JPS4845174A - - Google Patents

Info

Publication number
JPS4845174A
JPS4845174A JP47011436A JP1143672A JPS4845174A JP S4845174 A JPS4845174 A JP S4845174A JP 47011436 A JP47011436 A JP 47011436A JP 1143672 A JP1143672 A JP 1143672A JP S4845174 A JPS4845174 A JP S4845174A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47011436A
Other languages
Japanese (ja)
Other versions
JPS5329071B2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4845174A publication Critical patent/JPS4845174A/ja
Publication of JPS5329071B2 publication Critical patent/JPS5329071B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1143672A 1971-02-05 1972-02-02 Expired JPS5329071B2 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7101600.A NL164425C (nl) 1971-02-05 1971-02-05 Halfgeleiderinrichting voorzien van een koellichaam.

Publications (2)

Publication Number Publication Date
JPS4845174A true JPS4845174A (cg-RX-API-DMAC7.html) 1973-06-28
JPS5329071B2 JPS5329071B2 (cg-RX-API-DMAC7.html) 1978-08-18

Family

ID=19812417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1143672A Expired JPS5329071B2 (cg-RX-API-DMAC7.html) 1971-02-05 1972-02-02

Country Status (9)

Country Link
JP (1) JPS5329071B2 (cg-RX-API-DMAC7.html)
AU (1) AU466735B2 (cg-RX-API-DMAC7.html)
CA (1) CA956731A (cg-RX-API-DMAC7.html)
CH (1) CH538194A (cg-RX-API-DMAC7.html)
DE (1) DE2202802B2 (cg-RX-API-DMAC7.html)
FR (1) FR2124487B1 (cg-RX-API-DMAC7.html)
GB (1) GB1375054A (cg-RX-API-DMAC7.html)
IT (1) IT947244B (cg-RX-API-DMAC7.html)
NL (1) NL164425C (cg-RX-API-DMAC7.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5412270A (en) * 1977-06-22 1979-01-29 Nec Corp Integrated circuit rackage
JPS5549513U (cg-RX-API-DMAC7.html) * 1978-09-28 1980-03-31
JPS62189743A (ja) * 1986-02-14 1987-08-19 Matsushita Electric Works Ltd 配線回路体

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2752655A1 (de) * 1977-09-23 1979-06-07 Blaupunkt Werke Gmbh Elektronisches bauelement
JPS55113389U (cg-RX-API-DMAC7.html) * 1979-02-02 1980-08-09
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
JPS58119595A (ja) * 1982-01-09 1983-07-16 三菱電機株式会社 巻上装置
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
GB2124433B (en) * 1982-07-07 1986-05-21 Int Standard Electric Corp Electronic component assembly
JPS59116311U (ja) * 1983-01-21 1984-08-06 日立金属株式会社 羽根付コンベヤチエン
GB2135521A (en) * 1983-02-16 1984-08-30 Ferranti Plc Printed circuit boards
US4685030A (en) * 1985-04-29 1987-08-04 Energy Conversion Devices, Inc. Surface mounted circuits including hybrid circuits, having CVD interconnects, and method of preparing the circuits
GB8706857D0 (en) * 1987-03-23 1987-04-29 Bradley International Ltd Alle Chip carriers
US4868349A (en) * 1988-05-09 1989-09-19 National Semiconductor Corporation Plastic molded pin-grid-array power package
GB2237682A (en) * 1989-09-28 1991-05-08 Redpoint Limited Heatsink for semiconductor devices
GB2240425B (en) * 1990-01-20 1994-01-12 Motorola Ltd Radio transmitter power amplifier with cooling apparatus
JPH07109867B2 (ja) * 1991-04-15 1995-11-22 インターナショナル・ビジネス・マシーンズ・コーポレイション 半導体チツプの冷却構造
DE102019115500A1 (de) * 2019-06-07 2020-12-10 OSRAM CONTINENTAL GmbH Anordnung und Verfahren zur Herstellung einer Anordnung

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3414775A (en) * 1967-03-03 1968-12-03 Ibm Heat dissipating module assembly and method
FR1564787A (cg-RX-API-DMAC7.html) * 1968-03-04 1969-04-25

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5412270A (en) * 1977-06-22 1979-01-29 Nec Corp Integrated circuit rackage
JPS5549513U (cg-RX-API-DMAC7.html) * 1978-09-28 1980-03-31
JPS62189743A (ja) * 1986-02-14 1987-08-19 Matsushita Electric Works Ltd 配線回路体

Also Published As

Publication number Publication date
CA956731A (en) 1974-10-22
FR2124487A1 (cg-RX-API-DMAC7.html) 1972-09-22
DE2202802A1 (de) 1972-08-17
AU466735B2 (en) 1973-08-09
GB1375054A (cg-RX-API-DMAC7.html) 1974-11-27
NL164425C (nl) 1980-12-15
CH538194A (de) 1973-06-15
FR2124487B1 (cg-RX-API-DMAC7.html) 1975-10-24
IT947244B (it) 1973-05-21
NL164425B (nl) 1980-07-15
DE2202802B2 (de) 1979-05-10
JPS5329071B2 (cg-RX-API-DMAC7.html) 1978-08-18
AU3853872A (en) 1973-08-09
NL7101600A (cg-RX-API-DMAC7.html) 1972-08-08

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