JPH1167825A - Method and equipment for mounting semiconductor chip - Google Patents
Method and equipment for mounting semiconductor chipInfo
- Publication number
- JPH1167825A JPH1167825A JP9224061A JP22406197A JPH1167825A JP H1167825 A JPH1167825 A JP H1167825A JP 9224061 A JP9224061 A JP 9224061A JP 22406197 A JP22406197 A JP 22406197A JP H1167825 A JPH1167825 A JP H1167825A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- film
- substrate
- heating jig
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は半導体チップ実装方
法及び実装装置に関する。詳しくは、半導体チップ部品
を接着剤を挟んで基板に載置し加圧加熱治具により加圧
加熱して実装する場合、加圧加熱治具への接着剤の付着
を防止するためのテープを供給する時に生ずる不具合を
解決した半導体チップ実装方法及び実装装置に関する。The present invention relates to a semiconductor chip mounting method and a mounting apparatus. Specifically, when a semiconductor chip component is mounted on a substrate with an adhesive interposed therebetween and mounted by pressing and heating with a pressing and heating jig, a tape for preventing adhesion of the adhesive to the pressing and heating jig is used. The present invention relates to a semiconductor chip mounting method and a mounting device which solve the problem that occurs when supplying.
【０００２】[0002]
【従来の技術】半導体チップ部品（ベアチップ）を基板
上に直接実装するＣＯＢ（ＣＨＩＰＯＮ ＢＯＡＲＤ）
技術には目的や用途に応じて種々の方式が提案されてお
り、その一つの方式としてフリップチップ実装方式があ
る。この実装方法は、半導体チップ部品と基板との間を
ワイヤを使用することなく、半導体チップ部品を直接基
板に搭載するものであり、ワイヤレスボンディング実装
方式とも呼ばれている。2. Description of the Related Art COB (CHIPON BOARD) for mounting semiconductor chip parts (bare chips) directly on a substrate
Various methods have been proposed for the technology according to the purpose and application. One of the methods is a flip-chip mounting method. This mounting method directly mounts a semiconductor chip component on a substrate without using wires between the semiconductor chip component and the substrate, and is also called a wireless bonding mounting method.
【０００３】従来のフリップチップ実装方式の実装工程
を図４および図５を用いて説明すると、先ず、図４
（ａ）に示すように、ボンディングツールのキャピラリ
１の中を通した金線（金ワイヤ）２の先端と放電用電極
３との間に高電圧を印加して放電させ、その放電エネル
ギにより図４（ｂ）の如く金線２の先端を溶融させ、そ
の表面張力により金ボール４を形成する。[0003] The mounting process of the conventional flip-chip mounting method will be described with reference to FIGS. 4 and 5.
As shown in FIG. 1A, a high voltage is applied between a tip of a gold wire (gold wire) 2 passing through a capillary 1 of a bonding tool and a discharge electrode 3 to cause a discharge. 4 (b), the tip of the gold wire 2 is melted, and the gold ball 4 is formed by the surface tension.
【０００４】次に、図４（ｃ）に示すように、半導体チ
ップ部品５の表面に形成されている電極パッド６に前記
キャピラリ１により金ボール４を押圧し、同時に超音波
振動を与えて図４（ｄ）の如く金ボール４をパッド６に
圧着する。このとき、キャピラリ１の先端内面に形成さ
れた凹型により金ボール４を塑性変形させて図４（ｅ）
に示すような大径部と小径部よりなる２段形状のバンプ
７を形成する。Next, as shown in FIG. 4C, the gold ball 4 is pressed by the capillary 1 on the electrode pad 6 formed on the surface of the semiconductor chip component 5, and at the same time, ultrasonic vibration is applied. The gold ball 4 is pressed against the pad 6 as shown in FIG. At this time, the gold ball 4 is plastically deformed by a concave mold formed on the inner surface of the tip of the capillary 1 and FIG.
Then, a two-stage bump 7 composed of a large diameter portion and a small diameter portion as shown in FIG.
【０００５】次いで、図４（ｅ）の如く、金線２をクラ
ンパー８によりクランプして上方に引張りバンプ７の上
方で金線２を切断する。このようにして各パッド６にバ
ンプ７を形成したのち、各バンプ７の高さにバラツキが
あるため、図４（ｆ）に示すように、半導体チップ部品
５を裏返し、平面度の良いガラス板９に押圧して各バン
プ７の先端を塑性変形させて高さを揃える。Next, as shown in FIG. 4E, the gold wire 2 is clamped by a clamper 8 and pulled upward to cut the gold wire 2 above the bump 7. After the bumps 7 are formed on the pads 6 in this manner, since the heights of the bumps 7 vary, the semiconductor chip component 5 is turned over as shown in FIG. 9, the tip of each bump 7 is plastically deformed to make the height uniform.
【０００６】次いで、図５（ｇ）の如く、平板上に数ミ
クロンの厚さに塗布した導電性ペースト１０にバンプ７
を押し付けて図５（ｈ）の如く、導電性ペースト１０を
バンプ７に転写する。この導電性ペースト１０は基板上
に半導体チップ部品５を実装した時に、バンプ７と基板
のパッドとの電気的な導通をより確実に行うものであ
り、エポキシ樹脂中に銀のフィラーを多数分散したもの
が使用される。Next, as shown in FIG. 5 (g), bumps 7 are applied to conductive paste 10 applied on a flat plate to a thickness of several microns.
To transfer the conductive paste 10 to the bumps 7 as shown in FIG. The conductive paste 10 more reliably performs electrical conduction between the bumps 7 and the pads of the substrate when the semiconductor chip component 5 is mounted on the substrate, and a number of silver fillers are dispersed in the epoxy resin. Things are used.
【０００７】次いで、この導電性ペースト１０を後工程
（樹脂接着工程）で流れ出さないように半硬化させる。
次いで、図５（ｉ）の如く、半導体チップ部品５を搭載
する基板１１の所定位置に熱硬化性の樹脂接着剤１２を
盛り、基板１１の表面に形成されている配線パターンに
接続されたパッド１３に半導体チップ部品のバンプ７を
位置合わせして載置し、次いで、図５（ｊ）の如く、半
導体チップ部品５の上から加圧加熱治具１４により加圧
・加熱して樹脂接着剤１２を硬化させ完成する。Next, the conductive paste 10 is semi-cured so as not to flow out in a later step (resin bonding step).
Next, as shown in FIG. 5 (i), a thermosetting resin adhesive 12 is applied to a predetermined position of the substrate 11 on which the semiconductor chip component 5 is mounted, and the pads connected to the wiring pattern formed on the surface of the substrate 11 are formed. 13, the bumps 7 of the semiconductor chip component are aligned and placed, and then, as shown in FIG. 12 is cured and completed.
【０００８】この場合、樹脂接着剤１２が半導体チップ
部品５により押し広げられた際、バンプ７に塗布されて
いる導電性ペースト１０と基板１１のパッド１３との間
に入り込まないように、樹脂接着剤１２はバンブ７に塗
布されている導電性ペースト１０が基板１１のパッド１
３に接するまではバンプ７に到達せず、その到達後に半
導体チップ部品５の端部に到達して該半導体チップ部品
５を密封するようになっている。In this case, when the resin adhesive 12 is spread out by the semiconductor chip component 5, the resin adhesive 12 is prevented from entering between the conductive paste 10 applied to the bump 7 and the pad 13 of the substrate 11. The conductive paste 10 applied to the bump 7 is applied to the pad 1 of the substrate 11.
The bumps 7 do not reach the bumps 7 until they come into contact with the bumps 3, and then reach the ends of the semiconductor chip components 5 to seal the semiconductor chip components 5.
【０００９】[0009]
【発明が解決しようとする課題】上記従来のフリップチ
ップ実装方式においては、図５（ｊ）の如く、半導体チ
ップ部品５の上から加圧加熱治具１４により加圧・加熱
して樹脂接着剤１２を硬化させる時、樹脂接着材１２が
加圧加熱治具１４の方へ回り込み半導体チップ部品５に
加圧加熱治具１４が接着してしまうことがある。このた
め、図６に示すように半導体チップ部品５と加圧加熱治
具１４との間に接着剤貼り付き防止用のフィルム１５を
挟んで加圧加熱し接着を防止している。なお、接着剤貼
り付き防止用フィルム１５は供給リール１６から巻き取
りリール１７の間に設けた２個のローラ１８，１８′間
に張り渡されている。In the above-mentioned conventional flip chip mounting method, as shown in FIG. 5 (j), the resin adhesive is pressed and heated from above the semiconductor chip component 5 by a pressing and heating jig 14. When the resin 12 is cured, the resin adhesive 12 may move toward the pressing and heating jig 14 and adhere to the semiconductor chip component 5 in some cases. For this reason, as shown in FIG. 6, a film 15 for preventing adhesion of an adhesive is interposed between the semiconductor chip component 5 and the pressing and heating jig 14 to heat under pressure to prevent adhesion. The adhesive sticking prevention film 15 is stretched between two rollers 18 and 18 ′ provided between the supply reel 16 and the take-up reel 17.
【００１０】ところが、フィルム１５が２個のローラ１
８，１８′間に緊張して掛け渡されていると加圧加熱治
具１４の加圧にバラツキを生じ正確な加圧制御ができな
くなるという問題がある。このためフィルム１５をたる
ませると、フィルム１５が基板１１上に載置された半導
体チップ部品５に接触し、該半導体チップ部品５を移動
させ、所定の位置に実装できなくなるという問題が生ず
る。However, the film 15 has two rollers 1
If it is stretched between 8, 18 ', there is a problem in that the pressurization of the pressurizing and heating jig 14 varies, and accurate pressurization control cannot be performed. For this reason, when the film 15 is sagged, the film 15 comes into contact with the semiconductor chip component 5 placed on the substrate 11 and moves the semiconductor chip component 5 to cause a problem that the semiconductor chip component 5 cannot be mounted at a predetermined position.
【００１１】本発明は、上記従来の問題点に鑑み、半導
体チップ部品をフリップチップ実装方式で基板に実装す
る時、接着剤貼り付き防止用フィルムを用いても、加圧
加熱治具の加圧制御及び正確な位置決めに影響のない半
導体チップ実装方法及び実装装置を実現することを目的
とする。The present invention has been made in view of the above-mentioned conventional problems, and when a semiconductor chip component is mounted on a substrate by a flip-chip mounting method, even if a film for preventing sticking of an adhesive is used, the pressure of a pressing and heating jig is reduced. It is an object of the present invention to realize a semiconductor chip mounting method and a mounting device which do not affect control and accurate positioning.
【００１２】[0012]
【課題を解決するための手段】本発明の請求項１の発明
の半導体チップ実装方法は、パッド上にバンプが形成さ
れた半導体チップを、基板との間に充填された樹脂接着
剤を介して、加圧加熱治具にて加圧・加熱して基板に搭
載する半導体チップ実装方法において、前記加圧加熱治
具と半導体チップとの間に接着剤貼りつき防止用のフィ
ルムを供給する場合、バックアッププレート上にテンシ
ョンを弛めたフィルムを受け、そのフィルムを加圧加熱
治具で吸着保持し、この吸着保持されたフィルムを介し
て半導体チップを基板にボンデイングすることを特徴と
する。この構成を採ることにより、接着剤貼りつき防止
用のフィルムを弛めたため加圧加熱治具の加圧力に影響
を与えず、また弛めたフィルムはバックアッププレート
で受けるため半導体チップ部品には接触せず、その位置
を乱すことはない。According to a first aspect of the present invention, there is provided a method of mounting a semiconductor chip, comprising: bonding a semiconductor chip having bumps formed on pads to a substrate via a resin adhesive filled between the semiconductor chip and a substrate. In a semiconductor chip mounting method of mounting on a substrate by pressing and heating with a pressing and heating jig, when supplying a film for preventing adhesive sticking between the pressing and heating jig and the semiconductor chip, The method is characterized in that a film whose tension is loosened is received on a backup plate, the film is sucked and held by a pressure and heating jig, and the semiconductor chip is bonded to a substrate via the sucked and held film. By adopting this configuration, the film for preventing the adhesive from sticking was loosened, so it did not affect the pressing force of the pressurizing and heating jig. Without disturbing its position.
【００１３】本発明の請求項２の発明の半導体チップ実
装装置は、パッド上にバンプが形成された半導体チップ
を、基板との間に充填された樹脂接着剤を介して、加圧
加熱治具にて加圧・加熱するフリップチップ方式にて基
板に搭載する場合に加圧加熱治具と半導体チップとの間
に接着剤貼りつき防止用のフィルムを挟む半導体チップ
実装装置であって、加圧加熱治具に真空吸着手段を設け
ると共に、該加圧加熱治具の下方に接着剤貼りつき防止
用のフィルムを支持する手段と、該フィルムの張力を緩
める手段と、該フィルムを下方より支持および退避可能
なバックアッププレートとを設けてなることを特徴とす
る。この構成をとることにより、請求項１と同様な効果
を得ることができる。According to a second aspect of the present invention, there is provided a semiconductor chip mounting apparatus comprising: a semiconductor chip having a bump formed on a pad; A semiconductor chip mounting device that sandwiches a film for preventing adhesive from sticking between a pressing and heating jig and a semiconductor chip when mounted on a substrate by a flip chip method in which pressure is applied and heated. The heating jig is provided with vacuum suction means, means for supporting a film for preventing adhesive sticking below the pressurizing and heating jig, means for loosening the tension of the film, and supporting and supporting the film from below. A retractable backup plate is provided. With this configuration, the same effect as the first aspect can be obtained.
【００１４】[0014]
【発明の実施の形態】図１は本発明の半導体チップ実装
装置の実施の形態を半導体チップ部品および該半導体チ
ップ部品を実装する基板と共に示す図である。同図にお
いて、２０は半導体チップ部品、２１は該半導体チップ
部品を搭載する基板、２２は該基板を載置するステージ
である。FIG. 1 is a view showing an embodiment of a semiconductor chip mounting apparatus according to the present invention, together with a semiconductor chip component and a substrate on which the semiconductor chip component is mounted. In the figure, 20 is a semiconductor chip component, 21 is a substrate on which the semiconductor chip component is mounted, and 22 is a stage on which the substrate is mounted.
【００１５】また、２３は半導体チップ部品を加圧・加
熱する加圧加熱治具であり、真空吸着用の孔２３ａが設
けられ、該孔２３ａはパイプ２４および電磁切り換え弁
２５を介して真空ポンプ２６に接続されている。また２
７は接着剤貼りつき防止用のフィルムであり、２個のロ
ーラ２８，２８′により加圧加熱治具２３の下方に張り
渡されたている。２９はそのフィルム供給リール、３０
は巻取リール、３１は巻取リール駆動モータである。Reference numeral 23 denotes a pressurizing and heating jig for pressurizing and heating the semiconductor chip component, which is provided with a hole 23a for vacuum suction, and the hole 23a is connected to a vacuum pump via a pipe 24 and an electromagnetic switching valve 25. 26. Also 2
Reference numeral 7 denotes a film for preventing the adhesive from sticking, and is stretched below the pressing and heating jig 23 by two rollers 28, 28 '. 29 is the film supply reel, 30
Denotes a take-up reel, and 31 denotes a take-up reel drive motor.
【００１６】また、３２はバックアッププレートであ
り、エアシリンダ又は油圧シリンダ等の移動手段（図は
エアシリンダ３３）に支持され、該エアシリンダ３３の
エア供給パイプ３３ａ，３３ｂは電磁切り換え弁３４を
通り圧縮空気ポンプ３５に接続されている。また、前記
電磁切り換え弁２５，３４および巻取リール駆動モータ
３１は制御装置３６に電気的に接続されている。Reference numeral 32 denotes a backup plate, which is supported by moving means (an air cylinder 33 in the figure) such as an air cylinder or a hydraulic cylinder. The air supply pipes 33a and 33b of the air cylinder 33 pass through an electromagnetic switching valve 34. It is connected to a compressed air pump 35. The electromagnetic switching valves 25 and 34 and the take-up reel drive motor 31 are electrically connected to a control device 36.
【００１７】このように構成された半導体チップ実装装
置を用いた本発明の半導体チップ実装方法を図２および
図３を用いて説明する。先ず、図２（ａ）はステージ２
２の上に基板２１が載置され、その上にに樹脂接着剤を
介して所定の位置に半導体チップ部品２０が載置された
初期の状態である。この状態から図２（ｂ）の如く、制
御装置３６はエアシリンダ３３を作動させてバックアッ
ププレート３２を半導体チップ部品２０の上方に移動さ
せる。A method of mounting a semiconductor chip according to the present invention using the semiconductor chip mounting apparatus thus configured will be described with reference to FIGS. First, FIG.
2 is an initial state in which the substrate 21 is mounted on the substrate 2 and the semiconductor chip component 20 is mounted on the substrate 21 at a predetermined position via a resin adhesive. From this state, as shown in FIG. 2B, the control device 36 operates the air cylinder 33 to move the backup plate 32 above the semiconductor chip component 20.
【００１８】次いで、図２（ｃ）の如く、巻取リール駆
動モータ３１を逆転（巻き取りと反対方向）させ、接着
剤貼りつき防止用のフィルム２７を弛ませる。この弛ま
せられたフィルム２７は同図の如く、バックアッププレ
ート３２に受け止められ半導体チップ部品２０には接触
しない。従って、半導体チップ部品２０はフィルム２７
により移動させられることはない。Next, as shown in FIG. 2C, the take-up reel drive motor 31 is rotated in the reverse direction (in the direction opposite to the take-up) to loosen the film 27 for preventing the adhesive from sticking. The loosened film 27 is received by the backup plate 32 and does not contact the semiconductor chip component 20, as shown in FIG. Accordingly, the semiconductor chip component 20 is
Will not be moved.
【００１９】次いで、図３（ｄ）の如く、加圧加熱治具
２３をバックアッププレート３２まで降下させ、同時に
電磁切り換え弁２５を切り換えてフィルム２７を吸着す
る。次いで、図３（ｅ）の如く、エアシリンダ３３を作
動させてバックアッププレート３２を退避させる。次い
で、図３（ｆ）の如く、加圧加熱治具２３を半導体チッ
プ部品２０に接触するまで降下させ、フィルム２７を介
して半導体チップ部品２０を加圧・加熱する。加圧加熱
治具２３による加圧・加熱が終了すれば、加圧加熱治具
２３を上昇させ、同時に巻取リール駆動モータ３１を正
転させフィルム２７を巻き取る。これにより図２（ａ）
の状態に復帰する。Next, as shown in FIG. 3D, the pressing and heating jig 23 is lowered to the backup plate 32, and at the same time, the electromagnetic switching valve 25 is switched to attract the film 27. Next, as shown in FIG. 3E, the air cylinder 33 is operated to retract the backup plate 32. Next, as shown in FIG. 3 (f), the pressing / heating jig 23 is lowered until it comes into contact with the semiconductor chip component 20, and the semiconductor chip component 20 is pressed / heated via the film 27. When the pressing and heating by the pressing and heating jig 23 is completed, the pressing and heating jig 23 is raised, and at the same time, the take-up reel drive motor 31 is rotated forward to wind up the film 27. As a result, FIG.
It returns to the state of.
【００２０】このように作用する本実施の形態の半導体
チップ実装方法及び装置は、接着剤貼りつき防止用のフ
ィルム２７により半導体チップ部品２０と加圧加熱治具
２３との接着剤による接着を防止し、且つ接着剤貼りつ
き防止用のフィルム２７の張力を弛めることにより加圧
加熱治具２３の加圧力のバラツキを防止でき、さらにフ
ィルム２７の弛みをバックアッププレート３２で受ける
ため、該フィルムの接触による半導体チップ部品２０の
移動を防止することができる。In the semiconductor chip mounting method and apparatus according to the present embodiment, the film 27 for preventing the adhesive from sticking prevents the semiconductor chip component 20 and the pressing / heating jig 23 from being bonded by the adhesive. In addition, since the tension of the film 27 for preventing the adhesive from sticking is loosened, the variation in the pressing force of the pressurizing and heating jig 23 can be prevented. And the movement of the semiconductor chip component 20 can be prevented.
【００２１】[0021]
【発明の効果】本発明の半導体チップ実装方法及び実装
装置に依れば、半導体チップ部品をフリップチップ実装
方式で、且つ接着剤貼り付き防止用フィルムを用いて基
板に実装する時、接着剤貼り付き防止用フィルムの張力
を弛めることにより、加圧加熱治具２３の加圧力のバラ
ツキを防止可能とし、且つ弛めたフィルムをバックアッ
ププレートで受けることにより、該フィルムの接触によ
る半導体チップ部品２０の移動を防止し正確な位置に実
装でき、実装品質の向上に寄与することができる。According to the semiconductor chip mounting method and the mounting apparatus of the present invention, when the semiconductor chip component is mounted on the substrate by the flip-chip mounting method and using the film for preventing the adhesion of the adhesive, the adhesive is applied. By relaxing the tension of the film for preventing sticking, it is possible to prevent variation in the pressing force of the pressurizing and heating jig 23, and by receiving the loosened film by the backup plate, the semiconductor chip component 20 is brought into contact with the film. Movement can be prevented and mounting can be performed at an accurate position, which can contribute to improvement in mounting quality.
【図１】本発明の半導体チップ実装装置の実施の形態を
半導体チップ部品および該半導体チップ部品を実装する
基板と共に示す図である。FIG. 1 is a view showing an embodiment of a semiconductor chip mounting apparatus of the present invention together with a semiconductor chip component and a substrate on which the semiconductor chip component is mounted.
【図２】本発明の半導体チップ実装装置の実施の形態を
用いた本発明の半導体チップ実装方法を説明するための
図である。FIG. 2 is a diagram for explaining a semiconductor chip mounting method of the present invention using the embodiment of the semiconductor chip mounting apparatus of the present invention.
【図３】本発明の半導体チップ実装装置の実施の形態を
用いた本発明の半導体チップ実装方法を説明するための
図である。FIG. 3 is a view for explaining a semiconductor chip mounting method of the present invention using the embodiment of the semiconductor chip mounting apparatus of the present invention;
【図４】従来のフリップチップ実装方式の実装工程を説
明するための図である。FIG. 4 is a diagram for explaining a mounting process of a conventional flip-chip mounting method.
【図５】従来のフリップチップ実装方式の実装工程を説
明するための図である。FIG. 5 is a diagram for explaining a mounting step of a conventional flip-chip mounting method.
【図６】発明が解決しようとする課題を説明するための
図である。FIG. 6 is a diagram for explaining a problem to be solved by the invention.
２０…半導体チップ部品 ２１…基板 ２２…ステージ ２３…加圧加熱治具 ２４…パイプ ２５，３４…電磁切り換え弁 ２６…真空ポンプ ２７…フィルム ２８，２８′…ローラ ２９…フィルム供給リール ３０…フィルム巻取リール ３１…巻取リール駆動モータ ３２…バックアッププレート ３３…エアシリンダ ３５…圧縮空気ポンプ ３６…制御装置 DESCRIPTION OF SYMBOLS 20 ... Semiconductor chip component 21 ... Substrate 22 ... Stage 23 ... Pressure heating jig 24 ... Pipe 25, 34 ... Electromagnetic switching valve 26 ... Vacuum pump 27 ... Film 28, 28 '... Roller 29 ... Film supply reel 30 ... Film winding Take-up reel 31 ... Take-up reel drive motor 32 ... Backup plate 33 ... Air cylinder 35 ... Compressed air pump 36 ... Control device
フロントページの続き (72)発明者 小八重 健二 神奈川県川崎市中原区上小田中４丁目１番 １号 富士通株式会社内 (72)発明者 石川 直樹 神奈川県川崎市中原区上小田中４丁目１番 １号 富士通株式会社内 (72)発明者 江本 哲 神奈川県川崎市中原区上小田中４丁目１番 １号 富士通株式会社内Continuing from the front page (72) Inventor Kenji Koyae 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Naoki Ishikawa 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Tetsu Emoto 4-1-1 Kamikadanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited
Claims (2)
ップを、基板との間に充填された樹脂接着剤を介して、
加圧加熱治具にて加圧・加熱して基板に搭載する半導体
チップ実装方法において、 前記加圧加熱治具と半導体チップとの間に接着剤貼りつ
き防止用のフィルムを供給する場合、バックアッププレ
ート上にテンションを弛めたフィルムを受け、そのフィ
ルムを加圧加熱治具で吸着保持し、この吸着保持された
フィルムを介して半導体チップを基板にボンデイングす
ることを特徴とする半導体チップ実装方法。A semiconductor chip having bumps formed on pads is bonded to a substrate via a resin adhesive filled between the semiconductor chip and the substrate.
In a semiconductor chip mounting method of mounting on a substrate by pressing and heating with a pressing and heating jig, when a film for preventing adhesive sticking is supplied between the pressing and heating jig and the semiconductor chip, a backup is provided. A method of mounting a semiconductor chip, comprising: receiving a film on which tension has been loosened on a plate, holding the film by suction using a pressure and heating jig, and bonding a semiconductor chip to a substrate via the suction-held film. .
ップを、基板との間に充填された樹脂接着剤を介して、
加圧加熱治具にて加圧・加熱するフリップチップ方式に
て基板に搭載する場合に加圧加熱治具と半導体チップと
の間に接着剤貼りつき防止用のフィルムを挟む半導体チ
ップ実装装置であって、 加圧加熱治具に真空吸着手段を設けると共に、該加圧加
熱治具の下方に接着剤貼りつき防止用のフィルムを支持
する手段と、該フィルムの張力を緩める手段と、該フィ
ルムを下方より支持および退避可能なバックアッププレ
ートとを設けてなることを特徴とする半導体チップ実装
装置。2. A semiconductor chip having a bump formed on a pad is bonded to a substrate via a resin adhesive filled between the semiconductor chip and the substrate.
When mounting on a substrate by the flip chip method of pressing and heating with a pressure heating jig, a semiconductor chip mounting device that sandwiches a film for preventing adhesive sticking between the pressure heating jig and the semiconductor chip Means for providing a vacuum suction means to the pressing and heating jig, means for supporting a film for preventing the adhesive from sticking below the pressing and heating jig, means for relaxing the tension of the film, And a backup plate capable of supporting and retracting from below.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22406197A JP3369082B2 (en) | 1997-08-20 | 1997-08-20 | Semiconductor chip mounting method and mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22406197A JP3369082B2 (en) | 1997-08-20 | 1997-08-20 | Semiconductor chip mounting method and mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1167825A true JPH1167825A (en) | 1999-03-09 |
| JP3369082B2 JP3369082B2 (en) | 2003-01-20 |
Family
ID=16807967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22406197A Expired - Fee Related JP3369082B2 (en) | 1997-08-20 | 1997-08-20 | Semiconductor chip mounting method and mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3369082B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002184807A (en) * | 2000-12-11 | 2002-06-28 | Mitsubishi Electric Corp | Semiconductor device and its manufacturing method and device |
| JP2006210464A (en) * | 2005-01-26 | 2006-08-10 | Fuji Mach Mfg Co Ltd | Apparatus for supplying shock absorbing material tape and device for crimping electronic part using this |
| KR100707096B1 (en) * | 2001-03-19 | 2007-04-13 | 앰코 테크놀로지 코리아 주식회사 | Manufacturing method of adhesive means for manufacturing semiconductor package |
| KR20180032043A (en) * | 2016-09-21 | 2018-03-29 | 주식회사 엘지화학 | Deep Drawing Apparatus for Laminated Sheet Capable of Adjusting Tension and Method for Deep Drawing Using the Same |
-
1997
- 1997-08-20 JP JP22406197A patent/JP3369082B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002184807A (en) * | 2000-12-11 | 2002-06-28 | Mitsubishi Electric Corp | Semiconductor device and its manufacturing method and device |
| KR100707096B1 (en) * | 2001-03-19 | 2007-04-13 | 앰코 테크놀로지 코리아 주식회사 | Manufacturing method of adhesive means for manufacturing semiconductor package |
| JP2006210464A (en) * | 2005-01-26 | 2006-08-10 | Fuji Mach Mfg Co Ltd | Apparatus for supplying shock absorbing material tape and device for crimping electronic part using this |
| JP4503448B2 (en) * | 2005-01-26 | 2010-07-14 | 富士機械製造株式会社 | Buffer material tape supply device and electronic component crimping device used for electronic component crimping device |
| KR20180032043A (en) * | 2016-09-21 | 2018-03-29 | 주식회사 엘지화학 | Deep Drawing Apparatus for Laminated Sheet Capable of Adjusting Tension and Method for Deep Drawing Using the Same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3369082B2 (en) | 2003-01-20 |
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