JPH1197582A - Wiring board and production thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the distance of wiring connecting the surface and backside of a board by arranging a plurality of second connecting terminals similarly to a plurality of first connecting terminals and forming a linear wiring connecting the first and second corresponding connecting terminals linearly between insulating stripe members. SOLUTION: First terminals, i.e., a plurality of surface pads 5, are formed on the surface 2a of a wiring board body 2 made of alumina ceramic and second terminals, i.e., a plurality of backside pads 6, are formed on the backside 2b thereof. The surface and backside pads 5, 6 are then connected, respectively, through a plurality of linear inner wiring 7 formed on the side face of insulating strip members 3a-3d by printing or the like. In this regard, the insulating strip members 3a, 3c and 3d have milky white color and the insulating stripe member 3b is added with tungsten, or the like, in order to form a black stripe pattern on white back ground. According to the arrangement, the distance of wiring connecting the surface and backside of the wiring board body 2 can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board on which an integrated circuit chip is mounted and a method of manufacturing the same, and more particularly, to a wiring board suitable for a CSP (chip scale package) having a plane dimension comparable to that of an integrated circuit chip, and a wiring board therefor It relates to a manufacturing method.

[0002]

2. Description of the Related Art Conventionally, a wiring board is formed by laminating and firing unsintered insulating layers having a small thickness. Wiring is formed on each of the insulating layers. Through holes and vias were used. In order to form this via or the like, it was necessary to first drill a through hole in the insulating layer.

[0003] With the high integration and high speed of integrated circuit chips (hereinafter also referred to as IC chips), miniaturization of a wiring board on which they are mounted is also required. (So-called chip-scale package, hereinafter also referred to as CSP) having a planar dimension of is required. For example, CSP1 shown in FIG.
In FIG. 00, two insulating layers 101 and 102 are laminated, and a pad 101p formed on a surface 101a thereof is formed.
And an IC chip I indicated by a broken line are connected by a solder S1 by a flip chip method, and a pad 102p formed on the back surface 102b and another wiring board P indicated by a broken line are connected by a solder S2 by a flip chip method. Connecting. In addition,
The pads 101p and 102p are electrically connected by vias 101v and 102v formed inside the CSP.

[0004]

In the CSP 100, the distance between the vias 101v and 102v is set to I
It is necessary to form the same as the interval between the terminals (bumps and the like) I1 of the C chip I. However, the interval between the terminals I1 of the IC chip I formed by the photolithography technique is very small, for example, 200 μm. Moreover, IC chip I
Are formed with many terminals I1. For this reason, CS
In manufacturing P100, it was necessary to form a large number of through holes for vias at small intervals (for example, 100 to 200).

[0005] It is difficult to form such a narrow pitch and a large number of via through holes in an unfired insulating layer.
When attempting to drill a large number of through holes using a mold at a time, the through hole diameter is limited to 100 μm and the pitch is limited to about 250 μm. Therefore, when forming a through hole with a pitch and a diameter smaller than that, it is necessary to drill one or several through holes, which takes time and costs. Further, in order to increase the thickness of the CSP 100, a plurality of insulating layers (two layers 101 and 102 in this example) are stacked to form the CSP 100.
In the case where 00 is formed, it is necessary to form through holes in each of the plurality of insulating layers, which is troublesome.

Further, in the CSP, when mounting an IC chip or mounting (connecting) the CSP on another wiring board.
When doing this, it is necessary to determine the positioning and direction. Also, it is necessary to identify the part number of the CSP. There has also been a demand for a method of providing a mark on a CSP with a simple configuration.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and a first object of the present invention is to provide a wiring board which can reduce the distance between wirings connecting the front and back surfaces of the board and which is easy to manufacture, and a method of manufacturing the same. Is to provide. It is another object of the present invention to provide a wiring board provided with a sign having a simple configuration for enabling positioning, direction discrimination, product number discrimination, and the like, and a method of manufacturing the same.

[0008]

According to a first aspect of the present invention, there is provided a liquid crystal display having a flat plate shape having a front surface and a back surface, and a plurality of strip-shaped insulating members being closely attached to each other in a width direction thereof. An insulating member, a plurality of first connection terminals formed on the surface of the insulating member, and a plurality of terminals formed on the back surface of the insulating member and arranged in the same arrangement as the first connection terminal. Formed between the second connection terminal and the strip-shaped insulating member;
A wiring board having an internal wiring that linearly connects the first connection terminal and the corresponding second connection terminal.

According to such a wiring board, since the internal wiring is formed between the strip-shaped insulating members, it is not necessary to form a through hole to form a via penetrating the insulating layer unlike a conventional wiring board. . For this reason, the internal wiring may be formed by printing or the like, and the interval between adjacent internal wirings can be reduced. The internal wiring is preferably formed in a straight line perpendicular to the front surface and the back surface, since the length of the wiring is shortened.

Here, examples of the insulating member include ceramics such as alumina, glass ceramic, and AlN.
In addition, the first connection terminal, the second connection terminal, and the internal wiring may be selected in consideration of the adhesion to the material of the insulating member, the conductivity, the solderability, and the like. , A
g, Ag-Pt, Ag-Pd, Au, Cu, and the like. Further, with respect to W, Mo, and the like, in order to improve oxidation resistance, solderability, and the like, Ni plating or Au
Plating may be applied. Further, the shape of the first and second connection terminals is not particularly limited, and examples thereof include pads and bumps.

[0011] Further, according to a second aspect of the present invention, there is provided the wiring board according to the first aspect, wherein at least one of the front surface and the rear surface is a polished surface.

According to this wiring board, at least one of the front surface and the back surface is a polished surface. Therefore, the coplanarity of the upper surface of the first or second connection terminal formed on the polished surface can be improved. For example, when the surface is a polished surface, the coplanarity of the upper surface of the first connection terminal formed on this surface is good. Therefore,
When an integrated circuit chip is connected to the surface of the wiring substrate by a flip chip method, the connectivity between the first connection terminal and the chip can be improved. Similarly, when the back surface is a polished surface, the coplanarity of the upper surface of the second connection terminal formed on the back surface is improved. Therefore, when another wiring board is connected to this back surface by the flip-chip method, the connectivity between the second connection terminal and the other wiring board can be improved.

Further, according to a third aspect of the present invention, at least one or more layers of the band-shaped insulating members have a color different from that of the other band-shaped insulating members. 2. The wiring board according to item 2.

According to the present invention, a strip-shaped pattern is formed on, for example, the surface of the wiring board by the strip-shaped insulating members having different colors. By reading the pattern such as the number and arrangement of the bands in advance, the type (product number), direction, position, and the like of the wiring board can be recognized.

Further, a solution according to claim 4 is a step of forming a plurality of linear conductor layers parallel to each other on at least one of the front surface and the back surface of the unfired insulating layer; A step of forming a laminate by laminating the fired insulating layers in the thickness direction, and a step of forming the unfired wiring substrate by cutting the laminate to a predetermined thickness in a direction perpendicular to the conductor layer on a straight line, Baking the unfired wiring board.

According to the present invention, a plurality of linear conductor layers parallel to each other are formed on at least one of the front surface and the back surface of the unsintered insulating layer, and the unsintered insulating layers are stacked to form a laminate. An unsintered wiring board is cut by cutting in a direction orthogonal to the linear conductor layer, and the unsintered wiring board is fired to form a wiring board.
Therefore, a troublesome process of forming a via by forming a through hole in the insulating layer and filling the conductor with the conductor is unnecessary. Further, since the linear conductor layer can be formed by printing or the like, the distance between the conductor layers can be reduced. Therefore, it is possible to provide a wiring board having a small distance between the conductor layers. Further, since a number of unfired wiring boards can be formed by cutting, an inexpensive wiring board can be manufactured.

The plurality of linear conductor layers may be formed on any one surface of the unsintered insulating layer. However, when formed on both surfaces, the back surface of one unsintered insulating layer when laminated is formed. Is integrated with the linear conductor layer formed on the surface (front surface) of the other unsintered insulating layer that is bonded to the back surface. As a result, the thickness of the linear conductor layer is approximately doubled, and the conduction resistance can be reduced accordingly, which is preferable.

The unsintered insulating layer is a layer which becomes an insulating layer after firing, and specifically includes a ceramic green sheet formed by a conventionally known doctor blade method, roll coater method or the like.

Further, a solution according to a fifth aspect is to form a plurality of linear conductor layers parallel to each other on at least one of the front surface and the back surface of the unsintered insulating layer; A step of forming a laminate by stacking the fired insulating layers in the thickness direction, a step of firing the laminate to form a fired body, and a step of forming the fired body to a predetermined thickness in a direction orthogonal to the conductor layer on a straight line. And a step of cutting the wiring board.

According to the present invention, a plurality of linear conductor layers parallel to each other are formed on one of the front surface and the back surface of the unsintered insulating layer, and the unsintered insulating layers are stacked to form a laminate.
After baking this into a fired body, it is cut in the direction orthogonal to the linear conductor layer to form a wiring board, so that it is troublesome to drill a through hole in the insulating layer and fill the conductor with a via to form a via. No steps are required. Further, since the linear conductor layer can be formed by printing or the like, the distance between the conductor layers can be reduced. Therefore, it is possible to provide a wiring board having a small distance between the conductor layers. Further, since a number of wiring boards can be formed by cutting, an inexpensive wiring board can be manufactured.

According to a sixth aspect of the present invention, at least one of the stacked unsintered insulating layers is provided.
The one or more unsintered insulating layers are different-color unsintered insulating layers whose coloring after firing is different from the others, and in the laminate forming step,
6. The method for manufacturing a wiring board according to claim 4, wherein said unsintered insulating layers having different colors are laminated at predetermined positions.

According to the present invention, since the uncolored unsintered insulating layers having different colors after firing are laminated at predetermined positions, the sign forming step is not required for forming the sign. In addition, since the insulating layer itself has a different coloring, the sign is not scraped off even after a process such as polishing.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to the drawings. (Embodiment 1) FIG. 1 is a perspective view of a wiring board according to Embodiment 1 of the present invention, and FIG. 2 is a sectional view. Here, FIG.
FIG. 1A is a perspective view of a wiring board 1 according to the present embodiment, and FIG. 1B is an exploded perspective view of the wiring board 1. Also,
FIG. 2A is a sectional view taken along the line AA ′, and FIG. 2B is a sectional view taken along the line BB ′. As shown in FIG. 1A, the wiring board 1 has a wiring board body 2 made of alumina ceramic. The wiring board main body 2 has a rectangular flat plate shape, and is formed by closely attaching band-shaped insulating members 3a to 3d in the width direction thereof in the left-right direction in the drawing. The surface 2a of the wiring board body 2
, Front side pads 5, 5 which are first connection terminals, and back side pads 6, 6, which are second connection terminals, are formed on the back surface 2 b. The front side pad 5 and the back side pad 6 are connected by linear internal wirings 7 formed on the side surfaces of the band-shaped insulating members 3a to 3d by printing or the like.

The band-shaped insulating members 3a to 3d are made of alumina ceramic of about 90% alumina.
a, 3c and 3d are milky white. On the other hand, member 3
b has a black color because W, Mo, Cr ₂ O _{3 and the} like are added. Therefore, the wiring board main body 2 is
As a result, a black striped stripe pattern is formed on a white background. The front and rear pads 5, 6 and the internal wiring 7 are mainly composed of tungsten. Also,
Electroless nickel plating and gold plating are applied to the surfaces of the front side and back side pads 5 and 6 to improve the solderability and the like.

Next, a method of manufacturing the wiring board 1 will be described. First, as shown in FIG. 3A, a green sheet G mainly containing alumina as a ceramic component is formed by a well-known slip casting method, and a tungsten paste is used on the surface thereof, and straight lines parallel to each other are formed by a screen printing method. A plurality of conductor layers L are formed. In this example,
Three such green sheets G (Gb, Gc, G
d) The green sheet Ga on which the conductor layer L is not formed is formed. The green sheet Gb is different from other green sheets in that W, Mo, C
A coloring agent such as r ₂ O ₃ is added.

Next, as shown in FIG. 3B, these green sheets are laminated in the order of Gd, Gc, Gb, and Ga.
The laminate M is formed by pressure bonding as shown in FIG. The laminate M is cut at a constant interval (constant thickness) according to a cutting line X indicated by a dashed line in FIG. This cutting direction is
This is a direction perpendicular to the longitudinal direction of the conductor layer L formed therein (direction perpendicular to the conductor layer). As a result, as shown in FIG. 4 (b), the cross section Lc of the cut conductor layer L is exposed on the cut surfaces C1 and C2 on both sides of the cut cut body (unfired wiring board) C. Become. Further, when formed in this manner, a cut body C having the same shape can be easily formed by cutting in the same manner as the so-called Kintaro candy.
The cut body C is formed by laminating strip members Ca, Cb, Cc, and Cd obtained by cutting the green sheets Ga and the like. As can be seen from FIG. 4B, a colorant is added to the belt-shaped member Cb corresponding to the green sheet Gb, unlike other members.

Further, as shown in FIG.
A tungsten paste is applied by screen printing so as to cover the conductor layer cross section Lc exposed on the cut surfaces C1 and C2 of FIG. In FIG. 5, the unfired pad Cp on the cut surface C2 side is not shown. The pad Cp is formed in order to increase the connection area because the area of the pad Cp is too small in the shape of the conductor layer cross section Lc when connected to an IC substrate or the like.

Then, the wiring substrate 1 is heated to about 1550 ° C. in a reducing atmosphere and integrally sintered to form the wiring board 1 shown in FIGS. Thereby, the band members Ca, Cb, Cc, Cd
Are the band-shaped insulating members 3a to 3d, the conductor layer L is the internal wiring 7, and the pad Cp is the front surface pad 5 and the rear surface pad 6. In addition, the band-shaped member Cb becomes black in the colorant by the firing, and becomes a black band-shaped insulating member 3b.
Other belt-shaped insulating members 3a, 3 to which no coloring agent is added
c and 3d are milky white. The surfaces of the front side pad 5 and the back side pad 6 are further subjected to nickel plating and gold plating by electroless plating.

In the present wiring board, the internal wiring 7 connecting the front surface side pad 5 and the back surface side pad 6 was obtained by firing a conductive layer L formed by printing. That is, since conduction between pads is not performed using vias as in a conventional wiring board, there is no need to drill through holes and fill them with conductors. Therefore, it is easy to form the internal wiring, and the interval between the internal wirings can be easily reduced.

In the present wiring board 1, as is apparent from the cross-sectional views shown in FIGS.
Among them, the interval d1 in the width direction of the band-shaped insulating member 3a or the like becomes the width of the member 3a or the like, while the interval d2 in the longitudinal direction of the band-shaped insulating member 3a or the like is perpendicular to the width of the internal wiring 7 or the like. Is determined by the interval (pitch). The interval d1 is determined by the thickness of each green sheet Ga or the like so that it can be easily understood. More specifically, the interval d1 is a value obtained by multiplying the thickness of the green sheet Ga or the like by a shrinkage rate during firing (a firing shrinkage rate: usually about 0.8). Therefore, in order to reduce the distance d1, the thickness of the sheet may be reduced. The interval d2 is a value obtained by multiplying the interval between the conductor layers L formed on the green sheet G by printing or the like by the firing shrinkage. That is, the conductor layer L is formed by a method such as screen printing.
It is not difficult to form a 100 μm line & space and a wiring of less than 100 μm. Therefore, the wiring board 1 with a small distance d2 can be easily formed.

As shown in FIG. 6, the wiring board 1 formed as described above is connected to the front-side pad 5 formed on the front surface 2a side of the wiring board 1 and the IC chip I via the solder S1 by the flip-chip method. Then, the back surface side pad 6 formed on the back surface side 2b and another wiring board P are connected via the solder S2 by the flip chip method. Between the pads 5 and 6,
Each is electrically connected by the internal wiring 7. Further, in the wiring board of the present embodiment, since the internal wiring 7 is formed in a straight line and connects the front and back surfaces of the wiring board body 2 with the shortest distance,
It is possible to exchange signals between the IC chip I and the other wiring board P at high speed.

Further, in the present embodiment, since only the strip-shaped insulating member 3b is formed in a black stripe pattern,
The product number of the wiring board 1, the direction (direction) of the board, and the position of each pad can be detected from this pattern. That is,
By adding an additive that makes the color development after firing different from the others in the green sheet, it is possible to easily add a pattern, and by this pattern, the product number of the wiring board, the orientation of the wiring board, the position of the pad, etc. Can be detected. For example, in this example, one (3b) of the four strip-shaped insulating members was blackened. Similarly, the member 3a may be blackened, and the product number or the like can be determined based on the position of the member to be blackened. Further, a combination of a plurality of stripes may be used. In this example, W,
Although an example in which Mo and Cr ₂ O ₃ are added to make a black color is shown, other additives may be added to form a different color, and the color tone (shading) is adjusted by adjusting the amount of the additive. ) May be changed. Further, the whole may be blackened and a white ceramic may be used in which only one part is added with no additive.

(Example 2) In Example 1 described above, the laminated body M was cut to form a cut body C, an unfired pad Cp was formed, and then the wiring substrate 1 was formed by simultaneous firing. However, in this example, the pad is formed after firing the cut body C. That is, the cut body C is formed in the same manner as in the first embodiment. Cut surface C1, C2 of cut body C
, The cross section Lc of the conductor layer L is exposed, and in this example, it is fired as it is in a reducing atmosphere. Thereby, the wiring board main body 2 'is sintered. This wiring board body 2 '
As shown in FIG. 7 (a), the front surface 2a 'and the back surface 2a'
b ', the end surfaces 7s' of the internal wiring 7 are exposed from both sides, and the strip-shaped insulating members 3a' to 3d 'are formed in close contact in the width direction thereof, and a black stripe pattern is formed by the members 3b'. .

Next, the surface 2 of the wiring board body 2 '
The a ′ and the back surface 2b ′ are polished by lap polishing or the like.
This makes it possible to eliminate the warpage, undulation, etc. of the wiring board body 2 ′ after firing, and to flatten the front surface 2a ′ and the back surface 2b ′. The black pattern of the band-shaped insulating member 3b 'of the wiring board main body 2' does not disappear even by this polishing. This is because the member 3b 'itself is black.

Next, pads (front side pads, rear side pads) are formed on the front surface 2a 'and the back surface 2b' of the wiring board 2 '. Specifically, a pad is formed by photolithography so as to cover the end face 7s' of the internal wiring exposed from both sides. For example, a Ti-Mo-Cu sputtered layer (thickness 3) is formed on the entire surface 2a 'as a connection layer.
00-2000} -2000}). Further, a photoresist is applied and exposed and developed to open an upper portion of the end face 7s in a predetermined shape (for example, 100 μmφ), and a current is passed through a sputter layer to perform Cu-Ni-Au plating (thickness 3-2-0.5 μm). To remove the resist and the unnecessary sputtered layer, and attach the surface side pad 5 'to the surface 2a'.
To form Similarly, a back surface side pad 6 '(not shown) is formed on the back surface 2b' side to complete the wiring board 1 '(see FIG. 7B).

In this way, the pads 5 'and 6' are formed after the front and back surfaces of the wiring board main body 2 'are polished once, so that the coplanarity of the upper surfaces of the pads 5' and 6 'is improved, and the IC chip and The connectivity with other wiring boards can be improved.

In the above example, Ti-Mo-C
Although an example is shown in which a pad having a configuration in which a Cu-Ni-Au plating layer is laminated on a u-sputtering layer is shown, another configuration may be used. Further, in addition to forming the pad by the photolithography technique as described above, the pad may be formed by vapor deposition using a mask. Further, after polishing, Ag, Ag-Pd, Ag-P
A pad such as t, Cu or the like may be printed, and the pad may be formed by baking at a temperature of about 800 to 1000 ° C. Also in this case, since the deformation of the main body 2 ′ due to the pad baking temperature is small, the front and back surfaces 2a ′ and 2b ′ of the wiring board main body 2 ′ can be made flat. Further, the connection of the IC chip is not limited to the flip chip method, and a structure of a wire bonding method can be adopted.

(Embodiment 3) In the above embodiments 1 and 2, the laminated body M was cut to form a cut body C and fired. In the third embodiment, an example will be described in which the multilayer body M is fired and then cut. That is, this example is the same as Example 1 up to the production of the laminate M (see FIG. 4A). This laminate M was fired in a reducing atmosphere, and FIG.
As shown in (1), a sintered laminate SM is formed. In the sintered laminate SM, four sintered layers Sa, Sb, Sc, and Sd are laminated, and the sintered layer Sb is colored black.

The sintered laminate SM is cut to a predetermined thickness along a cutting line Y indicated by a dashed line. The cutting direction is a direction orthogonal to the conductor layer L inside the multilayer body M. As a result, as shown in FIG.
The wiring board main body 2 ″ having b ′ and exposing the end surface 7s ′ of the internal wiring 7 from both surfaces was formed. According to this method, the sintered laminate SM was formed and then cut, Unlike the sintering of the cut body C, there is no warping or undulation caused by the sintering.
If the surface roughness and scratches of b ″ are sufficiently small, the pad can be formed as it is. The front surface 2a ″ and back surface 2b ″ of the wiring board body 2 ″ may be polished by lap polishing or the like. . Also in this case, the main body 2 ″
Since there is no warp or the like, the polishing is extremely small and can be easily performed. After that, the front side pad and the back side pad may be formed in the same manner as in the second embodiment.

[Brief description of the drawings]

FIG. 1 is a perspective view of a wiring board according to a first embodiment;

FIG. 2 is a cross-sectional view of the wiring board according to the first embodiment.

FIG. 3 shows a method of manufacturing a wiring board according to the first embodiment;
FIG. 4 is an explanatory diagram illustrating up to lamination of green sheets.

FIG. 4 is a diagram illustrating a method for manufacturing a wiring board according to the first embodiment;
It is explanatory drawing explaining manufacture of a cut body.

FIG. 5 is a diagram illustrating a method for manufacturing a wiring board according to the first embodiment;
FIG. 4 is an explanatory diagram illustrating the steps up to the formation of an unfired pad.

FIG. 6 is a cross-sectional view showing a state in which the wiring board of the present invention is connected to an IC chip and another wiring board.

FIG. 7 is an explanatory diagram for explaining the method for manufacturing the wiring board according to the second embodiment;

FIG. 8 is an explanatory diagram for explaining the method of manufacturing the wiring board according to the third embodiment;

FIG. 9 is a cross-sectional view showing a state in which a conventional wiring board is connected to an IC chip and another wiring board.

[Explanation of symbols]

 1: Wiring board 2, 2 ′, 2 ″: Wiring board main body 2a: Front surface 2b: Back surface 3a, 3b, 3c, 3d: Band-shaped insulating member 5: Front surface side pad (first connection terminal) 6: Back surface side pad (first 2 connection terminals) 7: Internal wiring

Claims (6)

[Claims] An insulating member having a flat plate shape having a front surface and a back surface, a plurality of band-shaped insulating members being arranged in close contact with each other in a width direction thereof, and formed on a surface of the insulating member. A plurality of first connection terminals, a plurality of second connection terminals formed on the back surface of the insulating member and arranged in the same arrangement as the first connection terminals, and a plurality of second connection terminals formed between the band-shaped insulating members; A wiring board having an internal wiring that connects a first connection terminal and a corresponding second connection terminal in a straight line perpendicular to the front surface and the back surface, respectively. 2. The wiring board according to claim 1, wherein at least one of the front surface and the rear surface is a polished surface. 3. The wiring board according to claim 1, wherein at least one layer of the band-shaped insulating members has a color different from that of the other band-shaped insulating members. 4. A step of forming a plurality of linear conductor layers parallel to each other on at least one of the front surface and the back surface of the unsintered insulating layer, and laminating the plurality of unsintered insulating layers in a thickness direction. Forming a laminate by cutting the laminate to a predetermined thickness in a direction orthogonal to the linear conductor layer to form a green wiring board; and firing the green wiring board. A method for manufacturing a wiring board, comprising: 5. A step of forming a plurality of linear conductor layers parallel to each other on at least one of a front surface and a back surface of the unsintered insulating layer, and laminating the plurality of unsintered insulating layers in a thickness direction. Forming a fired body by firing the stacked body, and cutting the fired body to a predetermined thickness in a direction perpendicular to the conductor layer on a straight line. A method for manufacturing a wiring board, comprising: 6. The laminated green insulating layer, wherein at least one or more of the laminated green insulating layers is a non-colored green insulating layer having a different color development after firing from the others. The said different color unsintered insulating layer is laminated | stacked on a predetermined position, The Claim 4 or 5 characterized by the above-mentioned.
3. The method for manufacturing a wiring board according to claim 1.