JPS4928270A - - Google Patents
Info
- Publication number
- JPS4928270A JPS4928270A JP6839872A JP6839872A JPS4928270A JP S4928270 A JPS4928270 A JP S4928270A JP 6839872 A JP6839872 A JP 6839872A JP 6839872 A JP6839872 A JP 6839872A JP S4928270 A JPS4928270 A JP S4928270A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6839872A JPS523775B2 (de) | 1972-07-08 | 1972-07-08 | |
GB3238173A GB1398940A (en) | 1972-07-08 | 1973-07-06 | Method of dividing semiconductor wafers |
DE19732334658 DE2334658C3 (de) | 1972-07-08 | 1973-07-07 | Verfahren zum Zerteilen von Halbleiterscheiben |
FR7325121A FR2192378B1 (de) | 1972-07-08 | 1973-07-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6839872A JPS523775B2 (de) | 1972-07-08 | 1972-07-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS4928270A true JPS4928270A (de) | 1974-03-13 |
JPS523775B2 JPS523775B2 (de) | 1977-01-29 |
Family
ID=13372538
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6839872A Expired JPS523775B2 (de) | 1972-07-08 | 1972-07-08 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS523775B2 (de) |
DE (1) | DE2334658C3 (de) |
FR (1) | FR2192378B1 (de) |
GB (1) | GB1398940A (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61102046A (ja) * | 1984-10-25 | 1986-05-20 | Nec Corp | 半導体装置の製造方法 |
JP2019220581A (ja) * | 2018-06-20 | 2019-12-26 | 株式会社ディスコ | チップの製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6642127B2 (en) * | 2001-10-19 | 2003-11-04 | Applied Materials, Inc. | Method for dicing a semiconductor wafer |
CN103341692A (zh) * | 2013-06-26 | 2013-10-09 | 京东方科技集团股份有限公司 | 切割不规则图形基板的方法和显示装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3615956A (en) * | 1969-03-27 | 1971-10-26 | Signetics Corp | Gas plasma vapor etching process |
-
1972
- 1972-07-08 JP JP6839872A patent/JPS523775B2/ja not_active Expired
-
1973
- 1973-07-06 GB GB3238173A patent/GB1398940A/en not_active Expired
- 1973-07-07 DE DE19732334658 patent/DE2334658C3/de not_active Expired
- 1973-07-09 FR FR7325121A patent/FR2192378B1/fr not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61102046A (ja) * | 1984-10-25 | 1986-05-20 | Nec Corp | 半導体装置の製造方法 |
JP2019220581A (ja) * | 2018-06-20 | 2019-12-26 | 株式会社ディスコ | チップの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
DE2334658B2 (de) | 1978-03-30 |
FR2192378B1 (de) | 1977-09-02 |
GB1398940A (en) | 1975-06-25 |
FR2192378A1 (de) | 1974-02-08 |
JPS523775B2 (de) | 1977-01-29 |
DE2334658A1 (de) | 1974-01-24 |
DE2334658C3 (de) | 1978-11-23 |