JPH1154996A - Calculation method of correction amount of electronic component mounting position - Google Patents

Abstract

PROBLEM TO BE SOLVED: To calculate a correction amount of a suction position of an electronic component readily and surely, by recognizing a distance from a center position of an electronic component to an optimum electronic component suction point as an offset value in advance, and measuring only a distance from a standard point to an electronic component end part. SOLUTION: A side part of an electronic component (b) sucked and held to a suction nozzle is measured by a laser measurement means. An electronic component end position coordinate value in the electronic component (b) obtained by the measurement from a standard point fixed in advance, a distance L12 from a pre-determined electronic component end position to an electronic component central position, and a distance (f) from an electronic component central position to an optimum electronic component suction point position, are added and subjected to data processing. When a gap is generated between a nozzle suction point WN in the electronic component (b) and a normal value, a mounting position correction amount in X, Y directions of the electronic component (b) on a printed board is calculated by operation with the data.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for calculating an electronic component mounting position correction amount used in the field of assembling or mounting electronic components.

[0002]

2. Description of the Related Art In the industry where electronic components such as chip components and IC components are mounted on a printed circuit board, as shown in FIG.
Before mounting, the position of the suction nozzle by the suction nozzle of the mounting machine is measured, and a deviation or an incorrect angle between the suction nozzle center r and the electronic component center p (the optimum reference center position in each component mounting) is measured. When it is detected, it is mounted after correcting it to a preset value.

For this measurement, a projection method onto the electronic component b using the laser unit 50 is generally known, and a set value specific to the mounted component in the control means and a measurement by the laser unit 50 are used. An appropriate correction amount (△ θ, △ X, △ Y) has been obtained by calculation with actual measured values of electronic components.

In this measurement, a so-called rectangular one whose plane shape is symmetrical with respect to the center p of a square or rectangular electronic component, which is a so-called rectangular one, is obtained by using the above-mentioned projection method.
As shown in the figure, the suction nozzle that is sucking the electronic component b is rotated by a predetermined angle △ θ in a certain direction, and during that time, the projection width of the electronic component b based on a signal from the laser unit 50 at every fixed minute rotation angle Is measured.

As a result, the projection width of the electronic component b when the projection width of the electronic component b is minimized (the state shown by the two-dot chain line in FIG. 1), the nozzle rotation angle △ θ, the projection center position, and the like are changed. Desired.

[0006] Then, based on these measurement data, the center position and the like of the electronic component b are obtained, and the correction amount of the electronic component mounting position according to the deviation of the component suction position is calculated.

However, in the electronic component b as shown in FIG. 4, that is, in a plane state in the X and Y directions, in the X or Y direction or the X and Y directions, In the case where the shape of the direction is asymmetrical, the shape of the electronic component is limited by the shape of the suction surface by the suction nozzle (the center of gravity may fluctuate or the nozzle suction may be removed). The center position cannot be set as the suction position by the suction nozzle.

For this reason, it is impossible to obtain the correction amount of the mounting position by the calculation using the suction position of the suction nozzle and the center position of the electronic component.

Therefore, in the art, there has been a strong demand for the appearance of a method capable of easily measuring a nozzle suction position and easily obtaining a correction amount based on the data when mounting an odd-shaped electronic component.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned demands, and recognizes, in advance, a distance from a center position of an electronic component to an optimum electronic component suction point as an offset value, and determines an electronic component from a reference point. By measuring only the distance to the end, when mounting electronic components, especially odd-shaped electronic components, the laser measuring means can easily and reliably calculate the correction amount of the suction position of the electronic components. It is an object of the present invention to provide a position correction amount calculation method.

[0011]

In order to achieve the above-mentioned object, the present invention provides a driving apparatus by numerical control that arbitrarily moves in the X, Y, and Z directions and arbitrarily rotates the Z axis. An electronic component mounting apparatus for picking up an electronic component from a supply unit by sucking and holding an upper flat portion of the electronic component by a suction nozzle and mounting the electronic component at a predetermined position on a printed circuit board positioned in a mounting unit. The side part of the electronic component held by suction is measured by a laser measuring means, and the coordinate value of the end position of the electronic component in the electronic component obtained by this measurement from a predetermined reference point, and a predetermined electronic component. A distance value from the end position of the component to the position of the optimum electronic component suction point is added to the data, and when the nozzle suction point of the electronic component deviates from the normal value, the data is calculated by using the data. The electronic component on the printed board X, Y
An electronic component mounting position correction amount calculating method for calculating the mounting position correction amount in the direction. In the first example, the electronic component is moved by an arbitrary nozzle in the X, Y, and Z directions by means of each driving means by numerical control, and the suction nozzle that arbitrarily rotates the Z axis is used to move the electronic component to the upper flat portion of the electronic component. Is taken out of the supply unit by sucking and holding, and in an electronic component mounting device to be mounted at a predetermined position on the printed circuit board positioned in the mounting unit,
In advance, the control unit sends a reference point coordinate value in the X direction, a coordinate value of each data of the electronic component, a coordinate value of an optimal electronic component suction point position of the electronic component, and an electronic component from the optimal electronic component suction point position coordinate value. A step of inputting each set value of the dimensional coordinate values up to the end position, a step of sucking and holding the electronic component by a suction nozzle, and a light emitting unit and a light receiving unit disposed at appropriate positions of the electronic component mounting apparatus. A step of irradiating a laser from a side of the electronic component to a light-receiving unit from a side of the electronic component while rotating the electronic component held by suction by a laser measuring unit; Detecting the projection width of the reference point and obtaining the minimum coordinate value of the end of the electronic component in the X and Y directions from the reference point coordinate value, and calculating the obtained minimum coordinate value and each of the set values. X of the electronic component to the substrate, in the electronic component mounting position correction amount calculating method which gave a step of calculating the mounting position correction amount in the Y direction.

In a second example, electronic components are arbitrarily moved in the X, Y, and Z directions by a driving means under numerical control, and the suction nozzles arbitrarily rotated about the Z axis. Take the upper flat part by suction and take it out of the supply part,
In the electronic component mounting device to be mounted at a predetermined position on the printed circuit board positioned in the mounting unit,
The control means sends a coordinate value of a reference point in the X direction, a coordinate value of each data of the electronic component, a coordinate value of an optimal electronic component suction point position of the electronic component, and an end of the electronic component based on the optimal electronic component adsorption point position coordinate value. A step of inputting each set value of the dimensional coordinate value up to the position, a step of sucking and holding the electronic component by a suction nozzle, and a laser measurement comprising a light emitting unit and a light receiving unit disposed at appropriate places of the electronic component mounting apparatus. Means for irradiating a laser from a side of the electronic component to a light-receiving portion from a side of the electronic component while rotating the electronic component held by suction by means, and projecting laser irradiation at the light-receiving portion. The width is detected and X from the reference point coordinate value is detected.
Or obtaining the minimum coordinate value of the end of the electronic component in the Y direction, and calculating the rotation angle amount of the electronic component when obtaining the minimum coordinate value of the end of the electronic component in the X or Y direction from the reference point coordinate value. Obtaining a correction position of the electronic component on the printed circuit board in the X and Y directions by calculating the minimum coordinate value, the rotation angle amount obtained in the step, and the respective set values. In the electronic component mounting position correction amount calculation method.

Further, the electronic component is formed in a plane shape in the X, Y direction, in the X direction, the Y direction, or the X, Y direction, and has a shape which is asymmetric in the left-right direction with respect to the center of the electronic component. Is done.

[0014]

Next, an embodiment of a method for calculating an electronic component mounting position correction amount according to the present invention will be described with reference to the drawings.

In FIGS. 1 and 2, W represents a chip component or I
This is an electronic component mounting apparatus that receives electronic components b such as C components from a supply unit m provided at an appropriate position of the main body 1, transfers the electronic components b to a mounting unit n, and mounts them at a plurality of appropriate positions at predetermined positions on a printed circuit board c.

The general structure is as follows: an advance / retreat body 3 which is driven by the advance / retreat means 2 and moves in the Y-axis direction (front-back direction); ) And a mounting head 6 having one or a plurality of the movable bodies 5 attached to the movable body 5.

A suction nozzle 7 for suction-holding the upper surface of the electronic component b is engaged with the mounting head 6 by a lifting means 8 so as to be able to move up and down, and a rotating means 9 moves the Z-axis (vertical axis) direction. It is rotatable as the center,
The advancing / retreating means 2, the moving means 4, the elevating means 8 and the rotating means 9 are operated by a numerically controllable servomotor or the like connected to the control means 10 so as to be positioned with high accuracy.

Before the electronic component mounting apparatus W mounts the electronic component, the electronic component b sucked by the suction nozzle 7 of the mounting head 6 is accurately mounted at a predetermined position on the printed circuit board c. The suction position and posture are measured in advance and quantified.
And the laser measuring means 11.

The control means 10 includes a laser measuring means 11
And controls the front / rear, left / right and up / down positions of the suction nozzle 7 in association with the above-mentioned respective means 2 and 4, 8, 9 and the like, and a conventional computer having a storage unit and a calculation unit is used. The program necessary for component mounting is input in advance.

That is, (1) the coordinate value of the reference point in the X direction, (2) the coordinate value of each data of the electronic component b,
Each set value such as (3) the coordinate value of the optimal electronic component suction point position in the electronic component b, and (4) the dimensional coordinate value from the coordinate value of the optimal electronic component suction point position to the end position of the electronic component is input. (See FIGS. 6 and 8).

The laser measuring means 11 comprises a light emitting body 12 and a light receiving body 13 provided so as to correspond to the electronic component b with the electronic component b interposed therebetween. A parallel laser beam emitted from a slit having a predetermined width in the luminous body 12 is received by a photoreceptor 13 composed of a CCD, by receiving a laser which is not blocked by the electronic part b. The projection width of b is detected.

Electronic component b used in the embodiment of the present invention
X, Y as shown in FIG. 3 and FIG.
Correction of the suction position of the electronic component b in the X direction or the Y direction or the X, Y direction in the horizontal state, and the shape in the left and right direction is asymmetrical with respect to the center position of the electronic component. It is effective for volume calculation.

Therefore, the method of the embodiment of the present invention uses the driving means 2 and 4, 8, 9 and the like by numerical control to set X,
The electronic component b is taken out from the supply unit m by the suction nozzle 7 that arbitrarily moves in the Y and Z directions and rotates the Z axis arbitrarily, while holding the upper flat part of the electronic component b by suction and holding the electronic component b. In the electronic component mounting apparatus W mounted at a predetermined position on the printed circuit board c positioned at
The side of the electronic component b sucked and held by the laser measuring means 1
1 and the electronic component end position coordinate value of the electronic component b obtained by this measurement from a predetermined reference point, and from the predetermined electronic component end position to the optimum electronic component suction point position. When the nozzle suction point of the electronic component b is displaced, the amount of correction of the mounting position of the electronic component b on the printed circuit board c in the X and Y directions is calculated by using the data. It is to be calculated.

The method of the first embodiment of the present invention will be described below in more detail. In particular, an example using an odd-shaped electronic component b as shown in FIGS. 3 and 4 will be described. .

In the embodiment of the present invention, the coordinate value of the reference point in the X direction, the coordinate value of each data of the electronic component b, the coordinate value of the optimal electronic component suction point position of the electronic component b, A step of inputting each set value from the coordinate value of the optimal electronic component suction point position to the dimension coordinate value from the electronic component end position (see FIG. 6), a step of sucking and holding the electronic component b by the suction nozzle 7, Electronic component mounting device W
While the electronic component b held by suction is rotated about the Z-axis by the laser measuring means 11 including the light emitting unit 12 and the light receiving unit 13 disposed at the appropriate positions, the light emitting unit is positioned from the side of the electronic component b. Irradiating the laser from the light source 12 to the light receiving unit 13, detecting the projection width of the laser irradiation in the light receiving unit 12, and calculating the minimum coordinate value of the end of the electronic component in the X and Y directions from the reference point coordinate value. And a step of calculating a mounting position correction amount of the electronic component b on the printed circuit board c in the X and Y directions by calculating the obtained minimum coordinate values and the respective set values.

In this variant electronic component b, there are four types (a, a, b) as shown in FIG. 5 depending on the direction at the time of suction by the suction nozzle 7 and the rotation direction of the sucked variant electronic component b in the measurement. b, c, d).

In each case, these odd-shaped electronic components b
Is measured during rotation in the range of
The mounting position correction amount (θC, △ X, △ Y) is obtained during the period from the adsorption of the odd-shaped electronic component b to the mounting.

In the case of the example shown in FIG. 5A, it is assumed that the odd-shaped electronic component b is sucked by the suction nozzle 7 at the position (posture) A, and the light emitting unit 12 and the light receiving unit are The measurement of the electronic component proceeds immediately, and the measurement signal is sent to the control means 10.

Then, the deformed electronic component b is rotated clockwise around the suction point WN by the suction nozzle 7 until the laser projection width on the deformed electronic component b becomes minimal (FIG. 5 ( The rotation angle amount θC (amount of correction in the rotation direction) until the position indicated by B in a) is actually measured.

Referring to FIG. 6 showing the details of the position B, the coordinate xW in the X-axis direction of the position of the optimum electronic component suction point is the distance xA from the reference point to the electronic component end position.
And the distance L / 2 from the end position of the electronic component to the center position of the electronic component, and the distance f from the center position of the electronic component to the position of the optimum electronic component suction point. That is, xW = xA + L / 2 + f = xA + g. From this, the correction amount ΔX in the X-axis direction is given by: ΔX = xN−xW = xN− (xA + L / 2 + f) = xN
− (XA + g) (f or g is a preset offset value).

Next, when the odd-shaped electronic component b is further rotated clockwise by 90 ° around the suction point WN by the suction nozzle 7, the position shown in FIG. 5 (a) becomes C and the position shown in FIG. 6 (b). The component attitude changes, and this state is measured by the laser measuring means 11.

The sum of the distance xB1 from the reference point to the one end position of the electronic component and the distance xB2 from the other end position is 1
/ 2 at the suction point WN by the suction nozzle 7
By subtracting from the axial coordinate xN, the correction amount ΔY in the Y-axis direction is obtained.

That is, ΔY = yN−yW = xN− (xB1 + xB2) / 2 can be obtained. In this example, the minimum coordinate values obtained easily and the respective set values are calculated. It is possible to calculate the mounting position correction amount of the electronic component b in the X and Y directions on the printed circuit board c.

Next, FIG. 7 shows a second embodiment method, and the operation will be described with reference to FIG.

In this embodiment, the coordinate value of the reference point in the X direction and the electronic component b
, Coordinate values of the optimal electronic component suction point position in the electronic component b, and dimensional coordinate values from the optimal electronic component suction point position coordinate value to the electronic component end position are input. The step (see FIG. 8), the step of sucking and holding the electronic component b by the suction nozzle 7, and the laser measuring means 11 including the light emitting unit 12 and the light receiving unit 13 arranged at appropriate positions of the electronic component mounting apparatus W, A step of irradiating a laser from the side of the electronic component b toward the light receiving unit 13 from the side of the electronic component b while rotating the suction-held electronic component b around the Z axis; Detecting the width and obtaining the minimum coordinate value of the end of the electronic component in the X or Y direction from the coordinate value of the reference point, and the minimum coordinate of the end of the electronic component in the X or Y direction from the coordinate value of the reference point value A step of obtaining the rotation angle θC of the electronic component b when the electronic component b is obtained, and calculating the minimum coordinate value, the rotation angle θC, and each of the set values obtained in the above-described step, thereby obtaining the electronic component b on the printed circuit board c. Calculating the amount of correction of the mounting position in the X and Y directions.

More specifically, first, the odd-shaped electronic component b
As shown in FIG. 7, it is assumed that suction is performed by the suction nozzle 7 in an inclined posture, and the deformed electronic component b is caused to correspond between the light emitting unit 12 and the light receiving unit 13 in the laser measuring unit 11. The part measurement proceeds immediately, and the measurement signal is sent to the control means 10.

Then, the deformed electronic component b is rotated counterclockwise around the suction point WN by the suction nozzle 7 until the laser projection width on the deformed electronic component b becomes minimal (FIG. 8). Rotation angle amount θ until it reaches the position shown in
C (correction amount in the rotation direction) is actually measured.

More specifically (see FIG. 8), the coordinate xC in the X-axis direction of the optimum electronic component suction point position is calculated from the distance xA from the reference point to the electronic component end position and the electronic component end position. It is obtained by the sum of the distance L / 2 to the electronic component center position and the distance f from the electronic component center position to the optimum electronic component suction point position.

That is, xW = xA + L / 2 + f = xA + g. From this, the correction amount ΔX in the X-axis direction is: ΔX = xN−xW = xN− (xA + L / 2 + f) = xN
− (XA + g) (f or g is a preset offset value).

Next, the correction amount ΔY in the Y-axis direction is obtained by the calculation based on the above measured data.

That is, as shown in FIG. 9, the optimum electronic component suction point (xG, yG) when the odd-shaped electronic component b is sucked by the suction nozzle 7 is rotated by θC about the nozzle suction point (xN, yN). At this time, since the coordinates of the optimal electronic component suction point are (xC, yC), xC = xGcosθC−yGsinθC (1) yC = xGsinθC + yGcosθC (2)

From FIG. 9, xC = xA + L / 2 + f = xA + g (3) xG = x1-1 / 2 (L2cos θC + L1 sin θC) (4)

By substituting these equations (3) and (4) into the above equation (1), xA + g = {x1-1 / 2 (L2cosθC + L1sinθC)} cosθC-yGsinθC yG = 1 / sinθC ｛x1-1 / 2 (L2cosθC + L1sinθC )｝ Cos θC-1 / sin θC (xA + g) (5)

Therefore, the equations (4) and (5) are replaced by the equation (2)
Substituting into, yC = {x1-1 / 2 ( L2cosθC + L1sinθC)} sinθC + cos 2 θC / sinθC {x1-1 / 2 (L2cosθC + L1sinθC)} - cosθC / sinθC (xA + g) = 1 / sinθC {x1sin 2 θC-1 / ² sin ² θC (L2cos θC + L1 sin θC) + x1cos ² θC− ／ cos ² θC (L2cos θC + L1 sin θC) −cos θC (xA + g)｝ = 1 / sin θC ｛x1-1 / 2 (L2cos θC + L1 sin θC) × cos-co.

Therefore, the correction amount ΔY in the Y-axis direction is expressed as follows: ΔY = yN−yC = yN−1 / sin θC ｛x1-1 /
2 (L2cosθC + L1sinθC) −cosθC
(XA + b)｝.

Therefore, even for the odd-shaped electronic component b,
In the mounting, the correction amount can be easily obtained based on the measurement of the nozzle suction position and the data.

[0047]

As described above, according to the electronic component mounting position correction amount calculating method of the present invention, when the electronic component b is in a plane state in the X and Y directions, the electronic component b is in the X or Y direction or the X and Y directions.
Even if the shape in the left-right direction is asymmetrical with respect to the center of the electronic component, the distance from the center position of the electronic component to the optimal electronic component suction point (or the electronic component By setting the distance from the end to the optimum electronic component suction point) as an offset value, a special effect is obtained in which the mounting position correction amount (△ X, △ Y) can be easily obtained.

[Brief description of the drawings]

FIG. 1 is a plan view schematically showing an embodiment of an electronic component mounting apparatus adopting an electronic component mounting position correction amount calculating method according to the present invention.

FIG. 2 is a side view showing a main part of the mounting device in FIG.

FIG. 3 is a perspective view schematically showing a measurement state of the electronic component in FIG.

FIG. 4 is a perspective view showing an electronic component measured in FIG.

FIG. 5 is an explanatory view showing a first example of a measurement state of an electronic component employed in the method of the embodiment of the present invention.

FIG. 6 is an explanatory diagram showing the measurement state in FIG. 5 in more detail;

FIG. 7 is an explanatory diagram showing a second example of a measurement state of an electronic component employed in the method of the embodiment of the present invention.

FIG. 8 is an explanatory diagram illustrating a measurement state of the electronic component in FIG. 7;

FIG. 9 is an explanatory diagram further describing a measurement state of the electronic component in FIG. 7;

FIG. 10 is an explanatory diagram illustrating a conventional method of calculating a mounting position correction amount of an electronic component.

[Explanation of symbols]

 b Electronic component c Printed circuit board m Supply unit n Mounting unit 7 Suction nozzle 10 Control unit 11 Laser measurement unit 12 Light emitting unit 13 Light receiving unit

Claims (4)

[Claims] 1. X,
The electronic component is removed from the supply unit by suction and holding the upper flat part of the electronic component by a suction nozzle that arbitrarily moves in the Y and Z directions and rotates the Z axis arbitrarily, and the print positioned in the mounting unit. In an electronic component mounting device to be mounted at a predetermined position on a substrate, a side portion of an electronic component sucked and held by a suction nozzle is measured by a laser measuring unit, and obtained by this measurement from a predetermined reference point. An electronic component end position coordinate value of the electronic component and a distance value from a predetermined electronic component end position to an optimum electronic component suction point position are added to generate data, and a normal value is set for a nozzle suction point of the electronic component. When the displacement occurs, an X and Y direction mounting position correction amount of the electronic component on the printed circuit board is calculated by calculation with the data. Method. 2. Each of the driving means by numerical control controls X,
The electronic component is removed from the supply unit by suction and holding the upper flat part of the electronic component by a suction nozzle that arbitrarily moves in the Y and Z directions and rotates the Z axis arbitrarily, and the print positioned in the mounting unit. In an electronic component mounting device to be mounted at a predetermined position on a substrate, the control unit in advance sends a coordinate value of a reference point in the X direction, a coordinate value in each data of the electronic component, and an optimal electronic component suction point position in the electronic component. Inputting each set value of coordinate values and dimensional coordinate values from the optimum electronic component suction point position coordinate value to the electronic component end position; a step of sucking and holding the electronic component by a suction nozzle; While the electronic component held by suction is rotated about the Z-axis, the electronic component is emitted from a side of the electronic component by laser measuring means including a light emitting unit and a light receiving unit disposed at an appropriate position of the mounting device. Irradiating the laser from the part to the light receiving part; detecting the projection width of the laser irradiation in the light receiving part to obtain the minimum coordinate value of the end of the electronic component in the X and Y directions from the reference point coordinate value An electronic component, comprising: calculating a correction amount of a mounting position of the electronic component on the printed circuit board in the X and Y directions by calculating the obtained minimum coordinate value and each of the set values. Mounting position correction amount calculation method. 3. Each of the driving means by numerical control controls X,
The electronic component is removed from the supply unit by suction and holding the upper flat part of the electronic component by a suction nozzle that arbitrarily moves in the Y and Z directions and rotates the Z axis arbitrarily, and the print positioned in the mounting unit. In an electronic component mounting device to be mounted at a predetermined position on a substrate, the control unit in advance sends a coordinate value of a reference point in the X direction, a coordinate value in each data of the electronic component, and an optimal electronic component suction point position in the electronic component. Inputting each set value of coordinate values and dimensional coordinate values from the optimum electronic component suction point position coordinate value to the electronic component end position; a step of sucking and holding the electronic component by a suction nozzle; While the electronic component held by suction is rotated about the Z-axis, the electronic component is emitted from a side of the electronic component by laser measuring means including a light emitting unit and a light receiving unit disposed at an appropriate position of the mounting device. Irradiating the laser from the part to the light receiving part; detecting the projection width of the laser irradiation in the light receiving part to obtain the minimum coordinate value of the end of the electronic component in the X or Y direction from the reference point coordinate value A step of obtaining a rotation angle amount of the electronic component when obtaining a minimum coordinate value of the end of the electronic component in the X or Y direction from the reference point coordinate value; and a step of obtaining the minimum coordinate value and rotation obtained in the step. By calculating the angle amount and the respective set values, X, X,
Calculating a correction amount of the mounting position in the Y direction. 4. The electronic component has an irregular shape in a plane state in the X, Y direction, in the X direction, the Y direction, or the X, Y direction, wherein the shape in the left-right direction is asymmetric with respect to the center of the electronic component. 4. The method according to claim 1, wherein the electronic component mounting position correction amount is calculated.