JPH1154273A - Color conversion filter and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a color conversion filter which improves the light-shielding property of a light-shielding layer, of which a surface is flattened with high accuracy, and which is used for forming a multicolor luminous device superior in the display performance and free of display defects, and an effective manufacturing method thereof. SOLUTION: In a color conversion filter where a light-shielding layers 2 and the color-converting layers 3 including at least one kind of fluorescent layer, and alternately and repeatedly mounted in flat on a light-transmitting base 1 in a condition that they are separated from each other, for separating and/or converting the light generation from an emitter, and the light-shielding layer 2 comprises a first light-shielding layer 21 for shielding the light generation from the emitter and the color converting layer, and a second light shielding layer 22 stacked on at least one of an upper face and a lower face of the first light-shielding layer 21, for compensating the light-shielding performance of the first light shielding layer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a color conversion filter and a method for manufacturing the same. For more details,
The present invention relates to a color conversion filter preferably used in general for color displays such as consumer and industrial display devices such as displays for personal computers, portable information devices such as displays for portable computers, portable telephones, pagers, etc. .

[0002]

2. Description of the Related Art Electronic display devices are commonly referred to as ma.
Various devices (m
a variety of information from humans (m
An) electronic device that communicates to a person and plays an important bridging interface between humans and equipment. This electronic device includes a light emitting type and a light receiving type. As the light emitting type, for example, a CRT (cathode ray tube), P
DP (plasma display), ELD (electroluminescence display), VFD (fluorescent display tube),
LED (light emitting diode) and the like. On the other hand, as a light receiving type, for example, LCD (liquid crystal display), E
CD (electrochemical display), EPID
(Electrophoretic display), SPD (dispersed particle oriented display), TBD (colored particle rotating display), PLZT (transparent ferroelectric PLZT [(Pb, L
a) (Zr, Ti) O ₃ ] ceramic display).

[0003] Here, as a method for full-color electronic display devices, a multicolor (for example, three primary colors of red, blue, and green) luminous bodies are separately arranged in a plane, and each luminous body emits light. Is received by a color conversion filter composed of a plurality of different color conversion layers (for example, color filters or phosphors), and is separated and / or converted to emit different light. In particular, the latter method has a configuration in which the luminous body and the color conversion filter are juxtaposed or overlapped. Here, as shown in FIG. 9, the color conversion filter has a configuration in which a light-shielding layer 2 and one or more types of color conversion layers 3 are alternately and separately arranged in a plane on a light-transmitting substrate 1. In general, each color conversion layer receives light from the light emitter 4 and can be separated and / or converted to emit different light. Here, the term "decomposition" means that a part of the luminescence of the luminous body is cut and a part of the luminescence is extracted, and a normal color filter has the function. On the other hand, the conversion means that the light emitted from the light emitter is changed to another light emission (light having a longer wavelength) and extracted, and a normal phosphor has the function. Requirements necessary for the color conversion filter include a high light-shielding property of the light-shielding layer and an improvement in flatness of the surface of the color conversion filter. If the light-shielding property of the light-shielding layer is low, as shown in FIG. 10, unnecessary leakage light mainly from the luminous body (and, in some cases, the color conversion layer) cannot be shielded, so that the viewing angle dependency of the color display is reduced. In this case, the visibility is reduced due to the color mixture. Here, the light shielding property of the light shielding layer is 400 wavelengths in the visible region.
It can be evaluated how much light of up to 700 nm is transmitted. Usually, the light amount of 100 to 400 nm is 100
On the other hand, the transmission amount is preferably 1 or less (transmittance 1% or less). The flatness of the surface of the color conversion filter is
This is important when illuminants are stacked on a color conversion filter. Here, the flatness means a difference in film thickness between the light shielding layer and each color conversion layer, that is, unevenness. If the irregularities are large, the luminous bodies cannot be laminated properly. That is, in the case of an electroluminescence display (ELD), as shown in FIG. 11, the fine electrodes 41 of the luminescent organic EL element 4 are laminated on the color conversion filter. Fine electrode 41 of EL element 4
Is disconnected or short-circuited, and the display cannot be displayed without any defect. The surface roughness of the filter is preferably 2.0 μm or less, more preferably 1.0 μm or less, and even more preferably 0.5 μm or less. A conventional color conversion filter is disclosed in
Japanese Patent Application Laid-Open No. 258860 discloses an example in which a fluorescent medium is arranged so as to be able to receive light emitted from an organic EL element. Japanese Patent Application Laid-Open No. Sho 64-40888 discloses a color display in which an organic EL element and a color filter are opposed to each other. It was unclear. On the other hand, a number of flattening color conversion filters have been disclosed in the field of liquid crystal color filters, and in particular, Japanese Patent Application Laid-Open Nos. 5-173013 and 5-181.
No. 009 and the like disclose a method of flattening a color filter by back exposure of a color resist.
However, since the light-shielding layer is not used as a mask,
There has been a problem that leakage of ultraviolet light at the time of exposure occurs and unnecessary filter residues remain, or the accuracy of a desired filter pattern deteriorates.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems. The present invention improves the light-shielding properties of a light-shielding layer and flattens the surface thereof with high precision, thereby achieving excellent display performance. It is an object of the present invention to provide a color conversion filter for constructing a multicolor light emitting device with few defects and an efficient manufacturing method thereof.

[0005]

According to the present invention, there is provided a color conversion filter having the following features and a method of manufacturing the same. [1] A light-shielding layer and a color conversion layer including one or more kinds of phosphor layers are alternately and alternately and separately arranged in a plane on a light-transmitting substrate. In the color conversion filter to be converted, the light-shielding layer is provided on at least one of the first light-shielding layer for shielding light emitted from the light-emitting body and / or the color conversion layer, and the upper surface or the lower surface of the first light-shielding layer. And a second light-shielding layer for supplementing the light-shielding property of the first light-shielding layer. [2] The color conversion filter according to [1], wherein the second light-shielding layer contains a metal material. [3] The color conversion filter according to [1] or [2], wherein the luminous body is an organic EL element. [4] A multicolor light emitting device comprising the color conversion filter according to [1] or [2] and an organic EL element. [5] A light-shielding layer and a color conversion layer including one or more kinds of phosphor layers are alternately and alternately and planarly separated on a light-transmitting substrate. A method of manufacturing a color conversion filter for converting, comprising the following steps (A) to (C). (A) A first light-shielding layer for shielding light emitted from a light-emitting body and / or a color conversion layer is planarly patterned and separately arranged on a light-transmitting substrate, and an upper surface of the first light-shielding layer or A second light-shielding layer for supplementing the light-shielding property of the first light-shielding layer is provided on at least one of the lower surface and the light-transmitting substrate. (B) The second light-shielding layer provided on the light-transmitting substrate is selectively removed by etching. (C) A photo-curable color conversion layer forming material is formed so as to fill the gap between the first light-shielding layers. [6] A light-shielding layer and a color conversion layer including one or more types of phosphor layers are alternately and alternately and planarly separated on a light-transmitting substrate. A method of manufacturing a color conversion filter for converting, comprising the following steps (A) to (F). (A) A first light-shielding layer for shielding light emitted from a light-emitting body and / or a color conversion layer is planarly patterned and separately arranged on a light-transmitting substrate, and an upper surface of the first light-shielding layer or A second light-shielding layer for supplementing the light-shielding property of the first light-shielding layer is provided on at least one of the lower surface and the light-transmitting substrate. (B) The second light-shielding layer provided on the light-transmitting substrate is selectively removed by etching. (C) A photo-curable color conversion layer forming material is formed so as to fill the gap between the first light-shielding layers. (D) Exposure is performed from the light-transmitting substrate side, and the photocurable color conversion layer forming material is selectively photocured to form one type of color conversion layer. (E) The unexposed portions of the color conversion layer forming material are removed. (F) Steps (B) to (E) are repeated as many times as necessary according to the number of types of color conversion layers. [7] In the step (A), the first light-shielding layer is two-dimensionally patterned and separately arranged on the light-transmitting substrate, and then the second light-shielding layer is formed on the upper surface of the first light-shielding layer and on the light-transmitting substrate. The method of manufacturing a color conversion filter according to [5] or [6], wherein [8] In the step (A), after the second light-shielding layer is laminated and provided on the entire surface of the light-transmitting substrate, the first light-shielding layer is patterned and separated in a plane on the second light-shielding layer. The method for producing a color conversion filter according to [5] or [6], wherein the color conversion filter is arranged. [9] In the step (A), after the second light-shielding layer is laminated and provided on the entire surface of the light-transmitting substrate, the first light-shielding layer is planarly patterned and separated on the second light-shielding layer. Then, a second light-shielding layer is further laminated on the upper surface of the first light-shielding layer and the second light-shielding layer provided on the light-transmitting substrate [5].
Or the method for manufacturing a color conversion filter according to [6]. [10] In the step (A), after the second light-shielding layer is two-dimensionally patterned and separately arranged on the light-transmitting substrate, the first light-shielding layer is alternated with the second light-shielding layer on the light-transmitting substrate. The method for producing a color conversion filter according to [5] or [6], wherein the color conversion filter is patterned and separated and arranged in a plane such that [11] In the step (A), after the second light-shielding layer is two-dimensionally patterned and separately arranged on the light-transmitting substrate, the first light-shielding layer is alternated with the second light-shielding layer on the light-transmitting substrate. It is patterned and separated in a plane so as to be arranged, and then, on the upper surface of the first light-shielding layer, and on the second light-shielding layer provided on the light-transmitting substrate, a second light-shielding layer is further laminated. The method for manufacturing a color conversion filter according to [5] or [6], wherein the color conversion filter is provided.

[0006]

Embodiments of the present invention will be specifically described below with reference to the drawings. I. Color conversion filter Configuration As shown in FIG. 1, the color conversion filter according to the present invention is such that a light-shielding layer 2 and a color conversion layer 3 including at least one kind of phosphor layer are alternately and repeatedly formed on a transparent substrate 1 in a planar manner. A light-shielding layer 21 for shielding light emitted from a light-emitting body and / or a color conversion layer;
1 is a light-shielding layer of a first light-shielding layer disposed on at least one of the upper surface and the lower surface, that is, the upper surface (FIG. 1A), the lower surface (FIG. 1B), or the upper and lower surfaces (FIG. 1C). It has a second light-shielding layer 22 for supplementing the characteristics. The thus configured color conversion filter of the present invention can effectively decompose and / or convert light emitted from a luminous body, for example, an organic EL element. Further, as shown in FIG. 2, even if the first light-shielding layer 21 has a low light-shielding property (wavelength 400
Even if the transmittance exceeds 1% at ~ 700 nm), the second light-blocking layer 22 can supplement the light-blocking property, so that the light-blocking property of the light-blocking layer is enhanced, and for example, unnecessary leakage light from the light-emitting body 4 is reduced. It can fully shield light. As a result, the viewing angle dependency of a full-color display (multicolor light-emitting device) can be eliminated, and a decrease in visibility due to color mixing can be avoided. In particular, when the first light-shielding layer becomes a thick film and further increases the definition, it is necessary to form the light-shielding layer by a photolithography method.
If the light-shielding layer has a high light-shielding property, light becomes difficult to transmit, so that it is difficult to increase the thickness and the definition of the light-shielding layer. Therefore, the light-shielding property of the light-shielding layer is reduced to increase the thickness and the definition of the light-shielding layer. At this time, it is very significant to arrange the second light-shielding layer to supplement the light-shielding property of the light-shielding layer. . In the present invention, the color conversion layer includes a phosphor layer. Since the phosphor layer needs a thick film unlike a normal color filter as described later, the light shielding layer has to be a thick film in order to flatten the surface of the color conversion filter. Therefore, it is meaningful to arrange the second light shielding layer for the above reason. The second light-shielding layer is preferably a layer containing a metal material having high light-shielding properties and excellent workability such as etching. Also, as a luminous body,
Organic EL elements are preferred. The organic EL element has high visibility due to planar self-emission, and is completely solid,
It has a feature of excellent impact resistance, and various EL devices using an inorganic or organic compound for a light emitting layer are currently being developed. Among them, an organic EL element is a display in which an organic compound is sandwiched between two electrodes, and is expected to be a display that has a variety of organic compounds and emits light of various colors with high efficiency and high luminance. Further, a multicolor light emitting device can be provided by combining the color conversion filter of the present invention and an organic EL element.

[0007] 2. Each component Hereinafter, the color conversion filter of the present invention will be specifically described for each component. (1) Translucent Substrate The translucent substrate used in the present invention is a substrate that supports a multicolor light-emitting device. preferable. Specific examples include a glass plate and a polymer plate. Examples of the glass plate include soda lime glass, barium / strontium-containing glass, lead glass, aluminosilicate glass, borosilicate glass, barium borosilicate glass, and quartz. Examples of the polymer plate include polycarbonate, acrylic, polyethylene terephthalate, polyether sulfide, and polysulfone.

(2) Color Conversion Layer The color conversion layer used in the present invention includes a phosphor layer, but may also include a color filter that separates (or cuts) light from the luminous body to adjust the color. Good. The phosphor layer and the color filter can be formed from a predetermined color conversion layer forming material.

The phosphor layer is composed of, for example, a fluorescent dye and a resin, or a fluorescent dye alone, and a layer composed of the fluorescent dye and the resin is prepared by dissolving or dispersing the fluorescent dye in a pigment resin and / or a binder resin. Can be mentioned. A specific fluorescent dye will be described. First, 1,4-bis (2-methylstyryl) benzene (hereinafter referred to as Bis-MS) is used as a fluorescent dye that converts light emitted from a violet light-emitting member into blue light from near-ultraviolet light.
B), stilbene-based dyes such as trans-4,4'-diphenylstilbene (hereinafter DPS), 7-hydroxy-4
And coumarin-based dyes such as -methyl coumarin (hereinafter coumarin 4).

Next, with respect to a fluorescent dye which converts light emitted from a blue, blue-green or white light-emitting member to green light, for example, 2,3,5,6-1H, 4H-tetrahydro-8-
Trifluoromethylquinolizino (9,9a, 1-gh) coumarin (hereinafter coumarin 153), 3- (2'-benzothiazolyl) -7-diethylaminocoumarin (hereinafter coumarin 6), 3- (2'-benzimidazolyl) -7-N,
Coumarin dyes such as N-diethylaminocoumarin (hereinafter, coumarin 7) and other coumarin dye-based dyes include Basic Yellow 51, and naphthalimide dyes such as Solvent Yellow 11 and Solvent Yellow 116.

A fluorescent dye that converts light emission from a blue-to-green or white light-emitting member to light emission from orange to red is, for example, 4-dicyanomethylene-2-methyl-6- (p- Dimethylaminostillyl)
Cyanine dyes such as -4H-pyran (hereinafter DCM);
-Ethyl-2- (4- (p-dimethylaminophenyl)
Examples thereof include pyridine dyes such as -1,3-butadienyl) -pyridinium-perchlorate (hereinafter, pyridine 1), rhodamine dyes such as rhodamine B and rhodamine 6G, and oxazine dyes.

Further, various dyes (direct dyes, acid dyes,
Basic dyes, disperse dyes, etc.) can also be selected as long as they have fluorescence. Further, the fluorescent dye is a polymethacrylic acid ester, polyvinyl chloride, vinyl chloride vinyl acetate copolymer, alkyd resin, aromatic sulfonamide resin,
It may be kneaded in advance into a pigment resin such as a urea resin, a melamine resin, or a benzoguanamine resin to form a pigment.

[0013] These fluorescent dyes or pigments may be used alone or as a mixture, if necessary.

On the other hand, the binder resin is preferably a transparent material (having a light transmittance of 50% or more in the visible light region). For example, transparent resins (polymers) such as polymethyl methacrylate, polyacrylate, polycarbonate, polyvinyl alcohol, polyvinyl pyrrolidone, hydroxyethyl cellulose, and carboxymethyl cellulose are exemplified.

In addition, a photosensitive resin to which a photolithography method can be applied in order to separate and arrange the phosphor layers in a plane is also selected. This material is used in the manufacturing method of the present invention. For example, a photocurable resist material having a reactive vinyl group such as an acrylic acid type, a methacrylic acid type, a polyvinyl cinnamate type, and a ring rubber type may be used. When a printing method is used, a printing ink (medium) using a transparent resin is selected. For example, polyvinyl chloride resin, melamine resin, phenol resin, alkyd resin, epoxy resin, polyurethane resin, polyester resin, maleic acid resin, polyamide resin, oligomer, polymer,
Transparent resins such as polymethyl methacrylate, polyacrylate, polycarbonate, polyvinyl alcohol, polyvinyl pyrrolidone, hydroxyethyl cellulose, and carboxymethyl cellulose can be used.

When the phosphor layer is mainly composed of a fluorescent dye,
A film is formed by a vacuum evaporation or sputtering method via a mask of a desired phosphor layer pattern.On the other hand, when a fluorescent dye and a resin are used, the fluorescent dye, the resin and an appropriate solvent are mixed, dispersed or solubilized. Liquid, spin coat,
It is common to form a film by a method such as roll coating, bar coating, or a casting method, and pattern it with a desired phosphor layer pattern by a photolithography method, or pattern it with a desired phosphor layer pattern by a method such as screen printing. It is.

The thickness of the phosphor layer is not limited as long as it does not interfere with the function of sufficiently receiving (absorbing) the light emitted from the organic EL element and generating fluorescence, but it is 10 nm to 1 mm, preferably 1 μm to 1 mm, more preferably 10 μm to 10
A thickness of 0 μm generally requires a thicker film than a color filter. Fluorescent dyes are more sensitive to concentration than color filter dyes, and they are more fluorescent when dispersed or solubilized at a lower concentration in a pigment resin or binder resin. Therefore, an absorbance equivalent to that of a color filter is required. Therefore, according to Lambert-Beer's law (Equation 1), if the extinction coefficient of the dye is kept constant, it is preferable that the phosphor layer eventually becomes a thick film. The concentration of the fluorescent dye in the phosphor layer including the pigment resin and / or the binder resin varies depending on the fluorescent dye, but is 1 to 10 ⁻⁴ m
ol / kg, preferably 0.1 to 10 ^-3 mol / kg,
More preferably, it is 0.05 to 10 ^-2 mol / kg.

Lambert-Beer's law A = εcl (Equation 1) A: Absorbance ε: Absorption coefficient (specific to dye) c: Dye concentration l: Film thickness Then, unevenness of the surface of the color conversion layer on the luminous body side is flattened. In this case, it is advantageous to make the thickness of each color conversion layer (phosphor layer or color filter layer) uniform, so that the thickness of each color conversion layer is preferably 10 μm or more in consideration of fluorescence.

On the other hand, as the color filter layer, for example, the following dyes alone or a solid state in which the dyes are dissolved or dispersed in a binder resin can be exemplified.

Red (R) dyes: Perylene pigments, lake pigments, azo pigments, quinacridone pigments, anthraquinone pigments, anthracene pigments, isoindoline pigments, isoindolinone pigments and the like, and at least two or more types Mixture of

Green (G) dye: a single product of at least two halogen-substituted phthalocyanine-based pigments, halogen-substituted copper phthalocyanine-based pigments, triphenylmethane-based basic dyes, isoindoline-based pigments, and isoindolinone-based pigments; Mixture of

Blue (B) dye: copper phthalocyanine pigment, indanthrone pigment, indophenol pigment,
Single products such as cyanine pigments and dioxazine pigments and mixtures of at least two or more

As the binder resin, the same material as the phosphor layer can be selected. Also, the same material as the phosphor layer can be selected for the binder resin necessary for arranging the color filters in a planar manner.

In particular, when the color filter is mainly composed of a dye, or when the color filter is composed of a pigment and a binder resin, patterning can be performed in the same manner as the phosphor layer.

When the color filter is composed of a dye and a binder resin, the concentration of the dye may be within a range in which the color filter can be patterned without any problem and the emission of the organic EL element can be sufficiently transmitted. Generally, depending on the type of the dye, the color filter film including the binder resin used contains the dye in an amount of 1 to 50% by weight.

(3) Light-Shielding Layer The light-shielding layer of the present invention has a first light-shielding layer and a second light-shielding layer. The first light-shielding layer is interposed between the color conversion layers of the color conversion filter (embedded between the color conversion layers) to shield light emitted from the luminous body and / or the color conversion layer, and has a viewing angle dependence. Build a full-color display with no visibility and good visibility. The second light-shielding layer is disposed on the upper surface and / or the lower surface of the first light-shielding layer in order to supplement the light-shielding property of the first light-shielding layer. The second light-shielding layer is used as a manufacturing photomask for flattening the surface of the color conversion filter and constructing a full-color display with few defects. The first light-shielding layer is, in particular, a solid state in which a black pigment or a metal material is dissolved or dispersed in a binder resin similar to that used for the color conversion layer, and the one patterned by the same method as the color conversion layer is used. To be elected. Since it is embedded in the gap between each color conversion layer, a thick film is generally required.

On the other hand, as the second light-shielding layer, a thin film of a metal or an alloy, or a metal oxide, nitride, sulfide, sulfate or the like is particularly used to supplement the light-shielding property of the first light-shielding layer. The patterning is performed by the same method as that for the color conversion layer. However, a material that becomes a photomask in manufacturing for planarizing the surface of the color conversion filter and that can be easily removed by etching or the like is preferable.

The first light shielding layer is interposed between the respective color conversion layers,
A light-emitting element and / or a light-emitting element from a color conversion layer are shielded from light to construct a full-color display with good visibility without dependence on viewing angle. However, since the first light-shielding layer alone may still have insufficient light-shielding properties, the second light-shielding layer may be provided on the upper surface and / or lower surface of the first light-shielding layer to compensate for the light-shielding properties of the first light-shielding layer. Two light shielding layers are arranged. As a result, it is possible to provide a color conversion filter for constructing a full-color display having good visibility without dependence on viewing angle. In addition, the second light-shielding layer is a temporary (easy to remove) in manufacturing for flattening the surface of the color conversion filter and constructing a full-color display with few defects.
Acts as a photomask.

The thickness of the first light-shielding layer is 10 nm to 1 mm, preferably 1 μm to 1 mm, more preferably 10 μm to 1 mm.
However, as described above, when the color conversion layer is made of a phosphor, a thicker film is required as compared with the case of a color filter, and the thickness of the color conversion layer and the first light-shielding layer are made uniform and flattened. For this purpose, the thickness of the first light-shielding layer is also preferably 10 μm or more. The thickness of the second light-shielding layer is 1 nm to 100 μm, preferably 10 nm to 10 μm, more preferably 100 nm to 100 μm.
1 μm, and may be thinner than the first light shielding layer. Further, the surface shape of the first and second light-shielding layers may be a lattice shape or a stripe shape. However, when the color conversion layer is a phosphor layer, light leakage from the phosphor layer side surface is remarkable, so that the lattice shape is more. preferable. The cross-sectional shape of the first and second light-shielding layers is usually rectangular, but may be inverted trapezoidal or T-shaped.

The transmittance of the first light-shielding layer is not more than 10% in a region where light of the light emitting member or light from the color conversion layer (particularly, the phosphor layer) is emitted, that is, light in a visible region having a wavelength of 400 nm to 700 nm. , And more preferably 1% or less. If it exceeds 10%, light from the light emitting member or light from the color conversion layer leaks, causing color shift (color mixing) of the multicolor light emitting device, and the viewing angle characteristics also deteriorate. If necessary, at least the side surface of the light-shielding layer may be made reflective. The transmittance of the second light-shielding layer may be the same as that of the first light-shielding layer. However, since the second light-shielding layer also functions as a photomask by exposure to ultraviolet light, the wavelength needs to have the same transmittance even in the range of usually 250 nm to 400 nm. .

Next, specific materials for the first and second light-shielding layers include, for example, the following metals and black pigments. The types of metals include Ag, Al, Au,
Cu, Fe, Ge, In, K, Mg, Ba, Na, N
i, Pb, Pt, Si, Sn, W, Zn, Cr, Ti,
One or more metals or alloys such as Mo, Ta, stainless steel and the like can be mentioned. Further, oxides, nitrides, sulfides, nitrates, sulfates, and the like of the above metals may be used, and carbon may be contained as necessary.

The above materials are prepared by sputtering, vapor deposition, C
A film is formed on a desired substrate by a method such as a VD method, an ion plating method, an electrodeposition method, an electroplating method, and a chemical plating method, and is patterned by a photolithography method or the like. A pattern (separately arranged in a plane) can be formed.

Examples of the black pigment include carbon black, titanium black, aniline black, and a black pigment obtained by mixing the above color filter pigments. These black pigments or the metal materials are dissolved or dispersed in the binder resin used in the color conversion layer to form a solid state, and the pattern is formed in the same manner as the color conversion layer to mainly form the pattern of the first light-shielding layer. .

(4) Light Emitting Element The light emitting element used in the present invention is an organic EL element,
It is preferable because it is thin, emits light from the surface, and can emit various colors of light with high efficiency and high brightness because of a wide variety of organic compounds. However, light sources for inorganic EL, LED, VFD, PDP, and LCD in some cases Can be used. The organic EL element has at least a recombination region and a light-emitting region as an organic material layer. Since the recombination region and the light-emitting region are usually present in the light-emitting layer, in the present invention, only the light-emitting layer may be used as the organic material layer.
An electron injection layer, an organic semiconductor layer, an electron barrier layer, an adhesion improving layer, and the like can also be used.

Next, a typical configuration example of the organic EL device used in the present invention will be described. Of course, it is not limited to this. Anode / light-emitting layer / cathode anode / hole-injection layer / light-emitting layer / cathode anode / light-emitting layer / electron injection layer / cathode anode / hole-injection layer / light-emitting layer / electron injection layer / cathode anode / organic semiconductor layer / light-emitting layer / Cathode anode / organic semiconductor layer / electron barrier layer / emission layer / cathode anode / hole injection layer / emission layer / adhesion improving layer / cathode. Among these, a normal configuration is preferably used.

(4) -1. Anode For the anode, a metal with a large work function (4 eV or more)
Those using an alloy, an electrically conductive compound or a mixture thereof as an electrode material are preferably used. Specific examples of such an electrode material include metals such as Au, CuI, ITO,
Conductive materials such as SnO ₂ and ZnO can be used. The anode can be manufactured by forming a thin film from these electrode substances by a method such as an evaporation method or a sputtering method. When light emitted from the light emitting layer is extracted from the anode in this manner, it is preferable that the transmittance of the anode with respect to the light emission be greater than 10%. The sheet resistance of the anode is several hundred Ω.
/ □ or less is preferred. The thickness of the anode depends on the material, but is usually selected in the range of 10 nm to 1 μm, preferably 10 to 200 nm.

(4) -2. Light-Emitting Layer The light-emitting material of the organic EL device is mainly an organic compound, and specific examples include the following compounds depending on a desired color tone. First, in the case of emitting purple light from the ultraviolet region, a compound represented by the following general formula may be mentioned.

[0038]

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In this general formula, X represents the following compound.

[0040]

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Here, n is 2, 3, 4 or 5.
Y represents the following compound.

[0042]

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The phenyl group, phenylene group,
The naphthyl group includes an alkyl group having 1 to 4 carbon atoms, an alkoxy group, a hydroxyl group, a sulfonyl group, a carbonyl group, an amino group,
A dimethylamino group, a diphenylamino group or the like may be used alone or plurally. These may be combined with each other to form a saturated 5-membered ring or 6-membered ring. Further, those bonded to a phenyl group, a phenylene group, or a naphthyl group at the para position are preferable for forming a smooth evaporated film having good bonding properties. Specifically, they are the following compounds. Especially,
P-quarterphenyl derivatives and p-quinphenyl derivatives are preferred.

[0044]

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[0045]

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[0046]

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[0047]

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Next, in order to obtain blue to green light emission, for example, fluorescent brighteners such as benzothiazole, benzimidazole and benzoxazole, metal chelated oxinoid compounds and styrylbenzene compounds are mentioned. Can be.

Specific examples of the compound names include those disclosed in JP-A-59-194393. Typical examples thereof include benzoxazole-based, benzothiazole-based, and benzimidazole-based fluorescent whitening agents. In addition, other useful compounds include chemistry of synthetic
Soybean 1971, pages 628-637 and 640.

As the chelated oxinoid compound, for example, those disclosed in JP-A-63-295695 can be used. A typical example is tris (8-quinolinol) aluminum (hereinafter referred to as A
8-hydroxyquinoline-based metal complex such as 1q) and dilithium epthridione.

Further, as the styrylbenzene-based compound, for example, those disclosed in European Patent Nos. 0319881 and 0375358 can be used.

Further, a distyrylpyrazine derivative disclosed in JP-A-2-252793 can also be used as a material for the light emitting layer. As other materials, for example, a polyphenyl-based compound disclosed in European Patent No. 0377715 can also be used as a material for the light-emitting layer.

Further, in addition to the above-described fluorescent whitening agent, metal chelated oxinoid compound, styrylbenzene compound and the like, for example, 12-phthaloperinone (J. Appl.
Phys., Vol. 27, L713 (1988)), 1, 4
-Diphenyl-1,3-butadiene, 1,1,4,4-
Tetraphenyl-1,3 butadiene (Appl. Phys.
Lett., Vol. 56, L799 (1990)), naphthalimide derivative (JP-A-2-305886), perylene derivative (JP-A-2-189890), oxadiazole derivative (JP-A-2-216791). Gazettes, or oxadiazole derivatives disclosed by Hamada et al. At the 38th Lecture Meeting on Applied Physics, aldazine derivatives (JP-A-2-220393), pyrazirine derivatives (JP-A-2-220394), Cyclopentadiene derivatives (JP-A-2-289675), pyrrolopyrrole derivatives (JP-A-2-29691),
Styrylamine derivatives (Appl. Phys. Lett., Vol. 56,
L799 (1990)), coumarin compounds (JP-A-2-191694), and WO90 / 1.
3148 and Appl. Phys. Lett., Vol 58, 18, P1982 (1991)
Can be used as a material for the light emitting layer.

In the present invention, an aromatic dimethylidin compound (European Patent No. 038876) is particularly used as a material for the light emitting layer.
No. 8 and JP-A-3-231970) are preferably used. As a specific example,
4'-bis (2,2-di-t-butylphenylvinyl)
Biphenyl, (hereinafter abbreviated as DTBPBBi),
4,4′-bis (2,2-diphenylvinyl) biphenyl (hereinafter abbreviated as DPVBi) and the like and derivatives thereof can be given.

Further, a compound represented by the general formula (R _S -Q) ₂ -AL-OL described in JP-A-5-258882 and the like.
And a compound represented by the formula: (Where L is a hydrocarbon of 6 to 24 carbon atoms comprising a phenyl moiety, OL is a phenolate ligand, Q is a substituted 8-quinolinolate ligand, R _S Represents an 8-quinolinolate ring substituent selected to sterically hinder the binding of more than two substituted 8-quinolinolate ligands to the aluminum atom. Specifically, bis (2-
Methyl-8-quinolinolate) (para-phenylphenolate) aluminum (III) (hereinafter PC-7), bis (2-methyl-8-quinolinolate) (1-naphtholate) aluminum (III) (hereinafter PC-17), etc. Is mentioned. In addition, there is a method of obtaining highly efficient mixed emission of blue and green light using doping according to JP-A-6-9953. In this case, as the host, the luminescent material described above, and as the dopant, a strong fluorescent dye from blue to green, for example, a coumarin-based fluorescent dye or a fluorescent dye similar to that used as the host described above may be used. it can. Specifically, a luminescent material having a distyrylarylene skeleton as the host, particularly preferably, for example, DPVBi, and a dopant as diphenylaminovinylarylene, particularly preferably, for example, N, N-diphenylaminovinylbenzene (DPAVB).

The light emitting layer for obtaining white light emission is not particularly limited, but the following can be mentioned. A white light emitting element is described as an example of an element using tunnel injection as in the element using the tunnel injection, which specifies the energy level of each layer of the organic EL laminated structure and emits light using tunnel injection (European Patent Publication No. 0390551). (Japanese Unexamined Patent Application Publication No. 3-23)
No. 0584) A light emitting layer having a two-layer structure is described (Japanese Unexamined Patent Publication No.
Japanese Patent Application Laid-Open No. 220390 and Japanese Patent Application Laid-Open No. 216790/1990 The light-emitting layer is divided into a plurality of layers and made of materials having different emission wavelengths (Japanese Patent Application Laid-Open No. 4-51491). Blue light emitter (fluorescence peak 380 nm to 480 nm) And a green light emitter (480 nm to 580 nm),
Further, a structure containing a red phosphor (Japanese Unexamined Patent Publication No.
207170) A structure in which a blue light-emitting layer contains a blue fluorescent dye, a green light-emitting layer has a region containing a red fluorescent dye, and further contains a green phosphor (Japanese Patent Laid-Open No. 7-142169) Are preferably used. Also,
An example of a red phosphor is shown in [Formula 8].

[0057]

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As a method for forming a light emitting layer using the above-mentioned materials, a known method such as a vapor deposition method, a spin coating method and an LB method can be applied. The light emitting layer is particularly preferably a molecular deposition film. Here, the molecular deposition film is a thin film formed by deposition from a material compound in a gaseous state or a film formed by solidification from a material compound in a solution state or a liquid phase state. Is
It can be distinguished from a thin film (molecule accumulation film) formed by the LB method by a difference in an aggregated structure and a higher-order structure and a functional difference caused by the difference. Also, Japanese Patent Application Laid-Open No. 57-517
As disclosed in Japanese Patent Publication No. 81, after a binder such as a resin and a material compound are dissolved in a solvent to form a solution, the solution is formed into a thin film by a spin coating method or the like to form a light emitting layer. be able to. The thickness of the light emitting layer formed in this manner is not particularly limited and can be appropriately selected depending on the circumstances. Usually, the thickness is preferably in the range of 5 nm to 5 μm. The light emitting layer of the organic EL element has the following functions. That is, an injection function; a function of injecting holes from an anode or a hole injection layer when an electric field is applied, and a function of injecting electrons from a cathode or an electron injection layer; a transport function; injected charges (electrons and holes ) By a force of an electric field and a light-emitting function; a function of providing a field for recombination of electrons and holes and linking it to light emission. However, there may be a difference between the ease with which holes are injected and the ease with which electrons are injected, and the transportability, which is represented by the mobility of holes and electrons, may be large or small. It is preferable to move.

(4) -3. Hole Injection Layer Next, the hole injection layer is not always necessary for the device used in the present invention, but is preferably used for improving light emitting performance. This hole injection layer is a layer that assists hole injection into the light emitting layer, has a large hole mobility,
The ionization energy is usually as low as 5.5 eV or less.
As such a hole injecting layer, a material that transports holes to the light emitting layer with a lower electric field is preferable, and the mobility of holes is at least 10 ⁴ to 10 ⁶ V / cm when an electric field is applied. ^-6 cm ² / V · sec is more preferable.
Such a hole injecting material is not particularly limited as long as it has the above-mentioned preferable properties. Conventionally, in a photoconductive material, a material commonly used as a charge transporting material for holes or a positive electrode material of an EL element is used. Any one of known materials used for the hole injection layer can be selected and used.

As specific examples, for example, triazole derivatives (see US Pat. No. 3,112,197 etc.), oxadiazole derivatives (see US Pat. No. 3,189,447 etc.), imidazole derivatives (Japanese Patent Publication No. 37-1
No. 6096), polyarylalkane derivatives (U.S. Pat. Nos. 3,615,402 and 3,82).
Nos. 0,989, 3,542,544, JP-B-45-555, JP-B-51-10983, JP-A-51-93224, and 55-171.
Nos. 05, 56-4148, 55-108
Nos. 667 and 55-15653 and 56-
No. 36656), pyrazoline derivatives and pyrazolone derivatives (U.S. Pat. Nos. 3,180,729 and 4,278,746; JP-A-55-8).
Nos. 8064, 55-88065, 49-
Nos. 105537, 55-51086 and 5
Nos. 6-80051, 56-88141, 57-54545, 54-112637 and 55-74546, and phenylenediamine derivatives (US Pat. No. 3,615,404). Specification, JP-B-51-10105, 46-3712
JP-A-47-25336, JP-A-54-53
No. 435, No. 54-110536, No. 54-
No. 119925), arylamine derivatives (U.S. Pat. Nos. 3,567,450 and 3,1).
Nos. 80,703, 3,240,597, 3,658,520 and 4,23
2,103, 4,175,961, 4,012,376, JP-B-49-3
5702, 39-27577 and JP-A-5
JP-A-5-144250, JP-A-56-119132, JP-A-56-22437, West German Patent No. 1,11
0,518), amino-substituted chalcone derivatives (see US Pat. No. 3,526,501),
Oxazole derivatives (as disclosed in U.S. Pat. No. 3,257,203), styryl anthracene derivatives (see JP-A-56-46234, etc.), and fluorenone derivatives (see JP-A-54-110837, etc.) ),
Hydrazone derivatives (US Pat. No. 3,717,462, JP-A-54-59143, and JP-A-55-520)
Nos. 63, 55-52064 and 55-46.
760, 55-85495, 57-1
1350, 57-148749, JP-A-2-311591, etc.), stilbene derivatives (JP-A-61-210363, 61-2284)
No. 51, No. 61-14642, No. 61-72
No. 255, No. 62-47646, No. 62-3
Nos. 6,674, 62-10652 and 62-
Nos. 30255, 60-93445 and 60
JP-A-94462, JP-A-60-174747, JP-A-60-175052, etc.), silazane derivatives (U.S. Pat. No. 4,950,950), polysilanes (JP-A-2-204996), Aniline copolymer (JP-A-2-282263), JP-A-1-
Conductive polymer oligomers (especially thiophene oligomers) disclosed in Japanese Patent Application Laid-Open No. 211399 can be used. As the material for the hole injection layer, those described above can be used.
No. 2,965,965), aromatic tertiary amine compounds and styrylamine compounds (U.S. Pat. No. 4,127,412, JP-A-53-27033).
JP-A-54-58445, JP-A-54-1496
Nos. 34, 54-64299, 55-79
No. 450, No. 55-144250, No. 56-
JP-A-119132, JP-A-61-295558, JP-A-61-98353, JP-A-63-295695, etc.), and particularly, an aromatic tertiary amine compound is preferably used. Further, it has two fused aromatic rings described in US Pat. No. 5,061,569 in a molecule,
For example, 4,4'-bis [N- (1-naphthyl) -N-
Phenylamino] biphenyl (hereinafter abbreviated as NPD) and 4,4 ′, 4 ″ -tris in which three triphenylamine units described in JP-A-4-308688 are connected in a starburst form. [N- (3-
Methylphenyl) -N-phenylamino] triphenylamine (hereinafter abbreviated as MTDATA) and the like. Further, in addition to the above-mentioned aromatic dimethylidin compound shown as a material of the light emitting layer, p-type Si, p-type S
An inorganic compound such as iC can also be used as a material for the hole injection layer. The hole injection layer can be formed by thinning the above-mentioned compound by a known method such as a vacuum evaporation method, a spin coating method, a casting method, and an LB method. The thickness of the hole injection layer is not particularly limited, but is usually 5 nm to 5 μm. This hole injection layer is
It may be composed of one or more of the above-mentioned materials, or may be a layer obtained by laminating a hole injection layer made of a compound different from the hole injection layer. Further, the organic semiconductor layer is a layer that assists hole injection or electron injection into the light emitting layer, and preferably has a conductivity of 10 ⁻¹⁰ S / cm or more. As a material for such an organic semiconductor layer, a conductive oligomer such as a thiophene-containing oligomer or an arylamine-containing oligomer, or a conductive dendrimer such as an arylamine-containing dendrimer can be used.

(4) -4 Electron Injection Layer On the other hand, the electron injection layer is a layer which assists the injection of electrons into the light emitting layer, has a high electron mobility, and the adhesion improving layer is one of the electron injection layers. In particular, a layer made of a material having good adhesion to the cathode. Preferred examples of the material used for the electron injection layer include a metal complex of 8-hydroxyquinoline or a derivative thereof, or an oxadiazole derivative. As a material used for the adhesion improving layer, a metal complex of 8-hydroxyquinoline or a derivative thereof is particularly suitable. Specific examples of the metal complex of 8-hydroxyquinoline or a derivative thereof include a metal chelate oxinoid compound containing a chelate of oxine (generally, 8-quinolinol or 8-hydroxyquinoline). For example, Alq described above can be used as the electron injection layer. On the other hand, as the oxadiazole derivatives, the general formulas (II), (III) and (IV)

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(Wherein Ar ^{10 to} Ar ¹³ each represent a substituted or unsubstituted aryl group, and Ar ¹⁰ , Ar ¹¹ and A
r ¹² and Ar ¹³ may be the same or different, and each represents an Ar ¹⁴ substituted or unsubstituted arylene group. )). Here, the aryl group includes a phenyl group, a biphenyl group, an anthranyl group, a perylenyl group, a pyrenyl group, and the like. Can be Also,
As the substituent, an alkyl group having 1 to 10 carbon atoms, 1 carbon atom
And 10 to 10 alkoxy groups or cyano groups. The electron transfer compound is preferably a thin film-forming compound. Specific examples of the electron transfer compound include the following.

[0064]

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(4) -5. Cathode As the cathode, a metal with a small work function (4 eV or less)
An alloy, an electrically conductive compound, and a mixture thereof are used as electrode materials. Specific examples of such electrode materials include sodium, sodium-potassium alloy,
Examples include magnesium, lithium, magnesium / silver alloy, aluminum / aluminum oxide (Al ₂ O ₃ ), aluminum / lithium alloy, indium, and rare earth metals. The cathode can be manufactured by forming a thin film from these electrode materials by a method such as evaporation or sputtering. The sheet resistance as the cathode is preferably several hundred Ω / □ or less, and the film thickness is usually 10 n.
The range of m to 1 μm and 50 to 200 nm is preferable. In the EL element used in the present invention, it is preferable that one of the anode and the cathode is transparent or translucent, since light is transmitted therethrough and light emission extraction efficiency is high.

(4) -6. Fabrication of Organic EL Element (Example) An anode, a light emitting layer, a hole injection layer, if necessary, and an electron injection layer, if necessary, are formed by the materials and methods exemplified above. An EL element can be manufactured. Further, the organic EL device can be manufactured in the reverse order from the cathode to the anode.

An organic E having a structure in which an anode / a hole injection layer / a light emitting layer / an electron injection layer / a cathode is sequentially provided on a support substrate is described below.
An example of manufacturing an L element will be described. First, on an appropriate substrate, a thin film made of an anode material is 1 μm or less, preferably 10 to 2 μm.
An anode is formed by a method such as vapor deposition or sputtering so as to have a thickness in the range of 00 nm. Next, a hole injection layer is provided on the anode. The formation of the hole injection layer
As described above, it can be performed by a method such as a vacuum deposition method, a spin coating method, a casting method, and an LB method. However, from the viewpoint that a uniform film is easily obtained and pinholes are hardly generated, the vacuum deposition method It is preferable to form with.
When the hole injection layer is formed by a vacuum evaporation method, the deposition conditions vary depending on the compound to be used (the material of the hole injection layer), the crystal structure and the recombination structure of the target hole injection layer, etc. Deposition source temperature 50 to 450 ° C, degree of vacuum 10 ^-7 to
10 ^-3 torr, deposition rate 0.01 to 50 nm / se
c, the substrate temperature is preferably -50 to 300 ° C., and the film thickness is preferably selected in the range of 5 nm to 5 μm.

Next, the formation of a light-emitting layer in which a light-emitting layer is provided on the hole injection layer is also carried out by using a desired organic light-emitting material by a vacuum evaporation method.
It can be formed by thinning the organic light-emitting material by a method such as sputtering, spin coating, or casting, but is formed by a vacuum evaporation method because a uniform film is easily obtained and pinholes are hardly generated. Is preferred. When the light emitting layer is formed by a vacuum evaporation method, the evaporation conditions vary depending on the compound used, but can be generally selected from the same condition range as the hole injection layer.

Next, an electron injection layer is provided on the light emitting layer. Like the hole injection layer and the light emitting layer, it is preferable to form the film by a vacuum deposition method from the viewpoint of obtaining a uniform film. The deposition conditions can be selected from the same condition range as the hole injection layer and the light emitting layer.

Finally, an organic EL device can be obtained by laminating a cathode. The cathode is made of metal,
Evaporation and sputtering can be used. However, to protect the underlying organic layer from damage during film formation,
Vacuum evaporation is preferred.

In the production of the organic EL device described so far, it is preferable to produce from the anode to the cathode consistently by one evacuation.

When a DC voltage is applied to the organic EL element, light emission can be observed by applying a voltage of 5 to 40 V with the anode having a positive polarity and the cathode having a negative polarity. Even if a voltage is applied in the opposite polarity, no current flows and no light emission occurs. Further, when an AC voltage is applied, uniform light emission is observed only when the anode has a positive polarity and the cathode has a negative polarity. The waveform of the applied alternating current may be arbitrary.

Here, in order to fabricate an organic EL element which emits light while being separated and arranged in a plane, a striped anode and a cathode are crossed, and a DC voltage is applied to each electrode.
An XY dot matrix system that emits light at the intersection and either an anode or a cathode are formed in a dot shape, and a TFT
An active matrix system in which a switching element such as (Thin Film Transister) applies a DC voltage to only a specific dot portion to emit light. The stripe-shaped or dot-shaped anode and cathode can be formed by etching or lift-off by photolithography, or by masking deposition or the like.

III. Method for manufacturing color conversion filter The method for manufacturing the color conversion filter of the present invention, as described above,
A light-shielding layer and a color conversion layer including one or more types of phosphor layers are alternately and separately separated in a plane on a light-transmitting substrate. In the method for manufacturing a conversion filter, the method (A)
(C) is included. 1. Step (A) A first light-shielding layer is two-dimensionally patterned and separated on a light-transmitting substrate, and at least one of an upper surface or a lower surface of the first light-shielding layer, and A light shielding layer is provided. Hereinafter, a specific description will be given.

FIGS. 3A and 4 show the light-transmitting substrate 1.
After disposing the first light shielding layer 21 thereon, the first light shielding layer 2
1 shows a case where a second light-shielding layer 22 is stacked and disposed on the upper surface of the light-transmitting substrate 1 and the light-transmitting substrate 1.

FIG. 5 shows that the second light-shielding layer 22 is laminated on the entire surface of the light-transmitting substrate 1 and then disposed.
A case where the first light-shielding layer 21 is separately patterned and arranged on a plane is shown above.

FIG. 6 shows that the second light-shielding layer 22 is laminated on the entire surface of the light-transmitting substrate 1 and then disposed.
The first light-shielding layer 21 is patterned and separated and arranged on the upper surface, and then the upper surface of the first light-shielding layer 21 and the light-transmitting substrate 1
A case is shown in which the second light-shielding layer 22 is further laminated on the second light-shielding layer 22 provided thereon.

FIG. 7 shows a second light shielding layer 2 on a light transmitting substrate 1.
2 shows a case in which the first light-shielding layer 21 is patterned and separated and arranged on the light-transmitting substrate 1 so that the first light-shielding layer 21 and the second light-shielding layer 22 are alternately arranged on the light-transmitting substrate 1. .

FIG. 8 shows a second light-shielding layer 2 on a light-transmitting substrate 1.
After the second light-shielding layer 21 is patterned and separated and arranged on the light-transmitting substrate 1, the first light-shielding layer 21 is patterned and separated and arranged on the light-transmitting substrate 1 so as to be alternate with the second light-shielding layer 22. The case where the second light-shielding layer 22 is further laminated on the upper surface of the first light-shielding layer 21 and on the second light-shielding layer 22 provided on the light-transmitting substrate 1 is shown.

2. Step (B) The second light-shielding layer provided on the light-transmitting substrate is selectively removed by etching. More specifically, as shown in FIG. 3B, a part of the second light-shielding layer 22 provided on the light-transmitting substrate 1 is selectively removed by etching (for example, using a photolithography method). I do. As a method of removal,
For example, wet etching using an etching solution or dry etching using an etching gas such as RIE (reactive ion etching) may be used.

3. Step (C) As shown in FIG. 3C, a photocurable color conversion layer forming material 3 ′ is formed so as to fill the gap between the first light shielding layers 21. Examples of the photo-curable color conversion layer forming material 3 ′ include materials using the above-described photosensitive resin or photo-curable resist material as a binder resin. The film formation method described above can be used.

In the present invention, the step (A)
What contains process (D)-(F) in addition to (C) is preferable. 4. Step (D) As shown in FIG. 3 (d), the light-curable color conversion layer forming material 3 ′ is light-cured by exposing from the light-transmitting substrate 1 side to form one type of color conversion layer 3. The method of exposure is not particularly limited. For example, light corresponding to the spectral sensitivity of the photocurable color conversion layer forming material is irradiated using a light source such as mercury or a halogen or xenon lamp. In order to form an accurate color conversion layer, it is preferable to irradiate the substrate with parallel light perpendicularly.

5. Step (E) As shown in FIG. 3 (e), the unexposed portions of the photocurable color conversion layer forming material 3 ′ are removed. Although there is no particular limitation on the method of removal, for example, treatment with a phenomenon liquid that dissolves uncured (unexposed) material or treatment with a gas that decomposes is performed.

6. Step (F) As shown in FIG. 3 (f), according to the number of types of color conversion layers,
By repeating steps (B) to (E) as many times as necessary, a color conversion filter 10 having a plurality (three types in the figure) of color conversion layers 3 can be obtained.

By doing so, the first and / or
Or, since the color conversion layer can be exposed using the second light-shielding layer as a mask, a desired color conversion layer pattern can be formed with high accuracy,
The color conversion filter surface can be flattened. Also,
As described above, it is possible to manufacture a color conversion filter for manufacturing a multicolor light emitting device (full-color display) having good visibility without dependency on the viewing angle.

[0086]

EXAMPLES The present invention will be described more specifically with reference to the following examples. [Example 1] 100 mm x 100 mm as a translucent substrate
An acrylate-based photocurable resist (viscosity 250 cp) in which 1% by weight (based on solid content) of carbon black is dispersed on a glass substrate (Corning 7059) having a thickness of 1.1 mm.
s) was spin-coated, baked at 80 ° C., and set in an exposure machine using a high-pressure mercury lamp as a light source. Then 50 μm
900 mJ / cm ² (36) through a mask that can obtain a stripe pattern with a line and a 250 μm gap.
(5 nm). Next, after developing with a 1% by weight aqueous solution of sodium carbonate at room temperature, 3000 mJ / c from the transparent substrate side.
The whole surface was post-exposed at m ² and baked at 200 ° C. to form a light-shielding layer pattern (first light-shielding layer). The thickness of the first light shielding layer was about 15 μm. The maximum value of the transmittance of the first light-shielding layer at a wavelength of 400 to 700 nm is 10%.
That was all. Next, this substrate was set in a sputtering apparatus, and the substrate was heated to 200 ° C. to deposit chromium (Cr) with a thickness of 100 nm on the entire surface (second light-shielding layer). Here, the wavelength 4 of the light shielding layer composed of the first light shielding layer and the second light shielding layer.
The maximum value of the transmittance at 00 to 700 nm was 1% or less, and the light-shielding property of the light-shielding layer was enhanced. Thus, a substrate on which the pattern of the first light-shielding layer and the second light-shielding layer were arranged was formed (corresponding to FIGS. 4 and 3A). Next, a positive photoresist (HPR204 manufactured by Fuji Film Orin Co., Ltd .:
A novolak resin-naphthoquinonediazide) was spin-coated on the substrate and baked at 80.degree. Then, 6
A mask capable of forming a stripe pattern having a 50 μm line and a 250 μm gap was aligned with the first light-shielding layer, and exposed at 300 mJ / cm ² (365 nm). Next, after developing with a 2.38% by weight aqueous solution of tetraammonium hydroxide (TMAH) at room temperature, the exposed portion of the second light-shielding layer was washed with 165 g of ceric ammonium nitrate (7 g).
Etching was performed with an etchant having a composition of 42 ml of 0 wt% perchloric acid and 1 liter of pure water. Next, the photoresist is removed with an organic alkali stripper (N30 manufactured by Nagase & Co., Ltd.).
3), the second light-shielding layer was selectively etched (FIG. 3B). Next, 2.8% by weight (based on solid content) of a copper phthalocyanine pigment (CI Pigment Blue 1)
5: 6) and 0.2% by weight (based on solid content) of a dioxazine-based pigment (CI Pigment Violet 23) was coated with an acrylic photocurable resist (JNPC0 manufactured by Nippon Synthetic Rubber Co., Ltd.).
6) The resist dispersed therein was spin-coated and baked at 80 ° C. (FIG. 3C). Next, from the translucent substrate side, 6
Exposure at 00 mJ / cm ² (FIG. 3 (d)), developing with a 1% by weight aqueous solution of sodium carbonate at room temperature to remove the unexposed portion of the color conversion layer, and baking at 200 ° C. to form a blue color filter pattern (color A conversion layer A) was formed (FIG. 3E).
The thickness of the color conversion layer A was about 15 μm, which was almost equal to the thickness of the first light-shielding layer. Next, a positive photoresist was spin-coated on the substrate and baked at 80 ° C. Next, a mask capable of obtaining a striped pattern with a 650 μm line and a 250 μm gap is aligned with the first light shielding layer (a part of the second light shielding layer adjacent to the color conversion layer A via the first light shielding layer becomes a gap). 30)
Exposure was performed at 0 mJ / cm ² (365 nm). Next, after this resist was developed at room temperature, the exposed portion of the second light-shielding layer was
The resist was peeled off by etching, and the second light-shielding layer was selectively etched. Next, coumarin 6 was added to 0.0 kg of the solid content of the acrylic photo-curable resist (described above) for 1 kg.
The resist compounded and dispersed to be 3 mol was spin-coated and baked at 80 ° C. Next, exposure was performed at 300 mJ / cm ² from the light-transmitting substrate side, development was performed at room temperature with a 1% by weight aqueous solution of sodium carbonate to remove the unexposed portion of the color conversion layer, and baking was performed at 200 ° C. to form a phosphor layer pattern. (Color conversion layer B) was formed. The thickness of the color conversion layer B was about 15 μm, which was almost the same as the thickness of the first light-shielding layer. Next, a positive photoresist is spin-coated on the substrate,
Bake at ℃. Next, a 650 μm line, 250 μm
A mask for obtaining a stripe-shaped pattern with m gaps is aligned with the first light-shielding layer (so that the portion of the second light-shielding layer adjacent to the color conversion layer B via the first light-shielding layer becomes a gap). , And 300 mJ / cm ² (365 nm). Next, after developing this resist at room temperature, the exposed portion of the second light-shielding layer is etched, and the resist is peeled off.
The second light shielding layer was selectively etched. Next, coumarin 6, a fluorescent pigment prepared by kneading 4% by weight (vs. benzoguanamine resin) of rhodamine 6G and 4% by weight (vs. benzoguanamine resin) of rhodamine B into a benzoguanamine resin, and an acrylic photocurable resist were used. The amount of coumarin 6 was adjusted to 0.1 with respect to 1 kg of the total amount of the fluorescent pigment obtained by kneading rhodamine 6G and rhodamine B in a benzoguanamine resin and the solid content of an acrylic photocurable resist.
A resist having a compounding amount of 03 mol, a compounding amount of a fluorescent pigment of 30% by weight, and a compounding amount of a solid content of an acrylic photocurable resist (described above) of 70% by weight was spin-coated and baked at 80 ° C. . Next, from the translucent substrate side, 60
After exposure at 0 mJ / cm ² and development at room temperature with a 1% by weight aqueous sodium carbonate solution to remove the unexposed portion of the color conversion layer,
The resultant was baked at ℃ to form a phosphor layer pattern (color conversion layer C). The thickness of the color conversion layer C was about 15 μm, which was almost equal to the thickness of the first light-shielding layer. From the above, color conversion filters (FIGS. 1 (a) and 3 (f)) were prepared, and the surface roughness of the color conversion filters was measured using a surface roughness meter (DEKTAK3030). Was.
In order to confirm the light emission luminance and chromaticity of the organic EL element to be laminated later, only a part of the color conversion layer was cut off.
Next, an organic EL device was manufactured. First, the substrate
A transparent electrode (anode and cathode extraction electrodes) of ITO (indium tin oxide) having a thickness of 0.15 μm and a surface resistance of 20 Ω / □ was formed by sputtering at a degree of vacuum of 10 ⁻⁶ torr by heating to 60 ° C. did. Next, a positive photoresist (HPR204 manufactured by Fuji Hunt Electronics Technology Co., Ltd.) is spin-coated on the ITO,
After baking in 250μm line 50μ
The alignment with the light-shielding layer pattern is performed through a mask that can obtain a stripe-shaped ITO pattern for an anode with an m gap and a stripe-shaped ITO electrode for a 600 μm line and a striped cathode with a 100 μm gap.
Exposure was performed at 0 mJ / cm ² . Next, 2.38% TMAH
The resist was developed with an aqueous solution and post-baked at 120 ° C. to form a resist pattern. Next, the substrate was immersed in a 47% aqueous hydrogen bromide solution at room temperature to etch the exposed portions of the ITO, and the resist was stripped with a stripping agent (N303 manufactured by Nagase & Co., Ltd.) to form an ITO pattern. . Next, this substrate was subjected to IPA cleaning and UV cleaning, and then fixed to a substrate holder of a vapor deposition device (manufactured by Nippon Vacuum Engineering Co., Ltd.). The evaporation source was prepared by charging MTDATA and NPD as hole injecting materials, DPVBi as a light emitting material, DPAVB as a dopant, and Alq as an electron injecting material into a molybdenum resistance heating boat, and using Ag as a cathode second metal in a tungsten filament. Then, Mg was mounted on a molybdenum boat as an electron injecting metal for the cathode.
Thereafter, the pressure in the vacuum chamber was reduced to 5 × 10 ⁻⁷ torr, and the layers were sequentially laminated in the following order. The vacuum was not broken on the way from the hole injecting layer to the cathode, but was performed by a single evacuation. First, as the hole injection layer, MTDATA was deposited at a deposition rate of 0.1 to
0.3 nm / s, film thickness 200 nm, NPD deposition rate 0.1-0.3 nm / s, film thickness 20 nm, DPVBi as light emitting layer DPVBi deposition rate 0.1-0.3 nm / s, DP
AVB is co-deposited at a deposition rate of 0.05 nm / s to a total thickness of 40 nm (the weight ratio of the dopant to the host material is 1.2 to 1.6).
q is a deposition rate of 0.1 to 0.3 nm / s, a film thickness of 20 nm,
The cathode is perpendicular to the anode ITO stripe pattern, and is connected to the extraction electrode ITO pattern.
Mg and Ag were co-evaporated through a mask having a stripe pattern of 0 μm line and 100 μm gap. That is, Mg has a deposition rate of 1.3 to 1.4 nm.
/ S and Ag are 200 nm at a deposition rate of 0.1 nm / s.
nm. Thus, the organic EL element was laminated on the color conversion filter. Next, when a voltage of 8 VDC is applied to the anode and the cathode, the intersection of the anode and the cathode to which the voltage is applied emits light, and the organic EL can be seen from the portion where the color conversion layer is shaved.
Light emission luminance and CIE chromaticity coordinates of the element (JIS Z 8
701) is 100 cd / m ² , and the chromaticity is x = 0.
16. It was confirmed that blue light emission was obtained at y = 0.24. The emission luminance of the light seen from the blue color filter (color conversion layer A) is 50 cd / m ² , and the chromaticity is x = 0.
14. It was confirmed that blue light with high color purity was emitted at y = 0.16. On the other hand, the emission luminance of light seen from the color conversion layer B is 113 cd / m ² , the chromaticity is x = 0.23, and y is
It was confirmed that yellowish green (yellowish green) light emission was obtained at 0.65. Further, it was confirmed that the light emission luminance of the light seen from the color conversion layer C was 15 cd / m ² , the chromaticity was x = 0.55, and y = 0.29, and red light was emitted. In this manner, a multicolor light-emitting device is manufactured, and since the light-shielding layer has high light-shielding properties, light of the original color can be obtained from each color conversion layer even when observed from all angles, and there is no viewing angle dependency. Was. In addition, since the color conversion filter is flattened, there is almost no crosstalk (light emission in a portion other than a desired light emission portion due to short circuit between the anode and the cathode due to unevenness of the color conversion layer) and display defects due to disconnection of the electrode. It was confirmed that good display was possible.

Example 2 100 m as Translucent Substrate
A glass substrate (Corning 7059) having a thickness of m × 100 mm × 1.1 mm was set in a sputtering apparatus, and the substrate was heated to 200 ° C. to form chromium (Cr) with a thickness of 100 nm over the entire surface (second light-shielding layer). ). Next, an acrylate-based photocurable resist (viscosity 250 cps) in which 1% by weight (based on solid content) of carbon black was dispersed was spin-coated, baked at 80 ° C., and set in an exposure machine using a high-pressure mercury lamp as a light source. . Then, 50 μm line, 250 μm
Exposure was performed at 1500 mJ / cm ² (365 nm) through a mask capable of obtaining a stripe pattern of gaps. Next, development was performed at room temperature with a 1% by weight aqueous solution of sodium carbonate, followed by baking at 200 ° C. to form a light shielding layer pattern (first light shielding layer). The thickness of the first light shielding layer was about 15 μm. The wavelength of the first light-shielding layer is 400 to 700 nm.
Was 10% or more. However, the wavelength 40 of the light shielding layer composed of the first light shielding layer and the second light shielding layer
The maximum value of the transmittance at 0 to 700 nm was 1% or less, and the light shielding property of the light shielding layer was enhanced. Thus, a substrate on which the first light-shielding layer pattern and the second light-shielding layer were arranged was formed (FIG. 5). Hereinafter, the color conversion layers A,
B and C were formed to produce a color conversion filter (FIG. 1B), and an organic EL element was further laminated. In this way,
Since a multicolor light-emitting device was manufactured and the light-shielding layer had high light-shielding properties, light emission of the original color was obtained from each color conversion layer even when observed from all angles, and there was no viewing angle dependency at all. In addition, since the color conversion filter was flattened, there were almost no display defects due to crosstalk and disconnection of the electrodes, and it was confirmed that good display was possible.

Example 3 100 m as Translucent Substrate
A glass substrate (Corning 7059) having a thickness of m × 100 mm × 1.1 mm was set in a sputtering apparatus, and the substrate was heated to 200 ° C. to form chromium (Cr) with a thickness of 100 nm over the entire surface (second light-shielding layer). ). Next, an acrylate-based photocurable resist (viscosity 250 cps) in which 1% by weight (based on solid content) of carbon black was dispersed was spin-coated, baked at 80 ° C., and set in an exposure machine using a high-pressure mercury lamp as a light source. . Then, 50 μm line, 250 μm
Exposure was performed at 1500 mJ / cm ² (365 nm) through a mask capable of obtaining a stripe pattern of gaps. Next, development was performed at room temperature with a 1% by weight aqueous solution of sodium carbonate, followed by baking at 200 ° C. to form a light shielding layer pattern (first light shielding layer). The thickness of the first light shielding layer was about 15 μm. The wavelength of the first light-shielding layer is 400 to 700 nm.
Was 10% or more. Further, chromium (Cr) was formed in a thickness of 100 nm on the entire surface of the substrate (second light-shielding layer). Here, the transmittance of the light-shielding layer composed of the first light-shielding layer and the second light-shielding layer at a wavelength of 400 to 700 nm was 1% or less, and the light-shielding properties of the light-shielding layer were enhanced. Thus, a substrate on which the pattern of the first light shielding layer and the second light shielding layer were arranged was formed (FIG. 6). Hereinafter, color conversion layers A, B, and C were formed under the same conditions as in Example 1 to produce a color conversion filter (FIG. 1C), and an organic EL element was further laminated. In this manner, a multicolor light-emitting device is manufactured, and since the light-shielding layer has high light-shielding properties, light emission of an original color can be obtained from each color conversion layer even when observed from all angles, and there is no viewing angle dependency. (FIG. 2). In addition, since the color conversion filter was flattened, there were almost no display defects due to crosstalk and disconnection of the electrodes, and it was confirmed that good display was possible.

[Embodiment 4] 100 mm as a translucent substrate
A glass substrate (Corning 7059) having a thickness of 100 mm x 1.1 mm was set in a sputtering apparatus, and the substrate was
By heating to 00 ° C., chromium (Cr) was formed on the entire surface in a thickness of 100 nm (second light-shielding layer). Next, a positive photoresist was spin-coated on the substrate and baked at 80 ° C. Next, exposure was performed at 150 mJ / cm ² (365 nm) through a mask capable of obtaining a striped pattern with a 650 μm line and a 250 μm gap. Next, after developing with a 2.38% TMAH aqueous solution at room temperature, the exposed portion of the second light-shielding layer was treated with ceric ammonium nitrate 1
Etching was performed using an etchant having a composition of 65 g, 42 wt% of 70 wt% perchloric acid, and 1 liter of pure water. Next, the photoresist was peeled off with a stripping solution of an organic alkali (N303 manufactured by Nagase & Co., Ltd.), and the second light-shielding layer was separately arranged in a plane. Next, an acrylate-based photocurable resist (viscosity 250 cps) in which 1% by weight (based on solid content) of carbon black was dispersed was spin-coated, baked at 80 ° C., and set in an exposure machine using a high-pressure mercury lamp as a light source. . Then, 1500 mJ / cm ² (365 n) from the light transmitting substrate side.
m). Next, development was performed at room temperature with a 1% by weight aqueous solution of sodium carbonate, followed by baking at 200 ° C. to form a light shielding layer pattern (first light shielding layer). The thickness of the first light shielding layer is about 1
It was 5 μm. The wavelength of the first light-shielding layer is 400 to
The maximum value of the transmittance at 700 nm was 10% or more. Further, the substrate is heated to 200 ° C. to make chromium (C
r) was formed on the entire surface in a thickness of 100 nm (second light-shielding layer). Here, the maximum value of the transmittance of the light shielding layer including the first light shielding layer and the second light shielding layer at a wavelength of 400 to 700 nm is 1
% Or less, and the light-shielding property of the light-shielding layer was enhanced. Thus, a substrate on which the pattern of the first light shielding layer and the second light shielding layer were arranged was formed (FIG. 8). Hereinafter, color conversion layers A, B, and C are formed under the same conditions as in Example 1 to form a color conversion filter (FIG. 1).
(A)) was prepared, and an organic EL element was further laminated. In this manner, a multicolor light-emitting device is manufactured, and since the light-shielding layer has high light-shielding properties, light emission of an original color can be obtained from each color conversion layer even when observed from all angles, and there is no viewing angle dependency. Was. In addition, since the color conversion filter was flattened, there were almost no display defects due to crosstalk and disconnection of the electrodes, and it was confirmed that good display was possible.

[Embodiment 5] 100 mm as a translucent substrate
A glass substrate (Corning 7059) having a thickness of 100 mm x 1.1 mm was set in a sputtering apparatus, and the substrate was
By heating to 00 ° C., chromium (Cr) was formed on the entire surface in a thickness of 100 nm (second light-shielding layer). Next, a positive photoresist was spin-coated on the substrate and baked at 80 ° C. Next, exposure was performed at 150 mJ / cm ² (365 nm) through a mask capable of obtaining a striped pattern with a 650 μm line and a 250 μm gap. Next, after developing with a 2.38% TMAH aqueous solution at room temperature, the exposed portion of the second light-shielding layer was treated with ceric ammonium nitrate 1
Etching was performed using an etchant having a composition of 65 g, 42 wt% of 70 wt% perchloric acid, and 1 liter of pure water. Next, the photoresist was peeled off with a stripping solution of an organic alkali (N303 manufactured by Nagase & Co., Ltd.), and the second light-shielding layer was separately arranged in a plane. Next, an acrylate-based photocurable resist (viscosity 250 cps) in which 5% by weight (based on solid content) of carbon black was dispersed was spin-coated, baked at 80 ° C., and set in an exposure machine using a high-pressure mercury lamp as a light source. . Next, 3000 mJ / cm ² (365 n) from the translucent substrate side.
m). Next, development was performed at room temperature with a 1% by weight aqueous solution of sodium carbonate, followed by baking at 200 ° C. to form a light shielding layer pattern (first light shielding layer). The thickness of the first light shielding layer is about 1
It was 5 μm. The wavelength of the first light-shielding layer is 400 to
The maximum value of the transmittance at 700 nm was 5% or more. Thus, a substrate on which the pattern of the first light shielding layer and the second light shielding layer were arranged was formed (FIG. 7). Example 1 below
Color conversion layers A, B, and C were formed under the same conditions as described above to produce a color conversion filter, and an organic EL element was further laminated. In this way, a multicolor light-emitting device was manufactured, but it was composed of only the first light-shielding layer of the light-shielding layer, and the light-shielding property was low. Therefore,
The angle at which light emission of the original color cannot be obtained from each color conversion layer is 1
Although it was present at about 0 degrees and slightly dependent on the viewing angle, it was at a level at which there was no practical problem. However, since the color conversion filter was flattened, there were almost no display defects due to crosstalk and disconnection of the electrodes, and it was confirmed that good display was possible.

[Comparative Example 1] In Example 5, instead of the acrylate photocurable resist in which 5% by weight (based on solids) of carbon black was dispersed as the first light-shielding layer, 1
A color conversion filter and a multicolor light-emitting device were produced under the same conditions as in Example 5, except that an acrylate-based photocurable resist in which carbon black was dispersed in a percentage by weight (based on solid content) was used. In this device, the second light-shielding layer is not formed, and only the first light-shielding layer is formed. The maximum value of the transmittance of the first light-shielding layer at a wavelength of 400 to 700 nm is 10% or more. Sex was low. As a result, in this device, the emission of the original color of each color conversion layer changes when viewed obliquely, the viewing angle dependence is large, and there is a practical problem (FIG. 10).

[Comparative Example 2] In Example 5, instead of the acrylate photocurable resist in which 5% by weight (solid content) of carbon black was dispersed as the first light-shielding layer, 2
An acrylate-based photocurable resist in which 0% by weight (based on solid content) of carbon black was dispersed was used. As a result, the light-shielding property of the resist was too high, the light for exposure did not pass, and the pattern of the first light-shielding layer could not be formed. Therefore, a color conversion filter and a multicolor light emitting device could not be manufactured.

[0093]

As described above, according to the present invention,
A color conversion filter for improving the light-shielding property of the light-shielding layer and flattening the surface thereof with high precision to provide a multicolor light-emitting device having excellent display performance and few display defects, and an efficient manufacturing method thereof. Can be provided.

[Brief description of the drawings]

FIGS. 1A and 1B are cross-sectional views schematically showing one embodiment of a color conversion filter of the present invention, wherein FIG. ) Shows the case where they are arranged on the upper and lower surfaces, respectively.

FIG. 2 shows a color conversion filter shown in FIG.
FIG. 3 is a cross-sectional view schematically showing a multicolor light emitting device using the same (L element).

FIG. 3 is a cross-sectional view schematically showing one embodiment of a method for manufacturing a color conversion filter of the present invention for each process.

FIG. 4 is a cross-sectional view schematically showing one embodiment of a method for disposing a second light-shielding layer in step (A) of one embodiment of the method for manufacturing a color conversion filter of the present invention.

FIG. 5 is a cross-sectional view schematically showing another embodiment of a method for disposing a second light-shielding layer in step (A) of the embodiment of the method for manufacturing a color conversion filter of the present invention.

FIG. 6 is a cross-sectional view schematically showing another embodiment of a method for disposing a second light-shielding layer in step (A) of the embodiment of the method for manufacturing a color conversion filter of the present invention.

FIG. 7 is a cross-sectional view schematically showing another embodiment of a method for disposing a second light-shielding layer in step (A) of one embodiment of the method for manufacturing a color conversion filter of the present invention.

FIG. 8 is a cross-sectional view schematically showing another embodiment of a method for disposing a second light-shielding layer in step (A) of one embodiment of the method for manufacturing a color conversion filter of the present invention.

FIG. 9 is a cross-sectional view schematically showing a conventional multicolor light emitting device (a combination of a color conversion filter and a light emitting body).

10 is a cross-sectional view schematically showing the viewing angle dependency of the multicolor light emitting device shown in FIG.

FIG. 11 is a cross-sectional view schematically showing the occurrence of disconnection or short circuit in a conventional color conversion filter.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 translucent substrate 2 light-shielding layer 21 first light-shielding layer 22 second light-shielding layer 3 color conversion layer 3 ′ photocurable color conversion layer forming material 4 light-emitting body (organic EL element) 10 color conversion filter

Claims (11)

[Claims] 1. A light-shielding layer and a color conversion layer including one or more kinds of phosphor layers are alternately and separately arranged in a plane on a light-transmitting substrate. /
Alternatively, in the color conversion filter for conversion, a light-shielding layer is provided on at least one of a first light-shielding layer for shielding light emitted from the luminous body and / or the color conversion layer, and an upper surface or a lower surface of the first light-shielding layer. And a second light-shielding layer for supplementing the light-shielding property of the first light-shielding layer. 2. The color conversion filter according to claim 1, wherein the second light-shielding layer contains a metal material. 3. The color conversion filter according to claim 1, wherein the luminous body is an organic EL element. 4. A multicolor light emitting device comprising the color conversion filter according to claim 1 and an organic EL element. 5. A light-shielding layer and a color conversion layer including one or more kinds of phosphor layers are alternately and separately arranged in a plane on a light-transmitting substrate. /
Alternatively, a method of manufacturing a color conversion filter to be converted includes the following steps (A) to (C). (A) A first light-shielding layer for shielding light emitted from a light-emitting body and / or a color conversion layer is planarly patterned and separately arranged on a light-transmitting substrate, and an upper surface of the first light-shielding layer or A second light-shielding layer for supplementing the light-shielding property of the first light-shielding layer is provided on at least one of the lower surface and the light-transmitting substrate. (B) The second light-shielding layer provided on the light-transmitting substrate is selectively removed by etching. (C) A photo-curable color conversion layer forming material is formed so as to fill the gap between the first light-shielding layers. 6. A light-shielding layer and a color conversion layer including at least one kind of phosphor layer are alternately and separately arranged in a plane on a light-transmitting substrate. /
Alternatively, a method for manufacturing a color conversion filter to be converted includes the following steps (A) to (F). (A) A first light-shielding layer for shielding light emitted from a light-emitting body and / or a color conversion layer is planarly patterned and separately arranged on a light-transmitting substrate, and an upper surface of the first light-shielding layer or A second light-shielding layer for supplementing the light-shielding property of the first light-shielding layer is provided on at least one of the lower surface and the light-transmitting substrate. (B) The second light-shielding layer provided on the light-transmitting substrate is selectively removed by etching. (C) A photo-curable color conversion layer forming material is formed so as to fill the gap between the first light-shielding layers. (D) Exposure is performed from the light-transmitting substrate side, and the photocurable color conversion layer forming material is selectively photocured to form one type of color conversion layer. (E) The unexposed portions of the color conversion layer forming material are removed. (F) Steps (B) to (E) are repeated as many times as necessary according to the number of types of color conversion layers. 7. In the step (A), after the first light-shielding layer is planarly patterned and separated on the light-transmitting substrate,
7. The method for producing a color conversion filter according to claim 5, wherein a second light-shielding layer is laminated and disposed on the upper surface of the first light-shielding layer and on the light-transmitting substrate. 8. In the step (A), a second light-shielding layer is laminated and provided on the entire surface of the light-transmitting substrate. 7. The method for manufacturing a color conversion filter according to claim 5, wherein the color conversion filters are separately arranged. 9. In the step (A), after a second light-shielding layer is laminated and provided on the entire surface of the light-transmitting substrate, the first light-shielding layer is patterned in a plane on the second light-shielding layer. The second light-shielding layer is further laminated and disposed on the upper surface of the first light-shielding layer and on the second light-shielding layer disposed on the light-transmitting substrate. Method for manufacturing a color conversion filter. 10. The method according to claim 1, wherein in the step (A), after the second light-shielding layer is two-dimensionally patterned and separately arranged on the light-transmitting substrate,
7. The method for manufacturing a color conversion filter according to claim 5, wherein the first light-shielding layer is separately patterned and arranged on the light-transmitting substrate so as to be alternate with the second light-shielding layer. 11. The method according to claim 11, wherein in the step (A), after the second light-shielding layer is two-dimensionally patterned and separately arranged on the light-transmitting substrate,
The first light-shielding layer is formed on the light-transmitting substrate, is separately patterned and arranged in a plane so as to be alternate with the second light-shielding layer, and is then provided on the upper surface of the first light-shielding layer and on the light-transmitting substrate. 7. The method for manufacturing a color conversion filter according to claim 5, wherein a second light-shielding layer is further laminated and disposed on the second light-shielding layer.