JP2006179814A - Film pasting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film pasting device that enables a film to be pasted at any semiconductor wafer location with an even line pressure under smooth welding force control. <P>SOLUTION: This device comprises a sliding unit 20 for moving a slider 40 by means of a motor 18, a first slide member 44 connected to the slider 40, and a vertical rail 48 which is relatively fixed for an horizontal guide 22 of the sliding unit 20 and is extended vertically. It also comprises a paste roller 66 for pasting a film material 78 to a semiconductor wafer 76, a roller supporter 60 for supporting the paste roller 66, and a second slide member 56 that engages with the vertical rail 48 fixed at the rear of the roller supporter 60 in a slidable manner. Furthermore, it comprises a slant rail 72 in the roller supporter 60 in such a way that it slants a little in a horizontal direction and the first slide member 44 engages in a slidable manner, and raises or lowers the roller supporter 60 along a slant of the slant rail 72 by means of the motor 18 to control suppress strength to the semiconductor wafer 76 with the paste roller 66. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a film affixing for adhering a film material to a semiconductor wafer, such as a protective film to be affixed to the surface of a semiconductor wafer that has been subjected to a formation process of a predetermined circuit pattern, etc. Relates to the device.

  Conventionally, in a manufacturing process of a semiconductor product, a semiconductor wafer having a large number of circuit patterns formed on its surface is subjected to a back grinding process as needed, and then cut into individual semiconductor chips by a dicing process for each functional element. To divide. Thereafter, the semiconductor chip is mounted and fixed on a die pad having a lead frame or the like, wire bonding is performed, and sealing with a mold resin is performed to complete an IC or LSI product.

  In recent years, when this semiconductor chip is mounted and fixed on a die pad, it is a film using a polymer alloy type adhesive composed of a thermoplastic resin and a thermosetting resin, and exhibits a tackiness when heated. A film is used. In order to mount and fix the semiconductor chip on the die pad of the lead frame using such a die bond film, first, a die bond film is pasted on the entire back surface of the semiconductor wafer after the back surface polishing step and before the dicing step. Thereafter, the semiconductor wafer and the die bond film are cut together in a dicing process to form a semiconductor chip having a die bond film on the back surface, which is mounted and fixed on the die pad of the lead frame.

In addition, when polishing (back grinding) or etching the back surface of a semiconductor wafer that has been subjected to a pattern forming process of a predetermined circuit or element, the surface of the semiconductor wafer is protected with adhesive to protect the surface of the semiconductor wafer. A film is affixed. The semiconductor wafer protected by the protective film is subjected to a treatment such as polishing on the back surface in a state where the front surface is sucked and held by a suction cup.
JP 2002-134438 A

  In the above conventional technique, generally, when a film is stuck on a semiconductor wafer, the semiconductor wafer is placed on a mounting table, and the film is stuck on the semiconductor wafer while applying a force with a sticking roller. At this time, since the pressure is applied by the application roller with a constant force, the contact length of the application roller is shortened at the peripheral portion of the semiconductor wafer, and the linear pressure of the application roller is increased with respect to the semiconductor wafer. On the contrary, the contact length becomes longer in the central portion of the, and the applied pressure is dispersed. For this reason, the linear pressure which is the pressing force per unit length of the sticking roller with respect to the semiconductor wafer differs depending on the part of the semiconductor wafer. In addition, bumps formed on the semiconductor wafer may be damaged at places where the linear pressure is high, and the film is crushed and thinned to cause elongation, and the film thickness is increased at the peripheral and central portions of the semiconductor wafer. There is also a problem of non-uniformity.

  In order to improve these problems, as disclosed in Patent Document 1, when a film-like die bond tape is applied to a semiconductor wafer, a force is applied stepwise to the application roller by air pressure control using an air cylinder, A method of attaching a die bond film to a semiconductor wafer has been proposed.

  However, the air cylinder used in the device that presses the sticking roller is difficult to control the compressed air to be operated, and has been a stepwise pressurizing operation. For this reason, the linear pressure of the sticking roller changes stepwise with respect to the die bond tape, and the film material is stuck to the semiconductor wafer with non-uniform linear pressure.

  The present invention has been made in view of the above-described problems of the prior art, and provides a film sticking apparatus capable of sticking a film material with a uniform linear pressure at any position on a semiconductor wafer by controlling a smooth pressing force. The purpose is to do.

  The present invention is a film sticking device for sticking a film material arranged immediately above a semiconductor wafer to the semiconductor wafer, a slider device for moving a slider portion by a motor, a sliding member connected to the slider portion, A sticking roller for sticking the film material to the semiconductor wafer, and a roller support part for supporting the sticking roller are provided, and the roller part is moved up and down along the sliding member by moving the slider part by the motor, It is a film sticking apparatus which can control the pressing force to the semiconductor wafer by the sticking roller.

  The present invention further includes a slider device that moves the slider portion by a motor, a first sliding member connected to the slider portion, and a fixed relative to the horizontal guide portion of the slider device and extends in the vertical direction. A vertical rail, a sticking roller for sticking the film material to the semiconductor wafer, a roller support portion for supporting the sticking roller, and a slidably engaged with the vertical rail fixed to the back surface of the roller support portion A film sticking device provided with the second sliding member and an inclined rail that is provided on the roller support portion and is slightly inclined with respect to the horizontal direction and is slidably engaged with the first sliding member. The slider portion is driven in a horizontal direction along the horizontal guide portion by a ball screw connected to a servo motor.

  According to the film sticking apparatus of the present invention, the film material can be stuck to the semiconductor wafer with a uniform pressure by continuously controlling the appropriate pressure. Therefore, the film material can be uniformly adhered at any position on the semiconductor wafer, and the film material can be uniformly and cleanly adhered to the semiconductor wafer, so that the workability in the manufacturing process of the semiconductor element can be improved and the yield can be improved. Is.

  Hereinafter, the film sticking apparatus of this invention is demonstrated based on FIGS. The film sticking apparatus 10 of this embodiment is used when sticking a film material on the surface of a semiconductor wafer.

  The structure of the film sticking apparatus 10 of this embodiment is demonstrated. As shown in FIGS. 1 and 2, the film sticking device 10 has mounting plates for fixing the film sticking device 10 to a device (not shown) at both ends of a base 12 formed in a long plate shape with an appropriate thickness. 14a and 14b are provided with a spacer 16 having an appropriate thickness interposed therebetween. The mounting plates 14a and 14b are formed in a rectangular shape and have different sizes.

  A slider device 20 having a servo motor 18 is attached on the base 12. The slider device 20 includes a horizontal guide portion 22 and a slider portion 40, and a ball screw 30 is attached along the horizontal guide portion 22 in the longitudinal direction. The ball screw 30 is screwed into the slider portion 40 and connected to the servo motor 18 so as to be rotatable.

  Further, a connecting portion 36 formed in an L shape by combining two rectangular plates of the vertical member 32 and the horizontal member 34 is fixed on the upper surface of the slider portion 40, and is provided to be slidable together with the slider 40. It has been. On the outer surface 32a of the vertical member 32 of the L-shaped connecting portion 36, a sliding member 44 that is a first sliding member that slides in engagement with an inclined rail 72 described later is attached.

  On the side surfaces in the vicinity of both end portions of the horizontal guide portion 22, vertical rails 48 are positioned to extend in the vertical direction. The vertical rail 48 is attached to the base 12 by a fixing member 50 formed in an L shape.

  Further, the film sticking device 10 is provided with a roller support portion 60 that supports the sticking roller 66 at a position parallel to the longitudinal direction adjacent to the horizontal guide portion 22. This roller support portion 60 has rectangular plate-like bearing members 64 attached to both ends of a long plate 62 having an appropriate width in a state perpendicular to the width direction, and is integrally formed in a U-shape. Yes. A rotation shaft 68 of a sticking roller 66 is rotatably attached to the bearing member 64 on the roller support portion 60, and a detachment stop 70 is fixed to both ends of the rotation shaft 68 by a stop bolt (not shown). Further, the roller support portion 60 is provided with a sliding member 56 on the back surface 60a, which is a second sliding member that engages with the vertical rail 48 and can slide in the vertical direction.

  Between the pair of sliding members 56 provided on the back surface 60a of the roller support portion 60, as shown in FIGS. 3 and 4, an inclined rail 72 that is slightly inclined with respect to the horizontal direction is fixed. . The inclined rail 72 is attached obliquely so that the end located on the servo motor 18 side is lower than the opposite end. A sliding member 44 fixed to the outer surface 32a of the vertical member 32 of the connecting portion 36 is slidably engaged with the inclined rail 72.

  Next, operation | movement of the film sticking apparatus 10 of this embodiment is demonstrated. In the film sticking device 10 in which the base 12 is fixed to a mounting portion of a device (not shown), when an operation signal is sent from a controller (not shown), the ball screw 30 connected to the servo motor 18 is rotated. Then, as shown in FIG. 4, the slider portion 40 moves horizontally along the ball screw 30 and the horizontal guide portion 22, and the integrally connected connecting portion 36 slides along the horizontal guide portion 22. Thereby, the sliding member 44 attached to the connecting portion 36 slides in the horizontal direction along the inclined rail 72. Then, due to the inclination of the inclined rail 72, the inclined rail 72 itself moves in the vertical direction, and the position of the roller support portion 60 in the vertical direction changes depending on the position. As shown in FIG. 5, the roller support portion 60 moves in the vertical direction by the sliding member 56 sliding on the vertical rail 48, and the deflection of each member due to the position of the sticking roller 66 is changed, The vertical pressing force changes.

  In order to attach the film material 78 to the semiconductor wafer 76 by the film pasting apparatus 10 of this embodiment, the film material 78 is placed directly on the semiconductor wafer 76 placed on the placing table 80 as shown in FIG. Pull out and place. The film material 78 is wound up in a roll shape and attached so as to be able to be pulled out from a feeding device (not shown), positioned by positioning means for the film material 78 (not shown), and the surface of the semiconductor wafer 76 via guide rollers 82a and 82b. Is pasted. Then, the film material 78 is stuck to the semiconductor wafer 76 in a pressurized state by the sticking roller 66 of the film sticking apparatus 10 attached to a device (not shown), and the film material 78 is applied to the semiconductor wafer 76 while applying a certain linear pressure. Is pasted.

  In order to apply a constant linear pressure by the sticking roller 66, the controller applies a force proportional to the length of the line segment that the sticking roller 66 crosses the semiconductor wafer 76 from the sticking roller 66 to the semiconductor wafer 76. The servo motor 18 is controlled to rotate the ball screw and adjust the position of the connecting portion 36.

  When the desired linear pressure can be obtained with a small force with respect to the semiconductor wafer 76, the position adjustment method of the connecting portion 36 by the slider portion 40 is a case where the connecting portion 36 is positioned on the left side in FIG. Moves the connecting portion 36 to the right side of FIG. By moving the connecting portion 36 to the right side in FIG. 4, the sticking roller 66 tries to move downward and pushes the semiconductor wafer 76 with a stronger force. Therefore, the slider member 40 is positioned on the right side in the vicinity of the center portion of the semiconductor wafer 76, and the slider member 40 is positioned on the left side in the vicinity of the peripheral portion of the semiconductor wafer 76 to attach the film material 78 to the semiconductor wafer 76. To do.

  According to the film sticking apparatus 10 of this embodiment, the pressurizing force that presses the sticking roller 66 is generated by the servo motor 18, whereby continuous and accurate control of the pressurizing force can be performed. For this reason, the film material 78 can be uniformly stuck to the semiconductor wafer 76 at a constant pressure. The force applied to the inclined rail 72 from the connecting portion 36 is continuously and smoothly controlled by the inclined rail 72 and applied to the roller support portion 60 without deviation. Therefore, a uniform linear pressure is applied by the sticking roller 66 at any position of the semiconductor wafer 76, and the bumps formed on the surface of the semiconductor wafer 76 are not damaged, and the film material 78 can be stuck more reliably. It will be.

  The film sticking apparatus according to the present invention is not limited to the above embodiment, and the motor for controlling the position of the sticking roller adjusts the position directly to the roller support portion via a ball screw or the like, so that the semiconductor wafer The pressing force on the motor may be controlled, and the position of the motor may be appropriately arranged. Further, the size of the application roller can be appropriately selected according to the size of the semiconductor wafer to be attached. Further, the stroke in the vertical direction of the roller support portion can be set according to the mounting inclination angle of the tilt rail, and can be set as appropriate as long as the tilt rail does not protrude from the back surface of the roller support portion.

It is a schematic plan view which shows the film sticking apparatus of one Embodiment of this invention. It is a schematic side view which shows the film sticking apparatus of this embodiment. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. It is CC sectional drawing of FIG. It is a schematic plan view which shows film sticking by the sticking roller of the film sticking apparatus of this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Film sticking apparatus 12 Base 18 Servo motor 20 Slider apparatus 22 Horizontal guide part 30 Ball screw 36 Connection part 40 Slider part 44,56 Sliding member 48 Vertical rail 50 Fixing member 60 Roller support part 66 Sticking roller 72 Inclined rail 76 Semiconductor wafer 78 Film material

Claims (3)

  In a film sticking apparatus for sticking a film material disposed immediately above a semiconductor wafer to the semiconductor wafer, a slider device for moving a slider part by a motor, a sliding member connected to the slider part, and the film material for the semiconductor A sticking roller for sticking to a wafer and a roller support part for supporting the sticking roller are provided, the slider part is moved by the motor to move the roller support part up and down along the sliding member, and the sticking roller is used to A film sticking apparatus characterized in that a pressing force to a semiconductor wafer can be controlled.   In a film sticking apparatus for sticking a film material disposed immediately above a semiconductor wafer to the semiconductor wafer, a slider device that moves a slider portion by a motor, a first sliding member connected to the slider portion, and a slider device A vertical rail that is fixed relative to the horizontal guide portion and extends in the vertical direction, a sticking roller that sticks the film material to the semiconductor wafer, a roller support portion that supports the sticking roller, and a roller support portion A second sliding member fixed to the back surface and slidably engaged with the vertical rail, and provided on the roller support portion and slightly inclined with respect to the horizontal direction, the first sliding member can slide. An inclined rail engaged with the motor, the slider is moved by the motor, the roller support is moved up and down by the inclination of the inclined rail, and the sticking is performed. Film sticking apparatus characterized by by chromatography La was possible to control the pressing force applied to the semiconductor wafer. 3. The film sticking apparatus according to claim 2, wherein the slider portion is driven in a horizontal direction along the horizontal guide portion by a ball screw connected to a servo motor.

Images