JPH11317599A - Electronic component arrangement method and device thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an electronic component arrangement method, capable of arranging electronic components with respect to an object, such as a bond while saving space. SOLUTION: A component-mounting surface 12a of a board 12 is kept vertical in position, and an electronic component P is made to approach the component- mounting surface 12a from a direction vertical with respect to the mounting surface, whereby the electronic component P can be mounted on the part mounting surface 12a. That is, as compared with the case where an electronic component descends from above to be mounted on the component-mounting surface of a board kept horizontal in position, the electronic component P can be mounted on the board 12 in a space-saving manner, so that this mounting method is capable of satisfying a recent requirement such as space saving.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component arranging apparatus for arranging electronic components on an object such as a substrate or a component packaging tape.

[0002]

2. Description of the Related Art Japanese Patent Laying-Open No. 5-304392 discloses an apparatus for mounting a plurality of electronic components on a substrate. The apparatus includes a component supply unit configured by arranging a plurality of component cassettes in a line, and an index table having a plurality of suction nozzles on an outer peripheral portion.

When electronic components are mounted on a substrate on an XY table, first, a component supply unit is moved so that a predetermined component cassette comes to a component extraction position. Next, the suction nozzle at the component removal position of the index table is lowered to suck and remove the electronic component from the component cassette. Next, the index table is rotated in a predetermined direction, and the suction nozzle holding the electronic component is moved to the component mounting position. Next, the XY table is moved to move the component mounting position of the board to the component mounting position. Next, the suction nozzle at the component mounting position is lowered, and the electronic component sucked by the suction nozzle is mounted on the substrate.

[0004]

Not only the above-mentioned apparatus but also the mounting of components on a board is generally performed by horizontally moving an electronic component taken out of a component supply section above the board, and placing the electronic component on a component mounting surface. It is implemented by vertically descending toward.

In such a component mounting method, it is necessary to provide a manipulator for moving the electronic component in a two-dimensional direction between the component supply unit and the substrate.
Since the horizontal movement of the manipulator requires a relatively large stroke, the size of the device in the direction in which the component supply unit, the board, and the manipulator are arranged is inevitably large, which satisfies the recent demand for space saving. It is difficult.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide an electronic component arranging method capable of performing an operation of arranging electronic components on an object such as a board in a space-saving manner. Another object of the present invention is to provide an electronic component placement apparatus suitable for implementing this method.

[0007]

In order to achieve the above object, an electronic component arranging method according to the present invention provides a non-horizontal state of a component arranging portion of an object on which an electronic component is to be arranging. The main feature is that the electronic component is relatively approached toward the location and the electronic component is arranged at the component placement location.

According to this method, the component placement location of the object on which the electronic component is placed is set to the non-horizontal state, and the electronic component is arranged at the component placement location in the non-horizontal state. Compared with the case where electronic components are arranged at the component arrangement location of a certain object, the operation of arranging the electronic components on the object such as a board can be performed in a space-saving manner.

On the other hand, an electronic component placement apparatus according to the present invention comprises: an object having a component placement location; an object support mechanism for supporting the object so that the component placement location is non-horizontal;
A component supply unit having a passage for supplying the electronic components in an aligned state and a discharge port for discharging the electronic components in the passage to the outside, wherein the discharge port is provided so as to face a component arrangement location of the object; And a component pushing mechanism for forcibly extruding the electronic component from the outlet of the component supply unit, and arranging the pushed electronic component at a component arrangement location of the object.

[0010] According to this device, the above-described electronic component placement method can be accurately performed by an operation of merely forcibly pushing out the electronic component from the outlet of the component supply unit.

The above and other objects, constitutional features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment FIGS. 1 to 4 show a first embodiment of the present invention. 1 to 4, reference numeral 1 denotes a base, 2 denotes a component supply unit, 7 denotes a suction nozzle,
Reference numeral 8 denotes a cylinder for driving the suction nozzle, 11 denotes a movable table, and 12 denotes a substrate.

The component supply unit 2 according to the first embodiment includes:
It comprises a storage 3, a vertically long supply member 4, a movable pipe 5, and a cylinder 6 for driving the movable pipe. The component supply unit 2 is attached to the base 1 such that the supply member 4 is oriented vertically.

The storage 3 is a storage room 3a having an inclined bottom surface.
And the upper end opening of the storage room 3a is openably and closably covered by a lid 3b. A rectangular or circular through-hole 3c is formed at the center of the inclined bottom surface of the storage room 3a. In the storage room 3a, many electronic components P of the same type having a prismatic shape are stored in bulk. This electronic component P has a prismatic shape having a predetermined width, thickness and length, and is shown in FIGS. 3 (A) to 3 (C).
Shows some examples. The electronic component P1 shown in FIG. 3A is a chip component such as a resistor, a capacitor, or an inductor having external electrodes EC at both ends in the length direction, and the electronic component P2 shown in FIG. The electronic component P3 shown in FIG. 3C is a composite component such as an LC filter or a network having external electrodes EC at both ends in the width direction.
Is an integrated circuit component such as a semiconductor device having a bump-shaped external electrode EC on the lower surface. Each of the electronic components P1 to P3 shown in FIGS. 3A to 3C has a dimensional relationship of length>width> thickness. However, if the cross-sectional shape of a passage 4b described later is changed, the length is reduced. Electronic components having a dimensional relationship of width = thickness can be handled, and cylindrical electronic components can also be handled.

The supply member 4 has a vertically long rectangular tube shape, and has a small outer portion 4a at the upper end. The small outer portion 4a is inserted into the center of the through-hole 3c of the storage 3, and the upper end of the small outer portion 4a in the inserted state projects slightly above the upper end of the through-hole 3c. The supply member 4 is provided with a passage 4 having an upper end opened and a lower end closed.
b. A discharge port 4c is formed on one side surface of the lower end of the passage 4b, and an insertion port 4d is formed on a side surface facing the discharge port 4c. As shown in FIG. 2, the cross-sectional shape of the passage 4 b is a rectangle slightly larger than the end surface shape of the storage component P, and the opening shape of the outlet 4 c is the shape of the side surface of the storage component P having the largest area. It is a rectangle slightly larger than the shape, and the opening shape of the insertion port 4 d is a circle slightly larger than the outer shape of the suction nozzle 7.

The movable pipe 5 has an outer shape slightly smaller than the inner shape of the through hole 3c and an inner shape slightly larger than the outer shape of the small outer portion 4a. This movable pipe 5
Are vertically movably disposed in an annular gap formed between the through hole 3c and the small portion 4a. A mortar-shaped guide surface 5a is formed at the upper end of the movable pipe 5, and a flange 5b is formed at the lower end. Further, a coil spring 5c is interposed between the lower end flange 5b and the lower surface of the storage 3. In the standby state, the movable pipe 5 is urged downward by the coil spring 5c, and the lower surface thereof is stepped on the outer surface of the supply member 4. Is in contact with Incidentally, the upper end of the movable pipe 5 in this standby state is slightly lower than the upper end of the small outer portion 4a of the supply member 4.

The movable pipe driving cylinder 6 is vertically mounted on the base 1 so that its rod 6a comes into contact with the flange 5b. The movable pipe 5 moves up and down together with the rod 6a of the cylinder 6.

The suction nozzle 7 is connected to a rod 8a of a cylinder 8 mounted horizontally on the base 1, and is provided at a rear side of the insertion port 4d in a direction that can be inserted into the insertion port 4d. The suction nozzle 7 moves forward and backward together with the rod 8a of the cylinder 8.

Although not shown, the above-mentioned cylinders 6, 8
The suction / exhaust port of the suction nozzle 7 is connected to a pipe from an air circuit including a vacuum pump and the like. The cylinders 6, 8 move the rods 6a, 8a by positive pressure or negative pressure, and the suction nozzle 7 performs component suction by negative pressure.

The movable table 11 is composed of a well-known XY table, and its support surface 11a is vertically oriented as in the case of the supply member 4. Support surface 11 of movable table 11
A large number of suction holes (not shown) are provided in a, and the substrate 12 can be held in close contact with the support surface 11a by applying the same negative pressure to the suction holes as the suction nozzle 7.

The substrate 12 is provided on the support surface 11 of the movable table 11.
In this state, the component mounting surface 12a of the substrate 12 is also oriented vertically, and as shown in FIG. 1, the component mounting surface 12a is spaced apart from the discharge port 4c of the supply member 4 by a predetermined distance. Facing each other.

Here, the operation of the apparatus according to the first embodiment will be described.

The electronic components P in the storage room 3a are stirred by moving the movable pipe 5 up and down by the rod 6a of the cylinder 6, as shown in FIG.
While being guided by the guide surface 5a or directly
One by one is taken into the opening at the upper end of the passage 4b in the length direction. Since the cross-sectional shape of the passage 4b is a rectangle slightly larger than the end surface shape of the storage component P, the electronic component P is inserted into the passage 4b in a state where the two sides in the thickness direction and the two sides in the width direction are aligned. It is captured. Since the electronic component P taken in the passage 4b moves downward by its own weight, the electronic components P shown in FIGS.
As shown in (2), the plurality of electronic components P are housed in the passage 4b in a state of being aligned in the length direction, and the lowermost electronic component P stops at the position of the outlet 4c.

In the state shown in FIG. 1, the movable table 11 is appropriately moved to adjust the position of the component mounting position, and then the suction nozzle 7 to which the negative pressure is applied is advanced by the rod 8a of the cylinder 8. As shown in FIG.
Is inserted into the insertion slot 4d, and the lowest electronic component P
Is pushed out from the outlet 4c while being sucked by the suction nozzle 7.

Since the direction of the component mounting surface 12a of the substrate 12 is vertical and the direction of movement of the suction nozzle 7 is horizontal, the electronic component P pushed out by the suction nozzle 7 is moved from a direction perpendicular to the component mounting surface 12a. It approaches toward the component mounting surface 12a.

A viscous joining material (not shown) such as cream solder is applied in advance to the component mounting position on the component mounting surface 12a, for example, a conductor such as a land, and thus approaches the component mounting surface 12a. The electronic component P adheres to the substrate 12 when reaching the bonding material.

The forward stroke of the suction nozzle 7 is
Since the electronic component P can be set in advance according to the distance between the component mounting surface 12a and the discharge port 4c of the supply member 4, the electronic component P is not pressed against the substrate 12 with an excessive pressure.

Thereafter, the negative pressure acting on the suction nozzle 7 is released or switched to a positive pressure, and then the suction nozzle 7 is retracted by the rod 8a of the cylinder 8 to return to the initial position. When the suction nozzle 7 returns to the initial position, the entire electronic component P in the passage 4b descends by its own weight, and the subsequent electronic component P stops at the position of the outlet 4c. Subsequently, when the electronic component P is mounted on the same substrate 12,
In the same manner as described above, after the movable table 11 is moved to perform the alignment, the suction nozzle 7 to which the negative pressure is applied may be advanced. Since a large number of electronic components P are stored in the storage room 3a, component mounting can be repeatedly performed until these storage components P are exhausted.

Since the electronic component P is extremely small and light, even if the suction nozzle 7 is returned to the initial position after the electronic component P has adhered to the substrate 12, the movable table 11
Is moved, the mounted electronic component P does not fall off the substrate 12.

Incidentally, for positioning when the electronic component P is extruded from the component supply unit 2 and mounted on the substrate 12, and for other positioning, a well-known optical detecting device, for example, an optical switch or a camera is used. An image processing device or the like is appropriately used.

As described above, according to the first embodiment, the direction of the component mounting surface 12a of the substrate 12 is vertical, and the component mounting surface 12a is perpendicular to the perpendicular component mounting surface 12a.
The electronic component P can be mounted on the component mounting surface 12a by approaching the electronic component P toward.

That is, the operation of mounting the electronic components P on the board 12 can be performed in a space-saving manner as compared with the case where the electronic components are lowered from above toward the component mounting surface of the board in a horizontal state. And can respond to the recent demand for space saving.

The operation of merely pushing out the electronic component P from the outlet 4c of the component supply unit 2 causes the electronic component P to be pushed out.
Is adopted, a mounting mechanism itself is made compact, which can greatly contribute to the space saving.

Further, since the component supply unit 2 integrally provided with the storage 3 is used, it is possible to continuously load components while sequentially supplying the storage components P into the passage 4b.

Further, since the storage parts P can be agitated by moving the movable pipe 5 up and down, the agitation of the storage parts P into the passage 4b is promoted by this agitation, so that the above-described parts supply can be performed smoothly. it can.

In the first embodiment, the lowest electronic component P in the passage 4b is stopped at the position of the discharge port 4c by utilizing the weight of the electronic component P on the upper side. May be stopped at the position of the outlet 4c by a separate means. 5 (A) to 5
FIG. 5C shows a specific example of the above-mentioned means. In the example of FIG. 5A, a permanent magnet 10a is provided on the lower end surface of the passage 4b or a surface adjacent thereto, and the lowermost position is determined by the magnetic force of the permanent magnet 10a. The electronic component P is held at the same position.
In the example of FIG. 5B, a suction hole 10b is provided in the lower end surface of the passage 4b or a surface adjacent thereto, and the lowermost electronic component P is held at the same position by the negative pressure acting on the suction hole 10b. ing. In the example shown in FIG. 5C, a discharge port 4c 'is formed by cutting out the lower wall portion of the discharge port 4c or a wall adjacent thereto, and the shutter 10 can be opened and closed.
By closing the discharge port 4c 'by c, the lowermost electronic component P is held at the same position. Incidentally, the shutter 10c is configured to be opened at the timing when the suction nozzle 7 is inserted into the insertion opening 4d by an actuator such as a cylinder or a motor, a link mechanism operated by pressing the suction nozzle 7, or the like.

In the first embodiment, the passage 4b
Although the electronic component P at the position of the discharge port 4c in the inside is extruded in the same posture and mounted on the substrate 12, when the electronic component P needs to be changed in direction when mounted on the substrate 12, It is preferable to adopt a structure as shown in FIG. In the structure shown in FIG. 6, an actuator 9 such as a motor for rotating the suction nozzle 7 around its center line as an axis is interposed between the rod 8a of the cylinder 8 for the suction nozzle and the suction nozzle 7. is there. If the suction nozzle 7 is rotated by the actuator 9 when the electronic component P is pushed out from the discharge port 4c, the direction of the electronic component P can be changed by an angle corresponding to the rotation angle.
The direction of the electronic component P mounted on the substrate 12 can be arbitrarily changed. [Second Embodiment] FIGS. 7 and 8 show a second embodiment of the present invention. 7 and 8, reference numeral 1 is a base, 2 is a component supply unit, 7 is a suction nozzle, 8 is a cylinder for driving the suction nozzle, 11 is a movable table, and 12 is a substrate.

The second embodiment differs from the first embodiment in that a supply member 13 having a lower portion bent rightward in the figure and a portion excluding the lower portion being vertical is used for the component supply unit 2. The point is that the directions of the cylinder 8 and the movable table 11 are inclined in accordance with the inclination of the lower bent portion of the supply member 13. Incidentally, the structure of the part not shown of the component supply unit 2 is the same as that of the first embodiment.

A passage 13a is formed in the supply member 13 so as to extend to the bent portion. A discharge port 13b is formed on one side of the lower end of the passage 13a.
An insertion opening 13c is formed in the side surface facing the above. The cross-sectional shape of the passage 13a is a rectangle slightly larger than the end surface shape of the storage component P, and the opening shape of the outlet 13b is
It is a rectangle slightly larger than the shape of the side surface having the largest area of the storage component P, and the opening shape of the insertion port 13 c is a circle slightly larger than the outer shape of the suction nozzle 7. Further, a permanent magnet 13d is embedded in the lower end surface of the passage 13a or a surface adjacent thereto.

The cylinder 8 for driving the suction nozzle is attached to the base 1 in a state where the cylinder 8 is inclined counterclockwise with respect to the horizontal line by the same angle as the inclination of the lower bent portion of the supply member 13. The movable table 11 has a support surface 11.
a is tilted counterclockwise with respect to the vertical line by the same angle as the tilt of the lower bent portion of the supply member 13.

Incidentally, in the illustrated example, the supply member 1
3, the inclination of the lower bent portion is approximately 30 degrees counterclockwise with respect to the vertical line, and the inclination of the cylinder 8 and the suction nozzle 7 is approximately 30 degrees counterclockwise with respect to the horizontal line.
The inclination of the suction nozzle 7 is the same. The tilt of the movable table 11 is about 30 degrees counterclockwise with respect to the vertical line, and the tilt of the component mounting surface 12a of the substrate 12 is the same.

Here, the operation of the apparatus according to the second embodiment will be described.

As in the first embodiment, the electronic components P in the storage room are taken in one by one in the longitudinal direction into the upper end opening of the passage 13a, and the electronic components P taken in the passage 4b move downward by their own weight. Therefore, as shown in FIG.
In the state a, a plurality of electronic components P are stored in a state aligned in the length direction, and the lowest electronic component P is held by the magnetic force of the permanent magnet 13d and stopped at the position of the outlet 13b.

In the state of FIG. 7, when the movable table 11 is appropriately moved to adjust the position of the component mounting position, and then the suction nozzle 7 to which the negative pressure is applied is advanced by the rod 8a of the cylinder 8, FIG. As shown in FIG.
Is inserted into the insertion port 13c, and the lowermost electronic component P is sucked by the suction nozzle 7 while the discharge port 13b is
Extruded from.

The component mounting surface 12a of the substrate 12 is tilted about 30 degrees in the counterclockwise direction with respect to the vertical line, and the moving direction of the suction nozzle 7 is about 3 degrees in the counterclockwise direction with respect to the horizontal line.
Since the electronic component P is inclined by 0 degrees, the electronic component P pushed out by the suction nozzle 7 approaches the component mounting surface 12a from a direction orthogonal to the component mounting surface 12a.

Since a viscous joining material (not shown) such as cream solder is applied in advance to the component mounting position on the component mounting surface 12a, for example, a conductor such as a land, the conductor approaches the component mounting surface 12a. The electronic component P adheres to the substrate 12 when reaching the bonding material.

The forward stroke of the suction nozzle 7 is
Since the electronic component P can be set in advance according to the distance between the component mounting surface 12a and the outlet 13b of the supply member 13, the electronic component P is not pressed against the substrate 12 with an excessive pressure.

Thereafter, the negative pressure acting on the suction nozzle 7 is released or switched to a positive pressure, and then the suction nozzle 7 is retracted by the rod 8a of the cylinder 8 to return to the initial position. When the suction nozzle 7 returns to the initial position, the entire electronic component P in the passage 13a descends by its own weight, and the subsequent electronic component P stops at the position of the outlet 13b by the magnetic force of the permanent magnet 13d. Subsequently, when the electronic component P is mounted on the same substrate 12, the movable table 11 is moved and aligned as described above, and then the suction nozzle 7 subjected to the negative pressure is inserted into the insertion port 13c. I just need.

Since the electronic component P is extremely small and light, even if the suction nozzle 7 is returned to the initial position after the electronic component P has adhered to the substrate 12, the movable table 11
Is moved, the mounted electronic component P does not fall off the substrate 12.

As described above, according to the second embodiment, the direction of the component mounting surface 12a of the substrate 12 is inclined by about 30 degrees in the counterclockwise direction with respect to the vertical line.
The electronic component P can be mounted on the component mounting surface 12a by approaching the electronic component P toward the component mounting surface 12a from a direction orthogonal to the direction a. Of course, similar component mounting can be performed if the above-mentioned inclination angle is within an acute angle range other than 30 degrees.

That is, the operation of mounting the electronic component P on the board 12 can be performed in a space-saving manner as compared with the case where the electronic component is lowered from above toward the component mounting surface of the board in a horizontal state. And can respond to the recent demand for space saving. Other functions and effects are the same as those of the first embodiment.

In the second embodiment, the passage 13a
5 is stopped at the position of the outlet 13b by the magnetic force of the permanent magnet 13d.
The lowermost electronic component P may be held by using the component holding means shown in FIG. 5B or FIG. 5C.

In the second embodiment, the passage 13
Although the electronic component P located at the position of the discharge port 13b in the area a is extruded in the same posture and mounted on the substrate 12, it is necessary to change the direction of the electronic component P when mounting the electronic component P on the substrate 12. At times, the suction nozzle rotating mechanism shown in FIG. 6 may be employed. Third Embodiment FIGS. 9 and 10 show a third embodiment of the present invention. 9 and 10, reference numeral 1 denotes a base, 2 denotes a component supply unit, 7 denotes a suction nozzle, 8 denotes a cylinder for driving the suction nozzle, 11 denotes a movable table, and 12 denotes a substrate.

The third embodiment differs from the first embodiment in that a supply member 14 having a lower portion bent leftward in the drawing and a portion excluding the lower portion being vertical is used for the component supply unit 2. The point is that the directions of the cylinder 8 and the movable table 11 are inclined in accordance with the inclination of the lower bent portion of the supply member 14. Incidentally, the structure of the part not shown of the component supply unit 2 is the same as that of the first embodiment.

A passage 14a is formed in the supply member 14 so as to extend to the bent portion. A discharge port 14b is formed on one side of the lower end of the passage 14a.
An insertion opening 14c is formed on a side surface facing the above. The cross-sectional shape of the passage 14a is a rectangle slightly larger than the end surface shape of the storage component P, and the opening shape of the outlet 14b is
It is a rectangle slightly larger than the shape of the side surface having the largest area of the storage component P, and the opening shape of the insertion port 14 c is a circle slightly larger than the outer shape of the suction nozzle 7.

The cylinder 8 for driving the suction nozzle is attached to the base 1 in a state in which the cylinder 8 is inclined clockwise with respect to the horizontal line by the same angle as the inclination of the lower bent portion of the supply member 14. The movable table 11 has a support surface 11a.
Are inclined clockwise with respect to the vertical line by the same angle as the inclination of the lower bent portion of the supply member 14.

By the way, in the illustrated example, the supply member 1
The inclination of the lower bent portion 4 is approximately 30 degrees clockwise with respect to the vertical line, and the inclination of the cylinder 8 and the suction nozzle 7 is approximately 30 degrees clockwise with respect to the horizontal line. The tilt of the movable table 11 is about 30 degrees clockwise with respect to the vertical line, and the tilt of the component mounting surface 12a of the substrate 12 is the same.

Here, the operation of the apparatus according to the third embodiment will be described.

As in the first embodiment, the electronic components P in the storage chamber are taken in one by one into the upper end opening of the passage 14a in the length direction, and the electronic components P taken in the passage 4b move downward by their own weight. Therefore, as shown in FIG.
a, a plurality of electronic components P are stored in a state of being aligned in the length direction.
Stop at position 4b.

In the state of FIG. 9, the movable table 11 is appropriately moved to adjust the position of the component mounting position, and then the suction nozzle 7 to which the negative pressure is applied is advanced by the rod 8a of the cylinder 8. As shown in FIG. 7, the suction nozzle 7 is inserted into the insertion port 14c, and the lowermost electronic component P is suctioned by the suction nozzle 7 while the discharge port 14 is being held.
b.

Since the component mounting surface 12a of the substrate 12 is inclined approximately 30 degrees clockwise with respect to the vertical line, and the moving direction of the suction nozzle 7 is inclined approximately 30 degrees clockwise with respect to the horizontal line. The electronic component P pushed out by the suction nozzle 7 approaches the component mounting surface 12a from a direction orthogonal to the component mounting surface 12a.

Since a viscous joining material (not shown) such as cream solder is applied in advance to the component mounting position on the component mounting surface 12a, for example, a conductor such as a land, the conductor approaches the component mounting surface 12a. The electronic component P adheres to the substrate 12 when reaching the bonding material.

The advance stroke of the suction nozzle 7 is
Since the electronic component P can be set in advance in accordance with the distance between the second component mounting surface 12a and the discharge port 14b of the supply member 14, the electronic component P is not pressed against the substrate 12 with an excessive pressure.

Thereafter, the negative pressure acting on the suction nozzle 7 is released or switched to a positive pressure, and then the suction nozzle 7 is retracted by the rod 8a of the cylinder 8 to return to the initial position. When the suction nozzle 7 returns to the initial position, the entire electronic component P in the passage 14a descends by its own weight, and the subsequent electronic component P stops at the outlet 13b. Subsequently, when the electronic component P is mounted on the same substrate 12, the movable table 11 is moved and aligned as described above, and then the suction nozzle 7 to which the negative pressure is applied is applied.
May be inserted into the insertion slot 14c.

Since the electronic component P is extremely small and lightweight, even if the suction nozzle 7 is returned to the initial position after the electronic component P has adhered to the substrate 12, the movable table 11
Is moved, the mounted electronic component P does not fall off the substrate 12.

As described above, according to the third embodiment, the direction of the component mounting surface 12a of the substrate 12 is inclined approximately 30 degrees clockwise with respect to the vertical line, and the tilted component mounting surface 12a is tilted.
The electronic component P can be mounted on the component mounting surface 12a by approaching the electronic component P toward the component mounting surface 12a from a direction perpendicular to the electronic component P. Of course, similar component mounting can be performed if the above-mentioned inclination angle is within an acute angle range other than 30 degrees.

That is, the operation of mounting the electronic component P on the board 12 can be performed in a space-saving manner as compared with the case where the electronic component is lowered from above toward the component mounting surface of the board in a horizontal state. And can respond to the recent demand for space saving. Other functions and effects are the same as those of the first embodiment.

In the third embodiment, the passage 14a
5A is stopped at the position of the outlet 14b using the weight of the upper electronic component P. However, FIG. 5A, FIG. 5B or FIG. The lowermost electronic component P may be held using the component holding means shown in FIG.

In the third embodiment, the passage 14
Although the electronic component P located at the position of the discharge port 14b in the area a is extruded in the same posture and mounted on the substrate 12, it is necessary to change the direction of the electronic component P when mounting the electronic component P on the substrate 12. At times, the suction nozzle rotating mechanism shown in FIG. 6 may be employed. Fourth Embodiment FIGS. 11 to 15 show a fourth embodiment of the present invention. 11 to 15, reference numeral 21 is a base, 22 is a unit rack, 23 is a component supply unit,
25 is a rack moving mechanism, 26 is a unit mounting mechanism, 27
Is a rotary head, 31 is a movable table, and 32 is a substrate.

The fourth embodiment is different from the first embodiment in that the component supply unit 23 is composed of only a vertically long supply member 24, and a plurality of supply members 24 are detachably attached to the unit rack 22. The point of holding, the point that an arbitrary supply member 24 can be attached to the rotary head 27 from the plurality of supply members 24 held by the unit rack 22, and the plurality of supply members 2 attached to the rotary head 27
4 is selectively used so that a desired electronic component P can be mounted on the substrate 32.

As shown in FIGS. 12 (A) and 12 (B), each of the supply members 24 constituting the component supply unit 23 has a passage 24a having an upper end opened and a lower end closed. An outlet 24b is provided on one side of the lower end of the passage 24a.
Is formed, and an insertion port 24c is formed on a side surface facing the discharge port 24b. The cross-sectional shape of the passage 24a is a rectangle slightly larger than the end surface shape of the storage component P described later, and the opening shape of the discharge port 24b is
Is a rectangle slightly larger than the shape of the side surface having the widest area, and the opening shape of the insertion port 24c is a circle slightly larger than the outer shape of a suction nozzle 27h described later.

In the passage 24a of each supply member 24,
Electronic components P of the same type having a prismatic shape are housed in a state where they are aligned in the length direction, specifically, in a state where the two sides in the thickness direction and the two sides in the width direction of the electronic component P are aligned. . The details of the electronic component P are as described above with reference to FIGS. 3 (A) to 3 (C). Of course, if the cross-sectional shape of the passage 24a is changed, it is possible to handle electronic components having a dimensional relationship of length> width = thickness, and also to handle cylindrical electronic components. Each corner supply member 24 includes
It is preferably formed of a transparent or translucent material so that the kind of the stored parts and the wear state of the parts can be checked from the outside. Further, two mounting holes 24d for mounting pins 27e, which will be described later, are provided on the back surface of the supply member 24 at an upper and lower interval, and a spring that engages with the annular concave portion of the mounting pins 27e is provided inside thereof. A ball 24f biased by 24e is provided.

As shown in FIG. 11, the unit rack 22 includes a bottom plate 22a, a pair of side plates 22b erected at both longitudinal ends of the upper surface of the bottom plate 22a, and two upper and lower unit holders provided between the side plates 22b. 22c and 22d, and two rows of slide guides 22 provided on the lower surface of the bottom plate 22a.
e. In the unit rack 22, a plurality of supply members 24 are detachably held in a horizontal row using two upper and lower unit holders 22c and 22d. Incidentally, each of the plurality of supply members 24 held in the unit rack 23 basically stores a different type of electronic component P.

The rack moving mechanism 25 is arranged below the unit rack 22 on the base 21 as shown in FIG. The rack moving mechanism 25 includes two rows of guide rails 25a with which a slide guide 22e of the unit rack 22 is movably engaged, a nut 25b fixed to the bottom surface of the unit rack 22, and a ball screw 25c screwed with the nut 25b. And a motor 25d for rotating the ball screw 25c in the forward and reverse directions. That is, the unit rack 22 linearly moves along the guide rail 25a by rotating the ball screw 25c in the forward and reverse directions by the motor 25d.

The unit mounting mechanism 26 is shown in FIGS.
As shown in FIG.
It is located on the rear side. This unit mounting mechanism 26
Is a supporting portion 2 having a built-in rod 26a and an actuator such as a cylinder and a motor for moving the rod 26a forward and backward.
6b and a chuck 26 provided at the tip of the rod 26a.
c and an actuator 26d such as a cylinder or a motor for driving the chuck 26c to open and close (see FIG. 13). The shape of the grip portion of the chuck 26c is the supply member 24.
The supply member 24 can be grasped by the closing operation.

The rotary head 27 is shown in FIG. 11 and FIGS.
As shown in FIG.
2 is arranged in front. The rotary head 27 is provided at 90 ° intervals on a shaft 27a, three disks 27b, 27c, and 27d fixed to the shaft 27a at intervals above and below, and peripheral surfaces of the upper and center disks 27b and 27c. A projecting mounting pin 27e, cylinders 27f arranged on the upper surface of the lower disk 27d at intervals of 90 degrees corresponding to the mounting pins 27e, and suction nozzles 27h connected to rods 27g of the cylinders 27f. , A motor 27i for driving the shaft 27a to rotate in the forward and reverse directions.

The directions of the three disks 27b, 27c and 27d are horizontal, and the four disks 27b, 27c and 27d are arranged on the lower disk 27d.
The directions of the two cylinders 27f are also horizontal. Each cylinder 2
Suction nozzle 27h connected to rod 27g of 7f
Is also horizontal, and as shown in FIG.
7 h faces the insertion port 24 c of the supply member 27 attached to the rotary head 27 at a predetermined interval.

Each mounting pin 27e has a sharpened shape, and has an annular concave portion on its outer peripheral surface with which a ball 24f provided in a mounting hole 24d of the supply member 24 engages.
As shown in FIG. 13, the lower end of the shaft 27a and the motor 27i are disposed in the base 21, and a bearing 22a is interposed between the base 21 and the shaft 27a. Although illustration is omitted, piping from an air circuit equipped with a vacuum pump and the like is connected to the intake and exhaust ports of the cylinder 27f and the suction nozzle 27h. Each cylinder 27
f moves the rod 27g by positive pressure or negative pressure, and each suction nozzle 27h performs component suction by negative pressure.

The movable table 31 is composed of a well-known XY table, and is arranged outside the head 27 in a direction in which the support surface 31a is vertical as shown in FIG. A large number of suction holes (not shown) are provided on the support surface 31a of the movable table 31.
The substrate 32 can be held in close contact with the support surface 31a by applying the same negative pressure to the suction hole as in the suction nozzle 27h.

The substrate 32 is provided on the support surface 11 of the movable table 31.
a component mounting surface 32a of the substrate 32 is also vertical in this state, and the component mounting surface 32a is connected to the supply member 2 mounted on the rotary head 27 as shown in FIG.
7 with a predetermined interval.

Here, the operation of the apparatus according to the fourth embodiment will be described.

In a state where the supply member 24 is not mounted on the rotary head 27 (see FIG. 10), first, the unit rack 22 is moved by the rack moving mechanism 25 so that the supply member 24 to be mounted first is mounted on the unit mounting mechanism. 26 and the chuck 26c. Then, the rod 26a of the unit mounting mechanism 26 is advanced, and when the chuck 26c in the open state contacts the supply member 24, the chuck 2
6c is closed and the supply member 24 is grasped, and the rod 26a
Is advanced and the supply member 24 is extracted from the unit rack 22.

When the rod 26a of the unit mounting mechanism 26 is further advanced, as shown in FIG.
The two mounting holes 24d are simultaneously fitted into the two mounting pins 27e of the rotary head 27. The attachment of the supply member 24 to the rotary head 27 is completed when the spring-biased ball 24f engages with the annular concave portion of the attachment pin 27e. When the supply member 24 is mounted on the rotary head 27, the insertion opening 24c of the supply member 24 and the suction nozzle 27h provided on the rotary head 27 have the same center line. After the mounting is completed, the chuck 26c of the unit mounting mechanism 26 is opened, the rod 26a is retracted, and the chuck 26c is returned to the initial position.

After attaching the first supply member 24, the rotary head 27 is rotated by 90 degrees by the motor 27i. At the same time, as described above, the supply member 24 to be mounted second by moving the unit rack 22 by the rack moving mechanism 25 is moved to the chuck 26 of the unit mounting mechanism 26.
c, the rod 26a of the unit mounting mechanism 26 is advanced, the supply member 24 is gripped by the chuck 26c, and the rod 26a is advanced further, and the supply member 24 is pulled out of the unit rack 22 and pulled out. The two mounting holes 24d of the supply member 24 are fitted and mounted on the two mounting pins 27e of the rotary head 27. After the mounting is completed, the chuck 26c of the unit mounting mechanism 26 is opened and the rod 2
6a is retracted, and the chuck 26c is returned to the initial position. In the same manner, the third and fourth supply members 2
4 is also mounted on the rotary head 27 in order.

In the state where the four supply members 24 are mounted on the rotary head 27 as shown in the illustrated example, up to four types of electronic components P can be selectively mounted on the component mounting surface 32 a of the substrate 32. is there.

When the electronic component P housed in one supply member 24 is mounted on the substrate 32, as shown in FIG.
And the movable table 31 is appropriately moved to align the component mounting position.

Then, as shown in FIG. 14, the suction nozzle 27h subjected to the negative pressure is connected to the rod 27 of the cylinder 27f.
Advance by g. Thereby, the suction nozzle 27h
Is inserted into the insertion port 24c of the supply member 24, and the lowest electronic component P in the passage 24a is pushed out from the discharge port 24b while being sucked by the suction nozzle 27h.

Since the direction of the component mounting surface 32a of the substrate 32 is vertical and the moving direction of the suction nozzle 27h is horizontal, the electronic components P pushed out by the suction nozzle 27
Is the component mounting surface 32 from a direction orthogonal to the component mounting surface 32a.
Approaching toward a.

A viscous joining material (not shown) such as cream solder is applied in advance to the component mounting position on the component mounting surface 32a, for example, a conductor such as a land, so that it approaches the component mounting surface 32a. When the electronic component P reaches the bonding material, it adheres to the substrate 32 side.

The forward stroke of the suction nozzle 27 h is determined by the component mounting surface 32 a of the substrate 32 and the discharge port 24 of the supply member 24.
Since the electronic component P can be set in advance in accordance with the interval from b, the electronic component P is not pressed against the substrate 32 with an excessive pressure.

Thereafter, the negative pressure acting on the suction nozzle 27h is released or switched to a positive pressure, and then the suction nozzle 27h is retracted by the rod 27g of the cylinder 27f to return to the initial position. Suction nozzle 27h
Escapes from the insertion port 24c, the entire electronic component P in the passage 24a descends by its own weight, and the subsequent electronic component P stops at the position of the discharge port 24b.

When the electronic component P housed in the supply member 24 different from the above is mounted on the substrate 32, the rotary head 27 is rotated so that the target supply member 24 faces the substrate 32 in the same manner as described above. At the same time, the movable table 31 is appropriately moved and the component mounting position is adjusted.
The suction nozzle 27h applied with the negative pressure may be advanced by the rod 27g of the cylinder 27f and inserted into the insertion port 24c of the supply member 24. Since a plurality of electronic components P are stored in each of the four supply members 24, component mounting can be repeatedly performed by selectively using the four supply members 24 until these storage components P are exhausted.

Since the electronic component P is extremely small and light, even if the suction nozzle 27h is returned to the initial position after the electronic component P has adhered to the substrate 32,
Even when the movable table 7 and the movable table 31 are moved, the mounted electronic component P does not fall off the substrate 32.

When replacing the supply member 24 mounted on the rotary head 27 with another supply member 24 held on the unit rack 22, in other words, when mounting a different type of electronic component P on the substrate 32 The rotating head 27 is rotated so that the supply member 24 to be replaced faces the unit rack 22, and at the same time, the supply member 2
The unit rack 22 is moved by the rack moving mechanism 25 such that the holding position of the unit rack 22 faces the holding position of the unit rack 22. Then, the rod 26a of the unit mounting mechanism 26 is advanced, and the chuck 26c in the open state is
Then, the chuck 26c is closed and the supply member 24 is gripped. Then, the rod 2 of the unit mounting mechanism 26
6a, the supply member 24 to be replaced is removed from the rotary head 27, and when the supply member 24 is held by the unit rack 22, the unit mounting mechanism 2
The chuck 26c of No. 6 is opened to retreat the rod 26c,
The chuck 26c is returned to the initial position.

Then, the unit rack 22 is moved by the rack moving mechanism 25, and the supply member 24 to be mounted on the rotary head 27 is moved to the chuck 26 of the unit mounting mechanism 26.
c, the rod 26a of the unit mounting mechanism 26 is advanced, the supply member 24 is gripped by the chuck 26c, and the rod 26a is advanced further, and the supply member 24 is pulled out of the unit rack 22 and pulled out. The two mounting holes 24d of the supply member 24 are fitted and mounted on the two mounting pins 27e of the rotary head 27. After the mounting is completed, the chuck 26c of the unit mounting mechanism 26 is opened and the rod 2
6a is retracted, and the chuck 26c is returned to the initial position.

By the way, when the supply member 24 is extracted from the unit rack 22 by the unit mounting mechanism 26, when the supply member 24 is returned to the unit rack 22 and held, or when the supply member 24 is mounted on the rotary head 27. And when the supply member 24 is removed from the rotary head 27, when the electronic component P is extruded from the supply member 24 mounted on the rotary head 27 and mounted on the substrate 32, or when other positioning is performed. A well-known optical detection device, for example, an image processing device using an optical switch or a camera is appropriately used.

As described above, according to the fourth embodiment, the direction of the component mounting surface 32a of the board 32 is vertical, and the component mounting surface 32a is perpendicular to the perpendicular component mounting surface 32a.
The electronic component P can be mounted on the component mounting surface 32a by approaching the electronic component P toward.

That is, the operation of mounting the electronic component P on the board 32 can be performed in a space-saving manner as compared with the case where the electronic component is lowered from above toward the component mounting surface of the board in a horizontal state. It is possible to meet the recent demand for space saving.

Further, since a mechanism capable of mounting the electronic component P on the substrate 32 by simply pushing out the electronic component P from the discharge port 24b of the supply member 24 constituting the component supply unit 23 is employed. The compactness can greatly contribute to the space saving described above.

Further, since a plurality of supply members 24 (component supply units 23) are mounted on the rotary head 27,
By appropriately rotating the rotary head 27, the supply member 2
By performing the selection of 4, the desired electronic component P can be mounted on the substrate 32.

Furthermore, the supply member 24 mounted on the rotary head 27 can be arbitrarily exchanged with another supply member 24 held on the unit rack 22.
Even when there are many types of electronic components P to be mounted on the board 32, the components can be accurately mounted on the board 32, and even if the type of the board 32 changes, the components can be accurately mounted on the board 32.

Further, the replacement of the supply member 24 can be performed during the mounting of the components, and the mounting of the components does not need to be interrupted for this replacement. Nor.

In the fourth embodiment, the supply member 2
4 is stopped at the position of the discharge port 24b by utilizing the weight of the electronic component P above the lowermost electronic component P. However, FIG. 5 (A), FIG. 5 (B) or FIG. 5
The lowest electronic component P may be held by using the component holding means shown in FIG.

In the fourth embodiment, the passage 24
Although the electronic component P at the position of the discharge port 24b in the area a is extruded in the same posture and mounted on the substrate 32, it is necessary to change the direction of the electronic component P when mounting the electronic component P on the substrate 32. At times, the suction nozzle rotating mechanism shown in FIG. 6 may be employed.

Further, in the fourth embodiment, the component mounting surface 32a is viewed from a direction orthogonal to the vertical component mounting surface 32a.
The electronic component P is placed closer to the electronic component P to mount the component. However, as in the second and third embodiments, the movable table 31 and the suction nozzle driving cylinder 2 are mounted.
The component mounting may be performed in a state in which the direction such as 7f is inclined.

FIG. 16 shows a structural example corresponding to the second embodiment, in which a supply member 33 constituting a component supply unit is provided.
Has a passage 33a therein which is inclined counterclockwise with respect to a vertical line when mounted on the rotary head 27. A discharge port 33b is formed on one side of the lower end of the passage 33a, and an insertion port 3 is formed on a side opposite to the discharge port 33b.
3c is formed. The cross-sectional shape of the passage 33a is a rectangle slightly larger than the end surface shape of the storage component P, and the opening shape of the outlet 33b is a rectangle slightly larger than the shape of the side surface of the storage component P having the largest area. The opening shape of the insertion port 33c is a circle slightly larger than the outer shape of the suction nozzle 27h.

The suction nozzle driving cylinder 27f is attached to the head 27 in a state where it is tilted counterclockwise with respect to the horizontal line by the same angle as the inclination of the passage 33a of the supply member 33. The movable table 31 is arranged such that its support surface 31a is inclined counterclockwise with respect to a vertical line by the same angle as the inclination of the passage 33a of the supply member 33. Incidentally, in the illustrated example, the supply member 33 is provided.
Of the passage 33a is about 15 degrees in a counterclockwise direction with respect to the vertical line, and the cylinder 27f and the suction nozzle 27h
Is about 15 degrees counterclockwise with respect to the horizontal line. The tilt of the movable table 31 is approximately 15 degrees counterclockwise with respect to the vertical line, and the tilt of the component mounting surface 32a of the substrate 32 is the same.

FIG. 17 shows a structural example corresponding to the third embodiment, in which a supply member 34 constituting a component supply unit is provided.
Has a passage 34a which is inclined clockwise with respect to a vertical line when mounted on the rotary head 27.
A discharge port 34b is formed on one side of the lower end of the passage 34a, and an insertion port 34c is formed on a side opposite to the discharge port 34b.
Are formed. The cross-sectional shape of the passage 34a is a rectangle slightly larger than the end face shape of the storage component P, and the opening shape of the discharge port 34b is a rectangle slightly larger than the shape of the side surface of the storage component P having the largest area. Yes, insertion slot 3
The opening shape of 4c is a circle slightly larger than the outer shape of the suction nozzle 27h.

The suction nozzle driving cylinder 27f is attached to the head 27 in a state where it is inclined clockwise with respect to a horizontal line by the same angle as the inclination of the passage 34a of the supply member 34. The movable table 31 has a support surface 3.
1a is arranged in a state of being inclined clockwise with respect to the vertical line by the same angle as the inclination of the passage 34a of the supply member 34. Incidentally, in the illustrated example, the inclination of the passage 34a of the supply member 34 is approximately 15 degrees clockwise with respect to the vertical line.
Degrees, and the inclination of the cylinder 27f and the suction nozzle 27h is about 15 degrees clockwise with respect to the horizontal line. The tilt of the movable table 31 is approximately 15 degrees clockwise with respect to the vertical line, and the tilt of the component mounting surface 32a of the substrate 32 is the same.

Further, in the fourth embodiment described above, a plurality of supply members 24 are detachably held on the unit rack 22. However, as shown in FIGS. 18 and 19,
If a plurality of storages 35 for supplying the electronic components P to each of the supply members 24 held in the unit rack 22 are provided above the unit rack 22, the supply members 24 can be moved from the rotary head 27 to the unit rack 22. The components can be automatically replenished to the supply member 24 at the timing of returning to.

The storage 35 is a storage room 35a having an upper end opening.
And a lid 35b for opening and closing the upper end opening of the storage chamber 35a.
And a through hole 35c formed at the center of the inclined bottom surface of the storage chamber 35a, and a cylindrical portion 35d formed at the lower end opening of the through hole 35c. In the storage room 35a, a large number of electronic components P of the same type having a prismatic shape are stored in bulk. The details of the electronic component P are as described above with reference to FIGS. 3 (A) to 3 (C). In addition, a chute tube 36 that takes in the electronic components P in the storage room 35a one by one in the length direction and guides the electronic components P downward by its own weight is connected to the through hole 35c. The inner shape of the chute tube 36 is the same as the passage 24 a of the supply member 24. Further, a slit 36a is formed on one side of the lower end portion of the chute tube 36, and a stopper 37 for preventing components from falling from the chute tube 36 is rotatably mounted on the slit 36a. Is biased inward. The storage 35 has a tubular portion 35d removably mounted on a storage holder 22f provided on the upper part of the unit rack 22.
It is inserted and supported by a chute tube holder 22e provided under 5d.

As shown in FIG. 18, the unit holder 23
When the supply member 24 is held by the supply members 24c and 23d, the stopper 37 is pushed to the right in the drawing by the upper end of the supply member 24, whereby the chute tube 36 and the passage 2
4, the electronic component P in the chute tube 36 moves by its own weight into the passage 24 and is supplied. On the other hand, as shown in FIG. 19, the supply member 24 is connected to the unit holders 23c and 23c.
In the state of being pulled out from d, the stopper 37 is rotated to the left side in the figure by the biasing force of the spring, and the lowermost electronic component P in the chute tube 36 is held by the stopper 37 to prevent its fall.

Incidentally, it is possible to provide the storage 35 with the movable pipe 5, the coil spring 5c and the movable pipe driving cylinder 6 in the first embodiment.
By moving the movable pipe 5 up and down to stir the storage component P in the same manner as in the embodiment, the chute tube 3
6 can be facilitated.

Further, in the fourth embodiment, the four supply members 23 are provided around the rotary head 27 at 90-degree intervals.
(Component supply unit 23) is shown,
Five or more supply members 23 may be mounted at intervals smaller than 90 degrees. By increasing the number of supply members 23 mounted on the rotary head 27, the range of component selection can be widened and the frequency of supply member replacement can be reduced. [Fifth Embodiment] FIGS. 20 to 22 show a fifth embodiment of the present invention. 20 to 21, reference numeral 41 is a movable head, 42 is a component supply unit, 51 is a movable table,
52 is a substrate.

The fifth embodiment differs from the first embodiment in that the component supply unit 42 is formed by integrally providing a storage 43 and a suction nozzle driving cylinder 46 in a supply member 45 having a passage 45a. Used, a plurality of component supply units 42 mounted in parallel on the movable head 41, and a desired electronic component P by selectively utilizing the plurality of component supply units 42 mounted on the movable head 41. Can be mounted on the substrate 51.

The movable head 45 is disposed so as to be tilted about 45 degrees counterclockwise with respect to the horizontal line. The movable head 45 can be moved in a direction perpendicular to the direction in which the component supply units 42 are arranged, while maintaining the above-described inclination angle, by an actuator (not shown) such as a cylinder or a motor.

Each component supply unit 42 has a storage 43
, A fixed pipe 44, a supply member 45, a suction nozzle driving cylinder 46, and a suction nozzle 47. Each component supply unit 42 is detachably attached to the upper surface of the movable head 41 such that the discharge port 45b has the same inclination as the movable head 45.

The storage 43 is a storage room 4 having an inclined bottom surface.
3a, and the upper end opening of the storage chamber 43a is openably and closably covered by a lid 43b. Further, a through hole 43c having a circular cross section is formed at the center of the inclined bottom surface of the storage chamber 43a. In the storage room 43a, a large number of electronic components P of the same type having a prismatic shape are stored in bulk. Details of this electronic component P are shown in FIGS.
This is as described above with reference to FIG. By the way, each of the plurality of component supply units 42 mounted on the movable head 41 basically stores different types of electronic components P.

The fixed pipe 44 has an outer shape corresponding to the inner shape of the through hole 43c, and the upper end thereof is
c so as to protrude slightly upward from the upper end of c.
c. The cross-sectional shape of the inner hole of the fixed pipe 44 is a rectangle slightly larger than the end face shape of the storage component P or a circle having a diameter slightly larger than the maximum end face length of the storage component P.

The supply member 45 has therein a passage 45a having a shape in which a vertical portion, a curved portion, and an inclined portion are continuous. The cross-sectional shape of this passage 45a is
It is a rectangle slightly larger than the end face shape of. This passage 4
The upper portion 5a has a portion corresponding to the outer shape of the fixed pipe 44, and the lower portion of the fixed pipe 44 is inserted and arranged in the same portion. A discharge port 45b is formed on one side surface (lower surface side) of the lower end of the passage 45a, and an insertion port 45c is formed on a side surface (upper surface side) opposed to the discharge port 45b. The opening shape of the outlet 45b is a rectangle slightly larger than the shape of the side surface of the storage component P having the largest area. In addition, the insertion port 45c is connected to the rod 46 of the cylinder 46.
A portion slightly larger than the outer shape of the suction nozzle 47 and a portion slightly larger than the outer shape of the suction nozzle 47 are continuously provided. A permanent magnet 45d is embedded in the lower end surface of the passage 45a or a surface adjacent thereto.

The movable pipe driving cylinder 46 is attached to the upper end opening side of the insertion port 45c of the supply member 45 in a state where the cylinder 46 is inclined at an angle of about 45 degrees counterclockwise with respect to the vertical line. Has been inserted into the large part of.

The suction nozzle 47 is connected to the rod 46a of the cylinder 46, and its lower end is inserted into a small portion of the insertion port 45c.

Although illustration is omitted, a pipe from an air circuit provided with a vacuum pump and the like is connected to the suction and exhaust ports of the cylinder 46 and the suction nozzle 47. Cylinder 4
6 moves the rod 46a by positive pressure or negative pressure, and the suction nozzle 47 performs component suction by negative pressure.

The movable table 51 is composed of a well-known XY table, and its support surface 51a is arranged so as to be inclined about 45 degrees counterclockwise with respect to a horizontal line. A large number of suction holes (not shown) are provided on the support surface 51a of the movable table 51.
The substrate 52 can be held in a state in which the substrate 52 is in close contact with the support surface 51a by applying the same negative pressure as the suction nozzle 47 to the suction hole.

The substrate 52 is provided on the support surface 51 of the movable table 51.
a in this state, the component mounting surface 52a of the substrate 52 is tilted approximately 45 degrees counterclockwise with respect to the vertical line, and the component mounting surface 52a
With a predetermined interval.

Here, the operation of the device of the fifth embodiment will be described.

The electronic components P in the storage chamber 43a are taken one by one in the lengthwise direction into the upper end opening of the fixed pipe 44 due to vibration or the like generated when the movable head 41 is moved. The electronic component P taken in the fixed pipe 44 moves downward by its own weight and is taken into the passage 45a. Since the cross-sectional shape of the passage 45a is a rectangle slightly larger than the end surface shape of the storage component P, the electronic component P is in a state where the two side surfaces in the thickness direction and the two side surfaces in the width direction are aligned. Since the electronic component P taken in the passage 45a moves further downward by its own weight, as shown in FIG. 21, a plurality of electronic components P are arranged and stored in the passage 45a in the length direction. The lowermost electronic component P is held by the magnetic force of the permanent magnet 45d and
Stop at position b.

In the state where the four component supply units 42 are mounted on the movable head 41 as shown in the illustrated example, up to four types of electronic components P are selectively supplied to the component mounting surface 52a of the substrate 52.
It can be mounted on

Supply member 4 of one component supply unit 42
When the electronic component P stored in the electronic component 5 is mounted on the substrate 52, the movable head 41 and the movable table 51 are appropriately moved as shown in FIG. Face the component mounting position.

Then, as shown in FIG. 22, the suction nozzle 47 applied with the negative pressure is advanced by the rod 46a of the cylinder 46. As a result, the lowest electronic component P in the passage 45a is pushed out from the discharge port 45b while being sucked by the suction nozzle 47.

The component mounting surface 52a of the board 52 is tilted approximately 45 degrees counterclockwise with respect to the vertical line, and the moving direction of the suction nozzle 47 is tilted approximately 45 degrees counterclockwise with respect to the vertical line. Therefore, the electronic component P pushed out by the suction nozzle 47 approaches the component mounting surface 52a from a direction orthogonal to the component mounting surface 52a.

Since a viscous bonding material (not shown) such as cream solder is applied in advance to the component mounting position on the component mounting surface 52a, for example, a conductor such as a land, the conductor approaches the component mounting surface 52a. The electronic component P adheres to the substrate 52 when reaching the bonding material.

The forward stroke of the suction nozzle 47 can be set in advance in accordance with the distance between the component mounting surface 52a of the substrate 52 and the discharge port 45b of the component supply unit 42. It will not be imposed.

Thereafter, the negative pressure applied to the suction nozzle 47 is released or switched to a positive pressure, and then the suction nozzle 47 is retracted by the rod 46a of the cylinder 46 to return to the initial position. When the suction nozzle 47 returns to the initial position, the entire electronic component P in the passage 45a descends by its own weight, and the subsequent electronic component P stops at the position of the outlet 24b due to the magnetic force of the permanent magnet 45d.

When the electronic component P stored in the supply member 45 of the component supply unit 42 different from the above is mounted on the substrate 52, the movable head 41 and the movable table 51 are appropriately moved in the same manner as described above. , Target component supply unit 4
The suction port 47 of the cylinder 46 may be moved forward by the rod 46a of the cylinder 46 while the second discharge port 45b faces the component mounting position of the substrate 52. Since a large number of electronic components P are stored in the respective storage rooms 43a of the four component supply units 42, the four component supply units 42 remain until the storage P is exhausted.
Can be selectively used to repeatedly mount components.

Since the electronic component P is extremely small and light, even if the suction nozzle 47 is returned to the initial position after the electronic component P has adhered to the substrate 52,
Even when the movable table 51 is moved, the mounted electronic component P does not fall off the substrate 52.

Further, since each component supply unit 42 is detachably mounted on the movable head 41, if these components are detached from the movable head 41 and another component supply unit 42 is mounted, electronic components P of different types can be obtained. It can also be mounted on the substrate 52.

For positioning when the electronic component P is extruded from the component supply unit 42 mounted on the movable head 41 and mounted on the substrate 52, or for other positioning, a well-known optical detecting device, for example, An image processing device using an optical switch or a camera is appropriately used.

As described above, according to the fifth embodiment, the direction of the component mounting surface 52a of the substrate 52 is inclined by about 45 degrees counterclockwise with respect to the horizontal line.
The electronic component P can be mounted on the component mounting surface 52a by approaching the electronic component P toward the component mounting surface 52a from a direction orthogonal to the direction a. Of course, if the inclination angle is within an acute angle range other than 30 degrees, the same component mounting can be performed, and the same component mounting can be performed even when the component is vertical as in the first and fourth embodiments. be able to.

That is, the operation of mounting the electronic component P on the board 52 can be performed in a space-saving manner as compared with the case where the electronic component is lowered from above toward the component mounting surface of the board in a horizontal state. It is possible to meet the recent demand for space saving.

Further, since a mechanism capable of mounting the electronic component P on the substrate 52 by simply pushing out the electronic component P from the discharge port 45b of the supply member 45 constituting the component supply unit 42 is employed. The compactness can greatly contribute to the space saving described above.

Further, since a plurality of component supply units 42 are mounted on the movable head 41, the component supply unit 42 is selected by relatively moving the movable head 41, and a desired electronic component P is placed on the substrate 32. Can be mounted.

In the fifth embodiment, a plurality of component supply units 42 are mounted on the movable head 41 movable in a predetermined direction. However, a plurality of component supply units are mounted on a fixed type head member. Even if 42 is mounted, the same component mounting as described above can be performed based on the movement of the movable table 51.

In the fifth embodiment, the lowest electronic component P in the passage 45a of the component supply unit 42 is stopped at the position of the outlet 45b by the magnetic force of the permanent magnet 45d. B) or the component holding means shown in FIG. 5C may be used to hold the lowest-order electronic component P.

Further, in the fifth embodiment described above, the movable head 41 is provided with the four component sharing units 42 mounted thereon, but five or more units may be mounted. By increasing the number of units mounted on the movable head 41, the range of component selection can be widened and the frequency of unit replacement can be reduced.

Further, in the fifth embodiment, the pipe 44 is provided on the bottom surface of the storage chamber 43a of the component supply unit 42.
The pipe 44 is shown as being fixed, but as in the first embodiment, the pipe 44 is made movable so that it can be moved up and down by an actuator such as a cylinder, or a movable pipe is separately provided outside the fixed pipe 44. If this can be moved up and down by an actuator such as a cylinder, the storage parts P can be agitated by the up and down movement of the pipe to promote the taking of the parts into the passage 45a.

As described above, in the above-described first to fifth embodiments, the object on which the electronic component is arranged is used as the substrate, and the electronic component pushed out from the outlet of the component supply unit is mounted on the substrate. However, the device according to the present invention can also be used as a device for sequentially inserting the electronic components P into the storage recesses 102 of the component packaging tape 101 as shown in FIG. Incidentally, the component packaging tape 101 is formed of resin, paper, or the like, and is used to store the electronic component storage recess 1.
02 at equal intervals in the length direction. Also, a guide hole 103 that can be engaged with a guide pin of a sprocket (not shown) is provided on one side edge or both side edges of the component packaging tape 101.
Are formed at equal intervals in the length direction. Reference numeral 10 in the figure
Reference numeral 3 denotes a cover tape that covers the component packaging tape 101 after component insertion, and the cover tape 103 is fixed to the surface of the component packaging tape 101 by a method such as heat welding.

When a component is inserted into the component packaging tape 101 by the above-described apparatus, the accommodating recess 102 of the component packaging tape 101 that moves intermittently faces the discharge port of the component supply unit at the stop timing.
The electronic component may be pushed out from the outlet of the component supply unit and inserted into the storage recess 102 each time the component packaging tape 101 stops.

In the first to fifth embodiments described above, the electronic component is pushed out from the discharge port by the suction nozzle. However, a device in which a small electromagnet is provided at the lower end of the pressing rod is used instead of the suction nozzle. Even when used, the same component extrusion as described above can be performed. When the gap between the discharge port of the component supply unit and the substrate is small, or when the gap between the discharge port of the component supply unit and the opening of the storage recess of the component packaging tape is small, the suction nozzle may be simply pressed by a rod. The same component mounting and component insertion can be performed.

[0150]

As described in detail above, according to the present invention,
The operation of arranging electronic components on an object such as a substrate or a component packaging tape can be performed in a space-saving manner, and it is possible to respond to the recent demand for space-saving.

[Brief description of the drawings]

FIG. 1 is a side view of an electronic component placement device according to a first embodiment of the present invention.

FIG. 2 is a partially enlarged perspective view of the component supply unit shown in FIG.

FIG. 3 is a perspective view showing a specific example of an electronic component that can be used in the device of the first embodiment.

FIG. 4 is an explanatory diagram of an operation of the device of the first embodiment.

FIG. 5 is a longitudinal sectional view showing a partial modification of the component supply unit shown in FIG. 1;

FIG. 6 is a partial side view showing a structure in which a nozzle rotating mechanism is added to the device of the first embodiment.

FIG. 7 is a partial side view of an electronic component placement device according to a second embodiment of the present invention.

FIG. 8 is a diagram illustrating the operation of the device according to the second embodiment.

FIG. 9 is a partial side view of an electronic component placement device according to a third embodiment of the present invention.

FIG. 10 is a diagram illustrating the operation of the device according to the third embodiment.

FIG. 11 is a perspective view of an electronic component placement device according to a fourth embodiment of the present invention.

12 is a perspective view and a longitudinal sectional view of the component supply unit shown in FIG.

FIG. 13 is a diagram illustrating the operation of the device according to the fourth embodiment.

FIG. 14 is a diagram illustrating the operation of the device according to the fourth embodiment.

FIG. 15 is a diagram illustrating the operation of the device according to the fourth embodiment.

FIG. 16 is a partial side view showing a modification of the component supply unit applicable to the apparatus of the fourth embodiment.

FIG. 17 is a partial side view showing a modification of the component supply unit applicable to the device of the fourth embodiment.

FIG. 18 is a longitudinal sectional view showing a structure in which a storage is arranged in a unit rack of the device of the fourth embodiment.

FIG. 19 is an operation explanatory view of the structure shown in FIG. 18;

FIG. 20 is a perspective view of an electronic component placement device according to a fifth embodiment of the present invention.

21 is a side view of the device shown in FIG. 20.

FIG. 22 is a diagram illustrating the operation of the device according to the fifth embodiment.

FIG. 23 is a perspective view of a component packaging tape showing another example of an object on which electronic components are arranged.

[Explanation of symbols]

P: electronic components, 2: component supply unit, 3: storage, 3
a ... storage chamber, 4 ... supply member, 4b ... passage, 4c ... discharge port, 4d ... insertion port, 5 ... movable pipe, 6 ... movable pipe driving cylinder, 7 ... suction nozzle, 8 ... suction nozzle driving cylinder, 9: suction nozzle rotation motor, 11: movable table, 12: substrate, 12a: component mounting surface, 13: supply member, 13a: passage, 13b: discharge port, 13c: insertion port, 14: supply member, 14a: passage , 14b ... outlet,
14c insertion slot, 22 unit rack, 23 component supply unit, 24 supply member, 24a passage, 24b
Discharge port, 24c: insertion port, 25: rack moving mechanism, 26
... Unit mounting mechanism, 27 ... Head, 27f ... Suction nozzle driving cylinder, 27h ... Suction nozzle, 31 ... Movable table, 32 ... Substrate, 32a ... Component mounting surface, 33 ... Supply member, 33a ... Path, 33b ... Exhaust port , 33c: insertion port, 34: supply member, 34a: passage, 34b: discharge port,
34c insertion slot, 35 storage, 35a storage room, 41
... Movable head, 42 ... Part supply unit, 43 ... Storage, 43a ... Storage room, 45 ... Supply member, 45a ... Pathway,
45b: discharge port, 45c: insertion port, 46: suction nozzle driving cylinder, 47: suction nozzle, 51: movable table, 52: substrate, 52a: component mounting surface.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masaru Aoki 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Electric Power Co., Inc. (72) Taro Yasuda Inventor 6-16-20 Ueno, Taito-ku, Tokyo Taiyo (72) Inventor Koji Saito Inside Taiyo Denki Co., Ltd. 6-16-20 Ueno, Taito-ku, Tokyo

Claims (22)

[Claims] An electronic component is placed in a non-horizontal state at a component placement position of an object on which the electronic component is to be placed, and the electronic component is relatively approached toward the component placement position in the non-horizontal state. A method for arranging electronic components, comprising: 2. The electronic device according to claim 1, wherein the direction of the component arrangement position of the object is vertical, and the electronic component is relatively approached from a direction orthogonal to the perpendicular component arrangement position toward the component arrangement position. Item 2. The electronic component arrangement method according to Item 1. 3. The direction of a component arrangement position of an object is inclined at an acute angle with respect to a vertical line, and the electronic component is relatively approached from a direction orthogonal to the inclined component arrangement position toward the component arrangement position. The electronic component placement method according to claim 1, wherein: 4. An electronic component is forcibly pushed out from an outlet of a component supply passage in a state where an outlet of a component supply passage faces an arrangement position of a component of an object, and the pushed out electronic component is placed on the object. The electronic component placement method according to any one of claims 1 to 3, wherein the electronic component placement method is arranged at a component placement location. 5. The electronic component placement method according to claim 4, wherein the pushing out of the electronic component from the outlet of the component supply passage is performed by a suction nozzle capable of sucking the electronic component. 6. The electronic component placement method according to claim 4, wherein the pushing out of the electronic component from the outlet of the component supply passage is performed by a pressing rod. 7. The electronic component arranging method according to claim 1, wherein the object is a substrate, and the component arranging portion is a component mounting surface of the substrate. 8. The electronic component arranging method according to claim 1, wherein the object is a component wrapping tape, and the component arranging portion is a component housing concave portion of the component wrapping tape. 9. An object having a component placement position, an object support mechanism for supporting the object so that the component placement position is in a non-horizontal state, a passage for supplying electronic components in an aligned state, and a passage in the passage. A component supply unit provided with a discharge port for discharging the electronic components to the outside, the discharge port being provided so as to face the component placement position of the object, and the electronic component being forcibly discharged from the component supply unit discharge port. And a component pushing mechanism for arranging the extruded electronic component at a component arranging location of the object. 10. The direction of component placement of the object supported by the object support mechanism is vertical, and the electronic component approaches the component placement from a direction orthogonal to the vertical component placement. The electronic component placement device according to claim 9, wherein: 11. The direction of a component arrangement position of an object supported by the object support mechanism is inclined at an acute angle with respect to a vertical line, and the electronic component is arranged at a component arrangement position from a direction orthogonal to the inclined component arrangement position. The electronic component placement device according to claim 9, wherein: 12. The component pushing mechanism according to claim 9, further comprising: a pushing tool for pushing out the electronic component from an outlet of the component supply unit, and an actuator for moving the pushing component. An electronic component placement device according to claim 1. 13. The electronic component placement device according to claim 12, wherein the pushing tool is a suction nozzle capable of sucking an electronic component. 14. The electronic component placement apparatus according to claim 13, further comprising an actuator for rotating the suction nozzle as an axis of a center line thereof. 15. The electronic component placement device according to claim 12, wherein the pushing device is a pressing rod. 16. The component supply unit, wherein a storage room for storing a large number of electronic components in a bulk is integrally provided, and a passage communicates with a bottom surface of the storage room. The electronic component placement device according to claim 9. 17. The electronic component placement apparatus according to claim 16, further comprising: a movable member for stirring the electronic component in the storage chamber; and an actuator for moving the movable member. 18. The electronic component placement apparatus according to claim 9, further comprising a head to which a plurality of component supply units can be detachably mounted. 19. The electronic component placement device according to claim 18, wherein the head is movably supported and includes an actuator for moving the head. 20. A rack for detachably holding a plurality of component supply units, and a unit mounting mechanism for mounting the component supply unit from the rack to the head and returning the component supply unit from the head to the rack. The electronic component placement device according to claim 18 or 19, wherein: 21. The object according to claim 9, wherein the object is the substrate, the component placement location is the component mounting surface of the substrate, and the object support mechanism is a movable table capable of holding the substrate. 2. The electronic component placement device according to claim 1. 22. The object, wherein the component arranging portion is a component housing recess of the component wrapping tape, and the object support mechanism is a transport mechanism for transporting the component wrapping tape in a predetermined direction. The electronic component placement device according to claim 9.