JPH1183933A - Inspection method for ic chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an inspection method in which an electrode is connected surely when an IC chip mounted on a circuit board by a resin, for connection, containing conductive particles is removed so as to be remounted on an evaluation board and in which the reliability of an inspection is enhanced by using the evaluation board whose electrode is formed to be protrusion-shaped. SOLUTION: An evaluation board 6a which is used for an IC chip inspection is constituted in such a way that, e.g. bump electrodes 3 are formed on a glass board 7 on which a conductor pattern 8 is formed. The electrodes 3 are installed in positions faced with bump electrodes 2 on an inspected IC chip, which is removed from a circuit board and to which a resin 4a for connection is stuck. Then, a resin 4b, for connection, which contains conductive particles 5b is arranged between the evaluation board 6a and the IC chip 1, it is heated and pressurized by using a heating and pressurization head or the like, and the IC chip 1 is connected to the evaluation board 6a. By this constitution, a pressure is applied so as to be concentrated between the electrodes 2 and the electrodes 3, a load is not applied to other places, a short circuit or the like can be suppressed, and a stable inspection can be executed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an I-shaped semiconductor device having a protruding electrode mounted on a circuit board using a connecting resin containing conductive particles.
The present invention relates to an IC chip inspection method for removing a C chip from a circuit board, re-mounting the C chip on an evaluation board, and inspecting the function of the IC chip.

[0002]

2. Description of the Related Art The technology of directly mounting an IC chip on a circuit board such as a printed circuit board or a glass substrate is used to reduce the size of equipment used, increase the driving frequency of the IC chip, and reduce the connection cost. Accordingly, it is used in various electronic devices.

In particular, in a liquid crystal display panel, a liquid crystal driving I
By directly mounting the C chip on a glass substrate, the compactness and the anti-vibration property are improved, so that the portability, which is a feature of the liquid crystal display device, is further increased, and this connection method is becoming mainstream. In this connection method, since an IC chip is directly mounted on a glass substrate, COG (Chip)
On Glass) method.

Several methods have been devised for directly mounting an IC chip on a circuit board, examples of which are described below. FIG. 3 shows a method of connecting an IC chip to a circuit board.

A protruding electrode 2 is formed on the IC chip 1, and the electrode 1 is formed on a circuit board 14 connecting the IC chip 1 at a position facing the protruding electrode 2. IC
A thermosetting resin 12a mainly composed of an epoxy resin containing conductive particles 5a is provided between the chip 1 and the circuit board 14.
Is formed in a sheet shape.

When connecting the IC chip 1 and the circuit board 14, after the projecting electrodes 2 and the electrodes 13 are aligned,
The IC chip 1 is heated and pressed by the heating and pressing head 11 to cure the connection resin 4a.

FIG. 4 shows a cross section of the connection portion after the connection resin 4a is cured. The thermosetting resin 12a containing the conductive particles 5a once lowers in viscosity by heating and is extruded by the pressure at the time of pressurization. It cures while forming a fillet-like shape.

[0008]

As described above, the IC chip 1 is mounted on the circuit board 14, but if any problem occurs in the IC chip 1 after the connection, the IC chip 1
It is necessary to remove the C chip 1 from the circuit board 14 and inspect its performance.

Conventionally, as a method for inspecting the function of the IC chip 1, a burn-in inspection method using wire bonding has been performed. However, this inspection method has a problem that it requires a large number of work steps and a high equipment cost. . Furthermore, since the reliability of the wire part is not sufficiently secured,
There is also a problem that the reliability of the IC chip 1 in high-temperature, high-humidity or low-temperature operation cannot be confirmed.

FIG. 5 shows a state where the IC chip 1 mounted on the circuit board 14 is removed from the circuit board 14. When removing the IC chip 1 from the circuit board 14, a method of heating the IC chip 1 to soften the connection resin is general.

The surface of the IC chip 1 has a convex shape due to the formation of the protruding electrodes 2, while the surface of the circuit board 14 has the electrodes 13 formed but is almost flat, so that the connection Most of the resin 4a adheres to the IC chip 1 and the IC chip 1 is removed.
The surface of the protruding electrode 2 formed on the chip 1 is covered with the connection resin 4a.

The I covered with the connecting resin 4a as described above
As a method of inspecting the performance of the C chip 1, there is a method of bringing the needle 16 into contact with the protruding electrode 2 of the IC chip 1, as shown in FIG.

That is, this is a method of inspecting the performance of an IC chip by inputting an electric signal 16a from an input-side protruding electrode 2a of the IC chip 1 and detecting an electric signal 16b from an output-side protruding electrode 2b of the IC chip 1.

However, according to this inspection method, when the pitch between the protruding electrodes 2 of the IC chip 1 is very narrow, I
Since it is difficult to apply the needles 15 to all the protruding electrodes 2 of the C chip 1, they are selectively applied. In addition, the needle 15 used for the inspection is very thin and requires careful handling, is easily worn, and is very expensive, so that it is difficult to easily perform the inspection in terms of cost.

In addition to the above-mentioned method, there is a method of mounting the IC chip 1 covered with the connection resin 4a again on an evaluation board 6b having a substantially flat surface as shown in FIG.

First, another connecting resin containing conductive particles 5b is provided between the IC chip 1 which is removed from the circuit board 14 and whose surface is covered with the connecting resin 4a, and the evaluation board 6b on which the electrodes 13 are formed. 4b is arranged. The protruding electrode 2 of the IC chip 1 and the electrode 17 of the evaluation substrate 6b are aligned, and heated and pressed by the heating and pressing head 11.

The function of the IC chip 1 mounted on the evaluation board 6b in this way is evaluated.
The connection resin 5a sticking to the C chip 1 hinders the conductive particles 5b of the connection resin 4b from contacting the protruding electrodes 2 of the IC chip 1 easily. There was a problem that it was not possible to contact with.

When the IC chip 1 is pressed by the heating / pressing head 11, pressure is applied to the conductive particles 5b between the protruding electrodes 2 of the IC chip 1 and the electrodes 17 of the evaluation substrate 6b.
The conductivity is exhibited when the conductive particles 5b are crushed. At this time, the conductive particles 5 are also provided between the IC chip 1 and the electrode 17 via the connection resin 4a attached around the bump electrode 2.
Since the pressure is easily applied to b, the conductive particles 5b are likely to be crushed, and there is also a problem that the adjacent electrodes are likely to be short-circuited between the protruding electrodes 2.

The present invention solves the above problems, stably and reliably connects the protruding electrodes of the IC chip to the electrodes of the evaluation board, increases the reliability of the performance evaluation of the IC chip, and can perform the IC chip inspection at low cost. The aim is to provide a method.

[0020]

An IC chip inspection method according to the present invention is characterized in that an evaluation board having a special shape is used.

According to the present invention, the connection between the protruding electrode of the IC chip and the electrode of the evaluation board is ensured, and a highly reliable performance test of the IC chip can be performed at low cost.

[0022]

According to a first aspect of the present invention, there is provided an IC chip inspection method, wherein an IC chip having a protruding electrode mounted on a circuit board using a connection resin containing conductive particles is removed from the circuit board and re-mounted on an evaluation board. When testing the function of the IC chip, the evaluation substrate is formed with a projection electrode having a shape facing the projection electrode formed on the IC chip. The method is characterized in that the function of the IC chip is inspected by connecting the protruding electrodes formed on the IC chip with a connection resin containing conductive particles.

According to this structure, the connection between the protruding electrode of the IC chip and the protruding electrode of the evaluation board is ensured.
Since a short circuit does not occur between the projecting electrodes of the C chip, a stable and highly reliable I
C chip inspection can be performed.

According to a second aspect of the present invention, there is provided an IC chip inspection method according to the first aspect, wherein the evaluation substrate is a glass substrate. According to this configuration, when the evaluation substrate is a glass substrate, the connection state between the IC chip and the evaluation substrate can be checked from the back side of the evaluation substrate, and the cost can be reduced.

An embodiment of the present invention will be described below with reference to FIGS. FIG. 3 shows the conventional example.
7 that are the same as those shown in FIG. (Embodiment) FIGS. 1 and 2 show (embodiment) of the present invention.

As shown in FIG. 1, a protruding electrode 3 is formed on a glass substrate 7 on which a conductor pattern 8 is formed to form an evaluation substrate 6a. The projecting electrode 3 is provided at a position facing the projecting electrode 2 formed on the IC chip 1.

The evaluation board 6a having the above-described structure and the I to which the connection resin 4a has been removed from the circuit board 14 are attached.
A sheet-shaped connection resin 4b containing conductive particles 5b is arranged between the C-chip 1 and heated and pressed by the heating and pressing head 11.

When the IC chip 1 is connected to the evaluation board 6a in such a configuration, as shown in FIG. 2, the pressure is concentrated between the protruding electrodes 2 and the protruding electrodes 3, and the pressure is applied to the outside. The portion is less likely to be loaded.

Therefore, between the protruding electrodes 2 and the protruding electrodes 3, the conductive particles 5b contained in the connection resin 4b are crushed, so that the protruding electrodes 2 and the protruding electrodes 3 can be connected to each other. One function can be tested. Also,
In other portions, the crushing of the conductive particles 5b and the adjacent short circuit between the adjacent protruding electrodes 2 of the IC chip 1 can be suppressed, and the contact can be stabilized and improved.

A specific example of the IC chip inspection method in the above (embodiment) will be described below. (Example 1) In the above (embodiment), the size of the IC chip 1 is 12 mm × 2.5 mm, and the connection surface side has a height of 15 μm and an area of 100 μm by electrolytic plating.
The projection electrode 3 having a size of × 50 μm was formed.

On the protruding electrodes 2 of the IC chip 1, the connection resin 4a which has been hardened once is
It was attached so as to cover the protruding electrode 2 with a thickness of about 18 μm. The evaluation substrate 6a has a warp of 0.05 mm / 470 m.
m, a glass substrate 7 having a non-alkali grade was used, and a conductor pattern 8 was formed by forming a film of aluminum (Al) having a low wiring resistance by sputtering on the glass substrate 7. Further, on the conductor pattern 8, gold (Au) was deposited by plating to a thickness of 10 μm on the barrier metal 9 made of a titanium layer so as to face the bump electrode 2 of the IC chip 1.

The size of the protruding electrode 3 is 110 μm × 60 μm.
m, and a margin was kept in consideration of positional deviation at the time of connection. Further, in order to protect the conductor pattern 8, a nitride film (SiNx) was formed on a portion other than the protruding electrode 3, and a protective film 10 for the conductor pattern 8 was provided.

The connection resin 4b for connecting the IC chip 1 and the evaluation board 6a is composed of 5000 ± 1500 conductive particles 5b having a diameter of 5 μm and a resin ball plated with gold and having a diameter of 5000 ± 1500 / mm ^2.
Epoxy thermosetting resin 12b dispersed in the range of
A sheet formed into a sheet having a thickness of 23 μm was used.

A sheet-like connecting resin 4b is arranged between the IC chip 1 configured as described above and the evaluation board 6a,
The projecting electrode 2 and the projecting electrode 3 were aligned with each other, and the IC chip 1 was heated and pressed by the heating / pressing head 11.

The obtained connection body between the IC chip 1 and the evaluation board 6a was provided with the protruding electrodes 3 on the evaluation board 6a. The pressure load was concentrated only between the protruding electrodes 3, and the load was hardly applied to other portions.

The effect is that the conductive particles 5b are crushed between the protruding electrodes 2 and 3, and the connection between the electrodes becomes possible.
In other portions, the collapse of the conductive particles 5b and the adjacent short circuit between the adjacent protruding electrodes 2 of the IC chip 1 are suppressed, and the contact can be stabilized and improved.
A reliable test could be performed.

[0037]

As described above, according to the IC chip inspection method of the present invention, the electrodes of the evaluation board are formed in the form of projections, so that the IC chip to which the connection resin once hardened and adhered is removed again. Even when connection is made to the evaluation substrate using a connection resin, the contact between the protruding electrode of the IC chip and the electrode of the evaluation substrate can be stably obtained, and a reliable inspection of the IC chip can be performed. Can also be kept lower than before.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a method for connecting an IC chip and an evaluation substrate in an embodiment.

FIG. 2 is a cross-sectional view of a connection portion between an IC chip and an evaluation board in the embodiment.

FIG. 3 is a sectional view showing a conventional method for connecting an IC chip to a circuit board.

FIG. 4 is a cross-sectional view of a state of a connection portion between a conventional IC chip and a circuit board.

FIG. 5 is a sectional view showing a conventional method for connecting an IC chip to an evaluation board.

FIG. 6 is a cross-sectional view of an IC chip detached from a conventional circuit board.

FIG. 7 is a sectional view of a connection portion between a conventional IC chip and an evaluation board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC chip 2 Projecting electrode 3 Projecting electrode 4a, 4b Connection resin 5a, 5b Conductive particle 6a, 6b Evaluation board

Claims (2)

[Claims] When the IC chip with a protruding electrode mounted on a circuit board using a connection resin containing conductive particles is removed from the circuit board and re-mounted on an evaluation board to test the function of the IC chip, As the evaluation substrate, a projection electrode having a shape facing the projection electrode formed on the IC chip is used. The projection electrode on the evaluation substrate and the projection electrode formed on the IC chip are electrically conductive particles. IC chip inspection method for inspecting the function of an IC chip by connecting using a connection resin containing the same. 2. The IC chip inspection method according to claim 1, wherein the evaluation substrate is a glass substrate.