JPH1139946A - Injection resin composition for insulation of electric apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an injection resin composition for insulation of electric apparatus which has excellent characteristics as injection resin and good workability. SOLUTION: This resin composition for electric insulation consists of bisphenol epoxy resin as a main component and a curing agent and the main component is produced by mixing epoxy resin with 250 epoxy equivalent and epoxy resin with 400 epoxy equivalent at 80:20 ratio and the main component and the curing agent are mixed at 1:0.9 equivalent ratio and moreover, a silane coupling agent is added to silica as a filler.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cast resin composition for insulating electrical equipment and an epoxy resin cast product.

[0002]

2. Description of the Related Art Hitherto, as an insulating material and a structural material for high-voltage equipment, a polymer composite cured product using an epoxy resin as a matrix, that is, a so-called molded product has been widely used. In addition, with the recent sophistication and concentration of society, large capacity, small size and high reliability of equipment are strongly demanded.
Even for mold cast products, the maximum operating temperature of stationary equipment is 10
There is an increasing tendency to use heat-resistant epoxy cast products having a glass transition temperature (hereinafter referred to as “Tg”) of 115 ° C. or higher, in which the physical properties of the material are stable even at 5 ° C. or higher.

[0003]

However, the heat-resistant epoxy resin having a Tg of 115 ° C. or higher according to the prior art,
Since it is hard and brittle, there is a problem that the obtained cast product is easily broken. As a result, it is necessary to use a solid epoxy resin having poor workability or to fill a large amount of a filler in order to maintain a crack resistance test result of −30 ° C. or lower using an iron conductor. As a result, the viscosity is remarkably increased, and the operable time (pot life) is shortened.

[0004]

The electric insulating resin composition of the present invention for solving the above-mentioned problems is an electric insulating resin composition comprising a main agent comprising a bisphenol type epoxy resin and a curing agent, wherein the main agent comprises Is an epoxy resin having an epoxy equivalent of 250 and an epoxy resin having an epoxy equivalent of 400:
20. The main agent and the curing agent are mixed in an equivalent ratio of 1: 0.9, and a silane coupling agent is added to silica as a filler.

[0005] The resin composition for electrical insulation is characterized in that the filler silica has a particle size of 10 to 15 µm.

The epoxy resin cast product of the present invention is characterized by using the above-mentioned resin composition for electrical insulation.

[0007]

Embodiments of the present invention will be described below.

[0008] The resin composition for electrical insulation of the present invention comprises a main agent obtained by mixing an epoxy resin having an epoxy equivalent of 250 and an epoxy resin having an epoxy equivalent of 400 in a ratio of 80:20, and a curing agent. And a curing agent in an equivalent ratio of 1: 0.95 to 0.9, and a silica silane coupling agent as a filler. Here, the above-mentioned bisphenol-type epoxy resin is, for example, “Epicoat 834” (trade name, manufactured by Yuka Shell Co., Ltd.) having an epoxy equivalent of 250, and “YL-642” having an epoxy equivalent of 400.
5B "(trade name; manufactured by Yuka Shell Co., Ltd.), epoxy equivalent 40
0 "CT-200" (trade name; manufactured by Ciba Geigy), but the present invention is not limited thereto.

The epoxy resin is mixed with a bisphenol-type epoxy resin having an epoxy equivalent of 250 and a bisphenol-type epoxy resin having an epoxy equivalent of 400 at a ratio of 80:20.
preferable.

The curing agent is an acid anhydride, 4-
Methyltetrahydrophthalic anhydride (for example, “HN-2
200 ", manufactured by Shin Nippon Rika Co., Ltd., acid anhydride equivalent = 16
6: Example 1-1), 3-methyltetrahydrophthalic anhydride (for example, “MT-500” trade name, manufactured by Shin Nippon Rika Co., Ltd., acid anhydride equivalent = 166: Example 1-2), hexahydrophthalic anhydride Acids (for example, “HHPA” trade name, manufactured by Shin Nippon Rika Co., Ltd., acid anhydride equivalent = 154: Examples 1-3), and the like, but the present invention is not limited thereto.

As the curing accelerator, a tertiary amine can be mentioned, but the present invention is not limited to this.

The epoxy resin cast product of the present invention is obtained by adding a filler to the above-mentioned resin composition for electrical insulation and heating and curing the resin composition in a predetermined shape.

[0013] As the filler, an average particle diameter of 10 to 15 is used.
μm of silica can be used, and a predetermined amount of a silane coupling agent is blended. Then, the main agent and the curing agent / curing accelerator are mixed at an equivalent ratio of 1: 0.9, and
2 to 46% by volume of the above filler is added, mixed until uniform, and heat-cured under predetermined conditions to obtain a resin cast product.

[0014]

Embodiments of the present invention will be described below.

(Example 1) a) Preparation of main agent Epoxy equivalent 2 having general properties as base resin
50 bisphenol A type epoxy resin (for example, “Epicoat 834” trade name, manufactured by Yuka Shell Co., Ltd.) and an epoxy equivalent of 400 bisphenol A type epoxy resin (for example, “CT-200” trade name, manufactured by Ciba Geigy Co., Ltd.)
What was blended at a fixed ratio of 0:20 was used. A predetermined amount of this resin was placed in a stainless beaker and stirred while heating at 100 ° C. until uniform. b) Adjustment of Curing Agent / Curing Accelerator The curing agent was 4-methyltetrahydrophthalic anhydride (for example, “HN-2200” trade name, manufactured by Hitachi Chemical Co., Ltd., acid anhydride equivalent = 166) as an acid anhydride. 1-1), 3-methyltetrahydrophthalic anhydride (for example, “MT-50”)
0 "trade name, manufactured by Shin Nippon Rika Co., Ltd., acid anhydride equivalent = 154:
Example 1-2), hexahydrophthalic anhydride (for example,
"HHPA" brand name, manufactured by Shin Nippon Rika, acid anhydride equivalent =
154: Using Example 1-3), a small amount (0.2% by weight) of a tertiary amine (for example, “DMP-30” (trade name, manufactured by Kayaku Akzo)) as a curing accelerator to start the reaction smoothly ) Was added and stirred until uniform. c) Filler 1 phr of silane coupling agent (for example, “KBM-403” (trade name, manufactured by Shin-Etsu Silicone Co., Ltd.)) is mixed with silica (for example, “MCF-4” (trade name)) having a crystalline state of melting and having an average particle diameter of 11 μm. Then, the main agent of (a) and the curing agent / curing accelerator of (b) are mixed at an equivalent ratio of 1: 0.9, and mixed until uniform, and 100 ° C.-2 hr + 100 ° C.-15 hours
Heat curing was performed at r. The amount of the filler added was 42% by volume. The obtained resin was a heat-resistant cast resin having a Tg of 115 ° C. or higher and a high crack resistance, as shown in Table 2 below.

(Comparative Example 1) As a comparative example, an epoxy epoxy equivalent of 40 having general characteristics as a base resin was used.
0 bisphenol A type epoxy resin (for example, “CT
−200 ”(trade name, manufactured by Ciba-Geigy) as 100,
Except that 4-methyltetrahydrophthalic anhydride (for example, “HN-2200” (trade name, manufactured by Shin Nippon Rika Co., Ltd., acid anhydride equivalent = 166: the same as in Example 1-1)) was used as a curing agent, The same operation as in Example 1 was performed. Note that no curing accelerator was added.

(Embodiment 2) In Embodiment 1 described above,
“C) Filler” has crystalline state of melting and average particle size of 12μ
The same operation as in Example 1 was performed except that m silica (for example, “FX-4” trade name: manufactured by Tatsumori Co., Ltd.) was used. As shown in Table 3 below, the obtained resin was a heat-resistant cast resin having a Tg of 115 ° C. or higher and a high crack resistance.

Example 3 In Example 1 described above,
“C) Filler” has crystalline state of melting and average particle size of 15μ
The same operation as in Example 1 was performed except that m silica (for example, “RD-8AL” trade name: manufactured by Tatsumori) was used. The obtained resin had a Tg of 115 as shown in Table 4 below.
It was a heat-resistant cast resin having a temperature of at least ℃ and a high crack resistance.

(Embodiment 4) In Embodiment 1 described above,
“C) Filler” has crystalline state of melting and average particle size of 14μ
The same operation as in Example 1 was performed except that m silica (for example, “SS-F1” trade name: manufactured by Izumi Tech Co., Ltd.) was used.
The resulting resin had a Tg of 1 as shown in Table 5 below.
It was a heat-resistant cast resin having a crack resistance of 15 ° C. or higher.

(Embodiment 5) In Embodiment 1 described above,
“C) Filler” has a crystalline state of melting and an average particle size of 10μ
The same operation as in Example 1 was performed, except that m silica (for example, “E-1” trade name: manufactured by Tatsumori Co., Ltd.) was used. The obtained resin was a heat-resistant cast resin having a Tg of 115 ° C. or higher and a high crack resistance, as shown in Table 6 below.

(Embodiment 6) In Embodiment 1 described above,
“C) Filler” has a crystalline state of melting and an average particle size of 10μ
m of silica (for example, “A-1” trade name: manufactured by Tatsumori Co., Ltd.) and the same operation as in Example 1 except that the filling amount was 265 phr. The obtained resin was a heat-resistant cast resin having a Tg of 115 ° C. or higher and high crack resistance, as shown in Table 7 below.

Table 1 below shows the test items and their conditions.
"Table 2" to "Table 7" show the results.

FIG. 1 shows the particle size distribution of the silica used.

[0024]

[Table 1]

[0025]

[Table 2]

[0026]

[Table 3]

[0027]

[Table 4]

[0028]

[Table 5]

[0029]

[Table 6]

[0030]

[Table 7]

As shown in Tables 2 to 7, the resin having the composition of this example has excellent properties as a casting resin, and has a high heat resistance at a Tg of 115 ° C. or higher. Also, the steel had excellent ability to clear -30 ° C with iron bolts and nuts in terms of crack resistance. In addition, the pot life was as long as about 10 times the conventional one.

[0032]

As described above, a resin having these compositions is excellent in various properties as a casting resin, and has a high heat resistance at a Tg of 115 ° C. or more, and has a crack resistance of an iron bolt and nut. Since it has an excellent ability to clear ≦ −30 ° C., it can cope with the downsizing of electric devices and the increase in heat resistance of insulating materials accompanying high output. In addition, since the pot life is long industrially, it can be used for mass production.

[Brief description of the drawings]

FIG. 1 is a diagram showing a particle size distribution of silica used in this example.

Claims (3)

[Claims] 1. An electrical insulating resin composition comprising a main agent comprising a bisphenol type epoxy resin and a curing agent, wherein the main agents comprise an epoxy resin having an epoxy equivalent of 250 and an epoxy resin having an epoxy equivalent of 400: 20. A mixture of the main agent and the curing agent in an equivalence ratio of 1: 0.9, and adding a silane coupling agent to silica as a filler. Resin composition. 2. The resin composition according to claim 1, wherein the filler has a silica particle diameter of 10 to 15 μm. 3. An epoxy resin cast product comprising the resin composition for electrical insulation according to claim 1 or 2.