JPH1131883A - Manufacture of multilayered wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To firmly electrically connect wiring conductors to thin-film wiring conductors and thin-film wiring conductor layers to each other, by forming an organic resin insulating layer having through holes by exposing a photosensitive organic resin precursor applied to the surface of the organic resin insulating layer, and then, developing the precursor. SOLUTION: After an organic resin insulating layer 2a and thin-film wiring conductor layers 3a are successively formed on the upper surface of a substrate 1, another organic resin insulating layer 2b having through holes 8b is formed on the surface of the insulating layer 2a including the conductor layers 3a. Then, an acid catalyst photosensitive resin precursor is applied to the upper surface of the insulating layer 2b. The resin precursor in the other area than the areas where the conductor layers 3a are applied, and in the areas where the layers 3a are applied, are successively and respectively subjected to first and second exposure. After exposure, the precursor is developed. Thereafter, thin-film conductor layers 3b are formed on the upper surface of the insulating layer 2b and, at the same time, through hole conductors 9b are formed on the internal surfaces of the through holes 8b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer wiring board, and more particularly to a multilayer wiring board used for a hybrid integrated circuit device, a semiconductor element housing package for housing a semiconductor element, and the like.

[0002]

2. Description of the Related Art Conventionally, a multilayer wiring board used for a hybrid integrated circuit device, a package for accommodating a semiconductor element, or the like, has its wiring conductor formed by a thick film forming technique such as the Mo-Mn method.

[0003] This Mo-Mn method is generally used for tungsten,
Organic solvents for high melting point metal powders such as molybdenum and manganese,
A solvent is added and mixed, and a paste-shaped metal paste is printed and applied on the outer surface of the green ceramic body in a predetermined pattern by a screen printing method. Then, a plurality of these are laminated and fired in a reducing atmosphere to obtain a high melting point. This is a method of sintering and integrating a metal powder and a green ceramic body.

The ceramic body on which the wiring conductor is formed is usually an oxide ceramic such as an aluminum oxide sintered body or a mullite sintered body, or an aluminum nitride having an oxide film deposited on the surface. Non-oxide ceramics such as a porous sintered body and a silicon carbide sintered body are used.

However, when the wiring conductor is formed by using the Mo-Mn method, the wiring conductor is formed by screen-printing a metal paste. Had the drawback that it could not be done.

In order to solve the above-mentioned drawbacks, a multi-layer wiring board formed using a thin film forming technique capable of miniaturization instead of forming the wiring conductor by the conventional thick film forming technique is used. It has become.

[0007] A multilayer wiring board in which such wiring conductors are formed by a thin film forming technique is generally made of a glass epoxy resin formed by impregnating a ceramic cloth made of aluminum oxide sintered body or the like or a glass cloth woven with glass fibers with an epoxy resin. And an organic resin insulating layer having a predetermined pattern formed of a photosensitive epoxy resin or the like which is formed on the upper surface of the substrate by spin coating, exposure processing, development processing, and the like, and copper or aluminum. And other thin film wiring conductor layers formed by adopting thin film forming technology such as electroless plating or vapor deposition and photolithography technology, and alternately stacking thin film wiring conductors located above and below The layers are electrically connected via the through-hole conductors attached to the inner walls of the through-holes provided in the organic resin insulation layer. And a bonding pad electrically connected to the thin-film wiring conductor layer is formed on the upper surface of the uppermost organic resin insulating layer, and an active component such as a semiconductor element is formed on the bonding pad. The electrodes of passive components such as capacitors, capacitors, and resistors are connected via solder.

[0008]

However, in the above-mentioned multilayer wiring board, the organic resin insulating layer of the multilayer wiring portion applied on the substrate is exposed to the organic resin precursor applied by spin coating. An organic resin precursor that is formed by performing a development process and that is coated with an organic resin precursor to form a next organic resin insulating layer on an organic resin insulating layer having a thin film wiring conductor layer on the upper surface; The precursor is thin in the region where the thin film wiring conductor layer is present, and the other region is thick, causing a difference in thickness, and when this is subjected to exposure treatment, the organic resin precursor in the thin region is completely cured. However, in a thick region, the curing is incomplete and the organic resin insulating layer cannot be reliably formed. As a result, the bonding strength between the organic resin insulating layers stacked vertically is greatly reduced, and Reliability of the wiring board had a disadvantage of low.

Similarly, when a wiring conductor is formed on the upper surface of the substrate, an organic resin precursor is applied to the substrate by spin coating, and the organic resin precursor is exposed and developed. When forming an organic resin insulating layer, the thickness of the region where the wiring conductor is present in the applied organic resin precursor is thin, and the other regions are thicker, resulting in a difference in thickness. Although the organic resin precursor in the thin region is completely cured, the curing in the thick region is incomplete and the organic resin insulating layer cannot be reliably formed. It cannot be firmly joined to the formed substrate, and has the disadvantage that the reliability as a multilayer wiring substrate is reduced.

In order to solve the above-mentioned drawback, it is conceivable to irradiate the organic resin precursor with excessive light so that both the thick and thin regions of the organic resin precursor are photocured simultaneously. However, when the organic resin precursor is irradiated with excessive light, the light wraps around, which causes a drawback that the organic resin insulating layer cannot be formed in a predetermined pattern shape. In particular, it is impossible to clearly form a through hole at a predetermined position of the organic resin insulating layer, and the organic resin insulating layer is located vertically above and below the organic resin insulating layer via a through hole conductor attached to the inner wall of the through hole. The thin-film wiring conductor layers, or the wiring conductor provided on the upper surface of the substrate and the thin-film wiring conductor layer cannot be reliably and firmly electrically connected.

The present invention has been devised in view of the above-mentioned drawbacks, and has as its object the purpose of forming an organic resin insulating layer having a predetermined pattern by appropriately curing the organic resin precursor over substantially the entirety thereof. The bonding strength between the resin insulating layers and the organic resin insulating layers stacked vertically is strong, and the through-hole conductors are used between the wiring conductor provided on the substrate and the thin-film wiring conductor and between the thin-film wiring conductor layers located above and below. It is an object of the present invention to provide a method for manufacturing a highly reliable multilayer wiring board capable of reliably and firmly making an electrical connection.

[0012]

According to the method of manufacturing a multilayer wiring board of the present invention, a substrate and an organic resin insulating layer and a thin-film wiring conductor layer formed on the substrate are alternately laminated and positioned vertically. A multilayer wiring board comprising a thin-film wiring conductor layer electrically connected via a through-hole conductor provided in an organic resin insulating layer, wherein the multilayer wiring section is formed of the following (a) to (e). ) Is formed.

(A) a step of applying a photosensitive organic resin precursor on the upper surface of a substrate and subjecting the precursor to an exposure treatment and a development treatment to thereby deposit an organic resin insulation layer; and (b) the organic resin insulation layer. Copper, nickel, gold,
Depositing a metal film made of at least one kind of aluminum and processing the metal film into a predetermined pattern by photolithography to form a thin-film wiring conductor layer; and (c) forming a thin-film wiring conductor layer on the upper surface. A photosensitive organic resin precursor is applied on the organic resin insulating layer thus formed, and the first exposure process is performed except for the organic resin precursor applied to a region where the thin film wiring conductor layer is disposed. And then subjecting the entire organic resin precursor to a second exposure treatment, followed by a development treatment to form an organic resin insulating layer having a through hole, and (d) an organic resin having the through hole. A metal film made of at least one of copper, nickel, gold and aluminum is deposited on the upper surface of the resin insulating layer and in the through hole by a thin film forming technique, and the metal film is formed. Forming a thin-film wiring conductor layer that is partly electrically connected to a thin-film wiring conductor layer located below through a through hole by processing into a predetermined pattern by a photolithography technique; ) And (d) are alternately repeated.

Further, the method for manufacturing a multilayer wiring board according to the present invention comprises:
A substrate having a wiring conductor on the upper surface, formed on the substrate,
The organic resin insulating layer and the thin-film wiring conductor layer are alternately laminated, and the upper and lower thin-film wiring conductor layers are electrically connected through through-hole conductors provided in the organic resin insulating layer. Wherein the multilayer wiring portion is formed by the following steps (a) to (e).

(A) A photosensitive organic resin precursor is applied on a substrate having a wiring conductor formed on the upper surface, and the organic resin precursor is applied to a region where the wiring conductor is disposed. Exposing a first exposure treatment, and then applying a second exposure treatment to the whole of the organic resin precursor, and then performing a development treatment to form an organic resin insulation layer having a through hole; (B) A metal film made of at least one of copper, nickel, gold and aluminum is deposited on the upper surface of the organic resin insulating layer having the through hole and in the through hole by a thin film forming technique, and the metal film is formed by a photolithography technique. (C) forming a thin-film wiring conductor layer that is partly electrically connected to a wiring conductor located below through a through-hole through a predetermined pattern. A photosensitive organic resin precursor is applied on the organic resin insulating layer having the thin-film wiring conductor layer formed on the upper surface, and the organic resin precursor applied to the region where the thin-film wiring conductor layer is disposed is used. Excluding a first exposure treatment, then a second exposure treatment on the whole of the organic resin precursor, and then a development treatment to form an organic resin insulating layer having a through hole; (d) A) depositing a metal film made of at least one of copper, nickel, gold, and aluminum on the upper surface of the organic resin insulating layer having the through hole and in the through hole by a thin film forming technique, and applying the metal film to a predetermined position by a photolithography technique; (E) forming a thin-film wiring conductor layer that is partly electrically connected to a thin-film wiring conductor layer located below via a through hole by processing into a pattern; Step of repeating serial steps (c) and (d) alternately. According to the method for manufacturing a multilayer wiring board of the present invention, a small amount of light is irradiated on the thin organic resin precursor applied to the region where the thin film wiring conductor layer is present, By irradiating a large amount of light to the resin precursor, the entire organic resin precursor is appropriately photo-cured, thereby increasing the bonding strength between the organic resin insulating layers stacked vertically.
At the same time, the organic resin insulating layer can be sharply formed in a predetermined pattern shape, and the through hole can be formed extremely sharply at a predetermined position, and through the through hole conductor attached to the inner wall of the through hole. The thin-film wiring conductor layers located above and below the organic resin insulating layer can be reliably and firmly electrically connected.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment of a multilayer wiring board manufactured by the manufacturing method of the present invention, wherein 1 is a board, 2
a, 2b, 2c, 2d are organic resin insulating layers, 3a, 3b,
3c and 3d are thin film wiring conductor layers.

The substrate 1 has an organic resin insulating layer 2 on its upper surface.
a, 2b, 2c, 2d and the thin film wiring conductor layers 3a, 3b, 3
A multi-layer wiring section 4 composed of c and 3d is formed, and functions as a support member for supporting the multi-layer wiring section 4.

The substrate 1 is made of an oxide ceramic such as an aluminum oxide sintered body or a mullite sintered body, or a non-oxide ceramic such as an aluminum nitride sintered body or a silicon carbide sintered body having an oxide film on its surface. Oxide ceramics, and further made of an electrically insulating material such as glass epoxy resin impregnated with epoxy resin in a cloth woven with glass fiber, for example, when formed of aluminum oxide sintered body , Alumina, silica, calcia, magnesia, etc., an appropriate organic solvent and a solvent are added and mixed to form a slurry, which is then formed into a ceramic green sheet by using a conventionally known doctor blade method or calendar roll method. Ceramic green sheet), and after that, the ceramic green sheet is subjected to an appropriate punching process to obtain a predetermined shape. Hot together form (about 1600
C) or by mixing a raw material powder such as alumina with an appropriate organic solvent and solvent to adjust the raw material powder and form the raw material powder into a predetermined shape by a press molding machine. If the body is made by firing the body at a temperature of about 1600 ° C. and is made of glass epoxy resin, for example, a cloth woven with glass fiber is impregnated with the epoxy resin precursor and the epoxy resin precursor is heated to a predetermined temperature. It is manufactured by heat curing.

The substrate 1 has organic resin insulating layers 2a, 2b, 2c, 2d and thin film wiring conductor layers 3a, 3a, 3d on its upper surface.
b, 3c, 3d are alternately arranged in a multilayer structure, and a multilayer wiring portion 4 is formed, and the organic resin insulating layers 2a, 2b, 2c, 2d constituting the multilayer wiring portion 4 are vertically Function of electrically insulating the thin film wiring conductor layers 3a, 3b, 3c and 3d located at
b, 3c and 3d function as transmission paths for transmitting electric signals.

The organic resin insulating layer 2a of the multilayer wiring section 4
2b, 2c, and 2d are made of, for example, a photosensitive epoxy resin, and are formed by irradiating a predetermined light to a photosensitive organic resin precursor to cure the photosensitive resin.

Further, the organic resin insulating layer 2 of the multilayer wiring section 4
b, 2c, and 2d have through holes 8b, 8c, and 8d each having a minimum diameter of about 1.5 times the thickness of the organic resin insulating layers 2b, 2c, and 2d at predetermined positions thereof.
The through holes 8b, 8c, 8d are provided with through hole conductors 9b for electrically connecting the thin film wiring conductors 3a, 3b, 3c, 3d located above and below via organic resin insulating layers 2b, 2c, 2d to be described later. , 9c, 9d.

Each of the organic resin insulating layers 2a, 2b, 2c,
On the upper surface of 2d, thin-film wiring conductor layers 3a, 3
b, 3c, 3d further include each of the organic resin insulating layers 2b, 2c,
On the inner walls of the through holes 8b, 8c, 8d provided in 2d, through hole conductors 9b, 9c, 9d are provided, respectively, and the organic resin insulating layers 2b, 2c, Each of the thin film wiring conductor layers 3a, 3b, 3c, and 3d located above and below the 2d is electrically connected.

Each of the organic resin insulating layers 2a, 2b, 2c,
The thin film wiring conductor layers 3a, 3b, 3c, 3d and the through hole conductors 9b, 9c, 9d provided on the upper surface of 2d and the inner walls of the through holes 8b, 8c, 8d are made of copper, nickel,
The thin film wiring conductor layers 3a, 3b, 3c, and 3d and the through-hole conductors 9b, 9c, and 9d are formed of a metal material such as gold or aluminum by employing a thin film forming technique and a photolithographic technique. , Wiring can be miniaturized, and thereby, the thin film wiring conductor layers 3a, 3b, 3c, 3d can be formed at an extremely high density.

The organic resin insulating layers 2a, 2b, 2
c, 2d and the thin film wiring conductor layers 3a, 3b, 3c, 3d are alternately arranged in multiple layers, and the multilayer wiring portion 4 is formed by centering the upper surface of each of the organic resin insulating layers 2a, 2b, 2c, 2d. If the average roughness (Ra) is 0.05 μm ≦ Ra ≦ 5 μm, a rough surface may be used to join the organic resin insulating layers 2a, 2b, 2c, 2d to the thin film wiring conductor layers 3a, 3b, 3c, 3d and to position them vertically. The bonding between the organic resin insulating layers 2a, 2b, 2c, and 2d can be made strong. Accordingly, the upper surfaces of the respective organic resin insulating layers 2a, 2b, 2c, 2d of the multilayer wiring section 4 are roughened by an etching technique or the like, and the center line average roughness (Ra) is 0.05 μm ≦ Ra ≦ 5 μm. It is preferable to keep the surface.

The organic resin insulating layers 2a, 2b, 2
c and 2d are count values of the height of irregularities (Pc) at a length of 2.5 mm on the surface, where 1 μm ≦ Pc ≦ 10 μm
Is 500 or more and 0.1 μm ≦ Pc ≦ 1 μm is 2500
At least 0.01 μm ≦ Pc ≦ 0.1 μm is 12500
When the number is more than the number, the organic resin insulating layers 2a, 2b, 2c,
2d and the thin film wiring conductor layers 3a, 3b, 3c, 3d and the organic resin insulation layers 2a, 2b, 2c
Bonding between 2d becomes stronger. Accordingly, the count value of the height (Pc) of the unevenness at a length of 2.5 mm on the surface of the organic resin insulating layer 2 is 1 μm ≦ Pc ≦ 10 μm.
m is 500 or more, and 0.1 μm ≦ Pc ≦ 1 μm is 250
0 or more, 0.01 μm ≦ Pc ≦ 0.1 μm is 1250
It is preferable to set the number to zero or more.

The organic resin insulating layers 2a, 2b, 2c, 2
d The center line average roughness (Ra) of the upper surface and the count value of the height of irregularities (Pc) at a length of 2.5 mm are determined by measuring the surfaces of the organic resin insulating layers 2a, 2b, 2c, and 2d with an atomic force microscope ( Dimension 300-Nano S manufactured by Digital Instruments Inc.
(copeIII), scanning was performed at a diagonal of 50 μm square (70 μm) to inspect and measure the surface condition, and respective numerical values were obtained from the measurement results.

The center line average roughness (Ra) is 0.0
5 μm ≦ Ra ≦ 5 μm, the count value of the height of unevenness (Pc) at a length of 2.5 mm is 1 μm ≦ Pc ≦ 10 μm
m is 500 or more, and 0.1 μm ≦ Pc ≦ 1 μm is 250
0 or more, 0.01 μm ≦ Pc ≦ 0.1 μm is 1250
The zero or more organic resin insulating layers 2a, 2b, 2c, 2d
CH is formed on the upper surfaces of the organic resin insulating layers 2a, 2b, 2c and 2d.
The surface is roughened to a predetermined roughness by performing a reactive ion etching process by blowing a gas such as F ₃ , CF ₄ , and Ar.

If the thickness of each of the thin film wiring conductor layers 3a, 3b, 3c and 3d of the multilayer wiring portion 4 is less than 1 μm, the electric resistance of each of the thin film wiring conductor layers 3a, 3b, 3c and 3d is large. Each of the thin film wiring conductor layers 3a, 3b,
It becomes difficult to transmit a predetermined electric signal to 3c and 3d.
b, 3c and 3d are formed of organic resin insulating layers 2a, 2b, 2c and 2
d, the thin film wiring conductor layers 3a, 3b, 3c,
A large stress is present inside 3d, and the large intrinsic stress makes it easy for the thin film wiring conductor layers 3a, 3b, 3c, 3d to be separated from the organic resin insulating layers 2a, 2b, 2c, 2d. Therefore, each thin-film wiring conductor layer 3 of the multilayer wiring portion 4
It is preferable that the thicknesses of a, 3b, 3c, and 3d be in the range of 1 μm to 40 μm.

Thus, according to the above-described multilayer wiring board, the electrodes of the electronic component A such as a semiconductor element and a capacitor are connected to the thin-film wiring conductor layer 3d attached to the uppermost organic resin insulating layer 2d via solder or the like. When the electrodes of the electronic component A are electrically connected to the thin film wiring conductor layer 3d, a semiconductor device or a hybrid integrated circuit device is obtained, and the thin film wiring conductor layers 3a, 3b, 3c, 3
The electronic component A is connected to an external electric circuit by connecting any one of d to an external electric circuit.

Next, a method of forming the multilayer wiring section 4 in the above-described multilayer wiring board will be described with reference to FIG. First, as shown in FIG. 2A, an organic resin insulating layer 2
a. The organic resin insulating layer 2a is, for example,
A phenol novolak resin, methylol melamine, diallyldiazonium salt and propylene glycol monomethyl ether acetate are added to and mixed with an acid-catalyzed photosensitive epoxy resin to form a paste-form acid-catalyzed photosensitive epoxy resin precursor and The upper surface of the substrate 1 is applied to a predetermined thickness by a spin coating method, a curtain coating method, or the like, and then subjected to a predetermined exposure at an energy of 1 to ³ J / cm ³ by an exposure machine using a high-pressure mercury lamp or the like. Thereafter, the substrate 1 is applied to a predetermined thickness on the upper surface of the substrate 1 by performing a developing process using a spray developing machine or the like.

Next, as shown in FIG. 2B, a thin-film wiring conductor layer 3a made of at least one of copper, nickel, gold and aluminum is applied on the organic resin insulating layer 2a in a predetermined pattern.

The thin film wiring conductor layer 3a is formed on a top surface of the organic resin insulating layer 2a by applying a metal material made of at least one of copper, nickel, gold and aluminum to a predetermined thickness by an electroless plating method, a vapor deposition method, a sputtering method or the like. After that, this is formed into a predetermined pattern on the upper surface of the organic resin insulating layer 2a by processing this into a predetermined pattern by employing photolithography technology.

When the thin film wiring conductor layer 3a is formed of copper and by an electroless plating method, for example, copper sulfate 0.06 mol / l, formalin 0.3 mol / l
Liter, sodium hydroxide 0.35 mol / l,
An electroless plating solution composed of 0.35 mol / liter of ethylenediaminetetraacetic acid is prepared, and the plating solution is used to form a layer having a thickness of 1 μm to 4 μm on the upper surface of the organic resin insulating layer 2a.
A copper film having a thickness of 0 μm is applied, and thereafter, the copper film is formed into a predetermined pattern by employing a conventionally known photolithography technique.

Next, as shown in FIG. 2C, an organic resin insulating layer 2b having a through hole 8b is formed on the organic resin insulating layer 2a on which the thin film wiring conductor layer 3a is attached.

The organic resin insulating layer 2b is made of substantially the same material as that of the organic resin insulating layer 2a, specifically, a photosensitive epoxy resin. For example, phenol novolak resin, methylolmelamine, diallyldiazonium A paste-form acid-catalyzed photosensitive epoxy resin precursor obtained by adding and mixing propylene glycol monomethyl ether acetate to a salt is applied to the upper surface of the organic resin insulating layer 2a to a predetermined thickness by a spin coating method, a curtain coating method, or the like, Next, of the organic resin precursor, the thin film wiring conductor layer 3
The thick organic resin precursor excluding the organic resin precursor applied to the area where a is disposed is irradiated with an energy of 0.5 to ² J / cm ² by an exposure machine using a high-pressure mercury lamp or the like. (1) Photo-curing a part of the thick organic resin precursor by performing the exposure treatment of (1), and then applying the thin organic resin precursor applied to the region where the thin film wiring conductor layer (3a) is disposed and the other thickness. 1 to 3 J / with an exposure machine using a high-pressure mercury lamp, etc.
A ^second exposure process is performed with an energy of ² cm ² , whereby the entire organic resin precursor is appropriately photo-cured.
b is formed on the organic resin insulating layer 2a. In this case, the organic resin precursor has no uncured part because its entirety is moderately light-cured,
Organic resin insulating layer 2a and organic resin insulating layer 2 located above and below
b, and at the same time, the organic resin insulating layer 2b
Can be clearly formed in a predetermined pattern shape, and the through holes 8b can be formed very clearly in predetermined positions in the organic resin insulating layer 2b.

In the exposure treatment of the organic resin insulating layer 2a, first, the entire organic resin precursor is subjected to a first exposure treatment at an energy of 1 to 3 J / cm ² by an exposure machine using a high-pressure mercury lamp or the like. Then, an exposing machine using a high-pressure mercury lamp or the like for the thick organic resin precursor excluding the organic resin precursor applied to the region where the thin film wiring conductor layer 3a is disposed in the organic resin precursor By 0.5
The second exposure treatment may be performed at an energy of about ² J / cm ² .

Next, as shown in FIG. 2D, a thin-film wiring conductor layer 3b is deposited on the upper surface of the organic resin insulating layer 2b, and a through-hole conductor is formed on the inner wall of the through hole 8b provided in the organic resin insulating layer 2b. 9b is formed. The thin-film wiring conductor layer 3b is partially electrically connected to the thin-film wiring conductor layer 3a located below via the through-hole conductor 9b.

The thin-film wiring conductor layer 3b is made of the same metal material as the thin-film wiring conductor layer 3a.
a, the organic resin insulating layer 2
b is formed on the upper surface.

The through-hole conductor 9b is made of substantially the same metal material as the thin-film wiring conductor layer 3a. When the thin-film wiring conductor layer 3b is formed on the upper surface of the organic resin insulating layer 2b by employing a thin-film forming technique. Thin film wiring conductor layer 3
The same metal material as b is simultaneously formed on the inner wall of the through hole 8b formed in the organic resin insulating layer 2b to form the inner wall of the through hole 8b.

Finally, the thin film wiring conductor layer 3 is formed on the upper surface.
On the organic resin insulating layer 2b having a layer b, the same method as that for forming the organic resin insulating layer 2b and the same method for forming the thin film wiring conductor layer 3b and the through-hole conductor 9b are repeatedly performed. The layers 2c, 2b and the thin film wiring conductor layers 3c, 3d are alternately laminated, and the upper and lower thin film wiring conductor layers 3b, 3c, 3d are connected to the through-hole conductors 9c, 9
If the connection is made by d, the multilayer wiring board as a product shown in FIG. 1 is completed.

Next, another embodiment of the present invention will be described with reference to FIGS. FIG. 3 shows another embodiment of a multilayer wiring board manufactured by the manufacturing method of the present invention, in which organic resin insulating layers 12a and 12
b, 12c, 12d and thin film wiring conductor layers 13a, 13b,
13c and 13d are alternately laminated in multiple layers to form a multilayer wiring portion 14.

As shown in FIG.
First, an organic resin insulating layer 12a having a through hole 18a is formed on a substrate 11 having a wiring conductor 6 on an upper surface.

The organic resin insulating layer 12a is made of, for example, an acid-catalyzed photosensitive epoxy resin or the like. A phenol novolak resin, methylolmelamine, diallyldiazonium salt is mixed with propylene glycol monomethyl ether acetate and mixed to form a paste-like acid. A catalyst-type photosensitive epoxy resin precursor is prepared and applied to a predetermined thickness by a spin coating method, a curtain coating method, or the like on a substrate 11 on which a wiring conductor 6 is formed on the upper surface. Of the thick organic resin precursor excluding the organic resin precursor applied to the region where the wiring conductors 6 are disposed, by using an exposing machine using a high-pressure mercury lamp or the like to obtain 0.5 to ² J / cm ^2. A first exposure process is performed with a second energy to photo-cure a part of the thick organic resin precursor, 1~3J by exposure machine using a high-pressure mercury lamp 6 is is arranged is in a thick, which is applied to the area being thin organic resin precursor and other thicknesses for both the thick organic resin precursor / cm ² A second exposure process is performed with the energy described above, whereby the entire organic resin precursor is appropriately light-cured. Thereafter, the organic resin precursor is developed with a spray developing machine or the like to form an organic resin insulating layer 12a having a through hole 18a. Form.

In this case, since the entire organic resin precursor is appropriately light-cured, there is no uncured portion, and the substrate 11 and the organic resin insulating layer 12a are bonded very firmly, and The layer 12a can be clearly formed in a predetermined pattern shape, and the through hole 18a can be formed very clearly in a predetermined position in the organic resin insulating layer 12a.

In the exposure treatment on the organic resin insulating layer 12a, the entire organic resin precursor is first subjected to a first exposure treatment at an energy of 1 to 3 J / cm ² by an exposure machine using a high-pressure mercury lamp or the like. Thereafter, the thick organic resin precursor, excluding the organic resin precursor applied to the region where the wiring conductor 6 is disposed, of the organic resin precursor is reduced to 0 by an exposure machine using a high-pressure mercury lamp or the like. 0.5-2J
The second exposure treatment may be performed at an energy of / cm ² .

Next, as shown in FIG. 4B, a thin-film wiring conductor layer 13a made of at least one of copper, nickel, gold and aluminum is deposited on the organic resin insulating layer 12a and the organic resin insulating layer 12a is formed. A through-hole conductor 19a is attached to the inner wall of the through-hole 18a.
A part of the thin film wiring conductor layer 13a is a through hole conductor 1
It is electrically connected to the wiring conductor 6 via 9a.

The thin film wiring conductor layer 13a and the through hole conductor 19a are formed by electroless plating a metal material made of at least one of copper, nickel, gold and aluminum on the upper surface of the organic resin insulating layer 12a and the inner wall of the through hole 18a. A predetermined thickness is applied by a method, a vapor deposition method, a sputtering method, or the like, and thereafter, this is applied to the upper surface of the organic resin insulating layer 12a and the organic resin insulating layer 12a by processing into a predetermined pattern by employing a photolithography technique. Each is formed on the inner wall of the provided through hole 18a.

When the thin-film wiring conductor layer 13a and the through-hole conductor 19a are formed of copper by an electroless plating method, for example, copper sulfate 0.06 mol / l, formalin 0.3 mol / l An electroless plating solution comprising 0.35 mol / l of sodium hydroxide and 0.35 mol / l of ethylenediaminetetraacetic acid is prepared, and using these plating solutions, the upper surface of the organic resin insulating layer 12a and the inner wall of the through hole 18a. 1μ thick
A metal film of m to 40 μm is deposited, and thereafter, the metal film is formed using a conventionally known photolithography technique,
It is formed by processing into a predetermined pattern.

Next, as shown in FIG. 4 (c), the organic resin insulating layer 12 having the thin film wiring conductor layer 13a formed on the upper surface
organic resin insulating layer 12 having through hole 18b on
b is formed.

The organic resin insulating layer 12b is made of substantially the same material as the above-mentioned organic resin insulating layer 12a, specifically, a photosensitive epoxy resin. For example, phenol novolak resin, methylolmelamine, diallyldiazonium A paste-form acid-catalyzed photosensitive epoxy resin precursor obtained by adding and mixing propylene glycol monomethyl ether acetate to a salt is applied to the upper surface of the organic resin precursor 12a to a predetermined thickness by a spin coating method, a curtain coating method, or the like, Next, an exposure machine using a high-pressure mercury lamp or the like is applied to the thick organic resin precursor excluding the organic resin precursor applied to the region where the thin film wiring conductor layer 13a is disposed in the organic resin precursor. 0.5 to 2 J / cm
A part of the thick organic resin precursor is photo-cured by performing a first exposure treatment with energy ² and then the thin organic resin precursor applied to the region where the thin film wiring conductor layer 13a is disposed. Both the body and the other organic resin precursor having a large thickness are subjected to a second exposure treatment with an energy of 1 to 3 J / cm ² by an exposure machine using a high-pressure mercury lamp or the like. Is appropriately light-cured, and thereafter, is subjected to a developing process using a spray developing machine or the like to form an organic resin insulating layer 12b having a through hole 18b.

Next, as shown in FIG. 4D, a thin-film wiring conductor layer 13b is deposited on the organic resin insulating layer 12b, and the through holes 18 provided in the organic resin insulating layer 12b are formed.
The through-hole conductor 19b is adhered to the inner wall of b. A part of the thin film wiring conductor layer 13b is a through hole conductor 19b.
Is electrically connected to the thin-film wiring conductor layer 13a via the.

The thin-film wiring conductor layer 13b and the through-hole conductor 19b are made of the same metal material as the thin-film wiring conductor layer 13a and the through-hole conductor 19a, and are the same as the method of forming the thin-film wiring conductor layer 13a and the through-hole conductor 19a. By the method described above, it is formed on the upper surface of the organic resin insulating layer 12b and on the inner wall of the through hole 18b formed in the organic resin insulating layer 12b.

Finally, the thin film wiring conductor layer 1 is formed on the upper surface.
3b and the same method as forming the organic resin insulating layer 12b on the organic resin insulating layer 12b
3a and the through-hole conductor 19a are formed in the same manner as above, and the organic resin insulating layers 12c and 12d and the thin film wiring conductor layers 13c and 13d are alternately laminated. By connecting 13d with through-hole conductors 19c and 19d, a multilayer wiring board is completed as a product shown in FIG.

It should be noted that the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the scope of the present invention. Although only a multilayer wiring portion formed by alternately laminating a plurality of organic resin insulating layers and a plurality of thin film wiring conductor layers is applied only to the above, even if the multilayer wiring portion is provided only on the lower surface side of the substrate, It may be provided on both upper and lower surfaces.

[0055]

According to the method of manufacturing a multilayer wiring board of the present invention, a small amount of light is irradiated on a thin organic resin precursor applied to a region where a thin film wiring conductor layer is present. The organic resin precursor having a large thickness is irradiated with a large amount of light, and the entire organic resin precursor is appropriately photo-cured, thereby increasing the bonding strength between the organic resin insulating layers stacked vertically. At the same time, the organic resin insulating layer can be sharply formed in a predetermined pattern shape, and the through hole can be formed extremely clearly at a predetermined position, and the through hole attached to the inner wall of the through hole can be formed. The thin film wiring conductor layers located above and below the organic resin insulating layer via the conductor can be reliably and firmly electrically connected.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of a multilayer wiring board manufactured by a manufacturing method of the present invention.

2 (a) to 2 (d) are enlarged cross-sectional views of main parts in each step for explaining a method of manufacturing the multilayer wiring board of FIG. 1;

FIG. 3 is a sectional view showing another embodiment of the multilayer wiring board manufactured by the manufacturing method of the present invention.

4 (a) to 4 (d) are enlarged cross-sectional views of main parts in respective steps for explaining a method of manufacturing the multilayer wiring board of FIG. 3;

[Explanation of symbols]

 1 ... substrate 2a, 2b, 2c, 2d ... organic resin insulation layer 3a, 3b, 3c, 3d ... thin film wiring conductor layer 4 ····· Multilayer wiring part 6 ···· Wiring conductors 8b, 8c, 8d ········ Holes 9b, 9c, 9d: Through-hole conductor A: Electronic components

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 23/12 H01L 23/12 N

Claims (4)

[Claims] 1. A through-hole conductor formed by alternately stacking a substrate and an organic resin insulating layer and a thin film wiring conductor layer formed on the substrate and providing upper and lower thin film wiring conductor layers in the organic resin insulation layer. A multilayer wiring board comprising: a multilayer wiring portion electrically connected to the multilayer wiring portion, wherein the multilayer wiring portion is formed by the following steps (a) to (e). Production method. (A) a step of applying a photosensitive organic resin precursor on the upper surface of a substrate, and applying an exposure treatment and a development treatment thereon to deposit an organic resin insulation layer; and (b) a thin film on the organic resin insulation layer. Forming a thin film wiring conductor layer by applying a metal film made of at least one of copper, nickel, gold, and aluminum by a forming technique and processing the metal film into a predetermined pattern by a photolithography technique;
(C) A photosensitive organic resin precursor is applied on the organic resin insulating layer having the thin film wiring conductor layer formed on the upper surface, and is applied to a region of the organic resin precursor where the thin film wiring conductor layer is arranged. Except for those that have been exposed, a first exposure treatment is performed, then a second exposure treatment is performed on the entire organic resin precursor, and then a development treatment is performed to form an organic resin insulation layer having through holes. And (d) depositing a metal film made of at least one of copper, nickel, gold, and aluminum on the upper surface of the organic resin insulating layer having the through hole and in the through hole by a thin film forming technique, and depositing the metal film. Processing into a predetermined pattern by photolithography technology to form a thin-film wiring conductor layer that is partially electrically connected to a thin-film wiring conductor layer located below via through holes If, (e) the (c) and (d)
The process of repeating the process of 2. A through-hole conductor formed by alternately laminating a substrate and an organic resin insulating layer and a thin film wiring conductor layer formed on the substrate and providing upper and lower thin film wiring conductor layers in the organic resin insulation layer. A multilayer wiring board comprising: a multilayer wiring portion electrically connected to the multilayer wiring portion, wherein the multilayer wiring portion is formed by the following steps (a) to (e). Production method. (A) a step of applying a photosensitive organic resin precursor on the upper surface of a substrate, and applying an exposure treatment and a development treatment thereon to deposit an organic resin insulation layer; and (b) a thin film on the organic resin insulation layer. Forming a thin film wiring conductor layer by applying a metal film made of at least one of copper, nickel, gold, and aluminum by a forming technique and processing the metal film into a predetermined pattern by a photolithography technique;
(C) coating a photosensitive organic resin precursor on an organic resin insulating layer having a thin-film wiring conductor layer formed on the upper surface, performing a first exposure treatment on the entire organic resin precursor, Excluding the resin precursor applied to the region where the thin film wiring conductor layer is disposed, the second exposure process is performed,
(D) forming an organic resin insulating layer having a through-hole by performing a development process thereafter; and (d) forming copper, nickel, gold, or the like on the upper surface of the organic resin insulating layer having the through-hole and in the through-hole by a thin film forming technique. A metal film made of at least one kind of aluminum is applied and the metal film is processed into a predetermined pattern by a photolithography technique, and a part of the metal film is electrically connected to a thin film wiring conductor layer located below through a through hole. And (e) alternately repeating the steps (c) and (d). 3. A substrate having a wiring conductor on an upper surface thereof, and an organic resin insulating layer and a thin film wiring conductor layer formed on the substrate are alternately laminated, and the thin film wiring conductor layers located above and below are formed on the organic resin insulating layer. And a multilayer wiring portion electrically connected through a through-hole conductor provided in the multilayer wiring board, wherein the multilayer wiring portion is formed by the following steps (a) to (e). Manufacturing method of a multilayer wiring board. (A) A photosensitive organic resin precursor is applied on a substrate having a wiring conductor formed on its upper surface, and the organic resin precursor is not applied to a region where the wiring conductor is disposed in the organic resin precursor. Performing a first exposure process, then performing a second exposure process on the entire organic resin precursor, and then performing a development process to form an organic resin insulating layer having a through hole; (b) A metal film made of at least one of copper, nickel, gold, and aluminum is deposited on the upper surface of the organic resin insulating layer having the through hole and in the through hole by a thin film forming technique, and the metal film is formed into a predetermined pattern by a photolithography technique. Forming a thin-film wiring conductor layer that is electrically connected to a wiring conductor located below through a through hole,
(C) A photosensitive organic resin precursor is applied on the organic resin insulating layer having the thin film wiring conductor layer formed on the upper surface, and is applied to a region of the organic resin precursor where the thin film wiring conductor layer is arranged. Except for the first exposure treatment, and then subject the entire organic resin precursor to a second exposure treatment,
(D) forming an organic resin insulating layer having a through-hole by performing a development process thereafter; and (d) forming copper, nickel, gold, or the like on the upper surface of the organic resin insulating layer having the through-hole and in the through-hole by a thin film forming technique. A metal film made of at least one kind of aluminum is applied and the metal film is processed into a predetermined pattern by a photolithography technique, and a part of the metal film is electrically connected to a thin film wiring conductor layer located below through a through hole. And (e) alternately repeating the steps (c) and (d). 4. A substrate having a wiring conductor on an upper surface thereof, and an organic resin insulating layer and a thin film wiring conductor layer formed on the substrate are alternately laminated, and the thin film wiring conductor layers located above and below are formed on the organic resin insulating layer. And a multilayer wiring portion electrically connected through a through-hole conductor provided in the multilayer wiring board, wherein the multilayer wiring portion is formed by the following steps (a) to (e). Manufacturing method of a multilayer wiring board. (A) A photosensitive organic resin precursor is applied on a substrate having a wiring conductor formed on the upper surface, and a first exposure process is performed on the entire organic resin precursor. A step of performing a second exposure process except for a portion applied to a region where the wiring conductor is arranged, and then performing a development process to form an organic resin insulating layer having a through hole; A metal film made of at least one of copper, nickel, gold, and aluminum is deposited on the upper surface of the organic resin insulating layer having a through hole and in the through hole by a thin film formation technique, and the metal film is formed into a predetermined pattern by a photolithography technique. Processing, forming a thin-film wiring conductor layer that is partially electrically connected to the wiring conductor located below through the through-hole,
(C) coating a photosensitive organic resin precursor on an organic resin insulating layer having a thin-film wiring conductor layer formed on the upper surface, performing a first exposure treatment on the entire organic resin precursor, Except for the resin precursor applied to the region where the thin film wiring conductor layer is disposed, a second exposure process is performed, and then a development process is performed to form an organic resin insulating layer having a through hole. And (d) depositing a metal film made of at least one of copper, nickel, gold, and aluminum on the upper surface of the organic resin insulating layer having the through hole and in the through hole by a thin film forming technique, and depositing the metal film. Processing into a predetermined pattern by photolithography technology to form a thin-film wiring conductor layer that is partially electrically connected to a thin-film wiring conductor layer located below via through holes , The step of repeating alternating steps of (e) above (c) and (d)