JP2006120676A - Attaching apparatus for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact apparatus for attaching electronic components that can reduce the attachment time of electronic components and has improved productivity. <P>SOLUTION: The attaching apparatus of electronic components comprises a plurality of heads H, capable of moving to a prescribed position; a head holder 20 for holding the heads H; and an insulating substrate 4 to which electronic components 8 are attached. One head or a plurality of heads in the plurality of heads H are formed by a bulk head 31. The bulk head 31 has a storage section 34a for storing a number of chip electronic components 8, an aligning hole S that is connected to the storage section 34a and aligns the electronic components 8 in a row, and an exhausting port G that is connected to the aligning hole S and discharges the electronic components 8, one by one for attaching the electronic components 8 discharged from the exhausting port G to the insulating substrate 4. Thus, the bulk head 31 can reduce the quantity of motion, when attaching the electronic components 8, can reduce attachment time, and can improve productivity. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component mounting apparatus suitable for manufacturing a circuit board used in various electrical devices.

  FIG. 24 is a front view showing an outline of a conventional electronic component mounting apparatus, FIG. 25 is an explanatory view showing the operation of the conventional electronic component mounting apparatus, and then shows the configuration of the conventional electronic component mounting apparatus. 24 and 25, the head base 52 is fixed to a table 51 that can move in the X and Y directions. The head base 52 also moves in the X and Y directions as the table 51 moves. To move to.

  The two shafts 53 and 54 are attached to the head base 52 so as to be movable in the vertical direction (Z direction), and air cylinders 55 and 56 are arranged above the two shafts 53 and 54, respectively. The air cylinders 55 and 56 move the shafts 53 and 54 in the vertical direction (Z direction).

  Further, the suction head 58 for sucking the electronic component 57 is disposed so as to be movable by the shaft 53, and the dispenser 59 storing the adhesive is disposed so as to be movable by the shaft 54. An insulating substrate 60 for mounting is placed at a predetermined position.

  Next, the operation of the conventional electronic component mounting apparatus having such a configuration will be described. First, the table 51 is moved and the suction head 58 is placed on the electronic component 57 supplied from a feeder (not shown). After being positioned, the suction head 58 is moved downward by the air cylinder 55 to suck the electronic component 57.

  Thereafter, the table 51 is moved in the X and Y directions, and the suction head 58 is moved to a predetermined position on the insulating substrate 60. Then, as shown in FIG. The electronic component 57 is mounted on the insulating substrate 60.

The dispenser 59 moves the table 51 in the X and Y directions to a predetermined position on the insulating substrate 60, and then moves downward along with the shaft 54 by the air cylinder 56, so as to move on the insulating substrate 60. An adhesive is applied to the surface.
(For example, see Patent Document 1)

In the conventional electronic component mounting apparatus, the suction head 58 reciprocates between the electronic component 57 supplied from a feeder (not shown) and a predetermined position on the insulating substrate 60. The momentum of the suction head 58 is large, the mounting time of the electronic component 57 cannot be shortened, and the productivity is deteriorated.
Further, since the table 51 is moved in the X and Y directions to determine the position of the suction head 58, the moving means of the table 51 is expensive and large.

Japanese Examined Patent Publication No. 7-77309

In the conventional electronic component mounting apparatus, the suction head 58 reciprocates between the electronic component 57 supplied from a feeder (not shown) and a predetermined position on the insulating substrate 60. There is a problem that the momentum of the suction head 58 is large, the mounting time of the electronic component 57 cannot be shortened, and the productivity is deteriorated.
Further, since the table 51 moves in the X and Y directions to determine the position of the suction head 58, there is a problem that the moving means of the table 51 is expensive and large.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a small electronic component mounting apparatus that can shorten the mounting time of an electronic component and has high productivity.

  As a first means for solving the above-mentioned problem, a plurality of heads movable to a predetermined position, a head holder for holding the heads, and an insulating substrate on which electronic components are mounted are provided. One or a plurality of the heads are formed of a bulk head, and the bulk head is connected to a storage unit that stores a large number of chip-type electronic components, and the electronic components are arranged in a row. An alignment hole aligned in a state and a discharge port connected to the alignment hole for discharging the electronic components one by one, and the electronic component discharged from the discharge port of the bulkhead is formed on the insulating substrate. It was set as the structure made to mount | wear.

As a second solution, the insulating substrate can move in the X direction, and the head held by the head holder can move in the Y direction perpendicular to the X direction and in the vertical Z direction. It was set as the structure which enabled the movement.
As a third solution, a motor for rotating the head holder is provided, and the motor rotates the head holder with the head.

As a fourth solution, the head is arranged on the circumference of the head holder along the direction in which the rotation axis of the head holder extends.
As a fifth solution, the head holder is configured to be movable in the Z direction with the head.
Further, as a sixth solving means, a linear moving means for moving the head in the Z direction is provided, and the linear moving means is held in the head holder, and the head is moved in the Z direction. It was set as the structure which moved.

  Further, as a seventh solving means, a plurality of first and second linear movement means are provided, and the first linear movement means moves the head in the Z direction quickly, and the second linear movement means. The moving means moves the head in the Z direction at a slower speed than the first linear moving means.

As an eighth solution, the head is configured to be detachable from the head holder.
As a ninth solution, the plurality of heads are arranged at equal intervals of 45 degrees.

  Further, as a tenth solution, at least one of the plurality of heads is formed by a dispenser, and the dispenser stores the cream solder or the adhesive in the storage portion and the insulating substrate on the insulating substrate. A solder nozzle or an application nozzle for applying the adhesive, and the electronic component is attached to the cream solder or the adhesive applied on the insulating substrate by the dispenser; did.

  As an eleventh solution, at least one of the plurality of heads is formed by a suction head, and the suction head is for sucking the electronic component at a predetermined position outside the insulating substrate. The suction head includes a suction nozzle, and the suction head is moved to a predetermined position to suck the electronic component, and then the electronic component is mounted on the insulating substrate.

As a twelfth solution, a plurality of the suction heads are provided, and the plurality of suction heads move simultaneously to the outside of the insulating substrate so as to simultaneously suck the respective electronic components at predetermined positions. The configuration is as follows.
Further, as a thirteenth solution means, a tape member on which a large number of the electronic components are taped is provided, and a plurality of the tape members are arranged side by side.

  An electronic component mounting apparatus according to the present invention includes a plurality of heads movable to a predetermined position, a head holder that holds the heads, and an insulating substrate on which the electronic components are mounted. One or a plurality are formed by a bulkhead, and the bulkhead includes a storage portion that stores a large number of chip-type electronic components, and an alignment hole that is connected to the storage portion and aligns the electronic components in a row. Since the electronic component discharged from the bulkhead discharge port is connected to the alignment hole, and the electronic component discharged from the bulkhead discharge port is mounted on the insulating substrate. The amount of exercise in mounting can be reduced, the mounting time can be shortened, and productivity can be improved.

  In addition, the insulating substrate can move in the X direction, and the head held by the head holder can move in the Y direction perpendicular to the X direction and the Z direction in the vertical direction. The movement to the insulating substrate side and the head side can be dispersed, the moving means can be simplified, the cost can be reduced, and the size can be reduced.

  In addition, the motor has a motor for rotating the head holder, and the motor rotates the head holder with the head, so that the electronic component can be moved to the mounting position with higher accuracy, and the electronic component with higher accuracy. Can be installed.

  Further, since the head is arranged along the direction in which the rotation axis of the head holder extends on the circumference of the head holder, a plurality of heads can be easily arranged.

  Further, since the head holder is movable in the Z direction with the head, the amount of movement of each head in the Z direction can be reduced, and the working efficiency can be improved.

  Also, it has a linear moving means for moving the head in the Z direction, and the linear moving means moves the head in the Z direction while being held by the head holder, so that each head can be moved arbitrarily. What is possible is obtained.

  In addition, a plurality of first and second linear moving means are provided, the first linear moving means moves the head in the Z direction quickly, and the second linear moving means moves the head to the first linear moving means. Since the electronic component can be moved faster by the first linear moving means, the electronic component can be rapidly collided with the insulating substrate or the like by the second linear moving means. This can prevent the electronic components from being damaged.

  Further, since the head can be attached to and detached from the head holder, a head that can be appropriately replaced as required can be obtained.

  Further, since the plurality of heads are arranged at equal intervals of 45 degrees, a large number of heads can be arranged, and a small size and a good working efficiency can be obtained.

  In addition, at least one of the plurality of heads is formed by a dispenser, and the dispenser is used for applying cream solder or adhesive on the insulating substrate and a storage portion for storing cream solder or adhesive. Since the electronic component has an application nozzle and is attached to the cream solder or adhesive applied on the insulating substrate by the dispenser, the step of applying the cream solder or adhesive and the step of attaching the electronic component Can be performed continuously, and a product with good workability can be obtained.

  In addition, at least one of the plurality of heads is formed by a suction head, and the suction head has a suction nozzle for sucking an electronic component located at a predetermined position outside the insulating substrate. Since the electronic component is mounted on the insulating substrate after moving to the position and the electronic component is sucked, it is possible to mount a non-chip type electronic component by the sucking head. Therefore, various electronic components can be mounted by the bulkhead and the sucking head. What can be handled is obtained.

  In addition, a plurality of suction heads are provided, and the plurality of suction heads are moved simultaneously to the outside of the insulating substrate so as to suck each electronic component at a predetermined position at the same time. It is done.

  Also, since the tape member has a tape member on which a large number of electronic components are taped and a plurality of tape members are arranged side by side, the space is small and the tape member can be easily replenished or replaced. .

  FIG. 1 is a front view of an electronic component mounting apparatus of the present invention, FIG. 2 is a plan view of the electronic component mounting apparatus of the present invention, and FIG. 1 is a cross-sectional view taken along line 3-3 of FIG. 1, FIG. 4 is a cross-sectional view taken along line 4-4 of FIG. 1, FIG. 5 is a cross-sectional front view of the principal part of the electronic component mounting apparatus of the present invention, and FIG. FIG. 7 is a right side view of the main part of the electronic component mounting apparatus according to the present invention.

  8 is a perspective view of the suction head according to the electronic component mounting apparatus of the present invention, FIG. 9 is a perspective view of the bulkhead according to the electronic component mounting apparatus of the present invention, and FIG. 10 is the mounting of the electronic component of the present invention. FIG. 11 is an exploded perspective view of a bulk nozzle according to the apparatus, FIG. 11 relates to an electronic component mounting apparatus of the present invention, an explanatory view showing a flow of compressed air in the bulk nozzle, and FIG. 12 relates to an electronic component mounting apparatus of the present invention; It is explanatory drawing which shows the flow of the air suction in a bulk nozzle.

  13 is a plan view showing a state in which a plurality of mounting devices are arranged side by side, and FIG. 14 is related to the electronic component mounting device according to the present invention and mounts electronic components. FIG. 15 relates to the electronic component mounting apparatus of the present invention, FIG. 15 illustrates the second process of mounting the electronic component, and FIG. 16 relates to the electronic component mounting apparatus of the present invention. FIG. 10 is an explanatory view showing a third step of mounting an electronic component.

  FIG. 17 relates to the electronic component mounting apparatus of the present invention. FIG. 18 is a cross-sectional front view of an essential part showing a first step for explaining the mounting process of the electronic component in the suction head, and FIG. FIG. 19 is a cross-sectional plan view of an essential part showing a first step for explaining the mounting process of the electronic component in the suction head according to the mounting device. FIG. 19 relates to the mounting device of the electronic component of the present invention. It is explanatory drawing which shows the 2nd process for demonstrating a mounting process.

  20 is related to the electronic component mounting apparatus of the present invention, and is a cross-sectional perspective view showing the main part of the bulk nozzle and the movement of the chip-type electronic component. FIG. 21 is related to the electronic component mounting apparatus of the present invention. FIG. 22 relates to the electronic component mounting apparatus of the present invention, FIG. 22 illustrates the second operation of the bulk nozzle, and FIG. 23 illustrates the electronic component mounting apparatus of the present invention. FIG. 6 is an explanatory diagram showing a third operation of the bulk nozzle.

  Next, the configuration of the electronic component mounting apparatus according to the present invention will be described with reference to FIGS. 1 to 23. The installation base 1 is formed of a flat metal base placed on an installation desk or the like. 1, a flat table 3 is fixed by a plurality of columnar support members 2.

The transport member 5 for transporting the insulating substrate 4 provided with the wiring pattern is formed by a pair of rails 5a. The transport member 5 is installed on the table 3 and is positioned between the pair of rails 5a. The table 3 is provided with first linear moving means 6 made of a linear motor or the like.
When the insulating substrate 4 transported by the transport member 5 is positioned on the first linear moving means 6, the insulating substrate 4 is sucked and held by the sucking means (not shown), and the first linear moving means 6 It can move in the X direction, which is the direction in which the rail 5a extends.

The holding means 7 is attached to the table 3 at a position orthogonal to the X direction outside the insulating substrate 4, and a plurality of long strip-shaped tape members 9 on which a large number of electronic components 8 are taped are arranged in this holding means 7. It is arranged in the installed state.
Each of the plurality of tape members 9 is attached to the holding means 7, and the electronic components 8 are peeled off one by one from the tape. The peeled electronic components 8 are as shown in FIGS. In addition, in a state of being located outside the insulating substrate 4, it is in a state of being located on one arcuate line S <b> 1.

  The electronic component 8 taped on the tape member 9 may be a chip-type electronic component or an electronic component other than a chip-type component, and the electronic component 8 is supplied sequentially.

  The movable member 10 made of a flat metal has a rectangular hole 10a provided in the center portion and a step-shaped guide portion 10b provided on a pair of opposite sides of the hole 10a. Is mounted so as to be movable in the vertical direction (Z direction) while being supported by a plurality of shaft members 11 fixed to the table 3, and the movable member 10 is a ball screw servo mounted on the side surface of the table 3. By the second linear moving means 12 made of a motor or the like, the movement is fine and slow in the vertical direction (Z direction).

Further, on the upper surface of the movable member 10 disposed on the conveying means 5, a pair of support portions 13, a guide rod 14 stretched between the pair of support portions, and a straight line with the guide rod 14 as a guide. A third linear moving means 15 made of a movable linear motor or the like is attached.
The third linear moving means 15 is movable in the Y direction orthogonal to the X direction.

The holding member 16 made of a metal material is removed from the square-shaped support portion 16a, the plurality of holes 16b provided on the same circumference in the lower plate portion of the support portion 16a, and the side plates facing the support portion 16a. A pair of arm portions 16c projecting in the direction.
The holding member 16 has an arm portion 16c positioned on the guide portion 10b in a state where the square-shaped holding portion 16a faces the hole 10a of the movable member 10, and the side plate of the holding portion 16a is 3 linear movement means 15.

  The holding member 16 is moved in the Y direction by the third linear moving means 15, and when the holding member 16 is moved, the arm portion 16c is guided by the guide portion 10b and moved. The holding member 16 and the third linear moving means 15 are movable in the Z direction together with the movable member 10.

  A rotatable shaft portion 18 is provided between the upper and lower plate portions of the holding portion 16a of the holding member 16, and this shaft portion 18 is a servo type motor 19 attached on the upper plate portion of the holding portion 16a. The shaft 18 and the motor 19 can be moved in the Y direction together with the holding member 16 and can be moved in the Z direction together with the movable member 10. It is possible.

A head holder 20 is attached to the shaft portion 18, and a plurality of heads H are detachably attached to the outer periphery of the head holder 20 at intervals of 45 degrees.
The heads H are arranged on the circumference of the head holder 20 along the direction in which the rotation axis of the head holder 20 extends, and these heads H rotate and move in the Y direction along with the head holder 20. The movable member 10 can be moved in the Z direction.

In this embodiment, the plurality of heads H include a suction head 21 as shown in FIG. 8, a dispenser (not shown here), and a bulk head as shown in FIGS. 9 to 12 and 19 to 21. 31.
The plurality of heads H are a combination of a plurality of bulk heads 31 and one dispenser, a combination of a plurality of bulk heads 31 and one, or a plurality of suction heads 21, or one Of course, various combinations, such as a combination of the bulkhead 31, a dispenser and a plurality of suction heads 21, can be applied.

  Next, the configuration of the suction head 21 will be described with reference to FIG. 8. The attachment member 22 includes a movable body 23 slidably attached to the attachment member 22 and a tube 24. An attached air inflow member 25 for compressed air, an adsorption nozzle 26 for adsorbing the electronic component 8 attached to the tip of the air inflow member 25, an electromagnetic valve member 27 for controlling the compressed air, A fourth linear moving means 28 is attached to the attachment member 22 and is composed of a solenoid or the like.

  The suction head 21 has a mounting member 22 detachably attached to the outer periphery of the head holder 20, and the movable body 23 can be moved at a high speed in the Z direction by the fourth linear moving means 28. With the movement of the movable body 23, the air inflow member 25, the suction nozzle 26, and the electromagnetic valve member 27 are also movable in the Z direction.

  Although not shown here, the dispenser has a configuration similar to the suction head 21 shown in FIG. 8, and will be described with reference to FIG. 8. The mounting member 22 is slidable with respect to the mounting member 22. A movable body 23 attached, a tube 24, and an air inflow member 25 for compressed air attached to the movable body 23, an electromagnetic valve member 27 for controlling the compressed air, and a movable body 23, The storage portion stores cream solder or adhesive, the application nozzle attached to the storage portion, and the fourth linear moving means 28 attached to the attachment member 22 and made of a solenoid or the like.

  In the dispenser, the attachment member 22 is detachably attached to the outer periphery of the head holder 20, and the movable body 23 can be moved at a high speed in the Z direction by the fourth linear moving means 28. With the movement of 23, the storage part including the air inflow member 25 and the application nozzle is also movable in the Z direction.

  Next, the outline of the configuration of the bulkhead 31 will be described with reference to FIG. 9. The flat mounting member 22, the fourth linear moving means 28 including a solenoid mounted on the mounting member 22, and the air The inflow member 25 and the electromagnetic valve member 27 are attached, and are disposed between the bulk nozzle 33 pulled by the spring means 32 toward the fourth linear movement means 28 and between the bulk nozzle 33 and the air inflow member 25. And a tube (not shown).

  The bulkhead 31 is attached to the outer periphery of the head holder 20 so that the mounting member 22 is detachable, and the bulk nozzle 33 is provided with an air inflow member 25 and an electromagnetic valve member 27 against the spring means 32. The linear valve moving means 28 can move at a high speed in the Z direction, and the solenoid valve member 27 controls the compressed air and suction air in the bulk nozzle 33.

  Next, the detailed structure of the bulk nozzle 33 will be described with reference to FIGS. 9 to 12 and FIGS. 20 to 23. The base body 34 made of a transparent synthetic resin molded product has a large number of chip-type electronic components 8 mounted thereon. A first recess 34a having an open end for storage, an inclined portion 34b provided on the open end side of the first recess 34a, and a second provided near the lower portion of the first recess 34a. Having a recess 34c.

  The first plate portion 35 made of a metal plate or the like having the same outer shape as that of the base body 34 is provided in a substantially central portion, and a large first hole 35a provided in a shape similar to the first concave portion 34a, and this A thin first groove 35b formed to extend downward in an inclined state connected to the first hole 35a, and a state in which one end is open at the lower end in a state of being connected to the first groove 35b. One end of the second groove portion 35c formed on the second groove portion 35c and the end portion of the first groove portion 35b across the second groove portion 35c, and the one end side of the second groove portion 35c is connected to the second groove portion 35c. The third groove portion 35d formed to be narrower than 35b, the second hole 35e provided to be connected to the other end side of the third groove portion 35d, and the upper portion of the second groove portion 35c. Provided in the vicinity of the third hole 35f and the joint between the first hole 35a and the first groove. Having a plurality of small fourth hole 35g that is.

  When the first plate portion 35 is superimposed on the first and second concave portions 34a and 34c of the base body 34 and combined by thermocompression bonding or the like, and the first plate portion 35 is superimposed on the base body 34, As shown in FIG. 19, the second groove 35c and the third hole 35f are opposed to the second recess 34c, and the vicinity including the fourth hole 35g is opposed to the first recess 34a. It has become.

  The second plate portion 36 made of a metal plate or the like having the same outer shape as the first plate portion 35 includes a first hole 36a with respect to the second hole 35e of the first plate portion 35, and a third hole 36e. A second hole 36b facing the hole 35f, a third hole 36c facing the fourth hole 35g, and an elongated fourth hole 36d provided between the second and third holes 36b and 36c. And a plurality of small fifth holes 35e provided in the upper part of the third hole 36c.

  When the second plate portion 36 is overlaid on the first plate portion 35 and combined by thermocompression bonding or the like, and the second plate portion 36 is overlaid on the first plate portion 35, FIGS. As shown in FIG. 4, the side portion of the first hole 35a is closed, and the side portion of the first recess 34a of the base portion 34 is closed, so that the housing portion for the chip-type electronic component 8 is formed. It becomes.

  The first groove portion 35b of the first plate portion 35 is closed at the side portion by the base portion 34 and the second plate portion 36 to form the alignment hole S of the electronic component 8, and the second portion 35b. The side portions of the groove portion 35c and the third groove portion 35d are also closed by the base portion 34 and the second plate portion 36, and the discharge port G of the electronic component 8 is formed on the open end side of the second groove portion 35c. Furthermore, in the state where the first hole 36a faces the second hole 35e and the second hole 36b faces the third hole 35f, a part of the third hole 35f is the second plate portion. Further, the fifth hole 36e is in a state facing the position of the first hole 35a, that is, the first recess 34a.

  The third plate portion 37 made of a metal plate or the like having the same outer shape as the second plate portion 36 includes a first hole 37a facing the first hole 36a of the second plate portion 36, and a second A second hole 37b facing the third hole 36b, a third hole 37c facing the third hole 36c, two fourth holes 37d facing the fourth hole 36d, and a fifth hole 36e. And a fifth hole 37e provided in the upper portion and a seventh hole 37f, 37g.

  The third plate portion 37 is overlaid on the second plate portion 36 and combined by thermocompression bonding or the like. When the third plate portion 37 is overlaid on the second plate portion 36, the third plate portion 37 is combined. The first to fifth holes 37a to 37e of the part 37 are in a state of facing the first to fifth holes 36a to 35e of the second plate part 36, respectively.

  The fourth plate portion 38 made of a metal plate or the like having the same outer shape as the third plate portion 37 is opposed to one of the first hole 37a and the fourth hole 37d of the third plate portion 37. An L-shaped first hole 38a, a substantially L-shaped second hole 38b opposed to the second, third, fifth, and sixth holes 37b, 37c, 37e, and 37f; Another third hole 38c facing the hole 37f, an inverted L-shaped fourth hole 38d facing the fourth hole 37d and the seventh hole 37g, and the other facing the seventh hole 37g One fifth hole 38e is provided.

  The fourth plate portion 38 is overlaid on the third plate portion 37 and combined by thermocompression bonding or the like. When the fourth plate portion 38 is overlaid on the third plate portion 37, the first hole 38a faces one of the first hole 37a and the fourth hole 37d of the third plate portion 37, and the second hole 38b is the second, third, fifth, and sixth holes 37b, 37c. , 37e, 37f, the third hole 38c faces the sixth hole 37f, the fourth hole 38d faces the fourth hole 37d and the seventh hole 37g, and the fifth hole 38e It will be in the state which opposes the 7th hole 37g.

The fifth plate portion 39 made of a metal plate or the like having the same outer shape as the fourth plate portion 38 includes a first hole 39a facing the third hole 38c of the fourth plate portion 38, and a fifth plate portion 38a. There is a second hole 39b opposite to the hole 38e, and the fifth plate portion 39 is overlapped with the fourth plate portion 38 and combined by thermocompression bonding or the like. When overlaid on the plate portion 38, the first hole 39a faces the third hole 38c of the fourth plate portion 38, and the second hole 39b faces the fifth hole 38e.
A compressed air groove M1 and a suction air groove M2, which will be described later, are formed by these holes and groove portions.

The shutter member 40 includes a main body portion 40a and a rod-like portion 40b connected to the main body portion 40a. The shutter member 40 includes a base portion 34 and first to fifth plate portions 35 to 39 which are overlapped with each other. 34 is movably accommodated in a cavity formed by the second recess 34c, the second groove 35c, and the third hole 35f located between the second plate portion 36 and the second plate portion 36.
That is, the main body 40a of the shutter member 40 is located in the second recess 34c and the third hole 35f, and the rod-like portion 40b is located in the second recess 34c and the second groove 35c.

  The urging means 41 made of a coil spring or the like is accommodated in a cavity where the second recess 34c and the third hole 35f are located, and the urging means 41 constantly presses the shutter member 40 toward the discharge port G. In addition, the shutter member 40 is movable so as to open the discharge port G against the biasing means 41.

  In the bulk nozzle 33 having such a configuration, a large number of chip-type electronic components 8 are accommodated in the accommodating portion (first concave portion 34a) from the inclined portion 34b side, and although not illustrated here, the inclined portion 34b side is the lid. Thus, the electronic component 8 can be prevented from spilling from the storage portion, and the amount of the electronic component 8 in the storage portion can be visually confirmed by the transparent base 34.

  In the bulk nozzle 33, compressed air and suction air can be circulated by the compressed air groove M1 and the suction air groove M2. First, the flow of the compressed air in the compressed air groove M1 indicated by the dotted line is shown in FIG. Describing based on this, compressed air from a tube (not shown) is, as indicated by a dotted line, the first hole 39a → the third hole 38c → the second hole 38b → the third hole 37c → the third hole. From 36c to the fourth hole 35g, compressed air is sent into the storage portion, and the electronic component 8 is stirred and the electronic component 8 located in the alignment hole S is pushed out.

  Further, the second hole 38b → the fifth hole 37e → the fifth hole 36e, and the compressed air is sent into the storage portion to stir the electronic component 8 and the electronic component 8 positioned in the alignment hole S. In addition, the compressed air is sent to the second hole 38b → the second hole 37b → the second hole 36b → the third hole 35f and the second recess 34c to attach the shutter member 40. When the compressed air is stopped, the shutter member 40 is moved by the urging means 41, and the discharge member G is moved by the shutter member 40. The operation of closing and pushing out the electronic component 8 from the discharge port G is performed.

Next, the flow of the suction air of the bulk nozzle 33 in the suction air groove M2 indicated by the dotted line will be described with reference to FIG. 12. The suction air sucked from the tube (not shown) is the first as shown by the dotted line. Hole 39b → Fifth hole 38e → Seventh hole 37g → Fourth hole 38d → Fourth hole 37d → Fourth hole 36d → Fourth hole 37d → First hole 38a → First hole 37a → The first hole 36a → the second hole 35e → the third groove 35d, and the electronic component 8 located in the second groove 35c is sucked, and the shutter member 40 opens the discharge port G. The electronic component 8 is prevented from falling off in the open state.
And the distribution | circulation of this suction air and the distribution | circulation of compressed air are the states isolate | separated so that it may not mutually merge by the 1st-5th board parts 35-39.

  Although not shown here, a plurality of image recognition devices are installed, the position of the insulating substrate 4 in the X direction, the position of the movable member 10 in the Z direction, the Y direction of the holding means 16 including the head holder 20 and the like. The position or the position in the rotational direction of the head holder 20 including the head H is accurately controlled.

  Next, the operation of the electronic component mounting apparatus of the present invention having such a configuration will be described with reference to FIGS. 13 to 23. First, as shown in FIG. 13, a plurality of electronic component mounting apparatuses are arranged in parallel. In the case where the electronic component 8 is mounted on the insulating substrate 4 with a large number of types, the number of mounting devices corresponding to the electronic component 8 is large. It is a mounting device.

  First, cream solder or adhesive is applied to the insulating substrate 4 by a dispenser. The application operation is performed by moving the insulating substrate 4 in the X direction by the first linear moving means 6 as shown in FIG. The head H is moved in the Y direction by the third linear moving means 15 and the head H is rotated by the motor 19 to determine the position of the head H with respect to the insulating substrate 4.

  Thereafter, as shown in FIG. 15, the fourth linear moving means 28 moves the dispenser storage portion and the application nozzle in the Z direction so as to move to the vicinity of the insulating substrate 4 at a high speed, and then to FIG. 16. As shown, the second linear moving means 12 moves the application nozzle together with the movable member 10 in a fine and gentle manner in the Z direction.

At this time, the fine and gentle movement by the second linear moving means 12 makes it possible for the coating nozzle to avoid an abrupt collision with the insulating substrate 4 and to determine an accurate position. Cream solder or adhesive housed in the housing portion is applied to the insulating substrate 4 by the sent air.
Further, after the cream solder or the adhesive is applied, the movable member 10 is moved to the upper position by the second linear moving means 12, and the application nozzle and the like are moved upward by the fourth linear moving means 28. Return to original position.

  Next, the mounting operation of the electronic component 8 by the bulk head 31 will be described with reference to FIGS. 14 to 16. In the bulk head 31, the same operation as the dispenser, that is, as shown in FIG. 15 is positioned at a predetermined position, the bulk nozzle 33 is moved to the vicinity of the insulating substrate 4 by the fourth linear moving means 28 as shown in FIG. 15, and then, as shown in FIG. However, the electronic component 8 is attached (attached) to the cream solder or the adhesive by a fine and gentle movement by the second linear moving means 12.

  Further, the mounting operation of the electronic component 8 by the bulk head 33 will be described in detail with reference to FIGS. 20 to 23. When the bulk nozzle 33 is positioned in the vicinity of the insulating substrate 4 as shown in FIG. As shown in FIG. 21, the discharge port G is blocked by the rod-like portion 40 b of the shutter member 40.

  Next, when the bulk nozzle 33 approaches the state of FIG. 16, the compressed air and the suction air simultaneously act in the bulk nozzle 33. First, when the compressed air acts, as shown in FIG. Compressed air flows from the fourth hole 35g and the fifth hole 36e, the electronic component 8 is agitated, the electronic component 8 is aligned with the alignment hole S, and the electronic component 8 positioned in the alignment hole S is compressed air. Pressed by.

  Further, when the electronic component 8 is agitated by compressed air, as shown in FIG. 20, the first plate portion 35 is slightly thicker than the electronic component 8 and the first plate 35 is used. At the corner formed between the inner surface of the first hole 35 a connected to the first groove 35 b of the portion 35 and the second plate portion 36, the electronic component 8 stands upright with respect to the second plate portion 36. In the state (the electronic component 8 is standing), the electronic component 8 is in an unstable state, and the electronic component 8 falls to the first recess 34a side of the base body 34. In the case of the state along the part, the electronic component 8 is in a stable state and is led to the alignment hole S along the corner part.

  Furthermore, when compressed air acts, as shown in FIG. 22, the compressed air flows into the second recess 34c and the third hole 35f, and the shutter member 40 moves against the biasing means 41. Therefore, when the discharge port G is opened, one electronic component 8 is pushed out from the alignment hole S to the discharge port G, and suction air acts from the third groove portion 35d on the opposite side of the alignment hole S, The electronic component 8 is sucked and held.

Next, when the bulk nozzle 33 is in the state of FIG. 16, the action of the compressed air and the suction air in the bulk nozzle 33 is stopped as shown in FIG. The discharge port G is closed by the rod-like portion 40b and the electronic component 8 of the discharge port G is pushed out, and the electronic component 8 is attached (attached) to the cream solder or the adhesive.
In this manner, the electronic component 8 is mounted by the bulk nozzle 33 of the bulk head 31.

Next, the mounting operation of the electronic component 8 by the suction head 21 will be described with reference to FIGS. 17 to 19. First, as shown in FIGS. 17 and 18, the head H is moved by the third linear moving means 15. Then, the holding means 16 is moved in the Y direction, and the head H is positioned on the electronic component 8 peeled off from the tape member 9.
At this time, the plurality of heads H are positioned on the plurality of electronic components 8 on the arcuate line S1.

  Next, as shown in FIG. 19, after the suction nozzle 26 is moved in the Z direction by the fourth linear moving means 28 and moved to the vicinity of the electronic component 8 at a high speed, it is not shown here. As shown in FIG. 16, the second linear moving means 12 moves the suction nozzle 26 together with the movable member 10 in a fine and gentle manner in the Z direction, and sucks the electronic component 8 by each of the plurality of suction nozzles 26.

At this time, the suction nozzle 26 does not suddenly collide with the electronic component 8 due to the fine and gentle movement by the second linear moving means 12.
Further, after the electronic component 8 is sucked, the movable member 10 is moved to the upper position by the second linear moving means 12, and the suction nozzle 26 is moved to the upper original position by the fourth linear moving means 28. Returned to

  Next, as shown in FIGS. 14 to 16, the suction head 21 that has sucked the electronic component 8 operates in the same manner as the dispenser, that is, as shown in FIG. After being positioned at the predetermined position, as shown in FIG. 15, the suction nozzle 26 is moved to the vicinity of the insulating substrate 4 by the fourth linear moving means 28, and then the suction nozzle 26 is moved as shown in FIG. The electronic component 8 is attached (attached) to the cream solder or adhesive by fine and gentle movement by the second linear moving means 12.

  By such an operation, the electronic component 8 is mounted by the dispenser, the bulk head 31, or the suction head 21.

The front view which concerns on the mounting device of the electronic component of this invention. The top view which concerns on the mounting device of the electronic component of this invention. Sectional drawing in the 3-3 line of FIG. Sectional drawing in the 4-4 line | wire of FIG. The principal part cross-sectional front view which concerns on the mounting apparatus of the electronic component of this invention. The right view which concerns on the mounting device of the electronic component of this invention. The principal part cross-section right view which concerns on the mounting device of the electronic component of this invention. The perspective view of the adsorption head concerning the mounting device of the electronic parts of the present invention. The perspective view of the bulkhead which concerns on the mounting device of the electronic component of this invention. The disassembled perspective view of the bulk nozzle which concerns on the mounting device of the electronic component of this invention. Explanatory drawing which concerns on the mounting device of the electronic component of this invention, and shows the flow of the compressed air in a bulk nozzle. Explanatory drawing which concerns on the mounting device of the electronic component of this invention, and shows the flow of the air suction in a bulk nozzle. The top view which shows the state which concerns on the mounting device of the electronic component of this invention, and the several mounting device was arranged in parallel. Explanatory drawing which shows the 1st process which concerns on the mounting device of the electronic component of this invention, and mounts an electronic component. Explanatory drawing which shows the 2nd process which concerns on the mounting device of the electronic component of this invention, and mounts an electronic component. Explanatory drawing which shows the 3rd process which concerns on the mounting device of the electronic component of this invention, and mounts an electronic component. The principal part cross-sectional front view which concerns on the mounting device of the electronic component of this invention, and shows the 1st process for demonstrating the mounting process of the electronic component in a suction head. The principal part cross-sectional top view which shows the 1st process for relating to the mounting device of the electronic component of this invention, and explaining the mounting process of the electronic component in a suction head. Explanatory drawing which concerns on the mounting device of the electronic component of this invention, and shows the 2nd process for demonstrating the mounting process of the electronic component in a suction head. The principal part cross-section perspective view which shows the movement of the principal part of a bulk nozzle and a chip-type electronic component concerning the mounting device of the electronic component of this invention. Explanatory drawing which shows the 1st operation | movement of a bulk nozzle in connection with the mounting device of the electronic component of this invention. Explanatory drawing which shows the 2nd operation | movement of a bulk nozzle in connection with the mounting device of the electronic component of this invention. Explanatory drawing which shows the 3rd operation | movement of a bulk nozzle in connection with the mounting device of the electronic component of this invention. The front view which shows the outline | summary of the mounting device of the conventional electronic component. Explanatory drawing which shows operation | movement of the conventional electronic component mounting apparatus.

Explanation of symbols

1: installation base 2: support member 3: table 4: insulating substrate 5: transport member 5a: rail 6: first linear moving means 7: holding means 8: electronic component 9: tape member 10: movable member 10a: hole 10b : Guide part 11: Shaft member 12: Second linear moving means 13: Support part 14: Guide rod 15: Third linear moving means 16: Holding means 16a: Holding part 16b: Hole 16c: Arm part 17: Connecting part 18: Shaft portion 19: Motor 20: Head holder H: Head S1: Arc line X: X direction Y: Y direction Z: Z direction 21: Suction head 22: Mounting member 23: Movable body 24: Tube 25: Air inflow Member 26: Suction nozzle 27: Solenoid valve member 28: Fourth linear movement means 31: Bulk head 32: Spring means 33: Bulk nozzle 34: Base 34a: First recess 34b: Inclined portion 4c: 2nd recessed part 35: 1st board part 35a: 1st hole 35b: 1st groove part 35c: 2nd groove part 35d: 3rd groove part 35e: 2nd hole 35f: 3rd hole 35g : 4th hole 36: 2nd board part 36a: 1st hole 36b: 2nd hole 36c: 3rd hole 36d: 4th hole 36e: 5th hole 37: 3rd board part 37a : 1st hole 37b: 2nd hole 37c: 3rd hole 37d: 4th hole 37e: 5th hole 37f: 6th hole 37g: 7th hole 38: 4th board part 38a: 1st hole 38b: 2nd hole 38c: 3rd hole 38d: 4th hole 38e: 5th hole 39: 5th board part 39a: 1st hole 39b: 2nd hole 40: Shutter Member 40a: Main body portion 40b: Bar-shaped portion 41: Biasing means S: Alignment hole G: Discharge port M1: Compressed air groove M2: Suction air groove

Claims (13)

A plurality of heads movable to a predetermined position; a head holder for holding the heads; and an insulating substrate on which electronic components are mounted. One or more of the plurality of heads is a bulk The bulkhead is formed of a head, and the bulkhead is connected to a storage portion for storing a large number of chip-type electronic components, an alignment hole that is connected to the storage portion, and the electronic components are aligned in a row, and is connected to the alignment hole. An electronic component having a discharge port through which the electronic components are discharged one by one, wherein the electronic component discharged from the discharge port of the bulkhead is mounted on the insulating substrate. Mounting device. The insulating substrate is capable of moving in the X direction, and the head held by the head holder is capable of moving in the Y direction perpendicular to the X direction and the vertical Z direction. The electronic component mounting apparatus according to claim 1. 3. The electronic component mounting apparatus according to claim 2, further comprising a motor for rotating the head holder, wherein the motor rotates the head holder with the head. 4. The electronic component mounting apparatus according to claim 2, wherein the head is disposed along a direction in which a rotation axis of the head holder extends on a circumference of the head holder. 5. The electronic component mounting apparatus according to claim 2, wherein the head holder is movable in the Z direction along with the head. It has linear moving means for moving the head in the Z direction, and the linear moving means moves the head in the Z direction while being held by the head holder. The electronic component mounting apparatus according to any one of claims 2 to 5. A plurality of first and second linear moving means, wherein the first linear moving means moves the head in the Z direction quickly; and the second linear moving means moves the head to the first direction. 7. The electronic component mounting apparatus according to claim 6, wherein the electronic component is moved in the Z direction at a speed slower than that of the one linear moving means. 8. The electronic component mounting apparatus according to claim 2, wherein the head is detachable from the head holder. 9. The electronic component mounting apparatus according to claim 2, wherein the plurality of heads are arranged at equal intervals of 45 degrees. At least one of the plurality of heads is formed by a dispenser, and the dispenser applies the cream solder or the adhesive onto the insulating substrate, and a storage portion for storing the cream solder or the adhesive. 10. The coating device according to claim 2, further comprising an application nozzle for attaching to the cream solder or the adhesive applied to the insulating substrate by the dispenser. The electronic component mounting apparatus according to any one of the above. At least one of the plurality of heads is formed by a suction head, and the suction head has a suction nozzle for sucking the electronic component at a predetermined position outside the insulating substrate, and the suction head 11. The electronic component mounting apparatus according to claim 2, wherein the electronic component is mounted on the insulating substrate after moving to a predetermined position and sucking the electronic component. . A plurality of the suction heads are provided, and the plurality of suction heads move simultaneously to the outside of the insulating substrate to simultaneously suck the respective electronic components at predetermined positions. The electronic component mounting apparatus according to 11. 13. The electronic component mounting apparatus according to claim 12, wherein a plurality of the electronic components have tape members taped, and the plurality of tape members are arranged side by side.

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