KR100715648B1 - Semiconductor chip buried type resin package, manufacturing method for the same, and magnetic sensor using the same - Google Patents

Abstract

In a resin package incorporating a semiconductor chip, the degree of freedom of arrangement of the resin package is improved, the number of parts is reduced, the parts are generalized, the size is reduced, and the mass production is achieved.

In the resin package main body 5 and the resin package main body 5 which have the semiconductor chip 16, such as a hall element, and the two adjacent surface parts e and f which mutually orthogonally embed and embed | leave the semiconductor chip 16, A lead frame 6 which is mounted on the outer surfaces of the two surface portions e and f of the substrate 2 over the two surface portions e and f and electrically connected within the semiconductor chip 16 and the resin package body 5. ) Is configured.

Description

Semiconductor Chip Buried Resin Package, Manufacturing Method of Semiconductor Chip Buried Resin Package and Magnetic Sensor Using Semiconductor Chip Buried Resin Package

1: (a) is a perspective view which shows typically the resin package to which this invention is applied, (b) is a perspective view which shows typically a Hall element, and (c) and (d) are both the 1st of this invention. It is typical sectional drawing of the resin package which concerns on embodiment.

2 is a diagram for explaining the yoke.

FIG. 3: (a) is a typical perspective view of the magnetic sensor which concerns on 1st Embodiment of this invention, (b)-(d) respectively show an example of the package for Z directions which concerns on 1st Embodiment of this invention. It is a figure which shows.

4 is an electric circuit diagram showing an example of a magnetic detection circuit using a Hall element.

FIG. 5: (a) is a top view of the magnetic sensor which concerns on 1st Embodiment of this invention, (b) is sectional drawing of the same magnetic sensor.

Fig. 6 is a top view of the magnetic sensor of the BGA package according to the first embodiment of the present invention, (b) is a bottom view of the magnetic sensor of the same BGA package, and (c) is the same BGA. A cross-sectional view of a magnetic sensor in a mold package.

(A) is a front perspective view of the resin package which concerns on 1st Embodiment of this invention, (b) is a back perspective view of the same resin package, and both (c) and (d) are 1st of this invention. It is a figure which shows the arrangement example of the BGA type resin package which concerns on embodiment, (e), (f) are the figure which shows the arrangement example of the LGA type resin package which concerns on the 1st Embodiment of this invention, (g)-(i) are figures for demonstrating the example of arrangement | positioning of the magnetic sensor chip which mounted the resin package which concerns on 1st Embodiment of this invention.

8 is a top view of a metal plate before bending processing according to the first embodiment of the present invention.

FIG. 9: (a), (b) are the figure which shows an example of the shape pattern of the lead terminal which concerns on the 1st Embodiment of this invention.

10: (a)-(f) are the figures for demonstrating the manufacturing method of the resin package which concerns on the 1st Embodiment of this invention all.

FIG. 11: (a)-(c) is a figure for demonstrating the mounting method of the semiconductor chip which concerns on 1st Embodiment of this invention, respectively.

(A), (b) is a figure for demonstrating the shaping | molding of the resin package which concerns on 1st Embodiment of this invention, respectively, (c) is a figure of the resin molding which concerns on 1st Embodiment of this invention. An enlarged view of the outer surface.

 FIG. 13: (a) is a figure for demonstrating the removal method of the Teflon tape which concerns on 1st Embodiment of this invention, (b), (c) are all of the resin molding which concerns on 1st Embodiment of this invention. It is a figure for demonstrating a cutting method.

14 is a view for explaining another manufacturing method of the surface mount magnetic sensor according to the first embodiment of the present invention, and (b) is a manufacture using bonding according to the first embodiment of the present invention. It is a figure for demonstrating a method.

(A) is a perspective view of the resin package which concerns on the modification of 1st Embodiment of this invention, (b) is a figure which shows the mounting example of the hall element which concerns on the modification of 1st Embodiment of this invention. to be.

16A and 16B are cross-sectional views of a resin package according to a modification of the first embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

1, 31: resin package (semiconductor chip buried resin package)

5: metal plate

5a, 5b: hole

6: lead frame

10-12, 20: magnetic sensor (three-dimensional magnetic sensor)

16, 30a, 30c: Hall element

17: yoke 18: pedestal

18a: potato portion (potato noodles) 18b: upper cap

18c: lower cap 19: controller IC (control unit)

19a: drive current supply unit 19b: amplifier

19c: amplification rate control unit 21: lead terminal

22: bonding wire 23a: leg portion

23b: electrode 24: resin molded body

30: Z-direction magnetic detection package (magnetic sensing member)

31a: upper side 31b: front side

32: inclined surface 50: resin package body

90 mold 91 substrate

92: guard terminal 93: mounting range

94: connector 95: teflon tape

96: cutter 97: electrode

100: solder ball

The present invention relates to a method for manufacturing a semiconductor chip buried resin package and a semiconductor chip buried resin package, which are suitable for use in, for example, magnetic sensors, orientation sensors, light emitting diodes (LEDs), and infrared sensor elements. The present invention also relates to a magnetic sensor using a semiconductor chip buried resin package.

In general, a car navigation device equipped with a GPS (Global Positioning System) receiver and a mobile phone (mobile terminal) having a navigation function mainly include a small magnet that detects (detects, senses, potatoes, senses) geomagnetism. Equipped with a sensor or orientation sensor. Here, unless otherwise indicated, magnetic field means magnetic field (or magnetic field) H and magnetic flux density B (permeability (μ) x magnetic field (H)). The magnetic sensor performs detection of a magnetic field in one to three dimensions, measurement (measurement) of the strength of the magnetic field, voltage conversion of the detected magnetic field, voltage output, and the like, and the orientation sensor is specialized for detecting a geomagnetic field. In this way, the strength and direction of the geomagnetism in one to three dimensions are detected, and data indicating these intensities and directions are output. Both of these two types of sensors (magnetic sensor and azimuth sensor) are integrally modularized with IC (Integrated Circuit) or LSI (Large Scale Integration) for control, and many kinds are sold. In addition, unless otherwise indicated, a magnetic sensor among two types of sensors is demonstrated and the overlapping description of an orientation sensor is abbreviate | omitted.

Since the mobile telephone is used at a high place and various inclination angles, the magnetic sensor mounted inside the mobile telephone must correspond to the magnetic component from the three-dimensional direction. In general, magnetic sensors require the ability to detect weak geomagnetisms, while magnets such as microphones and speakers also detect unnecessary magnets other than geomagnetisms, so that unnecessary magnets are shielded.

For this reason, the Hall element is used as a device which can detect the magnetic field H with a small size and with a relatively constant sensitivity. This hall element has a directivity (sensing direction) of sensing for detecting the magnetic field H in a specific direction, and has a characteristic of outputting a weak voltage having a magnitude corresponding to the intensity of the magnetic field H in the potato direction. If the magnetic detection axes of the two Hall elements are arranged to be orthogonal to each other on a horizontal substrate in the mobile phone, the magnetic field H in the two-dimensional direction can be detected, and three Hall elements are provided by providing three Hall elements. The magnetic field H in a direction can be detected, and the magnetic field component of each direction of X, Y, and Z which comprise a three-dimensional space can be measured.

In addition, the intensity | strength of the magnetic field H is calculated from the magnetic field component of three directions by the controller IC provided in the magnetic sensor in the measured magnetic field component of each direction. Here, the controller IC is demanding high precision for the application of the drive current to the Hall element, the detection of the weak voltage caused by the Hall effect, and the processing of the amplification of the weak voltage. In addition, in order to reduce power consumption and maintain accuracy by bringing three Hall elements, a controller IC, and the like into close proximity, the Hall elements and the controller IC are integrated into one chip (packaging or modularization).

This single chip prevents misalignment of the Hall element even when an impact is applied to the mobile phone, for example, enabling detection of a weak voltage in a state where no voltage loss occurs, and maintaining stable detection accuracy. In addition, the performance quality of the magnetic sensor can be improved and uniformized. In addition, high-density mounting of components inside the mobile phone can be performed, and the mobile phone can be miniaturized, and the cost can be reduced.

Further, the chip can take various shapes, depending on the use of the magnetic sensor, the manufacturing method, and the like.

However, the conventional package shape is a rectangular parallelepiped, and the lead frame (conductive member for connecting between the hall element and the controller IC) of the package is exposed only on one surface of the rectangular parallelepiped package. Therefore, in either of the case where the package is mounted on a substrate having a circuit pattern, or when the package is integrated with a controller IC and molded (injecting and molding a synthetic resin), the size and the package of the package are determined. There is a problem that there is no freedom of design for each of the places to be fixed. Specifically, the size of the package to be mounted on the cellular phone is about 4 mm square or less, and the height of the package is limited.

In addition, since the geomagnetic detection direction by the conventional magnetic sensor is only the Z direction, there is a problem that the magnetic sensor using the package cannot be miniaturized again.

Since magnetic detection in a three-dimensional space is obtained by combining three sets of one-dimensional magnetic sensors, there is a problem that physical miniaturization is difficult and not suitable for mass production.

On the other hand, in recent years, the demand for the three-dimensional magnetic sensor which is small and suitable for mass production is increasing. In particular, in the portable information processing apparatus incorporating an electronic compass or a GPS function, a function of detecting geomagnetism with high accuracy and recognizing azimuth is indispensable, and development of a compact three-dimensional magnetic sensor is desired. In addition, a small three-dimensional magnetic sensor for detecting a geomagnetism is required for a head mounted display used to provide a virtual reality environment. In recent years, the general purpose small portable apparatuses, such as a mobile telephone and a PDA (Personal Digital Assistants) apparatus, are equipped with the electronic compass and GPS function, and the miniaturization and the mass production of a three-dimensional magnetic sensor have become urgent.

In addition to the three-dimensional magnetic sensor, a small size and a shape suitable for mass production include, for example, an LED for mounting on a light emitting pen, an infrared sensor for detecting infrared rays, and the like.

It is extremely desirable that microminiatures in semiconductor chips such as the three-dimensional magnetic sensor, the LED, and the infrared sensor described above be provided at a low cost, and high precision is required for the three-dimensional magnetic sensor.

The present invention has been made in view of such a problem, and is a resin package incorporating a semiconductor chip, and improves the degree of freedom of placement of the resin package and the reduction of component scores while maintaining conduction between the resin package and the external circuit. To provide a method for producing a semiconductor chip buried resin package, a semiconductor chip buried resin package, and a magnetic sensor using the semiconductor chip buried resin package, which can promote the generalization of components, and to downsize and mass-produce. do.

To this end, the semiconductor chip buried resin package of the present invention includes a resin package body having at least two adjacent face portions intersecting with each other while embedding the semiconductor chip and the semiconductor chip, and the two pieces of the resin package body. The outer surface of the surface portion is mounted across these two surface portions and is provided with a lead frame electrically connected within the semiconductor chip and the resin package body (claim 1).

Here, at least two mutually intersecting face parts of the resin package body may be configured as at least two adjacent face parts that are perpendicular to each other (claim 2).

These semiconductor chips and the resin package main body can be comprised as following (i)-(iii).

(i) The semiconductor chip is configured as a hall element, and the resin package main body is configured as a magnetic field transparent resin package main body (claim 3).

(ii) The semiconductor chip is configured as an infrared sensor element, and the resin package main body is configured as an infrared transmissive resin package main body (claim 4).

(iii) The semiconductor chip is configured as a light emitting diode element, and the resin package body is configured as a light transmissive resin package body (claim 5).

Moreover, the manufacturing method of the semiconductor chip buried resin package of this invention has the manufacturing method (claim 6) of one semiconductor chip buried resin package, and the manufacturing method (claim 7) of several semiconductor chip buried resin package. .

The manufacturing method of the semiconductor chip buried resin package of this invention is the process of bending the front-end | tip part of n lead terminals in the following description, n is a natural number, and was formed in one side of a conductor board, and a lead terminal In the step of mounting a semiconductor chip, the step of electrically connecting the lead terminal and the semiconductor chip, and the bent lead terminal and the semiconductor chip electrically connected to the lead terminal, this is embedded in the resin molded body for the semiconductor chip. The lead terminal is subjected to resin molding so that the outer surface of the lead terminal is exposed over at least two adjacent face portions intersecting with each other in the resin molded body, thereby producing a resin molded body and the resin molded body from the conductor plate. It is characterized by including a step of cutting (claim 6).

In the method for manufacturing a chip buried resin package according to the present invention, a total of n × m lead terminals of m pairs (in the following description, m represents a natural number) of n pairs of lead terminals are formed on one side. In the conductor plate, the step of bending the leading end portions of the n × m lead terminals, the step of attaching the semiconductor chips to the respective lead terminals, and the semiconductor chips corresponding to the lead terminals of the above groups For each of the above-described semiconductor chips electrically connected to the bent lead terminals and the lead terminals, which are electrically connected to each other, the semiconductor chips are embedded in a resin molded body, and for the lead terminals, other than the n lead terminals. The process of producing a plurality of resin molded objects by performing resin molding so that the surface may be exposed over at least 2 adjacent surface parts mutually crossing in a resin molded object, It is characterized by including the process of cutting the resin molded object of these from a conductor plate (claim 7).

Here, all the manufacturing methods of the semiconductor chip buried resin package of this invention which concerns on Claim 6 and 7 can also be as shown to following (iv)-(vii).

(iv) In the sixth or seventh aspect, when the semiconductor chip is mounted on the lead terminal, the semiconductor chip is mounted on the lead terminal base side portion at the base side rather than the tip portion of the bent lead terminal ( Claim 8).

(v) When manufacturing a resin molded object in Claim 6 or 7, after attaching and mounting a masking member on the outer surface side of a lead terminal, resin molding is performed (claim 9).

(vi) In claim 6 or 7, a notch for bending is formed in the lead terminal so as to intersect with the lead terminal prior to the step of bending the tip portion of the lead terminal (claim 10).

(vii) In claim 6 or 7, a notch for cutting is formed in the lead terminal so as to intersect with the lead terminal before the step of cutting the resin molded body from the conductor plate (claim 11).

In addition, the magnetic sensor using the semiconductor chip buried resin package of the present invention is a resin package main body which is disposed on a substrate and has a hole element and at least two adjacent surface portions which are orthogonal to each other while embedding the hall element and the hall element. And a first semiconductor chip buried type configured to be mounted on the outer surface of the two face portions in the resin package body over the two face portions and having a lead frame electrically connected in the hall element and the resin package body. A resin package and a control unit for driving and controlling the Hall element in the first semiconductor chip buried resin package are provided (claim 12).

Moreover, the magnetic sensor using the semiconductor chip buried resin package of Claim 12 has a 2nd semiconductor which has the same structure as the 1st semiconductor chip buried resin package on a board | substrate separately from a 1st semiconductor chip buried resin package. The chip buried resin package may be arranged in a state of being rotated by 90 degrees (90 °) with respect to the first semiconductor chip buried resin package (claim 13).

In addition, the magnetic sensor using the semiconductor chip buried resin package according to claim 13 constitutes a three-dimensional space on a substrate separately from the first semiconductor chip buried resin package and the second semiconductor chip buried resin package. A magnetic sensing member capable of detecting magnetism in an axial direction different from the axial direction detected by the first semiconductor chip buried resin package and the second semiconductor chip buried resin package in three axes may be disposed (claims). 14).

In the magnetic sensor using the semiconductor chip buried resin package according to claim 14, the magnetic sensing member is configured as a third semiconductor chip buried resin package having the same structure as the first semiconductor chip buried resin package. The three semiconductor chip buried resin packages may be disposed in a state of being rotated by 90 degrees with respect to the first semiconductor chip buried resin package and the second semiconductor chip buried resin package, respectively (claim 15).

According to the semiconductor chip buried resin package of the present invention, a design having a high degree of freedom in arrangement can be made, and the number of parts is reduced, thereby facilitating the generalization of parts.

Moreover, according to the manufacturing method of the semiconductor chip buried resin package of this invention, since it can use without changing an existing manufacturing process, it can reduce mounting cost other than manufacturing cost, and it is low in mass production. It can manufacture efficiently at cost.

Moreover, according to the manufacturing method of the semiconductor chip buried resin package of this invention, one resin package and some resin package can be manufactured by substantially the same process, and can be manufactured using the same manufacturing line. Therefore, it contributes to the improvement of manufacturing efficiency. In addition, it is possible to manufacture one resin package and a plurality of resin packages without rearranging or changing the production line, so that the work efficiency is greatly improved and the production efficiency is further improved.

In addition, according to the magnetic sensor using the semiconductor chip buried resin package of the present invention, the magnetic sensor can be miniaturized, which contributes to the miniaturization of a mobile phone or the like. Further, for example, a portable telephone having a navigation function can be miniaturized.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described with reference to drawings.

(A) Description of the first embodiment of the present invention

1 (a) is a perspective view schematically showing a semiconductor chip buried resin package (hereinafter, referred to as a resin package), to which the present invention is applied. The resin package 1 shown in FIG. 1 (a) is used for an extremely small magnetic sensor (magnetic sensor using a semiconductor chip buried resin package: three-dimensional magnetic sensor), an orientation sensor, or the like. Here, as shown in FIG. 5 (a), FIG. 5 (b), etc. which are mentioned later, the magnetic sensor detects the geomagnetism of the three-axis direction which comprises the three-dimensional space which consists of X, Y, and Z, and detects it. It has a magnetic detection function that converts the strength of a geomagnetism into a weak voltage, obtains the direction data of the detected geomagnetism, and outputs the weak voltage and the direction data. The magnetic sensor in the cellular phone, the GPS position measurement module (not shown), and the like cooperate to provide the navigation service to the user. In addition, unless otherwise indicated, a magnetic sensor is demonstrated as a three-dimensional magnetic sensor which detects the magnetism of each direction of three dimensions here.

The resin package 1 shown in Fig. 1A constitutes a component of a three-dimensional magnetic sensor, which includes a Hall element 16 as a semiconductor chip, a resin package main body 50 made of a synthetic resin, and a control circuit. Or the lead frame 6 for conducting with external circuits, such as a wiring pattern on a board | substrate, is comprised. Here, the hall element 16 has a magnetic detection function. And the resin package main body 50 embeds the hall element 16, and has two adjacent surface parts (surfaces) (e, f) which mutually orthogonally cross, and are later mentioned FIG.12 (a), FIG.12 ( As shown to b), it shape | molds with the synthetic resin injected using the metal mold | die 90. As shown to FIG. In the first embodiment described below, the semiconductor chip is configured as the hall element 16, and the resin package main body 50 is configured as the magnetic field transparent resin package main body.

In addition, the lead frame 6 is mounted on the outer surfaces (surface portions exposed to the outside) of the two surface portions e and f in the resin package main body 50 over these two surface portions e and f. At the same time, the hall element 16 and the resin package main body 50 are electrically connected. As described later, the resin package main body 50 is molded (molding by injection of a synthetic resin), and the lead frame 6 is manufactured by bending a thin metal plate as a conductive member.

Each member of the resin package 1 is further described with reference to Figs. 1 (b) to 1 (d).

FIG. 1B is a perspective view schematically showing the hall element 16. The hall element 16 shown in FIG. 1 (b) outputs a weak voltage having a magnitude corresponding to the intensity of the magnetic field, and detects the magnetic field from a specific direction (potato direction). In order to improve the detection accuracy, for example, as shown in FIG. 2, a yoke (magnetic procedure yoke) 17 is provided in the potato part (potato surface) 18a of the hall element 16. . The yoke 17 focuses (converges) the magnetic flux of the magnetic flux density B from the Z direction, for example, and guides the focused magnetic flux to the potato portion 18a of the Hall element 16. In addition, as shown in Fig. 1 (d), the magnetic flux from the horizontal or X direction or Y direction is inclined by 90 degrees from the state shown in Fig. 1 (c) as shown in Fig. 1 (d). The procedure is to lead to the potato portion 18a.

It is also possible to allow the hall element 16 to independently detect the magnetic field without providing the yoke 17.

The hall element 16 is equipped with two or more electrodes for input and output of the drive current, and when the magnetic flux is applied in the potato direction in the state in which the drive current is applied from each electrode, the electrons in the hall element 16 Moves with force in the direction orthogonal to both the direction of the drive current and the magnetic field direction. By this movement, the charge distribution is polarized on one side of the pair of opposing side elements of the Hall element 16. The polarization generates weak electromotive force between the one side of the pair, and the weak voltage is amplified and output.

In addition, the molded resin package 1 has a lead frame 6. The lead frame 6 is connected to the Hall element 16 and the conductive member which is provided outside the resin package 1 to connect the controller IC (control unit) 19 that drives and controls the Hall element 16. It is functioning as. Since the wiring of the Hall element 16 and the controller IC 19 cannot be provided inside the resin package body 50, the output of the Hall element 16 is led to the lead frame 6 through the bonding wire 22. It is supposed to be.

Next, the shape and arrangement of the resin package body 50, the lead frame 6, and the like will be described in further detail.

The resin package main body 50 embeds the hall element 16 and has two adjacent surface portions (surface portions e and f described below: see FIG. 1 (a)) which are perpendicular to each other. The resin package main body 50 is a substantially rectangular parallelepiped, a synthetic resin is inject | poured, and the synthetic resin is cooled and obtained. The resin package main body 50 has each surface part of 6 surfaces of a, b, c, d, e, and f which are shown to Fig.1 (a).

The lead frame 6 is mounted on the outer surfaces of the two surface portions e and f of the resin package 1 over these two surface portions e and f, and at the same time, the Hall element 16 and the resin. It is electrically connected in the package main body 50. And in this embodiment, the lead frame 6 is comprised as n lead terminals (lead electrodes) 21 in which n pieces (n represents natural numbers, for example, 4) each attached to the surface parts e and f. .

That is, the lead terminal 21 has a surface portion e of the four surface portions c, d, e, and f shown in Fig. 1A and the outside of the surface portion f adjacent to the surface portion e. It is formed on the surface. The bottom surface of the Hall element 16 is bonded to each of the four lead terminals 21 by an insulating paste or the like, and the bonded Hall elements 16 are bonded to each lead terminal 21. Bonded through wire 22. Thereby, the lead frame 6 (lead terminal 21) attached to the surface parts e and f is electrically connected with the hall element 16 provided in the inside of the resin package 1 by bonding. Will be. In addition, the lead frame 6 (lead terminal 21) is connected to a controller IC 19, a circuit, or the like external to the resin package 1, so that the hall element 16 is controlled through each lead terminal 21. The current is supplied from the IC 19 and the weak voltage can be output.

The size of the resin package 1 is several tens of micrometers, for example, and the thickness of the metal plate of the lead frame 6 is about 0.1 mm (0.1-0.12 mm), for example. And the lead frame 6 is shape | molded by bending a metal plate.

Next, the "vertical type" and the "lateral type" which show the arrangement | positioning method of the resin package 1 required for the following description are demonstrated with reference to FIG. 1 (c) and FIG. 1 (d). In addition, the arrangement | positioning method of arrangement | positioning in consideration of the point which side of four sheets of the resin package 1 should be made into a bottom surface, and in which direction the magnetic detection axis of the longitudinal direction of the resin package 1 should be directed in Means the way.

Both FIG.1 (c) and FIG.1 (d) are typical sectional drawing of the resin package 1 which concerns on 1st Embodiment of this invention, and the surface (a) of the resin package 1 shown to FIG. 1 (a). The cross section parallel to) is shown. Here, the vertical type refers to the substrate 91 on which the resin package 1 has a circuit pattern so that the potato direction of the Hall element 16 (and the yoke 17) shown in FIG. 1C is in the Z direction. In addition, the horizontal type is the arrangement | positioning which the resin package 1 was provided on the board | substrate 91 so that the potato direction of the hall element 16 shown to FIG. 1 (d) may become an X direction or a Y direction. It is a way. In the case of the vertical type, the surface portion e of the resin package 1 contacts the substrate 91, and in the case of the horizontal type, the surface portion f of the resin package 1 contacts the substrate 91.

More specifically, since the lead terminal surface (the surface on which the lead terminal 21 is formed) is formed on the outer surface of two adjacent surfaces e and f, the surface portion e of the resin package 1 is directed to the bottom surface. Each lead terminal 21 attached to the surface portion f is electrically connected to an external circuit such as the controller IC 19, and when the f surface is the bottom surface, each lead terminal 21 mounted on the e surface is provided. Is electrically connected to an external circuit such as the controller IC 19. Specifically, as shown in Fig. 1 (c), the Hall element 16 is mounted on the surface portion e so that the magnetic detection direction of the Hall element 16 is perpendicular to each of the e surface-c surface. Direction. On the other hand, as shown in Fig. 1 (d), when the vertical resin package 1 is rotated 90 degrees from the state shown in Fig. 1 (c), the magnetic detection direction is in each of the d plane-f planes. It is orthogonal.

Therefore, since the magnetic detection direction can be changed according to the arrangement method of the resin package 1 itself, the present resin package 1 can be arranged so as to face the magnetic detection direction even if either surface faces the magnetic detection direction. An external circuit can always be connected via the lead terminal 21, and the degree of freedom of arrangement is improved, contributing to miniaturization and mass production. In addition, any arrangement method of vertical or horizontal type can be connected to an external controller IC or the like, so that the magnetic detection function of at least two directions (actually three directions) is provided using one type of resin package 1. As a result, the number of parts constituting the magnetic sensor is reduced, and the generalization of the parts is promoted.

As a result, the Hall element 16 in the resin package 1 shown in Fig. 1 (c) detects the magnetic field (Hz) from the Z direction and transmits the magnetic field (Hz) through the Hall element 16. The voltage is converted into a voltage, and a weak voltage is output through the circuit pattern on the lower side of the lead frame 6. In addition, when detecting the magnetic field (the x component of the intensity H of the magnetic field) (Hx) from the X direction, the Hall element 16 in the resin package 1 shown in FIG. 1D shows the magnetic field Hx. Detects and outputs a weak voltage to an external circuit. In addition, when detecting the magnetic field Hy from the Y direction, the Hall element 16 is arranged so that the axial direction of the resin package 1 shown in Fig. 1 (d) is orthogonal to both the Z and X directions. It is arrange | positioned on the board | substrate 91. As a result, magnetic fields Hx, Hy, and Hz in the triaxial direction are obtained.

In this manner, the present resin package 1 can exhibit two kinds of magnetic detection functions of the Z direction and the X or Y direction by changing the vertical type and the horizontal type.

Next, with reference to FIG.3 (a) and FIG.3 (b), an example of the magnetic sensor using the resin package 1 is explained in full detail.

3A is a schematic perspective view of a magnetic sensor according to the first embodiment of the present invention. The magnetic sensor 10 shown in FIG. 3 (a) includes a pedestal (mold part) 18 as a substrate and two main resin packages 1 (each resin package 1 is shown in FIG. 1). It has the structure shown to (a), and the structure was mentioned above) and the Z direction magnetic detection package (it corresponds to a magnetic sensing member. Hereinafter, it is called a package for Z direction. It is also called a magnetic detection package) ( 30) and the controller IC 19 as a control part. Here, each of the two resin packages 1 is fixed to the upper surface of the pedestal 18 and outputs a voltage corresponding to the components Hx and Hy in each direction of X or Y of the geomagnetism H. A resin package (first semiconductor chip buried resin package) 1 for directions and a resin package (second semiconductor chip buried resin package) 1 for Y directions are provided. The package 30 for Z direction outputs the voltage according to the component (Hz) of a Z direction. The controller IC 19 that controls the operation of the hall element 16 is electrically connected to two resin packages 1 and the Z-direction package 30.

In other words, the magnetic sensor 10 includes a resin package (first semiconductor chip buried resin package) 1 for the X direction and a resin package (second semiconductor chip buried resin package) 1 for the Y direction. Each resin package 1 is disposed on a substrate (base 18), embeds the Hall element 16 and the Hall element 16, and at the same time, the two adjacent surface portions e which are orthogonal to each other. and the outer surface of the two surface portions e and f of the resin package main body 5 having the f and the resin package main body 5 are mounted over these two surface portions e and f, A controller IC having a lead frame 6 electrically connected to the hall element 16 and the resin package main body 5 and for driving and controlling the hall element 16 in each resin package 1 ( 19) is provided. As a result, the parts score of the magnetic sensor 10 can be reduced, and the versatility of the parts can be improved.

In addition, about the connection between each component, each resin package 1 on the pedestal 18, the package 30 for Z direction, etc. are all the controller IC 19 by the bonding wire 22 of Au, for example. ) In addition, between the controller IC 19 and an external circuit (not shown) is connected by a bonding wire 22 (not shown), so that the magnetic sensor 10 can be electrically operated.

Moreover, about arrangement | positioning and magnetic detection, each resin package 1 is arrange | positioned so that the detection axis | shaft of each resin package 1 for the X or Y direction and the package 30 for a Z direction may mutually orthogonally cross. In other words, the magnetic sensor 10 has a structure similar to that of the resin package 1 for the X direction on the substrate (base 18), which is the same as the resin package 1 for the X direction. Resin package 1 is disposed in a state of being rotated by 90 degrees with respect to resin package 1 for X direction.

Thereby, each function of the magnetic detection from the X direction and the magnetic detection from the Y direction is realized by one kind of resin package 1, and the component score can be reduced. As a result, the magnetic sensor 10 can be downsized, contributing to the downsizing of the mobile telephone.

Moreover, on the board | substrate (base 18), apart from the said resin package 1 for the X direction and the resin package 1 for the Y direction, it is for the said X direction in the three axes which comprise a three-dimensional space. A package for the Z direction (magnetic sensing member) 30 capable of detecting magnetism along an axial direction different from the axial direction detected by the resin package 1 and the resin package 1 for the Y direction is disposed. .

Moreover, this resin package 1 can also be provided for the magnetic detection from a Z direction, and this resin package 1 can be mounted with respect to the X, Y, and Z directions. That is, the package 30 for Z direction is comprised as the resin package (third semiconductor chip buried resin package) 1 which has the same structure as the resin package 1 for said X direction, and this resin package ( 1) may be arrange | positioned in the state which rotated 90 degrees with respect to said resin package 1 for the X directions, and the resin package 1 for the Y direction, respectively.

In addition, although the arrangement | positioning uses the Z direction package 30 with respect to the Z direction in three directions of X, Y, and Z, while using the magnetic detection package 30 with respect to X direction, It is also possible to use the resin package 1 (the resin package 1 also has the structure shown in Fig. 1A) as viewed in each direction. Similarly to this, the magnetic detection package 30 can be used in the Y direction, and the resin package 1 can also be used for each of the X and Z directions.

In this way, the magnetic fields of the respective directional components of X, Y, and Z are detected in each of the three packages (two resin packages 1 and the Z-direction package 30), and the magnetic field components in each detected one-dimensional direction By synthesizing, magnetic detection in the three-dimensional direction is realized.

Moreover, by configuring in this way, it becomes possible to use for one type of resin package 1 for the magnetic detection of two directions of X or Y. That is, in the magnetic detection in two directions of X or Y, by arranging two kinds of one resin package 1 in a different direction, the magnetic detection in the X direction and the magnetic detection in the Y direction are enabled. Therefore, the freedom degree of the arrangement pattern at the time of design increases, such as "Which direction to arrange | position each package on the base 18."

In addition, the thickness of the pedestal 18 and the length of one side are each about 1 micrometer or less and about 50 micrometers, respectively, and the manufacture of this resin package 1 requires an extremely fine processing technique. Therefore, since the same resin package 1 can be shared for the detection in the X or Y direction, the number of parts can be reduced, and the generalization of the parts can be promoted, and the production efficiency and cost reduction can be promoted.

In addition, since the molding of each package is performed by injecting a synthetic resin in a state in which various ICs, components, pedestals 18, and the like are integrated, the spatial position of each of the three packages is fixed, and deterioration in detection accuracy over time. Becomes difficult to occur.

In addition, you may change the Z direction package 30 of this magnetic sensor 10 with various things.

3 (b) to 3 (d) are diagrams each showing an example of a package for the Z direction according to the first embodiment of the present invention. The package 30a for Z direction shown in this FIG. 3B has a comparatively large lead terminal which is easy to bond, and the package 30c for Z direction shown in FIG. Each component is bonded by the upper surface. In addition, these Z-direction packages 30a and 30c each include a hall element so as to be parallel to the magnetic detection direction (Z direction) (not shown), and products which have been sold in the past can be used. . In addition, it is also possible to arrange | position the hall element 16 shown to FIG.3 (d) directly on the base 18, without packaging. In addition, both the Z direction package 30c and the hall element 16 shown to FIG.3 (c) and FIG.3 (d) may be fitted in the socket (not shown) which has a soldering terminal. Alternatively, the resin package 1 itself may be mounted on the pedestal 18 as described above, instead of the Z-direction package 30 shown in FIG. 3 (a). Further, it is possible to further promote stable component procurement and, for example, to increase the average failure interval of the magnetic sensor 10, thereby indirectly contributing to the improvement of the yield of the magnetic sensor 10.

As mentioned above, the shape of the resin package 1 itself and the arrangement | positioning of the resin package 1 in the base 18 were demonstrated.

Next, the package shape (outer shape) of the magnetic sensor 10 will be described in more detail, and a method of spatially and efficiently arranging various components and the like for miniaturizing the magnetic sensor 10 will be described.

The package shape of the magnetic sensor 10 shown in FIG. 3A is called a LGA (Land Grid Array) type. The magnetic sensor 10 is manufactured as a magnetic sensor module in which each package of X, Y, Z and the controller IC 19 are integrated. For this reason, the shape of the magnetic sensor module differs due to the package manufacturing method of integrating a plurality of functional modules such as IC, LSI, memory, and the like. Although the shape of the magnetic sensor module varies, in the following description, two types of IC shapes of the LGA type and the Ball Grid Array (BGA) type will be described for miniaturization and stabilization of operation.

Hereinafter, the appearance of the BGA type magnetic sensor will be described with reference to FIGS. 5 (a), 5 (b) and 7 (f) regarding the external shape of the LGA type magnetic sensor with reference to FIG. 4. The shape will be described in detail with reference to Figs. 6 (a) to 6 (c), respectively.

4 is an electric circuit diagram showing an example of a magnetic detection circuit using the Hall element 16. In the Hall element 16 shown in FIG. 4, a drive current is supplied from the controller IC 19, and when the magnetic flux of the magnetic flux density B is applied to the Hall element 16, the Hall element 16 is generated in the Hall element 16. The weak voltage is detected by the controller IC 19. Here, the controller IC 19 includes a drive current supply unit 19a for supplying a drive current to the hall element 16, an amplifier 19b for amplifying a weak voltage generated in the hall element 16, and a weak voltage. With respect to the amplifier 19b, the amplifier 19b maintains an appropriate amplification factor and changes the resistance value of the variable resistor VR which adjusts the bias of the amplifier 19b based on the weak voltage value from the hall element 16. It is comprised by the amplification ratio control part 19c which controls the amplification ratio of the amplifier 19b.

In addition, the magnetic sensor 10 and the controller IC 19 are not all limited to the magnetic detection circuit shown in this FIG.

As a result, the weak voltages output by the resin packages 1 in the X, Y, and Z directions are all amplified by the amplifier 19b, and the amplified voltages are output as detection voltages, which correspond to the detected voltages. The strength of geomagnetics is obtained.

In addition, Fig.5 (a) is a top view of the magnetic sensor 10 which concerns on 1st Embodiment of this invention using an LGA type package. The magnetic sensor 10 shown in this FIG. 5A has a controller IC 19 and two main resin packages 1 in a mounting range 93 on a pedestal 18 made of a synthetic resin, for example. ) And the Z-direction package 30 are arranged, and all three packages of the controller IC 19, the two resin packages 1, and the Z-direction package 30 are connected by bonding wires 22. . And the edge part of the base 18 is equipped with the electrode 23b and the leg part 23a electrically connected through the controller IC 19 and the circuit pattern (not shown), and the weak voltage is output to the exterior. At the same time, a drive current, a control signal, and the like from the outside are input to the controller IC 19.

Here, the two resin packages 1 for magnetic detection in the X direction and the Y direction are provided so as to be perpendicular to each other, and as shown in Fig. 7 (f), the Hall elements 16 are horizontally arranged. The lead terminal 21 and the controller IC 19 (denoted IC) on the surface f which are mounted and located on the ceiling surface shown in FIG. 7F are bonded wires 22. It is connected by.

5 (a), 7 (f) and the following FIG. 5 (b) have the same reference numerals as those described above.

5 (b) is a cross-sectional view of the magnetic sensor 10 shown in FIG. 5 (a), showing a cross section between AA's of the controller IC 19 shown in FIG. 5 (a). . The controller IC 19, the pedestal 18, and the like are covered by the upper cap 18b and the lower cap 18c illustrated in FIG. 5B, and the leg portion 23a is formed of the substrate 91. Soldered to a circuit pattern (not shown).

And the Hall element 16 of the resin package 1 for the X direction is arranged horizontally in the X direction (see FIG. 7 (f)), and the Hall element 16 of the resin package 1 for the Y direction is Y. In the horizontal direction, the Hall element of the magnetic detection package 30 is vertically arranged in the Z direction. In these arrangements, the three packages respectively detect magnetism in each of X, Y, and Z directions and output voltages, and the controller IC 19 performs three-axis directions based on these three types of voltages. Each magnetic field of Hx, Hy, and Hz is synthesized to calculate the direction and intensity of the magnetic or geomagnetic field.

In addition, the resin package 1 may be provided in place of the magnetic detection package 30.

In addition, instead of providing two resin packages 1 and a set of magnetic detection packages 30 as described above, two resin packages 1 are provided and each magnetic detection of these resin packages 1 is performed. When the axes are arranged so as to be perpendicular to each other, the magnetic sensor 10 in the two-dimensional direction is obtained, and one resin package 1 is provided to detect the magnetism in the one-dimensional direction by using the resin package 1. It may be.

In addition, although illustration is abbreviate | omitted, in the manufacture of a portable telephone, the magnetic sensor 10 is attached to a portable telephone with a GPS module, the inclination sensor, etc. The mobile phone acquires the current position using the latitude, longitude, and altitude received by the GPS module, the inclination angle of the mobile phone measured by the inclination sensor, and the data of the geomagnetism measured by the magnetic sensor 10. Thus, the user can use the navigation service.

Next, the magnetic sensor of the BGA type package will be described in detail with reference to Figs. 6 (a) to 6 (c), respectively.

Fig. 6A is a top view of the magnetic sensor of the BGA type package according to the first embodiment of the present invention, and Fig. 6B is a bottom view of the magnetic sensor shown in Fig. 6A. The same reference numerals as those described above with reference numerals shown in Figs. 6 (a) and 6 (b) are the same as those mentioned above.

6 (a) and 6 (b), respectively, are BGA types that detect magnetism in each of three-dimensional directions, and two resin packages on the top of the pedestal 18. FIG. (1), the Z direction package 30, and the controller IC 19 are provided, the necessary ones of these are connected by the bonding wire 22, and some of the plurality of bonding wires 22 And the solder ball 100 are electrically connected to each other.

Here, FIG. 6 (c) is a cross-sectional view of the magnetic sensor 20 shown in FIGS. 6 (a) and 6 (b), respectively, showing a cross section taken along line B-B 'shown in FIG. 6 (a). It is displaying. Each terminal of the controller IC 19 and the three resin packages 1 shown in FIG. 6 (a) is bonded and connected to the portion indicated by the black circles on the upper surface of the pedestal 18, and the portions indicated by the black circles are shown in FIG. 6 is connected to the solder ball 100 via a wiring (indicated by a dashed line) formed inside the pedestal 18 shown in FIG. The solder balls 100 are all hemispherical formed on the bottom surface (or the back surface) of the pedestal 18, for example, a plurality of 10 to 100 many are formed at high density. These solder balls 100 are soldered to a circuit pattern (not shown) formed on the substrate 91, whereby the controller IC 19 inside the IC, the three resin packages 1, and the controller IC ( 19 is controlled from an external circuit (not shown).

Next, referring to FIGS. 7A to 7F, the surface when the resin package 1 is mounted on the substrate, and the six surfaces of the resin package 1 shown in FIG. 1A. Correspondence of (a to f) will be described, and each mounting example of the vertical type and the horizontal type will be described. 7 (a) to 7 (f), those having the same reference numerals as those above represent the same as those above.

FIG.7 (a) is a front perspective view of the resin package 1 which concerns on 1st Embodiment of this invention, and the surface (e, f) of the resin package 1 shown to this FIG.7 (a) is respectively, It corresponds to the plane (e, f) shown to FIG. 1 (a). 7 (b) is a rear perspective view of the same resin package 1 shown in FIG. 7 (a), and shows the surfaces (c, d) on the back side of the surfaces (e, f) of the resin package (1). It is displayed and corresponds to the surface c and d shown to Fig.1 (a).

Moreover, the difference of the arrangement | positioning method at the time of attaching the resin package 1 to a circuit pattern is shown to FIGS. 7 (c) -7 (f), respectively. In addition, HE (Hall Element) represents the Hall element 16.

The vertical and horizontal arrangements shown in Figs. 7C to 7F are for surface mounting of the substrate 91, and the lead terminals 21 of the resin package 1 are directly on the circuit pattern side. Are facing. On the other hand, in the arrangement of the vertical and horizontal shapes shown in Figs. 7D and 7F, respectively, the lead terminals 21 of the resin package 1 do not face the circuit pattern side, The ceiling surface and the controller IC (denoted IC) 19 are connected by a bonding wire 22.

In addition, the four types of arrangements shown in each of FIGS. 7C to 7F and the correspondence with the magnetic detection direction will be described in detail.

The four types of arrangements shown in Figs. 7C and 7E are for detecting magnetism in the Z direction and magnetism in the X or Y direction, respectively (the pattern surface is in the Z direction (vertical) or X or Y direction (horizontal).

In this manner, the two mutually intersecting surface portions (e, f) intersecting each other in the resin package main body 5 are configured as two adjacent surface portions (e, f) orthogonal to each other. In the resin package 1, the surface portions e and f are not strictly orthogonal to each other at 90 degrees, and the intersecting angles can be allowed to have a predetermined angle.

In addition, the number of the lead terminals 21 at the time of bonding connection may be three or less and five or more as well as four. The lead layout is a lower surface and an opposite surface of the device.

In this way, the present resin package 1 can be molded or mounted on a substrate in a state in which the resin package 1 is arranged vertically and horizontally.

Next, an arrangement example of the resin package 1 in the case where the resin package 1 is made into one chip will be described with reference to Figs. 7 (g) to 7 (i).

7 (g) to 7 (i) are diagrams for explaining an example of the arrangement of the magnetic sensor chips in which the resin package 1 according to the present embodiment is mounted, and FIGS. 7 (g) to 7 ( X, Y, and Z shown in i) each indicate the direction of the magnetic field. Here, the magnetic sensor 10 shown in FIG.7 (g) mounts the controller IC 19 with each resin package 1. On the other hand, the magnetic sensor 11 shown in FIG. 7H is a layout in which the controller IC 19 is attached to the outside, and the controller IC 19 and each resin package 1 are directly bonded. Although not shown, a mold having a wiring pattern formed therein, a substrate on which a wiring pattern is formed by soldering to a bottom surface of the mold, and a controller IC of a BGA type for external attachment are provided. 1) can also be electrically connected by surface mounting system.

In addition, in the magnetic sensor 12 shown in FIG. 7 (i), the resin package 1, the controller IC 19, and the like are mounted directly on the substrate by soldering, and are connected to an external circuit (not shown). The connector 94 is provided.

Thereby, the LGA type is obtained by connecting the bonding wires 22 to those shown in Figs. 7 (g) to 7 (i), and the solder balls 100 (Fig. 6 (a) and the like) are obtained. The BGA type is obtained by soldering to the provided substrate. In addition, although not shown, it can also manufacture in IC package shape other than LGA type and BGA type.

In addition, when the package shape is explained in full detail, the magnetic sensor 11 shown to FIG.7 (g) and FIG.7 (h) is a lead frame type, a lead wire package type, a BGA type, LGA type, and a lead, respectively. Various shapes such as solder and package type can be used. As the magnetic sensor 12 shown in Fig. 7 (i), a board mounting type, a pattern, a solder, or a package type can be used.

In this manner, the present resin package 1 can realize various functions regardless of the chip shape.

Hereinafter, the manufacturing method of this resin package 1 is explained in full detail.

It is a top view of the metal plate before the bending process which concerns on 1st Embodiment of this invention. As for the metal plate 5 shown in this FIG. 8, 200 pieces in total (50 guards) which make one set of four lead terminals 21 (four rectangular lead terminals 21 attached with "L") to one set (guard) When the terminal for dragon is included, about 250 lead terminals 21 are formed. In addition, two guard terminals (guard terminals: see FIG. 13 (b)) 92 are formed outside the four lead terminals 21 to prevent damage to the resin package 1 during cutting. Can be avoided. That is, four lead terminals 21 are used to manufacture one resin package 1. And as mentioned below, the hole element 16 which attached the yoke 17 was fixed by bonding between two inside of four lead terminals 21 by bonding, and it is 50 resin packages in a final process. (1) is isolate | separated and 50 resin packages 1 of the same structure are manufactured.

In addition, the properties required for the 50 resin packages 1 are relatively low in thermal expansion ratio, excellent in heat dissipation efficiency and large in strength against bending. As a material having this property, a Cu system is used as an example. In addition, the circular hole part 5a and the rectangular hole part 5b formed in the metal plate 5 are all the guide holes used for fixing the metal plate 5 at the time of a process, the movement of the metal plate 5, etc. to be. In addition, the number of lead terminals of one set, the manufacturing number, yield, and guard terminal number of the resin package 1 can be changed into various values.

9A and 9B are diagrams each showing an example of a shape pattern of the lead terminal 21 (lead frame 6) according to the first embodiment of the present invention. 9 (a) and 9 (b) show the metal plate 5 in the part without the diagonal line, respectively. Here, the shape patterns shown in Figs. 9A and 9B show the lead frames 6 from the directions of the planes e and f, respectively (see Fig. 1A). It is shown. In addition, the code | symbol 16 shown with the dotted line in FIG.9 (a) and FIG.9 (b) represents a hall element.

10A to 10F are views for explaining the bending process of the lead terminal 21 performed before mounting the hall element in the description of the first embodiment of the present invention.

In the first step, as shown in each of FIGS. 10A and 10B, the hole element (not shown) is disposed so as to intersect the lead terminal 21 at the tip portion of the lead terminal 21. Two V notches (V type notches) V ₁ and V ₂ having a width corresponding to the size of the bottom surface are formed. Here, V ₁ is a V notch for bending for easily bending the metal plate 5, and V ₂ is a V notch for cutting. It is also possible to notch V (V ₂₎ for cutting, to form in the other steps in before the cut after the resin package 1 is made. The number of V notches, the depth, the width between the V notches, and the like can be set in various values.

In the second step, a Teflon (registered trademark) tape 95 as a masking member is provided on the surface (hereinafter referred to as the back surface) on the opposite side of the bent surface of the tip portion shown in FIGS. 10 (c) and 10 (d). For example, it is attached (attached) using the map mold method or the like. In addition, the material of the Teflon tape 95 has the characteristic of polyimide high temperature resistance, for example, and is hard to peel off.

In the third step, the tip portions shown in Figs. 10E and 10F are bent at right angles (90 degrees). In addition, the bending angle of the lead frame 6 exposed on the lower surface and the rear surface of the resin package 1 may be set at an angle of about 45 degrees to about 90 degrees. In this case, the bending process can be smoothly performed. Can be. In addition, since there are two bending operations of the metal plate, the first bending angle is not necessarily required until it is strictly 90 degrees, and may be an angle slightly larger or slightly smaller than 90 degrees. Thereby, the potato angle is adjusted or selected.

Subsequently, in the fourth step, the hall element (not shown) is attached to the lead terminal base side portion on the base side rather than the tip portion of the bent lead terminal 21.

11 (a) to 11 (c) are views for explaining the mounting method of the hall element 16 according to the first embodiment of the present invention, respectively. Fifty hole elements 16 are die-bonded by paste bonding between the V notches V ₁ and V ₂ of the tip portion shown in FIG. 11 (a). That is, each Hall element 16 is fixed to the lead terminal 21 (lead frame 6).

In addition, in the fifth step, the four electrodes 16a to 16d of the Hall element 16 shown by black circles in Fig. 11C are four lead terminals 21 shown in Fig. 11C, respectively. Is bonded). In addition, various kinds of electrodes to be bonded are selected in addition to Au and the like.

And a 6th process molds the bonded resin package 1 obtained by FIG. 11 (a)-FIG. 11 (c).

12 (a) to 12 (c) are diagrams for explaining the molding of the resin package 1 according to the first embodiment of the present invention, respectively. The metal mold | die 90 shown to this FIG. 12 (a) is attached to the bent metal plate, and a synthetic resin is inject | poured into the lead frame area | region enclosed by this metal mold | die 90. FIG. And after resin molding (molding press or potting) is performed, a burr is removed and the resin molded object 24 by which the resin package 1 is subordinately arrange | positioned is obtained (refer FIG. 13 (a) described below).

12 (c) is an enlarged view of the outer surface of the resin molded body 24 according to the first embodiment of the present invention, and the teflon is attached to the outer surface (part denoted by C) shown in this FIG. 12 (b). By attaching the tape 95, the level difference between the portion where the lead terminal 21 is mounted and the portion where the lead terminal 21 is not mounted is flattened.

Subsequently, the seventh step peels off the Teflon tape 95 attached to the lead frame 6.

FIG. 13A is a diagram for explaining the removal method of the Teflon tape 95 according to the first embodiment of the present invention. When the Teflon tape 95 is peeled off from the back surface of the bonded four lead terminals 21 shown in Fig. 13A, the portion where the lead terminal 21 is mounted and the lead terminal 21 are mounted. The uneven parts are exposed in a flat state.

In the eighth step, the resin molded body 24 is cut to obtain 50 resin packages 1.

FIG. 13 (b) and FIG. 13 (c) are figures for demonstrating the cutting method of the resin molded object 24 which concerns on 1st Embodiment of this invention. As the manufacturing apparatus shows the resin molding 24 shown to FIG. 13 (a) using the cutter 96 shown to FIG. 13 (c), as shown to FIG. 13 (b), at about equal intervals. When cutting, the guard terminal 92 is cut | disconnected, each resin package 1 is isolate | separated, and 50 resin packages 1 which have the same structure as shown to FIG. 1 (c), FIG. 1 (d) are manufactured. do. Thereby, an efficient manufacturing plan can be made.

About each process mentioned above, each manufacturing method of one resin package 1 and 50 resin packages 1 is demonstrated.

Apparatus for manufacturing a resin package (1), forming a lead terminal 21, a bend for V-notch (V ₁₎ of the lead terminal 21 so as to intersect prior to the step of bending the tip end portions of the lead terminals 21 In addition, prior to the step of cutting the resin molded body from the metal plate (conductor plate) (FIG. 13 (a), etc.), the cut V notch V ₂ is cut in the lead terminal 21 so as to intersect the lead terminal 21. (1st process) is formed. In addition, when forming both V notches (V ₁ , V ₂ ) prior to the step of bending the tip portion of the lead terminal 21, the formation of the cutting V notches (V ₂ ) and the bending V notches (V) Formation of ₁ ) may be any one first. Moreover, the manufacturing apparatus attaches masking members, such as Teflon tape 95, to a back surface (2nd process).

Next, the manufacturing apparatus bends the tip portions of the four lead terminals 21 formed on one side of the metal plate 5 (third step), and then attaches the hall element 16 to the lead terminals 21. It attaches (4th process). In the fourth step, when the hall element 16 is attached to the lead terminal 21, the manufacturing apparatus is arranged at the base portion of the lead terminal on the base side rather than the tip portion of the bent lead terminal 21. The hall element 16 is mounted. And the manufacturing apparatus electrically connects the lead terminal 21 and the hall element 16 using a bonding, for example (5th process).

Further, for the bent lead terminal 21 and the hall element 16 electrically connected to the lead terminal 21, for the hall element 16, this is embedded in the resin molded body, and for the lead terminal 21. By molding the resin so that the outer surface of the terminal 21 is exposed over two adjacent surface portions (for example, the surfaces (e, f) shown in Fig. 1A) intersecting each other in the resin molded body, The resin molded body 24 is produced (manufactured) (sixth step). When manufacturing this resin molding 24, a manufacturing apparatus performs resin molding, after attaching masking members, such as Teflon tape 95, to the outer surface side of the lead terminal 21. FIG. And the manufacturing apparatus cuts the resin molding 24 from the metal plate 5 (8th process).

Thus, each resin package 1 of a vertical type and a horizontal type can be manufactured by the same process.

On the other hand, 50 of the resin package (1) also, prior to the step of bending the tip end portions of the lead terminals 21, to intersect with the lead terminal 21, form a bent V-notch (V ₁₎ for, in addition, Prior to the step of cutting the resin molded body 24 from the metal plate 5, a cutting V notch V ₂ is formed at the tip portion of the lead terminal 21 so as to intersect with the lead terminal 21 (first step) ), The Teflon tape 95 is attached to the back surface (second step). Further, the step of forming the bent V-notch (V _1), V notch (V ₂₎ for cutting for the, in all, the Teflon may be a tape (95) after attaching the installation, and, V notch (V ₂₎ for cutting May be performed after formation of the V notches V ₁ for bending. In addition, when forming both V notches (V ₁ , V ₂ ) prior to the step of bending the tip portion of the lead terminal 21, the formation of the cutting V notches (V ₂ ) and the bending V notches (V) Formation of ₁ ) may be any one first.

Next, in the manufacturing apparatus, the metal plate 5 in which the lead terminal 21 of 50 pairs (about 250 pieces are included when the guard terminal 92 is included) which consists of four lead terminals 21 as one set is formed in one side. ), The tip portions of the 200 lead terminals 21 are bent (third step), and the hall elements 16 are attached to the respective lead terminals 21 of the above sets (fourth step). .

Moreover, similarly to the manufacturing process of one resin package 1, a manufacturing apparatus mounts the hall element 16 in the lead terminal base side part of the base side rather than the front end part of the said bent lead terminal 21 above. do. Further, the step of forming the cutting V-notch (V ₂₎ for, on the lead terminal base side portion of the base side, may be carried out after the step of mounting the hall element 16. And the manufacturing apparatus electrically connects the said lead terminal 21 of each said group, and the corresponding hall element 16, respectively (5th process).

In addition, for each of the above-described Hall elements 16 electrically connected to the bent lead terminals 21 and the lead terminals 21, for the Hall elements 16, they are embedded in the resin molded body 24 and lead terminals. Regarding (21), the resin molded body is formed by performing resin molding so that the outer surfaces of the four lead terminals 21 are exposed over two adjacent surface portions e and f intersecting with each other in the resin molded body 24. A plurality of (24) is produced (sixth step).

 When manufacturing each resin molded object 24, the manufacturing apparatus performs resin molding, after attaching and installing the Teflon tape 95 as a masking member to the outer surface side of the lead terminal 21. As shown in FIG. In addition, the attaching and attaching process of the Teflon tape 95 can be performed after the process of attaching the hall element 16 to the lead terminal base side portion on the base side rather than the tip portion of the bent lead terminal 21. And the manufacturing apparatus cut | disconnects these resin moldings 24 from the metal plate 5 (8th process).

Thus, according to this manufacturing method, one resin package 1 and some resin package 1 can be manufactured by substantially the same process. Moreover, since one resin package 1 and some resin package 1 can be manufactured using the same manufacturing line, it contributes to the improvement of manufacturing efficiency.

In addition, one resin package 1 and a plurality of resin packages 1 can be manufactured without the rearrangement or the change of a manufacturing line, and work efficiency is greatly improved and production efficiency is further improved. Improve.

14 (a) is a diagram for explaining a manufacturing method of the magnetic sensor 10 (or 20) according to the first embodiment of the present invention. Prior to the soldering, plating treatment of Pd or Sn is performed on the bottom surfaces of the magnetic sensors 10 and 20 shown in Fig. 14A. In addition, reflow soldering (for example, powdery solder) is performed at the position to be soldered on the substrate 91. And the magnetic sensor 10 or 20 is correctly arrange | positioned on the board | substrate 91, this board | substrate 91 passes through a heating furnace, and is soldered (this soldering process is called reflow), and surface mount type magnetic Sensor 10 or 20 is manufactured.

14 (b) is a figure for demonstrating the manufacturing method using the bonding which concerns on 1st Embodiment of this invention. Each resin package 1 for Z direction and X or Y direction shown to this FIG. 14 (b) is being fixed on the board | substrate 91, and with the lead terminal 21 of each resin package 1, For example, the controller IC 19 is bonded to manufacture the magnetic sensor 10 or 20.

The magnetic sensor 10 or 20 manufactured in this way can respond to specifications, such as a restriction | limiting of height, and can promote the miniaturization of a mobile telephone. In addition, the user can use a navigation service.

Further, the single chip and the mold can be resistant to impact, prevent the positional shift and voltage loss of the Hall element 16, and maintain stable detection accuracy.

In this manner, according to the present manufacturing method, a small magnetic sensor 10 or 20 and azimuth sensor of about 4 mm square can be obtained, which can be adapted to the specification regarding the size of the mobile telephone. In addition, two types of vertical and horizontal arrangements are possible, and for example, the magnetic sensor module can be flexibly arranged with respect to requirements such as the height (Z direction) and the area (X or Y direction). Improves.

In addition, since the product shape and manufacturing process of this manufacturing method and the resin package 1 can be used, without changing substantially existing product shapes, such as BGA and LGA type | mold, a manufacturing process, such as a mold and a bonding, It is possible to supply magnetic sensors and the like having added value such as freedom of design at low cost. The orientation sensor also has almost the same advantages as those of the magnetic sensors 10 and 20 described above.

In addition, the shape of the resin package 1 can be modified in various ways.

15A is a perspective view of a resin package according to a modification of the first embodiment of the present invention. The resin package 31 shown in FIG. 15A is provided with seven surfaces (surface portions) 31a to 31g, and the resin package main body 13 is formed by the surfaces 31a to 31g. Similarly, synthetic resin is injected into the space region surrounded by the resin package main body 13. Moreover, the surface 31d (inclined surface) is provided between the surface 31a (upper surface) and the surface 31b (front side surface). The cross-section C-C 'parallel to 31 g (left side surface) has a pentagonal shape. Moreover, four lead terminals 21 are provided in the surface 31c and the surface 31g of the resin package 31, for example, and these lead frames 6 are manufactured by the bending process of a metal plate. . In Fig. 15A, the Hall element 16 is not shown.

In addition, what is shown to FIG. 15 (a) and following FIG. 15 (b) and having the same code | symbol as mentioned above is the same as those.

Fig. 15B is a diagram showing an example of mounting the Hall element 16 according to the modification of the first embodiment of the present invention. The hall element 16 shown in FIG. 15B is die-bonded and fixed to the surface 31e by paste bonding. In addition, the electrical connection of the lead terminal 21 and the hall element 16 is performed using the bonding wire 22 via the electrode 97. As shown in FIG. Here, the electrode 97 is attached to the inner surface of the surface 31e, and by using the internal wiring formed inside the surface 31, the hall element 16 is connected to the lead terminal 21 through the lead terminal 21, It is to be electrically connected to an external circuit.

Thus, the resin package 31 embeds the Hall element 16 as a semiconductor chip and the Hall element 16, and has a resin package body having two adjacent surface portions 31c and 31g which are orthogonal to each other. 13 and the outer surface of the two surface portions 31c and 31 in the resin package body 13 are mounted over these two surface portions 31c and 31, and at the same time, the hall element 16 and the resin package body. The lead frame 6 electrically connected in (13) is comprised.

Thus, even when the resin package 31 which modified the external shape of the resin package is used, the magnetic sensor 10 or 20 can be manufactured without causing deterioration in the accuracy of magnetic detection. 16A and 16B are sectional views of the resin package 31 according to the modification of the first embodiment of the present invention, respectively, and those having the same reference numerals as described above are the same as those. As shown in these FIG. 16 (a) and FIG. 16 (b), the resin package 31 of either a vertical type | mold or a horizontal type | mold can be provided on the base 18. FIG.

Thereby, the vertical resin package 13 shown in FIG. 16 (a) detects magnetism from the Z direction, and the horizontal resin package 13 shown in FIG. 16 (b) has the X direction or The magnetism from the Y direction is detected.

Thus, the resin package can take various external shapes, and even when each external shape is different, the built-in hall element 16 can be arranged on the pedestal 18 in two types of vertical and horizontal shapes. In this state, magnetic detection from each of the Z, X, and Y directions can be performed, and thus advantages similar to those obtained in the above embodiments can be obtained.

(B) Description of Second Embodiment of the Present Invention

Various types of semiconductor chips having the same order size as those of the hall element 16 in the first embodiment are known. In 2nd Embodiment, the aspect using a light emitting diode element (light emitting diode: hereinafter, LED) or an infrared sensor element is demonstrated.

A product in which the LED is molded into a resin package is, for example, penlight, and is improved by a brilliant atmosphere by shaking the penlight in the intestine. In 2nd Embodiment, a semiconductor chip is comprised as LED and the resin package main body is comprised as a light transmissive resin package main body. The structure of the LED built-in resin package in 2nd Embodiment replaces the hall element 16 of the resin package 1 in 1st Embodiment with LED.

Here, the LED can be molded with a synthetic resin, and can emit light in a molded state, for example, like a light emitting pen. In addition, as the color of the pigment contained in the synthetic resin, a desired color can be used, and for example, light having a high luminance can be obtained by various colors such as colorless transparent or colored transparent (green transparent, blue transparent, etc.). You can print

In addition, an infrared sensor element detects radiation energy (heat source) of a human, an animal, or an object, for example, and is specifically for measuring the intensity of an infrared ray. The functions of the infrared sensor element are, for example, point intensity (infrared intensity at a desired point) measurement, intensity distribution measurement, temperature measurement, optical information transmission, and distance positioning using triangulation. And the semiconductor chip is comprised as an infrared sensor element, and the resin package main body 13 is comprised as an infrared permeable resin package main body. In addition, the structure of the resin package with built-in infrared sensor element replaces the hall element 16 of the resin package 1 in 1st Embodiment with the infrared sensor element. In addition, the arrangement direction of the infrared sensor element is such that the infrared detection unit is directed outward of the resin package 31. For example, as shown in FIG. 15, the bottom surface of the infrared sensor element is two or four. Each of the lead terminals 21 is adhered with an insulating paste or the like.

In addition, about the fixed positions in the resin packages 1 and 31 of the LED and the infrared sensor element, when the LED and the infrared sensor element are pasted together to the bottom surface of the resin package 31, the "resin package 31" is used. Which side is the bottom surface "and" in which direction the longitudinal axes of the resin packages 1 and 31 are directed "are considered. In the case where the LEDs and the infrared sensor elements are mounted on the resin packages 1 and 31, materials having high output transmission characteristics of the light beam and input transmission characteristics of the infrared rays are selected, respectively, and the molded resin package ( Even if 1, 31) is used, the accuracy of light emission of light signals and detection of infrared rays is maintained.

Specifically, both the light emitting axis of the LED and the light receiving axis of the infrared sensor element are fixed in the resin package 31 so as to coincide with the above magnetic detection axis. In the one to three resin packages 31 including the LED or the infrared sensor element fixed to coincide with the magnetic detection axis, the light emission axis or the light reception axis interfere with each other on the substrate 91 or the pedestal 18. In this way, the light from the LED reaches the outside, and the infrared sensor element can efficiently receive the infrared light from the outside.

Therefore, the present resin package 31 outputs light emitted from the inside of the resin package 31 as an LED to the outside of the resin package 31, and simultaneously receives light input from outside the resin package 31 as an infrared sensor element. The light is received inside the package 31.

In addition, this resin package 31 can also mount LED and an infrared sensor element together.

Next, the manufacturing method of the semiconductor chip buried resin package 31 which concerns on 2nd Embodiment of this invention is demonstrated each manufacturing method of one resin package 31 and 50 resin packages 31, However. Each of these manufacturing methods also replaces the Hall element 16 in the first embodiment with an LED or an infrared sensor element.

First, the manufacturing apparatus bends the front end portions of the four lead terminals 21 formed on one side of the metal plate 5, mounts the LEDs on the lead terminals 21, and uses the lead terminals 21 and the LEDs as examples. For example, it is electrically connected using bonding. In addition, with respect to the LED electrically connected to the bent lead terminal 21 and the lead terminal 21, the LED is embedded in the resin molded body 24 (refer to FIG. 13 (a)), and the lead terminal 21 The resin molded body 24 is produced by performing resin molding so that the outer surface of the lead terminal 21 may be exposed over two adjacent surface parts which mutually cross in a resin molded body. And the manufacturing apparatus cuts the resin molding 24 from the metal plate 5.

Thus, since the metal plate 5 is bent after LED is attached to the metal plate 5, each resin package 31 of a vertical type and a horizontal type can be manufactured by the same process. Moreover, an infrared sensor element is also manufactured by the same process as a LED manufacturing method.

On the other hand, also about 50 resin packages 31, the manufacturing apparatus has a total of 200 sets (about 250 pieces including the guard terminal 92) of 50 sets which make one set of 4 lead terminals 21 on one side. In the metal plate in which the terminal 21 was formed, the front-end | tip part of said 200 lead terminals 21 is bent, and LED is attached to each said lead terminal 21 of each set. And the manufacturing apparatus electrically connects the lead terminal 21 of each said group, and corresponding LED, respectively.

In addition, for each of the above-mentioned LEDs electrically connected to the bent lead terminal 21 and the lead terminal 21, for the LEDs, this is embedded in the resin molded body, and for the lead terminal 21, the four lead terminals ( 50 sets of resin molded bodies are produced by performing resin molding so that the outer surface of 21) is exposed over two adjacent surface parts (e, f) which mutually intersect in a resin molded body. And a manufacturing apparatus cut | disconnects these resin moldings from a metal plate.

In addition, it is also possible to use the manufacturing method similar to the arrangement | positioning method of FIG. 15 (a) and FIG. 15 (b) also about the manufacturing method of the semiconductor chip buried resin package which provided the infrared sensor element instead of LED. Since the manufacturing method of the semiconductor chip buried resin package which installed this infrared sensor element is the same as that of LED manufacturing method, duplication description is abbreviate | omitted.

Thus, according to this manufacturing method, the substantially rectangular parallelepiped resin package 31 can implement | achieve the self-detection function of two directions, and contributes to the improvement of manufacturing efficiency.

In addition, the resin package 31 may be the case where the surface parts e and f do not mutually cross.

Moreover, by this, a user may select and use whether the light emission direction of an LED is an upward direction or a horizontal direction, for example. For such LEDs, products that are cheap and have high brightness are mounted.

Moreover, by this, a user can select the light reception direction of an infrared sensor element to an upper direction or a horizontal direction.

In this way, even when the arrangement direction of the resin package 31 in which the LED or the infrared sensor element is buried is changed, the degree of freedom of the arrangement of the resin package 31 can be improved while maintaining conduction between the resin package 31 and the outside. In addition, miniaturization and mass production can be achieved.

(C) other

Various shapes can be used for the shape of the above-mentioned resin packages 1 and 31, and various things can also be used for materials, such as the board | substrate 91 and synthetic resin. For example, the lead frame 6 may use a conductive material other than metal.

In addition, the magnetic sensors 10 and 20 using the semiconductor chip buried resin packages 1 and 31 of the present invention are also applied to a device for acquiring position information installed in a ship or the like, as well as a measurement device for tilt angles in building inspection and civil inspection. It is possible.

It is needless to say that the semiconductor chip buried resin packages 1 and 31 of the present invention can be applied to an orientation sensor. Since the azimuth sensor outputs azimuth information using data indicating the strength of the one-to-three-dimensional geomagnetism detected by the magnetic sensor, the direction of the geomagnetism, and data serving as a reference for the azimuth held in advance, When mounted on a telephone or the like, it contributes to the miniaturization of the mobile telephone.

The number n of lead terminals 21 may be 1 to 3 or 5 or more, and the number of combinations M may be various values. In addition, the various values in the said 1st Embodiment and 2nd Embodiment are all an example, and the superiority of this invention does not impair at all, only by changing the numerical value in these description.

The method for manufacturing the semiconductor chip buried resin package can also be mounted as a hybrid module provided with a single LED, a Hall element 16 for outputting azimuth, an output of azimuth sensor, and a controller IC 19.

According to the semiconductor chip buried resin package of the present invention, the degree of freedom of arrangement can be improved, and the size of the device on which the resin package is mounted can be reduced. In addition, the number of parts can be reduced, the versatility of the parts can be improved, and the cost reduction is promoted.

And according to the manufacturing method of the semiconductor chip buried resin package of this invention, since semiconductor chips, such as a hall element or LED and an infrared sensor element, are molded, resistance to shock etc. can be improved and long-term quality Can be maintained.

Further, according to the magnetic sensor using the semiconductor chip buried resin package of the present invention, for example, in addition to miniaturization of a mobile phone, miniaturization of various magnetic or geomagnetic detection devices such as azimuth sensors, ships, construction, and measurement, We aim at low cost. In addition, since the self-detection accuracy can be maintained equal to the precision according to the prior art, the communication service provider can expand and expand the navigation service.

That is, according to the semiconductor chip buried resin package of the present invention, a design having a high degree of freedom in placement can be made and the number of parts is reduced, thereby facilitating the generalization of parts.

Moreover, according to the manufacturing method of the semiconductor chip buried resin package of this invention, since it can use without changing an existing manufacturing process, mounting cost can be reduced besides manufacturing cost, and also low cost when carrying out mass production It can manufacture efficiently.

And according to the manufacturing method of the semiconductor chip buried resin package of this invention, since one resin package and some resin package can be manufactured by substantially the same process, and can also be manufactured using the same manufacturing cost. Contributes to the improvement of manufacturing efficiency. Furthermore, it is possible to manufacture one resin package and a plurality of resin packages without involving rearrangement or modification of the production line, so that the work efficiency is greatly improved and the production efficiency is further improved.

In addition, according to the magnetic sensor using the semiconductor chip buried resin package of the present invention, the magnetic sensor can be miniaturized, which contributes to the miniaturization of a mobile phone or the like. Further, for example, a portable telephone having a navigation function can be miniaturized.

Claims (15)

Semiconductor chip, A resin package main body having two adjacent face portions intersecting each other while embedding the semiconductor chip; A semiconductor comprising a lead frame which is mounted on the outer surface of the two face portions in the resin package body over the two face portions and electrically connected within the semiconductor chip and the resin package body. Chip buried resin package. The semiconductor chip buried resin package according to claim 1, wherein the two mutually intersecting surface portions of the resin package main body are configured as two adjacent mutually orthogonal surface portions. The semiconductor chip according to claim 1 or 2, wherein the semiconductor chip is configured as a hall element, A semiconductor chip buried resin package, wherein the resin package body is configured as a magnetic field transparent resin package body. The semiconductor chip according to claim 1 or 2, wherein the semiconductor chip is configured as an infrared sensor element, A semiconductor chip buried resin package, wherein the resin package body is configured as an infrared ray transmissive resin package body. The semiconductor chip according to claim 1 or 2, wherein the semiconductor chip is configured as a light emitting diode element, The said resin package main body is comprised as a light transmissive resin package main body, The semiconductor chip buried resin package characterized by the above-mentioned. Bending the tip portions of n lead terminals formed on one side of the conductor plate (n represents a natural number); Mounting a semiconductor chip on the lead terminal; Electrically connecting the lead terminal and the semiconductor chip; For the bent lead terminal and the semiconductor chip electrically connected to the lead terminal, this is embedded in the resin molded body for the semiconductor chip, and for the lead terminal, the outer surface of the lead terminal is mutually formed in the resin molded body. A step of producing the resin molded body by performing resin molding so as to be exposed over two adjacent face portions that intersect with each other; And a step of cutting the resin molded body from the conductor plate. In one side, a conductor plate having n (m represents a natural number) lead terminals and a total of n x m lead terminals formed of a set of m (m represents a natural number) pairs, the leading end of the n x m lead terminals Process of bending parts, Mounting a semiconductor chip to each of the above-described lead terminals; Electrically connecting the lead terminals of the pairs to the semiconductor chips respectively; For each of the above semiconductor chips electrically connected to the bent lead terminal and the lead terminal, this is embedded in a resin molded body for the semiconductor chip, and for the lead terminal, the outer surface of the n lead terminals is the resin. A process of producing a plurality of said resin molded objects by performing resin molding so that it may expose over two adjacent surface parts mutually crossing in a molded object, A process for producing a semiconductor chip buried resin package, comprising the step of cutting these resin molded bodies from the conductor plate. The semiconductor chip according to claim 6 or 7, wherein the semiconductor chip is attached to the lead terminal base side portion of the base side of the lead terminal rather than the tip portion of the bent lead terminal when the semiconductor chip is mounted on the lead terminal. The manufacturing method of the semiconductor chip buried resin package characterized by the above-mentioned. The method according to claim 6 or 7, wherein when producing the resin molded article, A resin chip is formed after attaching and installing a masking member on the outer surface side of the said lead terminal. The manufacturing method of the semiconductor chip buried resin package characterized by the above-mentioned. The semiconductor chip buried resin package according to claim 6 or 7, wherein a bending notch is formed in the lead terminal so as to intersect the lead terminal before the step of bending the tip portion of the lead terminal. Method of preparation. The semiconductor chip buried resin according to claim 6 or 7, wherein a cut notch is formed in the lead terminal so as to intersect the lead terminal prior to the step of cutting the resin molded body from the conductor plate. Method of manufacture of the package. Substrate, A resin package body disposed on the substrate and having two adjacent face portions perpendicular to each other at the same time that the hole elements and the hole elements are embedded, and on the outer surfaces of the two face portions in the resin package body, A first semiconductor chip buried resin package mounted over two surface portions and provided with a lead frame electrically connected within the hall element and the resin package body; And a control unit for driving and controlling the Hall element in the first semiconductor chip buried resin package. The second semiconductor chip buried resin package according to claim 12, wherein the second semiconductor chip buried resin package having the same structure as the first semiconductor chip buried resin package is separated from the first semiconductor chip buried resin package on the substrate. A magnetic sensor using a semiconductor chip buried resin package, which is disposed in a state of being rotated 90 degrees with respect to the semiconductor chip buried resin package. The first semiconductor chip buried resin according to claim 13, wherein the first semiconductor chip buried resin in three axes constituting a three-dimensional space is formed on the substrate separately from the first semiconductor chip buried resin package and the second semiconductor chip buried resin package. Magnetic sensor using a semiconductor chip buried resin package, characterized in that a magnetic sensing member capable of detecting magnetism in an axial direction different from the axial direction detected by the package and the second semiconductor chip buried resin package is disposed. . 15. The method of claim 14, wherein the magnetic sensing member is configured as a third semiconductor chip buried resin package having the same structure as the first semiconductor chip buried resin package, The third semiconductor chip buried resin package is disposed in a state where the third semiconductor chip buried resin package is rotated by 90 degrees with respect to the first semiconductor chip buried resin package and the second semiconductor chip buried resin package, respectively. Magnetic sensor using the package.

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