JPH11283918A - Liquid processing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing system, capable of as much reducing installation objects as possible inside a clean room and supplying processing liquid, while preventing the alteration of the processing liquid such as resist liquid or the like. SOLUTION: In this liquid processing system, at the supplying of the resist liquid to a resist application device, an endless belt 90 is turned, a box 84 housing a resist liquid storage tank 85 is elevated to a position near the lower side of the floor surface 81 of the clean room 80, and the resist liquid is supplied to the application device by a pump 92. On the other hand, at the exchanging of the resist liquid storage tank 85, the belt 90 is turned in reverse, the box 84 is lowered to the position of the floor surface 82 downstairs, and the resist liquid storage tank 85 is exchanged with the new one.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus for supplying a processing liquid such as a resist coating apparatus for applying a resist liquid to a substrate to be processed such as a semiconductor wafer, and a processing liquid supplied to the processing apparatus. And a processing liquid supply system.

[0002]

2. Description of the Related Art For example, in a photolithography process in a semiconductor device manufacturing process, in a coating and developing system, a resist coating process for forming a resist film on a surface of a semiconductor wafer (hereinafter, referred to as a "wafer") and a resist coating process. After the exposure processing is performed on the subsequent wafer, a development processing for developing the wafer is performed.

In the above-described resist coating process, a resist solution is uniformly applied to the wafer surface by a spin coating method or the like. More specifically, the wafer is rotated while the wafer is held by a spin chuck, and a resist liquid is dropped onto the center of the wafer surface from a resist nozzle disposed above the wafer. As a result, the dropped resist solution spreads radially outward of the wafer due to centrifugal force, and then the dropping of the resist solution stops, but the rotation of the wafer is continued while the rotation speed is reduced, and the resist spread on the wafer surface. Shake off liquid and dry.

In a clean room in which the above-mentioned coating / developing processing system is installed, those which are not directly required in the manufacturing process, such as tanks for resist solution, developing solution, drainage, etc., should be arranged as much as possible. Without these things
There is a request to place it under the floor.

[0005] For this reason, as an example of a method of supplying a resist solution to a resist nozzle, a resist solution storage tank is disposed on the floor below a clean room floor.
The resist liquid is lifted from the resist liquid storage tank to the buffer tank adjacent to the resist coating device by a pump provided on the floor below this floor, and the resist liquid is supplied from the buffer tank to the resist nozzle by the pump provided on the clean room floor. Like that. When one of the resist solution storage tanks is emptied, an operator replaces the new resist solution storage tank on the floor below the clean room.

[0006]

However, in the above-described method for supplying a resist solution, when the resist solution is pressurized by a downstairs pump and lifted to a buffer tank in the clean room, the cleanroom is cleaned from the floor downstairs. Since the height to the floor is about 10m and relatively high, the lifting pressure of the downstairs pump must be relatively high, and the resist solution is stored in the buffer tank while being pressurized by the relatively high pressure. Fried. As a result, when the resist solution supplied to the buffer tank and left still is exposed to a gas under the influence of the high pressure, there is a possibility that the resist solution is separated into solvents and deteriorates when it comes into contact with the gas.

[0007] In addition, the pump in the clean room
It is conceivable to suck and lift the resist solution from the resist solution storage tank downstairs to the buffer tank, but the pump's lifting capacity by suction is about 1 m, which is not feasible.

Further, from the viewpoint of reducing the number of installations in the clean room, it is conceivable to abolish the buffer tank in the clean room. The downstairs pumps must be controlled sequentially, and complicated control is required. In addition, residual pressure may remain in the clean room pump, and the discharge accuracy may deteriorate.

The present invention has been made in view of such circumstances, and even when the processing liquid tank is installed under the floor,
It is an object of the present invention to provide a liquid processing system capable of supplying a processing liquid to a processing apparatus while preventing deterioration of the processing liquid.

[0010]

In order to solve the above problems, the present invention provides a processing apparatus for performing a predetermined liquid processing on an object to be processed, a pump for supplying a processing liquid to the processing apparatus,
A processing liquid storage tank disposed below the floor on which the processing apparatus is installed, a supply pipe communicating from the processing liquid storage tank to the pump, a predetermined position below the floor, and a vicinity of the floor. Lifting means for raising and lowering the tank with respect to a position.

According to such a configuration, the processing liquid storage tank is arranged below the floor on which the processing apparatus is installed, and the processing liquid storage tank is moved to a predetermined position below the floor and the floor. Since the elevating means for elevating between the vicinity of the processing liquid is provided, when the processing liquid is supplied, the elevating means moves the processing liquid storage tank to a position near the floor on which the processing apparatus is installed, By driving the pump, the processing liquid can be supplied from the processing liquid storage tank to the processing unit via the supply pipe and the pump. Therefore,
There is no need to lift the processing liquid due to the high pressure of the pump,
Further, since a buffer tank is not required, the treatment liquid is not separated and deteriorated.

That is, the conventional problems in the case where the processing apparatus is installed on the floor of a clean room and the processing liquid storage tank is installed under the floor of the clean room can be solved by the above configuration.

[0013] Further, by providing a position detector for detecting that the tank raised and lowered by the raising and lowering means has reached a predetermined position under the floor and has reached a position near the floor surface, The time when the processing liquid storage tank is lowered to a predetermined position below the floor for replacing the storage tank can be detected, and the time when the processing liquid storage tank is raised to a position near the floor surface to supply the processing liquid to the processing unit can be detected. Can be detected.

Further, by having a liquid level sensor for detecting the liquid level of the processing liquid in the processing liquid storage tank, it is possible to detect the timing of replacing the processing liquid storage tank and to process the processing liquid. The liquid level of the processing liquid can be monitored when supplying the processing liquid to the unit.

Further, the lifting means has a box for storing and raising and lowering the processing liquid storage tank, so that the processing liquid storage tank can be raised and lowered stably. Also, by providing the liquid level sensor in the box together with the tank, the liquid level can be reliably grasped even when the tank moves up and down.

Furthermore, since the supply pipe has elasticity, the processing liquid storage tank can be easily moved up and down while the processing liquid storage tank and the pump are connected by the supply pipe. The elasticity here is exemplified by a case where the processing liquid storage tank has a spiral shape when the processing liquid storage tank is raised and extends when the processing liquid storage tank is lowered.

The present invention is particularly effective when the processing liquid is a resist liquid applied to an object to be processed and the processing apparatus is a resist coating apparatus for applying a resist liquid to a substrate.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIGS. 1 to 3 are views showing the overall configuration of a semiconductor wafer (hereinafter, referred to as "wafer") coating / developing processing system 1 to which an embodiment of the present invention is applied. FIG. 2 shows the front, and FIG. 3 shows the back.

In the coating and developing system 1, as shown in FIG. 1, a plurality of wafers W as substrates to be processed are loaded into the system in a wafer cassette CR, for example, in units of 25 wafers, or unloaded from the system. A cassette station 10 for loading and unloading wafers W into and out of the wafer cassette CR, and various single-wafer processing units for performing predetermined processing on the wafers W one by one in a coating and developing process. A configuration in which a processing station 11 arranged in multiple stages and an interface unit 12 for transferring a wafer W between an exposure apparatus (not shown) provided adjacent to the processing station 11 are integrally connected. have.

In the cassette station 10, FIG.
As shown in FIG.
At a position 0a, a plurality of wafer cassettes CR, for example, up to four wafer cassettes CR are placed in a line in the X direction with their respective wafer entrances facing the processing station 11 side. A wafer carrier 21 that can move in the wafer arrangement direction (Z direction: vertical direction) of the wafers stored in the cassette selectively accesses each wafer cassette CR.

Further, the wafer transfer body 21 is configured to be rotatable in the θ direction, and as will be described later, an alignment unit (ALIM) belonging to the multi-stage unit section of the third processing unit group G ₃ on the processing station 11 side. And an extension unit (EXT).

As shown in FIG. 1, the processing station 11 is provided with a vertical transfer type main wafer transfer mechanism 22 equipped with a wafer transfer device, and all the processing units are surrounded by one or more sets. Are arranged in multiple stages.

As shown in FIG. 3, the main wafer transfer mechanism 22 is provided with a wafer transfer device 46 inside a cylindrical support 49 so as to be vertically movable (Z direction). The cylindrical support 49 is connected to a rotation shaft of a motor (not shown), and is rotated integrally with the wafer transfer device 46 about the rotation shaft by the rotation driving force of the motor, whereby the wafer transfer is performed. The device 46 is rotatable in the θ direction. Note that the cylindrical support 49 may be configured to be connected to another rotating shaft (not shown) rotated by the motor.

The wafer transfer device 46 includes a plurality of holding members 48 movable in the front-rear direction of the transfer base 47, and the transfer of the wafer W between the processing units is realized by these holding members 48. .

In this example, as shown in FIG.
One processing unit group G ₁ , G ₂ , G ₃ , G ₄ , G ₅ can be arranged, and the multi-stage units of the first and second processing unit groups G ₁ , G ₂ are arranged in front of the system (FIG. 1). , The multi-stage unit of the _third processing unit group G ₃ is arranged adjacent to the cassette station 10, and the multi-stage unit of the fourth processing unit group G ₄ is arranged adjacent to the interface section 12. The multi-stage units of the _fifth processing unit group G5 can be arranged on the back side.

As shown in FIG. 2, in the first processing unit group G ₁ , two spinner type processing units, for example, a resist coating device unit, which place a wafer W on a spin chuck in a cup CP and perform a predetermined process. (COT) and the developing unit (DEV) are stacked in two stages from the bottom. Second processing even unit group G _2, two spinner-type processing units, for example, a resist coating unit Unit (C
OT) and the developing unit (DEV) are stacked in two stages from the bottom. The resist coating unit (COT) is preferably disposed in the lower stage because the drainage of the resist solution is troublesome both mechanically and for maintenance. However, it is of course possible to appropriately arrange the upper stage as needed.

As shown in FIG. 3, in the third processing unit group G ₃ , an oven-type processing unit that performs a predetermined process by placing the wafer W on the mounting table SP, for example, a cooling unit (COL) that performs a cooling process , An adhesion unit (AD) for performing a so-called hydrophobizing process for improving the fixability of a resist, an alignment unit (ALIM) for positioning, and an extension unit (EX)
T), a pre-baking unit (PREBAKE) for performing a heating process before the exposure process and a post-baking unit (POBAKE) for performing a heating process after the exposure process are stacked in, for example, eight stages from the bottom. Fourth processing even unit group G _4, oven-type processing units, for example, a cooling unit (COL), an extension and cooling unit (EXTCOL), extension unit (EXT), a cooling unit (COL), prebaking units (PREBAKE ) And a post-baking unit (POBAKE) are stacked in order from the bottom, for example, in eight stages.

As described above, the cooling unit (COL) and the extension cooling unit (EXTCOL) having a low processing temperature are arranged in the lower stage, and the baking unit (PREBAKE), the post-baking unit (POBAKE) and the adhesion having a high processing temperature are arranged. By arranging the units (AD) in the upper stage, thermal mutual interference between the units can be reduced. Of course, a random multi-stage arrangement may be used.

As shown in FIG. 1, the interface section 12 has the same size in the depth direction (X direction) as the processing station 11, but is set smaller in the width direction. A portable pickup cassette CR and a stationary buffer cassette BR are provided in front of the interface section 12.
On the other hand, a peripheral exposing device 23 is arranged on the back side, and a wafer carrier 24 is provided on the central part. The wafer carrier 24 moves in the X and Z directions to move the cassettes CR and BR and the peripheral exposure device 2.
3 is accessed. The wafer transfer body 24 is configured to be rotatable also in the θ direction, and includes an extension unit (EXT) belonging to a multi-stage unit of the fourth processing unit group G4 on the processing station 11 side, and further, The wafer delivery table (not shown) on the adjacent exposure apparatus side can also be accessed.

Further, in the coating and developing system 1, as shown in FIG. 1, a multi-stage unit of the _fifth processing unit group G5 shown by a broken line is also arranged on the back side of the main wafer transfer mechanism 22 as described above. Although the multi-stage unit of the _fifth processing unit group G5 can be
, And can be shifted to the side as viewed from the main wafer transfer mechanism 22. Therefore, even when provided as a multi-stage unit of the fifth processing unit group G ₅ shown, by sliding along the guide rail 25, the space portion can be secured, to the main wafer transfer mechanism 22 The maintenance work can be easily performed from behind. The multi-stage unit of the _fifth processing unit group G5 is not limited to such a linear slide shift along the guide rail 25, but may be a system as shown by a reciprocating rotation arrow indicated by a chain line in FIG. Even if it is configured to rotate outward, it is easy to secure a space for maintenance work on the main wafer transfer mechanism 22.

Next, a resist coating unit (CO
T) will be described. 4 and 5 are a schematic cross-sectional view and a schematic plan view showing the entire configuration of the resist coating unit (COT).

This resist coating unit (COT)
An annular cup CP is arranged at the center of the
The spin chuck 52 is arranged inside the. The spin chuck 52 is rotationally driven by a drive motor 54 in a state where the wafer W is fixedly held by vacuum suction. The drive motor 54 is disposed at an opening of the unit bottom plate 50 so as to be able to move up and down, and is connected to a lift drive means 60 and a lift guide means 62 such as an air cylinder via a cap-like flange member 58 made of, for example, aluminum. . On the side of the drive motor 54, for example, SU
A cylindrical cooling jacket 64 made of S is attached,
The flange member 58 is attached so as to cover the upper half of the cooling jacket 64.

When the resist solution is applied, the lower end of the flange member 58 is in close contact with the unit bottom plate 50 near the outer periphery of the opening of the unit bottom plate 50, thereby sealing the inside of the unit. When the transfer of the wafer W is performed between the spin chuck 52 and the main wafer transfer mechanism 22,
0 lifts the drive motor 54 or the spin chuck 52 upward, so that the lower end of the flange member 58 floats from the unit bottom plate 50.

A resist nozzle 66 for supplying a resist solution to the surface of the wafer W is connected via a resist solution supply pipe 68 to a resist solution supply section described later. The resist nozzle 66 is detachably attached to the tip of the nozzle scan arm 70 via a nozzle holder 73. The nozzle scan arm 70 is attached to the upper end of a vertical support member 72 that can move horizontally on a guide rail 71 laid in one direction (Y direction) on the unit bottom plate 50, and is driven in a Y direction (not shown). The mechanism moves in the Y direction integrally with the vertical support member 72 by a mechanism.

The nozzle scan arm 70 can also be moved in the X direction perpendicular to the Y direction in order to selectively mount the resist nozzle 66 in the resist nozzle standby section 74. Is also going to move.

Further, in the resist nozzle standby section 74, the discharge port of the resist nozzle 66 is inserted into the port 75 of the solvent atmosphere chamber, and is exposed to the solvent atmosphere therein, so that the resist liquid at the nozzle tip does not solidify or deteriorate. It has become.

Further, the nozzle holder 73 of the resist nozzle scan arm 70 has a thinner nozzle 7 for supplying a liquid agent, for example, a thinner, for wetting the wafer surface on the wafer surface before supplying the resist liquid to the wafer surface.
6 is attached. The thinner nozzle 76 is connected to a thinner supply unit (not shown) via a thinner supply pipe (not shown). The thinner nozzle 76 and the resist nozzle 66 are attached such that each discharge port is located on a straight line along the Y movement direction of the resist nozzle scan arm 70.

A rinse nozzle scan arm 78 is provided on the guide rail 71, and a rinse nozzle 77 for side rinsing is attached to the end of the rinse nozzle scan arm 78. This rinse nozzle 77
Are the rinse nozzle standby position (solid line position) set on the side of the cup CP and the rinse liquid discharge position (dotted line position) set just above the periphery of the wafer W installed on the spin chuck 52. It translates or moves linearly between and.

Next, the resist coating operation of the resist coating unit (COT) configured as described above will be described.

The cup C in the resist coating unit (COT) is held by the holding member 48 of the main wafer transfer mechanism 22.
When the wafer W is transported right above P, the wafer W
Is sucked in vacuum by the spin chuck 52 which has been lifted by the lift drive means 60 and lift guide means 62, for example, which are air cylinders. Main wafer transfer mechanism 2
After the wafer W is vacuum-sucked to the spin chuck 52, the holding member 48 is moved to the resist coating unit (CO).
T) Pull back from inside, resist coating unit (CO
The delivery of the wafer W to T) is completed.

Next, the spin chuck 52 moves the wafer W down to a fixed position in the cup CP, and the drive motor 54 starts rotating the spin chuck 52. Thereafter, the nozzle holder 73 from the resist nozzle standby unit 74
Starts moving. The movement of the nozzle holder 73 is Y
Done along the direction.

When the discharge port of the thinner nozzle 77 reaches the center of the spin chuck 52 (the center of the wafer W), the thinner is supplied to the surface of the rotating wafer W. The solvent supplied to the wafer surface spreads uniformly from the center of the wafer to the entire area around the wafer due to centrifugal force.

Subsequently, the nozzle holder 73 is moved in the Y direction until the discharge port of the resist nozzle 66 reaches the center of the spin chuck 52 (the center of the wafer W). Is dropped at the center of the surface of the rotating wafer W, and the resist is applied to the surface of the wafer.

Next, referring to FIG. 1, FIG. 6 and FIG.
A supply mechanism for supplying the resist liquid to the resist coating device will be described. FIG. 6 is a cross-sectional view of a clean room in which the coating / developing processing system is installed and the lower floor thereof, showing a state where the processing liquid storage tank is raised.
1 is a cross-sectional view of a clean room in which a coating and developing processing system is installed and a floor below the clean room, showing a state where a processing liquid storage tank is lowered.

As shown in FIGS. 6 and 7, a plurality of guide rails 83 are erected between the floor surface 81 of the clean room 80 and the floor surface 82 below the floor. Along the box 84, a box 84 is provided so as to be movable up and down.

The box 84 accommodates a resist solution storage tank 85. As shown in FIG. 7, the operator replaces the resist liquid storage tank 85 with the box 84 lowered to the floor surface 82 below the floor. The box 84 also houses a liquid level meter 86 for measuring the liquid level in the resist liquid storage tank 85. The liquid level in the liquid level meter 86 is configured to be the same as the liquid level of the resist liquid in the tank 85, and the upper and lower positions of the liquid level of the liquid level meter 86 are detected. Level sensors 87a and 87b are provided. Thereby, the liquid level in the resist liquid storage tank 85 is measured.

Elevating mechanism 8 for elevating and lowering box 84
8 is provided below the floor 81 of the clean room 80,
A motor and a pulley (not shown) are provided in the elevating mechanism 88. In addition, on the floor surface 82 downstairs,
A lower elevating mechanism 89 containing a pulley (not shown) is provided. An endless belt 90 is wrapped around a pulley (not shown) of the elevating mechanism 88 and a pulley (not shown) of the lower elevating mechanism 89.
The box 84 is held in a part of. This allows
When a motor (not shown) in the elevating mechanism 88 is driven,
A pulley (not shown) of the elevating mechanism 88 rotates, and an endless belt 90 wrapped around this pulley and a pulley (not shown) of the lower elevating mechanism 89 rotates to form a box 84.
Is raised and lowered.

The box 84 is provided with a lifting mechanism 88
The belt 90 and the like move up and down the position near the lower side of the floor 81 of the clean room 80 as shown in FIG. 6 and the position of the floor 82 below the floor as shown in FIG. Further, a position detector 91a for detecting that the box 84 has reached a position near the lower side of the floor 81 and a position detector 91b for detecting that the box 84 has reached the position of the floor 82 below the floor are provided. Have been. The above-described liquid level data of the liquid level meter 86, the control signal of the lifting / lowering mechanism 88, and the position data of the position detectors 91a and 91b are transmitted and received to and from a unit controller (not shown) of the resist coating apparatus. Have been.

As shown in FIGS. 1, 6 and 7, the resist nozzle 66 of the resist coating device (COT) is used.
(FIGS. 4 and 5) Pump 9 for feeding resist solution
The pump 92 is provided with an elastic supply pipe 93.
Is connected to a resist liquid storage tank 85 via a liquid level meter 86 in a box 84. When the box 84 is raised to a position near the lower side of the floor surface 81 as shown in FIG. When it is lowered to the position 82, it is configured to be elongated as shown in FIG. Note that the supply pipe 93 does not necessarily have to have elasticity, in which case,
For example, the supply pipe 93 may be wound when the box 84 is moved up and down.

In the supply mechanism configured as described above,
When the resist liquid is supplied to the resist nozzle 66 (FIGS. 4 and 5) of the resist coating device (COT), a motor (not shown) in the elevating mechanism 88 is driven as shown in FIG. The pulley (not shown) is rotated, the endless belt 90 is rotated, the box 84 is raised to a position near the lower side of the floor surface 81 of the clean room 80, and the arrival to this lower side is detected by the position detector 91a. Is done.

In this state, the pump 92 is driven, and the resist solution is fed from the resist solution storage tank 85 to the resist nozzle 66 (FIGS. 4 and 5) of the resist coating device (COT). At this time, the liquid level sensor 87 of the liquid level meter 86
The liquid level in the resist liquid storage tank 85 is measured by a and 87b, and when the resist liquid storage tank 85 approaches or becomes empty, a signal is transmitted to a unit controller (not shown).

As a result, when replacing the resist liquid storage tank 85, the box 84 is lowered to the position of the floor surface 82 below the floor, as shown in FIG. At this time, the arrival at the floor surface 82 below the floor is detected by the position detector 91b. In this state, the operator replaces the resist liquid storage tank 85 with a new one.

As described above, in this embodiment, there is no need to lift the resist solution from the resist solution storage tank 85 disposed on the floor surface 82 below the clean room by the high pressure of the downstairs pump as in the prior art. Also, since a buffer tank is not required, the resist solution is not separated into solvents and deteriorated. Therefore, it is possible to realize the conventional requirement that extraneous materials should not be disposed in the clean room without any problem.

Note that the present invention is not limited to the above embodiment, and various modifications are possible. For example, in the above embodiment, the coating apparatus for applying a resist liquid to a semiconductor wafer has been described. However, the present invention can be applied to a case where a resist liquid is applied to a substrate to be processed other than the semiconductor wafer, for example, an LCD substrate. . Further, the processing liquid may be other than the resist liquid.

[0055]

As described above, according to the present invention,
Elevating means for disposing a processing liquid storage tank below the floor on which the processing apparatus is installed, and for raising and lowering the processing liquid storage tank between a predetermined position below the floor and a position near the floor When the processing liquid is supplied, the processing liquid storage tank is moved to a position near the floor on which the processing apparatus is installed by the elevating means, and the pump is driven to process the processing liquid. The liquid can be supplied from the liquid storage tank to the processing unit via a supply pipe and a pump. Therefore, there is no need to raise the processing liquid by a high pressure of the pump, and no buffer tank is required, so that the processing liquid does not separate and deteriorate.

That is, according to the present invention, the conventional problems in the case where the processing apparatus is installed on the floor of a clean room and the processing liquid storage tank is installed under the floor of the clean room can be solved.

The present invention is particularly effective when the processing liquid is a resist liquid to be applied to an object to be processed and the processing apparatus is a resist coating apparatus for applying a resist liquid to a substrate.

[Brief description of the drawings]

FIG. 1 is a plan view of the overall configuration of a semiconductor wafer coating and developing processing system according to an embodiment of the present invention.

FIG. 2 is a front view of the coating and developing system shown in FIG.

FIG. 3 is a rear view of the coating and developing system shown in FIG. 1;

FIG. 4 is a cross-sectional view of the overall configuration of a resist coating apparatus mounted on the coating and developing processing system shown in FIG.

5 is a plan view of the resist coating device shown in FIG.

FIG. 6 is a cross-sectional view of a clean room in which a coating and developing processing system is installed and a floor below the clean room, showing a state where a processing liquid storage tank is raised.

FIG. 7 is a sectional view of a clean room in which a coating and developing processing system is installed and a lower floor thereof, showing a state in which a processing liquid storage tank is lowered.

[Explanation of symbols]

 1 Coating / Development Processing System 80 Clean Room 81 Clean Room Floor 82 Floor Downstairs 83 Guide Rail 84 Box 85 Resist Liquid Storage Tank (Treatment Liquid Storage Tank) 86 … Level gauge 88… Lift mechanism 90… Belt 92… Pump 93… Supply pipe W… Semiconductor wafer COT… Resist coating device

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Izumi Hasegawa 2655 Tsukure, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Inside the Tokyo Electron Kyushu Kumamoto Office

Claims (8)

[Claims] 1. A processing apparatus for performing a predetermined liquid processing on an object to be processed, a pump for supplying a processing liquid to the processing apparatus, and a processing liquid disposed below a floor on which the processing apparatus is installed. A storage tank, a supply pipe communicating from the processing liquid storage tank to the pump, and elevating means for elevating the tank between a predetermined position below the floor surface and a position near the floor surface. A liquid processing system characterized by the above-mentioned. 2. The liquid processing system according to claim 1, wherein the processing device is installed on a floor of a clean room, and the tank is installed under a floor of the clean room. 3. The apparatus according to claim 1, further comprising a position detector for detecting that the tank moved up and down by the elevating means has reached a predetermined position under the floor and has reached a position near the floor surface. The liquid processing system according to claim 1. 4. The liquid processing system according to claim 1, further comprising a liquid level sensor for detecting a liquid level of the processing liquid in the processing liquid storage tank. . 5. The liquid processing system according to claim 1, wherein the elevating means includes a box that accommodates the processing liquid storage tank and moves up and down. . 6. The liquid processing system according to claim 5, wherein the liquid level detection sensor is provided in the box. 7. The processing apparatus according to claim 1, wherein the supply pipe has elasticity. 8. The resist processing apparatus according to claim 1, wherein the processing liquid is a resist liquid applied to a target object, and the processing unit is a resist coating apparatus that applies the resist liquid to a substrate. The liquid treatment system according to claim 1.