JP2020120139A - Picking device of scattering component and picking method of the scattering component - Google Patents

Abstract

To hold a component having various postures with a suction nozzle.SOLUTION: A picking device of a scattering component, comprises: a component support part that supports a plurality of components in a state that they are scattered in various postures; a suction nozzle that sucks and holds each component supported by an upper face of a component support part; a swing device that makes an axial core of the suction nozzle swing at an arbitrary angle; a movement device that makes the suction nozzle move at the arbitrary position of the component support part; and a control device. The control device acquires a posture of a component on the basis of imaging data obtained by imaging each component supported by the upper face of the component support part from an upper direction along a vertical axial line, and the swing device makes the axial core of the suction nozzle swing in accordance with the posture of each component to be acquired, and the suction nozzle of which the axial core is swung sucks and holds each component one by one.SELECTED DRAWING: Figure 12

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a scattered component picking device or the like having a component support portion that supports a plurality of components in a scattered state.

In an apparatus having a component support part that supports a plurality of components in a scattered state, a component holder holds a component supported by the component support part, and the components are aligned and placed at a component supply position. By placing the parts, the parts are supplied. The following patent documents describe a technique of gripping scattered components with a robot hand.

JP, 6-127698, A

According to the technique described in the above patent document, it is possible to hold the scattered components to some extent by the component holders. However, since the components are scattered on the component support in various postures, there is a possibility that the components cannot be properly held by the component holders, specifically, the suction nozzles. The present invention has been made in view of such circumstances, and an object thereof is to hold components in various postures by a suction nozzle.

In order to solve the above problems, a picking device for a scattered component according to the present invention is a component support portion that supports a plurality of components in various postures, and a component that is supported on the upper surface of the component support portion. A suction nozzle that holds the suction nozzle, a swivel device that swivels the axis of the suction nozzle to an arbitrary angle, a moving device that moves the suction nozzle to an arbitrary position on the component support unit, and a control device. The control device acquires the attitude of the part based on imaging data obtained by imaging the part supported on the upper surface of the part supporting portion from above along a vertical axis, and according to the acquired attitude of the part. The swirling device swivels the axis of the suction nozzle, and the suction nozzle with the axis swivels holds the components one by one. Further, the method for picking up scattered parts according to the present invention is a method in which a picking device picks up the parts based on imaging data obtained by imaging a plurality of parts scattered in various postures on a part support portion, The picking device sucks and holds a component supported on the upper surface of the component support portion, a swivel device that swivels the axis of the suction nozzle at an arbitrary angle, and the suction nozzle on the component support portion. A moving device for moving to an arbitrary position of, and a step of acquiring an upward surface of the component to be suction-held on the basis of imaging data; After the step of turning the axis of the suction nozzle so that the axis of the nozzle and the upward surface of the component are at a right angle, and the step of turning the axis of the suction nozzle, the moving device moves the suction nozzle. Is moved, and the suction nozzle sucks the upward surface.

In the scattered component picking device and the like according to the present invention, the posture of the component supported on the upper surface of the component support portion is acquired based on the imaging data, and the swivel device rotates the axis of the suction nozzle according to the acquired posture of the component. The suction nozzle that swivels the core and swivels the shaft core holds the components one by one. As a result, it is possible to hold the components in various postures by the suction nozzle.

It is a perspective view showing a component mounter. It is a perspective view showing a component mounting device of a component mounter. It is a perspective view showing a bulk component supply device. It is a perspective view which shows a component supply unit. It is a perspective view showing a parts supply unit in a state where a parts collection container was raised to a rising end position. It is a perspective view which shows a component holding head. It is a figure which shows a chuck. It is a figure which shows the component receiving member in the state where the lead components were stored. It is a block diagram showing a control device of a component mounter. It is a perspective view showing a parts scattered state realization device. It is a figure which shows the component support member in the state in which several lead components were scattered. It is a figure which shows the component support member in the state in which several lead components were scattered. It is a figure which shows the chuck which hold|maintains a lead component. It is a figure which shows notionally the comparison table of a lead component. It is a figure which shows the component support member in the state in which the some electronic circuit component was scattered. It is a figure which shows notionally the comparison table of an electronic circuit component. It is a perspective view showing a parts scattered state realization device and a parts returning device.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

<Component mounter configuration>
FIG. 1 shows a component mounter 10. The component mounter 10 is a device for executing a component mounting operation on the circuit substrate 12. The component mounter 10 includes an apparatus main body 20, a base material transfer/holding device 22, a component mounting device 24, imaging devices 26 and 28, a component supply device 30, a bulk component supply device 32, and a control device (see FIG. 9) 34. There is. The circuit substrate 12 may be a circuit board, a substrate having a three-dimensional structure, or the like, and the circuit substrate may be a printed wiring board, a printed circuit board, or the like.

The apparatus main body 20 includes a frame portion 40 and a beam portion 42 mounted on the frame portion 40. The substrate transfer/holding device 22 is disposed in the center of the frame portion 40 in the front-rear direction and has a transfer device 50 and a clamp device 52. The carrying device 50 is a device for carrying the circuit substrate 12, and the clamp device 52 is a device for holding the circuit substrate 12. As a result, the base material carrying/holding device 22 carries the circuit base material 12 and fixedly holds the circuit base material 12 at a predetermined position. In the following description, the transport direction of the circuit substrate 12 is referred to as the X direction, the horizontal direction perpendicular to that direction is referred to as the Y direction, and the vertical direction is referred to as the Z direction. That is, the width direction of the component mounter 10 is the X direction, and the front-back direction is the Y direction.

The component mounting device 24 is disposed on the beam portion 42 and has two work heads 60 and 62 and a work head moving device 64. Each of the work heads 60 and 62 has a component holder (see FIG. 2) 66 such as a chuck and a suction nozzle, and the component holder 66 holds the component. Further, the work head moving device 64 has an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. Then, the X-direction moving device 68 and the Y-direction moving device 70 move the two work heads 60 and 62 integrally to an arbitrary position on the frame portion 40. Further, as shown in FIG. 2, the work heads 60 and 62 are detachably attached to sliders 74 and 76, and the Z-direction moving device 72 individually moves the sliders 74 and 76 in the vertical direction. That is, the work heads 60 and 62 are individually moved in the vertical direction by the Z-direction moving device 72.

The imaging device 26 is attached to the slider 74 in a state of facing downward, and is moved together with the work head 60 in the X direction, the Y direction, and the Z direction. Thereby, the imaging device 26 images an arbitrary position on the frame section 40. As shown in FIG. 1, the image pickup device 28 is arranged between the base material carrying and holding device 22 on the frame portion 40 and the component supply device 30 so as to face upward. As a result, the imaging device 28 images the components held by the component holder 66 of the work heads 60 and 62.

The component supply device 30 is arranged at one end of the frame portion 40 in the front-rear direction. The component supply device 30 has a tray-type component supply device 78 and a feeder-type component supply device (not shown). The tray-type component supply device 78 is a device that supplies components placed on the tray. The feeder-type component supply device is a device that supplies components using a tape feeder (not shown) and a stick feeder (not shown).

The bulk component supply device 32 is arranged at the other end of the frame portion 40 in the front-rear direction. The discrete component supply device 32 is a device that aligns a plurality of components in a scattered state and supplies the components in the aligned state. In other words, it is a device that aligns a plurality of components in arbitrary postures in a predetermined posture and supplies the components in a predetermined posture. The configuration of the component supply device 32 will be described in detail below. Examples of components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, solar cell components, and power module components. Further, electronic circuit parts include parts with leads and parts without leads.

As shown in FIG. 3, the bulk component supply device 32 includes a main body 80, a component supply unit 82, an imaging device 84, and a component delivery device 86.

(A) Component Supply Unit The component supply unit 82 includes a component supplier 88, a component scattered state realizing device 90, and a component returning device 92, and these component feeder 88, a component scattered state realizing device 90, and a component returning device 92. Are integrally configured. The component supply unit 82 is detachably assembled to the base 96 of the main body 80, and in the bulk component supply device 32, the five component supply units 82 are arranged in a line in the X direction.

(I) Component Feeder As shown in FIG. 4, the component feeder 88 includes a component container 100, a housing 102, and a grip 104. The component container 100 is generally in the shape of a rectangular parallelepiped and has an open upper surface and a front surface. The bottom surface of the component storage container 100 is an inclined surface 116, and is inclined toward the front surface of the component storage container 100 which is open.

The housing 102 has a pair of side walls 120, and the component storage container 100 is swingably held between the pair of side walls 120. Further, an inclined plate 152 is fixedly disposed between the pair of side walls 120 so as to be located in front of the lower end portion of the front surface of the component storage container 100. The inclined plate 152 is inclined so that it descends as it goes forward.

The grip 104 is disposed at the rear end of the housing 102, and is composed of a fixed grip member 170 and a movable grip member 172. The movable gripping member 172 can approach and separate from the fixed gripping member 170. The movable gripping member 172 is connected to the rear surface of the component container 100 by a connecting arm (not shown). As a result, when the grip 104 is gripped, the movable gripping member 172 approaches and separates from the fixed gripping member 170, and the component container 100 swings between the pair of side walls 120.

Further, the component feeder 88 is arranged between the pair of side frame portions 190 assembled to the base 96, and is attachable to and detachable from the base 96. A lock mechanism (not shown) is provided at the lower end of the movable grip member 172 of the grip 104, and when the grip 104 is gripped, the lock mechanism is released. That is, when the operator holds the grip 104 of the component supply device 88 and lifts the component supply device 88, the component supply device 88 is removed from between the pair of side frame portions 190.

(Ii) Component scattered state realizing device The component scattered state realizing device 90 includes a component supporting member 220, a component supporting member moving device 222, and a feeder vibrating device 224. The component support member 220 has a generally long plate shape, and is arranged so as to extend forward from below the inclined plate 152 of the component feeder 88. Side wall portions 228 are formed on both side edges of the component support member 220 in the longitudinal direction.

The component support member moving device 222 is a device that moves the component support member 220 in the front-rear direction by driving an electromagnetic motor (see FIG. 9) 223. As a result, the component support member 220 moves in the front-rear direction slightly below the lower end of the inclined plate 152 of the component feeder 88 with the upper surface of the component support member 220 being horizontal.

The feeder vibrating device 224 includes a cam member 240, a cam follower 242, and a stopper 244. The cam member 240 has a plate shape and is fixed to the outer side surface of the side wall portion 228 so as to extend in the front-rear direction. A plurality of teeth 245 are formed on the upper end of the cam member 240 at equal intervals in the front-rear direction. The cam follower 242 includes a lever 252 and a roller 254. The lever 252 is arranged at the lower end of the side wall 120 of the component feeder 88 and is swingable around the upper end. The roller 254 is rotatably held at the lower end of the lever 252. The lever 252 is biased forward by the elastic force of a coil spring (not shown). The stopper 244 is provided on the side wall 120 in a protruding shape, and the lever 252 biased by the elastic force of the coil spring is in contact with the stopper 244.

(Iii) Component Return Device As shown in FIG. 5, the component return device 92 includes a container elevating device 260 and a component recovery container 262. The container elevating/lowering device 260 includes an air cylinder 266 and an elevating/lowering member 268, and the elevating/lowering member 268 moves up and down by the operation of the air cylinder 266. The air cylinder 266 is fixed to the front end of the component support member 220. As a result, the air cylinder 266 moves in the front-rear direction together with the component support member 220 by the operation of the component support member moving device 222.

The component collection container 262 is arranged on the upper surface of the elevating member 268, and moves in the vertical direction by the operation of the air cylinder 266. The component collection container 262 has a box shape with an open upper surface, and is rotatably held on the upper surface of the elevating member 268. As shown in FIG. 4, a projecting pin 272 is arranged at the rear end of the component collection container 262. The projecting pin 272 projects outward on the side of the component collection container 262. An engagement block 274 is fixed to the inside of the upper end portion on the front side of the side frame portion 190. Then, as shown in FIG. 5, when the component collection container 262 moves up to the rising end position by the operation of the air cylinder 266, the projecting pin 272 engages with the engagement block 274. As a result, the component collection container 262 rotates.

(B) Imaging Device The imaging device 84 includes a camera 290 and a camera moving device 292, as shown in FIG. The camera moving device 292 includes a guide rail 296 and a slider 298. The guide rail 296 is fixed to the main body 80 so as to extend in the width direction of the bulk component feeder 32 above the component feeder 88. The slider 298 is slidably attached to the guide rail 296, and slides to an arbitrary position by the operation of the electromagnetic motor (see FIG. 9) 299. The camera 290 is attached to the slider 298 in a state of facing downward.

(C) Component Delivery Device As shown in FIG. 3, the component delivery device 86 includes a component holding head moving device 300, a component holding head 302, and two shuttle devices 304.

The component holding head moving device 300 includes an X-direction moving device 310, a Y-direction moving device 312, and a Z-direction moving device 314. The Y-direction moving device 312 has a Y slider 316 arranged above the component supply unit 82 so as to extend in the X direction. The Y slider 316 is driven by an electromagnetic motor (see FIG. 9) 319. , Move to any position in the Y direction. The X-direction moving device 310 has an X-slider 320 arranged on the side surface of the Y-slider 316, and the X-slider 320 is moved to an arbitrary position in the X-direction by driving an electromagnetic motor (see FIG. 9) 321. Moving. The Z-direction moving device 314 has a Z slider 322 arranged on the side surface of the X slider 320, and the Z slider 322 is moved to an arbitrary position in the Z direction by driving an electromagnetic motor (see FIG. 9) 323. Moving.

As shown in FIG. 6, the component holding head 302 includes a head body 330, a component holder 332, a holder turning device 334, and a holder rotating device 335. The head body 330 is formed integrally with the Z slider 322. The component holder 332 holds components and is detachably attached to the lower end of the holder 340. The component holder 332 includes a suction nozzle 332a and a chuck 332b. The suction nozzle 332a has a suction pipe 336 at the lower end portion, and the component is suction-held at the tip of the suction pipe 336. Further, the chuck 332b includes a main body portion 337 and a pair of claw portions 338, as shown in FIG. The pair of claw portions 338 are arranged so as to extend downward from the lower surface of the main body portion 337, and slide so that they can approach and separate from each other. As a result, the chuck 332b holds the parts by the pair of claws 338 by bringing the pair of claws 338 close to each other, and separates the pair of claws 338 by the pair of claws 338. Remove the parts from between. The holder 340 is bendable on the support shaft 344, and the holder 340 is bent 90 degrees upward by the operation of the holder turning device 334. As a result, the component holder 332 attached to the lower end of the holder 340 turns 90 degrees and is positioned at the turning position. That is, the component holder 332 is swung between the non-turning position and the turning position by the operation of the holding tool turning device 334. Further, the holder rotating device 335 rotates the component holder 332 about its axis.

Further, as shown in FIG. 3, a holder station 350 is arranged on the upper surface of the base 96. A plurality of types of suction nozzles 332 a and a plurality of types of chucks 332 b are housed in the holder station 350, and the suction nozzle 332 a or the chuck 332 b mounted on the holder 340 of the component holding head 302, and the holder station 350. The suction nozzle 332a or the chuck 332b housed in the cartridge is exchanged by the operation of the holder station 350 and the component holding head moving device 300.

As shown in FIG. 3, each of the two shuttle devices 304 includes a component carrier 388 and a component carrier moving device 390, and is fixed to the main body 80 laterally side by side in front of the component supply unit 82. Has been done. Five component receiving members 392 are mounted on the component carrier 388 so as to be aligned in a row in the lateral direction, and the components are placed on the respective component receiving members 392.

Specifically, as shown in FIG. 8, the component supplied by the bulk component supply device 32 is an electronic circuit component having a lead (hereinafter sometimes abbreviated as “lead component”) 410, and the lead component 410 is It is composed of a block-shaped component body 412 and two leads 414 protruding from the bottom surface of the component body 412. A component receiving recess 416 is formed in the component receiving member 392. The component receiving recess 416 is a step-shaped recess, and is composed of a main body receiving recess 418 opening on the upper surface of the component receiving member 392 and a lead receiving recess 420 opening on the bottom surface of the main body receiving recess 418. There is. Then, the lead component 410 is inserted into the component receiving recess 416 with the lead 414 facing downward. As a result, the lead 414 is placed in the component receiving recess 416 while the lead 414 is inserted in the lead receiving recess 420 and the component body 412 is inserted in the body receiving recess 418.

Further, as shown in FIG. 3, the component carrier moving device 390 is a plate-shaped long member, and is arranged on the front side of the component supply unit 82 so as to extend in the front-rear direction. A component carrier 388 is provided on the upper surface of the component carrier moving device 390 so as to be slidable in the front-rear direction, and is slid to an arbitrary position in the front-rear direction by driving an electromagnetic motor (see FIG. 9) 430. When the component carrier 388 slides in the direction of approaching the component supply unit 82, it slides to the component receiving position located within the movement range of the component holding head 302 by the component holding head moving device 300. On the other hand, when the component carrier 388 slides away from the component supply unit 82, the component carrier 388 slides to the component supply position located within the movement range of the work heads 60 and 62 by the work head moving device 64.

Further, as shown in FIG. 9, the control device 34 includes an overall control device 450, a plurality of individual control devices (only one is shown in the figure) 452, an image processing device 454, and a storage device 456. Including. The overall control device 450 is mainly composed of a computer, and is connected to the base material conveying and holding device 22, the component mounting device 24, the image pickup device 26, the image pickup device 28, the component supply device 30, and the bulk component supply device 32. ing. As a result, the overall control device 450 centrally controls the substrate transfer/holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the bulk component supply device 32. The plurality of individual control devices 452 are mainly configured by a computer, and are provided in the substrate transfer/holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the bulk component supply device 32. Correspondingly provided (only the individual control device 452 corresponding to the bulk component supply device 32 is shown in the figure). The individual control device 452 of the bulk component supply device 32 is connected to the component scattered state realizing device 90, the component returning device 92, the camera moving device 292, the component holding head moving device 300, the component holding head 302, and the shuttle device 304. Thereby, the individual control device 452 of the bulk component supply device 32 controls the component scattered state realizing device 90, the component returning device 92, the camera moving device 292, the component holding head moving device 300, the component holding head 302, and the shuttle device 304. .. The image processing device 454 is also connected to the imaging device 84 and processes the imaging data captured by the imaging device 84. The image processing device 454 is connected to the individual control device 452 of the bulk component supply device 32. Thereby, the individual control device 452 of the bulk component supply device 32 acquires the imaging data imaged by the imaging device 84. The storage device 456 stores various data and is connected to the individual control device 452. Thereby, the individual control device 452 acquires various data from the storage device 456.

<Operation of component mounter>
With the above-described configuration, the component mounter 10 performs the component mounting operation on the circuit substrate 12 held by the substrate transfer/holding device 22. Specifically, the circuit substrate 12 is transported to the work position, and is fixedly held at that position by the clamp device 52. Next, the imaging device 26 moves above the circuit board 12 and images the circuit board 12. As a result, information regarding the error in the holding position of the circuit substrate 12 is obtained. Further, the component supply device 30 or the bulk component supply device 32 supplies the components at a predetermined supply position. The supply of parts by the loose parts supply device 32 will be described later in detail. Then, one of the work heads 60 and 62 moves above the component supply position, and the component holder 66 holds the component. Next, the work heads 60 and 62 holding the components move above the image pickup device 28, and the image pickup device 28 picks up an image of the component held by the component holder 66. As a result, information about the error in the holding position of the component can be obtained. Then, the work heads 60 and 62 holding the components move above the circuit substrate 12 and correct the components held therein by correcting the error in the holding position of the circuit substrate 12 and the error in the holding position of the component. , Mounted on the circuit substrate 12.

<Operation of the loose parts supply device>
(A) Supply of Lead Components by the Bulk Component Supply Device In the bulk component supply device 32, the lead component 410 is loaded into the component storage 100 of the component feeder 88 by an operator, and the loaded lead component 410 is a component. By the operation of the supply unit 82 and the component delivery device 86, the components are supplied in a state of being placed on the component receiving member 392 of the component carrier 388. Specifically, the worker inserts the lead component 410 from the opening on the upper surface of the component container 100 of the component supplier 88. At this time, the component support member 220 is moved below the component supplier 88 by the operation of the component support member moving device 222, and the component recovery container 262 is located in front of the component supplier 88.

The lead component 410 thrown in through the opening on the upper surface of the component container 100 falls on the inclined surface 116 of the component container 100 and spreads on the inclined surface 116. At this time, when the lead component 410 dropped on the inclined surface 116 rolls over the inclined plate 152, it is housed in the component collection container 262 located in front of the component supply unit 88.

After inserting the lead component 410 into the component container 100, the component support member 220 is moved from below the component supply unit 88 to the front by the operation of the component support member moving device 222. At this time, when the cam member 240 reaches the cam follower 242, the roller 254 of the cam follower 242 rides over the teeth 245 of the cam member 240 as shown in FIG. The lever 252 of the cam follower 242 is biased in the forward direction by the elastic force of the coil spring, and the forward bias of the lever 252 is restricted by the stopper 244. Therefore, when the component support member 220 moves forward, the roller 254 and the tooth 245 are kept in mesh with each other, the lever 252 does not rotate forward, and the roller 254 moves to the tooth 245. Get over. At this time, the component feeder 88 moves up and down by overcoming the teeth 245 of the roller 254. That is, with the roller 254 meshing with the tooth 245, the component support member 220 moves forward, so that the roller 254 passes over the plurality of teeth 245 and the component feeder 88 continuously vibrates in the vertical direction. ..

The lead component 410 spreading on the inclined surface 116 of the component container 100 moves forward due to the vibration of the component supplier 88 and the inclination of the inclined surface 116, and the upper surface of the component support member 220 via the inclined plate 152. Is discharged to. At this time, the side wall portion 228 of the component support member 220 prevents the lead component 410 from falling from the component support member 220. Then, as the component support member 220 moves forward, the lead components 410 are scattered on the upper surface of the component support member 220.

When the lead components 410 are scattered on the component supporting member 220 from the inside of the component container 100, the lead components 410 are placed on the component supporting member 220 in various postures as shown in FIGS. 11 and 12. Scattered around. Specifically, the component body 412 of the lead component 410 has a generally rectangular parallelepiped shape, and has six faces. The six surfaces are a bottom surface 500 from which the lead 414 extends, a top surface 502 facing the bottom surface 500, and four side surfaces 504, 506, 508, 510. Then, among these four side surfaces 504, 506, 508, 510, a side surface (hereinafter sometimes referred to as “first side surface”) 504 and a side surface (hereinafter sometimes referred to as “second side surface”) A side surface (hereinafter, sometimes referred to as “third side surface”) 508 and a side surface (hereinafter, sometimes referred to as “fourth side surface”) 510 are opposed to each other. The surface areas of the first side surface 504 and the second side surface 506 are larger than the surface areas of the third side surface 508 and the fourth side surface 510. The lead 414 is bent in an L shape, and is divided into a base end portion 512 extending from the component body 412 and a bent portion 514 bent at a right angle toward the first side surface 504.

When the lead components 410 having such a shape are scattered on the component supporting member 220, the lead components 410 are supported on the component supporting member 220 in two postures. Specifically, a posture in which the first side surface 504 is directed upward (hereinafter, sometimes referred to as “first posture”) and a posture in which the second side surface 506 is directed upward (hereinafter referred to as “second posture”) The lead component 410 is supported on the component support member 220 in any one of the two postures (i.e. This is because the top surface 502, the third side surface 508, and the fourth side surface 510 have small surface areas, and the bottom surface 500 is provided with the leads 414. In the lead component 410 in the first posture, the first side face 504 faces straight up, but in the lead component 410 in the second posture, the second side face 506 faces diagonally upward. This is because the lead 414 is bent toward the first side surface 504. Specifically, the bent portion 514 of the lead 414 is bent beyond the first side surface 504, and in the lead component 410 in the second posture, at the end of the first side surface 504 on the upper surface 502 side and the tip of the bent portion 514. , Is in contact with the upper surface of the component support member 220. Therefore, the first side surface 504 is inclined, and the second side surface 506 facing the first side surface 504 faces obliquely upward.

In the lead components 410 scattered in such a posture, the lead components 410 may not be properly held by one type of component holder 332. More specifically, for example, when a chuck is used as the component holder 332, a pair of claws of the chuck holds the third side surface 508 and the fourth side surface 510 of the lead component 410 so that the chuck leads the lead component. 410 can be gripped. Although the lead component 410 in the second posture is inclined, the third side face 508 and the fourth side face 510 are at right angles to the upper surface of the component support member 220, so that as shown in FIG. It is possible to sandwich the third side surface 508 and the fourth side surface 510 of the lead component 410 by the pair of claw portions 338.

However, as shown in FIG. 11, the lead component 410a and the lead component 410b are scattered close to each other, and the gap between the fourth side surface 510 of the lead component 410a and the fourth side surface 510 of the lead component 410b is extremely small. Very few. Therefore, the claw of the chuck cannot be inserted into the gap between the fourth side surface 510 of the lead component 410a and the fourth side surface 510 of the lead component 410b, and the lead component 410a and the lead component 410b are gripped by the chuck. I can't.

When a suction nozzle is used as the component holder 332, the lead component 410 can be suction-held on the first side face 504 or the second side face 506 facing upward of the lead component 410. Although the second side surface 506 of the lead component 410 in the second posture is inclined, as shown in FIG. 12, the holder swivel device 334 swivels the holder 340 in accordance with the slant angle of the second side surface 506. In addition, the suction nozzle as the component holder 332 is at a right angle to the second side surface 506. Accordingly, the second side surface 506 can be appropriately suction-held by the suction nozzle. However, the lead components 410d are scattered near the side wall portion 228. Therefore, when the component holder 332 is tilted to suck and hold the second side surface 506 of the lead component 410d, the component holder 332 abuts the side wall portion 228, and the lead component 410d is sucked and held by the suction nozzle. I can't.

As described above, in some cases, the lead components 410 scattered in various states cannot be properly held by one type of component holder 332. Therefore, in the bulk component supply device 32, two types of holders, that is, a suction nozzle and a chuck, are set as the component holders 332 for holding the lead components 410. Specifically, as shown in FIG. 14, the storage device 456 of the bulk component supply device 32 stores the type of component, a component holder 332 capable of holding the component, and a component held by the component holder 332. The faces are associated and stored as a comparison table. In this comparison table, the suction nozzle A and the chuck A are set for the lead component 410. Then, in the suction nozzle, the first side surface 504 or the second side surface 506 is set as the holding surface, and in the chuck, the third side surface 508 and the fourth side surface 510 are set as the holding surface.

The holder station 350 accommodates a plurality of types of suction nozzles 332a and a plurality of types of chucks 332b. Of the plurality of types of suction nozzles 332a, a predetermined type of suction nozzle A and a plurality of types of suction nozzles 332a are stored. A predetermined type of chuck A of the types of chucks 332b is stored in the comparison table. Further, even for a component of a different type from the lead component 410, one of a plurality of types of the suction nozzle 332a and the chuck 332b is selected according to the shape, the area, etc. of the suction surface of the component by the suction nozzle 332a and the grip surface of the chuck 332b. Plural types are stored in the comparison table. In addition, one type of suction nozzle 332a or chuck 332b may be set for a plurality of types of parts, and a plurality of types of suction faces or grip faces of a predetermined part may be set. The suction nozzle 332a or the chuck 332b may be set.

Then, when the lead components 410 are scattered on the component supporting member 220, the camera 290 of the image capturing device 84 moves above the component supporting member 220 by the operation of the camera moving device 292, and images the lead components 410. .. Then, based on the imaging data captured by the camera 290 and the comparison table, the component holder capable of holding the lead component 410 (hereinafter, sometimes referred to as “target component holder”) is Specified in. Specifically, first, it is specified that the components scattered on the component support member 220 are the lead components 410 based on the imaging data. Then, the suction nozzle A and the chuck A are specified as the target component holders of the lead component 410 based on the comparison table. Next, since the lead component 410b cannot be held by the chuck A with respect to the lead component 410a, the suction nozzle A is specified as the target component holder. Further, since the lead component 410a cannot hold the lead component 410b with respect to the lead component 410b, the suction nozzle A is specified as the target component holder. Further, since there is no obstacle to holding the lead component 410c, the suction nozzle A and the chuck A are specified as the target component holder. In addition, since the suction nozzle A cannot hold the lead component 410d due to the presence of the side wall portion 228, the chuck A is specified as the target component holder.

In this way, when the target component holder is specified for each of the plurality of lead components on the component support member 220, the lead component 410 is held by the specified target component holder. Specifically, for example, when the suction nozzle A is attached to the holder 340 of the component holding head 302, any one of the lead components 410a, 410b, and 410c has a suction nozzle. Adsorbed and held by A. Further, for example, when the chuck A is mounted on the holder 340 of the component holding head 302, any one of the lead component 410c and the lead component 410d is gripped by the chuck A. In the following description, the case where the component holding head 302 is equipped with the chuck A of the plurality of types of suction nozzles 332a and chucks 332b will be described.

The component holding head 302 to which the chuck A is attached is moved to the upper side of either the lead component 410c or the lead component 410d, and the chuck A grips either the lead component 410c or the lead component 410d. Then, the component holding head 302 is moved above the component carrier 388. At this time, the component carrier 388 is moved to the component receiving position by the operation of the component carrier moving device 390. Further, when the component holding head 302 moves above the component carrier 388, the component holder 332 is pivoted to the pivot position. Further, the component holder 332 is rotated by the operation of the holder rotation device 335 so that the lead 414 of the lead component 410 held by the component holder 332 in the swivel position faces downward in the vertical direction.

When the component holding head 302 moves above the component carrier 388, the lead component 410 with the lead 414 facing downward in the vertical direction is inserted into the component receiving member 392. As a result, the lead component 410 is placed on the component receiving member 392 with the lead 414 facing downward in the vertical direction, as shown in FIG.

Then, when the lead component 410 is placed on the component receiving member 392, the component carrier 388 is moved to the component supply position by the operation of the component carrier moving device 390. The component carrier 388 that has moved to the component supply position is located within the movement range of the work heads 60 and 62, so that the bulk component supply device 32 supplies the lead component 410 at this position. As described above, in the bulk component supply device 32, the lead component 410 is supplied with the lead 414 facing downward and the upper surface 502 facing the bottom surface 500 to which the lead 414 is connected facing upward. Therefore, the component holders 66 of the work heads 60 and 62 can appropriately hold the lead components 410.

Further, while the component holding head 302 moves toward the component carrier 388 to place the lead components 410 on the component receiving member 392, the lead components 410 scattered on the component supporting member 220 may be removed. The camera 290 again captures an image, and the target component holder is identified again for each lead component based on the captured data and the comparison table. That is, every time the component holder 332 holds the lead component 410, the lead component 410 is imaged by the camera 290, and the target component holder is identified for each lead component based on the imaged data and the comparison table. To be done. This is because, when the lead component 410 is held by the component holder 332, the position of the lead component 410 on the component support member 220 may shift. Then, the component holding head 302 mounts the lead component 410 on the component receiving member 392 of the component carrier 388, and then returns to above the component supporting member 220.

When the component holding head 302 is returned above the component support member 220, if there is the lead component 410 whose chuck A is specified as the target component holder, the lead component 410 is gripped by the chuck A. Then, as described above, the grasped lead component 410 is placed on the component receiving member 392. On the other hand, when there is no lead component 410 for which the chuck A is specified as the target component holder, the component holding head 302 is moved above the holder station 350, and the chuck A attached to the holder 340 is held. It is accommodated in the ingredient station 350. Then, of the plurality of types of suction nozzles 332a and chucks 332b housed in the holder station 350, the suction nozzle A is attached to the holder 340. Then, the component holding head 302 is moved above the component support member 220.

When the component holding head 302 is moved above the component support member 220, the lead nozzle 410 for which the suction nozzle A is specified as the target component holder is suction-held by the suction nozzle A. Then, as described above, the grasped lead component 410 is placed on the component receiving member 392. As described above, in the bulk component supply device 32, when the lead component 410 is held by one of the suction nozzle A and the chuck A, and the lead component 410 that can be held by one of the component support member 220 disappears, the suction nozzle is sucked. The lead component 410 is held by the other of A and chuck A. As a result, many lead components 410 scattered on the component support member 220 can be held by the component holder 332.

Further, in the above description, each time the lead component 410 on the component support member 220 is held by the component holder 332, the lead component 410 of the component support member 220 is imaged by the camera 290. It is also possible to sequentially hold the plurality of lead components 410 by the component holder 332. Specifically, when the target component holder is specified for each lead component based on the imaging data and the comparison table, position information for each lead component and information about the target component holder for each lead component (hereinafter, “ "Position/holder information") is stored in the storage device 456.

Then, when the lead component 410 is held by the chuck A attached to the component holding head 302 or the suction nozzle A, the position/holder information stored in the storage device 456 is referred to. As a result, the position of the lead component 410 on the component support member 220 is identified, and the target component holder corresponding to the lead component 410 is identified. Therefore, the lead component 410 whose position is specified based on the position/holder information is held by the component holder 332 specified according to the lead component 410. That is, the lead component 410 is held by the component holder 332 attached to the component holding head 302, and the held component is placed on the component receiving member 392, and thereafter, the image is not taken by the camera 290, Based on the position/holder information stored in the storage device 456, the next lead component 410 is held by the component holder 332 mounted on the component holding head 302. Even after the component holder 332 mounted on the component holding head 302 is replaced with the component holder 332 housed in the holder station 350, the image is not captured by the camera 290 and stored in the storage device 456. The next lead component 410 is held by the replaced component holder 332 based on the determined position/holder information. As a result, it is possible to reduce the number of times the camera 290 captures images.

In addition, the bulk component supply device 32 can supply an electronic circuit component having no lead 414 in addition to the lead component 410. The method of supplying the electronic circuit component 520 having the shape shown in FIG. 15 will be described below. The electronic circuit component 520 has a generally rectangular parallelepiped shape and has six faces. The six surfaces are a top surface 522 having a large surface area, a bottom surface 524 facing the top surface 522, and four side surfaces 526, 528, 530, 532. Then, of these four side surfaces 526, 528, 530, 532, a side surface (hereinafter sometimes referred to as “first side surface”) 526 and a side surface (hereinafter sometimes referred to as “second side surface”) 528 faces each other, and a side surface (hereinafter sometimes referred to as “third side surface”) 530 and a side surface (hereinafter sometimes referred to as “fourth side surface”) 532 face each other. The first side surface 526 and the second side surface 528 are continuous with the long sides of the upper surface 522 and the bottom surface 524, and the third side surface 530 and the fourth side surface 532 are continuous with the short sides of the upper surface 522 and the bottom surface 524.

When the electronic circuit components 520 having such a shape are scattered on the component support member 220 according to the same procedure as that of the lead component 410, the electronic circuit components 520 have a posture with the upper surface 522 or the bottom surface 524 facing upward. Is supported on the component support member 220. This is because the surfaces other than the upper surface 522 and the bottom surface 524, that is, the four side surfaces 526, 528, 530, and 532 have small surface areas.

For the electronic circuit components 520 scattered in such a posture, the comparison table shown in FIG. 16 is stored in the storage device 456. In the comparison table for the electronic circuit component 520, the chuck B and the chuck C are set as the target component holder from the plurality of types of the suction nozzle 332a and the chuck 332b. The pair of claws of the chuck B are arranged relatively close to each other, and the pair of claws of the chuck C are arranged relatively separated from each other. Therefore, in the chuck B, the first side surface 526 and the second side surface 528 are set as holding surfaces, and in the chuck C, the third side surface 530 and the fourth side surface 532 are set as holding surfaces.

Even when the target component holder is specified for each electronic circuit component 520 scattered on the component support member 220 by using the comparison table set in this way, as with the lead component 410, by the camera 290. The component support member 220 is imaged. As a result, the components scattered on the component support member 220 are identified as the electronic circuit components 520 based on the imaging data. Then, based on the comparison table, the chuck B and the chuck C are specified as the target component holders of the electronic circuit component 520. Next, since the electronic circuit component 520a cannot be held by the chuck C with respect to the electronic circuit component 520a, the chuck B is specified as the target component holder. Further, since the electronic circuit component 520a cannot be held by the chuck C with respect to the electronic circuit component 520b, the chuck B is specified as the target component holder. Further, since there is no obstacle to holding the electronic circuit component 520c, the chuck B and the chuck C are specified as the target component holder. Further, since the electronic circuit component 520e cannot be held by the chuck B with respect to the electronic circuit component 520d, the chuck C is specified as the target component holder. Further, since the electronic circuit component 520e cannot be held by the chuck B with respect to the electronic circuit component 520e, the chuck C is specified as the target component holder. Further, since the chuck C cannot hold the electronic circuit component 520f due to the presence of the side wall portion 228, the chuck B is specified as the target component holder.

In this way, when the target component holder is specified for each of the plurality of electronic circuit components 520 on the component support member 220, the electronic circuit component 520 is held by the specified target component holder. The method of holding the electronic circuit component 520 by the target component holder and the method of placing the held electronic circuit component 520 on the component receiving member 392 are the holding method of the lead component 410 and the component receiving of the lead component 410. Since the mounting method on the member 392 is the same as the mounting method, description thereof will be omitted. Even when the electronic circuit component 520 is held, like the lead component 410, the component support member 220 is imaged every time the electronic circuit component 520 is held, and based on the imaged data and the comparison table. The target component holder may be specified, or the target component holder may be specified based on the position/holder information stored in the storage device 456.

(B) Collection of Parts In the bulk component supply device 32, it is possible to collect the lead components 410 or the electronic circuit components 520 scattered on the component support member 220. Specifically, the component support member 220 is moved downward of the component supply unit 88 by the operation of the component support member moving device 222. At this time, as shown in FIG. 17, when the lead components 410 are scattered on the component support member 220, the lead components 410 are blocked by the inclined plate 152 of the component feeder 88 to support the components. The lead component 410 on the member 220 is scraped off inside the component collection container 262.

Next, the component collection container 262 is lifted by the operation of the container lifting/lowering device 260. At this time, as shown in FIG. 5, the projecting pin 272 provided in the component collection container 262 engages with the engaging block 274 provided inside the side frame portion 190. As a result, the component collection container 262 rotates, and the lead component 410 in the component collection container 262 is returned to the inside of the component container 100.

In the bulk component supply device 32, as described above, the lead component 410 is picked up from the component support member 220 by the two types of component holders 332 such as chucks or suction nozzles. Further, the electronic circuit component 520 is picked up from the component support member 220 by the two types of component holders 332 of the chuck B or the chuck C. Therefore, in the bulk component supply device 32, it is possible to reduce the number of lead components 410 or electronic circuit components 520 that are returned to the component container 100.

Then, when the lead component 410 or the electronic circuit component 520 is returned to the component container 100, the operator grips the grip 104 of the component supplier 88 to lock the component supplier 88 as described above. Is released. Then, the operator lifts the component feeder 88, so that the component feeder 88 is removed from between the pair of side frame portions 190. As a result, the lead component 410 is collected from the component supplier 88 outside the bulk component supply device 32.

The individual control device 452 of the component supply device 32 has a determination unit 470, a component holding unit 472, and a storage control unit 474, as shown in FIG. The determination unit 470 is a functional unit for determining the target component holder based on the imaged data and the comparison table. The component holding unit 472 is a functional unit for holding a component by the determined target component holder. The storage control unit 474 is a functional unit for holding the component by the component holder 332 based on the position/holder information stored in the storage device 456.

Further, the present invention is not limited to the above-mentioned embodiments, and can be carried out in various modes in which various modifications and improvements are made based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, all the components on the component support member 220 are picked up based on the position/holder information, but one type based on the position/holder information. Before picking up a component that can be held by the component holder 332 and holding the component by another type of component holder 332, the component support member 220 is imaged again by the camera 290 to obtain new position/holder information. May be created. That is, for example, the lead component 410 is held by the suction nozzle based on the position/holder information stored in the storage device 456. Then, after the suction nozzle is replaced with the chuck, the camera 290 images the component support member 220, and new position/holder information is created based on the imaged data and the comparison table. Then, the lead component 410 may be held by a chuck based on the new position/holder information.

32: Bulk component supply device (component supply system) 84: Imaging device 220: Component support member (component support part) 300: Component holding head moving device (moving device) 302: Component holding head (working head) 332: Component holder (Suction nozzle) (Grip tool) 452: Individual control device (control device) 456: Storage device

Claims (4)

A component support that supports multiple components in various postures in a scattered state,
A suction nozzle that suction-holds the component supported on the upper surface of the component support portion,
A turning device for turning the axis of the suction nozzle at an arbitrary angle,
A moving device that moves the suction nozzle to an arbitrary position on the component support portion,
A control device,
Equipped with
The control device is
The posture of the component is acquired based on image data obtained by capturing an image of the component supported on the upper surface of the component support unit from above along a vertical axis, and the swivel device is configured to perform the suction operation according to the acquired posture of the component. A picking device for scattered parts, characterized in that the axis of the nozzle is swung, and the suction nozzle having the axis swiveled holds the parts one by one. The mobile device is
A horizontal moving device for moving the suction nozzle in the horizontal direction and a vertical moving device for moving the suction nozzle in the vertical direction,
The horizontal movement device,
The picking device for scattered parts according to claim 1, wherein the suction nozzle and the swivel device are moved simultaneously. The vertical movement device,
The picking device for scattered parts according to claim 2, wherein the suction nozzle is moved in the vertical direction by one motor. A method for picking a component by a picking device based on imaged data obtained by imaging a plurality of components scattered in various postures on a component support,
The picking device is
A suction nozzle that suction-holds the component supported on the upper surface of the component support portion,
A turning device for turning the axis of the suction nozzle at an arbitrary angle,
A moving device that moves the suction nozzle to an arbitrary position on the component support portion,
Equipped with
A step of acquiring the upward surface of the component to be suction-held based on the imaged data;
A step of rotating the axis of the suction nozzle so that the turning device has a right angle between the axis of the suction nozzle and the upward surface of the component based on the acquired upward surface;
After the step of rotating the axis of the suction nozzle, the moving device moves the suction nozzle, the suction nozzle sucks the upward surface,
Picking method of scattered parts including.

Images