JP2002134438A - Method and apparatus for sticking die bond tape to semiconductor wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the bump damage of a semiconductor wafer or the partial elongation of a die bond tape, make the adhesion thickness of the die bond tape constant, avoid re-adhering of the tape after tape cutting and prevent the wafer from being broken in an extra tape peeling step. SOLUTION: A die bond tape 3 is positioned directly above a heated semiconductor wafer 1 supported with a wafer mounting table 21, the pressing force exerted on the wafer 1 with a sticking roll 26 is adjustable and changed at some regions to make uniform the line pressure of the roll 26 for pressure bonding, thereby sticking the tape 3 with a fused adhesive, and an extra portion of the tape 3 is cut through by a cutter 34 and peeled off from the table 21.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for attaching a die bond tape to a semiconductor wafer in a semiconductor product manufacturing process.

[0002]

2. Description of the Related Art Generally, in the process of manufacturing a semiconductor product, a semiconductor wafer having a large number of circuit patterns (functional elements) formed on its surface is subjected to a back-grinding step (back grinding) if necessary. Each functional element is cut (dicing process) into individual semiconductor chips (also referred to as dies). Thereafter, the semiconductor chips are mounted and fixed on die pads such as lead frames (die bonding process), and then wire bonding is performed. Furthermore, by performing sealing with a mold resin, the product of IC or LSI is completed.

In order to mount and fix a semiconductor chip on a lead frame or the like, a silver paste or the like is previously applied to a die pad portion of the lead frame by a dispenser, and the semiconductor chip is mounted thereon, and then the silver paste is applied. The semiconductor chip is fixed on the die pad by heat curing.

[0004] However, such a method of applying a paste using a dispenser has a problem in the amount of paste applied and the stability of the applied shape. That is, if the amount of the paste applied is too large, the paste protrudes from the semiconductor chip and contaminates the semiconductor chip. As a result, a characteristic defect occurs in the semiconductor chip, which causes a reduction in yield and reliability. On the other hand, if the amount of application is insufficient, the fixing strength is reduced, which causes a problem that the semiconductor chip is separated from the die pad of the lead frame in the next wire bonding step.

[0005] Under such circumstances, in recent years, a die bond tape (or film or sheet material) having a function as a die bonding material has been proposed and put to practical use.

This die-bonding tape uses, for example, a polymer alloy adhesive containing thermoplastic resin (polyimide resin, acrylic resin, etc.) and thermosetting resin (epoxy resin, phenolic resin, etc.) as components. Tape, which is usually non-tacky and heated (eg, 100
C. to 160.degree. C.) so as to exhibit tackiness.

[0007] In order to mount and fix a semiconductor chip on a die pad of a lead frame using such a die bond tape, a conventional and generally performed method is a dicing step in which a backside polishing step is completed first. Prepare the previous semiconductor wafer, then paste the above-mentioned die bond tape on the entire back surface of this prepared semiconductor wafer, then cut the semiconductor wafer and die bond tape together in the dicing process, and attach the die bond tape on the back surface A semiconductor chip is formed and mounted and fixed on a die pad of a lead frame.

In order to attach a die bond tape to the back surface of a semiconductor wafer, a die bond tape having a width larger than the outer diameter of the semiconductor wafer is used. Then, the die bond tape is cut along the outer peripheral edge of the semiconductor wafer so as to penetrate the die bond tape, so that the die bond tape is bonded to the semiconductor wafer.

FIGS. 13 and 14 show an example of a conventional apparatus for attaching a die-bonding tape to the back surface of a semiconductor wafer. The apparatus shown in FIG. 3
A peeling roll 7 is arranged so that a part of the way from the supply part 4 to the take-up part 5 passes just above the wafer mounting table 2, and a part of the die bonding tape 3 during which the protective sheet 6 is peeled off from the die bonding tape 3. And a winding roll 8 that reciprocates between the winding section 8 of the protection sheet 6 and the entrance and exit sides of the die bonding tape 3 with respect to the wafer mounting table 2 and presses the die bonding tape 3 onto the semiconductor wafer 1. 9, a die-bonding tape peeling roll 10 that moves forward together with the attaching roll 9 and retreats after the attaching roll 9 retreats, reciprocates in the same manner as the roll 10, and holds the die-bonding tape 3 during forward movement. , A dancer roll 12 that moves up and down according to the amount of the die bond tape 3 pulled out, The sensor 13 for stopping the winding unit 5 detects, place the sensor 14 to drive the winding unit 5 detects the descending position of the dancer roller 12, further,
Immediately above the wafer mounting table 2, there is provided a cutter unit 16 having a cutter 15 which can freely move up and down and rotate and which rotates when descending.

The above-mentioned wafer mounting table 2 is made of a material having air permeability, suction-supports the semiconductor wafer 1 mounted on the upper surface by suction by suction means, and heats the semiconductor wafer 1 at 100 ° C. to 160 ° C. by heating means. C. and a concave groove 17 having a diameter larger than the outer diameter of the semiconductor wafer 1 is formed on the upper surface.
The die bond tape 3 attached to the semiconductor wafer 1 rotates and penetrates along the outer periphery of the semiconductor wafer 1.

To attach the die bond tape 3 onto the semiconductor wafer 1 with the above-described attaching apparatus, FIG.
When the semiconductor wafer 1 is mounted on the wafer mounting table 2 in the mechanism state shown in FIG. 1 and the semiconductor wafer 1 is sucked and heated, the tape chuck 11 holds the middle of the die bond tape 3 and the tape chuck 11 advances. After the die-bonding tape 3 is drawn out by the movement, the roll 10 and the bonding roll 9 are moved from the standby position to the forward position indicated by the two-dot chain line in FIG. Then, the semiconductor wafer 1 is pressurized at a constant pressure, and the adhesive portion of the overlapping portion of the die bond tape 3 on the semiconductor wafer 1 is melted and bonded by the heat of the semiconductor wafer 1.

When the bonding roll 9 reaches the advance position, it returns to the standby position while pressing the die-bonding tape 3 onto the semiconductor wafer 1 again. Next, the cutter 15 of the cutter unit 16 descends and rotates, and the die-bonding tape 3 is rotated. When the cutter unit 16 returns to the raised position, the tape chuck 11 releases the holding of the die bond tape 3, and the tape chuck 1
When the roll 1 and the roll 10 return to the standby position, the surplus portion of the die bond tape 3 is peeled off from the wafer mounting table 2, and the winding portion 5 winds the surplus portion of the die bond tape 3 by a predetermined length. After the step of attaching the die bond tape 3 to the semiconductor wafer 1 has been completed, the semiconductor wafer 1 may be taken out from the wafer mounting table 2.

[0013]

In the above-mentioned conventional bonding method, the bonding roll 9 is used to bond the die-bonding tape 3 onto the semiconductor wafer 1 by applying a predetermined pressure.

However, since the semiconductor wafer 1 has a plane shape of a broken circle, one rolling roll 9
When the die-bonding tape 3 is pressed onto the semiconductor wafer 1, the contact length (pressing length) of the bonding roll 9 to the semiconductor wafer 1 is such that the start and end of pressing correspond to the periphery of the semiconductor wafer 1. The length is short, the linear pressure is concentrated on the semiconductor wafer 1 and the semiconductor wafer 1
In the central part of, the contact length becomes longer and the pressing force is dispersed, so if a constant pressure is applied,
The linear pressure of the bonding roll 9 with respect to the semiconductor wafer 1 differs depending on the portion of the semiconductor wafer 1, and in a portion where the linear pressure is high, bump destruction may occur in the semiconductor wafer 1, and the die bond tape 3 may be partially damaged. There is a problem in that elongation occurs, and the thickness of the die bond tape 3 formed by the adhesive becomes thin at the beginning and end of pressing and becomes thick at the center due to a change in linear pressure.

Further, the conventional wafer mounting table 2 comprises:
The die bonding tape 3 attached to the semiconductor wafer 1 is cut into the cutter 1 because the die bonding tape 3 has an integrated structure up to the portion that supports the surplus portion after the die bonding tape 3 has been cut through.
Die-bonded tape 3 when piercing or cutting out with 5
The surplus portion is supported on the wafer mounting table 2 in a horizontal state.

For this reason, in the step of piercing the die-bonding tape 3, the outer periphery of the portion of the die-bonding tape 3 pierced by the cutter 15 is also heated by the wafer mounting table 2, and the adhesive is naturally melted. When the die bond tape 3 is cut by the cutter 15, the die bond tape 3 on the semiconductor wafer 1 side and the surplus die bond tape 3a on the wafer mounting table 2 side are cut once.
The cut portion is reattached by the molten adhesive, and when the excess die bond tape 3a is peeled off, the semiconductor wafer 1 is lifted from above the wafer mounting table 2 and is sucked by the wafer mounting table 2. Force is applied to the semiconductor wafer 1
There is a problem that cracks occur in the cracks.

Accordingly, an object of the present invention is to adjust the pressing force of the bonding roll on the semiconductor wafer in accordance with the portion of the semiconductor wafer, to prevent the breakage of the semiconductor wafer from bumps and the occurrence of partial elongation of the die bonding tape. Die bonding tape to a semiconductor wafer without causing the semiconductor wafer to crack in the process of peeling off the excess die bonding tape, as well as achieving a constant bonding thickness of the die bonding tape and no re-adhesion of the die bonding tape after the die bonding tape is cut through An object of the present invention is to provide a sticking method and a sticking device.

[0018]

In order to solve the above-mentioned problems, a first method of the present invention is to dispose a die bonding tape directly above a semiconductor wafer supported by a wafer mounting table and heated. After bonding the die-bonding tape on the semiconductor wafer with a bonding roll that moves in the length direction of the tape, pasting this die-bonding tape with the molten adhesive, and cutting through the die-bonding tape along the outer periphery of the semiconductor wafer, In a method of attaching a die bond tape to a semiconductor wafer in which an excess portion of the die bond tape is peeled off from a wafer mounting table, a pressure applied to the semiconductor wafer of the die bond tape by the attaching roll can be adjusted, and a force applied to a part of the semiconductor wafer. By changing the pressure, the linear pressure of the application roll can be At any position of Eha made uniform,
This adopts a configuration in which a die bond tape is pressed on a semiconductor wafer.

According to a second method of the invention, a die bonding tape is positioned just above a heated semiconductor wafer supported by a wafer mounting table, and the die bonding tape is moved on the semiconductor wafer by a bonding roll moving in the length direction of the die bonding tape. In the method of attaching the die-bonding tape to the semiconductor wafer, the tape was pressed and attached, and after piercing the die-bonding tape along the outer periphery of the semiconductor wafer with a cutter, the excess portion of the die-bonding tape was peeled off from the wafer mounting table. , The wafer mounting table,
A temperature control table that sucks and supports the semiconductor wafer and heats it, and a tape support table that is positioned around the outer periphery of the tape support table at a distance, is separated and independent, and a suction groove is provided on the tape support table to surround the temperature control table In the meantime, at the time of cutting through the die-bonding tape by the cutter, the excess die-bonding tape located on the tape support table is started up by sucking the inner peripheral portion of the cut-out portion into the suction groove, and the semiconductor wafer is placed on the semiconductor wafer. A configuration is adopted in which the die bond tape is separated from the outer periphery of the attached die bond tape to prevent the die bond tape from re-adhering at the cut-out portion.

The invention of the third apparatus is characterized in that the die-bonding tape is transferred from the supply section to the winding section with respect to the wafer mounting table for horizontally supporting and heating the semiconductor wafer by suction. It is placed so that it passes directly above, and during the transition of this die-bonding tape, it is reciprocated between the entrance side and the exit side of the die-bonding tape with respect to the wafer mounting table, and the die-bonding tape is pressed onto the semiconductor wafer. A guide roll for peeling off the die bond tape that moves forward together with the roll and the attaching roll, and retreats after the sticking roll retreats, reciprocates integrally with the guide roll, and holds and pulls out the die bond tape during forward movement. Place a tape chuck, and
Immediately above the wafer mounting table, it is possible to move up and down and rotate freely, and there is a cutter unit equipped with a cutter that rotates when descending and penetrates the die bond tape along the outer periphery of the semiconductor wafer. In the attaching device, the attaching roll,
Detecting means for electrically detecting the moving position of the mounting roll, and attaching the reciprocating mechanism for applying reciprocating motion on the wafer mounting table to the attaching roll so as to move up and down via a pressurizer; The pressurizer is actuated by a signal, and the control means for adjusting the pressing force of the bonding roll to the semiconductor wafer changes the pressing force of the bonding roll depending on the portion of the semiconductor wafer, thereby reducing the linear pressure of the bonding roll to any position on the semiconductor wafer. However, the configuration is made to be uniform.

The invention of the fourth apparatus is characterized in that the die bonding tape is transferred from the supply section to the winding section with respect to the wafer mounting table for horizontally supporting and heating the semiconductor wafer by suction. It is placed so that it passes directly above, and during the transition of this die-bonding tape, it is reciprocated between the entrance side and the exit side of the die-bonding tape with respect to the wafer mounting table, and the die-bonding tape is pressed onto the semiconductor wafer. A guide roll for peeling off the die bond tape that moves forward together with the roll and the attaching roll, and retreats after the sticking roll retreats, reciprocates integrally with the guide roll, and holds and pulls out the die bond tape during forward movement. Place a tape chuck, and
Immediately above the wafer mounting table, it is possible to move up and down and rotate freely, and there is a cutter unit equipped with a cutter that rotates when descending and penetrates the die bond tape along the outer periphery of the semiconductor wafer. In the mounting device, the wafer mounting table is separated and independent of a temperature control table for suction-supporting and heating the semiconductor wafer and a tape support table positioned at an interval around the outside of the wafer mounting table. The suction groove of the system is provided so as to surround the temperature control table in a state where it is divided into the entrance side and the exit side of the die bond tape, and it is located on the tape support table with this suction groove during the process of cutting through the die bond tape by the cutter. The inner part of the hollowed part of the excess die bond tape Ri launched, but employing the configuration as away the outer periphery of the die bonding tape joined to the semiconductor wafer.

A pulse motor for driving a reciprocating mechanism is used as the detecting means for electrically detecting the moving position of the application roll, and a control means inputs a signal from the pulse motor, and a computer controlled by the computer. Is formed by an electropneumatic regulator that operates the pressurizer, and the computer calculates the linear pressure of the sticking roll in response to the input of the position signal of the sticking roll from the pulse motor, and sends an electric signal corresponding to the moving position of the sticking roll. An electropneumatic regulator can be configured to feed the pressurizer with a pressurized fluid.

Further, a tape contact sheet such as silicon can be laid on the upper surface of the tape support table around the suction groove.

[0024]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 schematically shows an entire structure of a device for attaching a die bond tape to a semiconductor wafer according to the present invention, and a wafer mounting table 21 for horizontally sucking and heating a semiconductor wafer 1 supplied to an upper surface thereof. Is set in a fixed position, and the die bonding tape 3 is arranged on the wafer mounting table 21 such that the middle of the transition from the supply unit 22 to the winding unit 23 passes directly above the wafer mounting table 21. .

During the transfer of the die-bonding tape 3, the peeling roll 24 for peeling the protective sheet 6 from the die-bonding tape 3, the winding section 25 of the protective sheet 6, and the insertion of the die-bonding tape 3 on the wafer mounting table 21. A bonding roll 26 that reciprocates between the side and the delivery side and presses the die-bonding tape 3 onto the semiconductor wafer 1, a guide roll 27 that guides the die-bonding tape 3 from the peeling roll 24 to the bonding roll 26, and a bonding roll 26. A die-bonding tape peeling member 28 that moves forward together and retreats after the application roll 26 retreats, and reciprocates in the same manner as the peeling member 28, and the die-bonding tape 3 moves forward.
A tape chuck 29 for holding and pulling the die bond tape 3, a dancer roll 30 moving up and down according to the amount of the die bond tape 3 pulled out, a guide roll 31 for guiding the die bond tape 3 to the dancer roll 30, and a rising position of the dancer roll 30 are detected. A sensor 32 for stopping the take-up unit 23 and a sensor 33 for detecting the lowering position of the dancer roll 30 and driving the take-up unit 23 are provided. And a cutter unit 35 having a cutter 34 that rotates when descending is provided.

First, the wafer mounting table 21
As shown in FIGS. 5 to 8, the temperature control table 36 includes a temperature support table 37 and a tape support table 37 located at a predetermined interval around the outside of the temperature control table 36. The semiconductor wafer 1 is formed into a planar shape having a slightly smaller diameter than the outer diameter of the semiconductor wafer 1 by using the material having the semiconductor wafer 1. The semiconductor wafer 1 mounted on the upper surface is suction-supported by suction by suction means, and the semiconductor wafer 1 is heated by heating means. Is heated to a temperature of 100 ° C to 160 ° C.

The tape support table 37, which is disposed separately around the outside of the temperature control table 36, has a flat rectangular shape wider than the width of the die-bonding tape, and has a central portion larger than the outer diameter of the temperature control table 36. Large diameter through hole 38
The cutter 34 of the cutter unit 35 penetrates the die-bonding tape 3 at an annular space 39 formed by the outer periphery of the temperature control table 36 and the inner periphery of the through hole 38.

At a position along the periphery of the through hole 38 on the upper surface of the tape support table 37, a suction concave groove 4 having a V-shaped cross section which is divided into two systems, the entrance side and the exit side of the die bond tape 3.
0 and 41 are provided, and both suction grooves 40 and 41 have a substantially semicircular planar shape and are arranged so as to surround the outside of the temperature control table 36. Two suction systems are provided at the bottoms of both suction grooves 40 and 41. A plurality of suction holes 42 for individually connecting to the sources are provided.

On the upper surface of the tape support table 37, a silicon sheet 43 for adhering the die bond tape 3 superimposed on the tape support table 37 with adhesive force is laid on the outer peripheral portions of both the suction concave grooves 40 and 41. Have been.

The supply unit 22 of the die bond tape 3
Has a mechanism capable of applying a brake to the reel of the die-bonding tape 3 wound by a roll and applying tension to the drawn-out die-bonding tape 3.

The die bond tape peeling member 28 includes:
A rotatable peeling roll 44 located above the upper surface of the wafer mounting table 21 at a predetermined distance and reciprocating between the entrance and exit sides of the die bond tape 3 with respect to the wafer mounting table 21; It is located just above the peeling roll 44, moves up and down, and is formed by a peeling roll 44 and a tension roll 45 that holds the die bond tape 3 together with the peeling roll 44 at the time of descending. The tape chuck 29 peels off the die bond tape peeling member 28. The roll 46 is formed at the same height position as the roll 44, and a chucking member 47 that moves up and down immediately above the roll 46 and holds the die bond tape 3 with the roll 46 when descending.

The bonding roll 26 is arranged at a height at which it rolls on the upper surface of the wafer mounting table 21. As shown in FIGS. 2 to 4, the bonding roll 26 reciprocates on the wafer mounting table 21. It is attached to a reciprocating mechanism 48 for imparting movement so as to move up and down via an air cylinder 49 serving as a pressurizer.

The reciprocating mechanism 48 includes a horizontal guide rail 50 on both sides of the upper part of the wafer mounting table 21, an endless running body 51 such as a chain on one side of the wafer mounting table 21, and movement of the die bonding tape 3. A movable bracket 52, which is disposed in parallel to the respective directions and is supported at both ends by guide rails 50, is connected to the endless traveling body 51, and a plurality of guide shafts 53 are provided below the movable bracket 52.
The sticking roll 26 is rotatably supported by a holder 54 arranged so as to be able to move up and down, and the piston rod of the air cylinder 49 fixed to the movable bracket 52 is connected to the holder 54. The adhering roll 26 is raised and lowered and the endless traveling body 5
The operation 1 causes the attaching roll 26 to reciprocate a fixed stroke.

A pulse motor (encoder) 55 is used to drive the endless traveling body 51, and a detecting means for electrically detecting the moving position of the attaching roll 26 is provided between the pulse motor 55 and the air cylinder 49. A microcomputer 56 for inputting an output signal of the pulse motor 55; and an electropneumatic regulator (adjustment valve) for operating the air cylinder 49 with the output signal of the microcomputer 56 to adjust the pressing force of the bonding roll 26 to the semiconductor wafer 1. ) 57 is provided.

When the bonding roll 26 presses the die bond tape 3 onto the semiconductor wafer 1, the microcomputer 56 informs the microcomputer 56 of the contact length of the moving position of the bonding roll 26, that is, the position of the bonding roll 26 with respect to the semiconductor wafer 1 ( The change of the pressure length) and the control condition of the air cylinder 49 for changing the linear pressure of the application roll 26 corresponding to this change are stored in advance, and the movement of the application roll 26 input from the pulse motor 55 is stored. By operating the electropneumatic regulator 57 under the condition corresponding to the position and controlling the supply of the pressurized air to the air cylinder 49 by the electropneumatic regulator 57, even if the position of the bonding roll 26 with respect to the semiconductor wafer 1 changes, The linear pressure of the bonding roll 26 is kept constant at any position on the semiconductor wafer 1.

That is, the contact length is short at the start and end of pressurization where the position of the bonding roll 26 corresponds to the peripheral edge of the semiconductor wafer 1, and the line pressure concentrates on the semiconductor wafer 1. 0.5 kg / cm ²
In the central portion of the semiconductor wafer 1, the contact length becomes longer and the pressing force is dispersed, so that, for example, 3.0 kg
By controlling the air cylinder 49 so as to increase the pressing force to / cm ² , the die bonding tape 3 can be made to have a constant bonding condition at any position with respect to the semiconductor wafer 1. It is possible to prevent the semiconductor wafer 1 from breaking the bump at a high place, and to prevent the die bond tape 3 from being partially stretched and the applied thickness from being uneven.

The pasting device of the present invention has the above-described configuration, and the pasting method will be described next.

FIG. 1 shows an initial state before the die bonding tape 3 is bonded to the upper surface of the semiconductor wafer 1. The bonding roll 26, the die bonding tape peeling member 28, and the tape chuck 29 are placed on the wafer mounting table 21.
Is at the standby position on the right side of FIG.
Of the die bond tape pulled out from the supply unit 22 is separated from the separation roll 24, the guide roll 27, the application roll 26, the die bond tape peeling member 28, the tape chuck 29, and the guide roll 3.
1, the horizontal portion passing through the dancer roll 30 and moving to the winding section 23 and moving from the die bonding tape peeling member 28 to the guide roll 31 is the wafer mounting table 21.
It is located directly above.

In this state, when the semiconductor wafer 1 is mounted on the temperature control table 36 of the wafer mounting table 21,
The semiconductor wafer 1 is fixed on the temperature adjustment table 36 by the suction force applied to the upper surface of the temperature adjustment table 36, and the semiconductor wafer 1 is heated by the heating means provided on the temperature adjustment table 31.
Heat to a temperature between 00C and 160C.

At this time, since the tape support table 37 of the wafer mounting table 21 is separated from the temperature control table 36 at the interval 39, the tape support table 37 is not heated by the heat of the temperature control table 36.

Tape Pulling Step When the semiconductor wafer 1 is heated, the chuck member 47 of the tape chuck 29 descends and holds the middle of the die bond tape 3 with the roll 46 as shown by a chain line in FIG.
The tape chuck 29 moves to the forward position shown by the solid line on the left side of FIG.

As shown in FIG. 10, the tension roll 45 of the die-bonding tape peeling member 28 descends to hold the middle of the die-bonding tape 3 with the peeling roll 44, and the die-bonding tape peeling member 28 and the bonding roll 26 Moves while rolling to the forward position indicated by the solid line on the left side of the figure, and the bonding roll 26 presses the die bond tape 3 against the tape support table 37 and the upper surface of the semiconductor wafer 1.

At this time, a brake is applied to the supply unit 22 to stop the die bond tape 3 from being pulled out, and the tension bond 45 and the peeling roll 44 of the die bond tape peeling member 28 hold the die bond tape 3 and move the die bond tape 3 forward to attach. The tension is applied to the die bond tape 3 pressed against the upper surface of the wafer mounting table 21 by the roll 26.

When the die roll 3 is pressed against the upper surface of the semiconductor wafer 1 by the bonding roll 26, the semiconductor wafer 1 is heated, so that the adhesive in the portion of the die bond tape 3 overlapping the semiconductor wafer 1 is melted.
The die bond tape 3 adheres to the semiconductor wafer 1.

When the bonding roll 26 presses the die bond tape 3 against the upper surface of the semiconductor wafer 1, the movement of the bonding roll 26 is detected, and the air cylinder 49 is operated based on the detected position. The pressing force on the semiconductor wafer 1 is set low at the beginning of pressurization corresponding to the peripheral edge of the semiconductor wafer 1, and when the pressure reaches the center of the semiconductor wafer 1, the pressing force increases, and when the pressure passes through the center, The pressing force is controlled so as to decrease toward the end of the pressurization, whereby the linear pressure of the bonding roll 26 becomes constant at any position of the semiconductor wafer 1 and the die bonding tape 3 is moved to the semiconductor wafer 1.
In any position, it is possible to make a fixed state of attachment.

When the application roll 26 reaches the advance position, it moves backward, and again under the same conditions as the advance, the die bonding tape 3
Is pressed against the tape support table 37 and the upper surface of the semiconductor wafer 1 to return to the mechanism position.

When the bonding roll 26 returns to the standby position, the cutter 34 of the cutter unit 35 descends and rotates as shown in FIG. 11, and is formed by the outer circumference of the temperature control table 36 and the inner circumference of the through hole 38. The cutter 34 penetrates the die-bonding tape 3 along the outer peripheral edge of the semiconductor wafer 1 at the portion of the formed annular space 39.

When a suction force is applied to the suction grooves 40 and 41 provided on the tape support table 37 when the die bond tape 3 is pierced by the cutter 34, FIGS.
As shown in the figure, the inner peripheral portion of the cut-out portion of the excess die-bonding tape 3a located on the tape support table 37 is sucked into the suction grooves 40, 41, and the surplus die-bonding tape 3a is cut off by the suction. The inner peripheral portion of the portion is sucked and rises up, and is kept separated from the outer periphery of the die bond tape 3 attached to the semiconductor wafer 1, whereby the die bond tape 3 attached to the semiconductor wafer 1 is maintained. And the surplus die bond tape 3a is prevented from being re-adhered.

When the cutter 34 of the cutter unit 35 returns to the raised position, the tension roll 45 of the die bond tape peeling member 28 and the chuck member 47 of the tape chuck 29 both at the advanced position indicated by the chain line in FIG. Then, the excess die-bonding tape 3a is released from holding and holding, and the die-bonding tape peeling member 28 and the tape chuck 29 retreat to the standby position shown by the solid line in FIG. The peeling roll 44 peels off the surplus die bond tape 3a from the tape support table 37.

When the peeling roll 44 peels off the surplus die bond tape 3a from the tape support table 37, the tape support table 37 of the surplus die bond tape 3a
The suctioned grooves 40 and 41 provided in the suction groove 40 and 41 are also separated. However, since the suction grooves 40 and 41 are divided into two sides, ie, the entrance side and the exit side of the die-bonding tape 3, the two systems are separated. In the first half of the peeling step of peeling off the excess die bond tape 3a from the tape support table 37,
Even if the suction groove 41 becomes atmospheric pressure by separating the excess die bond tape 3a from the suction groove 41 on the left side in FIGS. 5 and 6, the suction groove 40 on the right side in FIGS. Therefore, in the first half of the peeling process, the second half of the surplus die bond tape 3a is
7 does not peel off from the suction groove 40, thereby preventing the latter half of the peeling off from reattaching to the die bond tape 3 stuck on the semiconductor wafer 1.

When the peeling roll 44 peels off the latter half of the excess die-bonding tape 3a from the tape support table 37 and retreats to the standby position, the winding unit 23 winds up the excess die-bonding tape 3a by a predetermined length. When the step of attaching the die bond tape 3 to the semiconductor wafer 1 is completed, and the semiconductor wafer 1 is taken out from the temperature control table 36 of the wafer mounting table 21, the state returns to the initial state of FIG.

In the above, the use of the bonding roll 26 has been described as an example of the case where the die bond tape 3 is bonded on the semiconductor wafer 1, but the structure of the bonding roll 26 of the present invention is as follows.
For example, a photosensitive liquid resist having a large thickness is spin-coated on a semiconductor wafer, a photosensitive dry film resist is laminated on the photosensitive liquid resist, and then heating and pressing are performed on the resist, or the thickness is uniform. It can also be used for the process of directly pressing and bonding the photosensitive dry film resist specified in the above to the underlying barrier metal, making the thickness of the photosensitive liquid resist constant or using the photosensitive dry film resist as a barrier metal. There is an advantage that it can be uniformly adhered over the entire surface of the substrate.

[0054]

As described above, according to the present invention, the pressing force of the bonding roll for pressing the die-bonding tape onto the semiconductor wafer heated and held on the wafer mounting table is changed depending on the position of the semiconductor wafer. As a result, the linear pressure of the bonding roll can be made uniform at any position of the semiconductor wafer, thereby preventing bump destruction of the semiconductor wafer and partial elongation of the die bonding tape, and reducing the thickness of the die bonding tape. It will be possible to stabilize.

Further, since the wafer mounting table is separated and independent of a temperature control table for sucking and supporting the semiconductor wafer and heating it, and a tape support table located at an interval around the outside of the wafer mounting table. Is not transmitted to the tape support table and the die bond tape does not adhere to the tape support table, so that the die bond tape can be smoothly peeled off from the tape support table.

Further, a suction groove is provided on the tape support table so as to surround the temperature control table, and the excess die bond tape located on the tape support table is cut through during the step of cutting the die bond tape by the cutter. The inner peripheral part of the part is raised by sucking it into the suction groove so as to be separated from the outer periphery of the die bond tape stuck on the semiconductor wafer, so that the cut-out parts of the die bond tape may come into contact with each other. In addition, the die bond tape in which the adhesive is melted by heating can be prevented from re-adhering at the hollow portion, and the semiconductor wafer does not peel off in the step of peeling off the excess die bond tape from the tape support table.

[Brief description of the drawings]

FIG. 1 is a side view schematically showing an entire apparatus for attaching a die bond tape to a semiconductor wafer according to the present invention.

FIG. 2 is an enlarged vertical sectional front view showing a structure of a sticking roll in the sticking device.

FIG. 3 is a plan view of the above.

FIG. 4 is a side view of the above.

FIG. 5 is a plan view showing the configuration of a wafer mounting table.

FIG. 6 is a longitudinal sectional front view showing the configuration of a wafer mounting table.

FIG. 7 is a longitudinal sectional view taken along an arrow AA in FIG. 5;

FIG. 8 is a longitudinal sectional view taken along arrow BB in FIG. 5;

FIG. 9 is a simplified front view showing a tape pulling-out step in a sticking process.

FIG. 10 is a simplified front view showing a tape attaching step in an attaching process.

FIG. 11 is a simplified front view showing a tape cutting step in the attaching process.

FIG. 12 is a simplified front view showing a tape peeling step in an attaching process.

FIG. 13 is a side view schematically showing the entire structure of a conventional die-bonding tape bonding apparatus for a semiconductor wafer.

FIG. 14 is a plan view of the above with a part omitted.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor wafer 3 Die bond tape 21 Wafer mounting table 22 Supply part 23 Winding part 24 Peeling roll 25 Winding part 26 Pasting roll 27 Guide roll 28 Die bond tape peeling member 29 Tape chuck 30 Dancer roll 31 Guide roll 32 Sensor 33 Sensor 34 Cutter 35 Cutter unit 36 Temperature control table 37 Tape support table 38 Through hole 39 Interval 40 Suction recess 41 Suction recess groove 42 Suction hole 43 Silicon sheet 44 Roll 45 Tension roll 46 Roll 47 Chucking member 48 Reciprocating mechanism 49 Air cylinder 50 Guide Rail 51 Endless running body 52 Movable bracket 53 Guide shaft 54 Holder 55 Pulse motor 56 Microcomputer 57 Electro-pneumatic regulator

Claims (6)

[Claims] 1. A die-bonding tape is positioned directly above a semiconductor wafer supported and heated by a wafer mounting table, and the die-bonding tape is pressure-bonded onto the semiconductor wafer by a bonding roll moving in the length direction of the die-bonding tape.
This die-bonding tape is attached with a molten adhesive, the die-bonding tape is cut out along the outer periphery of the semiconductor wafer with a cutter, and the excess part of the die-bonding tape is peeled off from the wafer mounting table. In the bonding method, the pressure applied to the semiconductor wafer of the die bond tape by the bonding roll is adjustable, and by changing the pressing force depending on the portion of the semiconductor wafer, the linear pressure of the bonding roll is made uniform at any position of the semiconductor wafer. A method for attaching a die-bonding tape to a semiconductor wafer, comprising: bonding a die-bonding tape to a semiconductor wafer. 2. A die bonding tape is positioned directly above a heated semiconductor wafer supported by a wafer mounting table, and the die bonding tape is pressed and bonded onto the semiconductor wafer by a bonding roll moving in the length direction of the die bonding tape. The method of attaching a die-bonding tape to a semiconductor wafer, wherein the die-bonding tape is cut off along a periphery of the semiconductor wafer with a cutter, and then an excess portion of the die-bonding tape is peeled off from the wafer mounting table. Is separated into a temperature control table that sucks and supports the semiconductor wafer and heats the semiconductor wafer, and a tape support table located at an interval around the outside of the temperature control table, and the suction groove is formed on the tape support table so as to surround the temperature control table. The die bond tape with a cutter. During the piercing process, the excess die bond tape located on the tape support table is started up by sucking the inner peripheral portion of the pierced portion into the suction groove, and the outer peripheral portion of the die bond tape stuck on the semiconductor wafer is raised. A method for attaching a die-bonding tape to a semiconductor wafer, wherein the detaching prevents the die-bonding tape from re-adhering at a hollow portion. 3. A method of transferring a die bonding tape from a supply section to a winding section with respect to a wafer mounting table which horizontally supports the semiconductor wafer by suction while adsorbing and supporting the semiconductor wafer, so that the tape passes directly above the wafer mounting table. During the transfer of this die-bonding tape, the die-bonding tape reciprocates between the entrance side and the exit side of the die-bonding tape on the wafer mounting table,
A bonding roll that presses the die-bonding tape onto the semiconductor wafer, and moves forward with the bonding roll,
A guide roll for peeling off the die bond tape, which retreats after the application roll retreats, and a tape chuck that reciprocates integrally with the guide roll, holds the die bond tape at the time of advancement, and pulls out the same, are further provided. Immediately above, the ascending and descending and rotating become freely possible, the die bonding tape attaching device to the semiconductor wafer provided with a cutter unit having a cutter that rotates at the time of descending and penetrates the die bonding tape so as to follow the outer periphery of the semiconductor wafer, Attaching roll, attached to the reciprocating mechanism for imparting reciprocating motion on the wafer mounting table to the attaching roll so as to move up and down via a pressurizer, a detecting means for electrically detecting the moving position of the attaching roll, The pressurizer is activated by the signal from this detection means, and the adhesive roll is applied to the semiconductor wafer The control means for adjusting the pressing force of the semiconductor wafer, by changing the pressing force of the bonding roll depending on the part of the semiconductor wafer, so that the linear pressure of the bonding roll is made uniform at any position of the semiconductor wafer. Die bond tape sticking device. 4. A computer in which a pulse motor for driving a reciprocating mechanism is used as a detecting means for electrically detecting a moving position of the sticking roll, and a control means inputs a signal from the pulse motor, and the computer controls the computer. It is formed by an electro-pneumatic regulator that operates the pressurizer, and in response to the input of the position signal of the pasting roll from the pulse motor, this computer calculates the linear pressure of the pasting roll, and the electric signal corresponding to the moving position of the pasting roll 4. The apparatus for attaching a die-bonding tape to a semiconductor wafer according to claim 3, wherein the electro-pneumatic regulator supplies the pressurized fluid to the pressurizer. 5. A process in which a die bonding tape is transferred from a supply unit to a winding unit with respect to a wafer mounting table that horizontally supports and heats a semiconductor wafer by suction so as to pass right above the wafer mounting table. During the transfer of this die-bonding tape, the die-bonding tape reciprocates between the entrance side and the exit side of the die-bonding tape on the wafer mounting table,
A bonding roll that presses the die-bonding tape onto the semiconductor wafer, and moves forward with the bonding roll,
A guide roll for peeling off the die bond tape, which retreats after the application roll retreats, and a tape chuck that reciprocates integrally with the guide roll, holds the die bond tape at the time of advancement, and pulls out the same, are further provided. Immediately above, the ascending and descending and rotating become freely possible, the die bonding tape attaching device to the semiconductor wafer provided with a cutter unit having a cutter that rotates at the time of descending and penetrates the die bonding tape so as to follow the outer periphery of the semiconductor wafer, The wafer mounting table is separated and separated into a temperature control table for suction-supporting and heating the semiconductor wafer and a tape support table positioned at an interval around the outside thereof, and two suction grooves are provided on the tape support table. With the temperature divided into the inlet and outlet sides of the die bond tape. It is provided so as to surround the bullion, and at the time of cutting out the die bond tape by the cutter, the suction concave groove starts up by suctioning the inner peripheral portion of the surpassed die bond tape located on the tape support table, An apparatus for attaching a die bond tape to a semiconductor wafer, wherein the apparatus is separated from the outer periphery of the die bond tape attached to the semiconductor wafer. 6. The apparatus according to claim 5, wherein a tape adhesive sheet is laid at a position around the suction groove on the upper surface of the tape support table.