JPH11284328A - Solder reflow method and apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the heat influence on a BGA substrate by irradiating parallel heat beams on the substrate with a plurality of solder balls disposed thereon, using a plane heat type light heater to weld and connect the plurality of solder balls to solder ball set positions on the substrate. SOLUTION: A first and second plane heat type light heaters 101, 102 constitute a solder reflow apparatus, the first plane heat type light heater 101 has a first light source 103 capable of the plane heating within an irradiation range and can change the heating condition by changing the tilt angle, using a first angle adjuster 105, the first plane heat type light heating heater 101 can change the heating condition by changing the tilt angle, using a second angle adjuster 106, a substrate position detecting sensor detects the substrate carried by a substrate carrier mechanism to control the outputs of the light sources 103, 104 to fuse and connect solder balls. Thus it is possible to suppress the heat influence on the BGA substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a solder reflow method and a solder reflow apparatus.

[0002]

2. Description of the Related Art As electronic devices have become smaller, lighter, and more multifunctional, electronic components used therein have also become smaller, lighter, and multifunctional. For this reason, in particular, high-density mounting of a BGA (Ball Grid Array) package, a semiconductor device using flip chip bonding, and the like has been developed.

A BGA package uses a printed wiring board, a high heat conductive ceramic such as aluminum nitride, and a high heat resistant resin such as a polyimide resin. A bump formed of a solder-plated copper ball or the like is arranged, and is melted to connect an input / output unit of a package to a terminal of a wiring board. With the advent of such technology, BGA packages have become QFP (Q
This is an excellent package that can be easily reduced in size and highly integrated, as compared with connecting to a printed wiring board by using a flat board (uad Flat Package).

[0004] In the production of the BGA package as described above, formation of bumps on a substrate is an important operation. Generally B
In order to form a GA substrate, bumps are formed on the substrate by, for example, holding a solder ball on a head and mounting it on a work electrode, as disclosed in the prior art of Japanese Patent Application Laid-Open No. 9-82713. After that, the work is heated in a heating furnace to melt and separate the solder balls to form bumps (protruding electrodes) on the electrodes.

More specifically, in the bump formation of a conventional BGA substrate, a flux is applied to a bump formation portion of a BGA substrate, solder particles are aligned and mounted thereon, and temporarily fixed by utilizing the viscosity of the flux. Next, the BGA substrate on which the solder balls are mounted is transferred to a reflow furnace. In the reflow furnace, the solder particles are melted to form bumps on the BGA substrate.

The bump forming apparatus includes a substrate take-out apparatus,
A flux coating device, a solder particle aligning and mounting device, a reflow furnace, and the like are installed.

[0007]

SUMMARY OF THE INVENTION A reflow furnace for melting and solidifying solder particles placed on a BGA substrate is described below.
Among the bump forming apparatuses, when compared to a flux coating apparatus, a solder particle aligning and mounting apparatus, and the like, the size becomes large. How to reduce the area occupied by the reflow apparatus in the bump forming apparatus has been a major issue from the viewpoint of the arrangement of the equipment in the production factory.

[0008] Further, in order to melt and solidify the solder particles placed on the BGA substrate, the BGA substrate must pass through a long furnace of the reflow furnace. There is a problem that the BGA substrate deteriorates in function or becomes defective.

Further, since a large amount of energy is required to heat the inside of the reflow furnace, it is also a major problem how to suppress the energy used.

Therefore, the present invention makes it easy to reduce the size of the device.
It is an object of the present invention to provide a solder reflow method and a solder reflow device that can suppress the thermal influence on the BGA substrate when the solder particles are melted and solidified, and that can perform efficient heating.

[0011]

According to a first aspect of the present invention, there is provided a solder reflow method, wherein a substrate on which a plurality of solder balls are arranged is irradiated with a heat beam in parallel by using a surface heating type light heater, whereby the substrate is reflowed. A solder ball fusion connection step of melting and connecting the plurality of solder balls to a solder ball arrangement position.

Here, the substrate is glass epoxy, organic plastic film or sheet or alumina,
The wiring board is formed using ceramics such as silicon carbide and a material such as silicon.

A surface heating type light heater is a surface heating type light heater having a reflecting mirror for reflecting and irradiating a heat ray emitted from a heating light source in parallel, or a heat ray emitted from the heating light source. A surface heating type light heater that changes the optical axis using a lens and performs parallel irradiation, or a reflecting mirror that reflects heat rays emitted from a heating light source, and a lens that changes the optical axis and uses This is a surface heating type light heater to be irradiated.

Further, the parallel irradiation means that when the light starting from each point of the light source is treated geometrically, a reflecting mirror or
Irradiating each light beam that has passed through a lens or the like as a parallel light beam or a substantially parallel light beam.

[0015] The term "fusion connection" means that the solder ball is heated while the solder melting temperature is maintained, the solder of the solder ball is fixed at the solder ball arrangement position, and the solder ball and the electrode at the solder ball arrangement position are connected to each other. Are electrically and mechanically connected to each other.

By irradiating the ball mounting surface of the BGA substrate with a heat beam using the heater described above, the BGA substrate is heated by the irradiated heat beam and the solder balls can also be heated.

When the plurality of solder balls mounted on the BGA substrate reach the melting temperature by the radiated heat rays, the solder balls are melt-connected to the positions of the solder balls on the BGA substrate, and the bump electrodes are connected to the BGA substrate. Is formed.

As a result, according to the solder reflow method of the present invention, it is possible to easily reduce the size of the solder reflow device, to suppress the thermal effect on the BGA substrate when the solder balls are melted and solidified, and to improve the efficiency. Enables effective heating.

According to a second aspect of the present invention, there is provided the solder reflow apparatus according to the first aspect, wherein the substrate is disposed at a right angle to a heat beam irradiated in parallel by the surface heating type light heater. A ball fusion connection step is performed.

Here, the term "perpendicular" means that when the light starting from each point of the light source is treated geometrically, each light beam that has passed through a reflecting mirror or a lens becomes a parallel light beam. The light receiving surface of the substrate is disposed at a right angle to the parallel light beam. The reason for making the right angle is that the light receiving area of the substrate receives uniform light energy by arranging the substrate at a right angle to the parallel light beam. This makes it possible to perform uniform heating.

The surface heating type light heater arranged is a heater having a reflecting mirror for reflecting and parallelly irradiating a heat ray radiated from the heating light source, and mounts the substrate in a direction perpendicular to the above-mentioned parallel ray. With this arrangement, the ball mounting surface of the BGA substrate placed in the irradiation range can suppress the variation in the heating temperature due to the heat rays, and the uniform bump electrodes can be formed on the BGA substrate.

According to a third aspect of the present invention, there is provided the solder reflow method according to the first aspect, wherein the substrate is disposed obliquely with respect to the parallel-irradiated heat ray of the surface heating type light heater. A solder ball fusion connection step is performed.

Here, the oblique arrangement means that when light starting from each point of the light source is treated geometrically, each light beam that has passed through a reflecting mirror, a lens, or the like is emitted as parallel light beams. The light receiving surface of the substrate is obliquely arranged with respect to the parallel light, and the oblique arrangement is performed by arranging the substrate obliquely with respect to the parallel light so that the light receiving range of the substrate is It is possible to change the distance from the light source, and the closer the distance of the light beam starting from each point of the light source to reaching the substrate is, the stronger the light energy can be obtained. The farther the distance is, the lower the light energy is obtained. Therefore, by arranging the substrate obliquely with respect to the parallel light beam, it is possible to change the light reaching distance from the light source, and to change the heating temperature of the substrate within the light receiving surface.

A solder reflow method according to a fourth aspect of the present invention is the solder reflow method according to any one of the first to third aspects, wherein the solder ball fusion connection step is performed while moving the substrate. .

The term “movement” refers to relatively moving the irradiation range of the substrate. When the distance from the light source changes in the light receiving range of the substrate, the substrate is moved in the direction of the change in the distance from the light source. It is desirable to do.

By moving the substrate in an irradiation range in which the distance from the surface heating type light heater to the substrate is changed,
The ball mounting surface of the BGA substrate is gradually heated by a heat ray to give a temperature difference to the substrate surface, and it is possible to perform a fusion connection at a solder ball arrangement position.

Further, by reversing the inclination direction,
It is also possible to rapidly melt the solder balls and cool the substrate.

According to a fifth aspect of the present invention, in the solder reflow apparatus, a surface heating type light heater capable of irradiating heat rays in parallel, and a surface heating type light heater holding portion for holding the surface heating type light heater. And a substrate mounting portion for mounting the substrate on which the solder balls are arranged.

In the solder reflow apparatus, a BGA substrate transfer mechanism, a substrate mounting portion connected to the BGA transfer mechanism, and a surface heater are arranged opposite to the substrate mounting portion.

The solder reflow device mounts a substrate on which a plurality of solder balls are mounted in a substrate mounting range of the substrate mounting portion, thereby reflecting a predetermined heat ray radiated from a heating light source to be parallelized. A plurality of solder balls mounted on the substrate by heat rays will be placed within the heating range of the surface heating type light heater having a reflecting mirror to be irradiated,
It becomes possible to perform a fusion connection to the solder ball arrangement position of the substrate.

According to a sixth aspect of the present invention, in the solder reflow apparatus according to the fifth aspect, a transport mechanism for transporting the substrate and positioning the substrate in a substrate mounting range of the substrate mounting portion. And a positioning mechanism.

The solder reflow device is transported to a substrate mounting portion by a substrate transport mechanism on which a plurality of solder balls are mounted, and is mounted on a substrate mounting area of the substrate mounting portion, thereby setting a predetermined heating. And a plurality of solder balls mounted on the substrate by the heat beam, which are placed within a heating range of a surface heating type light heater having a reflecting mirror for reflecting and irradiating the heat beam emitted from the light source for parallel irradiation. Can be melt-connected to the solder ball arrangement position of the substrate. The substrate in which a plurality of solder balls are connected by fusion is discharged from the substrate mounting portion by a transport mechanism, and transported to an inspection device, a substrate stock device, or the like.

According to a seventh aspect of the present invention, in the solder reflow apparatus according to the fifth aspect, the surface heating type light heater holding portion has a function for adjusting an inclination angle of the surface heating type light heater. It is characterized by having.

By providing the surface heating type light heater holding portion with an inclination angle adjusting function, by applying an inclination angle to the surface heater and the substrate, a temperature difference is caused in an irradiation range on the substrate. Becomes possible. The tilt angle adjustment function is arranged so that the generated temperature difference is caused in the moving direction of the substrate, so that the irradiation range in which the distance to the substrate is changed is moved by the substrate, and the ball mounting of the BGA substrate is performed. The mounting surface is gradually heated by the heat ray to give a temperature difference to the substrate surface, and it is possible to perform a fusion connection at a solder ball arrangement position.

Further, by reversing the inclination direction,
It is also possible to rapidly melt the solder balls and cool the substrate.

According to an eighth aspect of the present invention, in the solder reflow apparatus according to any one of the fifth to seventh aspects, the surface heating type light heater is a line type.

The surface heating type optical heater is a surface heating type optical heater having a reflecting mirror for reflecting and irradiating a heat ray emitted from a heating light source in parallel, and is a line type having a width larger than the width of the BGA substrate. And a line-type light-emitting portion, it is possible to melt-connect a plurality of solder balls mounted on the substrate to the positions of the solder balls on the substrate.

According to a ninth aspect of the present invention, in the solder reflow apparatus according to any one of the fifth to eighth aspects, the heating light source emits a heat ray such as a near infrared ray or an infrared ray. It is a heater.

The surface heating type light heater is a surface heating type light heater having a reflecting mirror for reflecting and parallelly irradiating the heat light emitted from the heating light source. Heat rays such as infrared rays and infrared rays are used. Preferably, a heater that can be heated by near infrared rays and generates a halogen beam is preferable.

As described above, according to the present invention, a BGA substrate having the same quality can be obtained in a small space, and the heating range can be suppressed as compared with the method using a reflow furnace. Therefore, there is an effect that the energy used can be suppressed.

[0041]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is an explanatory view of a BGA substrate manufactured by the solder reflow method of the embodiment.
FIG. 2 is a cross-sectional view of a GA substrate, and FIG. 2B is a plan view of a BGA substrate. The BGA substrate 10 has a BGA substrate 1, a semiconductor chip 3, wires 4, a sealing resin portion 5, and a plurality of solder ball arrangement positions 2.

The BGA substrate 10 has the semiconductor chip 3 mounted on the BGA substrate 1 and the electrodes 9 of the semiconductor chip 3 and the BG
The connection portion 6 of the A substrate 1 is connected with the wire 4 and connected to the solder ball arrangement position 2 on the surface of the BGA substrate 1 by a through hole 8 or the like. Semiconductor chip 3 and wire 4
And the connection part 6 are sealed with a sealing resin to form the sealing resin part 5. Solder balls 7 are placed at solder ball arrangement positions 2, and solder balls 7 are soldered to solder ball arrangement positions 2 by heat.

FIG. 2 is a schematic diagram for explaining the solder reflow device of the embodiment. Solder reflow device 100
Are a first surface heating light heater 101, a second surface heating light heater 102, a first light source 103, a second light source 104, a first angle adjustment unit 105, and a second angle adjustment unit. 1
06, first holding shaft 107, first position adjusting mechanism 10
9, the second holding shaft 108, the second position adjusting mechanism 110,
It is formed of a substrate transport mechanism 111, a first sensor 112, a second sensor 113, and a third sensor 114. As the surface heating type light heater, a surface heating type light heater having a reflecting mirror for reflecting and parallelly irradiating the heat ray emitted from the light source was used.

The first surface heating type light heater 10
Each of the first and second surface heating type light heaters 102 can change the heating output by an output adjustment function (not shown).

The first of the first surface heating type light heater 101
Light source 103 and second surface heating type light heater 102
In order to explain the heat beam emitted from the second light source 104, the heat beam emitted from the end of the first surface heating type light heater 101 is converted into a first light beam 116 and a first surface heating type light heater. The heat ray emitted from the other end of the light heater 101 is a third light ray 118, and the heat ray emitted from the end of the second surface heating type light heater 102 is a fourth light ray 119, The heat ray emitted from the other end of the surface heating type light heater 101 is referred to as a sixth ray 120.

Further, the starting point of the first light ray 116 is the emission point a, the arrival point of the first light ray 116 on the upper surface of the substrate transport mechanism 111 is the light receiving point b, and the starting point of the third light ray 118 is the emission point e. The light receiving point f indicates the point at which the third light beam 118 reaches the upper surface of the substrate transport mechanism 111, the emission point g indicates the starting point of the fourth light ray 119, and the point at which the fourth light ray 119 reaches the upper surface of the substrate transfer mechanism 111. The light receiving point h, the starting point of the sixth light ray 120 will be described as an emission point k, and the point at which the sixth light ray 120 reaches the upper surface of the substrate transport mechanism 111 will be described as a light receiving point m.

The structure of the solder reflow device 300 is as follows:
It comprises a substrate transport mechanism 111 for transporting the GA substrate 1, a first surface heating type light heater 101 and a second surface heating type light heater 102 which are arranged to face the substrate transfer mechanism. The first surface heating type light heater 101 has a first light source 103 to enable surface heating within an irradiation range. The first surface heating type light heater 101 can change a heating condition by changing a tilt angle by a first angle adjusting unit 105, and further a first position connected to a first holding shaft 107. The position can be adjusted by the adjusting mechanism 109, and the first position adjusting mechanism 109 is connected to the apparatus main body.

Further, the second surface heating type light heater 102
Also, the heating condition can be changed by changing the inclination angle by the second angle adjusting unit 106, and further by the second position adjusting mechanism 110 connected to the second holding shaft 108.
The position can be adjusted, and the first position adjusting mechanism 109 can be adjusted.
Is connected to the device body.

As described above, the first surface heating type light heater 101 and the second surface heating type light heater 102 have a structure in which the irradiation angle and the irradiation distance can be changed. It is possible to easily change the heating conditions corresponding to the characteristics.

The substrate transport mechanism 111 has a first sensor 112 and a second sensor 113 for detecting a substrate position.
And the third sensor 114 are arranged to detect the position of the substrate, and the output of the first light source 103 and the second light source 104 is controlled by a control device (not shown) using a signal from the sensor.

The substrate transfer mechanism 111 of the solder reflow device 100 is connected to a transfer mechanism of a solder ball mounting device (not shown), and the solder ball mounting device is connected to a flux coating device (not shown). The flux coating device is not shown. The BGA substrate 1 is connected to the BGA substrate supply device, and is supplied to the solder reflow device 100.

The BGA substrate 10 that has been subjected to the solder reflow is transported by the substrate transport mechanism 111, passes over the third sensor 114, and is stored in a storage unit (not shown).

The above-described solder reflow device 100
, The solder balls 7 mounted on the BGA substrate 1
Is melted to form the BGA substrate 10.

First, as a first solder reflow method,
By making the distance from the emission point a of the first light ray 116 to the light receiving point b equal to the distance from the emission point e of the third light ray 118 to the light receiving point f, the first surface heating type light heater 10 can be used.
The solder balls 7 on the surface of the BGA substrate 1 placed in the irradiation range 1 are given uniform light energy.

Further, by making the distance from the emission point g of the fourth light ray 119 to the light receiving point h equal to the distance from the emission point k of the sixth light ray 120 to the light receiving point m, the second surface heating type light can be obtained. The solder balls 7 on the surface of the BGA substrate 1 placed within the irradiation range of the heater 102 are given uniform light energy.

At this time, the positional relationship between the surface of the substrate transfer mechanism 111, the first surface heating type light heater 101, and the surface of the substrate transfer mechanism 111 and the second surface heating type light heater 102 is as follows. The first surface heating type light heater 101 is disposed parallel to the surface of the transfer mechanism 111, and the second surface heating type light heater 102 is further disposed parallel to the surface of the substrate transfer mechanism 111. Have been. A first ray 116, a third ray 118, and a fourth ray 119
Then, the sixth light beam 120 irradiates the surface of the substrate transport mechanism 111 at right angles. From this, the first ray 11
6, the distance from the emission point a to the light receiving point b, and the third light beam 1
The distance from the emission point e to the light receiving point f is adjusted by the first position adjustment mechanism 109 so as to secure a distance of about 20 mm. The distance between the light receiving point h of the light ray 119 and the distance from the emission point k of the sixth light ray 120 to the light receiving point m of the sixth light ray 120 are such that a distance of about 20 mm is secured. To adjust the position. Further, the first surface heating type light heater 10 is controlled by an output adjustment mechanism (not shown) so that the average temperature of the light receiving point of each light beam is 240 ° C.
The output of the first and second surface heating type light heaters 102 is adjusted.

The above setting is performed, and the substrate transfer mechanism 11 is set.
The first sensor 112 transports the BGA substrate 1
Through the BGA substrate 1 and the second sensor 11
3, the BGA substrate 1 stops moving, and the BGA substrate 1 is placed within the irradiation range of the second surface heating type light heater 102. Similarly, the first
BGA also within the irradiation range of the surface heating type light heater 101
The mounting substrate 1 is placed.

After placing the BGA substrate 1 within the irradiation range of the first surface heating type light heater 101 and the irradiation range of the second surface heating type light heater 102, respectively,
When the light source 103 and the second light source 104 are energized and the solder melting temperature rises, the group of solder balls 7 can be melted to form the BGA substrate 10.

Thereafter, the first light source 103 and the second light source 1
04 is stopped, and the BG
A substrate 10 is transported and stored in a storage stocker (not shown)
The substrate 10 is stored.

As a second solder reflow method,
The first angle adjusting unit 105 adjusts the mounting angle of the first surface heating type light heater 101, and adjusts the first light beam 11.
6, the distance from the emission point e of the third light beam 118 to the light reception point f is shorter than the distance from the emission point a to the light reception point b. Thus, the light energy at the light receiving point f becomes stronger than the light energy at the light receiving point b. Accordingly, if the BGA substrate 1 moves on the substrate transport mechanism 111 at a constant speed, the BG
The substrate A temperature gradually increases. Therefore, the first
The first angle adjustment unit 105 was adjusted so that the measured temperature of the light receiving point b of the light ray 116 was 90 ° C. and the average temperature of the light receiving point f of the third light ray 118 was 250 ° C. At this time, the distance from the emission point a of the first light ray 116 to the light receiving point b is about 2
First position adjusting mechanism 1 so as to secure a distance of 0 mm.
09, the height was adjusted.

At this time, since the surface heating type light heater is used, the temperature on the substrate transport mechanism 111 at the light receiving point of the light beam within the irradiation range is reduced by the substrate transport mechanism 1.
On the surface of the eleventh surface, a temperature equal to the light receiving point can be secured in the direction perpendicular to the transport direction.

Further, the second angle adjusting unit 106
The mounting angle of the second surface heating type light heater 102 is adjusted so that the distance from the emission point g of the fourth light ray 119 to the light reception point h is smaller than the distance from the emission point k of the sixth light ray 120 to the light reception point m.
Increase the distance to Thereby, the light energy at the light receiving point m becomes stronger than the light energy at the light receiving point g. Therefore, if the BGA substrate 1 moves on the substrate transport mechanism 111 at a constant speed, the BGA substrate temperature will gradually decrease. Therefore, the second angle adjustment unit 106 was adjusted so that the average measured temperature of the light receiving point h of the fourth light beam 119 was 170 ° C. and the average measured temperature of the light receiving point m of the sixth light ray 120 was 80 ° C. At this time, the position was adjusted by the second position adjusting mechanism 110 so that the distance from the emission point k of the sixth light ray 120 to the light receiving point m was about 20 mm.

At this time, since the surface heating type light heater is used, the temperature on the substrate transport mechanism 111 at the light receiving point of the light beam within the irradiation range is reduced by the substrate transport mechanism 1.
On the surface of the eleventh surface, a temperature equal to the light receiving point can be secured in the direction perpendicular to the transport direction.

When the BGA substrate 1 supplied on the substrate transport mechanism 111 from the left side of the substrate transport mechanism 111 reaches the position of the first sensor 112, the first light source 103 receives a signal from the first sensor 112. And the first surface heating type light heater 101 is in a heated state. Further, the BGA substrate 1 is moved at a constant speed, so that the BGA substrate 1 is moved.
And the solder balls 7 placed on the BGA substrate 1
Is gradually heated from the irradiation position of the light beam 116, and the solder melts while moving to the irradiation position of the third light beam 118,
The BGA substrate 1 and the solder balls 7 are connected. When the BGA substrate 10 in which the solder balls 7 have been melted further moves and reaches the position of the second sensor 113, the second light source 104 of the second surface heating type optical heater 102 is energized.

Further, as the BGA substrate 1 and the solder balls 7 mounted on the BGA substrate 1 move, the fourth light beam 119 is gradually cooled from the irradiation position, and the sixth light beam 120 is irradiated. While moving to the position, the solder solidifies, and the BGA substrate 1 and the solder balls 7 are connected to each other.
The GA substrate 10 is completed.

On the substrate transport mechanism 111, the BGA substrate 1
0 moves at a constant speed, and a signal that the BGA substrate 10 has passed over the third sensor 114 is transmitted from the third sensor 114, and the second light source 1 of the second surface heating type optical heater 102 is transmitted.
04 is stopped.

After that, the BG is
A substrate 10 is transported and stored in a storage stocker (not shown).
The substrate 10 is stored.

According to the second solder reflow method described above, the configuration of the solder reflow apparatus 100 is preferable in that rapid cooling immediately after melting is prevented and proper solder fixing conditions are obtained.

The first sensor 112 in the above description,
The second sensor 113 and the third sensor 114 are BG
Since the power can be changed depending on the supply state of the substrate for A 1, the output of the surface heating type optical heater is set to the residual heat application state by changing the energization state to the surface heating type optical heater, and the first sensor 112 And the second sensor 113 is connected to the BGA substrate 1
It is possible to change the output to the actual heating state with a signal passing through, so that power consumption is reduced and an effect of suppressing energy is produced. In addition, since the output state can be changed from the output cutoff state, the signal processing method of the sensor is changed according to the supply state of the BGA substrate 1, thereby further reducing power consumption and suppressing energy. Spawn.

Unlike a hot atmosphere type reflow furnace in which a substrate passes through a sealed device, the structure is open, and the reflow condition is visually checked through a protection means such as a light-shielding filter while flowing in a reflow state. Enable management.

The above-described solder reflow device 100
A guide plate is arranged in accordance with the size of the BGA substrate or the BGA
Even when the substrate is moved on the substrate transport mechanism 111, the operation efficiency of the solder reflow device 100 is increased, and the
It is possible to achieve uniform quality.

[Brief description of the drawings]

FIG. 1 is a diagram showing a structure of a BGA substrate manufactured by a solder reflow method of an embodiment.

FIG. 2 is a schematic diagram for explaining a solder reflow device of an embodiment.

[Explanation of symbols]

 Reference Signs List 1 BGA substrate 2 Solder ball arrangement position 7 Solder ball 10 BGA substrate 100 Solder reflow device 101 First surface heating type light heater 102 Second surface heating type light heater 103 First light source 104 Second light source 105 First angle adjustment unit 106 Second angle adjustment unit 111 Substrate transport mechanism 112 First sensor 113 Second sensor 114 Third sensor 116 First ray 118 Third ray 119 Fourth ray 120 Sixth A Outgoing point of the first ray b Receiving point of the first ray e Outgoing point of the third ray f Receiving point of the third ray g Outgoing point of the fourth ray h Receiving point of the fourth ray k Outgoing point of sixth ray m Receiving point of sixth ray

Claims (9)

[Claims] 1. A substrate on which a plurality of solder balls are arranged is irradiated with a heat beam in parallel by using a surface heating type light heater to melt-connect the plurality of solder balls to the solder ball arrangement positions of the substrate. A solder reflow method comprising a solder ball fusion connection step. 2. The solder ball reflow process according to claim 1, wherein the solder ball fusion connection step is performed in a state where the substrate is arranged at a right angle to the heat beam irradiated in parallel by the surface heating type light heater. A solder reflow method. 3. The solder reflow method according to claim 1, wherein the solder ball fusion connection step is performed in a state where the substrate is obliquely arranged with respect to the parallel-irradiated heat beam of the surface heating type light heater. A solder reflow method. 4. The solder reflow method according to claim 1, wherein the solder ball fusion connection step is performed while moving the substrate. 5. A surface heating type light heater capable of irradiating heat rays in parallel, a surface heating type light heater holding portion for holding the surface heating type light heater, and a solder ball. A solder reflow device, comprising: a substrate mounting portion for mounting a substrate. 6. The solder reflow device according to claim 5, further comprising: a transfer mechanism for transferring the substrate; and a positioning mechanism for positioning the substrate in a substrate mounting range of the substrate mounting portion. A solder reflow device. 7. The solder reflow device according to claim 5, wherein the surface heating type light heater holding section has a function of adjusting an inclination angle of the surface heating type light heater. apparatus. 8. The solder reflow device according to claim 5, wherein said surface heating light heater is of a line type. 9. The solder reflow device according to claim 5, wherein the heating light source is a heater that radiates heat rays such as near infrared rays and infrared rays. apparatus.