JPH1177795A - Production of rubber sheet - Google Patents

Production of rubber sheet

Info

Publication number
JPH1177795A
JPH1177795A JP9248361A JP24836197A JPH1177795A JP H1177795 A JPH1177795 A JP H1177795A JP 9248361 A JP9248361 A JP 9248361A JP 24836197 A JP24836197 A JP 24836197A JP H1177795 A JPH1177795 A JP H1177795A
Authority
JP
Japan
Prior art keywords
sheet
rubber
rubber sheet
boron nitride
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9248361A
Other languages
Japanese (ja)
Other versions
JP3434678B2 (en
Inventor
Mikitoshi Sato
幹敏 佐藤
Hiroaki Sawa
博昭 澤
Kazuyoshi Ikeda
和義 池田
Masato Nishikawa
正人 西川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP24836197A priority Critical patent/JP3434678B2/en
Publication of JPH1177795A publication Critical patent/JPH1177795A/en
Application granted granted Critical
Publication of JP3434678B2 publication Critical patent/JP3434678B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To continuously and inexpensively produce a rubber sheet having extremely high-order heat conductivity and flexibility in a small filling amt. of a boron nitride powder and suitable as a raw material of a highly flexible spacer of high heat conductivity. SOLUTION: In a rubber sheet producing method, a rubber kneaded material is passed through a mold having a plurality of slits each having an opening part of which the ratio (h/w) of length (h) and width (w) is 2 or more to continuously extrude a plurality of strip-like sheets which are, in turn, converged and integrated to form a sheet and this sheet is vertically sliced in its thickness direction to be cured. Especially, a rubber kneaded material pref. contains addition reaction type liquid silicone and a boron nitride powder.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ゴムシートの製造
方法、詳しくは窒化ホウ素粉末のような鱗片状粒子をシ
ートの厚み方向に立たせた状態で充填させるのに好適な
ゴムシートの製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a rubber sheet, and more particularly, to a method for producing a rubber sheet suitable for filling flaky particles such as boron nitride powder in a state of standing in the thickness direction of the sheet. .

【0002】[0002]

【従来の技術】トランジスタ、サイリスタ等の発熱性電
子部品においては、使用時に発生する熱を如何に除去す
るが重要な問題となっている。従来、このような除熱方
法としては、発熱性電子部品を電気絶縁性の放熱シート
を介して放熱フィンや金属板に取り付け、熱を逃がすこ
とが一般的に行われており、その放熱シートとしてはシ
リコーンゴムに熱伝導性フィラーを分散させたものが使
用されている。
2. Description of the Related Art In heat-generating electronic components such as transistors and thyristors, it is important to remove heat generated during use. Conventionally, as such a heat removal method, a heat-generating electronic component has been generally attached to a heat-dissipating fin or a metal plate via an electrically insulating heat-dissipating sheet to dissipate heat. Is used in which a thermally conductive filler is dispersed in silicone rubber.

【0003】近年、電子部品内の回路の高集積化に伴い
その発熱量も大きくなっており、従来にも増して高い熱
伝導性を有する放熱シートが求められると同時に、電子
部品の損傷防止の観点から、強い装着負荷をかけること
が嫌われる場合も多く、このような場合には、熱抵抗が
極めて小さく、且つ高い柔軟性を有するシート状の放熱
部材が要求されている。
[0003] In recent years, the amount of heat generated by electronic circuits in electronic components has increased with the increase in the degree of integration, and a heat radiating sheet having higher thermal conductivity than ever has been required. From the viewpoint, it is often disliked to apply a strong mounting load. In such a case, a sheet-like heat radiating member having extremely low thermal resistance and high flexibility is required.

【0004】放熱シートを高熱伝導化するには、高熱伝
導性のフィラーを大量に充填する方法があるが、この場
合には放熱シートの柔軟性が著しく失われる欠点があ
る。そこで、窒化ホウ素粒子の熱伝導率の異方性、すな
わち窒化ホウ素の鱗片状粒子は、その長さ方向に極めて
高い熱伝導率を有する特異性を利用し、窒化ホウ素粒子
をシートの厚み方向に立たせた状態で充填させることの
提案がある(例えば、特開昭62-154410号公報、特開平3
-151658号公報、特開平8-244094号公報)。
In order to increase the thermal conductivity of the heat radiating sheet, there is a method of filling a large amount of a filler having high thermal conductivity, but in this case, there is a disadvantage that the flexibility of the heat radiating sheet is remarkably lost. Therefore, the anisotropy of the thermal conductivity of the boron nitride particles, that is, the scaly particles of boron nitride, utilizing the specificity of having a very high thermal conductivity in the length direction, the boron nitride particles in the thickness direction of the sheet There are proposals for filling in a standing state (for example, Japanese Patent Application Laid-Open No. 62-154410,
-151658, JP-A-8-244094).

【0005】しかしながら、特開昭62-154410号公報で
例示される製造方法では、超音波振盪機などの特殊設備
が必要であると共に、その処理工程も必要となり、更に
は厚シートへの適応が難しいなどの問題がある。また、
特開平3-151658号公報で例示されている製造方法では、
回分式工程とならざるを得ず、製造コスト等の問題があ
った。
However, the manufacturing method exemplified in Japanese Patent Application Laid-Open No. 62-154410 requires special equipment such as an ultrasonic shaker, requires a processing step, and further requires adaptation to a thick sheet. There are problems such as difficulty. Also,
In the manufacturing method exemplified in JP-A-3-151658,
There is no choice but to be a batch process, and there are problems such as manufacturing cost.

【0006】一方、特開平8-244094号公報で例示される
製造方法では、連続製造が可能であるも、連続製造され
るシートの厚みが金型出口の寸法に支配されるため各種
の厚さへの対応が容易ではなく、しかもこの方法によっ
て製造される連続シートではシート上下面付近の窒化ホ
ウ素の配向がシート面に沿って配向することを本発明者
らは確認しており、このような内部構造の乱れは熱伝導
性に悪影響を及ぼすことも確かめている。
On the other hand, in the manufacturing method exemplified in Japanese Patent Application Laid-Open No. H8-244094, continuous manufacturing is possible, but since the thickness of a continuously manufactured sheet is governed by the size of a mold outlet, various thicknesses are required. The present inventors have confirmed that the orientation of boron nitride near the upper and lower surfaces of the sheet in the continuous sheet produced by this method is not easy to cope with, and that the orientation of the boron nitride is oriented along the sheet surface. It has also been confirmed that disturbances in the internal structure have a negative effect on thermal conductivity.

【0007】更には、上記方法はいずれも比較的高コス
トである窒化ホウ素粉末を多量に充填するものであるの
で、コスト高となるばかりか、高熱伝導性ではあるがア
スカC硬度が60以上と柔軟性が十分でない。
[0007] Further, since the above-mentioned methods all involve filling a relatively large amount of boron nitride powder, which is relatively expensive, not only the cost is high, but also the high thermal conductivity but Asker C hardness of 60 or more. Insufficient flexibility.

【0008】[0008]

【発明が解決しようとする課題】本発明は上記に鑑みて
なされたものであり、少量の窒化ホウ素粉末の充填量で
極めて高度な熱伝導性と柔軟性を示し、高熱伝導性高柔
軟性スペーサーの原反として好適なゴムシートを、連続
的かつ安価に製造することを目的とするものである。
DISCLOSURE OF THE INVENTION The present invention has been made in view of the above, and has a very high thermal conductivity and a high flexibility when a small amount of boron nitride powder is used. It is intended to continuously and inexpensively produce a rubber sheet suitable as a raw material of the rubber sheet.

【0009】[0009]

【課題を解決するための手段】すなわち、本発明は、開
口部の縦(h)と横(w)の比(h/w)が2以上のス
リットをその横方向に複数個配列してなる金型内に、ゴ
ム混練物を通過させて複数の帯状シートを連続的に押し
出すと共に、それらを集束一体化し、その集束一体化物
をその厚み方向に対して垂直にスライスし、それを硬化
させることを特徴とするゴムシートの製造方法であり、
特にゴム混練物が、付加反応型液状シリコーンと窒化ホ
ウ素粉末を含むものであることを特徴とするゴムシート
の製造方法である。
That is, according to the present invention, a plurality of slits having an opening having a ratio (h / w) of 2 or more in length (h) and width (w) are arranged in the horizontal direction. Continuously extruding a plurality of band-shaped sheets by passing a rubber kneaded material into a mold, consolidating them, slicing the converged integrated product perpendicularly to its thickness direction, and curing it. A method for producing a rubber sheet,
In particular, the present invention provides a method for producing a rubber sheet, wherein the rubber kneaded material contains an addition reaction type liquid silicone and boron nitride powder.

【0010】[0010]

【発明の実施の形態】以下、更に詳しく本発明について
説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in more detail.

【0011】本発明で使用されるゴム混練物は、未硬化
ゴムと無機質充填材を含むものである。無機質充填材と
しては、マイカ、窒化ホウ素、板状水酸化アルミニウ
ム、テトラポット型酸化亜鉛などをあげることができる
が、高熱伝導性高柔軟性スペーサーを製造する場合に
は、窒化ホウ素粉末が好ましい。中でも、粉末X線解析
法による黒鉛指数(GI)が1.5以下である高結晶性
の窒化ホウ素粉末が特に好ましい。
The rubber kneaded product used in the present invention contains an uncured rubber and an inorganic filler. Examples of the inorganic filler include mica, boron nitride, plate-like aluminum hydroxide, tetrapot type zinc oxide, and the like. In the case of producing a highly thermally conductive and flexible spacer, boron nitride powder is preferable. Among them, a highly crystalline boron nitride powder having a graphite index (GI) of 1.5 or less by powder X-ray analysis is particularly preferable.

【0012】また、この場合において、熱抵抗を損なわ
せない範囲で窒化ホウ素以外の熱伝導性フィラーを併用
することができ、また絶縁性を損なわせない範囲でアル
ミニウム、銅、銀等の金属粉末と併用することもでき
る。
Further, in this case, a heat conductive filler other than boron nitride can be used together as long as the thermal resistance is not impaired, and a metal powder such as aluminum, copper, silver or the like can be used as long as the insulating property is not impaired. Can also be used in combination.

【0013】本発明のゴムシートに含まれる無機質充填
材の割合は任意であるが、ゴムシートが高熱伝導性高柔
軟性スペーサーである場合、窒化ホウ素粉末の含有率は
20〜60体積%、特に25〜45体積%であることが
望ましい。窒化ホウ素粉末の含有率が20体積%未満で
は熱抵抗が十分でなくなり、また60体積%を越える
と、柔軟性、機械的強度が極端に損なわれる。
Although the proportion of the inorganic filler contained in the rubber sheet of the present invention is arbitrary, when the rubber sheet is a highly heat-conductive and flexible spacer, the content of the boron nitride powder is 20 to 60% by volume, especially Desirably, it is 25 to 45% by volume. When the content of the boron nitride powder is less than 20% by volume, the thermal resistance becomes insufficient, and when it exceeds 60% by volume, flexibility and mechanical strength are extremely impaired.

【0014】一方、ゴムとしては、シリコーンゴム、ウ
レタンゴム、アクリルゴム、ブチルゴム、エチレンプロ
ピレン共重合体、エチレン酢酸ビニル共重合体などを使
用することができるが、高熱伝導性高柔軟性スペーサー
を製造する場合には、柔軟性、形状追随性、発熱面への
密着性、更には耐熱性の点から、シリコーンゴムが最適
である。
On the other hand, as the rubber, silicone rubber, urethane rubber, acrylic rubber, butyl rubber, ethylene propylene copolymer, ethylene vinyl acetate copolymer, etc. can be used. In this case, silicone rubber is most suitable from the viewpoints of flexibility, shape followability, adhesion to a heat generating surface, and heat resistance.

【0015】シリコーンゴムの種類としては、ミラブル
型シリコーンが代表的なものであるが、総じて所要の柔
軟性を発現させることが難しい場合が多いので、高い柔
軟性を発現させるためには付加反応型液状シリコーンが
最も好適である。付加反応型液状シリコーンの具体例と
しては、一分子中にビニル基とH−Si基の両方を有す
る一液反応型のオルガノポリシロキサン、又は末端ある
いは側鎖にビニル基を有するオルガノポリシロキサンと
末端あるいは側鎖に2個以上のH−Si基を有するオル
ガノポリシロキサンとの二液性のシリコーンなどをあげ
ることができる。このような付加反応型液状シリコーン
の市販品としては、例えば東レ・ダウコーニング・シリ
コーン社製、商品名「SE−1885A/B」がある。
As a type of silicone rubber, millable silicone is typical. However, it is often difficult to achieve the required flexibility as a whole. Liquid silicone is most preferred. Specific examples of the addition reaction type liquid silicone include a one-pack reaction type organopolysiloxane having both a vinyl group and an H-Si group in one molecule, or an organopolysiloxane having a vinyl group at a terminal or a side chain and a terminal. Alternatively, a two-part silicone with an organopolysiloxane having two or more H-Si groups in a side chain can be used. As a commercially available product of such an addition reaction type liquid silicone, there is, for example, a product name “SE-1885A / B” manufactured by Dow Corning Toray Silicone Co., Ltd.

【0016】付加反応型液状シリコーンは、アセチルア
ルコール類、マレイン酸エステル類などの反応遅延剤、
超微粉シリカ、十〜数百μmのシリコーンパウダーなど
の増粘剤、難燃剤、顔料などと併用することもできる。
[0016] The addition reaction type liquid silicone is a reaction retarder such as acetyl alcohols and maleic acid esters,
It can also be used in combination with a thickener such as ultrafine silica powder, silicone powder of tens to several hundreds μm, a flame retardant, a pigment and the like.

【0017】ゴムシートが高熱伝導性高柔軟性スペーサ
ーである場合、その柔軟性は付加反応型液状シリコーン
の架橋密度、窒化ホウ素粉末の充填量によって調整する
ことができる。柔軟性の尺度としては、荷重3kg/c
2をかけたときの圧縮変形率が30%以上であること
が望ましい。圧縮率が30%未満の場合には、電子部品
に実装着したときに装着負荷を緩和できず、電子部品を
破損させてしまう危険がある。
When the rubber sheet is a highly heat conductive and highly flexible spacer, its flexibility can be adjusted by the crosslinking density of the addition reaction type liquid silicone and the filling amount of boron nitride powder. As a measure of flexibility, a load of 3 kg / c
It is desirable that the compressive deformation rate when m 2 is applied is 30% or more. If the compression ratio is less than 30%, the mounting load cannot be reduced when the electronic component is mounted and mounted, and the electronic component may be damaged.

【0018】また、ゴムシートが高熱伝導性高柔軟性ス
ペーサーである場合、その熱抵抗は厚み1mmあたり
0.6℃/W以下、圧縮変形率は20%以上であること
が好ましい。
When the rubber sheet is a highly heat conductive and highly flexible spacer, its thermal resistance is preferably 0.6 ° C./W or less per 1 mm thickness, and its compressive deformation rate is preferably 20% or more.

【0019】熱抵抗は、TO−3型に裁断した試料(1
mm)をトランジスタが内蔵されたTO−3型銅製ヒー
ターケース(有効面積6.0cm2 )と銅板との間には
さみ、初期厚みの10%が圧縮されるように荷重をかけ
てセットした後、トランジスタに電力5Wをかけて4分
間保持し、ヒーターケースと放熱フィンとの温度差
(℃)を測定し、次の(1)式にて算出される。
The thermal resistance of the sample (1) cut into a TO-3 type was measured.
mm) between a TO-3 type copper heater case (effective area 6.0 cm 2 ) containing a transistor and a copper plate, and set by applying a load so that 10% of the initial thickness is compressed. The transistor is held at the power of 5 W for 4 minutes, the temperature difference (° C.) between the heater case and the radiation fin is measured, and calculated by the following equation (1).

【0020】 熱抵抗(℃/W)=温度差(℃)/電力(W) ・・・ (1)Thermal resistance (° C./W)=temperature difference (° C.) / Power (W) (1)

【0021】圧縮変形率は、10mm角(厚さ1mm)
の試料を圧縮時の変位と荷重の表示できる試験機(例え
ば島津製作所社製・商品名「オートグラフ」)にて、圧
縮速度(ヘッド移動速度)0.5cm/分で荷重3kg
/cm2 をかけたときの試料の変形量を測定し、その初
期厚みとの比より、 次の(2)式から算出される値であ
る。なお、試料厚がこれに満たないときは試料を単純積
層することにより1mmとし、面積がこれに満たないと
きには複数個の試料の面積総和が100mm2となるよ
うにして圧縮変形率を測定するものとする。
The compressive deformation rate is 10 mm square (thickness 1 mm)
Using a tester (for example, Shimadzu Corporation, product name "Autograph") that can display the displacement and load during compression of the sample, a load of 3 kg at a compression speed (head moving speed) of 0.5 cm / min.
/ Cm 2 is a value calculated from the following equation (2) by measuring the amount of deformation of the sample when multiplied by / cm 2 , and comparing it with the initial thickness. In addition, when the sample thickness is less than this, the sample is simply laminated to make 1 mm, and when the area is less than this, the compressive deformation rate is measured so that the total area of a plurality of samples becomes 100 mm 2. And

【0022】 圧縮変形率(%)=荷重3kg/cm2 をかけたときの変形量(mm)/試料 の初期厚み(mm)×100 ・・・ (2)Compressive deformation rate (%) = Amount of deformation (mm) when a load of 3 kg / cm 2 is applied / Initial thickness of sample (mm) × 100 (2)

【0023】本発明のゴムシートの製造方法について更
に説明すると、ゴム混練物は、開口部の縦(h)と横
(w)の比(h/w)が2以上のスリットをその横方向
に複数個配列してなる金型内を通過させて複数の帯状シ
ートを連続的に押し出し成形する。スリット開口部のh
/w比が2未満では、鱗片状粒子が立った状態で充填さ
れる割合が少なくなり、ゴムシートの熱伝導性が十分で
なくなる。好適なh/w比は5以上、特に10以上であ
る。開口部の寸法の一例を示せば、縦3mm、横0.2
5mm、h/w=12である。
The method for producing a rubber sheet according to the present invention will be further described. In the rubber kneaded material, a slit having a ratio (h / w) of length (h) to width (w) of the opening of 2 or more is formed in the lateral direction. A plurality of belt-shaped sheets are continuously extruded by passing through a plurality of arranged dies. H of slit opening
If the / w ratio is less than 2, the proportion of the flake-like particles filled in a standing state decreases, and the thermal conductivity of the rubber sheet becomes insufficient. Suitable h / w ratios are 5 or more, especially 10 or more. An example of the size of the opening is 3 mm long and 0.2 mm wide.
5 mm, h / w = 12.

【0024】本発明で使用される金型(1)は、上記開
口部を有するスリット(2)が横方向に複数個配列され
てなるものである(図1参照)。スリットの数として
は、30以上、望ましくは50以上、特に100個以上
であることが好ましい。
The mold (1) used in the present invention has a plurality of slits (2) having the above-mentioned openings arranged in the lateral direction (see FIG. 1). The number of slits is preferably 30 or more, more preferably 50 or more, and particularly preferably 100 or more.

【0025】スリットから押し出しされた複数の帯状シ
ートは、次いで、図2、図3に示されるように、集束金
型(3)に供給されて速やかに集束一体化された後、集
束金型の排出口の近傍に配置されたカッター刃(4)、
複数のピアノ線等のワイヤーなどによって、集束一体化
物の厚み方向に対して垂直(すなわち押し出し方向に対
して平行)にスライスされ、複数枚のシートに分割され
る。ゴムシートの厚みは、カッター刃やワイヤーの間隔
の調整によって自在に制御することができる。
The plurality of strip-shaped sheets extruded from the slits are then supplied to a converging mold (3), and are quickly converged and integrated as shown in FIGS. A cutter blade (4) arranged near the outlet,
With a plurality of wires such as a piano wire, the bundled product is sliced perpendicularly to the thickness direction (that is, parallel to the extrusion direction) and divided into a plurality of sheets. The thickness of the rubber sheet can be freely controlled by adjusting the interval between the cutter blade and the wire.

【0026】ゴムシートが高熱伝導性高柔軟性スペーサ
ーである場合、その厚みは0.2〜10mm、特に0.
5〜2mmが好ましい。スライスされたシートは、硬化
させた後、又は硬化させる前に、打ち抜き等によって所
望形状に加工される。この場合、スライスされた分割シ
ートのうち、集束金型の上面又は下面と接触していた部
分の分割シートは、それらと接触していない中間部分の
分割シートに比較して、立った状態の鱗片状粒子の割合
が少ないので、高熱伝導性高柔軟性スペーサーの原反と
しては望ましくはない。
When the rubber sheet is a highly heat conductive and highly flexible spacer, its thickness is 0.2 to 10 mm, especially 0.1 to 10 mm.
5 to 2 mm is preferred. After or before curing, the sliced sheet is processed into a desired shape by punching or the like. In this case, among the sliced divided sheets, the divided sheets of the portion that was in contact with the upper surface or the lower surface of the converging mold are compared with the divided sheets of the intermediate portion that are not in contact with them, and the scales in the standing state It is not desirable as a raw material of a highly thermally conductive and highly flexible spacer because the ratio of the particulate particles is small.

【0027】ゴムシートの硬化は、ギアオーブンなどの
加熱機で加熱することによって行うことができる。ま
た、集束金型部にリボンヒーター等を設置し、シートの
スライスと同時に行うこともできる。
The curing of the rubber sheet can be performed by heating with a heater such as a gear oven. Alternatively, a ribbon heater or the like may be provided in the converging mold to perform the slicing simultaneously with the sheet slicing.

【0028】本発明によって製造されたゴムシートは、
その表面の粘着性を制御するために必要に応じて表面処
理を施すことができる。具体的な表面処理方法として
は、(1)ボロンナイトライド粉末を打紛する、(2)
過酸化物架橋剤などを表面塗布し表面のみを硬化させ
る、(3)紫外線を照射するなどである。
The rubber sheet produced according to the present invention comprises:
A surface treatment can be applied as needed to control the tackiness of the surface. Specific surface treatment methods include (1) powdering boron nitride powder, (2)
For example, a peroxide cross-linking agent is applied to the surface to cure only the surface, or (3) ultraviolet irradiation.

【0029】ゴムシートが高熱伝導性高柔軟性スペーサ
ーである場合、わずかに粘着性を有しているため、輸送
時のハンドリング性を補助するとともに、輸送時、保存
時のゴミ付着を防止する観点より、包装材に配列して取
り扱うことが好ましい。包装材としては、例えばポリエ
チレンフィルム、ポリプロピレンフィルム、PETフィ
ルム、テフロンフィルム、ガラスクロス補強テフロンフ
ィルムなどを使用することができる。
When the rubber sheet is a highly heat-conductive and highly flexible spacer, it has a slight adhesiveness, so that it can be easily handled during transportation and can prevent dust from adhering during transportation and storage. More preferably, it is arranged in a packaging material and handled. As the packaging material, for example, a polyethylene film, a polypropylene film, a PET film, a Teflon film, a glass cloth reinforced Teflon film, or the like can be used.

【0030】高熱伝導性高柔軟性スペーサーは、発熱性
電子部品又は発熱性電子部品の搭載された回路基盤と冷
却装置との間に挟み込んで使用されるものであるが、冷
却装置にあらかじめ貼付け、一体化するなどして電子部
品用放熱部材として供給することも可能である。冷却装
置としては、例えばヒートシンク、放熱フィン、金属又
はセラミックスのケースなどがあげられる。そのセラミ
ックスの例としては、AlN、BN、SiC、Al2
3 などである。また、具体的にこれらの電子部品用放熱
部材が使用される電子機器としては、例えばコンピュー
ター、CD−ROMドライブ、DVDドライブ、CD−
Rドライブなどである。
The high thermal conductivity and high flexibility spacer is used by being sandwiched between a heat-generating electronic component or a circuit board on which the heat-generating electronic component is mounted and a cooling device. It is also possible to supply as a heat dissipating member for electronic components by integrating them. Examples of the cooling device include a heat sink, a radiation fin, and a metal or ceramic case. Examples of the ceramics include AlN, BN, SiC, Al 2 O
3 and so on. Further, specifically, as electronic devices in which these heat radiating members for electronic components are used, for example, computers, CD-ROM drives, DVD drives, CD-ROMs, etc.
R drive and the like.

【0031】[0031]

【実施例】以下、実施例、比較例をあげて更に具体的に
本発明を説明する。
The present invention will be described more specifically with reference to examples and comparative examples.

【0032】実施例1〜6 A液(ビニル基を有するオルガノポリシロキサン)とB
液(H−Si基を有するオルガノポリシロキサン)の二
液性の付加反応型シリコーン(東レダウコーニング社
製、商品名「SE−1885FR」)をA液対B液の混
合比を表1に示す配合(体積%)で混合し、これにマレ
イン酸ジメチルを主剤とした反応遅延剤と窒化ホウ素粉
末(電気化学工業社製、商品名「デンカボロンナイトラ
イドGP」平均粒径=7μm)を表1に示す割合(体積
%)で室温下にて混合してスラリーを調製した。
Examples 1 to 6 Liquid A (organopolysiloxane having a vinyl group) and B
Table 1 shows the mixing ratio of the liquid A to the liquid B of a two-part addition reaction type silicone (organic polysiloxane having an H-Si group) (trade name: SE-1885FR, manufactured by Dow Corning Toray Co., Ltd.). The mixture was mixed at a mixing ratio (% by volume), and a reaction retarder containing dimethyl maleate as a main component and boron nitride powder (trade name “Dencaboron nitride GP”, manufactured by Denki Kagaku Kogyo Co., Ltd., average particle size = 7 μm) were mixed in Table 1. The mixture was mixed at room temperature at the ratio (volume%) shown in Table 1 to prepare a slurry.

【0033】このスラリーを、図1に示される金型(ス
リット開口部の寸法は表1に記載)の取り付けられた押
し出し機により複数枚の帯状シートに押し出すと共に、
図2、図3に示される集束金型に供給して集束一体化
し、それを2枚の固定されたカッター刃の間を通過させ
て集束一体化物の厚み方向にスライスし、その中間部分
からなるグリーンシート(1mm厚)を製造した。
This slurry was extruded into a plurality of strip-shaped sheets by an extruder equipped with a mold (slit openings are described in Table 1) shown in FIG.
The bundle is supplied to the convergence mold shown in FIGS. 2 and 3 to perform convergence and integration, and then passes between two fixed cutter blades, slices in the thickness direction of the convergence integrated product, and includes an intermediate portion thereof. A green sheet (1 mm thick) was manufactured.

【0034】このグリーンシートを加熱機で150℃×
22時間加熱硬化させて本発明のゴムシートとし、高柔
軟性高熱伝導性スペーサーの原反(1mm厚)とした。
The green sheet was heated at 150 ° C. ×
The rubber sheet of the present invention was heated and cured for 22 hours to obtain a raw material (1 mm thick) of a highly flexible and thermally conductive spacer.

【0035】比較例1〜2 実施例1又は実施例4で用いた金型に変えて、長方形の
単数の開口部(高さ1mm、幅50mm)を持った通常
のシート押し出し金型を用い、1mm厚のグリーンシー
トを製造したこと以外は、実施例1又は実施例4と同様
にしてゴムシート(1mm厚)を製造した。
Comparative Examples 1 and 2 Instead of the mold used in Example 1 or Example 4, a normal sheet extrusion mold having a single rectangular opening (height: 1 mm, width: 50 mm) was used. A rubber sheet (1 mm thick) was manufactured in the same manner as in Example 1 or Example 4 except that a 1 mm thick green sheet was manufactured.

【0036】上記で得られたゴムシートについて、TO
−3型及び10mm角に裁断し、熱抵抗及び圧縮変形率
を上記に従い測定した。それらの結果を表1に示す。
With respect to the rubber sheet obtained above, TO
-3 type and 10 mm square were cut, and the thermal resistance and the compressive deformation were measured as described above. Table 1 shows the results.

【0037】[0037]

【表1】 [Table 1]

【0038】実施例1〜6で得られた原反を裁断して、
高柔軟性高熱伝導性スペーサー(50mm角×1mm)
とし、それをアルミニウム製の放熱フィンの平板面に積
層してヒートシンクを作製した。いずれの高柔軟性高熱
伝導性スペーサーも、アルミニウム板面に対して粘着を
有しており、容易にアルミニウム板に粘着した。得られ
たヒートシンクを発熱性電子部品に装着荷重3kg/c
2 として圧装したが、発熱性電子部品に損傷は見られ
ず、その動作時の放熱性も極めて良好であった。
By cutting the raw material obtained in Examples 1 to 6,
Highly flexible, high thermal conductive spacer (50 mm square x 1 mm)
Then, this was laminated on the flat surface of the aluminum radiation fin to produce a heat sink. Each of the high-flexibility and high-thermal-conductivity spacers had adhesion to the aluminum plate surface, and easily adhered to the aluminum plate. The resulting heat sink is mounted on the heat-generating electronic component with a load of 3 kg / c.
Pressing as m 2 showed no damage to the heat-generating electronic components and extremely good heat dissipation during operation.

【0039】[0039]

【発明の効果】本発明によれば、高柔軟性高熱伝導性ス
ペーサーの原反として好適なゴムシートを、連続的かつ
安価に製造することができる。
According to the present invention, it is possible to continuously and inexpensively produce a rubber sheet suitable as a raw material of a highly flexible and thermally conductive spacer.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明で使用される金型の一例を示す斜視図。FIG. 1 is a perspective view showing an example of a mold used in the present invention.

【図2】本発明で使用される集束金型の一例を示す斜視
図。
FIG. 2 is a perspective view showing an example of a focusing die used in the present invention.

【図3】図2の側面図。FIG. 3 is a side view of FIG. 2;

【符号の説明】[Explanation of symbols]

1 金型 2 スリット 3 集束金型 4 カッター刃 Reference Signs List 1 mold 2 slit 3 focusing mold 4 cutter blade

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI // C08J 5/18 CFH H01L 23/36 M B29K 83:00 105:16 B29L 7:00 (72)発明者 西川 正人 福岡県大牟田市新開町1 電気化学工業株 式会社大牟田工場内──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification symbol FI // C08J 5/18 CFH H01L 23/36 MB29K 83:00 105: 16 B29L 7:00 (72) Inventor Masato Nishikawa Fukuoka 1 Shinkaicho, Omuta City Inside the Omuta Plant of Denki Kagaku Kogyo Co., Ltd.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 開口部の縦(h)と横(w)の比(h/
w)が2以上のスリットをその横方向に複数個配列して
なる金型内に、ゴム混練物を通過させて複数の帯状シー
トを連続的に押し出すと共に、それらを集束一体化し、
その集束一体化物をその厚み方向に対して垂直にスライ
スし、それを硬化させることを特徴とするゴムシートの
製造方法。
1. A ratio (h / h) of a length (h) and a width (w) of an opening.
w) continuously extruding a plurality of belt-shaped sheets by passing the rubber kneaded material into a mold in which a plurality of slits each having two or more slits are arranged in the lateral direction, and consolidating and integrating them.
A method for producing a rubber sheet, comprising: slicing the bundle integrated product in a direction perpendicular to the thickness direction and curing the slice.
【請求項2】 ゴム混練物が、付加反応型液状シリコー
ンと窒化ホウ素粉末を含むものであることを特徴とする
請求項1記載のゴムシートの製造方法。
2. The method for producing a rubber sheet according to claim 1, wherein the rubber kneaded material contains an addition reaction type liquid silicone and boron nitride powder.
JP24836197A 1997-09-12 1997-09-12 Rubber sheet manufacturing method Expired - Fee Related JP3434678B2 (en)

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