JPH1192950A - 健全な膜の堆積方法及び装置 - Google Patents

健全な膜の堆積方法及び装置

Info

Publication number
JPH1192950A
JPH1192950A JP9269340A JP26934097A JPH1192950A JP H1192950 A JPH1192950 A JP H1192950A JP 9269340 A JP9269340 A JP 9269340A JP 26934097 A JP26934097 A JP 26934097A JP H1192950 A JPH1192950 A JP H1192950A
Authority
JP
Japan
Prior art keywords
film
substrate
semiconductor wafer
plating
elastic deformation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9269340A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1192950A5 (enExample
Inventor
Naoaki Kogure
直明 小榑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP9269340A priority Critical patent/JPH1192950A/ja
Publication of JPH1192950A publication Critical patent/JPH1192950A/ja
Publication of JPH1192950A5 publication Critical patent/JPH1192950A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP9269340A 1997-09-16 1997-09-16 健全な膜の堆積方法及び装置 Pending JPH1192950A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9269340A JPH1192950A (ja) 1997-09-16 1997-09-16 健全な膜の堆積方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9269340A JPH1192950A (ja) 1997-09-16 1997-09-16 健全な膜の堆積方法及び装置

Publications (2)

Publication Number Publication Date
JPH1192950A true JPH1192950A (ja) 1999-04-06
JPH1192950A5 JPH1192950A5 (enExample) 2004-10-14

Family

ID=17471019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9269340A Pending JPH1192950A (ja) 1997-09-16 1997-09-16 健全な膜の堆積方法及び装置

Country Status (1)

Country Link
JP (1) JPH1192950A (enExample)

Similar Documents

Publication Publication Date Title
TW312080B (enExample)
EP3058587B1 (en) Carrier-bonding methods and articles for semiconductor and interposer processing
Sukumaran et al. Low-cost thin glass interposers as a superior alternative to silicon and organic interposers for packaging of 3-D ICs
JP5449300B2 (ja) 微小機械デバイス及びその製造方法
KR100293454B1 (ko) 압축성형방법
CN102471867A (zh) 在基体、涂层基体和包含涂层基体的半成品上产生结构化涂层的方法
WO2002058132A1 (en) A method of filling trenches
EP1221715A3 (en) High density metal capacitor using via etch stopping layer as field dielectric in dual-damascence interconnect process
US10932371B2 (en) Bottom-up electrolytic via plating method
Li et al. Systematic low temperature silicon bonding using pressure and temperature
JP2013524019A (ja) ミクロスケール構造中でのシード層堆積
TWI223333B (en) Method of barrier metal surface treatment prior to Cu deposition to improve adhesion and trench filling characteristics
KR950010854B1 (ko) 텅스텐 플러그 형성방법
EP0913497B1 (en) Method for plating a substrate
EP0719451B1 (en) Filling holes and the like in substrates
EP1328012A1 (fr) Procédé de fabrication d'un composant électronique incorporant un microcomposantinductif
JP2618093B2 (ja) 電子ボードの多層ネットワークの金属層を相互接続する方法
US5234539A (en) Mechanical lift-off process of a metal layer on a polymer
US10660202B1 (en) Carrier structure and manufacturing method thereof
WO1991008586A1 (en) Methods of plating into holes and products produced thereby
Drost et al. Studies of fine pitch patterning by reel-to-reel processes for flexible electronic systems
US20120012979A1 (en) Semiconductor capacitor
US20250174470A1 (en) Method for metallization through-glass vias and a glass article manufacutured thereof
KR100277858B1 (ko) 반도체소자의 갭필링(gap filling)방법
CN112584627B (zh) 一种用石墨烯对陶瓷表面粗化的方法及覆铜板的制作方法

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20040820

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20041019

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20050301