JPH1145896A - Semiconductor device resin-sealing metallic mold and method for sealing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin-sealing metallic mold of a semiconductor device capable of resin sealing in a depressurizatrion environment without spoiling productivity and workability, and a method for sealing it. SOLUTION: Before the matched faces of upper and lower metallic molds are allowed to abut to each other, the top end of a seal 5 provided at the outer peripheral part of one metallic mold is allowed to slide on the side face of a seal bearing which is provided at the outer periphery of the opposed abutting face so as to be brought into contact with this. In a state that a constant gap is provided between the abutting faces of the upper and the lower metallic molds, inside air is exhausted from an air exit connected with a space formed of the seal 5 and the upper and lower matched faces, so that the seal can be further adhered to the side face of the seal bearing. The airtightness of the a space 21 can be maintained by using this self-sealability, high-speed deairing is operated through a constant gap, the upper and lower metallic molds are allowed to abut to each other, and sealing resin is allowed to flow into a cavity.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing mold for a semiconductor device and a method for sealing the same, and more particularly to a resin sealing step for a semiconductor device.

[0002]

2. Description of the Related Art Conventionally, the resin encapsulation process of a semiconductor device is usually performed under atmospheric pressure and has excellent workability. However, the residual gas in the resin encapsulation mold or the gas generated from the molten resin is molded. It was trapped as bubbles in the material, causing defects.

FIG. 6 schematically shows a cross section of a conventional resin sealing mold for a semiconductor device. The mold is composed of a pair of upper mold 27 and lower mold 29, and a cavity 34 is formed inside by closing the opposing contact surfaces.

A lead frame to which a semiconductor chip has been die-bonded and wire-bonded is prepared in advance, and the lead frame is placed between upper and lower molds 27 and 29 with the mold opened, and the semiconductor chip is placed in the center of the cavity. Arrange so that they come together. When the upper and lower molds are closed with the lead frame therebetween as described above, the semiconductor chip supported by the lead frame is fixed to the center of the cavity 33.

[0005] Thereafter, the temperature of the resin tablet 32 is raised and melted, and the melted resin is flown into the cavity 34 through the plunger 31 provided in the lower mold 29, so that the outer periphery of the semiconductor chip is formed without gaps. Resin molding can be performed. However, as described above, there is a problem that bubbles may be mixed into the flowing resin, which causes a reduction in reliability.

Referring to FIG. 7, the structure of a conventional resin mold for semiconductor device used at atmospheric pressure will be described in more detail.
The left and right sides of FIG. 7 show cross-sectional structures of the conventional mold at different depths.

[0007] The conventional upper die shown in FIG. 7 includes a cavity block 1, a cavity holder 2, an ejector holder 3, an ejector plate 4, a fastening bolt 7, a push-down pin 8, and a support pin 10. The cavity block contains a molten resin 33, and the ejector holder 3 has an ejector pin 36 for releasing the resin molded in the cavity. The cavity block has a lead pin receiving hole 39 for aligning the cavity with the lead frame.

The lower mold includes a cavity block 11, a cavity holder 12, an ejector holder 13, an ejector plate 14, a fastening bolt 17, and a push-up pin 1.
8. Support pins 20 are provided. The cavity block has the cavity 34 and the ejector holder 1
Reference numeral 3 denotes an ejector pin 37 for releasing the resin molded in the cavity. A lead pin 38 for positioning the cavity and the lead frame is formed in the cavity block. 31 is a plunger mechanism for pushing out the molten resin.

FIG. 7 shows an example in which the cavities are formed in the lower mold cavity block. However, as shown in FIG. 6, the cavities are generally formed in the upper and lower cavity blocks. .

The ejector pins 36 and 37 are brought into close contact with the upper molds 2 and 3 and the lower molds 12 and 13 using the push-down pins 8 and the push-up pins 18 so that the ejector pins 36 and 37 are attached to the molding surface of the molding material. It is extruded and this is released. Prior to resin sealing, residual resin, fine dust, and the like are removed using a die cleaner.

In such a conventional mold, there has been proposed a mold structure in which a surface through which a resin flows during molding can be set in a reduced pressure environment. If the air between the upper and lower molds and the gas contained in the resin are sufficiently degassed before performing the resin sealing, the problem that air bubbles are contained inside the molded product can be avoided.

FIG. 8 shows an example of a mold of a reduced pressure specification in which an O-ring 40 is arranged on the contact surface of the mold. FIG. 9 shows a structure in which the upper and lower dies are fitted to each other, and O
An example in which the ring 41 is arranged is shown. Other parts are the same as those of the mold described in FIG.

In the example of the conventional semiconductor resin sealing mold shown in FIGS. 8 and 9, a seal such as an O-ring is forcibly crushed by pressure applied between the upper and lower molds. Adopts a forced sealing method where the contact surfaces come into contact.

The O-ring has been conventionally used as a sealant in many cases, but is generally used by being compressed. In the case of FIG. 8, a force for compressing the O-ring 40 in the mold clamping direction is required. become. In other words, a stronger servomotor is required as a mold clamping mechanism, and O
A space for providing the ring 40 is required.

On the other hand, considering the pumping speed, it is desirable to provide a slight gap between the contact surfaces of the dies before the upper and lower dies are completely in contact with each other, and to evacuate the interior.
In the above-described structure for compressing the gap, it is difficult to set such a delicate gap.

In the case shown in FIG. 9, the above problem can be alleviated because the sliding resistance of the O-ring 41 on the side surface can be taken into account with respect to the direct compression force to the O-ring 40 as shown in FIG. However, in terms of space, a seal area larger than that in FIG. 9 is required. Further, in a mold of a chase mold exchange method as shown in FIG. 7 (the upper mold and the lower mold are collectively referred to as a chase mold), a sliding O-ring 41 as shown in FIG.
It is difficult to have a structure with

In the resin sealing step of the semiconductor device,
It is important to remove the resin residue and dust using a die cleaner before the sealing step. However, in the structure having the sliding type O-ring 41 shown in FIG. 9, a general die cleaner must be used. There is a drawback that can not be.

[0018]

As described above, in the conventional resin-molding mold for semiconductor device of a reduced pressure specification and the method for sealing the same, in the structure in which the O-ring is arranged on the contact surface of the mold, the O-ring is used. Need space for placement,
There are many problems such as the necessity of a powerful servomotor that crushes the O-ring, and the necessity of fine adjustment of the gap between the contact surfaces in order to increase the decompression speed.

In the structure in which the O-ring is arranged on the side surface of the mold, a large seal area is required. Further, since a general die cleaner cannot be used, resin residues and dust are removed before resin sealing. There is a problem that it is difficult to perform the operation sufficiently.

The present invention has been made in order to solve the above-mentioned problems. By providing a seal on one of the outer peripheries of the upper and lower dies or one of the outer peripheries of the upper and lower die sets for holding the upper and lower dies, the above-mentioned problem is solved. It is an object of the present invention to provide a semiconductor device resin sealing mold of reduced pressure specification and a method of sealing the same, which can solve the above problem.

[0021]

According to the resin sealing mold for a semiconductor device of the present invention, a seal is formed on the outer periphery of one of the contact surfaces of the upper and lower molds, and the contact surfaces of the upper and lower molds are in contact with each other. Before you do
An exhaust opening is formed so that the inner surface of the tip of the seal contacts the outer periphery of the other contact surface, and is connected to the space formed by the seal and the contact surfaces of the upper and lower molds. It is characterized by.

The resin sealing mold for a semiconductor device of the present invention is
A seal is formed on the outer periphery of one of the upper and lower die sets that respectively hold the upper and lower molds, and before the contact surfaces of the upper and lower molds come into contact, the inner surface of the tip of the seal contacts the outer periphery of the other die set. And an exhaust opening connected to a space formed by the seal and the contact surfaces of the upper and lower molds.

The seal is characterized by exhibiting a self-sealing property by exhausting air from an exhaust opening connected to the space. Preferably, the outer periphery of the other abutting surface with which the inner surface of the tip of the seal comes into contact is provided with a taper angle so that the tip of the seal spreads along the alignment direction of the upper and lower molds. It is characterized by.

A protrusion is formed on the outer periphery of the other contact surface so as to surround the periphery of the other contact surface, and the inner surface of the tip of the seal contacts the outer periphery of the protrusion. It is characterized by the following.

Preferably, the distance between the contact surfaces in the space formed by the seal and the contact surfaces of the upper and lower molds is
It is 0.1 mm or more and 20 mm or less. In this way, it is possible to minimize the deformation of the seal at the time of evacuation while maintaining high evacuation efficiency, and sufficiently exhibit the slidability and self-sealing property of the seal.

According to the method of sealing a resin mold for a semiconductor device of the present invention, a seal is provided on the outer periphery of one of the contact surfaces of the upper and lower molds, and the contact surfaces of the upper and lower molds are brought close to each other. Before the contact surfaces of the upper and lower molds come into contact with each other, the tip of the seal contacts the outer periphery of the other mold, and exhausts the space surrounded by the upper and lower molds and the seal in the contact state. In this case, the seal is further self-sealed, and after the contact surfaces of the self-sealed upper and lower molds are brought into contact with each other, the sealing resin flows therein.

Further, according to the method of sealing a resin sealing mold of a semiconductor device of the present invention, a seal is provided on an outer periphery of one of upper and lower die sets respectively holding the upper and lower molds, and the contact surfaces of the upper and lower molds are mutually opposed. Before the contact, the tip of the seal contacts the outer periphery of the other die set, and the space enclosed by the upper and lower die sets and the seal is evacuated in the contact state, thereby further self-sealing the seal. After the self-sealing, the contact surfaces of the upper and lower molds brought into a reduced pressure environment are brought into contact with each other, and then the sealing resin flows therein.

[0028]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIGS. 1 to 3 are sectional views showing the structure of a resin sealing mold for a semiconductor device according to the first embodiment of the present invention (hereinafter simply referred to as a mold) and a sealing method using the same. is there. 1 to 3 show cross sections of the mold of the present invention when viewed from the same direction as FIG. 7 used in the description of the conventional mold.

The mold of the present invention is used in a reduced pressure environment. Since the gist of the present invention is to show the structure of a mold for performing resin sealing under a reduced pressure environment and a sealing method thereof, it does not include a cavity, a plunger, and the like that are not directly related to the reduced pressure structure of the mold. The cross section of the portion is shown.

The mold shown in FIG. 1 comprises an upper mold and a lower mold.
The upper mold includes a cavity block 1 having a cavity into which a resin flows, a cavity holder 2 for holding the cavity, and an ejector pin (not shown) for releasing a resin molded in a cavity (not shown). ), And an ejector plate 4 for fixing the ejector holder 3.

Further, the upper mold is provided with a seal 5 which is a main part of the present invention and a seal holder 6 for fixing the seal. Reference numeral 7 denotes a fastening bolt, and 8 denotes a push-down pin having an O-ring 9 on a side surface. The resin-molded semiconductor device is released from the cavity. The O-ring 9 provided on the push-down pin 8 maintains the reduced pressure environment of the mold together with the seal 5. Reference numeral 10 denotes a support pin that supports the pressing mechanism.

The lower mold comprises a cavity block 11, a cavity holder 12, an ejector holder 13, and an ejector plate 14, like the upper mold. The lower die includes a seal receiving taper block 16 having a taper angle 15. The taper angle is such that when the upper mold and the lower mold are brought close to each other, the tip of the seal 5 is brought into contact with the seal receiver, and when the upper mold and the lower mold are brought into contact with each other, the tip of the seal 5 is pushed outward. It is formed as follows.

In addition, a fastening bolt 17, a push-up pin 18 for pushing up an ejector pin, an O-ring 19, and a support pin 20 are provided. The lower mold has a plunger mechanism for melting the tablet of the molding material and supplying the melted tablet into the cavity, but this is also not shown because it is not directly related to the present invention. FIG. 1 shows a state in which the upper and lower molds are not yet closed.

The mold of the first embodiment has a seal 5 having an L-shaped cross section and a seal holder 6 for fixing the seal 5 on the outer periphery of the upper cavity holder 2, and the lower cavity holder 12. Is characterized in that a seal receiving taper block 16 having a taper angle 15 is provided on the outer periphery of the seal receiving taper block 16.

The seal 5 is fixed to an upper seal holder 6 by pressing a horizontal portion and a vertical portion with a presser. The distal end portion of the seal 5 extending downward in a skirt shape has sufficient rigidity and length against its thickness-direction deflection. Seal holder 6 and seal receiving taper block 1
The four corners 6 are provided with a radius of curvature of an appropriate size so that the structure of the seal 5 will not be overloaded.

As shown in FIG. 2, when the upper and lower mating surfaces are brought close to each other, the inside of the lower end of the L-shaped sectional seal 5 comes into contact with the tapered surface 15 on the outer periphery of the seal receiving taper block 16. Further, when the two are brought closer to each other, the tip of the seal 5 slides while expanding the tip of the seal 5 along the tapered surface 15 while keeping the contact with the tapered surface 15. The state of close contact with No. 15 is enhanced.

Upper and lower mold cavity blocks 1, 1
The internal air is exhausted from a space 21 formed by the gap between the mating surfaces and the seal 5 through a separately provided exhaust hole (not shown). As the space is depressurized, the thin L-shaped seal 5 is further pressed against the tapered surface 15 from the outside by the atmospheric pressure, and exhibits a self-sealing property with excellent airtightness.

In the state where a certain gap is provided between the contact surfaces of the upper and lower molds as described above, if the inside of the mold is degassed as an obstacle to resin sealing, as shown in FIG. O on contact surface
Compared with the method of providing the ring 40 and crushing it to bring the contact surfaces of the upper and lower molds into close contact with each other and then exhausting the gas, the exhaust resistance is small, so that sufficient degassing can be performed in a short time.

In order to sufficiently reduce the exhaust resistance, it is desirable that the size of the gap is large. However, if the gap is excessive, the thin seal 5 having excellent self-sealing properties is deformed by the atmospheric pressure, and conversely, the airtightness is reduced. Cause problems. Therefore, a practically optimum gap size is about 1 mm. If the material and shape of the seal 5 are selected, the size of the gap can be increased to about 20 mm.

After the inside of the mold is sufficiently degassed through the space 21 having a small exhaust resistance, the mating surfaces of the upper and lower mold cavities 1 and 11 are brought into contact with each other as shown in FIG. A cavity (not shown) in which a sealing resin is provided in a cavity block using a jar (not shown).
To seal the semiconductor device chip with resin.

The semiconductor chip is die-bonded and wire-bonded to a thin lead frame, and the cavity blocks 1, 1
In No. 1, since the mating surfaces are in contact with the lead frame (not shown) interposed therebetween, the minimum value of the gap in the contact state is about 0.1 mm in thickness of the lead frame.

When the upper and lower cavity blocks 1 and 11 are evacuated after being brought into close contact with each other via the lead frame, the evacuating speed is reduced to the same level as the conventional method using an O-ring or the like. The mold provided with the seal 5
It can be used until the gap value corresponding to such a conventional sealing method is reached.

Accordingly, the value of the gap at which the present invention exerts superior high-speed degassing performance as compared with the conventional method is 0.1 mm.
Above, it is within the range of 20 mm or less. In FIGS. 1 to 3, the seal 5 is provided on the upper die, and the taper portion that contacts the seal is disposed on the lower die. However, such an arrangement is determined in consideration of the convenience of die cleaning of the die. It is. If the method of die cleaning is changed, the seal 5 can be provided in the lower mold, and the seal receiving taper block 16 can be provided in the upper mold.

Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a diagram showing a cross-sectional structure of a mold according to the second embodiment of the present invention. Contrary to the first embodiment, it is designed to have a structure in which a seal receiving block 23 is provided in an upper mold and a seal 24 is provided in a lower mold. FIG. 4 corresponds to FIG. 2 of the first embodiment, and shows a degassed state before upper and lower dies are closed.

In FIG. 4, the shape of the lower seal 24 is different from the L-shaped structure in which the whole is thinner, and has a shape in which the thin sealant extends upward from the inner periphery of the thick sealant fixed to the cavity holder 12. Has become. Further, the seal receiving block 23 is formed so as to protrude from the cavity holder 2 of the upper die, surround the cavity block 1, and, instead of providing a taper in the protruding portion, the outer periphery of the protruding portion is larger than the inner circumference of the seal 24. It was designed to be slightly smaller. As described above, even if a taper angle is not necessarily provided on the outer periphery of the seal receiving block 23, if the distal end portion of the seal 24 has a sufficient length and elasticity, a self-sealing property of the sealing material is used to form an airtight structure. The purpose of high-speed degassing before resin sealing can be achieved. After the inside of the mold is sufficiently degassed, the mating surfaces of the upper and lower mold cavities 1 and 11 are brought into contact with each other, and a sealing resin is applied to the cavity block 1 with a plunger (not shown). ,
11 flows into a cavity (not shown) provided in the semiconductor device 11, and the chip of the semiconductor device can be sealed with resin.

In the mold according to the second embodiment, deaeration inside the mold is caused not only by the space 21 between the contact surfaces of the upper and lower cavity blocks 1 and 11, but also by the cavity block 1 and the cavity block 1.
11 through the space 22 on both sides of the first
The exhaust resistance is further reduced as compared with the embodiment. The basic functions of the other parts denoted by reference numerals corresponding to FIGS. 1 to 3 are substantially the same as those of the first embodiment.

Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 5 is a diagram illustrating a cross-sectional structure of a mold according to the third embodiment. FIG. 5 shows the first and second
FIG. 5 shows a cross-sectional structure of the mold of the present invention viewed from the same direction as FIGS. 1 to 4 used in the description of the mold of the embodiment.

The mold of the present invention is used in a reduced pressure environment as in the first and second embodiments. In the third embodiment, the mold serves as a seal 26 and a seal receiver. The difference is that the tapered surface 30 is formed on the outer periphery of the upper die set 25 and the lower die set 28 that hold the upper die 27 and the lower die 29, respectively.

The gist of the present invention is that the structure of a mold for performing resin sealing under a reduced pressure environment using a seal 26 and a tapered surface 30 provided on the outer periphery of the upper die and the lower die set is described. In order to show the sealing method, the plunger 31 provided on the lower mold and the resin tablet 32 on the lower mold before melting are provided.
For the simplicity of the molten resin 33 and the cavity 34 in which the semiconductor chip is resin-molded, FIG. 6 conceptually showing the sectional structure of a conventional mold is used as it is. However, a vacuum seal according to a conventional method is provided between the lower die set 28 and the lower die 29, and between the lower die 29 and the plunger 31.

The details of the sectional structure of the upper mold and the lower mold are the same as those of the conventional upper mold and lower mold without the decompression function shown in FIG. 7 except for the vacuum seal provided in the lower mold. FIG. 5 shows a state in which the upper and lower molds are not yet closed.

The internal air is exhausted from the space 35 formed by the upper and lower molds 27 and 29 and the upper and lower die sets 25 and 28 and the seal 26 holding them through exhaust holes (not shown) provided separately. Is done. As the space is depressurized, the tip of the seal 26 is further pressed against the tapered surface 30 by the atmospheric pressure, and exhibits a self-sealing property with excellent airtightness.

As described above, even when the seal 26 and the seal receiver 30 of the present invention are formed around the contact surfaces of the upper and lower die sets, the purpose of high-speed degassing before resin sealing can be achieved. it can. After the inside of the mold has been sufficiently degassed, the mating surfaces of the upper and lower molds are brought into contact with each other.
2 is melted and flows into the cavity 34 by the plunger 31 to seal the chip of the semiconductor device with resin.

In the third embodiment, the tapered surface 30 is used as a seal receiver. However, as shown in the seal receiving block 23 of FIG. The seal 26 may be made smaller so as to have a self-sealing property by the elasticity of the distal end portion of the seal 26.

The present invention is not limited to the above embodiment. For example, in the second embodiment, if a taper angle is provided on the outer periphery of the seal receiving block 23 so as to widen the tip of the seal 24 outward, the self-sealing property of the seal 24 can be more smoothly exerted. At this time, the taper angle of the distal end portion of the seal receiving block 23 can substantially achieve the same purpose by caulking the thin portion at the distal end inward. In addition, various modifications can be made without departing from the spirit of the present invention.

[0055]

As described above, according to the mold of the present invention,
By making the seal and the opposing seal receiver a self-sealing contact with excellent airtightness, the airtightness required for deaeration inside the mold before resin sealing is maintained without requiring excessive compressive force. be able to.

Since the inner peripheral surface of the seal is movable along the outer peripheral surface of the seal receiver, before the contact surfaces of the upper die and the lower die (collectively referred to as a chase die) are closed. By providing a certain amount of space between the seal and the chase mold, the exhaust resistance at the time of degassing can be reduced and the degassing speed can be increased.

Further, since the seal and the seal receiver are provided around the chase mold or around the upper and lower die sets, a space as shown in the conventional decompression mold is not required. The feature is that the transfer from the mold can be performed relatively easily.

In addition, if the mold structure of the first and second actual modes in which the seal is completed in the chase mold, it is not necessary to provide a special seal on the die set side except for the suction and exhaust holes. Therefore, a decompression die can be realized without impairing the setup of the chase die.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a mold open state of a semiconductor resin sealing mold according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a self-sealing state of the semiconductor resin sealing mold according to the first embodiment of the present invention.

FIG. 3 is a sectional view showing a closed state of the semiconductor resin sealing mold according to the first embodiment of the present invention.

FIG. 4 is a sectional view showing a self-sealing state of a semiconductor resin sealing mold according to a second embodiment of the present invention.

FIG. 5 is a sectional view showing a self-sealing state of a semiconductor resin sealing mold according to a third embodiment of the present invention.

FIG. 6 is a cross-sectional view schematically showing a mold opening state of a conventional semiconductor resin sealing mold.

FIG. 7 is a cross-sectional view showing a mold opening state of a conventional semiconductor resin sealing mold.

FIG. 8 is a cross-sectional view showing an open state of a conventional semiconductor resin sealing mold provided with an O-ring.

FIG. 9 is a cross-sectional view showing a mold opening state of a conventional semiconductor resin sealing mold in which O-rings are provided on fitting surfaces of upper and lower molds.

[Explanation of symbols]

 1, 11 ... cavity block 2, 12 ... cavity holder 3, 13 ... ejector holder 4, 14 ... ejector plate 5, 24, 26 ... seal 6 ... seal holder 7, 17 ... fastening bolt 8, 18 ... push-down pin Push-up pins 9, 19, O-rings 10, 20 Support pins 15, 30 Tapered surface 16 Seal taper blocks 21, 22, 35 Exhaust space 23 Seal seal blocks 25, 28 Upper die set and lower Die set 27, 29 ... Upper and lower molds 31 ... Plunger 32 ... Resin tablet 33 ... Pool of molten resin 34 ... Cavities 36, 37 ... Ejector pins 38 ... Guide pins 39 ... Guide pin receiving holes 40, 41 … O-ring

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Hidenobu Sato 25-1, Ekimae Honcho, Kawasaki-ku, Kawasaki-shi, Kanagawa Prefecture Toshiba Microelectronics Corporation

Claims (10)

[Claims] 1. A semiconductor resin sealing mold in which a seal is formed on an outer periphery of one of contact surfaces of upper and lower molds, wherein the seal contacts the contact surfaces of the upper and lower molds. before,
An exhaust opening formed so that an inner surface of a tip portion of the seal contacts an outer periphery of the other contact surface, and connected to a space formed by the seal and the contact surfaces of the upper and lower molds; A resin sealing mold for a semiconductor device, comprising: 2. A semiconductor resin sealing mold in which a seal is formed on one of outer peripheries of an upper and lower die set, wherein the seal is a contact surface of the upper and lower die sets respectively held by the upper and lower die sets. Before the contact, the inner surface of the tip portion of the seal is formed so as to contact the outer periphery of the other die set, and is connected to the space formed by the seal and the contact surfaces of the upper and lower molds. A resin sealing mold for a semiconductor device comprising an exhaust opening. 3. The seal according to claim 1, wherein the seal exhibits a self-sealing property by exhausting air from an exhaust opening connected to the space. Semiconductor device resin mold. 4. The outer periphery of the other contact surface with which the inner surface of the tip of the seal contacts is tapered such that the tip of the seal spreads along the direction in which the upper and lower molds are aligned. 2. The resin mold for resin sealing of a semiconductor device according to claim 1, wherein 5. The outer periphery of the other die set with which the inner surface of the tip of the seal contacts is tapered such that the tip of the seal spreads along the direction in which the upper and lower dies are aligned. 3. The resin mold for resin sealing of a semiconductor device according to claim 2, wherein: 6. A projection formed around an outer periphery of the other contact surface so as to surround a peripheral portion of the other contact surface, and an inner surface of a tip portion of the seal is formed of the projection. 2. The resin sealing mold for a semiconductor device according to claim 1, wherein said mold is in contact with an outer periphery. 7. The space between the contact surfaces in the space,
3. The resin mold for resin sealing of a semiconductor device according to claim 1, wherein the diameter is 0.1 mm or more and 20 mm or less. 4. 8. A method for sealing a semiconductor resin sealing mold having a seal on the outer periphery of one of the contact surfaces of the upper and lower molds, wherein the contact surfaces of the upper and lower molds are brought close to each other. Before the contact surfaces of the upper and lower molds come into contact with each other, the tip of the seal contacts the outer periphery of the other mold, and the contact surface between the seal and the upper and lower molds in the contact state By exhausting the space enclosed by and further self-sealing the seal, after the contact surfaces of the self-sealed upper and lower molds are contacted with each other, the sealing resin flows in. To seal a semiconductor device resin mold. 9. A method for sealing a semiconductor resin sealing mold having a seal on an outer periphery of one of upper and lower die sets respectively holding an upper and lower mold, wherein the contact surfaces of the upper and lower molds are mutually Before the contact, the tip of the seal contacts the outer periphery of the other die set, and, in the contacted state, the seal and the contact surfaces of the upper and lower die sets and the contact surfaces of the upper and lower molds. By evacuating the enclosed space, the seal is further self-sealed, and after contacting the contact surfaces of the upper and lower molds that have been brought into a reduced pressure environment by the self-sealing, the sealing resin is flowed. A method for sealing a resin sealing mold for a semiconductor device. 10. The semiconductor device resin mold according to claim 8, wherein an interval between the contact surfaces in the space is 0.1 mm or more and 20 mm or less. Sealing method.