KR200389581Y1 - Tack boinding apparatus using ultrasonic waves for manufacturing ic card - Google Patents

Abstract

The present invention places a plurality of films stacked on the chip sheet in the correct position, and then temporarily attaches a plurality of films with ultrasonic waves without any significant damage to the film surface to precisely manufacture and simplify the card manufacturing process. It relates to a temporary adhesive device for manufacturing.

The present invention is a welding device for welding a plurality of films laminated on the chip sheet, the film supply unit for supplying a coating film through a roll installed on the frame, and the film supply unit is installed on one side, the supplied coating film After cutting by using the cutting means and the film combination means for transporting on the working plate using the film holding means, and the plurality of films installed on the transport film and the coating film is installed on the rear side of the film combination It is configured to include an ultrasonic welding part to be temporarily bonded with ultrasonic waves and a film discharge part which is installed at the rear side of the ultrasonic welding part to discharge a plurality of films welded by ultrasonic waves for the next process.

Description

Tack BOINDING APPARATUS USING ULTRASONIC WAVES FOR MANUFACTURING IC CARD}

The present invention relates to a temporary adhesive apparatus for card manufacturing, and more particularly, by placing a plurality of films stacked on a chip sheet in an accurate position, and temporarily attaching a plurality of films with ultrasonic waves without any significant damage to the film surface. The present invention relates to an apparatus for temporarily attaching and manufacturing a card using ultrasonic waves for precisely simplifying and simplifying a card manufacturing process.

In general, an IC card incorporating a semiconductor memory chip (IC chip) recording predetermined data is used for various purposes such as a credit card, a telephone card, or a transportation card, and its application area is gradually expanded. It's happening. Techniques for manufacturing such IC cards have been proposed in various methods and devices, including Korean Patent Publication No. 2000-0013497.

In order to fabricate an IC card, first, as shown in FIGS. 1A and 1B, a board on which an IC chip is attached (COB, Chip On Board) 12 on a chip sheet 11 having a plurality of loop coils arranged in a matrix. After mounting, the contacts of the boards 12 and the terminals of the loop coil are bonded.

Thereafter, a plurality of films 13, 14, and 15 respectively corresponding to both surfaces of the chip sheet 11 are laminated by thermocompression bonding, and then cut into a predetermined size according to the standard of the card 10. Here, the plurality of films 13, 14, and 15 may be printed film 14 printed such that the serial number or expiration date of the card 10 or the card type and the manufacturer are identifiable, the print film 14, and the like. The translucent protective layer 13 interposed between the chip sheets 11 and the transparent coating film 15 forming the outer surface can be classified into.

By the way, in the technique of manufacturing the IC card 10, it is important to stack the plurality of films 13, 14, 15 on the both sides of the chip sheet 11 so as to correspond precisely, and conventionally, these chip sheets 11 ) And films 13, 14, and 15 are performed manually by hand at the table-type work object, and the inconvenience of work as well as the inaccuracy of accuracy are reduced. Since the films 13, 14, and 15 are separated or separated from the corresponding positions of the chip sheets 11 by the pressing force of the rollers, etc., there is a problem that a large amount of defective products are produced during card manufacturing.

In addition, in order to improve the above problems, the plurality of films (13, 14, 15) laminated on the chip sheet 11 by using a heating heater to heat-welded the film before the card manufacturing film completely compressed to make the finished product. Later, a device or method of manufacturing the finished product was derived.

However, in the welding apparatus using the heating heater as described above, the films 13, 14, and 15 are separated or separated from the corresponding positions of the chip sheets 11 by the pressing force of the outer roller or the like in the process of laminating the films. Although it can be improved, it is easy to deform each film because it is welded by a immersion heater using heat, and it takes a long time for the films to be fused, and foreign matter occurs on the film surface, making it difficult to maintain the plane. There was this.

In order to solve the above problems, the present invention provides a film supply unit for supplying a film, a film combination unit for cutting and transporting the transported film and then loading the film together with a plurality of other films, and a plurality of stacked films It consists of an ultrasonic welding part for temporarily attaching them to the ultrasonic wave, and a film discharge part for discharging the films that are ultrasonically welded, so that a plurality of films stacked on the chip sheet are placed in the correct position, and then smoothly without ultrasonic damage to the film surface. It is an object of the present invention to provide a card manufacturing temporary adhesive apparatus using ultrasonic waves to reduce the defect rate of the product when manufacturing a card to improve the productivity by temporarily bonding a plurality of films.

In order to achieve the above object, the card manufacturing temporary adhesive apparatus using ultrasonic waves according to the present invention is a welding apparatus for welding a plurality of films laminated on the chip sheet, the coating film through a roll installed on the frame A film combination unit for supplying, and a film combination unit installed at one side of the film supply unit and cutting the supplied coating film using a cutting unit and then transferring the film to a work plate using a film holding unit, and the film combination unit. An ultrasonic welding part installed at the rear side to temporarily attach and glue the plurality of films stacked on the coated film and the coating film, and a plurality of films installed at the rear side of the ultrasonic welding part to be welded with ultrasonic waves for the next process. It comprises a film discharge unit for discharging.

Hereinafter, with reference to the accompanying drawings there may be a plurality of embodiments as an example of the card manufacturing temporary adhesive apparatus using ultrasonic waves according to the present invention, the following describes the most preferred embodiment.

Figure 2 is a perspective view showing the configuration of the card production temporary adhesive device using the ultrasonic wave according to the present invention, Figure 3 is a perspective view showing the film supply unit in the card production temporary adhesive apparatus using the ultrasonic wave according to the present invention, 4 is a perspective view showing a film combination in the card production temporary adhesive device using the ultrasonic wave according to the present invention, Figure 5 is a perspective view showing the ultrasonic welding portion in the card production temporary adhesive device using the ultrasonic wave according to the present invention, Figure 6 is a perspective view showing a film ejection unit in the card production temporary adhesive apparatus using the ultrasonic wave according to the present invention, Figures 7a and 7b is a film combination in the card production temporary adhesive apparatus using the ultrasonic wave according to the present invention. 7C and 7D are a left side view and a right side view showing a film combination unit in a card manufacturing temporary adhesion device using ultrasonic waves according to the present invention. 8A and 8B are a plan view and a front view showing a film holding part in the card manufacturing temporary adhesion device using ultrasonic waves according to the present invention, and FIGS. 9A and 9B are the card manufacturing temporary adhesion using ultrasonic waves according to the present invention. 10A and 10B are plan and front views illustrating a film discharge part in the card manufacturing temporary adhesion device using ultrasonic waves according to the present invention.

As shown in Figure 2 to 10, the temporary carding apparatus using the ultrasonic wave according to the present invention, once largely divided, the film supply unit for supplying the coating film 150 through the roll installed on the frame ( 100 and the film combination unit 200 which is installed at one side of the film supply unit 100 and cuts the supplied coating film 150 using cutting means and then transfers onto the work plate using film holding means. And an ultrasonic welding unit 300 and the ultrasonic welding unit installed at the rear side of the film combination unit 200 to temporarily attach and glue the plurality of films stacked on the transferred coating film 150 and the coating film. Installed at the rear side of the 300 is composed of a film discharge unit 400 for discharging a plurality of ultrasonically welded film for the next process.

As shown in Figure 3, the film supply unit 100 is a rectangular parallelepiped film supply frame 110 is installed, the upper side of the film supply frame 110 is rotatable film supply shaft 130 is installed in the center in the longitudinal direction And, the film supply roll 120 for supplying the film while rotating in conjunction with the shaft is installed on the center outer side of the film supply shaft 130.

One side of the film supply roll 120 and the lower side of the film supply shaft 130 is provided with a film supply motor 140 for gear coupling with the film supply shaft 130 to rotate the film supply roll 120. Here, a large amount of coating film 150 is wound on the outside of the film supply roll 130.

4 and 7a to 7d, the film combination unit 200 is provided with a film combination frame 210 installed on one side of the film supply frame 110, the upper side of one side of the film combination frame 210 The upper and lower rolls 251 and 252 are installed to transfer the coating film 150 supplied from the film supply unit 100 to a position to be cut.

The lower end of the lower roll 252 is coupled to the lower roll 252 and the roll belt 254, the roll rotation motor 253 for rotating the lower roll 252 is installed, the upper and lower rolls (251, 252) At the top of the upper roll 251 is moved up and down, and the roll transfer cylinder 250 for adjusting the interval between the upper roll 251 and the lower roll 252 is installed.

A cutting cylinder 260 is installed at a rear side of the roll transfer cylinder 250, and a cutting block 261 is attached to a lower side of the cutting cylinder 260, and the upper and lower ends of the cutting block 261 are provided. The cutting knife 262 for cutting the coating film 150 transferred by the rolls 251 and 252 to a predetermined length is fastened by bolts.

In addition, the left and right movable cylinder 272 is installed at one end of the cutting cylinder 260, one side of the left and right movable cylinder 272 is coupled to the primary foldable cylinder 271, the primary foldable cylinder 271 The lower side of the) is provided with a first temporary sticking rods 270 for first welding a plurality of films one by one.

The first LM guide 230 is installed in the center of the film combination frame 210, the first film holding part for holding and transporting the cut coating film 150 while linearly moving on the first LM guide 230 240 is mounted, and a first guide motor 231 coupled to the transfer belt 232 is installed at one side of the first LM guide 230.

On the upper end of the film combination frame 210 is transferred to the first film holding part 240, the film combination plate 220 is stacked and stacked by stacking a plurality of films.

Transfer film 221 is formed on both sides of the center of the film combination plate 220 in the longitudinal direction, and the upper side of the film combination plate 220 is a reference to prevent the transported coating film 150 is out of the work table A plurality of projections 222 are formed to hold.

In addition, a plurality of vacuum adsorption holes 223 are formed on one side upper end of the film combination plate 220 to suck and fix the transferred coating film 150 on a plate by vacuum.

As shown in FIGS. 8A and 8B, the first film holding part 240 is equipped with a lower holding block 242 which is movable up and down while moving longitudinally on the first L guide 230. Holding cylinders 241 for operating the lower holding block 242 up and down are installed at both sides of the lower holding block 242.

In addition, a rotary cylinder 243 is installed at the upper end of the lower holding block 242, and a rotating shaft 244 geared and driven by the rotary cylinder 243 is provided at one side of the rotary cylinder 243.

In addition, on both sides of the rotating shaft 244, when the coating film 150 is seated on the lower holding block 242, it is rotated by the rotating shaft 244 and passes through the transfer hole 221 formed on the film combination plate 220. The upper holding member 245 is attached to hold while holding the coating film 150 from above.

As shown in FIGS. 5 and 9A and 9B, an ultrasonic temporary frame 310 is installed at the rear side of the film combining frame 210, and the ultrasonic temporary frame 310 is disposed on the ultrasonic temporary frame 300. The inside of the center and the ultrasonic welding plate 311 is installed on the horizontal line and the film combination plate 220 and the horizontal line, the ultrasonic welding plate 311 is transferred to both sides of the center in the longitudinal direction as the film combination plate 220. The hole 221 is formed.

On the upper side of the ultrasonic temporary plate 311 is provided a plurality of ultrasonic temporary sticking rods 330 to weld the coating film 150 and the plurality of films again transferred from the film combination unit 200, each of the ultrasonic temporary The rear side of the folding bar 330 is provided with an ultrasonic temporary cylinder 320 for moving the temporary bar up and down.

A second L guide 340 is installed at the center of the lower side of the ultrasonic temporary plate 311, and is linearly moved on the second LG guide 340 through a transfer hole 221 formed on the ultrasonic temporary plate 311. The coating film 150 and the second film holding part 360 for holding a plurality of films are mounted.

Here, the detailed configuration and function of the second film holding part 360 is the same as the first film holding part 240 and will not be described in detail.

On the other hand, the second guide motor 350 is connected to the second film holding part 360 and the conveyance belt 232 to one side of the second LM guide 340 to transfer the second film holding part 360 Is installed.

6 and 10a and 10b, the film discharge unit 400, the discharge frame 410 is installed, the third LM guide 420 is installed on the inner upper portion of the discharge frame 410, A third film holding part 440 is mounted on the third LM guide to hold the films transferred from the ultrasonic welding part 300 and move them to the discharge passage while linearly moving.

The detailed configuration and function of the third film holding part 440 is the same as the first film holding part 240 and thus will not be described in detail.

One side of the third LM guide 420 is connected to the third film holding part 440 and the conveying belt 232 is provided with a third guide motor 430 for transferring the third film holding part 440. .

In addition, a discharge motor 450 for transmitting power is installed at an upper end of the discharge frame 410, and a plurality of discharge lead screws 460 connected to the discharge motor 450 and a belt at a square corner of the discharge frame 410. Are installed respectively.

On the outside of each of the discharge lead screw 460 is discharge discharge plate 470 which is discharged out of the stacked temporary film while being moved up and down by the drive of the discharge motor 450 is laid.

A wheel 471 is attached to the lower side of the discharge transfer plate 470 to easily and conveniently discharge the stacked temporary films.

Looking in detail the operation process of the card-making temporary adhesive device using the ultrasonic wave according to the present invention having the configuration as described above.

As shown in Figure 1 and 3, in the temporary carding apparatus using the ultrasonic card according to the present invention, first, the film supply motor 140 provided in the film supply unit 100 is driven to drive the film supply shaft 130 Is rotated, the film feed roll 120 is rotated in conjunction with the rotation of the film supply shaft 130 is provided with a large amount of coating film 150 wound on the film supply roll 120 in the film combination unit 200 The upper and lower rolls 251 and 252 are transferred.

Then, as shown in Figure 7b and 7d, the upper roll 251 is in close contact with the lower roll 252 by the roll transfer cylinder 250, the coating film 150 is supplied from the film supply roll 120 The lower roll 252 and the upper roll 251 are rotated in conjunction with each other by a roll rotation motor 253 located below the lower roll 252 to rotate the coating film 150 to the next position. Transferred.

Then, the cutting knife 262 coupled to the cutting block 261 by the operation of the cutting cylinder 260 is lowered vertically to cut the conveyed coating film 150 to a predetermined length and then rotated back to the original position. .

Subsequently, as shown in FIGS. 7A to 8B, the lower holding block 242 under the film combination plate 220 is held by the holding cylinder 241 provided in the first film holding part 240. Passing through the transfer hole 221 shown in the film combination plate 220 to support the coating film 150, the rotating shaft 244 by the rotating cylinder 243 is rotated by the film combination plate 220 The upper holding member 245 which is under the pass through the transfer hole 221 and is fixed by pressing the coating film 150 placed on the lower holding block 242.

Then, the first film holding part 240 holding the coating film 150 cut by the driving of the first guide motor 231 is a side of the film combination part 200 riding on the first L guide 230. Is transferred to.

After the coating film 150 is transferred to the protrusion 222 formed on one side of the film combination unit 200, the coating film 150 is fixed to be adsorbed so as not to move through the vacuum suction hole 223, Various carding films of the kind are placed on the coating film 150.

At this time, while placing each of the various types of film each one by applying heat only enough so that the layer laminated to the first temporary sticking rods 270 does not fall, the first is temporarily welded.

Then, as shown in FIGS. 9A and 9B, the second film holding part 360 operates the first film holding part 240 by driving the second guide motor 350 provided in the ultrasonic temporary welding part 300. In the same manner as described above, the laminated films are held and transferred onto the ultrasonic temporary plate 311 by the second LM guide 340.

 After transferring the laminated films, the ultrasonic temporary rod 330 is lowered by the ultrasonic temporary cylinder 320 installed in the ultrasonic temporary frame 310 to ultrasonically stack a plurality of laminated films placed on the ultrasonic temporary plate 311. Once again, do temporary adhesion without damaging the surface of the film once again.

Subsequently, as shown in FIGS. 10A and 10B, the third film holding part 440 is driven by the third guide motor 430 installed in the discharge frame 410 to hold the films temporarily bonded by ultrasonic waves as described above. After transporting the third L-M guide 420, it is laminated on the discharge transfer plate (470).

In this case, the third film holding part 440 is installed to be opposite to the first and second film holding parts 240 and 360 so that the upper holding member 245 rotates from the top to the bottom of the welded film under the lower holding block 242. Will hold them.

Finally, as the discharge lead screw 460 is operated by the discharge motor 450 provided in the film discharge unit 400, the discharge transfer plate 470 in which the plurality of films stacked with ultrasonic waves are stacked is transferred to the next workshop. do.

Card production temporary adhesive device using an ultrasonic wave according to the present invention having the configuration and operation process as described above is a film supply unit for supplying a film, cut and transported the transported film and loaded with a plurality of other films on the work object And a film combination unit for ultrasonically attaching a plurality of loaded films with ultrasonic waves, and a film ejection unit for discharging the ultrasonically welded films, thereby placing a plurality of films stacked on a chip sheet in an accurate position. After the film is temporarily attached to the film surface without any significant damage on the film surface, the film is not easily separated at the time of lamination. It is effective to increase.

1A and 1B are a perspective view and a separated cross-sectional view of a typical IC card;

Figure 2 is a perspective view showing the configuration of the card manufacturing temporary adhesive device using the ultrasonic wave according to the present invention;

Figure 3 is a perspective view showing a film supply unit in the card production temporary adhesive apparatus using ultrasonic waves according to the present invention;

Figure 4 is a perspective view showing a film combination unit in the card production temporary adhesive apparatus using the ultrasonic wave according to the present invention;

Figure 5 is a perspective view of the ultrasonic welding portion in the carding temporary adhesive device using the ultrasonic wave according to the present invention;

Figure 6 is a perspective view showing a film discharge unit in the carding operation adhesive device using the ultrasonic wave according to the present invention;

7a and 7b is a plan view and a front view showing a film combination in the card production temporary adhesive apparatus using ultrasonic waves according to the present invention;

Figure 7c and Figure 7d is a left side and right side view showing the film combination in the card production temporary adhesive apparatus using ultrasonic waves according to the present invention;

8a and 8b is a plan view and a front view showing a film holding part in the carding operation adhesive device using ultrasonic waves according to the present invention;

9a and 9b is a plan view and a front view showing the ultrasonic weldable portion in the card production temporary adhesive device using the ultrasonic wave according to the present invention;

10a and 10b is a plan view and a front view showing a film discharge unit in the carding operation adhesive apparatus using ultrasonic waves according to the present invention;

<Explanation of symbols for main parts of drawing>

100: film supply unit 110: film supply frame

120: film feed roll 130: film feed shaft

140: film supply motor 200: film combination unit

210: film combination frame 220: film combination plate

230: first LM guide 231: first guide motor

240: first film holding part 241: holding cylinder

242: lower holding block 243: rotary cylinder

244: rotating shaft 245: upper holding member

251: upper roll 252: lower roll

253: roll rotation motor 260: cutting cylinder

262: cutting knife 270: primary temporary stick

300: ultrasonic welding portion 310: ultrasonic welding frame

311: ultrasonic temporary plate 320: ultrasonic temporary cylinder

330: ultrasonic temporary stick 340: the second LM guide

350: second guide motor 360: second film holding part

400: film discharge unit 410: discharge frame

420: third LM guide 430: third guide motor

440: third film holding unit 450: discharge motor

460: discharge lead screw 470: discharge transfer plate

Claims (11)

In the welding device for welding a plurality of films laminated on the chip sheet, A film supply unit 100 supplying the coating film 150 through a roll installed on the frame; A film combination unit 200 installed at one side of the film supply unit 100 and cutting the supplied coating film 150 using cutting means and then transporting the coated film 150 onto a working plate using film holding means; An ultrasonic welding part 300 installed at the rear side of the film combination part 200 and temporarily attaching the plurality of films laminated on the transferred coating film 150 and the coating film by ultrasonic waves; The card-adjustable adhesion device using ultrasonic waves, characterized in that it comprises a film discharge unit 400 is installed on the rear side of the ultrasonic welding portion 300 to discharge a plurality of films welded by ultrasonic waves for the next process. The method of claim 1, The film supply unit 100 is coupled to the film supply frame 110 and the center outside of the film supply shaft 130 is installed on the upper side of the film supply frame 110, the film supply to rotate and interlock with the shaft to supply the film Ultrasonics characterized in that it further comprises a roll 120, the film supply motor 140 is coupled to the film supply shaft 130 on one side of the film supply roll 120 to transfer power to the shaft Card production temporary adhesive device used. The method of claim 1, The film combination unit 200 is installed on the film combination frame 210 and one side of the film combination frame 210 to transfer the coating film 150 supplied from the film supply unit 100 to a position to cut. Upper and lower rolls 251 and 252, a roll rotating motor 253 installed on the lower end of the lower roll 252 to rotate the lower roll 252, and installed on the upper and lower rolls 251 and 252. And a roll transfer cylinder 250 for moving the upper roll 251 up and down and adjusting a gap between the upper roll 251 and the lower roll 252, and a cutting cylinder installed at a rear side of the roll transfer cylinder 250. 260, a cutting knife 262 provided at the lower side of the cutting cylinder 260 to cut the coating film 150 to a predetermined length, and installed at one side of the cutting cylinder 260, and a plurality of films one by one. The first temporary rod 270 to be welded to the primary and the first L guide 230 is installed in the center of the film combination frame 210. In addition, the first film holding part 240 for holding and conveying the coating film 150 cut while linearly moving on the first LM guide 230, and the transfer belt 232 to one side of the first LM guide 230; Card-acting temporary adhesion device using ultrasonic waves, characterized in that further comprises a first guide motor 231 is coupled. The method of claim 3, Ultrasonics, characterized in that the film combination plate 220 is installed on the top of the film combination frame 210 to transfer the coating film 150 to the first film holding part 240, and then stacked a plurality of films stacked. Card production temporary adhesive using. The method of claim 4, wherein The film combination plate 220 has a plurality of projections 222 are formed in the longitudinal direction the transfer hole 221 is formed on both sides of the center, the reference film to prevent the coating film 150 transferred to the upper one side from leaving the workbench. Card-acting temporary adhesion device using ultrasonic waves, characterized in that formed. The method according to claim 4 or 5, On one side upper end of the film combination plate 220, a plurality of vacuum adsorption holes 223 for adsorbing and fixing the transported coating film 150 on a plate by vacuum, characterized in that the carding action using ultrasonic waves Gluing device. The method of claim 3, The first film holding part 240 is provided on both sides of the lower holding block 242 and the lower holding block 242 which can be moved up and down while moving longitudinally on the first L guide 230. The holding cylinder 241 for operating the holding block 242 up and down, the rotary cylinder 243 is installed on the top of the center of the lower holding block 242, and is coupled to one side of the rotating cylinder 243 The rotating shaft 244 is coupled to both sides of the rotating shaft 244 and the coating film 150 is seated on the lower holding block 242 is rotated by the rotating shaft 244 on the film combination plate 220 The card-actuated adhesive apparatus using ultrasonic waves, characterized in that it further comprises an upper holding member 245 for holding while pressing the coating film 150 through the formed transfer hole 221. The method of claim 1, The ultrasonic temporary contact 300 is an ultrasonic temporary frame 310, the ultrasonic temporary frame 310 and the ultrasonic temporary plate 311 installed on the horizontal line and the film combination plate 220 in the center of the ultrasonic temporary frame 310, the ultrasonic welding A plurality of ultrasonic temporary rods 330 installed at the upper side of the plate 311 to weld the coating film 150 and the plurality of films, which are transferred from the film combination unit 200, and the respective ultrasonic temporary rods 330. Ultrasonic temporary cylinder 320 to be installed at the rear side to move the temporary stick up and down, the second L guide 340 is installed in the lower center of the ultrasonic temporary plate 311, and the second L guide 340 The second film holding part 360 and the second film holding part 360 for holding the coating film 150 and the plurality of films through the transfer hole 221 formed on the ultrasonic temporary plate 311 while moving on) ) And the transfer belt 232 and the second EL De the second guide device for the adhesive card produced using ultrasonic waves, characterized in that is configured to further include a motor 350 that is installed on one side of the 340 feeding the second film holding portion (360). The method of claim 1, The film discharge unit 400 may include an emission frame 410, a third L guide 420 installed on an inner upper portion of the discharge frame 410, and the ultrasonic welding unit 300 while moving on the third L guide. The third film holding part 440 for holding the films transferred from the above to move to the discharge passage, and is connected to the third film holding part 440 and the conveying belt 232 and of the third LGM guide 4200 It is installed on one side of the card manufacturing temporary adhesive device using ultrasonic, characterized in that it further comprises a third guide motor 430 for transferring the third film holding part 440. The method according to claim 1 or 9, The film discharge unit 400 is installed at the upper end of the discharge frame 410, the discharge motor 450 for transmitting power, and installed in the square corner of the discharge frame 410, respectively, to the discharge motor 450 and the belt A plurality of discharge lead screws 460 connected to each other and coupled to the outside of each of the discharge lead screws 460 are discharged to the outside of the stacked temporary films while being moved up and down by driving the discharge motor 450. Card-acting temporary adhesion device using ultrasonic waves, characterized in that further comprises a transfer plate (470). The method of claim 10, The discharge transfer plate 470 is a card-adjustable adhesive device using ultrasonic, characterized in that it further comprises a plurality of wheels (471) at the bottom to easily and conveniently discharge the laminated temporary film out.