JPH11340625A - Method for vacuum lamination of adhesive film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for vacuum lamination of an adhesive sheet for making a build-up type multilayer printed wiring board, on which conductive circuit layers and insulating layers are laminated alternately to each other, by not having film-like adhesives seep out to internal layer circuit patterns. SOLUTION: Vacuum lamination of a holding film and a resin component material layer stacked thereon takes place at a high-temperature high-pressure condition on a patterned circuit substrate, wherein the resin component material layer is made of a resin component material of thermoplastic type and is solid at a room temperature. A method for vacuum lamination and equipment thereof are presented, wherein vacuum lamination using an adhesive film reduces seeping out of the resin component material by laminating with a seep-preventing sheet having small size of 1-8 mm from the edge of the resin component material and a height of more than that of the resin component material layer, and thus a method for vacuum lamination and an apparatus arise using an adhesive film which reduces seep out of the resin component material from the edge.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a build-up type multilayer printed wiring board in which conductive circuit layers and insulating layers are alternately stacked, and a method of vacuum laminating a film adhesive on an inner circuit pattern. Things.

[0002]

2. Description of the Related Art Conventionally, as a method of manufacturing a multilayer printed wiring board, a prepreg sheet in which glass cloth is impregnated with epoxy resin as an insulating adhesive layer on a circuit-formed inner layer circuit board and B-staged, is laminated and pressed through several sheets. In addition, a method of establishing interlayer conduction by using through holes is known. However, in this method, heating and pressure molding are performed by a laminating press, which requires large-scale equipment and a long time, resulting in high cost. In addition, since a glass cloth having a relatively high dielectric constant is used for the prepreg sheet, the interlayer thickness is small. In addition, there is a problem in that there is a limitation in terms of insulation, and insulation instability due to migration between through holes (CAF).

As a method of solving such a problem, in recent years, a manufacturing technique of a build-up type multilayer printed wiring board in which organic insulating layers are alternately stacked on a conductor layer of an inner circuit board has attracted attention. JP-A-8-64960 discloses a multi-layer printed wiring board by applying an undercoat adhesive, temporarily drying, bonding a film-like additive adhesive, heating and curing, roughening with an alkaline oxidizing agent, and forming a conductive layer by plating. There are known ways to do this. Also, JP-A-7-202
No. 418 discloses a method of manufacturing a multilayer printed wiring board by bonding an adhesive copper foil in which an adhesive layer composed of a high molecular weight epoxy resin and a liquid epoxy resin is formed on a copper foil to an inner circuit board. I have. On the other hand, the present inventors have also disclosed in Japanese Patent Application No. 9-357420 an interlayer resin composition layer for a multilayer printed wiring board which can simultaneously cover the inner circuit pattern and fill the resin in the surface via holes and / or through holes simultaneously. And a method for manufacturing a multilayer printed wiring board having high productivity using the same. When these resin composition layers are vacuum-laminated under heating and pressure conditions, the adhesive has heat fluidity, so that the adhesive is stained from the edge of the resin composition layer and the press surface is pressed. There was a problem of soiling. As a method for solving this problem, Japanese Patent Application No. Hei 9-357420 discloses a method for reducing the spotting of the adhesive by providing a resin base layer having a structure of the resin composition layer at both ends or one end of a supporting base film portion having no resin at least about 5 mm.
However, there was a drawback that the productivity of resin composition layer production was poor.

[0004]

SUMMARY OF THE INVENTION A resin composition layer surface of an adhesive film composed of a support base film and a resin composition layer on a patterned circuit board using a vacuum laminating apparatus capable of heating and pressing. In the method of laminating
It is an object of the present invention to develop a method for easily reducing stains of an adhesive.

[0005]

In examining various methods for preventing the adhesive from bleeding, between the at least one press plate of the vacuum laminating apparatus and the supporting base film surface of the adhesive film, the surface area of the adhesive film is smaller than that of the adhesive film. It is found that by providing a stain prevention sheet and installing the stain prevention sheet so that it does not protrude outside at any point around the surface of the adhesive film, it is possible to prevent the stain of the adhesive. Completed the invention.

That is, the present invention uses a vacuum laminating apparatus having at least one movable press plate which can be heated and pressurized, and 1) is laminated on a supporting base film and the surface thereof and is the same as or similar to the supporting base film. Attached drawing having a small area and having the physical properties of the hatched area S in FIG. 1 in relation to temperature and melt viscosity, the resin composition layer of the adhesive film composed of the resin composition layer at room temperature solid (2) a step of temporarily covering them at least partially after covering over at least the pattern portion on the circuit board; and (2) an area smaller than the surface area of the resin composition layer on the upper surfaces of the press plate and the supporting base film of the adhesive film. The anti-smudge sheet having a thickness greater than the thickness of the adhesive film is located 1 to 8 mm inside at any point around the surface of the resin composition layer of the adhesive film. A vacuum lamination method and apparatus of the adhesive film characterized by having a step of installing such.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The resin composition layer used in the present invention is a heat-fluid resin composition which is a solid at room temperature and contains a thermosetting resin and / or a polymer as a main component. And a resin composition capable of forming a film,
Further, there is no particular limitation as long as the properties required for the interlayer insulating material such as heat resistance and electrical properties are satisfied by thermosetting. The thickness of the resin composition is equal to or greater than the conductor thickness of the inner circuit board to be laminated, and is equal to the conductor thickness + (10 to 12).
0) It is desirable to be in the range of um.

Examples of the resin composition include an epoxy resin, an acrylic resin, a polyimide resin, a polyamideimide resin, a polycyanate resin, a polyester resin, and a thermosetting polyphenylene ether resin. May be used in combination of two or more, or a resin composition layer having a multilayer structure may be used.
Among them, an epoxy resin composition described in Japanese Patent Application No. 9-357420 is preferable for an epoxy resin system having excellent reliability and cost as an interlayer insulating material.

The preferred physical properties of the resin composition can be shown by measuring the dynamic viscoelastic modulus and showing the relationship between the temperature and the melt viscosity. The hatched area S in FIG. It is a preferable range of the product. The dynamic viscoelasticity was measured using a model Rhesol-G3000 manufactured by UBM Corporation. The upper limit of the dynamic viscoelasticity measurement curve is 10 minutes at an average drying temperature of 100 ° C., and the lower limit of the dynamic viscoelasticity measurement curve is the physical properties of the resin composition layer treated at an average drying temperature of 100 ° C. for 5 minutes. . Experimentally sandwiched by this curve, with a melt viscosity of 100,000 Poise or less and a melting temperature of 14
The range of 0 ° C. or lower represents the physical properties of the resin composition layer preferably used for the present invention. Melt viscosity 1
Above 10,000 Poise, the resin composition layer becomes hard, and when the vacuum lamination method of the adhesive film of the present invention is performed, the adhesion between the pattern on the circuit board and the resin composition layer is poor. 140 ° C
Manufacturing at the above temperature is not preferable because the obtained laminated circuit board is easily damaged by high temperature.

The dynamic viscoelasticity measurement shown in the accompanying drawings of FIG. 1 of the present application and shown in FIG. 1 was measured at a heating rate of 5 ° C./min. FIG. 2 shows dynamic viscoelasticity measurement curves measured at different heating rates for the resin composition layer obtained in Adhesive Film Production Example 1. Therefore, as for the preferable range of the physical properties of the resin composition layer, the dynamic viscoelasticity curve must be measured by adjusting the measurement conditions to chitin.

The stain preventing sheet used in the present invention may be fixed to a press plate of a vacuum laminating apparatus or may be an independent sheet. The press mechanism in the vacuum laminating apparatus may be of a type in which one press plate is movable, or a type in which one press plate is formed and both are movable. In the present invention, the hardness of the press plate is important, and it is not preferable that the press plate is too hard. Usually, a heat-resistant rubber material is used as the material. The material of the stain prevention sheet is, for example, a thickness of 0.
A PET film having a thickness of 1 to 1 mm or a heat-resistant rubber having a thickness of 1 to 2 mm is used.

The circuit board on which the resin composition layer of the adhesive film composed of the supporting base film and the resin composition layer is laminated may be patterned on one or both sides. When both sides are patterned, if two adhesive films are used in accordance with both sides of the circuit board, the resin composition of the adhesive film composed of the supporting base film and the resin composition layer on the patterned circuit board at the same time The layers can be laminated simultaneously on both sides of the circuit board.

The adhesive film used in the present invention comprises a support base film and a resin composition layer. Further, the resin composition layer is covered with a protective film for the purpose of preventing contamination during transportation and storage and maintaining quality. The support base film and the resin composition layer may be bonded to each other in a state having the same area, but usually, after the adhesive film is laminated on the circuit board, the support film is removed from the workability when removing the support film. Are designed to have a slightly larger area and are stuck together in this state.

The resin composition layer of the adhesive film used in the present invention is formed by applying a resin varnish dissolved in a predetermined organic solvent using a support base film as a support, and then drying the solvent by heating and / or blowing with hot air to obtain a solid at room temperature. The resin composition can be prepared by a known and commonly used method. In this case, almost no organic solvent remains in the produced adhesive film, and the organic solvent is removed to a degree that does not affect the working environment and safety in the operation of the subsequent laminating method.

Examples of the supporting base film constituting the adhesive film used in the present invention include polyolefins such as polyethylene and polyvinyl chloride, polyesters such as polyethylene terephthalate, polycarbonate, and metal such as release paper, copper foil and aluminum foil. Foil and the like. The thickness of the supporting base film is 10 to 15
0 μm is common. The support film may be subjected to a release treatment in addition to the mud treatment and the corona treatment. The thickness of the room temperature solid resin composition is not less than the conductor thickness of the inner layer circuit board to be laminated, and the conductor thickness + (10 to 120)
It is generally in the range of μm. The resin composition layer of the present invention comprising the resin composition at room temperature and the supporting base film is stored as it is or by further laminating a protective film on the other surface of the resin composition, winding it into a roll, and storing.

The method of vacuum laminating the resin composition layer of the adhesive film on the patterned inner circuit board includes the following:
Vacuum applicators manufactured by Morton International, Inc., vacuum presses manufactured by Meiki Seisakusho, and vacuum laminators manufactured by OPTEK, such as vacuum laminators, can be used. In laminating, if the protective film is present, the protective film is removed, and then the resin composition layer of the adhesive film is placed on the circuit board. The supporting base film, which is a resin composition at room temperature and which is solid at room temperature, is heated, pressed, and laminated. Since the resin flow at the time of lamination is equal to or larger than the conductor thickness of the inner layer circuit, the lamination allows the inner layer circuit pattern to be covered well. At this time, even when the surface area of the spot prevention sheet is larger than or approximately the same as the surface area of the resin composition layer of the adhesive film, or in other words, even if it is small, the spot prevention sheet is formed of the resin of the adhesive film. If it is outside at any point from the composition layer, the adhesive is stained from the end of the set resin composition layer, which is not preferable.

Therefore, the surface area of the spot prevention sheet is smaller than the surface area of the resin composition layer of the adhesive film, and the surface periphery of the spot prevention sheet is smaller than the surface periphery of the resin composition layer of the adhesive film. In this case, it is preferable that the distance is set to be 1 to 8 mm inside.
By fixing the bleeding prevention sheet having a thickness of not less than the resin composition layer to the press plate, or by sandwiching the sheet between the resin composition layer and the supporting base film at the time of lamination, sufficient pressure is applied to the film end portion at the time of pressing. It becomes possible to reduce the stain of the resin composition. If the size of the stain prevention sheet is less than 1 mm at any point from the size of the adhesive film at the time of lamination, there is no change in the amount of stains, and if it exceeds 8 mm, the effective area of the resin composition layer is small. In addition to the above, the press surface is likely to come into contact with the end of the film, and the effect of reducing stains is lost. More preferably, 2 to 5
mm. The thickness of the stain prevention sheet depends on the degree of thermal fluidity of the adhesive, but is preferably at least the thickness of the resin composition layer, and is preferably in the range of 0.3 to 4 mm. If the thickness of the stain prevention sheet is less than the thickness of the resin composition layer, the pressed surface comes into contact with the end of the film, so that there is no effect. In order to form a stain prevention sheet on the press surface or to develop a function equivalent thereto, a groove may be formed on the press surface, or a sheet material may be laminated on the press surface, The latter is easier to change the substrate size. The material of the sheet material is not particularly limited as long as it can follow the substrate to be laminated, but a film material such as a support base film, a heat-resistant rubber used for a pressed surface, and the like are preferable.

The method of vacuum laminating the resin composition layer of the present invention on a patterned circuit board is not limited to the case where the interlayer resin composition layer for build-up is used, and has a thermal fluidity. It goes without saying that the present invention can be applied to the entire resin composition layer, for example, a dry film such as a solder resist.

An apparatus for carrying out the method of the present invention is an apparatus for laminating a resin composition layer of an adhesive film composed of a support base film and a resin composition layer on a circuit board subjected to pattern processing. 1) Press means using at least one movable press plate which can be heated and pressed, 2) Smear prevention means using a stain prevention sheet fixed to the press plate of the press means, 3) The stain prevention sheet And a positioning means which can be set so that the periphery of the surface of the resin composition layer of the adhesive film is located 1 to 8 mm inside at any point.

It is characterized in that the surface of the spot prevention sheet is smaller than the surface area of the resin composition layer of the adhesive film, and the thickness of the spot prevention sheet is larger than the thickness of the adhesive film. The positioning means may read the position of the circuit board from the position of the press plate with an optical sensor or the like so as to match the position. The reading means is not particularly limited.

[0021]

EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples.

[0022]

[Production example of adhesive film] Liquid bisphenol A type epoxy resin (Epicoat 828 manufactured by Yuka Shell Epoxy Co., Ltd.)
EL) 20 parts, brominated bisphenol A type epoxy resin (YDB-500, manufactured by Toto Kasei Co., Ltd.), cresol novolak type epoxy resin (epoxy equivalent: 215, softening point: 78 ° C., Epicron manufactured by Dainippon Ink and Chemicals, Inc.) N-673) 20 parts, terminal epoxidized polybutadiene rubber (Denalex R-45EP manufactured by Nagase Kasei Kogyo Co., Ltd.)
T) and 15 parts thereof were dissolved in MEK by heating while stirring, and a brominated phenoxy resin varnish (nonvolatile content: 40% by weight, bromine content: 25% by weight, solvent composition, xylene: methoxypropanol: methyl ethyl ketone = 5: 2: 8,
50 parts of YPB-40-PXM40 manufactured by Toto Kasei Co., Ltd.
2,4 diamino-6- (2-methyl-1-imidazolylethyl) -1,3,5-triazine / isocyanuric acid adduct 4 parts as epoxy curing agent, further 2 parts of finely ground silica, 4 parts of antimony trioxide, 5 parts of calcium carbonate Was added to prepare a resin composition varnish. Apply the varnish to thickness 3
On a 8 μm PET film, the thickness after drying is 42, 7
Apply with a roller coater to 2 μm, 80 ~
After drying at 120 ° C., an adhesive film having a thickness of 80 and 110 μm was obtained. The measurement of the dynamic viscoelasticity of the resin composition layer of the adhesive film is performed, for example, using a model Rhesol manufactured by UBM Corporation.
-Measurement can be completed using G300. FIG. 1 shows the measured dynamic viscoelastic modulus curve, the upper limit of which is an average drying temperature of 10
0 ° C. for 10 minutes, and the lower curve is the average drying temperature of 100
It shows the physical properties of the resin composition treated at 5 ° C. for 5 minutes. FIG. 2 is a dynamic viscoelasticity measurement curve when the heating rate is 5 ° C./min, 8 ° C./min, and 20 ° C./min.

[0023]

Example 1 An 80 μm and 110 μm thick adhesive film obtained in the production example was temporarily attached to the center of the substrate on both sides of a 510 × 340 mm glass epoxy inner layer circuit board (conductor thickness: 18 μm) in a size of 506 × 336 mm. Next, a stain prevention sheet (500 x 330 mm
A PET film having a size of 0.1 to 1 mm in thickness) was disposed on both sides at the center of the adhesive film, and was placed so that it was located at least 3 mm inside regardless of the position from the end of the resin composition layer. Both sides were simultaneously laminated by a press at a temperature of 80 ° C. for 5 seconds using a vacuum applicator 700 manufactured by Morton International Incorporated.
The spots were visually observed. The results are shown in Table 1, and the results are shown in Table 1. The results are shown in Table 1.

[0024]

[Table 1]

[0025]

Comparative Example 1 A resin composition layer having a thickness of 506 x 336 mm was temporarily attached to both sides of a resin composition layer having a thickness of 506 x 336 mm on a patterned 510 x 340 mm glass epoxy inner layer circuit board (having a conductor thickness of 18 m). . Next, a stain prevention sheet (500 x 330 mm
A PET film having a size of 0.1 mm in thickness) was disposed on both sides at the center of the resin composition layer, and was disposed so as to be located at least 3 mm inside regardless of the position from the end of the resin composition layer. Both sides were simultaneously laminated by a press at a temperature of 80 ° C. for 5 seconds using a vacuum applicator 700 manufactured by Morton International Incorporated. The spots were visually observed, but the spots were "yes".

[0026]

EXAMPLE 2 A 110 μm thick resin composition layer obtained in the production example was applied to a 510 × 340 mm glass epoxy inner layer circuit board (conductor thickness: 35 μm) which had been subjected to pattern processing.
Temporarily attached to both sides at the center of the substrate with a size of 36 mm. Next, a 1.6 mm thick heat-resistant rubber in which the distance from the end of the resin composition layer was reduced in the range of 0 to 10 mm was arranged on the upper and lower press surfaces, and the temperature was adjusted to 80 by a vacuum applicator 700.
The laminate was simultaneously laminated on both sides by pressing at 5 ° C. for 5 seconds. The results are shown in Table 2.

[0027]

[Table 2]

[0028]

Comparative Example 2 On a patterned 510 × 340 mm glass epoxy inner layer circuit board (conductor thickness 35 μm), the thick resin composition layer of the 110 μm adhesive film obtained in the production example was displaced from the center of the board at a size of 506 × 336 mm on both sides. Temporarily attached. In this case, the periphery of the surface of the resin composition layer partially coincided with the periphery of the spot prevention sheet in which heat-resistant rubber having a thickness of 1.6 mm was arranged on the upper and lower pressing surfaces (distance 0 m)
m). Temperature 80 by vacuum applicator 700
The laminate was simultaneously laminated on both sides by pressing at 5 ° C. for 5 seconds. Exudation was "Yes". The results are shown in Table 2.

[0029]

Comparative Example 3 A thick resin composition layer of a 110 μm adhesive film obtained in the production example was placed on a patterned 510 × 340 mm glass epoxy inner layer circuit board (conductor thickness 35 μm) in a size of 506 × 336 mm to coincide with the center of the substrate. Temporarily attached to. In this case, the resin composition layer and 1.6 m
The spot prevention sheet in which m-thick heat-resistant rubber was arranged on the upper and lower press surfaces was made to have the same area. Both sides were simultaneously laminated by a vacuum applicator 700 at a temperature of 80 ° C. for 5 seconds. Exudation was "Yes".

[0030]

Comparative Example 4 A 110 μm thick resin composition layer obtained in the production example was 506 × 3 on a 510 × 340 mm glass epoxy inner layer circuit board (conductor thickness 35 μm) which had been subjected to pattern processing.
Temporarily attached to both sides at the center of the substrate with a size of 36 mm. Next, the distance was 10 m from any end of the resin composition layer.
The 1.6 mm thick heat-resistant rubber, which has been reduced by 1.6 m, is arranged on the upper and lower press surfaces, and the temperature is adjusted to 80 by a vacuum applicator 700.
The laminate was simultaneously laminated on both sides by pressing at 5 ° C. for 5 seconds. Exudation was "Yes". The results are shown in Table 2.

From the results of Examples 1 and 2, according to the method of the present invention, it is possible to laminate a resin composition layer having heat fluidity in a state in which the stain of the adhesive is reduced.

Comparative Example 5 FIG. 3 shows a dynamic viscoelasticity measurement curve of the resin composition layer obtained in Preparation Example 1 of the adhesive film, which was dried at an average drying temperature of 100 ° C. for 2 minutes. This is clearly outside the shaded area S shown in FIG. The adhesive film obtained by laminating the resin composition layer on the supporting base film was able to carry out the laminating step, but resin dripping occurred in the next thermosetting step, and thus the resin composition layer had an uneven thickness. Therefore, it could not be used for the purpose of the present invention.

[0032]

Comparative Example 6 FIG. 3 shows the dynamic viscoelasticity measurement curve of the resin composition layer obtained in Preparation Example 1 of the adhesive film obtained by drying the resin composition layer at an average drying temperature of 100 ° C. for 15 minutes. Clearly, it shifted to the higher viscosity side outside the shaded area S shown in FIG. An adhesive film was produced by laminating the resin composition layer on a supporting base film. An attempt was made to laminate the resin composition layer of the adhesive film on the pattern portion of the circuit board, but could not find any conditions for laminating without voids.

[0033]

According to the method of the present invention, it is possible to easily laminate an adhesive film having thermal fluidity with very excellent surface smoothness.

[Brief description of the drawings]

FIG. 1 shows a dynamic viscoelastic modulus measurement.
This is a curve measured using a model Rhesol-G3000 manufactured by M Co., Ltd., and the average drying temperature of the curve (1) at the upper limit of the dynamic viscoelastic modulus is 10
At 0 ° C. for 10 minutes, the lower curve (2) also shows an average drying temperature of 1
It shows the physical properties of the resin composition treated at 00 ° C. for 5 minutes. The measurement conditions were as follows: heating rate 5 ° C / min, starting temperature 60 ° C,
The measurement temperature interval is 2.5 ° C and the vibration is 1 Hz / deg.

FIG. 2 shows a dynamic viscoelastic modulus measurement, and is shown by U.B.
It is a curve measured using Model Rhesol-G3000 manufactured by M Corporation, and shows the physical properties of the resin composition obtained by treating the resin composition layer obtained in Adhesive Film Production Example 1 at an average drying temperature of 100 ° C. for 5 minutes. Heating rate 5 ° C / min (Curve III), 1
0 ° C. (curve II) and 20 ° C. (curve I). Measurement conditions are: starting temperature 60 ° C, measuring temperature interval 2.5 ° C, vibration 1Hz / d
eg.

FIG. 3 shows dynamic viscoelasticity measurement.
It is a curve measured using the model Rhesol-G3000 manufactured by M Co., Ltd., in which the resin composition layer obtained by the adhesive film production example 1 was dried at an average drying temperature of 100 ° C. for 2 minutes (curve A) and 8 minutes (curve B). And the physical properties of the resin composition treated for 15 minutes (curve C). The measurement conditions are as follows: a temperature rising rate is 5 ° C./min, a starting temperature is 60 ° C., a measuring temperature interval is 2.5 ° C., and a vibration is 1 Hz / deg.

Claims (3)

[Claims] 1. A vacuum laminating apparatus having at least one movable press plate which can be heated and pressurized, and 1) a supporting base film and a surface which is laminated on the surface thereof and which is the same as or smaller than the supporting base film. In addition, the resin composition layer of the adhesive film consisting of a resin composition layer of a thermofluid, room temperature solid having the properties of the shaded region S in FIG. After covering at least the pattern portion on the substrate, partially temporarily bonding them, 2) an area smaller than the surface area of the resin composition layer on the upper surface of the support base film of the press plate and the adhesive film, In addition, the anti-smudge sheet having a thickness greater than the thickness of the adhesive film is disposed so as to be located 1 to 8 mm inside at any point around the surface of the resin composition layer of the adhesive film. Vacuum lamination of the adhesive film characterized by having a degree 2. An apparatus for laminating a resin composition layer of an adhesive film composed of a support base film and a resin composition layer on a patterned circuit board, and 1) capable of heating and pressing. Press means using at least one movable press plate; 2) means for preventing stains from being applied by a stain prevention sheet fixed to the press plate of the press means;
3) Regardless of the point around the surface of the resin film layer of the adhesive film, the point around the surface of the spot prevention sheet is 1
And a positioning means which can be set to be located within 8 to 8 mm inside. 3. The adhesive according to claim 2, wherein the surface of the spot prevention sheet is smaller than the surface area of the resin composition layer of the adhesive film, and the thickness of the spot prevention sheet is larger than the thickness of the adhesive film. Film vacuum laminating equipment