JPS4932999A - - Google Patents

Info

Publication number
JPS4932999A
JPS4932999A JP47074764A JP7476472A JPS4932999A JP S4932999 A JPS4932999 A JP S4932999A JP 47074764 A JP47074764 A JP 47074764A JP 7476472 A JP7476472 A JP 7476472A JP S4932999 A JPS4932999 A JP S4932999A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47074764A
Other languages
Japanese (ja)
Other versions
JPS5649930B2 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7476472A priority Critical patent/JPS5649930B2/ja
Publication of JPS4932999A publication Critical patent/JPS4932999A/ja
Publication of JPS5649930B2 publication Critical patent/JPS5649930B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
JP7476472A 1972-07-25 1972-07-25 Expired JPS5649930B2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7476472A JPS5649930B2 (ko) 1972-07-25 1972-07-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7476472A JPS5649930B2 (ko) 1972-07-25 1972-07-25

Publications (2)

Publication Number Publication Date
JPS4932999A true JPS4932999A (ko) 1974-03-26
JPS5649930B2 JPS5649930B2 (ko) 1981-11-26

Family

ID=13556660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7476472A Expired JPS5649930B2 (ko) 1972-07-25 1972-07-25

Country Status (1)

Country Link
JP (1) JPS5649930B2 (ko)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5920370A (ja) * 1982-07-27 1984-02-02 Toyo Ink Mfg Co Ltd 導電性接着剤
JPS63248824A (ja) * 1987-04-03 1988-10-17 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JPH01316365A (ja) * 1988-03-24 1989-12-21 Shikoku Chem Corp １−ベンジルイミダゾール化合物、該化合物の合成方法及び該化合物を用いるポリエポキシ樹脂の硬化方法
WO2010103809A1 (ja) * 2009-03-11 2010-09-16 日本曹達株式会社 エポキシ樹脂組成物、硬化剤及び硬化促進剤
WO2010106780A1 (ja) 2009-03-17 2010-09-23 日本曹達株式会社 包接錯体、硬化剤、硬化促進剤、エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物
WO2012035755A1 (ja) * 2010-09-15 2012-03-22 日本曹達株式会社 液状の硬化性エポキシ樹脂組成物及びそれを含有する接着剤
JP2013213168A (ja) * 2012-04-04 2013-10-17 Nippon Soda Co Ltd プリプレグ用エポキシ樹脂組成物
US8653160B2 (en) 2007-09-21 2014-02-18 Nippon Soda Co., Ltd. Inclusion complex containing epoxy resin composition for semiconductor encapsulation
US8735529B2 (en) 2006-12-21 2014-05-27 Nippon Soda Co., Ltd. Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS497599A (ko) * 1972-05-29 1974-01-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS497599A (ko) * 1972-05-29 1974-01-23

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0242120B2 (ko) * 1982-07-27 1990-09-20
JPS5920370A (ja) * 1982-07-27 1984-02-02 Toyo Ink Mfg Co Ltd 導電性接着剤
JPS63248824A (ja) * 1987-04-03 1988-10-17 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JPH01316365A (ja) * 1988-03-24 1989-12-21 Shikoku Chem Corp １−ベンジルイミダゾール化合物、該化合物の合成方法及び該化合物を用いるポリエポキシ樹脂の硬化方法
US8735529B2 (en) 2006-12-21 2014-05-27 Nippon Soda Co., Ltd. Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin
US8653160B2 (en) 2007-09-21 2014-02-18 Nippon Soda Co., Ltd. Inclusion complex containing epoxy resin composition for semiconductor encapsulation
US8623942B2 (en) 2009-03-11 2014-01-07 Nippon Soda Co., Ltd. Epoxy resin composition, curing agent, and curing accelerator
WO2010103809A1 (ja) * 2009-03-11 2010-09-16 日本曹達株式会社 エポキシ樹脂組成物、硬化剤及び硬化促進剤
KR101349996B1 (ko) * 2009-03-17 2014-01-13 닛뽕소다 가부시키가이샤 포접 착물, 경화제, 경화 촉진제, 에폭시 수지 조성물 및 반도체 밀봉용 에폭시 수지 조성물
JP5459873B2 (ja) * 2009-03-17 2014-04-02 日本曹達株式会社 包接錯体、硬化剤、硬化促進剤、エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物
WO2010106780A1 (ja) 2009-03-17 2010-09-23 日本曹達株式会社 包接錯体、硬化剤、硬化促進剤、エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物
CN103936676A (zh) * 2009-03-17 2014-07-23 日本曹达株式会社 包合配合物、固化剂、固化促进剂、环氧树脂组合物及半导体封装用环氧树脂组合物
US9023956B2 (en) 2009-03-17 2015-05-05 Nippon Soda Co., Ltd. Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor
WO2012035755A1 (ja) * 2010-09-15 2012-03-22 日本曹達株式会社 液状の硬化性エポキシ樹脂組成物及びそれを含有する接着剤
JP2013213168A (ja) * 2012-04-04 2013-10-17 Nippon Soda Co Ltd プリプレグ用エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS5649930B2 (ko) 1981-11-26

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