JPH1197436A - 半導体集積回路のパッシベーション層形成方法 - Google Patents

半導体集積回路のパッシベーション層形成方法

Info

Publication number
JPH1197436A
JPH1197436A JP10130369A JP13036998A JPH1197436A JP H1197436 A JPH1197436 A JP H1197436A JP 10130369 A JP10130369 A JP 10130369A JP 13036998 A JP13036998 A JP 13036998A JP H1197436 A JPH1197436 A JP H1197436A
Authority
JP
Japan
Prior art keywords
passivation layer
film
forming
hsq
passivation film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP10130369A
Other languages
English (en)
Japanese (ja)
Inventor
Kousai Shin
▲こう▼ 縡 愼
Shigen Sai
志 鉉 崔
Heikin Ko
秉 槿 黄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JPH1197436A publication Critical patent/JPH1197436A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP10130369A 1997-09-12 1998-05-13 半導体集積回路のパッシベーション層形成方法 Withdrawn JPH1197436A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR97P47209 1997-09-12
KR1019970047209A KR19990025544A (ko) 1997-09-12 1997-09-12 반도체 집적 회로의 패시베이션층 형성방법

Publications (1)

Publication Number Publication Date
JPH1197436A true JPH1197436A (ja) 1999-04-09

Family

ID=19521265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10130369A Withdrawn JPH1197436A (ja) 1997-09-12 1998-05-13 半導体集積回路のパッシベーション層形成方法

Country Status (2)

Country Link
JP (1) JPH1197436A (ko)
KR (1) KR19990025544A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020002732A (ko) * 2000-06-30 2002-01-10 박종섭 반도체 소자의 절연막 형성 방법
JP4236805B2 (ja) * 2000-10-18 2009-03-11 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法および半導体装置

Also Published As

Publication number Publication date
KR19990025544A (ko) 1999-04-06

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Legal Events

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Effective date: 20041215

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Effective date: 20050111