JPH11306983A - Manufacture of plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To carry out adhesion and sealing, by which sheeting processing can be performed in a short time without using a chip tube, by installing a sealant with a through hole in a vent hole of a panel and aligning the vent hole with the through hole in the sealant. SOLUTION: A panel 3 is formed when a first glass substrate (back substrate) 1 and a second glass substrate (front substrate) 2 are stuck to each other with a clearance 5 provided between them, and then, sealed together by heating a sealant 4 applied to the vicinities of the both substrates 1, 2. In the first glass substrate 1, a through hole type vent hole 6 is arranged. In the vicinity of the vent hole 6 of the first glass substrate 1, a sealant 12 such as low melting point glass is applied, and a sealing pan 10 is brought into contact with the first glass substrate 1 while putting the sealant 12 between them. In the sealing pan 10, a through hole 11 is formed. In this sealing pan 10 attaching process, the position of the vent hole 6 of the glass substrate 1 and that of the opened end of the through hole 11 in the sealing pan 10 are aligned with each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a plasma display, and more particularly to a method for manufacturing a flat display panel such as a plasma display panel.
The present invention relates to degassing, gas filling, and sealing of a sealed panel.

[0002]

2. Description of the Related Art LCDs (Liquid Crystal Displays) and PDPs can be used as displays capable of saving space and portability.
(Plasma display) Flat panel displays (FPDs) such as FEDs (field emission displays) have been developed. Among them, the plasma display is a display utilizing light emission by discharge, and can be applied to a thin, large-screen display. 2. Description of the Related Art A plasma display panel included in a plasma display includes two glass substrates in which a discharge gas is sealed.

[0003] Plasma display panels are generally
A pre-process in which a mechanism for discharge light emission such as an electrode is formed on a glass substrate, and a glass substrate which has been subjected to the pre-process is opposed to the glass substrate at a small interval, and the periphery thereof is sealed with a sealing material (sealing). After exhausting the space between the
It is formed by injecting a discharge gas such as e, Ne, Xe, or the like, and performing a post-process such as aging or mounting of a driver mechanism.

Conventionally, the sealing and exhausting step performed in the above post-process includes a step of sealing both glass substrates, a step of sealing (sealing) an exhaust pipe (chip tube) to one glass substrate (back substrate), Each step includes a step of degassing by heating and exhausting, a step of sealing a discharge gas, and a step of sealing a chip tube (chip off).

[0005]

In the manufacturing process of a plasma display panel, most of the conventional sealing and exhausting processes are batch processes, require a long processing time, and have low productivity. I was The main factors are the prolonged evacuation time due to the evacuation from the chip tube, and the heating and heating of the glass panel with a low temperature gradient.
Cooling processes.

FIG. 15 is a schematic sectional view for explaining a tip tube used in a conventional sealing and exhausting process. FIG.
, The display panel 3 is formed by joining a first glass substrate 1 (back substrate) and a second glass substrate 2 (front substrate) with a sealing material 4 in a peripheral portion. The space between the two glass panels of the display panel 3 is evacuated and then filled with a discharge gas. The exhaust and gas filling are performed by the chip tube 100 attached to the first glass substrate 1. The chip tube 100 is attached by aligning the hollow portion of the chip tube 100 with the vent 6 of the first glass substrate 1 and sealing the periphery with a chip tube connection sealing material 101.

[0007] The chip tube has a long conductance due to a small conductance, and if there is an error in handling of a display panel or the like, the chip tube is damaged, which causes a reduction in product yield. Further, the chip tube makes it difficult to carry out the single-wafer transfer of the panel, and the chip-off operation for sealing the chip tube requires manual labor, which makes automation and in-line operation difficult.

[0008] A method that does not use a chip tube in the sealing and exhausting step has been proposed (Japanese Patent Laid-Open No. 1-41422).
JP-A-6-302279). However,
The conventional methods that do not use a tip tube have problems that it is difficult to automate the operation of fitting the sealing plug, and it takes a long time to exhaust gas because of the batch type. In order to automate and inline the sealing and exhausting process, a sealing method that does not use a chip tube and can perform single-wafer processing in a short time is desired.

Therefore, the present invention solves the problems of the conventional method of manufacturing a plasma display panel, and provides a method of exhausting a panel after sealing, filling a gas, and sealing.
It is an object of the present invention to provide a method of manufacturing a plasma display panel capable of performing bonding and sealing that can perform single-wafer processing in a short time without using a chip tube.
An object of the present invention is to provide a method for manufacturing a plasma display panel that can be in-lined.

[0010]

According to the method of manufacturing a plasma display panel of the present invention, the two glass substrates are 450
A panel formed by performing a sealing process in advance at a temperature of about ° C. is to be processed, and the panel is evacuated, filled with gas, and sealed.

The conventional sealing and exhausting process includes a sealing process for sealing around two glass substrates and an exhausting process for exhausting, sealing and sealing the inside of the panel after sealing. Although referred to as the present invention, the present invention relates to the evacuation processing after sealing, and the evacuation processing includes bonding, evacuation, gas sealing, and sealing of a sealing member.

The present invention relates to the above-mentioned exhaust treatment,
A sealing member having a through hole is attached to a vent of the panel, and exhaust and gas sealing without using a chip tube are enabled by passing through the through hole of the sealing member. The conductance of the through-hole can be made larger than the conductance of the tip tube, and the steps of sealing and removing the tip tube can be omitted, so that exhaust and gas filling can be performed in a short time.

Further, the diameter of the through hole of the sealing member is made smaller than that of the ventilation hole of the panel, and the sealing member is bonded and sealed to the panel in two stages. By gradually narrowing and finally sealing, a series of manufacturing processes of the plasma display panel is subdivided in steps, and by combining with a tact transfer mechanism,
An in-line (single-wafer) PDP (plasma display panel) manufacturing apparatus can be configured, and the overall time required for manufacturing a plasma display panel can be reduced.

Therefore, the present invention provides a plasma display panel manufacturing method for manufacturing a plasma display panel using a panel formed by sealing a glass substrate, wherein a member for sealing a vent of the glass substrate forming the panel is provided. A sealing member having a through hole having a diameter at least on a side not in contact with the glass substrate smaller than the ventilation hole is prepared, and in the first bonding process, the sealing member is provided in at least one place of the glass substrate. In the second sealing process, gas is sealed in the inside of the panel through a through hole, and then the through hole is finally sealed. Thereby, the bonding / sealing process of the sealing member is performed stepwise. This sealing member can be constituted by a sealing dish having a through hole in the center, and can be made of, for example, metal or ceramic.

[0015] By making the bonding and sealing process of the sealing member stepwise, the diameter of the vent hole for exhausting and sealing the gas into the panel is gradually narrowed, and the working process is made continuous in a stepwise manner. Thereby, the manufacturing process time can be reduced.

In the sealing and exhausting step in the present invention, a sealed panel is used, and the panel is evacuated or filled with gas.
The final sealing of the panel is performed continuously as an evacuation process. The temperature range is different between the sealing process for sealing the glass substrate to form a panel and the bonding process for attaching the sealing member to the glass substrate. For example, the temperature of the sealing process for forming the panel is higher than the temperature at which the sealing member is bonded (for example, about 450 ° C.), and it is necessary to control the temperature to uniformly heat the entire glass substrate. At this time, the firing of the frit glass as the sealing material needs to be performed in an oxidizing atmosphere. On the other hand, the bonding of the sealing member is performed at a temperature lower than the sealing temperature of the glass substrate (for example, about 350 ° C.).
Exhaust and gas filling the panel.

In the evacuation process of the present invention, the sealing member is bonded to the glass substrate at a temperature of about 350 ° C., which is the highest temperature in the process, during the evacuation as a first bonding process. And
The panel is cooled while continuing exhausting the gas through the through-hole, gas is sealed, and the through-hole is finally sealed by the second sealing process. In this sealing process, only the through-hole is locally spot-sealed, so that the processing time is short.

An outline of the exhaust process according to the present invention will be described. FIG. 1 is a flowchart for explaining the exhaust process in the present invention. In FIG. 1, the temperature inside the panel is started (step S1), and then the exhaust inside the panel is started (step S2). As a first bonding process, a sealing member is attached to the vent of the panel, and heated and evacuated to a predetermined ultimate temperature (for example, about 350 ° C.) to bond the sealing member (Step S3). Until the specified ultimate pressure is reached
After exhausting the gas through the through hole of the sealing member and cooling the panel, gas is sealed in the inside of the panel through the through hole of the sealing member (step S4). Finally, the through-hole is sealed, and the sealed gas is confined in the panel.

In general, glass materials are difficult to handle with respect to temperature, and are liable to be distorted or cracked due to rapid temperature changes or temperature differences. Therefore, it is difficult to seal the vent of the glass substrate in one step and in a short time.

On the other hand, in the present invention, the work of bonding and sealing the sealing member can be completed by a short step-wise work, and the temperature of the glass substrate and the exhaust in the panel can be adjusted according to each stage. , Gas filling, etc., the cycle time of the sealing and exhausting step can be shortened.

In the present exhaust process, the first bonding process is performed in the exhaust process, so that the exhaust can be performed with a large exhaust conductance before the sealing member is brought into contact, and the exhaust time can be reduced. Can be shortened.

In the first bonding process, when the sealing member is attached to the vertically placed panel, the sealing member is pressed against the glass substrate by the holding means, whereby the sealing member is at least sealed with the sealing material. Until it is solidified, it needs to be positioned and fixed at the position of the vent of the glass substrate.

The first mode of filling the gas in the panel is performed by placing the panel in an atmosphere of the filling gas and performing gas leak until the inside of the chamber reaches the final sealing gas pressure. Further, in the second mode in which gas is sealed in the panel, at least the open end of the through hole of the sealing member is covered by the covering portion, and the inside of the covering portion is filled with the filling gas. The gas is sealed by the pressure difference. According to the second embodiment using the mounting portion, the usage amount of the sealed gas can be reduced. Note that in this second embodiment,
The chamber leak is performed in synchronization with the panel leak so that the pressure outside the panel (chamber side pressure) becomes slightly lower than the panel inside pressure. This prevents gas outside the panel from entering the panel, and minimizes the causes of strain and cracks generated in the glass substrate due to the pressure difference.

As the sealing material for sealing the through hole of the sealing member, low melting glass, black glass paste, or UV adhesive can be used. When a glass material is used, laser light such as a carbon dioxide laser or a YAG laser or heat from a light source such as an ultra-high pressure mercury lamp is condensed to melt and seal the glass material. When an adhesive such as an LDC panel can be used, the adhesive can be irradiated with UV light to be solidified and sealed.

Further, a plurality of vents may be provided in the glass substrate, and exhaust and gas filling of the panel may be performed through the plurality of vents. In this case, the plurality of vents may be individually or individually provided to the plurality of vents. The sealing member can be attached integrally. Further, by separately attaching the covered portions to the plurality of through holes of the sealing member, performing exhaust on one side, and introducing gas on the other side, it is possible to simultaneously perform cleaning of the inside of the panel.

[0026]

Embodiments of the present invention will be described below in detail with reference to the drawings. An embodiment of a method of manufacturing a plasma display panel according to the present invention will be described with reference to FIGS. FIG. 2 is a flowchart illustrating a first embodiment of a method of manufacturing a plasma display panel.
FIG. 4 is a diagram showing changes in temperature and pressure in the panel. In addition,
In the following description, a part corresponding to the exhaust processing in the processing generally called the sealing exhaust processing in the manufacture of the plasma display panel will be described.

The evacuation step of the present invention is a step of performing sealing after exhausting the inside of the panel and sealing the gas therein, and connecting and connecting L / C (introduction chamber) and P / C (process chamber). ), And introduction of panels at U / C (discharge chamber)
The processing includes heating and exhausting, bonding of a sealing member, exhausting, filling of discharge gas, sealing of a vent, and the like.

Therefore, first, a panel formed by sealing two glass substrates in advance is introduced into the L / C. In addition, a vent for exhausting the inside of the panel and filling the inside of the panel with gas is formed in the rear substrate of the panel (step S11). In L / C, preheating is started and exhaust is started (step S12).

The panel is transported from the L / C to the P / C,
The air is exhausted in / C and heated by the heating means to increase the temperature (step S13).

Next, in steps S14 to S16, the sealing member (sealing plate) is bonded. FIG. 4 is a view for explaining the sealing of the sealing member, and shows an example in which a sealing plate 10 is used as the sealing member. In FIG. 4, a panel 3 is composed of a first glass substrate (rear substrate) 1 and a second glass substrate (front substrate) 2 bonded together with a gap 5 therebetween, and a seal applied to a peripheral portion between the substrates 1 and 2. The sealing material 4 is formed by heating and sealing. First glass substrate 1
Is provided with a vent 6 penetrating therethrough.

4 (a) and 4 (b), a sealing material 12 such as a low melting point glass is provided near the vent 6 of the first glass substrate 1.
Is applied and adhered, and the sealing plate 12 is sandwiched by the sealing material 12.
Is brought into contact with the first glass substrate 1. A through hole 11 is formed in the sealing dish 10. In the contact of the sealing plate 10, the position of the vent 6 of the first glass substrate 1 and the position of the sealing plate 10
Is aligned with the position of the open end of the through hole 11 (step S14).

When heating and evacuation are performed while the panel 3 is held in the vertical direction, the sealing member (sealing plate 1) is held by the holding means 14 at least until the sealing material 12 is solidified.
0) is held. FIG. 5 is a diagram illustrating a holding unit that holds the sealing member. The holding means 14 can be configured to use a spring mechanism, and presses the sealing dish 10 against the first glass substrate 1 (FIG. 5A) to hold (FIG. 5B). ). Thus, even when the panel 3 is held in the vertical direction, the sealing member (sealing plate 10) can be held at the position of the vent 6 (step S1).
5).

The temperature is a predetermined temperature (for example, about 350 ° C.)
After the temperature is increased to a certain level, the temperature is maintained at a uniform temperature for a predetermined time that the sealing material 12 is completely melted, and then cooled. Thereby, the sealing member is bonded.

After the mounting of the sealing member, the exhaust of the panel 3 is continued through the through hole 11 of the sealing member,
Evacuate. Note that the exhaust speed through the through-hole 11 is lower than before the sealing member is attached.

The exhaust in the P / C may be performed after the sealing member is attached. According to this aspect, the bonding of the sealing member can be performed in an oxygen atmosphere.

The solid line shown in FIG. 3 indicates the pressure history. While the air is exhausted, the temperature of the panel 3 is cooled at a temperature lowering rate at which no distortion occurs (steps S16, S17, S18).

After cooling, the panel 3 was changed from P / C to U / C
(Step S19), and the discharge gas is introduced into the U / C. The sealing gas introduced into the U / C leaks gas through the through hole 11 of the sealing plate 10 due to a pressure difference from the inside of the panel, and the sealing gas is sealed in the panel 3 (step S20).

After the gas is sealed in the panel 3, the through hole 11 of the sealing dish 10 is sealed in an atmosphere of the sealed gas. To seal the through-hole 11, a sealing material 13 such as a low-melting glass, a black glass paste, or a UV adhesive is attached to the through-hole 11, and in the case of a glass material, a carbon dioxide laser, a YAG laser, or the like is used. Laser light or light from an ultra-high pressure mercury lamp is condensed to melt and seal the glass material. In the case of a UV adhesive, the UV adhesive is irradiated to solidify the UV adhesive. Sealing.

FIG. 6 is a view showing one means for heating the sealing material 13. In FIG. 6, a light beam heating means 27 is provided outside the vacuum chamber 25, and the light beam heating means 27 is provided.
Irradiates the sealing material 13 through the window 26 from above, thereby performing heating. FIG. 4C shows a sealed state of the through hole. In this sealed state, the inside of the panel 3 is filled with the sealing gas and is shielded from the outside (step S21). After the sealing of the panel is completed, the panel 3 is
C and carried to the next step (step S2).
2).

The holding means 14 for holding the sealing dish 10
Can be removed at any stage after step S16, and the gas filling in step S20 can be performed regardless of the state in which the holding means 14 is attached or removed. Note that L / C, P / C, and P
Each process performed in each chamber of / C is performed stepwise.

The sealing dish 10 is not limited to the shape shown in FIG. Hereinafter, other embodiments of the sealing dish will be described. FIG. 7 is a cross-sectional view for explaining another embodiment of the sealing dish. Each of the sealing plates 20 and 22 shown in FIG. 7 is an example of a configuration including projections 21 and 23 having through holes 11. The protruding portion 21 has a shape in which the front end portion bulges in the circumferential direction, and the protruding portion 23 has a frustoconical shape in which the front end portion is thin.

The sealing plates 20 and 22 can be attached to the first glass substrate 1 in the same manner as the sealing plate 10 shown in FIG. 4 (FIGS. 7A and 7B). The sealing of the sealing plates 20 and 22 is performed by deforming the protruding portions 21 and 23 and closing the through holes 11. To close the through hole 11, the heat block 24 is pressed against the protrusions 21 and 23 (FIG. 7).
(C)) The protrusion 2 is formed by pressing while heating.
This can be done by deforming 1, 23 (FIG. 7D).

Next, another embodiment of the sealing process will be described with reference to FIGS. In this form of the sealing process, the sealing of the through hole of the sealing member is performed using at least the portion to be covered which covers the through hole.

FIG. 8 is a flowchart for explaining a procedure for sealing the through-hole of the sealing member. It should be noted that this flowchart shows only the procedure for sealing the through-hole, and the procedure before this processing is the same as the procedure up to step S18 in the flowchart of FIG. 2, and thus shows only the processing after step S18. The broken lines in FIG. 3 indicate changes in temperature and pressure in the chamber according to this embodiment.

After the panel on which the sealing member is mounted is transported into the U / C (step S51), the gas sealing tube is brought into contact with the sealing member. FIGS. 9 and 10 are diagrams for explaining the mounted portion 31. FIG. The covering portion 31 includes a cover 33 having a diameter enough to cover at least the through hole 11 of the sealing member.
The side of the cover 33 facing the through-hole 11 is opened, and an O-ring 32 is provided at the contact portion. Also, the cover 33
Is connected to a vacuum exhaust system 41 and a sealed gas source 43 provided outside the vacuum chamber 21 via valves 42 and 44, respectively. An inert gas source 45 is connected to the vacuum chamber 21 via a valve 46. A heating means is attached to the cover 33. As a heating means,
An optical system 29 for irradiating a laser beam by introducing a laser beam from the outside with an optical fiber 28 or the like, or a heat block 2 that can move forward and backward.
4 can be attached. If, for example, a YAG laser is used as the laser light source, it can be introduced into the cover 33 by an optical fiber.

The sealing means for sealing the through-hole is provided inside the covered portion 31 and also outside the covered portion 31,
It can also be performed by irradiating light through a window provided in the covered part 31.

O-ring 3 of cover 33 of gas sealing tube 31
By bringing 2 into contact with the first glass substrate 1 or the sealing dish 10, the inside of the panel 3 has the same atmosphere as the inside of the cover 33 through the through hole 11. Here, when the mounted part 31 is attached to the panel in the evacuated vacuum chamber 21, the inside of the panel 3 is kept in the evacuated state and is in a state of being cut off from the outside of the panel 3. Therefore, the degree of vacuum in the panel can be further increased by the evacuation system 41. (Step S52).

When the sealing gas is introduced from the sealing gas source 43 into the cover 33 with the mounting portion 31 attached, the pressure inside the panel 3 is low, and the sealing gas leaks into the panel 3 due to the pressure difference. (Step S53).

The inert gas leaks from the inert gas source 45 into the vacuum chamber 21 via the valve 46.
At this time, the pressure in the vacuum chamber 21 is set slightly lower than the pressure in the panel 3. Increasing the pressure in panel 3 prevents the inert gas from leaking into panel 3, and reducing the pressure difference prevents deformation of glass substrates 1 and 2 due to the pressure difference (step). S54).

After introducing the sealing gas into the panel 3, the through-hole 11 of the sealing plate 10 is sealed in the same manner as in the above-mentioned items 21 and 44 (step S55), and the panel is carried out from the U / C (step S55). S56).

The part to be covered is not limited to the inside of the U / C, but the P / C
Can be provided in each processing step, and the inside of the panel can be evacuated by connecting a vacuum evacuation system to the portion to be mounted.

The bonding and exhausting of the panel can be performed with the panel as it is or with the panel held. 11 and 12 are a schematic perspective view and a sectional view showing a form of a holder for holding the panel of the present invention. The heating of the panel 3 can be performed with the glass substrate as it is, or can be performed while being held by the holder 50.
The holder 50 holds the heat equalizing plates 53 and 54 in contact with the panel 3, and introduces the heat equalizing plates 53 and 54 into a heating unit (not shown) while being housed in the holder 50. In this heating means, heating can be performed by contact heat transfer.

FIGS. 11 (a) and 12 (a) are perspective views of the holder with the heat equalizing plate opened.
(B) and FIG. 12 (b) are perspective views of the holder with the heat equalizing plate closed, and FIGS. 11 (c) and 12 (c) are cross-sectional views of the holder with the heat equalizing plate closed. is there.

As shown in FIG. 11, the first example of the structure of the holder includes two heat equalizing plates 53 and 54,
52 so as to be openable and closable.
By holding the panel 1 at 4, the panel 1 is held in a state where both surfaces of the panel 1 are in contact with the heat equalizing plates 53 and 54. In addition,
One of the heat equalizing plates 53 is provided with a vent 56 penetrating at a position corresponding to the vent of the panel 1.

As shown in FIG. 12, a second configuration example of the holder includes two heat equalizing plates 53 'and 54'
The heat equalizing plates 53 ', 5
By closing 4 ′, both sides of panel 3 are
Holding is performed while making contact with 3 'and 54'. Note that one of the heat equalizing plates 53 'is provided with a vent 56' penetrating to a position corresponding to the vent of the panel 3.

The heat equalizing plates 53, 54, 53 ', 54'
Is a member in which one surface is in contact with the plane portion of the panel 3 and the other surface is in contact with the heating surface of the heating means, and efficiently and uniformly transmits heat to the panel 3.

In the panel held in the holder, the sealing member can be bonded, evacuated, and filled with gas as described above. FIG. 13 is a diagram for explaining exhaust and sealing of the panel held in the holder. FIG.
In the same manner as in FIG.
Is brought into contact with the panel 3 held by the holder 50. At this time, the tip of the cover 33 can be in contact with the glass surface of the panel 3 as shown in the figure, or can be in contact with the surface of the sealing dish 10.

Further, a plurality of vents can be provided in the panel 3, and the time for exhaust and introduction of the sealed gas can be reduced. As shown in FIG. 14, the sealing plates 10a, 10b are respectively provided for the plurality of ventilation holes 6a, 6b.
b, gas-filled tubes 31a and 31b can be used for each, and one of the gas-filled tubes 31a (or 3
Evacuation is performed in 1b), and gas can be sealed in the other gas sealing tube 31b (or 31a). According to this configuration, the inside of the glass panel can be cleaned.

According to the method of manufacturing a plasma display panel of the present invention, the operation of bonding and sealing the sealing member can be completed by a short step-wise operation without using a chip tube. In addition, by performing various processes such as controlling the temperature of the glass substrate, exhausting the inside of the panel, and filling gas, the cycle time of the sealing and exhausting step can be shortened.

Further, by the stepwise bonding / sealing, the final sealing can be spot sealing for sealing a small area, and the processing time for the bonding / sealing can be reduced. . In addition, an automatic in-line device can be configured in combination with the panel tact transfer mechanism.

Further, according to the present invention, it is possible to suppress distortion and cracks generated in the panel due to temperature and pressure.

[0062]

As described above, according to the method of manufacturing a plasma display panel of the present invention, the exhausting process of the sealed glass panel can be automatically performed in-line, and the productivity can be greatly improved by continuous production. Can be.

[Brief description of the drawings]

FIG. 1 is a flowchart for explaining a sealing exhaust process in the present invention.

FIG. 2 is a flowchart illustrating an embodiment of the present invention.

FIG. 3 is a diagram showing changes in temperature and pressure in a panel according to an embodiment of the present invention.

FIG. 4 is a diagram for explaining sealing of a sealing member according to an embodiment of the present invention.

FIG. 5 is a diagram illustrating a holding unit for holding the sealing member of the present invention.

FIG. 6 is a view showing a heating means for heating the sealing material of the present invention.

FIG. 7 is a cross-sectional view for explaining another embodiment of the sealing member of the present invention.

FIG. 8 is a flowchart illustrating an embodiment of the present invention.

FIG. 9 is a view for explaining a covered part of the present invention.

FIG. 10 is a view for explaining a covered part of the present invention.

FIG. 11 is a schematic perspective view showing a form of a holder for holding the panel of the present invention.

FIG. 12 is a cross-sectional view showing a form of a holder for holding the panel of the present invention.

FIG. 13 is a view for explaining sealing of the panel held by the holder of the present invention.

FIG. 14 is a view for explaining a covered part of the present invention.

FIG. 15 is a schematic cross-sectional view for explaining a tip tube used in a conventional sealing exhaust process.

[Explanation of symbols]

1, 2, glass substrate, 3 panel, 4, 12 sealing material,
5 gap, 6 vent, 10, 20 sealing plate, 11 through hole, 13 sealing material, 14 holding means, 21, 23 projecting part, 24 heat lock, 25 vacuum chamber, 26
... window, 27 ... light beam heating means, 28 ... optical fiber, 2
9: Optical system, 31: Covering part, 32: O-ring, 33: Cover, 41: Vacuum exhaust system, 42, 44, 46: Valve,
43: sealed gas source, 45: inert gas source, 50, 50 '
... Holders, 51, 52 ... Holding frames, 53, 54, 53 ',
54 ': heat insulating plate, 55: hinge, 56, 56': vent, 100: chip tube, 101: sealing material for connecting the chip tube.

Claims (3)

[Claims] 1. A plasma display panel manufacturing method for manufacturing a plasma display panel including a panel formed by sealing a glass substrate, wherein a ventilation member provided with a sealing member having a through hole at at least one position of the glass substrate. A method for manufacturing a plasma display panel, comprising: an adhesion process for adhering to a mouth; and a sealing process for sealing the through hole after exhausting and filling gas in the panel through the through hole of the sealing member. 2. The method of manufacturing a plasma display panel according to claim 1, wherein the diameter of the through hole at least on the side not in contact with the glass substrate is smaller than the diameter of the vent of the glass substrate. 3. The method of manufacturing a plasma display panel according to claim 1, wherein the exhaust and gas filling in the panel are performed by a covering portion covering at least an open end of a through hole of a sealing member.