JPH11307905A - Plural surfaces fixed board sheet, its generation method and positioning equipment used in the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the yield of a printed wiring board, reduce economical loss, and prevent loss of resources and deterioration of environment, by regenerating an acceptable printed wiring board in a plural surfaces fixed board sheet having an unacceptable printed wiring board. SOLUTION: In a plural surfaces fixed board sheet 15, a plurality of printed wiring boards 17a-17c in which patterns of wiring and lands are formed on the surfaces by using conductor thin film material are separably linked with each other. In the case that one out of a plurality of the printed wiring boards 17a-17c is unacceptable, the unacceptable board 17a is cut off, and the left board sheet 15 is engaged and bonded with an acceptable printed wiring board 17c cut off from a plural surfaces fixed board sheet when one out of a plurality of printed wiring boards is unacceptable.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plurality of imposed substrate sheets in which a plurality of printed wiring boards are detachably connected to each other, a method of reproducing the same, and a positioning apparatus used therefor.

[0002]

2. Description of the Related Art In consumer electronic and electrical equipment such as video cameras and mobile phones, printed wiring boards on which various electronic components such as semiconductors are mounted are used to reduce the size and weight of the products. Higher densities such as miniaturization and higher multilayers are being promoted. Furthermore, added value per unit area of printed wiring boards and production cost have been increasing in recent years, for example, gold plating is applied to component mounting lands as a measure for high-speed processing of digital signals.

As shown in FIG. 14, a plurality of identical printed wiring boards used in such electronic and electrical equipment are manufactured from the viewpoint of improving their handling, work efficiency, and the like at the time of manufacturing and mounting components. Printed wiring board 67, or a plurality of different printed wiring boards used in the same product,
In many cases, a single substrate sheet 65 that is detachably connected to each other via a connection portion A between adjacent perforations M (hereinafter, referred to as a plurality of imposed substrate sheets 65) is used.

[0004]

However, in such a conventional multiple-imposition board sheet 65, any one of the plurality of printed wiring boards 67 is provided with a function such as disconnection of wiring. In the case where a defective product having a defect in appearance is found, the entire multi-imposition board sheet 65 is conventionally good even though the other printed wiring boards 67 in the same multi-imposition board sheet 65 are good. In most cases, the entirety of the multiple-imposition board sheet 65 was discarded as a defective product.

In such a case, since the non-defective printed wiring board 67 is discarded together with the defective printed wiring board 67, the production cost of the printed wiring board 67 is increased due to a large economic loss. On the other hand, since it is difficult to recycle the printed wiring board 67, there is a possibility that loss of resources and deterioration of the environment may be caused. In particular, as described above, a printed wiring board having a high added value has a large economic loss.

As a special case, a defective printed wiring board 67 in one multi-imposition board sheet 65 is used.
There is a method in which marking is performed on the printed wiring board 67 so that components are mounted only on the non-defective printed wiring board 67. It takes the same trouble as the case of the ordinary multiple imposition board sheet 65 with no defective products.
In addition to remarkably lowering the component mounting efficiency, there is a problem that components may be erroneously mounted due to erroneous recognition or oversight of the marking or the like, and mounting failure may occur.

[0007] In view of the above problems, the present invention improves the yield of printed wiring boards by making use of non-defective printed wiring boards in a plurality of imposed substrate sheets having defective printed wiring boards. It is an object of the present invention to provide a multi-imposed substrate sheet capable of reducing a loss of resources and preventing loss of resources and deterioration of the environment, a method of reproducing the same, and a positioning device used therefor.

[0008]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a printed wiring board having a pattern of wiring and lands formed on a surface thereof made of a conductive thin film material, which is detachably connected to each other, In this state, in a plurality of imposition board sheets on which various circuit components are mounted on the plurality of printed wiring boards, if any of the plurality of printed wiring boards is defective, the defective One multi-layer printed circuit board sheet remaining after separating the printed wiring board and a non-defective printed wiring board in which one of the plurality of printed wiring boards is similarly separated from the other multi-layer printed circuit board sheets of a defective product It is configured to be fitted and bonded to each other.

According to the multi-layer board having the above structure, even if a defective printed wiring board is found in the multi-layer board, the entire multi-layer board is not discarded but discarded. If there are a plurality of imposed board sheets including such a defective printed wiring board, one of the plurality of imposed board sheets is separated from the defective boards and has only a non-defective printed wiring board. The sheet and a non-defective printed wiring board separated from other multi-imposed board sheets are fitted to each other and adhered to each other, so that all of the plurality of printed wiring boards are non-defective and one multi-imposed board sheet is used. Can be played.

[0010]

Embodiments of the present invention will be specifically described below with reference to the drawings. 1 to 1
FIG. 1 is a diagram referred to for describing a first embodiment of a multiple imposition substrate sheet, a method for reproducing the same, and a positioning device used therein according to the present invention.

In the present embodiment, as shown in FIG. 1, a printed wiring board used for consumer electronic and electric equipment such as a video camera and a portable telephone is easy to handle at the time of manufacture and mounting of parts. From the viewpoint of improving work efficiency, etc., a plurality (two) of the same printed wiring boards 17,
Alternatively, a plurality of different printed wiring boards 17 used in the same product may be detachably connected to each other and used as one substrate sheet, that is, a plurality of imposed substrate sheets 15 that are collectively combined into one.

Such a multi-imposition board sheet 15 is
The printed wiring boards 17 used in one step of the manufacturing process of the printed wiring board 17 and separated from the plurality of imposition board sheets 15 after component mounting are attached to the above-mentioned electronic / electric equipment and used. I have.

A pattern of wiring and soldering lands is formed on the surface of each printed wiring board 17 of the multiple imposition substrate sheet 15 of FIG. 1 by copper plating (conductor thin film material). Various electronic components constituting the electronic circuit formed on the plate 17 have not been mounted yet.

Adjacent printed wiring boards 17 are detachably connected to each other via a connection between adjacent perforations, and a board holding frame plate is provided around two printed wiring boards 17. The part 18 is a perforation M that is also adjacent
They are detachably connected to each other via a connecting portion A between them.

If a defective product such as a broken wire is found on any one of the printed wiring boards 17 in such a plurality of printed circuit board sheets 15, similarly, any one of the printed wiring boards 17 By using another multi-imposition board sheet 15 in which a defective product is found at 17, a new multi-imposition board sheet can be reproduced according to the procedure of the flowchart as shown in FIG.

For example, in FIG. 2, when the printed wiring board 17a among the printed wiring boards 17a and 17b of the plurality of imposition board sheets 15 is found to be defective due to disconnection or the like, the printed wiring board 17a 17a is separated from the multiple imposed board sheet 15, and the remaining non-defective printed wiring board 17c is separated from another multi-imposed board sheet having a printed wiring board which is also defective such as a broken wire. Then, the non-defective printed wiring board 17c is fitted to and adhered to a vacant portion of the above-mentioned multiple imposition board sheet 15 after the printed wiring board 17a is removed.

Then, as shown in FIG. 2, the printed wiring boards 17b and 17c are both new non-defective printed circuit boards 15a from between the plurality of imposed board sheets 15 having defective printed wiring boards 17a. Is played.
Then, the regenerated multi-imposition board sheet 15a can be thereafter sent to the mounting process in the same manner as a normal multi-imposition board sheet having no defective products. It is possible to improve the handling property at the time, work efficiency, and the like.

Hereinafter, a method of reproducing a plurality of imposed substrate sheets will be described with reference to the drawings according to the procedure of the flowchart shown in FIG. First, the defective printed wiring board 17a of the multiple-imposition board sheet 15 in FIG. 2 is separated from the multiple-imposition board sheet 15 (step S1 in FIG. 1). In such a separating step, a cutting machine such as a router 20 (engraving machine) or a milling machine (milling machine) as shown in FIG. 4 can be used as a separating device.

That is, a plurality of imposition substrate sheets 15 shown in FIG. 2 are fixed on a work set plate 22 shown in FIG. 4, and this work set plate 22 is set on a base plate 23 so as to be able to reciprocate in the Y direction in the figure. Is done. The router 20 can reciprocate in the X direction in the figure along the frame 25, and the rotary blade 20a can reciprocate in the Z direction in the figure.

When the start switch (not shown) is turned on and the cutting process is started by using such a router 20, the router 20 is controlled by a CPU (not shown) to cut the pre-programmed trajectory. By processing, all of the above-described connecting portions A can be cut. When such a router 20 is used, high-precision separation processing can be performed semi-automatically with a relatively inexpensive device, and it is possible to cope with the separation processing of various types of printed wiring boards only by changing the processing program.

Instead of using a cutting machine such as the router 20, a press punching machine using a punching die can be used as the separating device. This is because the connecting portion A between the perforations M is sheared by a punching die, and the printed wiring board 1
7a is cut off instantaneously. The punching die is a die composed of a male die and a female die. As shown in FIG. 5, the connection part A between the perforations M is cut by the punching die so that a constant gap C is left.

The gap C corresponds to the width of the male and female dies. The router 20 also cuts the connecting portion A between the perforations M so as to leave a gap C, as shown in FIG. 5, corresponding to the diameter of the rotary blade 20a.

In the cutting method using the punching die, the processing accuracy is ensured by the high-precision die, so that high-precision and high-speed processing is possible. Further, instead of using such a press punching machine or the above-mentioned cutting machine, an air nipper that can be cut by the force of high-speed jetting air can be used as the separating device.

After the separation step is completed, a pre-adhesion processing step of applying a physical or chemical treatment to the cut portion of the separated connecting portion A is performed (step S in FIG. 3).
2). In this step, the cut surface of the connection part A left on the non-defective printed wiring board 17b and the board holding frame plate part 18 of the multiple imposition board sheet 15 after the defective printed wiring board 17a is cut off, Processing and processing are performed so that the cut surface of the connection portion A left on the non-defective printed wiring board 17c separated from another multiple imposition substrate sheet can be brought into a state suitable for bonding.

First, the cut surface of the connecting portion A is filed or burrs are removed by physical processing such as buffing. Next, chips on the cut surface are removed by ultrasonic cleaning or the like, and then degreased with an organic solvent such as ethanol. Further, in order to secure the adhesive strength of the cut surface of the connection portion A, a primer (ethanolamine or the like) acting as a catalyst for the adhesive is applied to the cut surface, and a chemical adjustment to a surface property suitable for bonding is performed.

Next, a non-defective printed wiring board 17c is fitted into a vacant portion of the multi-imposition board sheet 15 after the printed wiring board 17a is removed, and the cut surfaces of the connecting portions A are bonded to each other. The bonding step is performed (Step S3 in FIG. 3). In such a bonding step, the pre-processed multi-imposition board sheet 15 and the printed wiring board 17c are set in a positioning device, and the filling and curing of the adhesive are performed. Wiring board 1
7c, a new multiple imposition substrate sheet 15 integral with one another
Play to a.

For this purpose, first, as shown in FIGS. 6 and 7, a plurality of imposition substrate sheets 15 and a printed wiring board 17c are set on a positioning device 27. On the positioning plate 29 of the positioning device 27, a plurality of positioning pins 31 are assembled in a pair, and a connecting portion between the perforations M as shown in FIG. The remaining part of A is fitted as shown in FIG. 7, so that the positioning between the multiple-imposition board sheet 15 and the printed wiring board 17c is performed.

As described above, between the remaining portion of the connecting portion A of the plurality of imposition board sheets 15 set on the positioning plate 29 of the positioning device 27 and the remaining portion of the connecting portion A of the printed wiring board 17c, that is, in FIG. The adhesive is poured into the space S between the remaining portions of the connecting portions A facing each other.

As the adhesive, the printed wiring board 17b,
A high-strength, high-heat-resistant epoxy-based adhesive that can withstand the load at the time of mounting components on 17c, the impact, and the heat (about 260 ° C.) at the time of reflow is used. As a curing property of the adhesive, a material that can be cured at a glass transition temperature (about 130 ° C.) or lower of a printed wiring board material (glass-epoxy) is selected. This prevents deformation of the product when the adhesive is cured, and cures the product at a temperature as low as possible to prevent the occurrence of secondary problems such as a decrease in solder wettability due to oxidation of the soldering land at a high temperature. This is to prevent it.

The adhesive is applied by manual operation using a dispenser or automatic operation using a coating robot as shown in FIG.
As shown in FIG. 7, the space S between the remaining portion of the connection portion A of the multiple-imposition board sheet 15 and the remaining portion of the connection portion A of the printed wiring board 17c is poured so as to fill the space S.

After the adhesive is filled, a plurality of imposition substrate sheets 15 and a printed wiring board 17c are positioned by a positioning device 2 using a clamp bar (not shown) to prevent warpage during heat curing.
After fixing to the positioning plate 29, the adhesive is cured by heating. The heating temperature is set to a maximum of about 120 ° C. in order to prevent the occurrence of secondary defects, and the plurality of imposed substrate sheets 15 and the printed wiring board 17 c are put into the heating furnace while being fixed to the positioning plate 29 of the positioning device 27.

When the adhesive is hardened in this way, as shown in FIG. 8, the connecting portions A of the plurality of imposed substrate sheets 15 and the printed wiring board 17c are connected by the hardened adhesive E, and the connecting portions are connected. It is restored in the same way as before the cutting of A. Note that an ultraviolet-curable epoxy-based adhesive may be used as the adhesive, and in that case, curing by ultraviolet spot irradiation is possible.

Next, a post-processing step is performed (step S in FIG. 3).
4). In this post-processing step, after the adhesive is cured, the multiple-imposition board sheet 15 and the printed wiring board 17c are removed from the positioning plate 29 of the positioning device 27, and the cured adhesive E is shaped and washed.

First, in order to remove the multi-imposition board sheet 15 and the printed wiring board 17c from the positioning plate 29 of the positioning device 27, the clamp bar must be connected to the positioning device 27.
From the substrate sheet 15
Since it is difficult to remove it only by lifting it upward, the positioning pin 31 is pushed into the positioning plate 29 to be immersed and then removed.

For this purpose, a male punch 33 as shown in FIGS. 9 and 10 is used, and the punch plate 35 on which the male punch 33 is erected is lowered with the male punch 33 downward. . The male punch 33 has a diameter smaller than the diameter of the positioning pin 31, changes from the state shown in FIG. 9 to the state shown in FIG. 10, and the tip of the male punch 33 contacts the tip of the positioning pin 31, The positioning pin 31 is pushed into the positioning plate 29 to be immersed. And male punch 33
After returning to the original upper position, the multiple-imposition board sheet 15 and the printed wiring board 17c can be easily removed from the positioning device 27.

A hand press as shown in FIG. 11 is used for such a removing operation, and the positioning plate 29 of the positioning device 27 is placed on the lower plate 37 of the hand press.
The guide hole 29a is fitted and fixed to the guide shaft 39. A punch plate 35 is fixed to the lower surface of the upper plate 41 in which the guide hole 41 a is fitted to the upper end of the guide shaft 39, and the upper plate 41 is lowered by the hydraulic cylinder 43, so that the punch plate 35 The male punch 33 can perform an operation of pushing the positioning pin 31 downward.

By pushing the positioning pins 31 downward in this manner, the multiple imposed board sheet 15 and the printed wiring board 17c bonded to each other with the adhesive E are separated from each other.
The positioning device 27 can be easily removed from the positioning plate 29, and the above-mentioned post-processing step, that is, shaping and cleaning of the cured adhesive E can be performed.

In the post-treatment step, the adhesive swelling portion of the adhesive application portion is molded into a flat shape using a hand router or the like. This is a problem during component mounting, such as a squeegee that moves along the upper surface of the printed wiring board 17 during cream solder printing or the adhesiveness of the cream solder printing metal screen is deteriorated at the rising portion of the adhesive. Perform shaping to prevent

After the completion of such shaping, the substrate sheet 15a with a plurality of substrates is cleaned so that no adhesive polishing debris remains on the soldering lands. In particular, the multiple imposed substrate sheet 15a in which gold is applied to the soldering lands of the printed wiring board 17, which requires high cleanability, needs to be carefully cleaned by pure water cleaning or the like.

According to the above four steps, when a defective printed wiring board is included, a plurality of imposition board sheets that have been conventionally discarded as defective together with a non-defective printed wiring board can be used. All printed wiring boards can be made reproducible into good quality multi-layer board sheets.

According to the multiple imposed substrate sheet according to the embodiment, the method for regenerating the same, and the positioning device used therefor, even if a defective printed wiring board 17a is found in the multiple imposed substrate sheet 15, Without discarding the entire multi-imposition board sheet 15, if there are a plurality of multi-imposition board sheets 15 including such a defective printed wiring board 17a, A plurality of imposed substrate sheets 15 having only non-defective printed wiring boards and a non-defective printed wiring board 17c separated from other multi-imposed board sheets are fitted and bonded to each other to form a plurality of sheets. All of the printed wiring boards 17b and 17c can be recycled into a non-defective multi-imposition board sheet 15a.

For this reason, the defective printed wiring board 17a
By utilizing the good printed wiring board 17b in the multiple imposition board sheet 15 having
The yield can be improved, the economic loss can be reduced, and the loss of resources and the deterioration of the environment can be prevented.
Particularly, a printed wiring board having a high added value has a great effect of reducing the economic loss.

FIG. 12 is a diagram referred to for explaining the second embodiment of the present invention. In the first embodiment, as shown in FIGS. 6 and 7, the connecting portion A is positioned so as to be sandwiched by a pair of positioning pins 31, whereas in the second embodiment, a plurality of impositions are provided. Substrate sheet 1
5 and the printed wiring board 17c are provided with a guide hole 45, and this guide hole 45 is inserted into the positioning plate 49 of the positioning device 47.
The second embodiment is different from the first embodiment in that the positioning is performed by fitting the positioning pin 51 to the erected positioning pin 51. According to such a second embodiment,
The same effects as in the first embodiment can be obtained.

FIG. 13 is a diagram referred to for explaining the third embodiment of the present invention. In the third embodiment, a positioning protrusion 61 having the same shape as the perforation M and a slightly smaller size is formed on a positioning plate 59 of a positioning device 57, and the positioning protrusion 61 is provided with a plurality of imposition substrate sheets 15.
The second embodiment differs from the first and second embodiments in that a perforation M of the printed wiring board 17c is fitted to the first embodiment. According to the third embodiment, the same effects as those of the first and second embodiments can be obtained.

In the above-described embodiment, the case where the multiple imposition substrate sheet 15 has two printed wiring boards 17 has been described. Needless to say, the present invention can be applied to a case having a plate.

Although the embodiments of the present invention have been specifically described above, the present invention is not limited to the above-described embodiments, and based on the technical idea of the present invention, various other embodiments are possible. Can be changed.

[0047]

As described above, according to the multi-imposition board sheet of the present invention, the method for regenerating the same, and the positioning apparatus used for the same, the printing of a good product in the multi-imposition board sheet having a defective printed wiring board is performed. By utilizing the wiring board, the yield of the printed wiring board can be improved, the economic loss can be reduced, and the loss of resources and the deterioration of the environment can be prevented. Particularly, a printed wiring board having a high added value has a great effect of reducing the economic loss.

[Brief description of the drawings]

FIG. 1 is a plan view showing a multi-imposition board sheet 15. FIG.

FIG. 2 conceptually shows a plurality of imposed substrate sheets 15, 15a and a printed wiring board 17 according to the first embodiment of the present invention.
It is a perspective view of c.

FIG. 3 is a flowchart showing a procedure according to a first embodiment of the method for regenerating a plurality of imposition substrate sheets according to the present invention.

FIG. 4 is a perspective view showing a separating device used to separate a defective printed wiring board 17a and a non-defective printed wiring board 17c from a plurality of imposition substrate sheets 15 by a router 20;

FIG. 5 is a partially enlarged plan view showing a gap C formed after a printed wiring board 17a or a non-defective printed wiring board 17c is separated from a plurality of imposition board sheets 15;

FIG. 6 is a perspective view showing a positioning device 27 for positioning between the multiple-imposition board sheet 15 and a non-defective printed wiring board 17c.

FIG. 7 is a partially enlarged perspective view showing a pair of positioning pins 31 in a state where the plural imposition substrate sheets 15 and the non-defective printed wiring board 17c are positioned.

FIG. 8 is a partial enlarged plan view showing an adhesive E between a bonded portion A of a perforated line M of a printed circuit board 17c and a plurality of imposed substrate sheets 15 bonded together.

FIG. 9 is a partial side cross-sectional view showing the positioning pins 31 and the male punches 33 before being pressed down to remove the bonded multiple-imposition board sheet 15 and the printed wiring board 17c.

FIG. 10 is a partial side sectional view showing the positioning pins 31 and the male punches 33 pressed down to remove the bonded multiple-imposition board sheet 15 and the printed wiring board 17c.

11 is a perspective view showing a hand press used to push down a positioning pin 31 by a male punch 33. FIG.

FIG. 12 is a perspective view showing a positioning device 47 for positioning a multi-imposition board sheet 15 and a non-defective printed wiring board 17c according to the second embodiment of the present invention.

FIG. 13 is a perspective view showing a positioning device 57 for positioning a plurality of imposition substrate sheets 15 and a non-defective printed wiring board 17c according to a third embodiment of the present invention.

FIG. 14 is a plan view showing a conventional multiple imposition substrate sheet 65.

[Explanation of symbols]

15, 15a ... multiple imposition board sheets, 17, 17a,
17b, 17c: printed wiring board, 18: board holding frame plate, 20: router, 20a: rotary blade, 22: work set plate, 23: base plate, 25: frame, 27: positioning device, 29: positioning plate, 29a …
Guide holes, 31: positioning pins, 33: male punch, 3
5 punch plate, 37 lower plate, 39 guide shaft, 41 upper plate, 41a guide hole, 43 hydraulic cylinder, 45 guide hole, 47 positioning device, 49 positioning plate, 51 positioning pin, 57 ... Positioning device,
Reference numeral 59: positioning plate, 61: positioning protrusion, 65: multiple imposition board sheet, 67: printed wiring board, M: perforation, A: connecting portion

Claims (6)

[Claims] 1. A plurality of printed wiring boards having wiring and land patterns formed on the surface thereof by a conductive thin film material are detachably connected to each other, and in this state, various circuit components are connected to the plurality of printed wiring boards. A plurality of imposed board sheets, wherein one of the plurality of printed wiring boards is a defective product, and one of the plurality of printed wiring boards is separated from the defective printed wiring board and one of the plurality of imposed substrate sheets is left. Similarly, any one of the plurality of printed wiring boards is separated from the other plurality of imposed substrate sheets of the defective product by a non-defective printed wiring board, and are fitted and bonded to each other. Substrate sheet. 2. The multiple imposition substrate sheet according to claim 1, wherein an adhesive having high strength and high heat resistance is used for the bonding. 3. A plurality of printed wiring boards having wiring and land patterns formed on the surface thereof by a conductive thin film material are detachably connected to each other, and in this state, various circuit components are connected to the plurality of printed wiring boards. A plurality of printed circuit boards, wherein any one of the plurality of printed wiring boards separates the defective printed wiring board from one of the defective printed circuit boards. One of the plurality of printed wiring boards separates the non-defective printed wiring board from the other plurality of imposed board sheets of the defective product, and the empty printed circuit board of the defective printed circuit board of the one multi-imposed board sheet is separated. By fitting and bonding a non-defective printed wiring board separated from the other multiple imposition board sheet to the portion, a plurality of printed wiring boards are formed. Multiple imposition substrate sheet reproducing method, characterized in that all play multiple imposition substrate sheet good. 4. The printed wiring board is detachably connected to the plurality of imposition board sheets via perforations,
Utilizing the perforations for positioning between the one multi-imposed board sheet remaining after the defective printed wiring board is separated and the non-defective printed wiring board separated from the other multi-imposed board sheet 4. The method for regenerating a plurality of imposed substrate sheets according to claim 3, wherein: 5. The method according to claim 3, wherein an adhesive having high strength and high heat resistance is used for the bonding. 6. A plurality of printed wiring boards having wiring and land patterns formed on the surface thereof by a conductive thin film material are detachably connected to each other through perforations, and in this state, are connected to the plurality of printed wiring boards. In the multiple imposition board sheet on which various circuit components are mounted, any one of the plurality of printed wiring boards separates the defective printed wiring board from one of the defective imposition board sheets. Similarly, any one of the plurality of printed wiring boards separates a non-defective printed wiring board from another plurality of imposed board sheets of a defective product, and the defective printed wiring board of the one plurality of imposed board sheets is By fitting and bonding a non-defective printed wiring board separated from the other multiple imposed substrate sheets to the separated empty portion, In the method for regenerating a plurality of imposed substrate sheets, in which all of the printed circuit boards are non-defective, the one or more imposed substrate sheets remaining after the defective printed circuit board is cut off and the other A positioning device used for positioning between a non-defective printed wiring board and a non-defective printed wiring board separated from the plurality of imposed substrate sheets, wherein the positioning device is used for positioning between the one multi-imposed substrate sheet and the defective printed wiring board. A positioning device used in a method for regenerating a plurality of imposed substrate sheets, wherein the perforation is used.