JPH1139948A - Injection resin composition for electric apparatus insulation - Google Patents
Injection resin composition for electric apparatus insulationInfo
- Publication number
- JPH1139948A JPH1139948A JP18952497A JP18952497A JPH1139948A JP H1139948 A JPH1139948 A JP H1139948A JP 18952497 A JP18952497 A JP 18952497A JP 18952497 A JP18952497 A JP 18952497A JP H1139948 A JPH1139948 A JP H1139948A
- Authority
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- Japan
- Prior art keywords
- epoxy resin
- equivalent
- manufactured
- trade name
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は電気機器絶縁用注型
樹脂組成物及びエポキシ樹脂注型品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cast resin composition for insulating electrical equipment and an epoxy resin cast product.
【0002】[0002]
【従来の技術】従来より、高電圧機器の絶縁材料及び構
造材料として、エポキシ樹脂をマトリックスとした高分
子複合硬化物、いわゆるモールド注型品が広く用いられ
ている。2. Description of the Related Art Hitherto, as an insulating material and a structural material for high-voltage equipment, a polymer composite cured product using an epoxy resin as a matrix, that is, a so-called molded product has been widely used.
【0003】また、近年の社会の高度化、集中化に伴
い、機器の大容量・小型・高信頼性化が強く要求されて
おり、SF6 絶縁媒体を用いたガス遮断機(GIS)の
モールド注型品においては、静止機器最高使用温度10
5℃以上でも材料の物性が安定なガラス転移温度(以下
「Tg」という)125℃以上の耐熱性エポキシ注型品
を使用する傾向が強まってきている。Also, with the recent sophistication and concentration of society, there is a strong demand for large capacity, small size, and high reliability of equipment, and a mold for a gas circuit breaker (GIS) using an SF 6 insulating medium is required. For cast products, the maximum operating temperature of stationary equipment is 10
There is an increasing tendency to use heat-resistant epoxy cast products having a glass transition temperature (hereinafter referred to as “Tg”) of 125 ° C. or higher, in which the physical properties of the material are stable even at 5 ° C. or higher.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、従来技
術によるTg≧125℃以上の耐熱性エポキシ樹脂は、
硬く脆いため、得られた注型品が割れやすいという問題
がある。この結果、鉄導体を用いた耐クラック性試験結
果が−20℃以下、アルミ導体を用いた耐クラック性試
験結果が−80℃以下を保持するために、作業性の悪い
固形エポキシ樹脂を使用したり、充填剤を多量に充填す
る必要がある。この結果、粘度が著しく増粘し、作業可
能時間(ポットライフ)が60分より短いために、作業
性が大変悪く工業的に非常に問題がある。However, the heat-resistant epoxy resin having Tg ≧ 125 ° C. or higher according to the prior art is
Since it is hard and brittle, there is a problem that the obtained cast product is easily broken. As a result, in order to maintain the crack resistance test result using iron conductor at -20 ° C or less and the crack resistance test result using aluminum conductor at -80 ° C or less, a solid epoxy resin with poor workability was used. Or a large amount of filler needs to be filled. As a result, the viscosity is remarkably increased, and the operable time (pot life) is shorter than 60 minutes.
【0005】[0005]
【課題を解決するための手段】上記課題を解決する本発
明の電気絶縁用樹脂組成物は、エポキシ樹脂からなる主
剤と、硬化剤とからなる電気絶縁用樹脂組成物であっ
て、主剤がビスフェノール型エポキシ樹脂と脂環式エポ
キシ樹脂とを配合してなり、上記主剤と硬化剤とを当量
比が1:0.95〜0.9の範囲で混合し、充填材で充填し
てなることを特徴とする。The electric insulating resin composition of the present invention for solving the above-mentioned problems is an electric insulating resin composition comprising a main agent comprising an epoxy resin and a curing agent, wherein the main agent is bisphenol. A mixture of a type epoxy resin and an alicyclic epoxy resin, the equivalent ratio of the above-mentioned base agent and the curing agent being 1: 0.95-0.9, and filling with a filler. Features.
【0006】上記電気絶縁用樹脂組成物において、上記
充填剤が酸化アルミニウムであることを特徴とする。[0006] In the above resin composition for electrical insulation, the filler is aluminum oxide.
【0007】本発明のエポキシ樹脂注型品は、上記電気
絶縁用樹脂組成物を用いてなることを特徴とする。An epoxy resin cast product of the present invention is characterized by using the above-mentioned resin composition for electrical insulation.
【0008】[0008]
【発明の実施の形態】以下、本発明の実施の形態を説明
する。Embodiments of the present invention will be described below.
【0009】本発明の電気絶縁用樹脂組成物は、主剤が
ビスフェノール型エポキシ樹脂と脂環式エポキシ樹脂と
を配合してなり、該主剤と硬化剤とを当量比が1:0.9
5〜0.9の範囲で混合し、充填材で充填してなるもので
ある。ここで、ビスフェノール型エポキシ樹脂とは、例
えばエポキシ当量250の「エピコート834」(商品
名;油化シェル社製)、エポキシ当量400の「YL−
6425B」(商品名;油化シェル社製)、エポキシ当
量400の「CT−200」(商品名;チバガイギー社
製)、エポキシ当量170のグリシジルエステルタイプ
エポキシ樹脂(例えば、「CY−184」商品名、チバ
ガイギー社製)を挙げることができるが、本発明はこれ
に限定されるものではない。また脂環式エポキシ樹脂と
しては、例えば「CY−179」(商品名;チバガイギ
ー社製)、エポキシ当量=400)を挙げることができ
るが、本発明はこれに限定されるものではない。[0009] The resin composition for electrical insulation of the present invention comprises a bisphenol type epoxy resin and an alicyclic epoxy resin as main ingredients, and the equivalent ratio of the main ingredient to the curing agent is 1: 0.9.
They are mixed in the range of 5-0.9 and filled with a filler. Here, the bisphenol-type epoxy resin is, for example, “Epicoat 834” (trade name, manufactured by Yuka Shell Co., Ltd.) with an epoxy equivalent of 250, and “YL-” with an epoxy equivalent of 400.
6425B "(trade name; manufactured by Yuka Shell Co., Ltd.)," CT-200 "(trade name; manufactured by Ciba Geigy) having an epoxy equivalent of 400, and glycidyl ester type epoxy resin having an epoxy equivalent of 170 (e.g.," CY-184 "trade name) , Manufactured by Ciba-Geigy), but the present invention is not limited thereto. Examples of the alicyclic epoxy resin include "CY-179" (trade name; manufactured by Ciba Geigy), epoxy equivalent = 400), but the present invention is not limited thereto.
【0010】上記エポキシ樹脂の配合としては、例えば
エポキシ当量が250のビスフェノール型エポキシ樹脂
とエポキシ当量が400のビスフェノール型エポキシ樹
脂と、当量が138の脂環式エポキシ樹脂とが、40:
40:20の範囲で混合したものを主剤とするのが、好
ましい。他の上記エポキシ樹脂の配合としては、例えば
エポキシ当量が250のビスフェノール型エポキシ樹脂
とエポキシ当量が475のビスフェノール型エポキシ樹
脂と、当量が138の脂環式エポキシ樹脂とが、40:
40:20の範囲で混合したものを主剤とするのが、好
ましい。他の上記エポキシ樹脂の配合としては、例えば
エポキシ当量が330のビスフェノール型エポキシ樹脂
と当量が138の脂環式エポキシ樹脂とが、80:20
の範囲で混合したものを主剤とするのが、好ましい。他
の上記エポキシ樹脂の配合としては、例えばエポキシ当
量が250のビスフェノール型エポキシ樹脂とエポキシ
当量が475のビスフェノール型エポキシ樹脂と、当量
が170のグリシジルエステル型エポキシ樹脂とが、4
0:40:20の範囲で混合したものを主剤とするの
が、好ましい。The epoxy resin is mixed, for example, with a bisphenol-type epoxy resin having an epoxy equivalent of 250, a bisphenol-type epoxy resin having an epoxy equivalent of 400, and an alicyclic epoxy resin having an equivalent of 138;
It is preferable to use a mixture in a ratio of 40:20 as the main agent. As other compounding of the epoxy resin, for example, a bisphenol type epoxy resin having an epoxy equivalent of 250, a bisphenol type epoxy resin having an epoxy equivalent of 475, and an alicyclic epoxy resin having an equivalent of 138 are 40:
It is preferable to use a mixture in a ratio of 40:20 as the main agent. As another compounding of the epoxy resin, for example, a bisphenol type epoxy resin having an epoxy equivalent of 330 and an alicyclic epoxy resin having an equivalent of 138 are mixed at 80:20.
It is preferable to use a mixture obtained in the range of the above as the main agent. As other compounding of the epoxy resin, for example, a bisphenol type epoxy resin having an epoxy equivalent of 250, a bisphenol type epoxy resin having an epoxy equivalent of 475, and a glycidyl ester type epoxy resin having an equivalent of 170 are used.
It is preferable to use a mixture in the range of 0:40:20 as the main agent.
【0011】上記硬化剤としては、酸無水物を挙げるこ
とができるが、本発明はこれに限定されるものではな
い。[0011] Examples of the curing agent include acid anhydrides, but the present invention is not limited thereto.
【0012】上記硬化促進剤としては、三級アミンを挙
げることができるが、本発明はこれに限定されるもので
はない。As the curing accelerator, a tertiary amine can be exemplified, but the present invention is not limited to this.
【0013】本発明のエポキシ樹脂注型品は、上記配合
の電気絶縁用樹脂組成物に充填材を加えて所定の形状で
加熱硬化してなるものである。The epoxy resin cast product of the present invention is obtained by adding a filler to the above-mentioned resin composition for electrical insulation and heat-curing it in a predetermined shape.
【0014】上記充填材としては、平均粒径12μmの
酸化アルミニウムを挙げることができ、主剤と硬化剤・
硬化促進剤を当量比1:0.95〜0.9で混合し、これに
42〜46容量%の上記充填材を添加し均一になるまで
混合し、例えば100℃で16時間及び150℃で8時
間の加熱硬化をおこなうことで、樹脂注型品を得る。Examples of the filler include aluminum oxide having an average particle size of 12 μm.
A curing accelerator is mixed in an equivalent ratio of 1: 0.95-0.9, and 42-46% by volume of the above filler is added and mixed until uniform, for example, at 100 ° C. for 16 hours and at 150 ° C. By performing heat curing for 8 hours, a resin cast product is obtained.
【0015】[0015]
【実施例】以下、本発明の効果を示す実施例を説明す
る。Embodiments of the present invention will be described below.
【0016】(実施例1) a)主剤の調整 ベースの樹脂として一般的な特性を持つエポキシ当量2
50のビスフェノールA型エポキシ樹脂(例えば、「エ
ピコート834」商品名、油化シェル社製)とエポキシ
当量400のビスフェノールA型エポキシ樹脂(例え
ば、「YL−6425B」商品名、油化シェル社製)を
50:50の一定比率でブレンドした物に、エポキシ当
量138の脂環式エポキシ樹脂(例えば、「CY−17
9」商品名、チバガイギー社製)を用いた。この樹脂の
所定量をステンレスビーカーにとり、100℃で加熱し
ながら均一になるまで攪拌した。 b)硬化剤・硬化促進剤の調整 硬化剤は酸無水物であるメチルヘキサヒドロ無水フタル
酸(例えば、「HN−5500」商品名、日立化成社
製、酸無水物当量=168)を用い、反応をスムーズに
開始するため三級アミン(例えば、「L−86」商品
名、明電ケミカル社製)を硬化促進剤として少量添加
し、均一になるまで攪拌した。 c)充填材 充填材として平均粒径12μmのアルミナ(例えば「F
X−4」商品名:龍森社製)に、(a)の主剤と(b)
の硬化剤・硬化促進剤を当量比1:0.95で混合し、
均一になるまで混合し、100℃−16hr+150℃
−8hrで加熱硬化を行った。上記充填材の添加量は4
2容量%のもの(実施例1−1)と、46容量%のもの
(実施例1−2)とした。(Example 1) a) Preparation of main agent Epoxy equivalent 2 having general properties as base resin
50 bisphenol A type epoxy resin (for example, “Epicoat 834” trade name, manufactured by Yuka Shell Co., Ltd.) and a bisphenol A type epoxy resin having an epoxy equivalent of 400 (for example, “YL-6425B” trade name, manufactured by Yuka Shell Co., Ltd.) Is blended in a fixed ratio of 50:50, and an alicyclic epoxy resin having an epoxy equivalent of 138 (for example, “CY-17
9 "(trade name, manufactured by Ciba Geigy). A predetermined amount of this resin was placed in a stainless beaker and stirred while heating at 100 ° C. until uniform. b) Adjustment of Curing Agent / Curing Accelerator The curing agent used was methylhexahydrophthalic anhydride (for example, “HN-5500” trade name, manufactured by Hitachi Chemical Co., Ltd., acid anhydride equivalent = 168), which is an acid anhydride. In order to start the reaction smoothly, a small amount of a tertiary amine (for example, “L-86” (trade name, manufactured by Meiden Chemical Co., Ltd.)) was added as a curing accelerator, and the mixture was stirred until it became uniform. c) Filler Alumina having an average particle size of 12 μm (for example, “F
X-4 "(trade name: manufactured by Tatsumori Co., Ltd.)
Are mixed at an equivalent ratio of 1: 0.95,
Mix until uniform, 100 ℃ -16hr + 150 ℃
Heat curing was performed at -8 hr. The amount of the filler is 4
One having 2% by volume (Example 1-1) and one having 46% by volume (Example 1-2) were used.
【0017】(比較例1)比較例としては、ベースの樹
脂として一般的な特性を持つエポキシ当量400のビス
フェノールA型エポキシ樹脂(例えば、「YL−642
5B」商品名、油化シェル社製)を100とした以外
は、実施例1−1と同様に操作した。Comparative Example 1 As a comparative example, a bisphenol A type epoxy resin having an epoxy equivalent of 400 having general characteristics as a base resin (for example, “YL-642”)
The operation was performed in the same manner as in Example 1-1, except that “5B” (trade name, manufactured by Yuka Shell Co.) was changed to 100.
【0018】(実施例2) a)主剤 ベースの樹脂として一般的な特性を持つエポキシ当量2
50のビスフェノールA型エポキシ樹脂(例えば、「エ
ピコート834」商品名、油化シェル社製)とエポキシ
当量475のビスフェノールA型エポキシ樹脂(例え
ば、「エピコート1001」商品名、油化シェル社製)
を50:50の一定比率でブレンドした物に、エポキシ
当量138の脂環式エポキシ樹脂(例えば、「CY−1
79」商品名、チバガイギー社製)を用いた。この樹脂
の所定量をステンレスビーカーにとり、100℃で加熱
しながら均一になるまで攪拌した。 b)硬化剤・硬化促進剤 硬化剤は酸無水物であるメチルヘキサヒドロ無水フタル
酸(例えば、「HN−5500」商品名、日立化成社
製、酸無水物当量=168)を用い、反応をスムーズに
開始するため三級アミン(例えば、「L−86」商品
名、明電ケミカル社製)を硬化促進剤として少量添加
し、均一になるまで攪拌した。 c)充填材 充填材として平均粒径14μmのアルミナ(例えば、
「FX−4」商品名:龍森社製)に、(a)と(b)を
当量比1:0.95で混合し、均一になるまで混合し、
100℃−16hr+150℃−8hrで加熱硬化を行
った。上記充填材の添加量は42容量%のもの(実施例
2−1)と、44容量%のもの(実施例2−2)とし
た。(Example 2) a) Epoxy equivalent 2 having general properties as a base resin
50 bisphenol A type epoxy resin (for example, "Epicoat 834" trade name, manufactured by Yuka Shell Co., Ltd.) and an epoxy equivalent of 475 bisphenol A type epoxy resin (for example, "Epicoat 1001" trade name, manufactured by Yuka Shell Co., Ltd.)
Is blended at a fixed ratio of 50:50 with an alicyclic epoxy resin having an epoxy equivalent of 138 (for example, “CY-1
79 "(trade name, manufactured by Ciba Geigy). A predetermined amount of this resin was placed in a stainless beaker and stirred while heating at 100 ° C. until uniform. b) Curing Agent / Curing Accelerator The curing agent used was methylhexahydrophthalic anhydride as an acid anhydride (for example, “HN-5500” (trade name, manufactured by Hitachi Chemical Co., Ltd., acid anhydride equivalent = 168)). To start smoothly, a small amount of a tertiary amine (for example, “L-86” (trade name, manufactured by Meiden Chemical Co., Ltd.)) was added as a curing accelerator, and the mixture was stirred until it became uniform. c) Filler Alumina having an average particle size of 14 μm (for example,
(FX-4) (trade name: manufactured by Tatsumori Co.), (a) and (b) were mixed at an equivalent ratio of 1: 0.95, and mixed until uniform.
Heat curing was performed at 100 ° C. for 16 hours + 150 ° C. for 8 hours. The amount of the filler added was 42% by volume (Example 2-1) and 44% by volume (Example 2-2).
【0019】(比較例2)比較例としては、ベースの樹
脂として一般的な特性を持つエポキシ当量475のビス
フェノールA型エポキシ樹脂(例えば、「エピコート1
001」商品名、油化シェル社製)を100とした以外
は、実施例2−1と同様に操作した。Comparative Example 2 As a comparative example, a bisphenol A type epoxy resin having an epoxy equivalent of 475 having general characteristics as a base resin (for example, Epicoat 1
001 "(trade name, manufactured by Yuka Shell Co.) was changed to 100, and the same operation as in Example 2-1 was performed.
【0020】(実施例3) a)主剤 ベースの樹脂として一般的な特性を持つエポキシ当量3
30のビスフェノールA型エポキシ樹脂(例えば、「Z
X1289」商品名、東都化成社製)に、エポキシ当量
138の脂環式エポキシ樹脂(例えば、「CY−17
9」商品名、チバガイギー社製)を用いた。この樹脂の
所定量をステンレスビーカーにとり、100℃で加熱し
ながら均一になるまで攪拌した。 b)硬化剤・硬化促進剤 硬化剤は酸無水物であるメチルヘキサヒドロ無水フタル
酸(例えば、「HN−5500」商品名、日立化成社
製、酸無水物当量=168)を用い、反応をスムーズに
開始するため三級アミン(例えば、「L−86」商品
名、明電ケミカル社製)を硬化促進剤として少量添加
し、均一になるまで攪拌した。 c)充填材 充填材として平均粒径14μmのアルミナ(例えば、
「FX−4」商品名:龍森社製)に、(a)と(b)を
当量比1:0.95で混合し、均一になるまで混合し、
100℃−16hr+150℃−8hrで加熱硬化を行
った。上記充填材の添加量は42容量%のもの(実施例
3−1)と、44容量%のもの(実施例3−2)とし
た。Example 3 a) Epoxy equivalent 3 having general properties as a base resin
30 bisphenol A type epoxy resins (for example, “Z
X1289 "(trade name, manufactured by Toto Kasei Co., Ltd.) and an alicyclic epoxy resin having an epoxy equivalent of 138 (for example," CY-17 ").
9 "(trade name, manufactured by Ciba Geigy). A predetermined amount of this resin was placed in a stainless beaker and stirred while heating at 100 ° C. until uniform. b) Curing Agent / Curing Accelerator The curing agent used was methylhexahydrophthalic anhydride as an acid anhydride (for example, “HN-5500” (trade name, manufactured by Hitachi Chemical Co., Ltd., acid anhydride equivalent = 168)). To start smoothly, a small amount of a tertiary amine (for example, “L-86” (trade name, manufactured by Meiden Chemical Co., Ltd.)) was added as a curing accelerator, and the mixture was stirred until it became uniform. c) Filler Alumina having an average particle size of 14 μm (for example,
(FX-4) (trade name: manufactured by Tatsumori Co.), (a) and (b) were mixed at an equivalent ratio of 1: 0.95, and mixed until uniform.
Heat curing was performed at 100 ° C. for 16 hours + 150 ° C. for 8 hours. The amount of the filler added was 42% by volume (Example 3-1) and 44% by volume (Example 3-2).
【0021】(比較例3)比較例としては、ベースの樹
脂として一般的な特性を持つエポキシ当量330のビス
フェノールA型エポキシ樹脂(例えば、「ZX128
9」商品名、東都化成社製)を100とした以外は、実
施例3−1と同様に操作した。Comparative Example 3 As a comparative example, a bisphenol A type epoxy resin having an epoxy equivalent of 330 having a general property as a base resin (for example, “ZX128”)
The same operation was performed as in Example 3-1 except that “9” trade name, manufactured by Toto Kasei Co., Ltd.) was changed to 100.
【0022】(実施例4) a)主剤 ベースの樹脂として一般的な特性を持つエポキシ当量2
50のビスフェノールA型エポキシ樹脂(例えば、「エ
ピコート834」商品名、油化シェル社製)とエポキシ
当量400のビスフェノールA型エポキシ樹脂(例え
ば、「YL−6425B商品名、油化シェル社製)を5
0:50の一定比率でブレンドした物に、エポキシ当量
138の脂環式エポキシ樹脂(例えば、「CY−17
9」商品名、チバガイギー社製)を用いた。この樹脂の
所定量をステンレスビーカーにとり、100℃で加熱し
ながら均一になるまで攪拌した。 b)硬化剤・硬化促進剤 硬化剤は酸無水物であるヘキサヒドロ無水フタル酸(例
えば、「リカシッドHH」商品名、新日本理化社製、酸
無水物当量=154)を用い、反応をスムーズに開始す
るため三級アミン(例えば、「L−86」商品名、明電
ケミカル社製)を硬化促進剤として少量添加し、均一に
なるまで攪拌した。 c)充填材 充填材として平均粒径14μmのアルミナ(例えば「F
X−4」商品名:龍森社製)に、(a)と(b)を当量
比1:0.9で混合し、均一になるまで混合し、100
℃−16hr+150℃−8hrで加熱硬化を行った。
上記充填材の添加量は42容量%のもの(実施例4−
1)と、46容量%のもの(実施例4−2)とした。Example 4 a) Epoxy equivalent weight 2 having general properties as a base resin
50 bisphenol A type epoxy resin (for example, “Epicoat 834” trade name, manufactured by Yuka Shell Co., Ltd.) and a bisphenol A type epoxy resin having an epoxy equivalent of 400 (for example, “YL-6425B trade name, manufactured by Yuka Shell Co., Ltd.) 5
An alicyclic epoxy resin having an epoxy equivalent of 138 (for example, “CY-17
9 "(trade name, manufactured by Ciba Geigy). A predetermined amount of this resin was placed in a stainless beaker and stirred while heating at 100 ° C. until uniform. b) Curing Agent / Curing Accelerator The curing agent is hexahydrophthalic anhydride (for example, “Ricacid HH” (trade name, manufactured by Shin Nippon Rika Co., Ltd., acid anhydride equivalent = 154)) which is an acid anhydride, and the reaction is smoothly performed. To start, a small amount of a tertiary amine (for example, “L-86” trade name, manufactured by Meiden Chemical Co., Ltd.) was added as a curing accelerator, and the mixture was stirred until it became uniform. c) Filler Alumina having an average particle size of 14 μm (for example, “F
X-4 "(trade name: manufactured by Tatsumori Co.), (a) and (b) were mixed at an equivalent ratio of 1: 0.9, and mixed until uniform.
Heat curing was carried out at a temperature of -16 ° C for 16 hours and 150 ° C for 8 hours.
The amount of the filler was 42% by volume (Example 4-
1) and 46% by volume (Example 4-2).
【0023】(比較例4)比較例としては、ベースの樹
脂として一般的な特性を持つエポキシ当量400のビス
フェノールA型エポキシ樹脂(例えば、「YL−642
5B商品名、油化シェル社製)を100とした以外は、
実施例4−1と同様に操作した。(Comparative Example 4) As a comparative example, a bisphenol A type epoxy resin having an epoxy equivalent of 400 having general characteristics as a base resin (for example, “YL-642”)
5B trade name, manufactured by Yuka Shell Co.)
The same operation as in Example 4-1 was performed.
【0024】(実施例5) a)主剤 ベースの樹脂として一般的な特性を持つエポキシ当量2
50のビスフェノールA型エポキシ樹脂(例えば、「エ
ピコート834」商品名、油化シェル社製)とエポキシ
当量475のビスフェノールA型エポキシ樹脂(例え
ば、「エピコート1001」商品名、油化シェル社製)
を50:50の一定比率でブレンドした物に、エポキシ
当量138の脂環式エポキシ樹脂(例えば、「CY−1
79」商品名、チバガイギー社製)を用いた。この樹脂
の所定量をステンレスビーカーにとり、100℃で加熱
しながら均一になるまで攪拌した。 b)硬化剤・硬化促進剤 硬化剤は酸無水物であるヘキサヒドロ無水フタル酸(例
えば、「リカシッドHH」商品名、新日本理化社製、酸
無水物当量=154)を用い、反応をスムーズに開始す
るため三級アミン(例えば、「L−86」商品名、明電
ケミカル社製)を硬化促進剤として少量添加し、均一に
なるまで攪拌した。 c)充填材 充填材として平均粒径14μmのアルミナ(例えば、
「FX−4」商品名:龍森社製)に、(a)と(b)を
当量比1:0.9で混合し、均一になるまで混合し、1
00℃−16hr+150℃−8hrで加熱硬化を行っ
た。上記充填材の添加量は42容量%のもの(実施例4
−1)と、44容量%のもの(実施例4−2)とした。(Example 5) a) Epoxy equivalent weight 2 having general properties as a base resin
50 bisphenol A type epoxy resin (for example, "Epicoat 834" trade name, manufactured by Yuka Shell Co., Ltd.) and an epoxy equivalent of 475 bisphenol A type epoxy resin (for example, "Epicoat 1001" trade name, manufactured by Yuka Shell Co., Ltd.)
Is blended at a fixed ratio of 50:50 with an alicyclic epoxy resin having an epoxy equivalent of 138 (for example, “CY-1
79 "(trade name, manufactured by Ciba Geigy). A predetermined amount of this resin was placed in a stainless beaker and stirred while heating at 100 ° C. until uniform. b) Curing Agent / Curing Accelerator The curing agent is hexahydrophthalic anhydride (for example, “Ricacid HH” (trade name, manufactured by Shin Nippon Rika Co., Ltd., acid anhydride equivalent = 154)) which is an acid anhydride, and the reaction is smoothly performed. To start, a small amount of a tertiary amine (for example, “L-86” trade name, manufactured by Meiden Chemical Co., Ltd.) was added as a curing accelerator, and the mixture was stirred until it became uniform. c) Filler Alumina having an average particle size of 14 μm (for example,
(FX-4) (trade name, manufactured by Tatsumori Co.), (a) and (b) were mixed at an equivalent ratio of 1: 0.9, and mixed until uniform.
Heat curing was performed at 00 ° C.-16 hr + 150 ° C.-8 hr. The amount of the filler was 42% by volume (Example 4).
-1) and 44% by volume (Example 4-2).
【0025】(比較例5)比較例としては、ベースの樹
脂として一般的な特性を持つエポキシ当量475のビス
フェノールA型エポキシ樹脂(例えば、「エピコート1
001」商品名、油化シェル社製)を100とした以外
は、実施例5−1と同様に操作した。Comparative Example 5 As a comparative example, a bisphenol A type epoxy resin having an epoxy equivalent of 475 having general properties as a base resin (for example, “Epicoat 1”)
The same operation as in Example 5-1 was performed except that “001” (trade name, manufactured by Yuka Shell Co.) was changed to 100.
【0026】(実施例6) a)主剤 ベースの樹脂として一般的な特性を持つエポキシ当量3
30のビスフェノールA型エポキシ樹脂(例えば、「Z
X1289」商品名、東都化成社製)に、エポキシ当量
138の脂環式エポキシ樹脂(例えば、「CY−17
9」商品名、チバガイギー社製)を用いた。この樹脂の
所定量をステンレスビーカーにとり、100℃で加熱し
ながら均一になるまで攪拌した。 b)硬化剤・硬化促進剤 硬化剤は酸無水物であるヘキサヒドロ無水フタル酸(例
えば、「リカシッドHH」商品名、新日本理化社製、酸
無水物当量=154)を用い、反応をスムーズに開始す
るため三級アミン(例えば、「L−86」商品名、明電
ケミカル社製)を硬化促進剤として少量添加し、均一に
なるまで攪拌した。 c)充填材 充填材として平均粒径14μmのアルミナ(例えば、F
X−4:龍森)に、(a)と(b)を当量比1:0.9
で混合し、均一になるまで混合し、100℃−16hr
+150℃−8hrで加熱硬化を行った。上記充填材の
添加量は42容量%のもの(実施例6−1)と、46容
量%のもの(実施例6−2)とした。(Example 6) a) Epoxy equivalent 3 having general properties as a base resin
30 bisphenol A type epoxy resins (for example, “Z
X1289 "(trade name, manufactured by Toto Kasei Co., Ltd.) and an alicyclic epoxy resin having an epoxy equivalent of 138 (for example," CY-17 ").
9 "(trade name, manufactured by Ciba Geigy). A predetermined amount of this resin was placed in a stainless beaker and stirred while heating at 100 ° C. until uniform. b) Curing Agent / Curing Accelerator The curing agent is hexahydrophthalic anhydride (for example, “Ricacid HH” (trade name, manufactured by Shin Nippon Rika Co., Ltd., acid anhydride equivalent = 154)) which is an acid anhydride, and the reaction is smoothly performed. To start, a small amount of a tertiary amine (for example, “L-86” trade name, manufactured by Meiden Chemical Co., Ltd.) was added as a curing accelerator, and the mixture was stirred until it became uniform. c) Filler Alumina having an average particle size of 14 μm (for example, F
X-4: Tatsumori), (a) and (b) in an equivalent ratio of 1: 0.9
And mixed until uniform, 100 ° C. for 16 hours
Heat curing was performed at + 150 ° C.-8 hr. The amount of the filler added was 42% by volume (Example 6-1) and 46% by volume (Example 6-2).
【0027】(比較例6)比較例としては、ベースの樹
脂として一般的な特性を持つエポキシ当量330のビス
フェノールA型エポキシ樹脂(例えば、「ZX128
9」商品名、東都化成社製)を100とした以外は、実
施例6−1と同様に操作した。Comparative Example 6 As a comparative example, a bisphenol A type epoxy resin having an epoxy equivalent of 330 having general properties as a base resin (for example, “ZX128”)
The same operation as in Example 6-1 was performed, except that “9” trade name, manufactured by Toto Kasei Co., Ltd.) was changed to 100.
【0028】(実施例7) a)主剤 ベースの樹脂として一般的な特性を持つエポキシ当量2
50のビスフェノールA型エポキシ樹脂(例えば、「エ
ピコート834」商品名、油化シェル社製)とエポキシ
当量400のビスフェノールA型エポキシ樹脂(例え
ば、「YL−6425B」商品名、油化シェル社製)を
50:50の一定比率でブレンドした物に、エポキシ当
量170のグリシジルエステルタイプエポキシ樹脂(例
えば、「CY−184」商品名、チバガイギー社製)を
用いた。この樹脂の所定量をステンレスビーカーにと
り、100℃で加熱しながら均一になるまで攪拌した。 b)硬化剤・硬化促進剤 硬化剤は酸無水物であるメチルヘキサヒドロ無水フタル
酸(例えば、「リカシッドMH」商品名、新日本理化社
製、酸無水物当量=168)を用い、反応をスムーズに
開始するため三級アミン(例えば、「L−86」商品
名、明電ケミカル社製)を硬化促進剤として少量添加
し、均一になるまで攪拌した。 c)充填材 充填材として平均粒径14μmのアルミナ(例えば「F
X−4」商品名:龍森社製)に、(a)と(b)を当量
比1:0.9で均一になるまで混合し、100℃−16
hr+150℃−8hrで加熱硬化を行った。上記充填
材の添加量は42容量%のもの(実施例7−1)と、4
6容量%のもの(実施例7−2)とした。(Example 7) a) Epoxy equivalent 2 having general properties as a base resin
50 bisphenol A type epoxy resin (for example, “Epicoat 834” trade name, manufactured by Yuka Shell Co., Ltd.) and a bisphenol A type epoxy resin having an epoxy equivalent of 400 (for example, “YL-6425B” trade name, manufactured by Yuka Shell Co., Ltd.) Was blended at a fixed ratio of 50:50, and a glycidyl ester type epoxy resin having an epoxy equivalent of 170 (for example, “CY-184” (trade name, manufactured by Ciba Geigy)) was used. A predetermined amount of this resin was placed in a stainless beaker and stirred while heating at 100 ° C. until uniform. b) Curing Agent / Curing Accelerator The curing agent used was methylhexahydrophthalic anhydride as an acid anhydride (for example, “Ricacid MH” (trade name, manufactured by Shin Nippon Rika Co., Ltd., acid anhydride equivalent = 168)). To start smoothly, a small amount of a tertiary amine (for example, “L-86” (trade name, manufactured by Meiden Chemical Co., Ltd.)) was added as a curing accelerator, and the mixture was stirred until it became uniform. c) Filler Alumina having an average particle size of 14 μm (for example, “F
X-4 "(trade name: manufactured by Tatsumori Co.), (a) and (b) were mixed at an equivalent ratio of 1: 0.9 until uniform, and then mixed at 100 ° C.-16.
Heat curing was performed at hr + 150 ° C.-8 hr. The amount of the filler was 42% by volume (Example 7-1),
It was 6% by volume (Example 7-2).
【0029】(比較例7)比較例としては、ベースの樹
脂として一般的な特性を持つエポキシ当量400のビス
フェノールA型エポキシ樹脂(例えば、「YL−642
5B」商品名、油化シェル社製)を100とした以外
は、実施例6−1と同様に操作した。Comparative Example 7 As a comparative example, a bisphenol A type epoxy resin having an epoxy equivalent of 400 having general properties as a base resin (for example, “YL-642”)
The same operation was performed as in Example 6-1 except that “5B” (trade name, manufactured by Yuka Shell Co.) was changed to 100.
【0030】下記「表1」に試験項目及びその条件を、
「表2」〜「表8」にその結果を示す。Table 1 below shows the test items and their conditions.
"Table 2" to "Table 8" show the results.
【0031】[0031]
【表1】 [Table 1]
【0032】[0032]
【表2】 [Table 2]
【0033】[0033]
【表3】 [Table 3]
【0034】[0034]
【表4】 [Table 4]
【0035】[0035]
【表5】 [Table 5]
【0036】[0036]
【表6】 [Table 6]
【0037】[0037]
【表7】 [Table 7]
【0038】[0038]
【表8】 [Table 8]
【0039】「表2」〜「表8」に示すように、本実施
例の組成からなる樹脂は注型用樹脂としての諸特性に優
れ、しかも、Tgが125℃以上で耐熱性が高く、かつ
耐クラック性も鉄ボルトナットで≦−20℃、アルミボ
ルトナットで≦−80℃をクリアーする優れた実力を有
していた。また、ポットライフも≧60分と長かった。As shown in Tables 2 to 8, the resin having the composition of this example has excellent properties as a casting resin, and has a high heat resistance at a Tg of 125 ° C. or higher. In addition, crack resistance was excellent at ≦ −20 ° C. for iron bolt nuts and ≦ −80 ° C. for aluminum bolt nuts. Also, the pot life was as long as ≧ 60 minutes.
【0040】[0040]
【発明の効果】以上のように、これらの組成からなる樹
脂は注型用樹脂としての諸特性に優れ、しかも、Tgが
125℃以上で耐熱性が高く、かつ耐クラック性も鉄ボ
ルトナットで≦−20℃、アルミボルトナットで≦−8
0℃をクリアーする優れた実力をもつため、電気機器の
コンパクト化、高出力化に伴う絶縁材料の高耐熱性化に
対応できる。また、工業的にもポットライフも≧60分
と長いため量産に対応できる。As described above, the resin having these compositions is excellent in various properties as a casting resin, and has a high heat resistance at a Tg of 125 ° C. or more, and has a crack resistance of an iron bolt and nut. ≤-20 ℃, -8 with aluminum bolt and nut
Since it has an excellent ability to clear 0 ° C, it can respond to the downsizing of electrical equipment and the high heat resistance of insulating materials accompanying the increase in output. In addition, since the pot life is industrially long as ≧ 60 minutes, it can be used for mass production.
Claims (3)
からなる電気絶縁用樹脂組成物であって、 主剤がビスフェノール型エポキシ樹脂と脂環式エポキシ
樹脂とを配合してなり、上記主剤と硬化剤とを当量比が
1:0.95〜0.9の範囲で混合し、充填材で充填してな
ることを特徴とする電気絶縁用樹脂組成物。1. A resin composition for electrical insulation comprising a main agent comprising an epoxy resin and a curing agent, wherein the main agent comprises a bisphenol type epoxy resin and an alicyclic epoxy resin, A resin composition for electrical insulation characterized by being mixed with an agent at an equivalent ratio of 1: 0.95 to 0.9 and filled with a filler.
電気絶縁用樹脂組成物。2. The resin composition for electrical insulation according to claim 1, wherein the filler is aluminum oxide.
を用いてなることを特徴とするエポキシ樹脂注型品。3. An epoxy resin cast product comprising the resin composition for electrical insulation according to claim 1 or 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18952497A JPH1139948A (en) | 1997-07-15 | 1997-07-15 | Injection resin composition for electric apparatus insulation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18952497A JPH1139948A (en) | 1997-07-15 | 1997-07-15 | Injection resin composition for electric apparatus insulation |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1139948A true JPH1139948A (en) | 1999-02-12 |
Family
ID=16242739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18952497A Pending JPH1139948A (en) | 1997-07-15 | 1997-07-15 | Injection resin composition for electric apparatus insulation |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1139948A (en) |
-
1997
- 1997-07-15 JP JP18952497A patent/JPH1139948A/en active Pending
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