JPH11508101A - マイクロメカニカルマイクロホン - Google Patents
マイクロメカニカルマイクロホンInfo
- Publication number
- JPH11508101A JPH11508101A JP9503529A JP50352997A JPH11508101A JP H11508101 A JPH11508101 A JP H11508101A JP 9503529 A JP9503529 A JP 9503529A JP 50352997 A JP50352997 A JP 50352997A JP H11508101 A JPH11508101 A JP H11508101A
- Authority
- JP
- Japan
- Prior art keywords
- microphone
- membrane
- micro
- transducer element
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000012528 membrane Substances 0.000 claims abstract description 96
- 238000007789 sealing Methods 0.000 claims abstract description 34
- 230000002093 peripheral effect Effects 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000012799 electrically-conductive coating Substances 0.000 claims 1
- 239000000428 dust Substances 0.000 abstract description 7
- 230000003068 static effect Effects 0.000 description 25
- 230000008859 change Effects 0.000 description 16
- 230000035945 sensitivity Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 229920000544 Gore-Tex Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Laminated Bodies (AREA)
- Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DK726/95 | 1995-06-23 | ||
| DK072695A DK172085B1 (da) | 1995-06-23 | 1995-06-23 | Mikromekanisk mikrofon |
| PCT/DK1996/000276 WO1997001258A1 (en) | 1995-06-23 | 1996-06-21 | Micromechanical microphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11508101A true JPH11508101A (ja) | 1999-07-13 |
| JPH11508101A5 JPH11508101A5 (enExample) | 2004-08-05 |
Family
ID=8096839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9503529A Ceased JPH11508101A (ja) | 1995-06-23 | 1996-06-21 | マイクロメカニカルマイクロホン |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6075867A (enExample) |
| EP (1) | EP0872153B1 (enExample) |
| JP (1) | JPH11508101A (enExample) |
| AT (1) | ATE205355T1 (enExample) |
| DE (1) | DE69615056T2 (enExample) |
| DK (2) | DK172085B1 (enExample) |
| ES (1) | ES2159747T3 (enExample) |
| WO (1) | WO1997001258A1 (enExample) |
Families Citing this family (73)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1318783A (fr) * | 1962-01-12 | 1963-02-22 | Dispositif de sécurité pour le blocage des portes | |
| US7881486B1 (en) * | 1996-12-31 | 2011-02-01 | Etymotic Research, Inc. | Directional microphone assembly |
| DE19715365C2 (de) * | 1997-04-11 | 1999-03-25 | Sennheiser Electronic | Kondensatormikrofon |
| US6088463A (en) | 1998-10-30 | 2000-07-11 | Microtronic A/S | Solid state silicon-based condenser microphone |
| US7003127B1 (en) | 1999-01-07 | 2006-02-21 | Sarnoff Corporation | Hearing aid with large diaphragm microphone element including a printed circuit board |
| JP2002534933A (ja) | 1999-01-07 | 2002-10-15 | サーノフ コーポレイション | プリント回路基板を有する大型ダイアフラムマイクロフォン素子を備えた補聴器 |
| AT407322B (de) * | 1999-03-23 | 2001-02-26 | Akg Acoustics Gmbh | Klein-mikrophon |
| US6522762B1 (en) | 1999-09-07 | 2003-02-18 | Microtronic A/S | Silicon-based sensor system |
| US6505076B2 (en) * | 2000-12-08 | 2003-01-07 | Advanced Bionics Corporation | Water-resistant, wideband microphone subassembly |
| US6741709B2 (en) * | 2000-12-20 | 2004-05-25 | Shure Incorporated | Condenser microphone assembly |
| GB0113255D0 (en) * | 2001-05-31 | 2001-07-25 | Scient Generics Ltd | Number generator |
| US20070113964A1 (en) * | 2001-12-10 | 2007-05-24 | Crawford Scott A | Small water-repellant microphone having improved acoustic performance and method of constructing same |
| US20030210799A1 (en) * | 2002-05-10 | 2003-11-13 | Gabriel Kaigham J. | Multiple membrane structure and method of manufacture |
| JP2004056438A (ja) * | 2002-07-19 | 2004-02-19 | Matsushita Electric Ind Co Ltd | マイクロフォン |
| US7072482B2 (en) | 2002-09-06 | 2006-07-04 | Sonion Nederland B.V. | Microphone with improved sound inlet port |
| US7142682B2 (en) | 2002-12-20 | 2006-11-28 | Sonion Mems A/S | Silicon-based transducer for use in hearing instruments and listening devices |
| EP1629687A1 (en) * | 2003-05-15 | 2006-03-01 | Oticon A/S | Microphone with adjustable properties |
| JP4188325B2 (ja) * | 2005-02-09 | 2008-11-26 | ホシデン株式会社 | 防塵板内蔵マイクロホン |
| DE102005008512B4 (de) * | 2005-02-24 | 2016-06-23 | Epcos Ag | Elektrisches Modul mit einem MEMS-Mikrofon |
| DE102005008514B4 (de) * | 2005-02-24 | 2019-05-16 | Tdk Corporation | Mikrofonmembran und Mikrofon mit der Mikrofonmembran |
| DE102005008511B4 (de) * | 2005-02-24 | 2019-09-12 | Tdk Corporation | MEMS-Mikrofon |
| JP4863993B2 (ja) * | 2005-05-31 | 2012-01-25 | 日本碍子株式会社 | 物体の通過検出装置 |
| DE102005053767B4 (de) * | 2005-11-10 | 2014-10-30 | Epcos Ag | MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau |
| DE102005053765B4 (de) * | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS-Package und Verfahren zur Herstellung |
| US8081783B2 (en) * | 2006-06-20 | 2011-12-20 | Industrial Technology Research Institute | Miniature acoustic transducer |
| TWI370101B (en) * | 2007-05-15 | 2012-08-11 | Ind Tech Res Inst | Package and packaging assembly of microelectromechanical sysyem microphone |
| TWI323242B (en) * | 2007-05-15 | 2010-04-11 | Ind Tech Res Inst | Package and packageing assembly of microelectromechanical system microphone |
| TWI343756B (en) * | 2009-08-10 | 2011-06-11 | Ind Tech Res Inst | Flat loudspeaker structure |
| US7832080B2 (en) * | 2007-10-11 | 2010-11-16 | Etymotic Research, Inc. | Directional microphone assembly |
| TWI336770B (en) * | 2007-11-05 | 2011-02-01 | Ind Tech Res Inst | Sensor |
| WO2009154981A2 (en) * | 2008-05-27 | 2009-12-23 | Tufts University | Mems microphone array on a chip |
| US9071910B2 (en) * | 2008-07-24 | 2015-06-30 | Cochlear Limited | Implantable microphone device |
| TWI405472B (zh) * | 2008-07-31 | 2013-08-11 | Htc Corp | 電子裝置及其電聲換能器 |
| DE102008058787B4 (de) * | 2008-11-24 | 2017-06-08 | Sennheiser Electronic Gmbh & Co. Kg | Mikrofon |
| US9247357B2 (en) | 2009-03-13 | 2016-01-26 | Cochlear Limited | DACS actuator |
| US20100303274A1 (en) * | 2009-05-18 | 2010-12-02 | William Ryan | Microphone Having Reduced Vibration Sensitivity |
| WO2011116246A1 (en) * | 2010-03-19 | 2011-09-22 | Advanced Bionics Ag | Waterproof acoustic element enclosures and apparatus including the same |
| DE102010017959A1 (de) * | 2010-04-22 | 2011-10-27 | Epcos Ag | Mikrofon mit breitem Dynamikbereich |
| EP2432249A1 (en) * | 2010-07-02 | 2012-03-21 | Knowles Electronics Asia PTE. Ltd. | Microphone |
| CN106878838B (zh) | 2011-01-18 | 2019-04-30 | 领先仿生公司 | 防潮耳机和包括防潮耳机的可植入耳蜗刺激系统 |
| DE112012005578B4 (de) * | 2012-01-05 | 2019-11-07 | Tdk Corporation | Differenzielles Mikrofon und Verfahren zum Ansteuern eines differenziellen Mikrofons |
| US8723277B2 (en) * | 2012-02-29 | 2014-05-13 | Infineon Technologies Ag | Tunable MEMS device and method of making a tunable MEMS device |
| US9002037B2 (en) | 2012-02-29 | 2015-04-07 | Infineon Technologies Ag | MEMS structure with adjustable ventilation openings |
| US8983097B2 (en) | 2012-02-29 | 2015-03-17 | Infineon Technologies Ag | Adjustable ventilation openings in MEMS structures |
| JP6426620B2 (ja) | 2012-12-18 | 2018-11-21 | Tdk株式会社 | トップポートｍｅｍｓマイクロフォン及びその製造方法 |
| US9173024B2 (en) * | 2013-01-31 | 2015-10-27 | Invensense, Inc. | Noise mitigating microphone system |
| DE102013207497A1 (de) * | 2013-04-25 | 2014-11-13 | Robert Bosch Gmbh | Bauelement mit einer mikromechanischen Mikrofonstruktur |
| DE102013106353B4 (de) * | 2013-06-18 | 2018-06-28 | Tdk Corporation | Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement |
| US9181080B2 (en) | 2013-06-28 | 2015-11-10 | Infineon Technologies Ag | MEMS microphone with low pressure region between diaphragm and counter electrode |
| US9024396B2 (en) | 2013-07-12 | 2015-05-05 | Infineon Technologies Ag | Device with MEMS structure and ventilation path in support structure |
| DE102013214823A1 (de) * | 2013-07-30 | 2015-02-05 | Robert Bosch Gmbh | Mikrofonbauteil mit mindestens zwei MEMS-Mikrofonbauelementen |
| US9510107B2 (en) | 2014-03-06 | 2016-11-29 | Infineon Technologies Ag | Double diaphragm MEMS microphone without a backplate element |
| US9438979B2 (en) * | 2014-03-06 | 2016-09-06 | Infineon Technologies Ag | MEMS sensor structure for sensing pressure waves and a change in ambient pressure |
| US9494477B2 (en) | 2014-03-31 | 2016-11-15 | Infineon Technologies Ag | Dynamic pressure sensor |
| US9554207B2 (en) * | 2015-04-30 | 2017-01-24 | Shure Acquisition Holdings, Inc. | Offset cartridge microphones |
| GB2554470A (en) | 2016-09-26 | 2018-04-04 | Cirrus Logic Int Semiconductor Ltd | MEMS device and process |
| DE102017103195B4 (de) * | 2017-02-16 | 2021-04-08 | Infineon Technologies Ag | Mikroelektromechanisches Mikrofon und Herstellungsverfahren für ein Mikroelektromechanisches Mikrofon |
| WO2018178772A2 (en) | 2017-03-28 | 2018-10-04 | Nanofone Ltd. | High performance sealed-gap capacitive microphone |
| DE102017213277B4 (de) * | 2017-08-01 | 2019-08-14 | Infineon Technologies Ag | Mems-sensoren, verfahren zum bereitstellen derselben und verfahren zum betreiben eines mems-sensors |
| WO2019135204A1 (en) | 2018-01-08 | 2019-07-11 | Nanofone Limited | High performance sealed-gap capacitive microphone with various gap geometries |
| JP7410935B2 (ja) | 2018-05-24 | 2024-01-10 | ザ リサーチ ファウンデーション フォー ザ ステイト ユニバーシティー オブ ニューヨーク | 容量性センサ |
| CN112840676B (zh) | 2018-10-05 | 2022-05-03 | 美商楼氏电子有限公司 | 响应于声学信号来生成电信号的声学换能器和麦克风组件 |
| WO2020072920A1 (en) | 2018-10-05 | 2020-04-09 | Knowles Electronics, Llc | Microphone device with ingress protection |
| CN112789239A (zh) | 2018-10-05 | 2021-05-11 | 美商楼氏电子有限公司 | 形成包括褶皱的mems振膜的方法 |
| US11932533B2 (en) | 2020-12-21 | 2024-03-19 | Infineon Technologies Ag | Signal processing circuit for triple-membrane MEMS device |
| US11889283B2 (en) | 2020-12-21 | 2024-01-30 | Infineon Technologies Ag | Triple-membrane MEMS device |
| US12240748B2 (en) | 2021-03-21 | 2025-03-04 | Knowles Electronics, Llc | MEMS die and MEMS-based sensor |
| US11528546B2 (en) | 2021-04-05 | 2022-12-13 | Knowles Electronics, Llc | Sealed vacuum MEMS die |
| US11540048B2 (en) | 2021-04-16 | 2022-12-27 | Knowles Electronics, Llc | Reduced noise MEMS device with force feedback |
| US11649161B2 (en) | 2021-07-26 | 2023-05-16 | Knowles Electronics, Llc | Diaphragm assembly with non-uniform pillar distribution |
| US11772961B2 (en) | 2021-08-26 | 2023-10-03 | Knowles Electronics, Llc | MEMS device with perimeter barometric relief pierce |
| US11780726B2 (en) | 2021-11-03 | 2023-10-10 | Knowles Electronics, Llc | Dual-diaphragm assembly having center constraint |
| KR20230115058A (ko) * | 2022-01-26 | 2023-08-02 | 주식회사 디비하이텍 | 맴스 마이크로폰 구조 및 제조방법 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3980838A (en) * | 1974-02-20 | 1976-09-14 | Tokyo Shibaura Electric Co., Ltd. | Plural electret electroacoustic transducer |
| FR2402374A1 (fr) * | 1977-08-30 | 1979-03-30 | Thomson Brandt | Dispositif de montage d'un microphone incorpore dans un appareil d'enregistrement sonore et appareil a microphone incorpore |
| FR2542552B1 (fr) * | 1983-03-07 | 1986-04-11 | Thomson Csf | Transducteur electroacoustique a diaphragme piezo-electrique |
| US5085070A (en) * | 1990-02-07 | 1992-02-04 | At&T Bell Laboratories | Capacitive force-balance system for measuring small forces and pressures |
| WO1995015067A1 (de) * | 1993-11-23 | 1995-06-01 | Lux Wellenhof Gabriele | Hülle für hörgeräte, damit versehene hörgeräte bzw. teile davon und hörtestvorrichtung und verfahren |
-
1995
- 1995-06-23 DK DK072695A patent/DK172085B1/da not_active IP Right Cessation
-
1996
- 1996-06-21 ES ES96921908T patent/ES2159747T3/es not_active Expired - Lifetime
- 1996-06-21 AT AT96921908T patent/ATE205355T1/de not_active IP Right Cessation
- 1996-06-21 WO PCT/DK1996/000276 patent/WO1997001258A1/en not_active Ceased
- 1996-06-21 US US08/981,714 patent/US6075867A/en not_active Expired - Lifetime
- 1996-06-21 EP EP96921908A patent/EP0872153B1/en not_active Expired - Lifetime
- 1996-06-21 DK DK96921908T patent/DK0872153T3/da active
- 1996-06-21 DE DE69615056T patent/DE69615056T2/de not_active Expired - Lifetime
- 1996-06-21 JP JP9503529A patent/JPH11508101A/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| EP0872153A1 (en) | 1998-10-21 |
| ATE205355T1 (de) | 2001-09-15 |
| US6075867A (en) | 2000-06-13 |
| DK0872153T3 (da) | 2001-11-19 |
| EP0872153B1 (en) | 2001-09-05 |
| WO1997001258A1 (en) | 1997-01-09 |
| DE69615056T2 (de) | 2002-04-25 |
| DE69615056D1 (de) | 2001-10-11 |
| DK172085B1 (da) | 1997-10-13 |
| DK72695A (da) | 1996-12-24 |
| ES2159747T3 (es) | 2001-10-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20051115 |
|
| A313 | Final decision of rejection without a dissenting response from the applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A313 Effective date: 20060403 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20060516 |