JPH1192950A5 - - Google Patents

Info

Publication number
JPH1192950A5
JPH1192950A5 JP1997269340A JP26934097A JPH1192950A5 JP H1192950 A5 JPH1192950 A5 JP H1192950A5 JP 1997269340 A JP1997269340 A JP 1997269340A JP 26934097 A JP26934097 A JP 26934097A JP H1192950 A5 JPH1192950 A5 JP H1192950A5
Authority
JP
Japan
Prior art keywords
substrate
film
semiconductor wafer
elastic deformation
depositing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997269340A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1192950A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9269340A priority Critical patent/JPH1192950A/ja
Priority claimed from JP9269340A external-priority patent/JPH1192950A/ja
Publication of JPH1192950A publication Critical patent/JPH1192950A/ja
Publication of JPH1192950A5 publication Critical patent/JPH1192950A5/ja
Pending legal-status Critical Current

Links

JP9269340A 1997-09-16 1997-09-16 健全な膜の堆積方法及び装置 Pending JPH1192950A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9269340A JPH1192950A (ja) 1997-09-16 1997-09-16 健全な膜の堆積方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9269340A JPH1192950A (ja) 1997-09-16 1997-09-16 健全な膜の堆積方法及び装置

Publications (2)

Publication Number Publication Date
JPH1192950A JPH1192950A (ja) 1999-04-06
JPH1192950A5 true JPH1192950A5 (enExample) 2004-10-14

Family

ID=17471019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9269340A Pending JPH1192950A (ja) 1997-09-16 1997-09-16 健全な膜の堆積方法及び装置

Country Status (1)

Country Link
JP (1) JPH1192950A (enExample)

Similar Documents

Publication Publication Date Title
DE60202145T2 (de) Verfahren zur Bereitstellung einer hydrophoben Schicht und Konsatormikrophon mit einer solchen Schicht
CA2142683A1 (en) Process for catalyzation in electroless plating using chitosan or a chitosan derivative
KR0163369B1 (ko) 전자장치용 부품 제조 방법 및 전자장치
JP3356262B2 (ja) 接着剤塗布方法及び装置
JP2004513221A5 (enExample)
US5512161A (en) Process for galvanically forming structured plate-shaped bodies
KR101264673B1 (ko) 소프트 몰드를 이용한 미세 패턴 형성방법
US20030127002A1 (en) Multilayer architechture for microcontact printing stamps
GB2317270A (en) Forming a layer on a pre-stressed semiconductor wafer
RU2002111340A (ru) Безэлектрический способ нанесения покрытия
EP0775447A3 (de) Verfahren und Vorrichtung zur Formen von Schokoladeschalen
JP3826455B2 (ja) グラビア塗布装置及びその製造方法
WO2004056698A3 (fr) Procede de realisation d'une micro-structure suspendue plane, utilisant une couche sacrificielle en materiau polymere et composant obtenu
JPH04503892A (ja) 孔のめっき方法およびこれによる製品
KR19980702423A (ko) 기판 표면상의 결함 손질 및 수리 방법과 이를 실시하기 위한 마이크로 갈바닉 장치
DE10206140A1 (de) Verfahren zum Ausbilden einer Vertiefung in einem Halbleitersubstrat
JPH08281957A (ja) インクジェットプリンタヘッドの製造方法
JPS6270271A (ja) セラミツクスの接合方法
KR970052887A (ko) 홈 위에 다리를 갖는 반도체 장치의 제조방법
JPH02139060A (ja) 溶融体又は液体の塗布方法とその装置
JPS5936599B2 (ja) 凸状の金属光沢模様およびその金属光沢模様の現出方法
JP2920686B2 (ja) 塗装方法及びその装置
JPH06275758A (ja) 半導体装置の製造方法
JPH084132Y2 (ja) 塗料塗布装置
JPH04186719A (ja) ディスペンサー用ノズル