JPH11345300A - Manufacture of ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method to efficiently manufacture a IC card without increasing the facilities at the time of mass-producing an IC card. SOLUTION: This manufacturing method of an IC card comprises temporarily connecting chip parts 2 to a circuit formed on a substrate 1 through an anisotropic conductive film 3 or anisotropic conductive paste, overlaping protective layers 4 coated with an adhesive 41 on and under the substrate 1 to make the adhesive 41 inner sides, further overlaping a cushioning material 5 on the surfaces of the layers 4 and integratedly laminating them with heating and pressing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing an IC card.

[0002]

2. Description of the Related Art An IC card includes a contact type IC card and a non-contact type IC card. The non-contact type IC card generally has an antenna circuit, a radio communication function, and a calculation / storage function. It is composed of an IC and a casing. To achieve such a configuration, the IC chip is usually directly connected and mounted on a substrate on which a circuit including an inner lead portion for connecting the antenna circuit and the IC chip is formed, and a protective layer is stacked thereon. Glue.

In order to connect and mount the IC chip, as shown in FIG. 2, the IC chip is usually overlaid on a circuit formed on a substrate via a conductive paste such as an anisotropic conductive film or silver paste. The connection is performed by pressing a connection head having a heating / pressing mechanism from above the IC chip.

[0004]

SUMMARY OF THE INVENTION Such a conventional IC
In the connection of chips, the connection head must be moved or the support table for fixing the substrate must be moved to connect each IC chip.
The production of a card requires a large number of connection heads, so that there is a problem that the equipment is overweight. Also,
As shown in FIG. 2, in order to suppress the resin exuding from the end of the IC chip, a material that flows somewhat when heated and becomes a weir for the resin, such as a Teflon sheet, is used for heating. -There is a problem that the pressurization must be performed and the cost for auxiliary materials increases.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing IC cards in large quantities with a small increase in equipment and capable of manufacturing efficiently.

[0006]

According to the method of manufacturing an IC card of the present invention, as shown in FIG. 1, a chip component is formed on a circuit formed on a substrate 1 via an anisotropic conductive film 3 or an anisotropic conductive paste. 2 are temporarily connected, and a protective layer 4 on which an adhesive 41 is applied is superimposed on the upper and lower sides of the substrate 1 so that the adhesive 41 is inside, and a cushion material 5 is further superimposed on the surface of the protective layer 4. It is characterized by laminating and integrating by heating and pressing.

As the adhesive 41, a thermosetting adhesive can be used.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The substrate 1 of the present invention differs depending on the method of forming a circuit to be described later, but when formed by a subtractive method, a copper-clad laminate used for an ordinary printed wiring board or a flexible plastic film is used. A flexible copper-clad film in which a copper foil is bonded to a copper-clad laminate or a copper-clad laminate having an inner layer circuit can be used. When forming by an additive method, an insulating plate or an insulating plate having an inner layer circuit can be used. Among these, copper-clad laminates used for printed wiring boards are made of prepreg and copper impregnated with thermosetting resin such as epoxy resin, phenol resin, and polyimide resin, using paper, glass cloth, short glass fiber, etc. as reinforcing fibers. A thermosetting resin varnish in which inorganic fillers such as ceramic whiskers, silica and talc are dispersed without using reinforcing fibers, or those obtained by laminating and unifying foils by heating and pressing,
A thermosetting resin with a copper foil applied to a copper foil and dried by heating, pressing and laminating the thermosetting resins with the copper foil on each other so that the resin surfaces are on the inside can be used. In addition, polyester film, flexible copper-clad film,
Adhesive such as epoxy resin modified with thermoplastic resin such as acrylic resin or fluororesin such as biaxially stretched polyethylene terephthalate film, polyimide film, etc. And a copper foil bonded together. When using the printing method to form a circuit, an insulating film or an insulating plate can be used, and a flexible plastic film such as a polyester film, a biaxially stretched polyethylene terephthalate film, and a polyimide film can be used as the insulating film.
As the insulating plate, one in which an insulating layer used for a copper-clad laminate is formed in a plate shape can be used, and paper, glass cloth, short glass fiber, or the like is used as a reinforcing fiber, and heat of epoxy resin, phenol resin, polyimide resin, or the like is used. A prepreg impregnated with a curable resin is molded by heating and pressing, or a thermosetting resin varnish in which inorganic fillers such as ceramic whiskers, silica, and talc are dispersed without using reinforcing fibers is placed on a carrier film. And carrier / heat-dried to remove the carrier film.

A polyethylene terephthalate film, a polyimide film, a polyethylene film, or a glass cloth epoxy prepreg can be used for the protective layer 4 to be overlaid on and under the substrate 1. Among them, the polyethylene terephthalate film is most preferable because it has no pollution. This protective layer 4
As the adhesive 41 to be applied to the substrate, a thermosetting adhesive, for example, a polyester-based resin obtained by adding a curing agent and diluting with a solvent can be used, and a polyvinyl alcohol-based resin can also be used. Resins are most preferred because of their good adhesion.

As the cushion material 5, silicone rubber, fluorine rubber, natural rubber, acrylic rubber, or the like can be used. Among them, silicone rubber and fluorine rubber are most preferable because of good releasability. The thickness is preferably in the range of 2 to 20 mm, and if it is less than 2 mm, the pressure cannot be dispersed, the pressure applied to the chip component tends to concentrate on one point, and the chip component may be cracked. Inferior,
Heating time is long and not economical.

The conditions for laminating and integrating by heating and pressing are as follows: a pressure of 1 to 20 kgf / cm ² and a temperature of 80 to ²⁰ kgf / cm ² .
The range of 0 ° C. and the time is preferably in the range of 0.1 to 3 minutes. If the time is out of this range, the surface of the anisotropic conductive film may have irregularities or may have a nonuniform thickness. Heating under these conditions
As a device for laminating and integrating by pressing, a press device used for laminating a copper-clad laminate used for a printed wiring board can be usually used.

(Operation) Hereinafter, the operation of the present invention will be described with reference to the accompanying drawings. As shown in FIG. 1, a cushion material is placed on a substrate 1 on which a chip component 2 is mounted and an upper and lower protective layer are overlapped. By heating and pressurizing through this, the chip component 2 can be connected to the substrate 1 and cured, and at the same time, IC cards can be stacked.

[0013]

EXAMPLE The dimensions of an IC chip were 2 × 3 mm and the thickness was 5 mm.
The thickness of the anisotropic conductive film was 3 × 4 mm, the thickness was 35 μm, and the thickness of the circuit was 15 μm. The substrate 1 was made of polyethylene terephthalate and had a thickness of 50 μm. In the example, a press device used for a printed wiring board was used, and in the comparative example, a conventional connection head was used. As the cushion material, a silicone rubber having a thickness of 3 mm was used. For the upper protective layer, a white polyethylene terephthalate film having a thickness of 125 μm was used, and the thickness of the adhesive was set to 90 μm.
A 5 μm thick polyethylene terephthalate film was used, and the thickness of the adhesive was 30 μm. The substrate 1 on which the IC chip was mounted was overlaid between the upper and lower protective layers, and laminated under the lamination conditions shown in Table 1.

(Test) The test was conducted under the following conditions. (Mounting Yield) Ten samples were manufactured, and the ratio of the number of IC chips which could be manufactured without breaking the IC chip and whose operation was confirmed was calculated. (Surface unevenness) Using a contact-type roughness meter (trade name, manufactured by Kosaka Laboratories) which is a surface roughness meter, IC
The measurement was performed on the upper surface of the chip. (Bending test) A card having a long side of 20 mm (short side of 10 mm) was bent so that the warp height was 1 mm, the bending speed was 30 times / minute, the temperature was normal temperature, the relative humidity was 60%, and the card was continuously formed. A current of 10 mA was passed, the resistance value was measured every 250 times, and the test was performed up to 4000 times, and a test was conducted when the rate of increase in the conductor resistance did not exceed 30%. (Temperature impact test) Placed alternately in an environment of −40 ° C. for 30 minutes / 100 ° C. for 30 minutes, the resistance value was measured every 50 cycles, and the test was performed up to 200 times.
Those that did not exceed 0% were evaluated as ○, and those that did not exceed 0%.

[0015]

[Table 1] * ACF is an anisotropic conductive film, ACP is an anisotropic conductive paste

The connection yield of each IC chip is 10
0%, so that the same connection reliability as that of the conventional method can be secured, and the crimping head, Teflon sheet unwinding and winding device, and parallel unwinding of the head, which were necessary for each conventional chip, are unnecessary, and the bonding head is used. The crimping step can be reduced, and the equipment for the printed wiring board used when manufacturing the substrate could be used as equipment. Further, as an incidental effect, surface irregularities could be reduced as compared with the conventional method.

[0017]

As described above, according to the present invention, it is possible to provide a method capable of efficiently manufacturing a large number of IC cards with a small increase in the number of facilities.

[Brief description of the drawings]

FIG. 1 is a schematic side view for explaining the method of the present invention.

FIG. 2 is a schematic side view for explaining a conventional method.

[Explanation of symbols]

 1. Substrate 2. 2. Chip components Anisotropic conductive film 4. Protective layer 5. Cushion material 41. adhesive

Claims (2)

[Claims] 1. A chip component is temporarily connected to a circuit formed on a substrate via an anisotropic conductive film or an anisotropic conductive paste, and a protective layer coated with an adhesive is provided on the upper and lower sides of the substrate. The method for manufacturing an IC card, wherein the layers are stacked so that the inside faces are inside, and a cushioning material is further stacked on the surface of the protective layer, and heated and pressed under reduced pressure to laminate and integrate. 2. The method for manufacturing an IC card according to claim 1, wherein the adhesive is a thermosetting adhesive.