JPS4831876A - - Google Patents

Info

Publication number
JPS4831876A
JPS4831876A JP47080043A JP8004372A JPS4831876A JP S4831876 A JPS4831876 A JP S4831876A JP 47080043 A JP47080043 A JP 47080043A JP 8004372 A JP8004372 A JP 8004372A JP S4831876 A JPS4831876 A JP S4831876A
Authority
JP
Japan
Prior art keywords
board
chip
transistor
aug
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47080043A
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4831876A publication Critical patent/JPS4831876A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W40/10—
    • H10W72/07236—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP47080043A 1971-08-16 1972-08-11 Pending JPS4831876A (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17189171A 1971-08-16 1971-08-16

Publications (1)

Publication Number Publication Date
JPS4831876A true JPS4831876A (cg-RX-API-DMAC10.html) 1973-04-26

Family

ID=22625531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47080043A Pending JPS4831876A (cg-RX-API-DMAC10.html) 1971-08-16 1972-08-11

Country Status (4)

Country Link
JP (1) JPS4831876A (cg-RX-API-DMAC10.html)
CA (1) CA972080A (cg-RX-API-DMAC10.html)
DE (1) DE2239945A1 (cg-RX-API-DMAC10.html)
GB (1) GB1401655A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5374365A (en) * 1976-12-15 1978-07-01 Toshiba Corp Semiconductor ceramic package

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4218694A (en) * 1978-10-23 1980-08-19 Ford Motor Company Rectifying apparatus including six semiconductor diodes sandwiched between ceramic wafers
US4939570A (en) * 1988-07-25 1990-07-03 International Business Machines, Corp. High power, pluggable tape automated bonding package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5374365A (en) * 1976-12-15 1978-07-01 Toshiba Corp Semiconductor ceramic package

Also Published As

Publication number Publication date
GB1401655A (en) 1975-07-16
DE2239945A1 (de) 1973-03-15
CA972080A (en) 1975-07-29

Similar Documents

Publication Publication Date Title
KR850004174A (ko) 반도체장치
GB1443362A (en) Lsi chip package
KR830004676A (ko) 회로 패키지들의 제조방법
KR920001701A (ko) 반도체 장치 및 그 제조방법
FR2316742B1 (cg-RX-API-DMAC10.html)
GB1341454A (en) Packaging of semiconductor devices
GB1288982A (cg-RX-API-DMAC10.html)
KR880011914A (ko) 전기 도전 캐리어 플레이트를 포함하는 집적회로
JPS4831876A (cg-RX-API-DMAC10.html)
GB1363805A (en) Electrical components particularly semiconductor devices
GB1296744A (cg-RX-API-DMAC10.html)
EP0081419A3 (en) High lead count hermetic mass bond integrated circuit carrier
GB1057687A (en) Improvements in and relating to methods of manufacturing semiconductor devices
ES360707A1 (es) Un dispositivo semiconductor.
JPS5749252A (en) Manufacture of semiconductor device
JPH05347324A (ja) 半導体パッケージ
JPS5587463A (en) Integrated circuit package
JPS56142659A (en) Semiconductor device
JPS6336550A (ja) 半導体装置
JPS59177949U (ja) 半導体装置
JPS57184225A (en) Semiconductor device
JPS58153448U (ja) 半導体素子用外囲器
JPS57103322A (en) Sealing case for semiconductor device
JPS57109350A (en) Semiconductor device
JPS6386609A (ja) 弾性表面波デバイス用パツケ−ジ