JPS4869471A - - Google Patents

Info

Publication number
JPS4869471A
JPS4869471A JP46104399A JP10439971A JPS4869471A JP S4869471 A JPS4869471 A JP S4869471A JP 46104399 A JP46104399 A JP 46104399A JP 10439971 A JP10439971 A JP 10439971A JP S4869471 A JPS4869471 A JP S4869471A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP46104399A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP46104399A priority Critical patent/JPS4869471A/ja
Publication of JPS4869471A publication Critical patent/JPS4869471A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Wire Bonding (AREA)
JP46104399A 1971-12-22 1971-12-22 Pending JPS4869471A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP46104399A JPS4869471A (ko) 1971-12-22 1971-12-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46104399A JPS4869471A (ko) 1971-12-22 1971-12-22

Publications (1)

Publication Number Publication Date
JPS4869471A true JPS4869471A (ko) 1973-09-20

Family

ID=14379632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46104399A Pending JPS4869471A (ko) 1971-12-22 1971-12-22

Country Status (1)

Country Link
JP (1) JPS4869471A (ko)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5142959A (ko) * 1974-10-09 1976-04-12 Hitachi Ltd
JPS56115530A (en) * 1980-02-15 1981-09-10 Mitsubishi Electric Corp Manufacture of flip chip type semiconductor device
JPS56142655A (en) * 1980-04-07 1981-11-07 Fujitsu Ltd Method of carrying electronic parts
JPS5848445A (ja) * 1981-09-17 1983-03-22 Matsushita Electric Ind Co Ltd 金属リ−ドと電極の接続方法
JPS58182820A (ja) * 1982-04-21 1983-10-25 Toshiba Corp 半導体装置の製造方法
JPS59103004U (ja) * 1982-12-23 1984-07-11 三菱重工業株式会社 ボイラの過冷却防止装置
JPS6058645A (ja) * 1983-09-12 1985-04-04 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS6086853A (ja) * 1983-10-19 1985-05-16 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS6086840A (ja) * 1983-10-19 1985-05-16 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS629642A (ja) * 1985-07-05 1987-01-17 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS62108543A (ja) * 1985-11-06 1987-05-19 Hitachi Ltd 半導体装置の電極形成法
JPS6413746A (en) * 1987-07-07 1989-01-18 Fujitsu Ltd Manufacture of semiconductor device
US5349239A (en) * 1991-07-04 1994-09-20 Sharp Kabushiki Kaisha Vertical type construction transistor
US5444300A (en) * 1991-08-09 1995-08-22 Sharp Kabushiki Kaisha Semiconductor apparatus with heat sink

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5142959A (ko) * 1974-10-09 1976-04-12 Hitachi Ltd
JPS56115530A (en) * 1980-02-15 1981-09-10 Mitsubishi Electric Corp Manufacture of flip chip type semiconductor device
JPS56142655A (en) * 1980-04-07 1981-11-07 Fujitsu Ltd Method of carrying electronic parts
JPS6255704B2 (ko) * 1980-04-07 1987-11-20 Fujitsu Ltd
JPS6234142B2 (ko) * 1981-09-17 1987-07-24 Matsushita Electric Ind Co Ltd
JPS5848445A (ja) * 1981-09-17 1983-03-22 Matsushita Electric Ind Co Ltd 金属リ−ドと電極の接続方法
JPS58182820A (ja) * 1982-04-21 1983-10-25 Toshiba Corp 半導体装置の製造方法
JPS59103004U (ja) * 1982-12-23 1984-07-11 三菱重工業株式会社 ボイラの過冷却防止装置
JPS6058645A (ja) * 1983-09-12 1985-04-04 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS6086853A (ja) * 1983-10-19 1985-05-16 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS6086840A (ja) * 1983-10-19 1985-05-16 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH0469427B2 (ko) * 1983-10-19 1992-11-06 Matsushita Electric Ind Co Ltd
JPS629642A (ja) * 1985-07-05 1987-01-17 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH0357618B2 (ko) * 1985-07-05 1991-09-02 Matsushita Electric Ind Co Ltd
JPS62108543A (ja) * 1985-11-06 1987-05-19 Hitachi Ltd 半導体装置の電極形成法
JPS6413746A (en) * 1987-07-07 1989-01-18 Fujitsu Ltd Manufacture of semiconductor device
US5349239A (en) * 1991-07-04 1994-09-20 Sharp Kabushiki Kaisha Vertical type construction transistor
US5444300A (en) * 1991-08-09 1995-08-22 Sharp Kabushiki Kaisha Semiconductor apparatus with heat sink

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