JPS493226B1 - - Google Patents
Info
- Publication number
- JPS493226B1 JPS493226B1 JP1382470A JP1382470A JPS493226B1 JP S493226 B1 JPS493226 B1 JP S493226B1 JP 1382470 A JP1382470 A JP 1382470A JP 1382470 A JP1382470 A JP 1382470A JP S493226 B1 JPS493226 B1 JP S493226B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
- Y10T225/325—With means to apply moment of force to weakened work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
- Y10T29/4979—Breaking through weakened portion
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80053569A | 1969-02-19 | 1969-02-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS493226B1 true JPS493226B1 (ja) | 1974-01-25 |
Family
ID=25178646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1382470A Pending JPS493226B1 (ja) | 1969-02-19 | 1970-02-19 |
Country Status (7)
Country | Link |
---|---|
US (1) | US3559855A (ja) |
JP (1) | JPS493226B1 (ja) |
DE (1) | DE2007099C3 (ja) |
FR (1) | FR2044689B1 (ja) |
GB (1) | GB1297561A (ja) |
IE (1) | IE33717B1 (ja) |
NL (1) | NL7001925A (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3707760A (en) * | 1971-05-19 | 1973-01-02 | Sieburg Ind Inc | Method and device for article working such as fracturing of semiconductor slices and separating semiconductor chips |
US3918150A (en) * | 1974-02-08 | 1975-11-11 | Gen Electric | System for separating a semiconductor wafer into discrete pellets |
DE2510167B2 (de) * | 1975-03-08 | 1976-12-16 | ELMEG-Elektro-Mechanik GmbH, 315OPeine | Fassung zur aufnahme elektromagnetischer relais |
DE2629358C3 (de) * | 1976-06-30 | 1980-01-24 | Elmeg-Elektro-Mechanik Gmbh, 3150 Peine | Anordnung mit einer Fassung zur Aufnahme elektrischer Schaltungselemente |
US4203127A (en) * | 1977-07-18 | 1980-05-13 | Motorola, Inc. | Package and method of packaging semiconductor wafers |
GB2168840A (en) * | 1984-08-22 | 1986-06-25 | Plessey Co Plc | Customerisation of integrated logic devices |
JPS6469534A (en) * | 1987-09-10 | 1989-03-15 | Kazuo Sato | Method for cutting workpiece, such as glass |
JPH07100615B2 (ja) * | 1988-03-29 | 1995-11-01 | 和郎 佐藤 | ガラス加工物切断装置 |
DE4006070A1 (de) * | 1990-02-27 | 1991-09-12 | Braun Ag | Verfahren und einrichtung zum zerteilen einer scheibe aus halbleitermaterial |
JP3227800B2 (ja) * | 1992-06-30 | 2001-11-12 | 富士ゼロックス株式会社 | 脆性板切断方法およびその装置 |
US6412677B1 (en) * | 1998-09-16 | 2002-07-02 | Hoya Corporation | Cutting method for plate glass mother material |
JP2001185519A (ja) * | 1999-12-24 | 2001-07-06 | Hitachi Ltd | 半導体装置及びその製造方法 |
DE10030388A1 (de) * | 2000-06-21 | 2002-01-03 | Schott Glas | Verfahren zur Herstellung von Glassubstraten für elektronische Speichermedien |
TW515781B (en) * | 2001-07-27 | 2003-01-01 | Hannstar Display Corp | Method for dividing fragile material and laminated glass |
US20060024922A1 (en) * | 2004-07-27 | 2006-02-02 | Da-Tung Wen | Method for cutting wafer |
DE102007001133B4 (de) * | 2007-01-05 | 2008-09-04 | Mdi Schott Advanced Processing Gmbh | Verfahren und Vorrichtung zum Brechen von Dünnglasscheiben |
US20080303855A1 (en) * | 2007-06-07 | 2008-12-11 | Alan Bidwell | Compliant Sealing Materials and Methods For Sealing Nozzles For A Micro-Fluid Ejection Head |
US20220270925A1 (en) * | 2019-07-22 | 2022-08-25 | Massachusetts Institute Of Technology | Flexing semiconductor structures and related techniques |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1481711A (fr) * | 1965-06-02 | 1967-05-19 | Nippon Electric Co | Dispositif pour briser une masse semi-conductrice en morceaux élémentaires |
-
1969
- 1969-02-19 US US3559855D patent/US3559855A/en not_active Expired - Lifetime
-
1970
- 1970-02-05 IE IE148/70A patent/IE33717B1/xx unknown
- 1970-02-10 GB GB1297561D patent/GB1297561A/en not_active Expired
- 1970-02-11 NL NL7001925A patent/NL7001925A/xx not_active Application Discontinuation
- 1970-02-17 DE DE2007099A patent/DE2007099C3/de not_active Expired
- 1970-02-19 JP JP1382470A patent/JPS493226B1/ja active Pending
- 1970-02-19 FR FR7006019A patent/FR2044689B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2007099A1 (de) | 1970-09-10 |
DE2007099C3 (de) | 1979-09-06 |
DE2007099B2 (de) | 1979-01-11 |
FR2044689B1 (ja) | 1975-03-21 |
FR2044689A1 (ja) | 1971-02-26 |
IE33717L (en) | 1970-08-19 |
GB1297561A (ja) | 1972-11-22 |
NL7001925A (ja) | 1970-08-21 |
IE33717B1 (en) | 1974-10-02 |
US3559855A (en) | 1971-02-02 |