JPH11338996A - Manufacture of resin card and manufacturing equipment for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a surely integrated resin card of a chip-incorporated type with uniform thickness, high quality and high reliability without the deformation, distortion or warp, etc., and without a clearance between card base materials, without breaking or damaging the chip. SOLUTION: This resin card manufacturing equipment 11 is constituted of a carrying device part 13 for carrying a work W for which a chip is disposed between the card base materials, a lamination part 14 for pressurizing the work W carried by the carrying device part 13 while heating it, and a pressurizing and cooling device part 15 for pressurizing and cooling the work W laminated in the lamination part 14 by clamping it by a cooling plate 51. The lamination part 14 is constituted of a chamber 32 composed of a box 31 for surrounding the carrying path of the work W by the carrying device part 13, a hot air supplier 36 for sending hot blast into the chamber 32 and turning the inside of the chamber 32 to a high temperature atmosphere and a pressurizing part 42 for pressurizing the work W passed through the chamber 32 and heated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to the manufacture of a resin card such as an IC card having a built-in IC chip or the like and having both functions of a contact type, a non-contact type, and both a contact type and a non-contact type. The present invention relates to a method and a manufacturing apparatus used for the method.

[0002]

2. Description of the Related Art In recent years, for example, credit cards, IDs,
As a card-shaped storage medium such as a card and a cash card, an IC card has been developed in which an IC module including a semiconductor memory such as a microprocessor, a RAM, and a ROM is mounted on a card material instead of a magnetic card. As this type of IC card, a contact IC
There are a card, a non-contact type IC card, an IC card having both functions of a contact type and a non-contact type, and in any case, the information storage amount is very large and the security is excellent. .

As shown in FIG. 4, an inlet sheet 3 in which an IC chip 2 is mounted on a coil antenna 1 and a card base 4 made of at least one sheet-like resin above and below the inlet sheet 3 are shown in FIG. Superimpose,
What integrated these is known.

[0004] As a method of manufacturing this resin card,
A recess is provided in advance in the card base material 4 serving as a core, and an IC is provided there.
A method of embedding the chip 2 and fixing it with an adhesive,
A work in which the inlet sheet 3 is sandwiched between the card bases 4 is disposed between sandwiching plates made of a metal plate, and heated and pressed through the sandwiching plates, so that the IC chip 2 is interposed between the card bases 4.
There is a method of laminating and the like in which the embedment is integrated.

[0005]

However, in the former method, a processing error that cannot be prevented occurs when processing the concave portion, and a minute gap is generated between the IC chip 2 and the card base material 4. As a result, the heights of the surface of the card base 4 and the surface of the IC chip 2 are not uniform, which causes a malfunction when the card is used. In the latter method, since heating and pressing are performed at the same time, that is, the work is directly heated and pressurized through a metal plate, heat and pressure are concentrated on the IC chip 2 at the time of pressurization, and the IC chip 2 is heated. 2 was sometimes damaged or damaged. That is, since the work W is thicker in the chip mounting portion than in the other portions, when the work W is pressed through the holding plate, the pressing force and the heat from the holding plate cause the IC chip 2
Concentrate on

In the conventional laminating technology,
After the heat welding, the heat is not cooled, so that there is a problem that the material is warped by the heat during transportation and hangs down by its own weight. Further, since a card base material formed by laminating a large number of sheet-shaped base materials of different materials, and a sheet base material formed of a thermoplastic resin, an adhesive, and the like are heated and pressed, the above-described laminating method requires a card. It is impossible to control the thickness of the film, and there is a problem that poor adhesion also occurs.

The present invention has been made in view of the above circumstances, and does not cause breakage or damage of an IC chip due to heat or pressure during card manufacturing, and prevents the IC chip and the card base material from being damaged. To provide a method of manufacturing a resin card capable of manufacturing a resin card having a uniform thickness without distortion without causing a gap which may cause a malfunction when the card is used, and a manufacturing apparatus used therefor. It is an object.

[0008]

In order to achieve the above object, a method for manufacturing a resin card according to claim 1 is a method for manufacturing a resin card having a built-in chip, the method comprising: The chip is arranged between the card substrates to form a work, and the work is passed through a high-temperature atmosphere and pressurized while being heated. Then, the work is pressurized and cooled. In other words, after the work in which the chips are arranged between the card base materials is passed through a high-temperature atmosphere and preheated, pressure is applied by reducing the distance between the rollers at the opposing positions, so that the card base material constituting the work is uneven. By heating, the sheet-like resin is softened, and the chip is not damaged or damaged due to heat concentration or pressure concentration. Also,
By pressurizing and cooling after molding by heating and pressurizing the work, distortion and warping due to residual heat after molding by heating and pressurizing are prevented.

[0009] A method for manufacturing a resin card according to claim 2 is as follows.
The method of manufacturing a resin card according to claim 1, wherein the work is pressurized stepwise while being heated. As described above, since the workpiece is pressurized stepwise while being heated, heat concentration and pressure concentration on the internal chip can be further suppressed.

The resin card manufacturing apparatus according to claim 3 is
A resin card manufacturing apparatus for manufacturing a resin card having a built-in chip, comprising: a transfer device unit that transfers a work in which the chips are arranged between card bases made of a sheet-like resin; and a transfer device unit. A laminating unit that pressurizes the conveyed work while heating it, and a pressurizing and cooling unit that pressurizes and cools the work, which has been laminated in the laminating unit, by sandwiching the work with a cooling plate, The laminating section is passed through a chamber formed of a box surrounding a transfer path of a work by the transfer device section, a hot air supply device that sends hot air into the chamber to make the inside of the chamber a high temperature atmosphere, and passes through the chamber. And a pressurizing unit for pressing the work to be heated by heating. That is, since the work in which the chips are arranged between the card base materials is fed into the chamber of the chamber in a high-temperature atmosphere and heated, the card base material of the work is sufficiently and uniformly heated. By heating, the sheet-like resin is softened, so that when the work is pressed by the pressing unit, heat concentration and pressure concentration on the chips in the work are eliminated, and chip breakage due to heat concentration and pressure concentration , Without damage. In addition, since the work is pressurized and cooled by the pressurizing and cooling device after the work is formed by heating and pressurizing, distortion and warping due to residual heat after laminating in the laminating unit are prevented.

According to a fourth aspect of the present invention, there is provided a resin card manufacturing apparatus.
4. The resin card manufacturing apparatus according to claim 3, wherein the pressing unit is rotatable around an axis orthogonal to the conveyance path at an opposing position via the conveyance path and spaced apart along the conveyance path. 5. It is characterized by comprising a plurality of rollers supported apart from each other, wherein the interval between the rollers at positions facing each other is gradually narrowed toward the front side in the direction of transport of the workpiece by the transport unit. . As described above, since the work is stepwise pressed through the work to the pressurizing portion including a plurality of rollers, the distance between each of which is gradually narrowed toward the front side in the transfer direction of the work. Concentration and pressure concentration are further reduced.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a resin card and an apparatus used therefor according to an embodiment of the present invention will be described below with reference to the drawings. 1 and 2, reference numeral 11 denotes a resin card manufacturing apparatus. This resin card manufacturing apparatus 11
Are mounted on the gantry 12 on the transport device unit 13 and the laminating unit 14
And a structure provided with a pressurizing and cooling device section 15.

The transport unit 13 includes rotating shafts 16 provided at both ends of the gantry 12, and a pair of endless transport chains 18 meshed with sprockets 17 provided at both ends of the rotating shaft 16. And a rotational force is applied to one of the rotating shafts 16 from a drive motor (not shown). That is, when the rotating shaft 16 is rotated by the drive motor, a pair of transport chains 18 meshed with the sprocket 17 of the rotating shaft 16 travel in the same direction.

As shown in FIG. 3, the transport chain 18 is provided with positioning pins 19 at intervals.
These positioning pins 19 have positioning holes 2 formed at both ends of a pair of holding plates 21 made of a metal plate or the like.
2 are fitted. That is, by fitting the positioning holes 22 at both ends of the holding plates 21 to the positioning pins 19, the holding plates 21 are positioned and supported in a state of being superimposed on the transport chain 18, and are supported by the transport chain 18. It is configured to be conveyed in the direction of arrow A in FIG.

A work W comprising an inlet sheet 3 on which the IC chip 2 is mounted on the coil antenna 1 and a card base material 4 stacked with the inlet sheet 3 interposed therebetween is disposed between the holding plates 21. It is supposed to be.

The laminating section 14 has a configuration having a chamber 32 composed of a box 31 surrounding a transfer path of the work W by the transfer device section 13. A hose 33 is connected to the chamber 32 at a vertical position via a transfer path.

The hoses 33 are connected to a damper 34, and a hot air supply 36 is connected to the damper 34 via a hose 35. Then, hot air is sent from the hot air supply device 36 to the damper 34, the amount of air is adjusted and sent to each hose 33 by the damper 34, and is sent into the box 31 constituting the chamber 32. ing. Then, the inside of the box 31 is made to have a high temperature atmosphere by the hot air sent from the hot air supply device 36.

Each of the workpieces W
A plurality of rollers 41 supported rotatably about an axis perpendicular to the conveyance direction and spaced apart along the conveyance path are provided, and these rollers 41 constitute a pressure unit 42. ing. The rollers 41 constituting the pressurizing section 42 are provided at positions facing each other via a transport path, and the interval between the rollers 41 is gradually narrowed forward in the transport direction of the work W. These rollers 41 can be adjusted according to the thickness of the work W. Further, the upper roller 41 can be moved up and down, and the lower end position is the opposing interval of the roller 41.
The upper roller 41 is configured to be pushed downward at a constant pressure by an actuator (not shown). For this reason, when a workpiece W thicker than the set facing distance of the rollers 41 is inserted, the upper roller 41 is moved upward while maintaining the pressure set by the actuator, and a mechanism is provided so that the pressure greater than the set pressure is not applied to the workpiece W. ing.

The work W transferred by the transfer device 13 is supplied to the chamber 32 of the laminating unit 14.
While being heated in the box 31 of the chamber 32 which has been brought into a high-temperature atmosphere by hot air,
And between the rollers 41 is pressurized in a stepwise manner.

A cover 43 is provided on the front side of the resin card manufacturing apparatus 11 on the side of the chamber 32 to ensure the heat insulating action in the chamber 32 and the safety during operation.

The pressurizing and cooling unit 15 includes a laminating unit 14
Is provided on the downstream side in the transport direction of the workpiece W.
It has a pair of cooling plates 51 installed at upper and lower positions of a transfer path of the work W by the transfer device unit 13. The lower cooling plate 51 of the cooling plates 51 is fixed to the distal end of a column 53 erected on a support frame 52 that is laterally supported near the lower part of the gantry 12.

The upper cooling plate 51 is supported by a press mechanism 54 provided on the support frame 52, and is moved by the press mechanism 54 in a direction of approaching and separating from the lower cooling plate 51. It has become. Here, the press mechanism 54 for moving the upper cooling plate 51 close to and away from the lower cooling plate 51 will be described.

An upper end of a support member 55 is rotatably connected to an upper portion of the upper cooling plate 51, and the support member 55 has a support portion having an intermediate portion erected on the support frame 52. It is rotatably connected to the tip of the member 56.
Further, a support frame 52 is provided on the rear end side of the support member 55.
Are connected to each other. One of these cylinders 57, 58
Extend the rod 57a, and the other cylinder 58 contracts the rod 58a.

When one of the cylinders 57 of the press mechanism 54 having the above structure is operated, the rear end of the support member 55 is pushed up by the cylinder 57, and the cylinder is rotated about the connection point with the support member 56. As a result, the upper cooling plate 51 connected to the tip of the supporting member 55 is pushed down toward the lower cooling plate 51, and when the other cylinder 58 is operated, the cylinder 58 The rear end portion is pulled down and pivoted in the opposite direction about the connection point with the support member 56 so that the upper cooling plate 51 connected to the front end portion of the support member 55 is pulled up. Has become.

A cooling hose 59 is connected to each cooling plate 51, and a cooling liquid is sent from the cooling hose 59 into a cooling pipe 60 disposed in the cooling plate 51. 51 is to be cooled. In the pressurized cooling device section 15 having the above structure, the cylinder 57 is operated to push down the upper cooling plate 51 in a state where the work W is disposed between the cooling plates 51,
Thus, the work W is pressed and cooled by the upper and lower cooling plates 51.

The gantry 12 of the resin card manufacturing apparatus 11 has a wheel 61 and an adjuster bolt 6
The resin card manufacturing apparatus 11 can be run by wheels 61, and the adjuster bolts 6 are provided.
By extending 2, the resin card manufacturing apparatus 11 is supported on the installation surface. Also, reference numeral 6 in FIG.
Reference numeral 3 denotes an operation box. The operation box 63 allows the user to operate the resin card manufacturing apparatus 11, set various operations, and the like.

Next, the resin card manufacturing apparatus 11 having the above structure
A case of manufacturing a resin card will be described.
First, a work W in which an inlet sheet 3 composed of a coil antenna 1 on which an IC chip 2 is mounted is disposed between a plurality of card bases 4 composed of a sheet-shaped resin,
Installed between the two. Then, the holding plate 21 holding the work 21 is set on the transport chain 18 by inserting the positioning holes 22 at both ends into the positioning pins 19 provided on the transport chain 18 of the transport unit 13.

In this state, the transport device 13 is operated to transport the workpiece W, and the workpiece W is sent into the chamber 32 of the laminating section 14. By doing so, the box 3 of the chamber 32, which has been brought into a high-temperature atmosphere by the sent hot air,
The work W is heated in 1 and is passed through a pressurizing section 42 composed of rollers 41 provided at opposing positions of these chambers 32. As a result, the heated work W between the sandwiching plates 21 is passed between the rollers 41, and is gradually pressurized in a stepwise manner to be laminated to an optimum plate pressure.

The work W thus laminated by the laminating unit 14 is further conveyed by the conveying unit 13 and disposed between the cooling plates 51 of the pressurizing and cooling unit 15, and in this state, The cylinder 57 of the press mechanism 54 operates, and the work W held between the holding plates 21 is held by the cooling plates 51, and the work W is cooled by the cooling plates 51.

After the cooling by the cooling plate 51, the upper cooling plate 51 is moved upward by the cylinder 58 of the press mechanism 54, and the pressing and cooling of the work W by the cooling plate 51 are completed. The work W is transported to the take-out position on the downstream side.

As described above, the above resin card manufacturing apparatus 1
According to No. 1, the work W is fed into the box 31 of the chamber 32 in a high-temperature atmosphere and heated when the lamination is performed.
Can be sufficiently heated without unevenness. In addition, since the workpiece W is passed through a plurality of rollers 41 whose facing distance is gradually narrowed toward the front in the transport direction while heating the workpiece W, the pressure is applied stepwise, so that the IC chip 2 in the workpiece W is pressed. Heat concentration and pressure concentration of the IC chip 2 can be suppressed.
Damage can be eliminated.

The work W after the laminating process by the laminating unit 14 is transferred to the cooling plate 51 of the pressure cooling unit 15.
Thus, deformation such as distortion or warpage due to residual heat after lamination can be prevented. That is, this resin card manufacturing apparatus 1
According to No. 1, there is no breakage or damage of the IC chip 2 due to heat concentration or pressure concentration as compared with the conventional case where the work W is heated via the holding plate and pressurized from above and below. High quality and highly reliable chips of uniform thickness with no gap between card base materials that cause deformation such as distortion and warpage due to residual heat after processing and cause malfunction during use. A built-in resin card can be manufactured.

[0033]

As described above, according to the method for manufacturing a resin card of the present invention and the manufacturing apparatus used therefor, the following effects can be obtained. According to the method for manufacturing a resin card according to the first aspect of the present invention, the work in which the chips are arranged between the card base materials is passed through a high-temperature atmosphere and is heated and pressurized. The chip can be prevented from being damaged or damaged due to heat concentration or pressure concentration of the chip. Further, after the work is molded by heating and pressurizing, by applying pressure and cooling, deformation such as distortion and warping due to residual heat after molding by heating and pressurizing can be prevented. In other words, there is no gap between card bases that causes deformation such as distortion and warping, and malfunctions during use without damaging or damaging the chip. A resin chip with a built-in chip having high reliability can be manufactured.

According to the resin card manufacturing method of the present invention, since the work is pressurized stepwise while being heated, heat concentration and pressure concentration on the internal chip can be further suppressed. As a result, chip breakage and damage are further prevented, and there is no gap between card base materials that may cause deformation such as distortion or warping and malfunction during use, ensuring high quality with a uniform integrated thickness In addition, a highly reliable resin card with a built-in chip can be manufactured.

According to the resin card manufacturing apparatus of the third aspect, the work in which the chips are arranged between the card base materials is fed into the chamber of the chamber in a high-temperature atmosphere and heated. The card base material can be sufficiently heated without unevenness. Thus, when the work is pressed by the pressing unit, heat concentration and pressure concentration on the chip in the work can be eliminated, and breakage and damage of the chip due to heat concentration and pressure concentration can be eliminated. In addition, since the work is pressurized and cooled by the pressurizing and cooling device after the work is molded by heating and pressurizing, deformation such as distortion and warpage due to residual heat after laminating in the laminating unit is prevented. be able to. That is,
High quality and high reliability with a uniform thickness, with no gaps between card bases that can cause deformation such as distortion and warping and cause malfunction during use without damaging or damaging the chip Can be manufactured.

According to the resin card manufacturing apparatus of the fourth aspect, the work is stepwise applied to the pressurizing section comprising a plurality of rollers, the distance between which opposes each other gradually decreases toward the front side in the transport direction of the work. Since pressure is applied, heat concentration and pressure concentration on the chip in the work can be largely suppressed. As a result, chip breakage and damage are further prevented, and there is no gap between card base materials that may cause deformation such as distortion or warping and malfunction during use, ensuring high quality with a uniform integrated thickness In addition, a highly reliable resin card with a built-in chip can be manufactured.

[Brief description of the drawings]

FIG. 1 is a perspective view of a resin card manufacturing apparatus illustrating a configuration and a structure of a resin card manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic side view of a part of the resin card manufacturing apparatus illustrating the configuration and structure of the resin card manufacturing apparatus according to the embodiment of the present invention.

FIG. 3 is a schematic side view of a transfer chain, a holding plate supported by the transfer chain, and a work for explaining a structure of a transfer device unit that forms the resin card manufacturing apparatus according to the embodiment of the present invention.

FIG. 4 is an exploded cross-sectional view of the resin card schematically illustrating the configuration and structure of a resin card with a built-in IC chip.

[Explanation of symbols]

 2 Chip 4 Card base material 11 Resin card manufacturing device 13 Transport device portion 14 Laminating portion 15 Pressure cooling device portion 31 Box body 32 Chamber 36 Hot air supply device 41 Roller 42 Pressurizing portion W Work

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI B29L 9:00 (72) Inventor Hideo Awakawa 1-5-1, Taito, Taito-ku, Tokyo Letterpress Printing Co., Ltd.

Claims (4)

[Claims] 1. A method for manufacturing a resin card in which a chip is embedded, wherein the chip is disposed between a plurality of card bases made of a sheet-like resin to form a work, and the work is placed in a high-temperature atmosphere. And pressurizing the workpiece while heating, and then cooling the workpiece while applying pressure. 2. The method for manufacturing a resin card according to claim 1, wherein the workpiece is pressurized stepwise while being heated. 3. A resin card manufacturing apparatus for manufacturing a resin card in which a chip is built, comprising: a transfer unit for transferring a work in which the chip is disposed between a plurality of card bases made of a sheet-like resin. A laminating unit that pressurizes the work conveyed by the conveying unit while heating, and a pressurized cooling device that pressurizes and cools the work laminated by the laminating unit by sandwiching the work with a cooling plate. A laminating section, the laminating section is a chamber formed of a box surrounding a transfer path of the work by the transfer device section, and a hot air supply device that sends hot air into the chamber to make the inside of the chamber a high temperature atmosphere. A pressurizing section for pressurizing the work heated while passing through the chamber. 4. A plurality of pressurizing portions supported at opposite positions via the transport path so as to be rotatable about an axis orthogonal to the transport path and spaced apart along the transport path. 4. The resin sheet according to claim 3, wherein a distance between the rollers at opposing positions is gradually reduced toward a front side in a direction in which the workpiece is transported by the transport unit. 5. Manufacturing equipment.