JPH1197760A - Surface-mounted magnetoelectric transducer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To fix a magnetoelectric transducer vertically to the surface of a packaging substrate by forming an element-supporting part by bending it nearly at right angle to the lead terminal of the magnetoelectric transducer that is fixed on the substrate so that the magnetism-sensing surface of a semiconductor element is vertical to the direction of a magnetic field. SOLUTION: Four lead terminals 15 are projected from one side surface of a resin-sealing part 17 with a specific gap, the tips of the lead terminals 15 are bent at nearly right angle so that a Hall element can be supported while being raised at the tip part, and element-supporting parts 30 (30a, 30b, 30c, and 30d) are formed. A semiconductor chip is mounted on a lead frame 25 and is supported vertically to the surface of a packaging substrate 40 by the element-supporting parts 30 when the Hall element 10 is self-supported, thus enabling a magnetism-sensing surface 20 of a semiconductor chip 11 to be vertical to the direction of a magnetic field being in parallel with the surface of the packaging substrate 40 and hence fixing a transducer vertically to the direction of the magnetic field.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetoelectric device for converting magnetism into electricity, and more particularly to a surface mount type magnetoelectric device which does not require a lead terminal insertion hole on a mounting board.

[0002]

2. Description of the Related Art A Hall element is known as a magnetoelectric conversion element for converting magnetism into electricity.

In the Hall element, a semiconductor chip for generating a Hall voltage in accordance with a magnetic flux density is mounted on a lead frame, terminals of the semiconductor chip are connected to corresponding leads, and the semiconductor chip and a connection portion are resin-sealed. It is formed.

Incidentally, the Hall element is generally used for controlling the rotation of a brushless motor.

[0005] This brushless motor includes a surface-facing type in which a magnet is installed perpendicular to the rotation axis and a circumferentially-facing type in which a magnet is installed parallel to the rotation axis. As shown in FIG.
Perpendicularly to the substrate 53, the direction j of the magnetic field is parallel to the magneto-sensitive surface 51 in the brushless motor 70, and the magnetic field can be sensed only by the leakage magnetic field m, and the sensitivity is reduced. .

For this reason, conventionally, as shown in FIG. 6, in order to make the magneto-sensitive surface 61 of the Hall element 60 perpendicular to the direction of the magnetic field, an insertion for inserting the lead terminal 65 into the mounting board 63 is conventionally performed. A hole is formed, the lead terminal 65 is inserted into the insertion hole, and the inserted portion is soldered 67 from the front and back sides, thereby mounting the Hall element 60 in a vertical direction with respect to the mounting board 63. Was.

[0007]

However, as in the prior art, the Hall element 6 requires a step of forming an insertion hole in the mounting board 63 and a step of soldering 67 the insertion portion.
0 has a problem that the number of manufacturing steps increases.

SUMMARY OF THE INVENTION An object of the present invention is to provide a surface-mounted magnetoelectric conversion element which can be easily fixed perpendicularly to the surface of a mounting substrate.

[0009]

According to a first aspect of the present invention, there is provided a magneto-electric conversion element for fixing a semiconductor element on a substrate such that the direction of a magnetic field is perpendicular to the direction of a magnetic field. In the above structure, the lead terminals of the semiconductor element are bent at substantially right angles to form an element supporting portion.

According to a second aspect of the present invention, the element support portion is formed by alternately bending a plurality of lead terminals of a semiconductor element in opposite directions.

In other words, the gist of the present invention is that the lead terminals are alternately turned in opposite directions so that the semiconductor chip is self-standing perpendicularly to the magnetic field to facilitate mounting so that the Hall element has high sensitivity. It has been folded.

According to the above configuration, the device is manufactured by a conventional element manufacturing method except for the step of bending the lead terminal. Moreover, it is mounted on a mounting board without changing the mounting process. The mounted surface mount type magnetoelectric element is supported by the element support in a state perpendicular to the mounting substrate. This makes the magnetically sensitive surface of the semiconductor chip perpendicular to the direction of the magnetic field,
Since the magnetic field is received in a wider area, the sensitivity of the surface-mounted magneto-electric conversion element is improved.

[0013]

Next, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIGS. 1 to 4 show schematic views of a Hall element according to the present invention. 1 is a side view, FIG. 2 is a front view, FIG. 3 is a bottom view, and FIG. 4 is a perspective view.

As shown in FIG. 1, in the Hall element 10 according to the present invention, the magneto-sensitive surface 20 has an arrow j indicating the direction of a magnetic field.
And is fixed on the mounting substrate 40 so as to be perpendicular to the surface of the mounting substrate 40 so as to be vertical.

More specifically, as shown in FIG. 4, in the Hall element 10, a semiconductor chip 11 having a magneto-sensitive surface 20 for converting magnetism into electricity is mounted on a lead frame 25 and connected thereto. The semiconductor element is connected to the lead frame 25.
The lead terminal 15 is sealed with a resin sealing portion 17 except for the lead terminal 15 at the tip end of the lead terminal 1 so that the entire lead terminal 1 can be supported.
The element supporting portion 30 is formed by bending the distal end side of the element 5 at a substantially right angle.

The semiconductor chip 11 includes a lead frame 25
There are four terminals for connecting to
The lead frame 25 includes four leads 13 which are portions sealed in the resin sealing portion 17 and lead terminals 15 which extend from the leads 13 and protrude outward from the resin sealing portion 17. And the semiconductor chip 11
These four terminals are connected to corresponding leads 13.

As shown in FIG. 2, four lead terminals 15
Is formed in an appropriate thickness and width so as to have sufficient strength to support the Hall element 10. These four lead terminals 15 are formed so as to protrude from one side surface of the resin sealing portion 17 at a predetermined interval. Further, the above-mentioned element support portions 30a, 30b, 30c, 30d are formed at the tip portions of the respective lead terminals 15 so as to support the Hall element 10 in an upright state.

The element supporting portions 30a, 30b, 30c,
30d, four lead terminals 15 are alternately bent in opposite directions as shown in FIG. 3, and the lead terminals 15 The length has been adjusted.

Next, the operation will be described with reference to FIG.

In manufacturing the above-described Hall element 10, except for the step of bending the lead terminal 15, it is manufactured by a conventional element manufacturing method. Further, it is mounted on the mounting board 40 without changing the mounting process.

At the time of this mounting, the Hall element 10 is transferred onto the mounting substrate 40 without changing its orientation, for example, in a state of being independent on a packing tape. The semiconductor chip is mounted on the lead frame 25 in the same manner as in the related art, and is supported by the element supporting portion 30 in a state perpendicular to the surface of the mounting substrate 40 when the Hall element 10 is self-standing. Thereby, the magneto-sensitive surface 2 of the semiconductor chip 11
0 is perpendicular to the direction of the magnetic field parallel to the surface of the mounting substrate 40 and receives a magnetic field over a wider area.
The sensitivity of 0 is improved.

Further, the Hall element 10 according to the present invention comprises:
The semiconductor chip 11 having the same structure as that of the related art can be used, and can be easily fixed perpendicular to the direction of the magnetic field.

As described above, the present invention provides a magneto-electric conversion device having a higher sensitivity to a magnetic field parallel to the surface of a mounting substrate without adding a special process in both a semiconductor device manufacturing process and a mounting process. The device can be used at lower current and voltage.

The Hall element according to the present invention is used for a CD-ROM drive, a DVD drive, and the like using a circumferentially opposed brushless motor.

In this embodiment, the four lead terminals 15 are alternately bent in opposite directions to form the element supporting portions 30a, 30b, 30c, 30d. Alternatively, the four may be in the same direction, or the outer two and the inner two may be in opposite directions.

In this embodiment, the Hall element 10
Although described above, the present invention is also applicable to other semiconductor elements mounted in a lead terminal insertion type.

[0028]

As described above, according to the present invention, it is possible to easily fix the semiconductor device perpendicularly to the surface of the mounting substrate without adding any special process in both the semiconductor device manufacturing process and the mounting process.

[Brief description of the drawings]

FIG. 1 is a side view of a surface-mounted magnetoelectric conversion element according to the present invention.

FIG. 2 is a front view of the surface-mounted magnetoelectric conversion element according to the present invention.

FIG. 3 is a bottom view of the surface-mounted magnetoelectric conversion element according to the present invention.

FIG. 4 is a perspective view of the surface-mounted magnetoelectric conversion element according to the present invention.

FIG. 5 is a diagram illustrating a relationship between a Hall element and a magnetic field in a conventional circumferentially opposed brushless motor.

FIG. 6 is a schematic view showing a conventional Hall element.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Hall element (Surface mount type magnetoelectric conversion element) 15 Lead terminal 20 Magnetically sensitive surface 30 Element support j Direction of magnetic field

Claims (2)

[Claims] 1. A magnetoelectric conversion element for fixing a semiconductor element on a substrate such that a magnetic sensing surface of the semiconductor element and a direction of a magnetic field are perpendicular to each other, wherein a lead terminal of the semiconductor element is bent at a substantially right angle to form an element support portion. A surface-mounted magnetoelectric conversion element characterized by being formed. 2. The magnetoelectric conversion element according to claim 1, wherein the element support portion is formed by bending a plurality of lead terminals of the semiconductor element alternately in opposite directions.