JPH11298178A - Cabinet for accommodating electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively dissipate heat of mounted components in a tightly closed type cabinet and increase allowable thermal capacity, by installing a heat dissipating plate on the tip part of a shaft protruded from fins for heat dissipation on the outer wall surface of the cabinet in which electronic components are accommodated. SOLUTION: A large number of long plate type fins for heat dissipation are protruded with pitches on the outer wall surfaces of a lid 1 and a cabinet 2. Electronic components 4 which generate heat during operation are accommodated in the cabinet 2. The lid 1 is tied on the upper surface of the cabinet 2 with machine screws 5. In the fins 3, holes 9 are formed, in which shafts 8 are inserted. The base end portions of the shafts 8 are slightly made to progress in the cabinet 2. Heat dissipating plates 6 are installed on the tip parts of the shaft 8 which parts are protruded from the fins 3 to the outside. As a result heat in the cabinet 2 is conducted to the heat dissipating plates 6 via the shafts 8. The shafts 8 of thermal conductor and the heat dissipating plates 6 are arranged on arbitrary fins 3 out of a large number of the fins 3. The angles of the heat dissipating plates 6 at the time of fixing the shaft 8, on which the heat dissipating plates 6 are fixed, to the fins 3 are set arbitrarily to the gravity direction (g).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component housing for housing electronic components that generate heat.

[0002]

2. Description of the Related Art A conventional electronic component housing for housing electronic components that generate heat during driving includes a case in which a large number of heat dissipating fins are provided on each surface of an outer wall of the housing which does not require power supply. As shown in Japanese Patent Publication No. 59-158, a device using a heat pipe is generally used. FIGS. 7 and 8 show such a conventional heat dissipation structure. 7 and 8 are perspective views of a conventional electronic component housing.
In FIG. 7, the lid 20 is attached to the housing 21 with screws 22. By providing a large number of fins 23 on each surface of the outer wall of the housing 21, heat is released from the entire housing wall.

[0003] In FIG. 8, a lid 24 is fastened to a housing 25 with screws 26, and an electronic component (not shown) that generates heat is mounted on a bottom surface 27 inside the housing 25. The heat of the electronic components is transmitted to the lower end of the heat pipe 29 formed on the side wall 28 via the bottom of the bottom surface 27 and the base of the side wall 28, and the cooling liquid sealed inside the heat pipe 29 vaporizes and liquefies. Release heat by repeating.

As a method of forced cooling, Japanese Patent Laid-Open No.
Japanese Patent Application Laid-Open No. 260893 and Japanese Patent Application Laid-Open No. 6-61673.
In some cases, a cooling device and its control device need to be supplied with power, such as a case with a built-in housing as disclosed in JP-A-152-152.

[0005]

This type of housing is required to take measures against the heat which increases with the miniaturization and the processing speed of the equipment year by year. For example, a complete mobile base station like an outdoor installation type simple mobile base station is required. In a closed housing, heat in the housing must be carried out of the housing in order to keep the temperature rise of electronic components in the housing below the operation guarantee temperature. As the most effective method, it is conceivable to install a cooling device in which a fan, a Peltier effect element, a heat exchanger for cooling circulation and the like are used alone or in combination.

However, the installation of the cooling device is difficult and practical due to the limitations of weight and installation location, the necessity of a control device and the necessity of power supply and piping, noise, maintenance and inspection, and the like. Often not. Therefore, it is necessary to take measures to dissipate heat in the housing itself. A large number of radiating fins are arranged on each surface of the outer wall, and the surface is painted with an emissivity close to 1. However, even if these measures are taken, the allowable heat capacity with respect to the housing volume is almost fixed, and there is a limit in improving the heat radiation.

[0007] Therefore, the present invention efficiently dissipates heat of electronic components mounted in a closed-type housing, and can increase the allowable heat capacity with respect to the housing volume without expanding the housing volume. It is intended to provide a housing for use.

[0008]

According to the present invention, a radiating fin projects from an outer wall surface of a housing in which an electronic component is housed, a shaft is inserted into the fin, and a tip of the shaft protrudes from the fin. A housing for electronic components, wherein a heat radiating plate is attached to a part.

According to the present invention, the allowable heat capacity can be increased without increasing the volume of the housing, the temperature of the electronic components is suppressed, the performance of the electronic components is stabilized, and the reliability of the entire device is improved. And a housing for storing electronic components.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention according to the first aspect of the present invention comprises a fin for projecting heat on an outer wall surface of a housing in which an electronic component is stored, and a shaft is inserted into the fin to project from the fin. A housing for electronic components, wherein a heat radiating plate is attached to a tip of a shaft to be mounted.

In this configuration, heat generated by the electronic component is transmitted to the outside of the housing through the shaft, and is released from the heat radiating plate to the outside. Therefore, it is possible to suppress a rise in temperature inside the housing.

According to a second aspect of the present invention, in the first aspect of the present invention, the base end of the shaft projects into the body.

According to this configuration, the heat in the housing can be more efficiently transmitted from the shaft to the radiator plate, and the temperature rise in the housing can be further suppressed.

According to a third aspect of the present invention, in the first or second aspect, the shaft is a heat pipe.

According to this configuration, when heat is applied to the heat receiving portion of the heat pipe, the coolant on the inner wall of the portion takes the heat as latent heat and boils into steam, which has a high pressure. Therefore, it moves inside at high speed and releases latent heat when condensed in the heat radiating section, and the added heat is released to the outside and the condensed coolant is continuously transported by repeating the cycle of returning to the heat receiving section by capillary action Since it is characterized by highly efficient thermal conductivity and thermal responsiveness, it is possible to greatly promote heat transport.

(Embodiment 1) FIG. 1 is a perspective view of an electronic component housing according to a first embodiment of the present invention, and FIG. 2 is a partial perspective view of an outer wall portion of the electronic component housing. 3 is a partial cross-sectional view of the outer wall of the electronic component housing.

In FIG. 1, the lid 1 is fastened to the upper surface of the housing 2 with screws 5. On the outer wall surface of the lid 1 and the housing 2, a large number of long plate-shaped heat radiation fins 3 are provided with a pitch. An electronic component 4 is housed inside the housing 2. The electronic component 4 generates heat during driving.

FIG. 2 is an enlarged view in which a part of the portion A in FIG. 1 is separated, and a hole 9 is formed in the fin 3.
The shaft 8 is inserted into the. Further, a heat radiating plate 6 is attached to a tip portion of the shaft 8 projecting outward from the fin 3. As shown in FIG. 3, the base end of the shaft 8 is
Slightly into the interior. Therefore, the heat in the housing 2 is transmitted to the heat sink 6 through the shaft 8 (arrow in FIG. 3). The shaft 8 and the radiator plate 6
Can be provided on any of the fins 3.

The shaft 8 and the heat radiating plate 6 are heat conductors, and can be made of metal or resin. In particular, metal is preferable from the viewpoint of heat conductivity. For example, aluminum alloy, copper alloy, steel, etc. can be used. Alloys are preferred in terms of thermal conductivity, weight, and cost. The lid 1 and the housing 2 are cast or molded products, and metals or resins can be used. In particular, metals are preferable in terms of thermal conductivity. For example, aluminum alloys, magnesium alloys, zinc alloys, and the like can be used, and especially aluminum alloys can be used. Is preferred in terms of thermal conductivity, weight and cost. The shaft 8 can be fixed by welding, bonding, press-fitting, a method of cutting a male screw on the outer peripheral surface of the cylinder, cutting a female screw on the fin 3, and screwing the shaft. In particular, press-fitting is preferable in terms of good workability. The heat sink 6 may be attached by welding, bonding, integral molding with the shaft 8, shaving, or the like. In particular, integral molding with the shaft 8 is preferable in terms of productivity and cost.

In FIG. 2, when the shaft 8 to which the heat radiating plate 6 is attached is attached to the fin 3, the angle of the heat radiating plate 6 can be set at any angle with respect to the direction g of gravity. In the case where a large number of fins are attached to one fin as shown in FIG.

(Embodiment 2) FIG. 4 is a partial perspective view of an outer wall portion of an electronic component housing according to Embodiment 2 of the present invention. The heat radiating plate 7 of the second embodiment is made of metal or synthetic resin, has a U-shaped fitting portion 7a at the center thereof, and is elastically detachably fitted to the shaft 8. Other configurations are the same as the first embodiment. Therefore, this also has the same operation and effect as in the first embodiment.

(Embodiment 3) FIG. 5 is a partial perspective view of an outer wall portion of an electronic component housing according to Embodiment 3 of the present invention. A large number of heat radiating plates 6 are mounted on the shaft 8. By increasing the number of heat sinks 6 in this manner,
The heat radiation effect can be further improved.

(Embodiment 4) FIG. 6 is a partial sectional view of an outer wall portion of a housing for electronic components according to Embodiment 4 of the present invention. This shaft 10 is a heat pipe. Since the heat pipe 10 is excellent in heat conductivity and heat responsiveness, the heat radiation effect can be further improved.

[0024]

As described above, according to the present invention, the heat in the housing is radiated to the atmosphere to suppress the rise in the temperature of the electronic components, stabilize the performance of the electronic components, and improve the reliability of the entire device. ,
Since the allowable heat capacity with respect to the housing volume can be increased, the processing speed of the device can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component housing according to a first embodiment of the present invention.

FIG. 2 is a partial perspective view of an outer wall of the electronic component housing according to the first embodiment of the present invention.

FIG. 3 is a partial cross-sectional view of an outer wall portion of the electronic component housing according to the first embodiment of the present invention.

FIG. 4 is a partial perspective view of an outer wall of an electronic component housing according to a second embodiment of the present invention.

FIG. 5 is a partial perspective view of an outer wall portion of the electronic component housing according to the third embodiment of the present invention.

FIG. 6 is a partial sectional view of an outer wall of an electronic component housing according to a fourth embodiment of the present invention.

FIG. 7 is a perspective view of a conventional electronic component housing.

FIG. 8 is a perspective view of a conventional electronic component housing.

[Explanation of symbols]

 2 Housing 3 Fin 4 Electronic component 6, 7 Heat sink 8 Shaft 10 Heat pipe

Claims (3)

[Claims] A radiating fin is projected from an outer wall surface of a housing in which an electronic component is stored, a shaft is inserted into the fin, and a radiating plate is attached to a tip of the shaft protruding from the fin. A housing for electronic components. 2. The electronic component housing according to claim 1, wherein a base end portion of said shaft projects into said main body. 3. The electronic component housing according to claim 1, wherein said shaft is a heat pipe.