DE69615056T2 - Mikromechanisches mikrofon - Google Patents
Mikromechanisches mikrofonInfo
- Publication number
- DE69615056T2 DE69615056T2 DE69615056T DE69615056T DE69615056T2 DE 69615056 T2 DE69615056 T2 DE 69615056T2 DE 69615056 T DE69615056 T DE 69615056T DE 69615056 T DE69615056 T DE 69615056T DE 69615056 T2 DE69615056 T2 DE 69615056T2
- Authority
- DE
- Germany
- Prior art keywords
- membranes
- microphone
- transducer element
- center electrode
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 239000012528 membrane Substances 0.000 claims description 68
- 239000000428 dust Substances 0.000 abstract description 5
- 230000003068 static effect Effects 0.000 description 24
- 230000035945 sensitivity Effects 0.000 description 15
- 230000008859 change Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000010276 construction Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 229920000544 Gore-Tex Polymers 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000012799 electrically-conductive coating Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Laminated Bodies (AREA)
- Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DK072695A DK172085B1 (da) | 1995-06-23 | 1995-06-23 | Mikromekanisk mikrofon |
| PCT/DK1996/000276 WO1997001258A1 (en) | 1995-06-23 | 1996-06-21 | Micromechanical microphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69615056D1 DE69615056D1 (de) | 2001-10-11 |
| DE69615056T2 true DE69615056T2 (de) | 2002-04-25 |
Family
ID=8096839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69615056T Expired - Lifetime DE69615056T2 (de) | 1995-06-23 | 1996-06-21 | Mikromechanisches mikrofon |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6075867A (enExample) |
| EP (1) | EP0872153B1 (enExample) |
| JP (1) | JPH11508101A (enExample) |
| AT (1) | ATE205355T1 (enExample) |
| DE (1) | DE69615056T2 (enExample) |
| DK (2) | DK172085B1 (enExample) |
| ES (1) | ES2159747T3 (enExample) |
| WO (1) | WO1997001258A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010017959A1 (de) * | 2010-04-22 | 2011-10-27 | Epcos Ag | Mikrofon mit breitem Dynamikbereich |
| US9510107B2 (en) | 2014-03-06 | 2016-11-29 | Infineon Technologies Ag | Double diaphragm MEMS microphone without a backplate element |
Families Citing this family (71)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1318783A (fr) * | 1962-01-12 | 1963-02-22 | Dispositif de sécurité pour le blocage des portes | |
| US7881486B1 (en) * | 1996-12-31 | 2011-02-01 | Etymotic Research, Inc. | Directional microphone assembly |
| DE19715365C2 (de) * | 1997-04-11 | 1999-03-25 | Sennheiser Electronic | Kondensatormikrofon |
| US6088463A (en) | 1998-10-30 | 2000-07-11 | Microtronic A/S | Solid state silicon-based condenser microphone |
| US7003127B1 (en) | 1999-01-07 | 2006-02-21 | Sarnoff Corporation | Hearing aid with large diaphragm microphone element including a printed circuit board |
| JP2002534933A (ja) | 1999-01-07 | 2002-10-15 | サーノフ コーポレイション | プリント回路基板を有する大型ダイアフラムマイクロフォン素子を備えた補聴器 |
| AT407322B (de) * | 1999-03-23 | 2001-02-26 | Akg Acoustics Gmbh | Klein-mikrophon |
| US6522762B1 (en) | 1999-09-07 | 2003-02-18 | Microtronic A/S | Silicon-based sensor system |
| US6505076B2 (en) * | 2000-12-08 | 2003-01-07 | Advanced Bionics Corporation | Water-resistant, wideband microphone subassembly |
| US6741709B2 (en) * | 2000-12-20 | 2004-05-25 | Shure Incorporated | Condenser microphone assembly |
| GB0113255D0 (en) * | 2001-05-31 | 2001-07-25 | Scient Generics Ltd | Number generator |
| US20070113964A1 (en) * | 2001-12-10 | 2007-05-24 | Crawford Scott A | Small water-repellant microphone having improved acoustic performance and method of constructing same |
| US20030210799A1 (en) * | 2002-05-10 | 2003-11-13 | Gabriel Kaigham J. | Multiple membrane structure and method of manufacture |
| JP2004056438A (ja) * | 2002-07-19 | 2004-02-19 | Matsushita Electric Ind Co Ltd | マイクロフォン |
| US7072482B2 (en) | 2002-09-06 | 2006-07-04 | Sonion Nederland B.V. | Microphone with improved sound inlet port |
| US7142682B2 (en) | 2002-12-20 | 2006-11-28 | Sonion Mems A/S | Silicon-based transducer for use in hearing instruments and listening devices |
| EP1629687A1 (en) * | 2003-05-15 | 2006-03-01 | Oticon A/S | Microphone with adjustable properties |
| JP4188325B2 (ja) * | 2005-02-09 | 2008-11-26 | ホシデン株式会社 | 防塵板内蔵マイクロホン |
| DE102005008512B4 (de) * | 2005-02-24 | 2016-06-23 | Epcos Ag | Elektrisches Modul mit einem MEMS-Mikrofon |
| DE102005008514B4 (de) * | 2005-02-24 | 2019-05-16 | Tdk Corporation | Mikrofonmembran und Mikrofon mit der Mikrofonmembran |
| DE102005008511B4 (de) * | 2005-02-24 | 2019-09-12 | Tdk Corporation | MEMS-Mikrofon |
| JP4863993B2 (ja) * | 2005-05-31 | 2012-01-25 | 日本碍子株式会社 | 物体の通過検出装置 |
| DE102005053767B4 (de) * | 2005-11-10 | 2014-10-30 | Epcos Ag | MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau |
| DE102005053765B4 (de) * | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS-Package und Verfahren zur Herstellung |
| US8081783B2 (en) * | 2006-06-20 | 2011-12-20 | Industrial Technology Research Institute | Miniature acoustic transducer |
| TWI370101B (en) * | 2007-05-15 | 2012-08-11 | Ind Tech Res Inst | Package and packaging assembly of microelectromechanical sysyem microphone |
| TWI323242B (en) * | 2007-05-15 | 2010-04-11 | Ind Tech Res Inst | Package and packageing assembly of microelectromechanical system microphone |
| TWI343756B (en) * | 2009-08-10 | 2011-06-11 | Ind Tech Res Inst | Flat loudspeaker structure |
| US7832080B2 (en) * | 2007-10-11 | 2010-11-16 | Etymotic Research, Inc. | Directional microphone assembly |
| TWI336770B (en) * | 2007-11-05 | 2011-02-01 | Ind Tech Res Inst | Sensor |
| WO2009154981A2 (en) * | 2008-05-27 | 2009-12-23 | Tufts University | Mems microphone array on a chip |
| US9071910B2 (en) * | 2008-07-24 | 2015-06-30 | Cochlear Limited | Implantable microphone device |
| TWI405472B (zh) * | 2008-07-31 | 2013-08-11 | Htc Corp | 電子裝置及其電聲換能器 |
| DE102008058787B4 (de) * | 2008-11-24 | 2017-06-08 | Sennheiser Electronic Gmbh & Co. Kg | Mikrofon |
| US9247357B2 (en) | 2009-03-13 | 2016-01-26 | Cochlear Limited | DACS actuator |
| US20100303274A1 (en) * | 2009-05-18 | 2010-12-02 | William Ryan | Microphone Having Reduced Vibration Sensitivity |
| WO2011116246A1 (en) * | 2010-03-19 | 2011-09-22 | Advanced Bionics Ag | Waterproof acoustic element enclosures and apparatus including the same |
| EP2432249A1 (en) * | 2010-07-02 | 2012-03-21 | Knowles Electronics Asia PTE. Ltd. | Microphone |
| CN106878838B (zh) | 2011-01-18 | 2019-04-30 | 领先仿生公司 | 防潮耳机和包括防潮耳机的可植入耳蜗刺激系统 |
| DE112012005578B4 (de) * | 2012-01-05 | 2019-11-07 | Tdk Corporation | Differenzielles Mikrofon und Verfahren zum Ansteuern eines differenziellen Mikrofons |
| US8723277B2 (en) * | 2012-02-29 | 2014-05-13 | Infineon Technologies Ag | Tunable MEMS device and method of making a tunable MEMS device |
| US9002037B2 (en) | 2012-02-29 | 2015-04-07 | Infineon Technologies Ag | MEMS structure with adjustable ventilation openings |
| US8983097B2 (en) | 2012-02-29 | 2015-03-17 | Infineon Technologies Ag | Adjustable ventilation openings in MEMS structures |
| JP6426620B2 (ja) | 2012-12-18 | 2018-11-21 | Tdk株式会社 | トップポートｍｅｍｓマイクロフォン及びその製造方法 |
| US9173024B2 (en) * | 2013-01-31 | 2015-10-27 | Invensense, Inc. | Noise mitigating microphone system |
| DE102013207497A1 (de) * | 2013-04-25 | 2014-11-13 | Robert Bosch Gmbh | Bauelement mit einer mikromechanischen Mikrofonstruktur |
| DE102013106353B4 (de) * | 2013-06-18 | 2018-06-28 | Tdk Corporation | Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement |
| US9181080B2 (en) | 2013-06-28 | 2015-11-10 | Infineon Technologies Ag | MEMS microphone with low pressure region between diaphragm and counter electrode |
| US9024396B2 (en) | 2013-07-12 | 2015-05-05 | Infineon Technologies Ag | Device with MEMS structure and ventilation path in support structure |
| DE102013214823A1 (de) * | 2013-07-30 | 2015-02-05 | Robert Bosch Gmbh | Mikrofonbauteil mit mindestens zwei MEMS-Mikrofonbauelementen |
| US9438979B2 (en) * | 2014-03-06 | 2016-09-06 | Infineon Technologies Ag | MEMS sensor structure for sensing pressure waves and a change in ambient pressure |
| US9494477B2 (en) | 2014-03-31 | 2016-11-15 | Infineon Technologies Ag | Dynamic pressure sensor |
| US9554207B2 (en) * | 2015-04-30 | 2017-01-24 | Shure Acquisition Holdings, Inc. | Offset cartridge microphones |
| GB2554470A (en) | 2016-09-26 | 2018-04-04 | Cirrus Logic Int Semiconductor Ltd | MEMS device and process |
| DE102017103195B4 (de) * | 2017-02-16 | 2021-04-08 | Infineon Technologies Ag | Mikroelektromechanisches Mikrofon und Herstellungsverfahren für ein Mikroelektromechanisches Mikrofon |
| WO2018178772A2 (en) | 2017-03-28 | 2018-10-04 | Nanofone Ltd. | High performance sealed-gap capacitive microphone |
| DE102017213277B4 (de) * | 2017-08-01 | 2019-08-14 | Infineon Technologies Ag | Mems-sensoren, verfahren zum bereitstellen derselben und verfahren zum betreiben eines mems-sensors |
| WO2019135204A1 (en) | 2018-01-08 | 2019-07-11 | Nanofone Limited | High performance sealed-gap capacitive microphone with various gap geometries |
| JP7410935B2 (ja) | 2018-05-24 | 2024-01-10 | ザ リサーチ ファウンデーション フォー ザ ステイト ユニバーシティー オブ ニューヨーク | 容量性センサ |
| CN112840676B (zh) | 2018-10-05 | 2022-05-03 | 美商楼氏电子有限公司 | 响应于声学信号来生成电信号的声学换能器和麦克风组件 |
| WO2020072920A1 (en) | 2018-10-05 | 2020-04-09 | Knowles Electronics, Llc | Microphone device with ingress protection |
| CN112789239A (zh) | 2018-10-05 | 2021-05-11 | 美商楼氏电子有限公司 | 形成包括褶皱的mems振膜的方法 |
| US11932533B2 (en) | 2020-12-21 | 2024-03-19 | Infineon Technologies Ag | Signal processing circuit for triple-membrane MEMS device |
| US11889283B2 (en) | 2020-12-21 | 2024-01-30 | Infineon Technologies Ag | Triple-membrane MEMS device |
| US12240748B2 (en) | 2021-03-21 | 2025-03-04 | Knowles Electronics, Llc | MEMS die and MEMS-based sensor |
| US11528546B2 (en) | 2021-04-05 | 2022-12-13 | Knowles Electronics, Llc | Sealed vacuum MEMS die |
| US11540048B2 (en) | 2021-04-16 | 2022-12-27 | Knowles Electronics, Llc | Reduced noise MEMS device with force feedback |
| US11649161B2 (en) | 2021-07-26 | 2023-05-16 | Knowles Electronics, Llc | Diaphragm assembly with non-uniform pillar distribution |
| US11772961B2 (en) | 2021-08-26 | 2023-10-03 | Knowles Electronics, Llc | MEMS device with perimeter barometric relief pierce |
| US11780726B2 (en) | 2021-11-03 | 2023-10-10 | Knowles Electronics, Llc | Dual-diaphragm assembly having center constraint |
| KR20230115058A (ko) * | 2022-01-26 | 2023-08-02 | 주식회사 디비하이텍 | 맴스 마이크로폰 구조 및 제조방법 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3980838A (en) * | 1974-02-20 | 1976-09-14 | Tokyo Shibaura Electric Co., Ltd. | Plural electret electroacoustic transducer |
| FR2402374A1 (fr) * | 1977-08-30 | 1979-03-30 | Thomson Brandt | Dispositif de montage d'un microphone incorpore dans un appareil d'enregistrement sonore et appareil a microphone incorpore |
| FR2542552B1 (fr) * | 1983-03-07 | 1986-04-11 | Thomson Csf | Transducteur electroacoustique a diaphragme piezo-electrique |
| US5085070A (en) * | 1990-02-07 | 1992-02-04 | At&T Bell Laboratories | Capacitive force-balance system for measuring small forces and pressures |
| WO1995015067A1 (de) * | 1993-11-23 | 1995-06-01 | Lux Wellenhof Gabriele | Hülle für hörgeräte, damit versehene hörgeräte bzw. teile davon und hörtestvorrichtung und verfahren |
-
1995
- 1995-06-23 DK DK072695A patent/DK172085B1/da not_active IP Right Cessation
-
1996
- 1996-06-21 ES ES96921908T patent/ES2159747T3/es not_active Expired - Lifetime
- 1996-06-21 AT AT96921908T patent/ATE205355T1/de not_active IP Right Cessation
- 1996-06-21 WO PCT/DK1996/000276 patent/WO1997001258A1/en not_active Ceased
- 1996-06-21 US US08/981,714 patent/US6075867A/en not_active Expired - Lifetime
- 1996-06-21 EP EP96921908A patent/EP0872153B1/en not_active Expired - Lifetime
- 1996-06-21 DK DK96921908T patent/DK0872153T3/da active
- 1996-06-21 DE DE69615056T patent/DE69615056T2/de not_active Expired - Lifetime
- 1996-06-21 JP JP9503529A patent/JPH11508101A/ja not_active Ceased
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010017959A1 (de) * | 2010-04-22 | 2011-10-27 | Epcos Ag | Mikrofon mit breitem Dynamikbereich |
| US9510107B2 (en) | 2014-03-06 | 2016-11-29 | Infineon Technologies Ag | Double diaphragm MEMS microphone without a backplate element |
| DE102015103321B4 (de) | 2014-03-06 | 2018-06-14 | Infineon Technologies Ag | Doppelmembran-Mems-Mikrophon ohne Rückplattenelement |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0872153A1 (en) | 1998-10-21 |
| ATE205355T1 (de) | 2001-09-15 |
| US6075867A (en) | 2000-06-13 |
| DK0872153T3 (da) | 2001-11-19 |
| EP0872153B1 (en) | 2001-09-05 |
| WO1997001258A1 (en) | 1997-01-09 |
| JPH11508101A (ja) | 1999-07-13 |
| DE69615056D1 (de) | 2001-10-11 |
| DK172085B1 (da) | 1997-10-13 |
| DK72695A (da) | 1996-12-24 |
| ES2159747T3 (es) | 2001-10-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: EPCOS PTE LTD, SINGAPORE, SG |
|
| 8328 | Change in the person/name/address of the agent |
Representative=s name: EPPING HERMANN FISCHER, PATENTANWALTSGESELLSCHAFT |