JPS4830374A - - Google Patents

Info

Publication number
JPS4830374A
JPS4830374A JP47081903A JP8190372A JPS4830374A JP S4830374 A JPS4830374 A JP S4830374A JP 47081903 A JP47081903 A JP 47081903A JP 8190372 A JP8190372 A JP 8190372A JP S4830374 A JPS4830374 A JP S4830374A
Authority
JP
Japan
Prior art keywords
palladium
wedge
silver
hard
under high
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47081903A
Other languages
English (en)
Japanese (ja)
Other versions
JPS51430B2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4830374A publication Critical patent/JPS4830374A/ja
Publication of JPS51430B2 publication Critical patent/JPS51430B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP47081903A 1971-08-19 1972-08-17 Expired JPS51430B2 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17302071A 1971-08-19 1971-08-19

Publications (2)

Publication Number Publication Date
JPS4830374A true JPS4830374A (enExample) 1973-04-21
JPS51430B2 JPS51430B2 (enExample) 1976-01-08

Family

ID=22630182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47081903A Expired JPS51430B2 (enExample) 1971-08-19 1972-08-17

Country Status (3)

Country Link
US (1) US3747198A (enExample)
JP (1) JPS51430B2 (enExample)
GB (1) GB1363042A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5244167A (en) * 1975-10-06 1977-04-06 Hitachi Ltd Wire bonding device
JPS5957461A (ja) * 1982-09-27 1984-04-03 Fujitsu Ltd 半導体装置

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2616521A1 (de) * 1976-04-14 1977-11-03 Bosch Gmbh Robert Verfahren und vorrichtung zum abtrennen eines drahtes oder eines bandes
US4068371A (en) * 1976-07-12 1978-01-17 Miller Charles F Method for completing wire bonds
US4268739A (en) * 1978-03-09 1981-05-19 United Wiring & Manufacturing Co. Automated wiring apparatus
US4422568A (en) * 1981-01-12 1983-12-27 Kulicke And Soffa Industries, Inc. Method of making constant bonding wire tail lengths
JPS57121150A (en) * 1981-01-20 1982-07-28 Furukawa Battery Co Ltd:The Manufacture of plate for storage battery
US4603803A (en) * 1982-08-24 1986-08-05 Asm Assembly Automation, Ltd. Wire bonding apparatus
GB2125720B (en) * 1982-08-24 1986-11-05 Asm Assembly Automation Ltd Wire bonding apparatus
FR2532515B1 (fr) * 1982-08-27 1985-12-13 Thomson Csf Procede de cablage automatise a panne vibrante et machine de cablage utilisant un tel procede
DE3343738C2 (de) * 1983-12-02 1985-09-26 Deubzer-Eltec GmbH, 8000 München Verfahren und Vorrichtung zum Bonden eines dünnen, elektrisch leitenden Drahtes an elektrische Kontaktflächen von elektrischen oder elektronischen Bauteilen
US4534811A (en) * 1983-12-30 1985-08-13 International Business Machines Corporation Apparatus for thermo bonding surfaces
US4597520A (en) * 1984-09-06 1986-07-01 Biggs Kenneth L Bonding method and means
GB2177639B (en) * 1985-07-08 1988-12-29 Philips Electronic Associated Ultrasonic wire bonder and method of manufacturing a semiconductor device therewith
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JPH02101754A (ja) * 1988-10-11 1990-04-13 Hitachi Ltd ボンディング方法及びボンディング装置
US5142117A (en) * 1990-11-20 1992-08-25 Motorola, Inc. Proximity heater for an ultrasonic bonding tool
JP2852134B2 (ja) * 1991-02-20 1999-01-27 日本電気株式会社 バンプ形成方法
US5180093A (en) * 1991-09-05 1993-01-19 Cray Research, Inc. Apparatus for ultrasonic bonding
US5201454A (en) * 1991-09-30 1993-04-13 Texas Instruments Incorporated Process for enhanced intermetallic growth in IC interconnections
US5186378A (en) * 1991-09-30 1993-02-16 Texas Instruments Incorporated Method and apparatus for transducer heating in low temperature bonding
US7084656B1 (en) 1993-11-16 2006-08-01 Formfactor, Inc. Probe for semiconductor devices
US7200930B2 (en) * 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
KR0186084B1 (ko) * 1995-09-02 1999-04-15 문정환 히팅장치를 구비한 웨지 공구
US5945065A (en) * 1996-07-31 1999-08-31 Tanaka Denshi Kogyo Method for wedge bonding using a gold alloy wire
US6049046A (en) * 1997-09-30 2000-04-11 Siemens Energy & Automation, Inc. Electric circuit protection device having electrical parts ultrasonically joined using a brazing alloy
US6010059A (en) * 1997-09-30 2000-01-04 Siemens Energy & Automation, Inc. Method for ultrasonic joining of electrical parts using a brazing alloy
JPH11330134A (ja) * 1998-05-12 1999-11-30 Hitachi Ltd ワイヤボンディング方法およびその装置並びに半導体装置
US6031216A (en) * 1998-06-17 2000-02-29 National Semiconductor Corporation Wire bonding methods and apparatus for heat sensitive metallization using a thermally insulated support portion
US6206275B1 (en) * 1999-10-13 2001-03-27 F & K Delvotec Bondtechnik Gmbh Deep access, close proximity, fine pitch bonding of large wire
US7407079B2 (en) * 2003-10-23 2008-08-05 Orthodyne Electronics Corporation Automated filament attachment system for vacuum fluorescent display
JP2015056426A (ja) * 2013-09-10 2015-03-23 株式会社東芝 ボンディング用ツール、ボンディング装置、および半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3400448A (en) * 1966-01-27 1968-09-10 Sylvania Electric Prod Method of bonding filamentary material
US3397451A (en) * 1966-04-06 1968-08-20 Western Electric Co Sequential wire and articlebonding methods
US3444612A (en) * 1967-04-10 1969-05-20 Engineered Machine Builders Co Wire bonding method
US3627192A (en) * 1969-02-03 1971-12-14 Bearings Seale & Gears Inc Wire lead bonding tool
US3648354A (en) * 1969-11-17 1972-03-14 Gen Motors Corp Tailless bonder for filamentary wire leads
US3643321A (en) * 1970-06-17 1972-02-22 Kulicke & Soffa Ind Inc Method and apparatus for tailless wire bonding

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5244167A (en) * 1975-10-06 1977-04-06 Hitachi Ltd Wire bonding device
JPS5957461A (ja) * 1982-09-27 1984-04-03 Fujitsu Ltd 半導体装置

Also Published As

Publication number Publication date
JPS51430B2 (enExample) 1976-01-08
US3747198A (en) 1973-07-24
GB1363042A (en) 1974-08-14

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