JPH11274195A - Method and apparatus for manufacturing resin encapsulated semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress a sealing tape from crumpling when a resin encapsulation while the sealing tape is mounted in a resin encapsulated semiconductor device manufacturing process. SOLUTION: A sealing die is composed of an upper and lower dies 112a, 112b, and the lower die 112b has four evacuating holes 113 and evacuating grooves 114 communicating with the evacuating holes 113, a sealing tape 106 is mounted on the lower die 112b, and a lead frame mounting a semiconductor chip 102 is mounted thereon. The sealing tape 106 is sucked through the four evacuating holes 113 of the lower die 112 in four directions in the die and stretched uniformly during resin encapsulation. By the resin encapsulation while tension is given to the sealing tape 106, the crumpling of the sealing tape due to the thermal shrinkage in the resin encapsulation can be avoided to make flat the back side of the resin, and also the tension may be given to the sealing tape, utilizing clamps or coupling between protrusions and recesses.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a resin-sealed semiconductor device in which a semiconductor chip and a lead frame are sealed with a sealing resin, and an apparatus for manufacturing the same.
In particular, the present invention relates to an improvement in a part of which is exposed from a sealing resin.

[0002]

2. Description of the Related Art In recent years, in order to cope with miniaturization of electronic equipment, it has been required to mount semiconductor components mounted on electronic equipment at a high density, and accordingly, semiconductor parts have been reduced in size and thickness. In.

A conventional resin-sealed semiconductor device will be described below.

FIG. 34A is a plan view of a conventional resin-encapsulated semiconductor device, and FIG. 34B is a cross-sectional view of the conventional resin-encapsulated semiconductor device.

As shown in FIGS. 34 (a) and 34 (b), a conventional resin-encapsulated semiconductor device is of a type having external electrodes on the back side.

A conventional resin-encapsulated semiconductor device includes a lead frame including an inner lead 201, a die pad 202, and a suspension lead 203 for supporting the die pad 202. The semiconductor chip 204 is bonded on the die pad 202 with an adhesive, and the electrode pad (not shown) of the semiconductor chip 204 and the inner lead 201 are electrically connected by the thin metal wire 205. The die pad 202, the semiconductor chip 204, the inner lead 201, the suspension lead 203, and the thin metal wire 205 are sealed with the sealing resin 6. In this structure, the sealing resin 206 does not exist on the back side of the inner lead 201, and the back side of the inner lead 201 is exposed.
The lower part of 1 is an external electrode 207.

In FIG. 34A, the sealing resin 206 is treated as a transparent body, and the inside of the semiconductor device is shown transparently. In the figure, the semiconductor chip 204 is shown by a broken line, and the thin metal wire 205 is shown. Illustration is omitted.

Conventionally, when a resin-encapsulated semiconductor device is mounted on a mounting board such as a printed board, a stand from the back surface of a sealing resin 206 required for bonding an external electrode to an electrode of the mounting board. In order to secure the off-height, as shown in FIG. 35, a ball electrode 209 made of solder is provided for the external electrode 207, and the ball electrode 209 is formed.
In this case, the stand-off height is secured, and the semiconductor device is mounted on the mounting board.

Next, a method for manufacturing a conventional resin-encapsulated semiconductor device will be described with reference to the drawings. FIG.
FIG. 39 is a cross-sectional view showing a manufacturing process of a conventional resin-encapsulated semiconductor device.

First, as shown in FIG. 36, a lead frame 2 having an inner lead 201 and a die pad 202 is provided.
Prepare 10 Although the die pad 202 is supported by suspension leads in the drawing, illustration of the suspension leads is omitted. A depressed portion is formed on the suspension lead, and the die pad 202 is set up. The lead frame 210 is not provided with a tie bar for stopping the flow of the sealing resin during resin sealing.

Next, as shown in FIG. 37, the semiconductor chip 20 is placed on the die pad 202 of the prepared lead frame.
4 is bonded with an adhesive. This step is a so-called die bonding step.

Then, as shown in FIG. 38, the semiconductor chip 204 bonded on the die pad 202 and the inner lead 201 are electrically connected by the thin metal wire 205. This step is a so-called wire bonding step.
As the thin metal wire 205, an aluminum thin wire, a gold (Au) wire, or the like is appropriately used.

Next, as shown in FIG.
02, the semiconductor chip 204, the inner leads 201, the suspension leads, and the fine metal wires 205 are sealed with a sealing resin 206. In this case, the lead frame to which the semiconductor chip 204 is bonded is housed in the sealing mold and is transfer-molded. In particular, the back surface of the inner lead 201 contacts the upper mold or the lower mold of the sealing mold. In this state, resin sealing is performed.

Finally, the tip 21 of the inner lead 201 projecting outward from the sealing resin 206 after the resin sealing.
Cut 1 By this cutting step, the tip surface of the inner lead 201 after cutting and the side surface of the sealing resin 6 are substantially on the same plane, and the lower part of the inner lead 201 becomes the external electrode 207.

In the conventional manufacturing process of the resin-encapsulated semiconductor device, the sealing resin 206 goes around the back surface of the inner lead 201 in the resin encapsulation process to form a resin burr (protruding portion of the resin). For this reason, a water jet process for blowing off resin burrs is usually introduced after the resin sealing process and before the cutting process of the inner lead 201.

If necessary, as shown in FIG. 35, a ball electrode made of solder is formed on the lower surface of the external electrode 207 to obtain a resin-sealed semiconductor device. In some cases, a solder plating layer is formed instead of a solder ball.

[0017]

However, in the conventional resin-encapsulated semiconductor device, since the lower surface of the external electrode 207 and the surface of the encapsulating resin 206 are on substantially the same surface on the back surface of the semiconductor device, The stand-off height from the stop resin 206 cannot be obtained. For this purpose, a ball electrode 209 made of solder or the like must be provided and mounted on a mounting board, and there has been a problem that efficient mounting cannot be performed.

In the resin sealing step of the conventional method of manufacturing a resin-encapsulated semiconductor device, a lead frame to which a semiconductor chip is bonded is housed in a sealing die, and an inner lead is provided on the surface of the lower die. Is pressed and brought into close contact with each other to seal the resin. However, there is still a problem that the sealing resin wraps around the back surface of the inner lead, and resin burrs (protrusions of the resin) are generated on the surface of the external electrode. there were.

Therefore, conventionally, a water jet process has been introduced to blow off the resin burrs 206a on the external electrodes 207. However, such a water jet process requires a great deal of labor, and a resin-encapsulated semiconductor. Contrary to the demand for simplification of steps such as reduction of steps in the mass production process of the apparatus. In other words, the occurrence of resin burrs has been a major obstacle to simplifying such a process. In addition, the water jet process may cause a serious quality problem that not only resin burrs but also soft metal plating is peeled off.

An object of the present invention is to provide a resin sealing step
Suppressing the occurrence of resin burrs on the back surface of the lead frame, or taking measures to secure the stand-off height from the sealing resin of the external electrode, and having good appearance and characteristics while having such a structure An object of the present invention is to provide a method of manufacturing a resin-sealed semiconductor device for obtaining a resin-sealed semiconductor device and an apparatus for manufacturing the same.

[0021]

According to a first aspect of the present invention, there is provided a method of manufacturing a resin-encapsulated semiconductor device, comprising the steps of preparing a sealing die, a semiconductor chip, and peripheral members. A first step of attaching the sealing tape to the sealing die while adhering the sealing tape to a part of the surface of the peripheral member, and removing the sealing tape while applying tension to the sealing tape. And a third step of sealing at least a part of the semiconductor chip and the peripheral member except for a part of the surface in a sealing resin in a mounted state.

According to this method, when there is a portion of the peripheral member that is to be surely exposed from the sealing resin, the sealing tape is brought into close contact with the portion of the peripheral member in the second step, so that the portion is removed. However, a structure that is reliably exposed from the sealing resin is realized. Further, since no resin burr is formed on that portion of the peripheral member, the step of water jet or the like which has been required conventionally can be omitted, so that the manufacturing process can be simplified.

In addition, it is possible to prevent wrinkles and sagging of the sealing tape during resin sealing, and consequently to generate uneven patterns on the back surface of the sealing resin of the formed resin-sealed semiconductor device. Can be prevented. That is, the second object can be achieved.

According to a second aspect of the present invention, in the method for manufacturing a resin-encapsulated semiconductor device, the first step comprises a first mold and a second mold, and A sealing mold having a die cavity in at least one of the molds 2 and a vacuuming concave portion sandwiching the die cavity in at least one of the first and second molds is prepared. In the third step,
Tension can be given to the sealing tape by adsorbing the sealing tape to the concave portion for evacuation.

According to this method, tension is given to the sealing tape by pulling the sealing tape into the concave portion for evacuation.

According to a third aspect of the present invention, in the method for manufacturing a resin-encapsulated semiconductor device in which the sealing tape is tensioned by the vacuuming, the vacuuming recess is formed in the die cavity. A plurality of vacuum pumps can be provided from the near inner position to the outer position, and the evacuation can be performed sequentially from the outermost evacuation recess.

According to this method, first, after the sealing tape is pulled and stretched by the outermost concave portion for evacuation,
Since the sealing tape is further pulled by the inner evacuation recess, a larger and more uniform tension can be applied to the sealing tape.

According to a fourth aspect of the present invention, in the method of manufacturing a resin-encapsulated semiconductor device in which a tension is applied to the sealing tape, in the first step, the die cavity is sandwiched. At least two regions are provided with a clamper for holding the sealing tape, and in the third step, tension is applied to the sealing tape by fixing the sealing tape with the clamper. Can be.

According to this method, tension is applied to the sealing tape by being clamped by the clamper.

According to a fifth aspect of the present invention, in the method of manufacturing a resin-sealed semiconductor device in which the sealing tape is tensioned by the clamper, the clamper is extended by the sealing tape. An urging means for urging in the direction may be further provided.

According to this method, a larger tension can be applied to the sealing tape by the urging force of the urging means.

According to a sixth aspect of the present invention, in the method of manufacturing a resin-encapsulated semiconductor device in which a sealing tape is tensioned by the clamper, the clamper may be provided before the second step. Thereby, the sealing tape is held in a place away from the sealing mold, and in the second step, the sealing tape is moved together with the clamper to the position of the sealing mold. it can.

According to this method, it is possible to prevent the sealing tape from being excessively stretched by the heat and tension of the sealing mold for a long time before resin sealing.

According to a seventh aspect of the present invention, in the method of manufacturing a resin-encapsulated semiconductor device in which tension is applied to the encapsulation tape, the first step includes the steps of: The first and second molds each have a die cavity in at least one of the first and second molds, and at least one pair of projections and recesses that engage with each other are formed in the first and second molds.
A sealing mold having at least two regions sandwiching the die cavity of the second mold is prepared, and in the third step, when the first and second molds approach, The engagement between the projections and the recesses can apply tension to the sealing tape.

According to this method, when the upper mold and the lower mold approach each other and the convex-concave portions are engaged, the sealing tape is pulled into the engaging portion, thereby applying tension to the sealing tape.

According to a eighth aspect of the present invention, in the method of manufacturing a resin-encapsulated semiconductor device in which the sealing tape is tensioned by the engagement of the projections and the recesses, The convex portion and the concave portion have engagement lengths different from each other, and the engaging length is provided only in a plurality of pairs which are larger as the outer convex portion and the concave portion. In the third step, the outermost convex portion is provided. A tension can be applied to the sealing tape so that the sealing tape stretched by the engagement of the portion and the recess is further stretched by the engagement of the projection and the recess on the inside.

According to this method, when the upper mold and the lower mold approach each other, the sealing tape stretched by the engagement of the outermost projections and recesses is used to form the inner projections and recesses. By being further extended by the engagement, a large and uniform tension can be applied to the sealing tape.

According to a ninth aspect of the present invention, in the method of manufacturing a resin-sealed semiconductor device, a plurality of the sealing tapes can be used.

According to a tenth aspect of the present invention, there is provided an apparatus for manufacturing a resin-encapsulated semiconductor device, comprising: A sealing mold comprising a mold and a second mold and having a die cavity in at least one of the first and second molds, and a part of the surface of the resin-sealed semiconductor device is formed from a sealing resin. Tension applying means for applying tension to the sealing tape to be exposed.

Thus, tension can be applied to the sealing tape in the resin sealing step of the resin-sealed semiconductor device, so that the sealing tape can be sealed without wrinkles or slack. Therefore, this manufacturing apparatus can be used for manufacturing a resin-sealed semiconductor device having no uneven pattern on the back surface of the sealing resin.

According to an eleventh aspect of the present invention, in the apparatus for manufacturing a resin-encapsulated semiconductor device, the tension applying means may be provided in at least one of the first and second molds. Can be provided as a concave portion for evacuation for sucking the sealing tape by being connected to an evacuation device.

As a result, tension can be applied to the sealing tape by sucking the sealing tape into the evacuation recess as described above.

According to a twelfth aspect of the present invention, in the manufacturing apparatus for a resin-encapsulated semiconductor device having the concave portion for vacuum evacuation in the sealing die, the concave portion for vacuum evacuation is formed by a groove sandwiching the die cavity. And a vacuum hole formed in each groove.

According to a thirteenth aspect of the present invention, in the manufacturing apparatus for a resin-encapsulated semiconductor device having the evacuation concave portion in the encapsulating mold, the evacuation concave portion is formed in an annular shape surrounding the die cavity. And a vacuum hole formed in the groove.

[0045] As described in claim 14, when providing the concave portion for evacuation in the sealing mold, it is preferable to provide a plurality of concave portions for evacuation.

Thus, tension can be more effectively applied to the sealing tape.

According to a fifteenth aspect of the present invention, in the manufacturing apparatus for a resin-encapsulated semiconductor device having the evacuation recess in the sealing mold, the evacuation recess is formed around the die cavity. It is also possible to use a plurality of grooves provided and a vacuum hole formed only in the outermost groove among the plurality of grooves and communicating with the evacuation device.

As a result, tension can be applied to the sealing tape in order from the outermost groove, so that a larger and more uniform tension can be applied to the sealing tape.

According to another aspect of the present invention, in the apparatus for manufacturing a resin-encapsulated semiconductor device, the tension applying means is provided in at least two regions sandwiching the die cavity. Can be used as a clamper.

Thus, the sealing tape can be tensioned by clamping the sealing tape with the clamper during resin sealing.

According to a seventeenth aspect of the present invention, in the apparatus for manufacturing a resin-encapsulated semiconductor device provided with the clamper, at least two sealing tapes are attached to the clamper.
It is preferable to have a function of moving so as to extend in the direction or more.

Thus, a larger tension can be applied to the sealing tape.

In a manufacturing apparatus for a resin-encapsulated semiconductor device having the above-described clamper, an urging means for urging the clamper in a direction in which the sealing tape is extended. It is preferable to further include

According to a nineteenth aspect of the present invention, in the apparatus for manufacturing a resin-encapsulated semiconductor device provided with the clamper, the clamper holds the sealing tape while holding the sealing tape.
A function that can be moved from a location away from the sealing mold to the position of the sealing mold can also be provided.

As a result, since the sealing tape is not exposed to the heat of the sealing mold for a long time, it is possible to prevent the sealing tape from being excessively stretched.

According to a twentieth aspect of the present invention, in the above-described apparatus for manufacturing a resin-encapsulated semiconductor device, the tension applying means may be provided in at least two places sandwiching the die cavity between the first and second molds. At least one pair of protrusions and recesses that are provided in the region and engage with each other.

Thus, when the upper mold and the lower mold approach each other at the time of resin sealing, the sealing tape is pulled into the engaging portion between the convex portion and the concave portion, so that tension can be applied to the sealing tape. .

According to a twenty-first aspect of the present invention, in the apparatus for manufacturing a resin-encapsulated semiconductor device provided with the protrusion and the recess engaged with each other, the engagement lengths of the protrusion and the recess are different from each other. Only a plurality of such pairs are provided, and the engagement length can be made larger for the outer convex portion and concave portion.

[0059] Thereby, tension can be applied to the sealing tape sequentially from the outermost engaging portion, so that a larger and more uniform tension can be applied to the sealing tape.

According to a twenty-second aspect of the present invention, in the apparatus for manufacturing a resin-encapsulated semiconductor device having the convex and concave portions which engage with each other, the die cavity of the first or second mold is formed. A plurality of protrusions and recesses may be provided in an outer region sandwiching all die cavities and an inner region between the plurality of die cavities.

Thus, even when a sealing mold having a large number of die cavities, which is widely used in a mass production process, is used,
It is possible to reliably prevent wrinkles and slack of the sealing tape in each die cavity where the resin-sealed semiconductor device is formed.

According to a twenty-third aspect of the present invention, in the apparatus for manufacturing a resin-encapsulated semiconductor device having the convex and concave portions which engage with each other,
It is preferable to perform a roughening treatment for preventing slippage.

Thus, the action of pulling the sealing tape into the engaging portion between the convex portion and the concave portion can be reliably achieved.

According to a twenty-fourth aspect of the present invention, in the manufacturing apparatus for a resin-encapsulated semiconductor device having the convex and concave portions which engage with each other, the wall surface of the convex or concave portion is made of a material which does not slip easily. It is preferable to keep it.

In this way, the effect of pulling the sealing tape into the engaging portion between the convex portion and the concave portion can be reliably achieved.

According to a twenty-fifth aspect of the present invention, in the apparatus for manufacturing a resin-encapsulated semiconductor device having the projection and the recess engaged with each other, a vacuum hole connected to a vacuum evacuation device is formed in the recess. Can be formed in advance.

Thus, tension can be applied to the sealing tape by the pulling force by vacuuming in addition to the pulling force by the engagement between the projection and the recess.

According to a twenty-sixth aspect of the present invention, in the above-described apparatus for manufacturing a resin-encapsulated semiconductor device, the first
Alternatively, a carved portion may be provided in a region of one of the second molds facing the part of the resin-sealed semiconductor device.

Thus, the sealing tape can be released toward the engraved portion during resin sealing, so that the amount of depression of the sealing tape by the pressing force can be adjusted. That is, the amount of protrusion from the sealing resin can be adjusted by the depth of the engraved portion.

[0070]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, a description will be given of a resin-sealed semiconductor device of the present invention, which can be applied to each embodiment, and a method of manufacturing the same.

FIG. 1A is a plan view showing an example of the structure of a resin-encapsulated semiconductor device according to the present invention, and FIG.
FIG. 2 is a cross-sectional view taken along the line Ib-Ib shown in FIG. However, in FIG. 1A, the sealing resin 17 is treated as a transparent body, the semiconductor chip 15 has a contour shown by a broken line, and illustration of the thin metal wire 16 is omitted.

As shown in FIGS. 1A and 1B, the resin-encapsulated semiconductor device has an inner lead 12, a die pad 13 for supporting a semiconductor chip, and a suspension for supporting the die pad 13. A lead frame including the leads 14 is provided. The semiconductor chip 15 is bonded on the die pad 13 with an adhesive, and the electrode pads (not shown) of the semiconductor chip 15 and the inner leads 12 are electrically connected to each other by the thin metal wires 16. Then, the inner lead 12 and the die pad 1
3. Suspended lead 14, semiconductor chip 15, and thin metal wire 1
6 is sealed in a sealing resin 17. The die pad 13 is set up by the depress portion 19 of the suspension lead 14 so as to be located above the inner lead 12. Therefore, in a state where the sealing resin 17 is sealed, the sealing resin 17 also exists thinly on the back surface side of the die pad 13. The sealing resin 17 does not exist on the lower surface side of the inner lead 12.
Is exposed, and the lower surface of the inner lead 12 serves as a connection surface with the mounting substrate. That is, the lower part of the inner lead 12 is the external electrode 18. In addition, the external electrode 18 does not inherently have a resin burr which is a portion of the resin protruding in the resin sealing step, and the external electrode 18 slightly protrudes below the back surface of the sealing resin 17. Such a structure of the external electrode 18 having no resin burr and projecting downward can be easily realized by a manufacturing method described later.

In such a resin-encapsulated semiconductor device, since the outer leads do not exist on the sides of the inner leads 12 and the lower portions of the inner leads 12 serve as the external electrodes 18, the size of the semiconductor device can be reduced. Can be planned. In addition, since no resin burr exists on the lower surface of the inner lead 12, that is, on the lower surface of the external electrode 18, the reliability of bonding with the electrode of the mounting board is improved. Further, since the external electrode 18 is formed so as to protrude from the surface of the sealing resin 17, when the resin-sealed semiconductor device is mounted on the mounting substrate, the external electrode 18 is bonded to the electrode of the mounting substrate. Is secured in advance. Therefore, the external electrode 18 can be used as an external terminal as it is, and it is not necessary to attach a solder ball to the external electrode 18 for mounting on the mounting board as in the conventional case, which is advantageous in terms of man-hour and manufacturing cost. Become.

Next, a method for manufacturing a resin-sealed semiconductor device will be described with reference to the drawings. 2 to 7
It is sectional drawing which shows an example of the manufacturing process of the resin sealing type semiconductor device of this invention.

First, in a step shown in FIG. 2, an inner lead 12 and a die pad 13 for supporting a semiconductor chip are formed.
Is prepared. In the figure, the die pad 13 is supported by suspension leads, but is not shown because it does not appear in this cross section.
A depressed portion is formed in the suspension lead, and the die pad 13 is set up above the surface of the inner lead 12. Furthermore, the prepared lead frame 20 is a lead frame which does not have a tie bar for stopping outflow of the sealing resin during resin sealing.

Next, in the step shown in FIG. 3, the semiconductor chip 15 is mounted on the die pad of the prepared lead frame, and the two are joined to each other with an adhesive. This step is
This is a so-called die bonding process. The member for supporting the semiconductor chip is not limited to the lead frame, and a member that can support another semiconductor chip, for example, a TAB tape or a substrate may be used.

Then, in the step shown in FIG.
3 and the semiconductor chip 15 and the inner lead 12
Are electrically connected by the thin metal wire 16. This step is a so-called wire bonding step. As the thin metal wire, an aluminum thin wire, a gold (Au) wire, or the like can be appropriately selected and used. Further, the electrical connection between the semiconductor chip 15 and the inner leads 12 may be performed not through the thin metal wires 16 but through bumps or the like.

Next, in a step shown in FIG. 5, a sealing tape 21 is attached to the back surface of the inner lead 12 with the semiconductor chip 15 bonded to the die pad 13 of the lead frame.

The sealing tape 21 serves as a mask for preventing the sealing resin from flowing around the resin on the rear surface side of the inner lead 12 in particular. Can prevent resin burrs from being formed on the back surface of the inner lead 12. The sealing tape 21 to be attached to the inner leads 12 and the like is a tape based on a resin containing polyethylene terephthalate, polyimide, polycarbonate, or the like as a main component, and can be easily peeled off after resin sealing. Any material that can withstand the high-temperature environment at the time of stoppage may be used. Here, a tape containing polyethylene terephthalate as a main component was used, and the thickness was 50 [μm].

Here, the sealing tape 21 is
It is adhered to the entire back surface of the lead frame in a state of being in close contact with only the surface of the inner lead 12 of the lead frame, and is not in close contact with the back surface of the die pad 13 upset by the depressed portion of the suspension lead. However, the rear surface of the die pad 13 may be exposed by bringing the sealing tape 21 into close contact with the rear surface of the die pad 13 and peeling off the sealing tape 21 after the resin sealing step, thereby improving the heat radiation characteristics.

Next, in the step shown in FIG.
5, the lead frame to which the sealing tape 21 is attached is housed in a mold, and the sealing resin 17 is poured into the mold to perform resin sealing. At this time, the inner lead 12
The distal end portion 22 of the inner lead 12 of the lead frame is pressed downward with a metal mold so as to prevent the sealing resin 17 from wrapping around the rear surface of the lead frame. In addition, the surface of the sealing tape 21 on the back surface side of the inner lead 12 is pressed toward the mold surface side to perform resin sealing.

Finally, in the step shown in FIG. 7, the sealing tape 21 adhered to the back surface of the inner lead 12 is removed by peeling off, and the external electrode 18 protruding from the back surface of the sealing resin 17 is formed. Then, by separating the distal end portion 22 of the inner lead 12 such that the distal end surface of the inner lead 12 and the side surface of the sealing resin 17 are substantially flush with each other,
A resin-sealed semiconductor device as shown in FIG. 7 is completed.

FIG. 8 is a partial rear view of the resin-encapsulated semiconductor device showing the external electrode 18 in an enlarged manner. As shown in the figure, since the resin sealing step in which the sealing tape 21 is adhered to the back surface of the lead frame is performed here, the back surface and the side surface of the inner lead 12, that is, the external electrode 18
Of resin burrs on the surface of the substrate can be prevented. Further, it is possible to prevent the sealing resin 17 from going around the surface of the external electrode 18 and burying a part of the external electrode 18 in the sealing resin 17 as in the conventional manufacturing method.

In the manufacturing method described above, the sealing tape 21 is applied to the back surface of the inner lead 12 before the resin sealing step.
Is adhered, so that the sealing resin 17 does not wrap around, and no resin burrs are generated on the back surface of the inner lead 12 serving as an external electrode. Therefore, unlike the conventional method of manufacturing a resin-encapsulated semiconductor device that exposes the lower surface of the inner lead, it is not necessary to remove the resin burr formed on the inner lead by a water jet or the like. That is, by eliminating the troublesome process for removing the resin burr, the process in the mass production process of the resin-encapsulated semiconductor device can be simplified. In addition, the peeling of the metal plating layer of nickel (Ni), palladium (Pd), gold (Au) or the like on the lead frame, which may have conventionally occurred in the resin burr removal step using a water jet or the like, can be eliminated. Therefore, pre-plating of each metal layer before the resin sealing step can be performed.

In addition, since the external electrode 18 formed by the above-described manufacturing method protrudes from the sealing resin 17, the external electrode 18 is used as an external terminal without attaching a solder ball as in the related art. be able to.

As shown in FIG. 6, in the resin sealing step, the sealing tape 21 is softened and thermally contracted by the heat of the molten sealing resin. And a step is formed between the back surface of the inner lead 12 and the back surface of the sealing resin 17. Therefore, the back surface of the inner lead 12 has a structure protruding from the back surface of the sealing resin 17, and the stand-off height of the external electrode 18 below the inner lead 12 can be secured. Therefore, this protruding external electrode 1
8 can be used as it is as an external terminal.

The size of the step between the back surface of the inner lead 12 and the back surface of the sealing resin 17 can be controlled by the thickness of the sealing tape 21 applied before the sealing step. In the present invention, the sealing tape 2 of 50 [μm] is used.
1, the size of the step, that is, the external electrode 18
Is generally about half of that, with a maximum of 50
[Μm]. That is, since the amount of the sealing tape 21 entering above the back surface of the inner lead 12 is determined by the thickness of the sealing tape 21, the protrusion amount of the external electrode 18 can be self-controlled by the thickness of the sealing tape 21, Manufacturing can be facilitated. This external electrode 1
In order to control the amount of protrusion of 8, it is only necessary to control the thickness of the sealing tape 21 in the mass production process, and there is no need to provide a separate process. Therefore, the manufacturing method of the present invention is extremely advantageous in cost of process control. It is a way. In addition, about the sealing tape 21 to stick, according to the magnitude | size of a desired step,
The hardness, thickness, and softening property of the material due to heat can be determined.

As shown in FIG. 1B, in the above resin-encapsulated semiconductor device, although the encapsulating resin 17 exists on the back surface side of the die pad 13, its thickness is determined by the Very thin. Therefore, the resin-sealed semiconductor device is substantially a single-sided sealed semiconductor device.

Here, an example is shown in which the sealing tape 21 is attached to the lower surface of the inner lead 12 of the lead frame before the resin sealing step. May be set in a sealing mold, and the lead frame 12 may be adhered thereon. In this case, as described later, the supply of the sealing tape to the sealing die can be performed, thereby further streamlining the process.

Here, an example of the manufacturing method in which a sealing tape is attached to the back surface of the lead frame to perform resin sealing has been described, but the method of the present invention is limited to a semiconductor device having a lead frame. It is not something to be done. The method of using a sealing tape in the resin sealing step, which is a basic concept of the present invention, is widely applicable to the resin sealing step of a semiconductor device having a semiconductor chip mounted thereon and having a member to be resin-sealed. It can be applied to a resin sealing process for semiconductor devices of a TAB type, a substrate type, and the like.

Hereinafter, embodiments of the present invention will be described. In the following embodiments, a resin sealing method and a resin sealing device for preventing generation of wrinkles in a resin-sealed semiconductor device will be described with reference to the drawings.

(First Embodiment) Next, specific examples according to the first embodiment in which tension is applied to the sealing tape by vacuum evacuation to eliminate wrinkles will be described.

First Specific Example FIG. 9A shows a sealing die (lower die) used in the method of manufacturing a resin-sealed semiconductor device according to a first specific example of the present embodiment. 9B is a cross-sectional view showing a state of resin sealing along a center line in FIG. 9A.

As shown in FIGS. 9A and 9B, in the method of manufacturing a resin-encapsulated semiconductor device of this embodiment, first, a lead frame having inner leads 101 and die pads 103 is prepared. The semiconductor chip 102 is bonded to the die pad 103 with a die bond material, and the electrode pads (not shown) on the semiconductor chip 102 and the inner leads 101 are electrically connected via the thin metal wires 105. In addition, the upper mold 112a and four evacuation holes 11 are provided.
3 and a lower mold 112b having an evacuation groove 114 for communicating between the evacuation holes 113 are prepared. Then, the lower mold 1 of the sealing mold 112
The sealing tape 106 is placed on the top 12b, and the lead frame on which the semiconductor chip 102 is mounted is placed thereon. In this state, the inner lead 1 of the lead frame
01 is in contact with the sealing tape 106.

Next, the upper mold 112a and the lower mold 112b of the sealing mold 112 are matched. At this time, the upper mold 112a
Is in contact with the upper surface of the sealing tape 106. Then, the upper mold 112a is pressed, and the lower mold 112b is pressed by a vacuuming device (not shown).
The sealing tape 106 is evacuated in four directions in the mold through the four evacuation holes 113 formed in the mold, and the uniformly extended state is maintained. By performing the resin sealing step in this state, the sealing tape 10 due to heat shrinkage during resin sealing is formed.
6 can be prevented from occurring. As a result, the back surface of the resin of the resin-molded resin-molded semiconductor device is formed flat.

Hereinafter, the mechanism for eliminating the wrinkles of the sealing tape will be described in more detail. At the time of resin sealing, the sealing tape 106 undergoes thermal contraction and shrinks, so that the sealing tape 106 is pulled in the direction of each of the vacuum holes 113 by performing vacuum evacuation through the vacuum holes 113. Can be By giving the sealing tape 106 an extended state as described above, the contraction of the sealing tape 106 is suppressed, and the occurrence of wrinkles is prevented. Therefore,
On the back surface of the formed resin-encapsulated semiconductor device, the surface of the encapsulation resin 107 that has been in contact with the encapsulation tape 106 is flat.

The depth and width of the evacuation groove 114 connected to the evacuation hole 113 on the lower mold 112b of the sealing mold 112 are formed in consideration of the elongation of the sealing tape 106. It is desirable.

However, it is also possible to pull the sealing tape from each of the vacuum holes individually without providing the vacuum grooves.
The effect of preventing the generation of wrinkles in the sealing tape can be exhibited.

In the present embodiment, the method of bonding the semiconductor chip to the lead frame and wire bonding is the same as the conventional method, so that the description using the drawings is omitted.

As described above, according to the method of manufacturing the resin-encapsulated semiconductor device of the present embodiment, when the encapsulation tape is brought into close contact with the lead frame or the like and is encapsulated with the resin, the encapsulation die is disposed at substantially equal intervals in the encapsulation mold. When the sealing tape is sucked through a plurality of provided vacuum evacuation holes and sealed with a resin while the sealing tape is pulled uniformly, wrinkles due to heat shrinkage when the sealing tape is thin The resin portion on the back surface of the resin-sealed semiconductor device after resin sealing can be formed flat.
In particular, by providing the evacuation groove, a more uniform pulling force can be applied to the sealing tape.

A method of forming a vacuum evacuation hole in the sealing mold of the present embodiment and performing a resin encapsulation step while pulling a sealing tape through the evacuation hole or a method of each embodiment described later. Can be applied not only to semiconductor devices having the structures shown in FIGS. 1A and 1B, but also to semiconductor devices having various structures. However, when the sealing tape needs to be brought into close contact with the upper mold, a vacuum hole is formed in the upper mold, and the sealing tape is pulled through the vacuum hole.

Next, as a modification of the first example, various examples in which a plurality of rows of vacuum grooves or vacuum holes are provided will be described.

FIG. 10 shows three rows of annular evacuation grooves 114a and 114.
b, 114c and each of the evacuation grooves 114a, 114b, 1
Vacuum evacuation holes 113a, 113b,
The lower mold 11 according to the second specific example provided with 113c.
It is a top view of 2b. In such a case, each evacuation hole 1
Vacuum evacuation may be performed simultaneously from 13a, 113b, and 113c, but first, evacuation is performed from the outermost evacuation hole 113a to extend the sealing tape, and then evacuation is performed from the intermediate evacuation hole 113b. Finally, three stages of evacuation may be performed such that the evacuation is performed from the innermost evacuation hole 113c to gradually elongate the sealing tape gradually. By performing this stepwise evacuation, there is an advantage that a more uniform and large tensile force can be applied to the sealing tape.

-Third Specific Example- FIG. 11 shows three rows of annular evacuation grooves 114a and 114.
b, 114c, a connecting groove 116a connecting between the evacuation grooves 114a-114b, and an evacuation groove 114b-114.
It is a top view of the lower metal mold | die 112b which concerns on the 3rd specific example in which the connection groove 116b which connects between c and the evacuation hole 113 formed in the outermost evacuation groove 114a were provided. In this case, when the evacuation is performed through the evacuation hole 113, the degree of vacuum is sequentially increased from the outermost groove 114a. Therefore, the same effect as stepwise evacuation can be exerted without performing control for shifting the evacuation timing.

-Fourth Specific Example- FIG. 12 shows three rows of evacuation grooves 117a, 117b, and 117c extending in the short side direction and each evacuation groove 117.
a, 117b, 117c
It is a top view of the lower metal mold | die 112b which concerns on the 4th example provided with 3a, 113b, 113c. The structure shown in FIG. 12 can also apply a tensile force to the sealing tape. In this case, as described above, three stages of evacuation may be sequentially performed from the outermost evacuation hole 113a. Alternatively, a connection groove as shown in FIG. 11 may be provided, a vacuum hole may be formed in the outermost vacuum groove 117a, and vacuum may be evacuated from this vacuum hole. In any case, the same effect as described for the structure provided with the annular evacuation groove can be exerted.

Fifth Specific Example FIG. 13 shows three rows of linearly evacuated grooves 118a, 118b, 118c extending in the long side direction, and each of the evacuated grooves 118.
a, 118b, 118c
It is a top view of the lower metal mold | type 112b which concerns on the 5th example provided with 3a, 113b, and 113c. With the structure shown in FIG. 13, a pulling force can be applied to the sealing tape. In that case, as described above, the outer evacuation hole 1
The evacuation in two stages may be performed sequentially from 13a. Alternatively, a connection groove as shown in FIG. 11 may be provided, a vacuum hole may be formed in the outer vacuum groove 117a, and vacuum may be evacuated from this vacuum hole. In any case, the same effect as described for the structure provided with the annular evacuation groove can be exerted.

In the above embodiment, the lower mold 112b
Although the example in which the vacuum groove and the vacuum hole are provided is described above, it goes without saying that the upper mold 112a may be provided with the vacuum groove and the vacuum hole. Further, the upper mold 112a
In addition, both the lower mold 112b and the lower mold 112b may be provided with a vacuum groove or a vacuum hole.

(Second Embodiment) Next, a method for manufacturing a resin-sealed semiconductor device according to a second embodiment of the present invention will be described. In the present embodiment, a device for releasing the pressing force applied to the sealing tape particularly below the inner lead will be described. FIG. 14 is a cross-sectional view illustrating a resin-sealed state in the method for manufacturing a resin-sealed semiconductor device according to the present embodiment. FIG. 15 is a top view of the lower mold 112b used in the present embodiment.

In FIGS. 14 and 15, the same members as those in the first embodiment are denoted by the same reference numerals as in FIG. 9B, and description thereof is omitted. In the present embodiment, in addition to the structure shown in FIG. 9B in the first embodiment,
In a region located below the inner lead 101 on the upper surface of the lower mold 112b, a carved portion 115 is formed with a desired depth. By using the lower mold 112b having a carved portion 115 below the inner lead 101, a part of the sealing tape 106 escapes into the carved portion 115 during resin sealing.
It is possible to suppress a deep groove which is easily formed between the layers 01 to shallow. Further, the adhesion area between the side surface of the inner lead 101 and the sealing resin 107 can be increased, and the adhesion strength between the inner lead 101 and the sealing resin 107 can be increased.

Here, the depth of the engraved portion 115 is appropriately determined according to the thickness of the sealing tape 106. When the thickness is equal to or greater than the thickness of the sealing tape 106, almost no pressure is applied to the inner leads 101, and thus the amount of protrusion of the inner leads 101 after the resin sealing step is almost eliminated. On the other hand, when the depth of the engraved portion 115 is close to 0, the protrusion amount of the inner lead 101 becomes too large as described above, and the effect of the present embodiment cannot be achieved.
Deep grooves are likely to appear between the inner leads 101. Therefore, when the sealing tape 106 is about 25 μm, the engraved portion 115 is almost unnecessary, but when the thickness of the sealing tape is about 30 μm to 80 μm, the thickness of the sealing tape 106 and the depth of the engraved portion 115 Is 2
It is preferably about 5 μm.

The structure in which the engraved portion is provided can be applied not only to the present embodiment but also to the above-described embodiments and the later-described embodiments.

(Third Embodiment) Next, in order to apply a pulling force to the sealing tape, a resin sealing step is performed while pulling the sealing tape from both sides. This will be described with reference to FIGS.

-First Specific Example- FIGS. 16 (a) and 16 (b) are plan views showing a first specific example in which a clamper is provided in an upper mold and a pulling force is applied to the sealing tape by the clamper. It is a figure and a sectional view. FIG.
As shown in FIGS. 6 (a) and 6 (b), the sealing device and the sealing mold of the resin-encapsulated semiconductor device are an upper mold 121a, a clamper 122a installed on the upper mold 121a, and a lower mold. Type 1
21b, a semiconductor product molding part 124 (die cavity) provided in the lower mold 121b, a sealing tape 125,
A structure in which a drive device 126 for applying pressure between the upper mold 121a and the lower mold 121b is provided, and the sealing tape 125 is sandwiched and fixed between the lower surface of the upper mold 121a and the clamper 122a. It has become. The lower mold 121
The b has a relief portion for avoiding a buffer with the clamper 122a.

-Second Specific Example- In FIGS. 17 to 21 in the following specific examples, FIG.
The same members as those shown in (a) and (b) are denoted by the same reference numerals and description thereof will be omitted.

FIGS. 17A and 17B show a mold 121a,
It is the top view and sectional drawing which show the 2nd specific example which comprised the clamper 122b provided outside 121b, and this clamper 122b was able to move independently of metallic molds 121a and 121b.

-Third Specific Example- FIGS. 18A and 18B show a case where a clamper 122c is provided outside the mold and extends in the long side direction, and the clamper 122c is independent of the molds 121a and 121b. FIGS. 9A and 9B are a plan view and a cross-sectional view illustrating a third specific example configured to be able to be moved.

-Fourth Specific Example- FIGS. 19 (a) and (b) show an annular clamper 122d surrounding the dies 121a and 121b provided outside the dies 121a and 121b. Mold 1
It is the top view and sectional drawing which show the 4th specific example comprised so that it could move independently of 21a, 121b.

Fifth Specific Example FIG. 20 shows that a clamper 122b having the same structure as that of the second specific example is provided outside the molds 121a and 121b, and the clamper 122b is independent of the molds 121a and 121b. And the clamper 122b
123 for urging the outside in a direction parallel to the short side direction
It is a top view which shows the 5th specific example in which was provided. In addition, two springs are provided for each clamper 122b,
May be biased in all directions.

Sixth Specific Example FIG. 21 shows a clamper 122 having the same structure as the third specific example extending outwardly of the dies 121a and 121b in the long side direction.
c, and the clamper 122c is
1b and can be moved independently.
FIG. 18 is a plan view showing a sixth specific example in which a spring 123 for urging the clamper 122c outward in a direction parallel to the short side direction is provided.

-Effects of Specific Examples- With any of the structures shown in FIGS. 17 to 21, a tensile force can be applied to the sealing tape 125, and wrinkling of the sealing tape 125 in the resin sealing step occurs. Consequently, it is possible to prevent the occurrence of an uneven pattern in the sealing resin. In particular, when a spring for urging the clamper outward is provided, the pulling force can be more effectively applied to the sealing tape. The means for urging the clamper outward is not limited to a spring, and it goes without saying that another elastic body such as rubber may be used.

In the second to sixth specific examples,
A function that allows the mechanism holding the clamper to move from a position away from the sealing mold to the vicinity of the sealing mold is added, and the sealing tape is affected by the thermal influence of the upper mold and the lower mold. After being clamped and fixed by the clamper at a place where it is not so separated, it may be supplied to the upper die 121a or the lower die 121b.

(Fourth Embodiment) Next, a concave portion and a convex portion which are engaged with each other are provided in the upper mold and the lower mold of the sealing mold, and the sealing is performed when the resin is sealed. Each specific example of the fourth embodiment in which the tape is sandwiched between the concave portion and the convex portion to apply a pulling force to the sealing tape will be described with reference to FIGS. 22 to 27. I do.

-First Specific Example- FIGS. 22A and 22B are a perspective view and a sectional view, respectively, showing a first specific example of the present embodiment. However, FIG.
FIG. 22 (b) shows the convex portion 139a and the concave portion 1 shown in FIG.
It is sectional drawing in the center part of the direction orthogonal to 41a.
As shown in FIGS. 22 (a) and 22 (b), the upper mold 131a has a convex portion 139a projecting vertically from the mold mating surface, while the lower mold 131b has the upper mold 131.
A concave portion 141a that can be engaged with the convex portion 139a of FIG. The lower mold 131b includes a semiconductor product molding unit 134.
Is provided.

With this structure, when the upper mold 131a is lowered and approaches the lower mold 131b, the sealing tape 1
35 are sandwiched between the convex portion 139a and the concave portion 141a which engage with each other. When the upper mold 131a is further lowered, the sealing tape 135 is moved to the convex portion 139a and the concave portion 141a.
, The sealing tape 135 is stretched in at least two directions.

-Second Specific Example- FIG. 23 is a bottom view of an upper mold showing a second specific example of the present embodiment. In this specific example, the upper mold 121a is provided with a convex portion 139b that is not linear but curved. Although the figure showing the structure of the lower mold is omitted, the lower mold is provided with a curved concave portion engageable with the convex portion 139b. Even with such a structure, the sealing tape can be elongated by the same operation as in the first specific example.

-Third Specific Example- FIGS. 24A and 24B are a cross-sectional view and a top view of a lower mold, respectively, showing a third specific example of the present embodiment. However, FIG. 24A shows the concave portion 141c shown in FIG.
FIG. 4 is a cross-sectional view of a central portion in a direction orthogonal to FIG. In this specific example, the upper mold 131a is formed with three rows of convex portions 139c projecting vertically from the mold mating surface.
However, the heights of the three rows of projections 139c are gradually reduced from the outermost side. On the other hand, the lower mold 131b has a depth that allows the protrusion 139c of the upper mold 131a to engage.
A row of recesses 141a is formed. In other words, the outer convex portion 139c and concave portion 141c have a larger engagement length. Further, the lower mold 131b includes the semiconductor product molding unit 1
34 are provided. In addition, a roll 142 as an urging means for pulling the sealing tape 135 is also provided, but this roll 142 is not always necessary.

As described above, the convex portions 139c and the concave portions 141c which are engaged with each other in a plurality of rows are provided, and the height of each convex portion 139c and the depth of each concave portion 141c are formed to be higher or deeper toward the outermost. By putting, the outermost convex part-
The sealing tape stretched by the engagement of the concave portion is sequentially stretched by the engagement of the convex portion and the concave portion inside. That is, since the sealing tape 135 can be pulled while gradually increasing the strength, the sealing tape 135 can be more effectively extended.

-Fourth Specific Example- FIG. 25 is a top view of a lower mold showing a fourth specific example of the present embodiment. In this specific example, a plurality of rows of short linear concave portions 141d are arranged in a staggered manner in the lower die 131b. However, the depth of each recess 141d is deeper toward the outermost. Although the figure showing the structure of the upper mold is omitted, the upper mold is provided with a plurality of rows of convex portions which can be engaged with the concave portion 141d. Even with such a structure, the sealing tape can be effectively elongated by the same operation as in the third specific example.

-Fifth Specific Example- FIG. 26 is a top view of a lower mold showing a fifth specific example of the present embodiment. In this specific example, a plurality of small circular concave portions 141e are arranged in a staggered manner in the lower die 131b. However, the depth of each recess 141e becomes deeper toward the outermost side. Although illustration of the structure of the upper mold is omitted, the upper mold is provided with a plurality of convex portions that can be engaged with the concave portion 141e. Even with such a structure, the sealing tape can be effectively elongated by the same operation as in the third specific example.

Sixth Specific Example FIG. 27 is a top view of a lower mold showing a sixth specific example of the present embodiment. In this specific example, when a plurality of semiconductor product molding portions 134 are provided in the lower mold 131b, a long linear concave portion 141g extending in the long side direction is provided at an end of the lower mold 131b in the long side direction. Provided, each semiconductor product molding unit 13
A small recess 141f is provided in the area between the four. Although the figure showing the structure of the upper mold is omitted, the concave 1
Protrusions engageable with 41f and 141g are provided.
Reference numeral 144 denotes a sealing resin flow path for supplying a sealing resin to each semiconductor product molding unit 134. In this case,
Sealing tape 135 from all sides of each semiconductor product molding portion 134
Is particularly effective when a large number of semiconductor devices are resin-sealed by one resin sealing step. Since the mold used in the actual resin sealing process of the semiconductor device has a very large number of die cavities in the sealing mold, the structure of this specific example is extremely effective. Can be.

-Seventh Specific Example- FIG. 28 is a sectional view showing a seventh specific example of the present embodiment. In this specific example, the upper mold 131a has a recess 141h.
Is provided on the lower mold 131b, and a convex portion 139h that engages with the concave portion 141h of the upper mold 131a is formed. Then, the sealing tape 13 is provided on the lower surface of the upper mold 131a.
5 is formed so as to surround the concave portion 141h. The lower mold 131b
Is provided with a semiconductor product molding part 134.

As described above, by providing the evacuation grooves 146 for the purpose of evacuation in the inside, the inner periphery, the outer periphery, or the outside of the region where the convex-concave portions are engaged with each other, sealing can be more effectively performed. The tape 135 can be stretched.

It is to be noted that a hole for evacuation is formed in the concave portion which engages with the convex portion, and tension is effectively applied to the sealing tape by both the engaging effect between the convex portion and the concave portion and the evacuation function. You can also.

In all of the above embodiments, the convex portion 139 and the concave portion 141 are matted on the surface to prevent the sealing tape 135 from slipping, or are formed of a non-slip material, for example, silicone rubber. It is desirable.

(Fifth Embodiment) In this embodiment, FIG. 29 shows a fifth embodiment in which the sealing tape in a state of being pulled in advance is used to prevent wrinkles of the sealing tape. It will be described with reference to FIG. FIG. 29 is a cross-sectional view illustrating a resin sealing method according to the fifth embodiment.

As shown in FIG. 29, a flat jig 147 is prepared, a sealing tape 135 is attached to the flat jig 147, and then transferred to the upper mold 131a. This also
Wrinkling of the sealing tape 135 can be prevented as much as possible.

It is to be noted that even greater effects can be obtained by using a sealing device and a sealing mold having a combination of the clamper function, the concave-convex shape, and the vacuuming function in the third to fifth embodiments. Needless to say.

(Sixth Embodiment) Hereinafter, a sixth embodiment of the present invention will be described. In the present embodiment, a method for continuously supplying a sealing tape for preventing wrinkling of a resin-sealed semiconductor device and a resin sealing device provided with a sealing tape supply device will be described with reference to the drawings. I will explain it.

FIGS. 30A to 30C are perspective views showing a resin sealing device provided with a sealing tape supply device and a resin sealing step in this embodiment. FIG.
It is sectional drawing which shows one process in a resin sealing process.

As shown in FIG. 30A, the sealing mold comprises an upper mold 151a and a lower mold 151b.
1b is provided with a large number of semiconductor product molding sections 160 (die cavities) and a sealing resin flow path 161 for supplying a sealing resin to each semiconductor product molding section 155.
Further, the unwinding roll 156a and the winding roll 156
It is configured to be able to continuously unwind and wind the sealing tape 152 while applying a constant tension to the sealing tape 152.

Then, as shown in FIG. 30B, a lead frame 153 on which a large number of semiconductor chips are mounted is supplied to the semiconductor product molding section 160 of the lower mold 151b, and the resin tablet 154a is sealed with the lower mold 151b. It is fed into the resin supply section.

Next, as shown in FIG. 52, the upper mold 151a and the lower mold 151b of the sealing mold are clamped, and the sealing resin melted from below by the piston 158 is applied to each semiconductor product molding section 160. Supplied to the semiconductor device 1
55 is injection molded. When the injection molding is completed, the lower mold 151b opens.

At this time, at the same time when the lower mold 151b is opened,
The sealing tape 152 is separated from the resin cull 154b and the resin-encapsulated semiconductor device 155 shown in FIG. In addition, a portion of the sealing tape 152 used in this resin sealing step is wound around a winding roll 156b,
The part used in the next resin sealing step is the unwinding roll 15
6a. Meanwhile, the resin cull 154b and the resin-encapsulated semiconductor device 155 are taken out of the lower mold 151b.

According to the present embodiment, the unwinding roll 15
By supplying the sealing tape 152 continuously between the winding tape 6a and the take-up roll 156b, the resin sealing step using the sealing tape can be performed quickly, and the production efficiency can be improved. it can. Also, the unwinding roll 156
By applying a rotational force to a and the take-up roll 156b, an appropriate tension can be applied to the sealing tape 152, and the occurrence of wrinkling of the sealing tape 152 in the resin sealing step can be suppressed.

(Effects of Suppressing Wrinkles in Each Embodiment) The effects of suppressing the occurrence of wrinkles in the above embodiments will be described in more detail.

FIGS. 32 (a) and 32 (b) are cross-sectional views showing the state in the sealing mold when the resin sealing step is performed without applying tension to the sealing tape, and the resin to be formed. It is sectional drawing of a sealing body. FIGS. 33 (a) and 33 (b)
FIG. 4 is a cross-sectional view showing a state in a sealing mold when a resin sealing step is performed in a state where tension is applied to a sealing tape 152, and a cross-sectional view of a formed resin sealing body. However, FIG.
In FIG. 2 (a) and FIG. 33 (a), in order to display in the same vertical relation as the resin sealing body, the display is shown upside down from the state shown in each of the above embodiments. FIG. 32 (a),
In FIG. 1B, members denoted by the same reference numerals as those in FIGS. 1A and 1B have already been described.

If resin sealing is performed without applying tension to the sealing tape, the sealing tape may be wrinkled, sagged, or broken as shown in FIG. Then, when this wrinkle or the like is generated, it is transferred to the sealing resin 17 as it is, so that the back surface of the sealing resin 17 of the removed resin sealing body after the resin sealing step is finished is as shown in FIG.
As shown in (b), dents and the like may occur. When such dents occur, not only the appearance is impaired, but also a part of the sealed member is exposed,
There is a possibility that cracks in the sealing resin 17 may occur.

On the other hand, as in each of the above embodiments, the sealing tape is attached to the sealing die while applying tension to the sealing tape in the resin sealing step, thereby forming the sealing tape as shown in FIG. The generation of wrinkles and sagging can be suppressed. Since no dents or the like occur on the back surface of the sealing resin 17 of the resin sealing body taken out after the resin sealing step, a resin-encapsulated semiconductor device having good appearance and characteristics can be obtained. . That is, the yield can be improved by reducing the defective rate.

A plurality of sealing tapes can be used. For example, it can be mounted on the upper surface side and the lower surface side, or a plurality of sheets can be mounted on one side.

[0150]

According to the method or the apparatus for manufacturing a resin-sealed semiconductor device of the present invention, when a semiconductor chip and peripheral members are sealed in a sealing resin with a sealing tape mounted, the sealing is performed. A tension is applied to the stop tape, so that wrinkles are prevented from being generated in the sealing tape, and a portion in which the sealing tape is in close contact is exposed from the sealing resin, and wrinkles are transferred. It is possible to manufacture a resin-encapsulated semiconductor device having no dents in the encapsulation resin due to the above.

[Brief description of the drawings]

1A and 1B are a plan view and a cross-sectional view showing a sealing resin of a resin-sealed semiconductor device applied to each embodiment.

FIG. 2 is a cross-sectional view illustrating a process of preparing a lead frame in a process of manufacturing a resin-sealed semiconductor device applied to each embodiment.

FIG. 3 is a cross-sectional view showing a step of bonding a semiconductor chip onto a die pad in a manufacturing step of a resin-sealed semiconductor device applied to each embodiment.

FIG. 4 is a cross-sectional view showing a step of forming a thin metal wire in a process of manufacturing a resin-sealed semiconductor device applied to each embodiment.

FIG. 5 is a cross-sectional view showing a step of laying a sealing tape under a lead frame in a process of manufacturing a resin-sealed semiconductor device applied to each embodiment.

FIG. 6 is a cross-sectional view showing a resin sealing step in a manufacturing step of the resin-sealed semiconductor device applied to each embodiment.

FIG. 7 is a cross-sectional view of the resin-encapsulated semiconductor device after the end cutting step of the inner lead in the manufacturing process of the resin-encapsulated semiconductor device applied to each embodiment;

FIG. 8 is a partial back view of the resin-sealed semiconductor device formed in the manufacturing process of the resin-sealed semiconductor device applied to each embodiment.

FIG. 9 is a plan view of a lower mold of an encapsulation mold used in a method of manufacturing a resin-encapsulated semiconductor device according to a first specific example of the first embodiment, and FIG. (A) is a sectional view showing the state of resin sealing at the center line.

FIG. 10 is a top view of a lower mold of a sealing mold according to a second specific example of the first embodiment having three rows of annular evacuation grooves and evacuation holes.

FIG. 11 is a top view of a lower mold of a sealing mold according to a third specific example of the first embodiment having three rows of annular evacuation grooves, connection grooves, and evacuation holes.

FIG. 12 is a top view of a lower mold of a sealing mold according to a fourth specific example of the first embodiment, having three rows of evacuation grooves and evacuation holes extending in the short side direction.

FIG. 13 is a top view of a lower mold of a sealing mold according to a fifth specific example of the first embodiment having three rows of evacuation grooves and evacuation holes extending in the long side direction.

FIG. 14 is a cross-sectional view showing a resin-sealed state in the method for manufacturing a resin-sealed semiconductor device according to the second embodiment.

FIG. 15 is a top view of a lower mold having a vacuum groove and a carved portion used in the second embodiment.

FIG. 16 is a plan view and a sectional view showing a first specific example of the third embodiment in which a clamper is provided in an upper mold.

FIGS. 17A and 17B are a plan view and a cross-sectional view illustrating a second specific example of the third embodiment in which a clamper that moves independently of a mold is provided.

FIGS. 18A and 18B are a plan view and a cross-sectional view illustrating a third specific example of the third embodiment in which a clamper extending in a long side direction is provided outside a mold.

FIG. 19 is a plan view and a sectional view showing a fourth specific example of the third embodiment in which an annular clamper surrounding the periphery of a mold is provided.

FIG. 20 is a plan view showing a fifth specific example of the third embodiment in which a clamper and a spring for urging the clamper in the short side direction are provided outside the mold.

FIG. 21 is a plan view showing a sixth specific example of the third embodiment in which a clamper and a spring for urging the clamper in the short side and long side directions are provided outside the mold.

FIG. 22 is a perspective view and a cross-sectional view showing a first specific example of the fourth embodiment in which a convex portion and a concave portion that engage with each other are provided on an upper mold and a lower mold, respectively.

FIG. 23 is a bottom view of an upper mold having a curved convex portion in a second specific example of the fourth embodiment.

FIG. 24 shows three rows of projections and recesses that engage with each other,
It is sectional drawing and the top view of a lower metal mold which show the 3rd example of 4th Embodiment provided in the lower metal mold, respectively.

FIG. 25 is a top view of a lower mold in which a plurality of rows of short linear concave portions are arranged in a staggered manner in a fourth specific example of the fourth embodiment.

FIG. 26 is a top view of a lower mold in which a plurality of small circular concave portions are arranged in a staggered manner in a fifth specific example of the fourth embodiment.

FIG. 27 is a top view of a lower mold having a linear concave portion and a small concave portion in a sixth specific example of the fourth embodiment.

FIG. 28 is a cross-sectional view showing a seventh specific example of the fourth embodiment in which convex portions and concave portions that engage with each other are provided in an upper mold and a lower mold, respectively, and a vacuum drawing groove is provided in the upper mold. It is.

FIG. 29 is a cross-sectional view illustrating a resin sealing method according to a fifth embodiment.

FIG. 30 is a perspective view showing a resin sealing device provided with a device for continuously supplying a sealing tape in a sixth embodiment and a resin sealing step.

FIG. 31 shows a state during a resin sealing step in the sixth embodiment.
It is sectional drawing which shows one process.

FIG. 32 is a cross-sectional view showing a state in a sealing die when a resin sealing step is performed in a state where tension is not applied to the sealing tape, and a cross-sectional view of a formed resin sealing body.

FIG. 33 is a cross-sectional view showing a state in a sealing mold when a resin sealing step is performed with tension applied to the sealing tape;
FIG. 3 is a cross-sectional view of a formed resin sealing body.

FIG. 34 is a plan view and a cross-sectional view of a conventional resin-encapsulated semiconductor device of a type having an external electrode on the back surface side.

FIG. 35 is a cross-sectional view of a conventional resin-encapsulated semiconductor device in which ball electrodes are provided on external electrodes to secure a stand-off height.

FIG. 36 is a cross-sectional view showing a step of preparing a lead frame in a manufacturing step of a conventional resin-encapsulated semiconductor device.

FIG. 37 is a cross-sectional view showing a step of bonding a semiconductor chip onto a die pad in a manufacturing process of a conventional resin-encapsulated semiconductor device.

FIG. 38 is a cross-sectional view showing a step of forming a thin metal wire in a manufacturing process of a conventional resin-encapsulated semiconductor device.

FIG. 39 is a cross-sectional view showing a resin sealing step in a manufacturing process of a conventional resin-sealed semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 12 Inner lead 13 Die pad 14 Suspended lead 15 Semiconductor chip 16 Fine metal wire 17 Sealing resin 18 External electrode 19 Depressed part 20 Lead frame 21 Sealing tape 101 Inner lead 102 Semiconductor chip 103 Die pad 105 Thin metal wire 106 Sealing tape 107 Sealing Resin 112a Upper mold 112b Lower mold 113 Vacuum evacuation hole 114 Vacuum evacuation groove 115 Engraved part 116 Connection groove 117 Vacuum evacuation groove 118 Vacuum evacuation groove 121a Upper die 121b Lower die 122 Clamper 123 Spring 124 Semiconductor product molding part (die) Cavity) 125 sealing tape 126 drive device 131a upper die 131b lower die 134 semiconductor product molding part (die cavity) 135 sealing tape 139 convex part 141 concave part 142 roll 144 sealing tree Flow path 146 Vacuum groove 147 Jig 151a Upper die 151b Lower die 152 Sealing tape 153 Lead frame 154a Resin tablet 154b Resin cul 155 Resin sealed semiconductor device 156a Unwind roll 156b Take-up roll 158 Piston 159 Rotating roll 160 semiconductor product molding section 161 sealing resin flow passage

[Procedure amendment]

[Submission date] March 15, 1999

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Full text

[Correction method] Change

[Correction contents]

[Document Name] Statement

Patent application title: Method for manufacturing resin-encapsulated semiconductor device and apparatus for manufacturing the same

[Claims]

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a resin-sealed semiconductor device in which a semiconductor chip and a lead frame are sealed with a sealing resin, and an apparatus for manufacturing the same.
In particular, the present invention relates to an improvement in a part of which is exposed from a sealing resin.

[0002]

2. Description of the Related Art In recent years, in order to cope with miniaturization of electronic equipment, it has been required to mount semiconductor components mounted on electronic equipment at a high density, and accordingly, semiconductor parts have been reduced in size and thickness. In.

A conventional resin-sealed semiconductor device will be described below.

FIG. 34A is a plan view of a conventional resin-encapsulated semiconductor device, and FIG. 34B is a cross-sectional view of the conventional resin-encapsulated semiconductor device.

As shown in FIGS. 34 (a) and 34 (b), a conventional resin-encapsulated semiconductor device is of a type having external electrodes on the back side.

A conventional resin-encapsulated semiconductor device includes a lead frame including an inner lead 201, a die pad 202, and a suspension lead 203 for supporting the die pad 202. The semiconductor chip 204 is bonded on the die pad 202 with an adhesive, and the electrode pad (not shown) of the semiconductor chip 204 and the inner lead 201 are electrically connected by the thin metal wire 205. The die pad 202, the semiconductor chip 204, the inner lead 201, the suspension lead 203, and the thin metal wire 205 are sealed with the sealing resin 6. In this structure, the sealing resin 206 does not exist on the back side of the inner lead 201, and the back side of the inner lead 201 is exposed.
The lower part of 1 is an external electrode 207.

In FIG. 34A, the sealing resin 206 is treated as a transparent body, and the inside of the semiconductor device is shown transparently. In the figure, the semiconductor chip 204 is shown by a broken line, and the thin metal wire 205 is shown. Illustration is omitted.

Conventionally, when a resin-encapsulated semiconductor device is mounted on a mounting board such as a printed board, a stand from the back surface of a sealing resin 206 required for bonding an external electrode to an electrode of the mounting board. In order to secure the off-height, as shown in FIG. 35, a ball electrode 209 made of solder is provided for the external electrode 207, and the ball electrode 209 is formed.
In this case, the stand-off height is secured, and the semiconductor device is mounted on the mounting board.

Next, a method for manufacturing a conventional resin-encapsulated semiconductor device will be described with reference to the drawings. FIG.
FIG. 39 is a cross-sectional view showing a manufacturing process of a conventional resin-encapsulated semiconductor device.

First, as shown in FIG. 36, a lead frame 2 having an inner lead 201 and a die pad 202 is provided.
Prepare 10 Although the die pad 202 is supported by suspension leads in the drawing, illustration of the suspension leads is omitted. A depressed portion is formed on the suspension lead, and the die pad 202 is set up. The lead frame 210 is not provided with a tie bar for stopping the flow of the sealing resin during resin sealing.

Next, as shown in FIG. 37, the semiconductor chip 20 is placed on the die pad 202 of the prepared lead frame.
4 is bonded with an adhesive. This step is a so-called die bonding step.

Then, as shown in FIG. 38, the semiconductor chip 204 bonded on the die pad 202 and the inner lead 201 are electrically connected by the thin metal wire 205. This step is a so-called wire bonding step.
As the thin metal wire 205, an aluminum thin wire, a gold (Au) wire, or the like is appropriately used.

Next, as shown in FIG.
02, the semiconductor chip 204, the inner leads 201, the suspension leads, and the fine metal wires 205 are sealed with a sealing resin 206. In this case, the lead frame to which the semiconductor chip 204 is bonded is housed in the sealing mold and is transfer-molded. In particular, the back surface of the inner lead 201 contacts the upper mold or the lower mold of the sealing mold. In this state, resin sealing is performed.

Finally, the tip 21 of the inner lead 201 projecting outward from the sealing resin 206 after the resin sealing.
Cut 1 By this cutting step, the tip surface of the inner lead 201 after cutting and the side surface of the sealing resin 6 are substantially on the same plane, and the lower part of the inner lead 201 becomes the external electrode 207.

In the conventional manufacturing process of the resin-encapsulated semiconductor device, the sealing resin 206 goes around the back surface of the inner lead 201 in the resin encapsulation process to form a resin burr (protruding portion of the resin). For this reason, a water jet process for blowing off resin burrs is usually introduced after the resin sealing process and before the cutting process of the inner lead 201.

If necessary, as shown in FIG. 35, a ball electrode made of solder is formed on the lower surface of the external electrode 207 to obtain a resin-sealed semiconductor device. In some cases, a solder plating layer is formed instead of a solder ball.

[0017]

However, in the conventional resin-encapsulated semiconductor device, since the lower surface of the external electrode 207 and the surface of the encapsulating resin 206 are on substantially the same surface on the back surface of the semiconductor device, The stand-off height from the stop resin 206 cannot be obtained. For this purpose, a ball electrode 209 made of solder or the like must be provided and mounted on a mounting board, and there has been a problem that efficient mounting cannot be performed.

In the resin sealing step of the conventional method of manufacturing a resin-encapsulated semiconductor device, a lead frame to which a semiconductor chip is bonded is housed in a sealing die, and an inner lead is provided on the surface of the lower die. Is pressed and brought into close contact with each other to seal the resin. However, there is still a problem that the sealing resin wraps around the back surface of the inner lead, and resin burrs (protrusions of the resin) are generated on the surface of the external electrode. there were.

Therefore, conventionally, a water jet process has been introduced to blow off the resin burrs 206a on the external electrodes 207. However, such a water jet process requires a great deal of labor, and a resin-encapsulated semiconductor. Contrary to the demand for simplification of steps such as reduction of steps in the mass production process of the apparatus. In other words, the occurrence of resin burrs has been a major obstacle to simplifying such a process. In addition, the water jet process may cause a serious quality problem that not only resin burrs but also soft metal plating is peeled off.

An object of the present invention is to provide a resin sealing step
Suppressing the occurrence of resin burrs on the back surface of the lead frame, or taking measures to secure the stand-off height from the sealing resin of the external electrode, and having good appearance and characteristics while having such a structure An object of the present invention is to provide a method of manufacturing a resin-sealed semiconductor device for obtaining a resin-sealed semiconductor device and an apparatus for manufacturing the same.

[0021]

According to a first aspect of the present invention, a semiconductor chip is mounted on a sealing tape.
Affixed the back of the lead frame, and at least
Place the sealing tab on the underside of the inner lead of the lead frame.
And a first step having a plurality of vacuum holes.
In a sealing mold comprising a mold and a second mold,
Resin-sealed lead frame with sealing tape
And at least the semiconductor chip of the lead frame is
A step of sealing the mounted upper surface area with a resin, and
Step of removing the sealing tape attached to the back of the frame
A method for manufacturing a resin-encapsulated semiconductor device comprising:
Then, the step of resin sealing is performed by using a second mold of the sealing mold.
Depending on the mold, the inner lead is
While pressing, the first mold of the sealing mold
The configured grooves and multiple vacuum holes in the grooves
When the resin is sealed using the first mold, the plurality of rows of grooves are formed.
Of the grooves, in order from the outermost row of grooves to the inside,
After vacuuming, with the sealing tape uniformly spread
Injecting a sealing resin into the sealing mold to perform resin sealing
It is.

According to this method, when there is a portion of the lead frame that is to be reliably exposed from the sealing resin, the second
In this step, the sealing tape is brought into close contact with the portion of the lead frame , thereby realizing a structure in which the portion is reliably exposed from the sealing resin. Further, since no resin burr is formed on that portion of the lead frame , a process such as a water jet which has been conventionally required can be omitted, and thus the manufacturing process can be simplified. Also, by this method, first, the sealing tape is
After being stretched by being pulled into the groove of the
Larger and more uniform as it is pulled into the inner groove
High tension can be applied to the sealing tape.

As described in claim 2, the first
The sealing die and the semiconductor chip comprising the die and the second die
A first step of preparing a mounted lead frame;
A stop tape is adhered to a part of the surface of the lead frame.
A second step of attaching to the sealing die while sealing
With the sealing tape attached while applying tension to the tape
At least the semiconductor chip and the lead frame
Also, a portion of the surface except for a part of the surface is sealed in a sealing resin.
Method of manufacturing resin-encapsulated semiconductor device having three steps
Wherein the first step comprises the steps of:
At least one of the mold and the second mold
It has a die cavity and has a small
For sandwiching the sealing tape in at least two areas
In the third step, a clamper is provided.
By fixing the sealing tape with a damper
That is, tension is applied to the sealing tape.

According to this method, the clamper
This provides tension to the sealing tape.

According to a third aspect of the present invention ,
In a method of manufacturing a resin-encapsulated semiconductor device in which a tension is applied to a sealing tape by a lamper,
The sealing tape stretches against the clamper for clamping.
A biasing means for biasing in the direction
Thus, tension can be applied to the sealing tape .

According to this method, the urging force of the urging means is
Thus, a greater tension can be applied to the sealing tape.

According to a fourth aspect of the present invention ,
In the method of manufacturing a resin-encapsulated semiconductor device in which a sealing tape is applied with tension by a lamper , the second step
Before, use a clamper to seal away from the sealing mold.
Holding the stop tape, and in the second step,
Put the sealing tape together with the ramper to the position of the sealing mold.
In moves can Rukoto.

According to this method, a long time before the resin sealing is performed.
The sealing tape is excessively high due to the heat and tension of the sealing mold.
Stretching can be prevented.

[0029] As described in claim 5, the first
A die in at least one of the mold and the second mold.
At least one having a cavity and engaging each other
The pair of protrusions and recesses are placed in front of the first mold and the second mold.
At least two areas sandwiching the die cavity
In the third step, the sealing mold is prepared.
When the first mold and the second mold approach,
Tension is applied to the sealing tape by the engagement between the convex and concave portions.
Can be granted .

According to this method, the first mold and the second mold
When the protrusions and recesses engage with each other, the sealing tape is
Tension on the sealing tape by being pulled into the engaging part of
Power is given.

According to a sixth aspect of the present invention, the projection
Part - The method of manufacturing a resin-sealed semiconductor device which is to give a tension to the seal tape by engagement of the recess, the first
In the step, the protrusions and the recesses have different engagement lengths from each other.
And the engagement length is larger for the outermost convex portions and concave portions.
In the third step, the outermost
Sealing tape stretched by engagement of convex and concave portions
Is further pulled by the engagement of the convex and concave portions on the inside.
Can you to apply tension to the seal tape as extended.

According to this method, the first mold and the second mold
When they approach each other, they are pulled by the engagement of the outermost convex and concave portions.
The extended sealing tape is
Larger and evener due to further stretching by engagement
One tension can be applied to the sealing tape .

According to a seventh aspect of the present invention, in the method of manufacturing a resin-encapsulated semiconductor device, the encapsulation tape is used in a plurality.
Several pieces can be used .

An apparatus for manufacturing a resin-encapsulated semiconductor device according to the present invention.
Is a resin-sealed semi-conductor as described in claim 8
Used in the resin sealing process in the manufacturing process of the body device
A first mold or a second mold comprising a first mold and a second mold.
Die cavity in at least one of mold 2
Having a sealing mold and a surface of the resin-sealed semiconductor device.
Tension on the sealing tape to expose part of the sealing resin
Resin mold having tension applying means for applying pressure
An apparatus for manufacturing a semiconductor device, wherein the tension applying means includes:
At least two areas sandwiching the die cavity
And a clamper for holding the sealing tape.
This is an apparatus for manufacturing a resin-encapsulated semiconductor device.

Thus, sealing with a clamper at the time of resin sealing is performed.
By holding the tape, tension can be applied to the sealing tape .

According to a ninth aspect of the present invention,
PA stretches the sealing tape in at least two directions.
Have the function of moving.

As a result, a larger tension is applied to the sealing tape.
Can be given .

As described in claim 10, the above
For manufacturing equipment for resin-encapsulated semiconductor devices with clampers
And the sealing tape is stretched against the clamper
Preferably, the apparatus further comprises a biasing means for biasing in the direction.
No.

[0039] As described in claim 11, the above
For manufacturing equipment for resin-encapsulated semiconductor devices with clampers
The clamper holds the sealing tape while holding the sealing mold.
Can be moved to a position of the sealing mold from a place away from
It can also have functions .

Thus, the sealing tape is exposed to the heat of the sealing mold.
Excessive sealing tape due to no long-term exposure
Stretching can be avoided .

According to a twelfth aspect, a resin
The manufacturing device for the encapsulated semiconductor device is a resin-encapsulated semiconductor device.
Gold used in the resin encapsulation step in the manufacturing process
A first mold or a second mold comprising a mold and a second mold
At least one of the molds has a die cavity
A sealing mold and a part of the surface of the resin-sealed semiconductor device;
Apply tension to the sealing tape to expose it from the sealing resin.
-Sealed semiconductor provided with tension applying means for
An apparatus for manufacturing an apparatus, wherein the tension applying means is configured to
The die cavity is sandwiched between the first mold and the second mold.
Engaging with each other provided in at least two areas
At least one pair of convex and concave portions, a resin-sealed semiconductor
It is an apparatus for manufacturing a body device.

Thus, the first mold and the second
When the mold 2 approaches, the sealing te
Tensioning the sealing tape as the
It is possible that.

As described in claim 13, the above
In an apparatus for manufacturing a resin-encapsulated semiconductor device having a projection and a recess engaged with each other , the projection and the recess are related to each other.
Only a plurality of pairs with different combined lengths are provided, and the engagement length is
The larger the convex portions and concave portions on the outside, the larger it can be.

Thus, sealing is performed sequentially from the outermost engaging portion.
The tape can be tensioned so it can be larger
A uniform tension can be applied to the sealing tape.

As described in claim 14, the above
Resin-sealed semi-conductor with convex and concave engaging with each other
In the apparatus for manufacturing a body device, the first mold or the second mold
The mold has multiple die cavities,
The recesses and recesses are the outer area sandwiching all die cavities and
Serial can it to arranged on the inner area between the die cavity.

As described in claim 15, the above
In a manufacturing apparatus of a resin-encapsulated semiconductor device having a convex portion and a concave portion which engage with each other, the wall surface of the convex portion or the concave portion
Should be roughened to prevent slippage.
New

As a result, the engagement portion between the convex portion and the concave portion is sealed.
The effect of pulling the tape can be reliably achieved .

As described in claim 16, the above
In an apparatus for manufacturing a resin-encapsulated semiconductor device having a projection and a recess engaged with each other, the wall surface of the projection or the recess is smooth.
It is preferable to use a hard-to-react material.

[0049] Also I'm in this, the convex portion - the engaging portion between the recess
The effect of pulling the sealing tape can be reliably achieved .

[0050] As described in claim 17, the above
In a manufacturing apparatus for a resin-encapsulated semiconductor device provided with a convex portion and a concave portion which engage with each other , the concave portion includes an evacuation device.
A connected vacuum hole may be formed in advance.

As a result, the pull by the engagement between the convex portion and the concave portion is achieved.
Sealed by pulling force by vacuuming in addition to pulling force
The stop tape can be tensioned.

[0052] As described in claim 18, in the manufacturing apparatus of the tree Aburafutome type semiconductor device, the first or second
Resin-molded semiconductor device in one of the molds
Engraved area is provided in the area facing part of the surface of the
You can keep it.

Thus, the sealing tape is engraved when sealing the resin.
It can be released to the insertion part.
The dent amount of the stop tape can be adjusted. That is, some of the above
The amount of protrusion from the sealing resin is adjusted by the depth of the engraved part
It can be.

As described in claim 19, the resin
The manufacturing device for the encapsulated semiconductor device is a resin-encapsulated semiconductor device.
Gold used in the resin sealing step in the manufacturing process of
A second mold or a first mold comprising a mold and a first mold
At least one of the molds has a die cavity
A sealing mold and a part of the surface of the resin-sealed semiconductor device;
Apply tension to the sealing tape to expose it from the sealing resin.
-Sealed semiconductor provided with tension applying means for
An apparatus for manufacturing an apparatus, wherein the tension applying means includes the second
At least one of the mold and the first mold
Provided in the area sandwiching the die cavity, and evacuated.
Vacuum for communicating with the device and sucking the sealing tape
A pulling recess, wherein the vacuum pulling recess is
A plurality of grooves provided around the cavity and the plurality of grooves;
Communicate with the evacuation device formed only in the outermost groove
Manufacturing apparatus for a resin-encapsulated semiconductor device,
You.

As a result, the sealing tape is sequentially formed from the outermost groove.
Larger and evener
Can Rukoto given one tension in the sealing tape.

[0056]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, a description will be given of a resin-sealed semiconductor device of the present invention, which can be applied to each embodiment, and a method of manufacturing the same.

FIG. 1A is a plan view showing an example of the structure of a resin-sealed semiconductor device according to the present invention, and FIG.
FIG. 2 is a cross-sectional view taken along the line Ib-Ib shown in FIG. However, in FIG. 1A, the sealing resin 17 is treated as a transparent body, the semiconductor chip 15 has a contour shown by a broken line, and illustration of the thin metal wire 16 is omitted.

As shown in FIGS. 1A and 1B, the resin-encapsulated semiconductor device has an inner lead 12, a die pad 13 for supporting a semiconductor chip, and a suspension for supporting the die pad 13. A lead frame including the leads 14 is provided. The semiconductor chip 15 is bonded on the die pad 13 with an adhesive, and the electrode pads (not shown) of the semiconductor chip 15 and the inner leads 12 are electrically connected to each other by the thin metal wires 16. Then, the inner lead 12 and the die pad 1
3. Suspended lead 14, semiconductor chip 15, and thin metal wire 1
6 is sealed in a sealing resin 17. The die pad 13 is set up by the depress portion 19 of the suspension lead 14 so as to be located above the inner lead 12. Therefore, in a state where the sealing resin 17 is sealed, the sealing resin 17 also exists thinly on the back surface side of the die pad 13. The sealing resin 17 does not exist on the lower surface side of the inner lead 12.
Is exposed, and the lower surface of the inner lead 12 serves as a connection surface with the mounting substrate. That is, the lower part of the inner lead 12 is the external electrode 18. In addition, the external electrode 18 does not inherently have a resin burr which is a portion of the resin protruding in the resin sealing step, and the external electrode 18 slightly protrudes below the back surface of the sealing resin 17. Such a structure of the external electrode 18 having no resin burr and projecting downward can be easily realized by a manufacturing method described later.

In such a resin-encapsulated semiconductor device, the outer lead does not exist on the side of the inner lead 12 and the lower portion of the inner lead 12 serves as the external electrode 18, so that the size of the semiconductor device can be reduced. Can be planned. In addition, since no resin burr exists on the lower surface of the inner lead 12, that is, on the lower surface of the external electrode 18, the reliability of bonding with the electrode of the mounting board is improved. Further, since the external electrode 18 is formed so as to protrude from the surface of the sealing resin 17, when the resin-sealed semiconductor device is mounted on the mounting substrate, the external electrode 18 is bonded to the electrode of the mounting substrate. Is secured in advance. Therefore, the external electrode 18 can be used as an external terminal as it is, and it is not necessary to attach a solder ball to the external electrode 18 for mounting on the mounting board as in the conventional case, which is advantageous in terms of man-hour and manufacturing cost. Become.

Next, a method for manufacturing a resin-sealed semiconductor device will be described with reference to the drawings. 2 to 7
It is sectional drawing which shows an example of the manufacturing process of the resin sealing type semiconductor device of this invention.

First, in a step shown in FIG. 2, an inner lead 12 and a die pad 13 for supporting a semiconductor chip are formed.
Is prepared. In the figure, the die pad 13 is supported by suspension leads, but is not shown because it does not appear in this cross section.
A depressed portion is formed in the suspension lead, and the die pad 13 is set up above the surface of the inner lead 12. Furthermore, the prepared lead frame 20 is a lead frame which does not have a tie bar for stopping outflow of the sealing resin during resin sealing.

Next, in the step shown in FIG. 3, the semiconductor chip 15 is placed on the die pad of the prepared lead frame, and the two are joined to each other with an adhesive. This step is
This is a so-called die bonding process. The member for supporting the semiconductor chip is not limited to the lead frame, and a member that can support another semiconductor chip, for example, a TAB tape or a substrate may be used.

Then, in the step shown in FIG.
3 and the semiconductor chip 15 and the inner lead 12
Are electrically connected by the thin metal wire 16. This step is a so-called wire bonding step. As the thin metal wire, an aluminum thin wire, a gold (Au) wire, or the like can be appropriately selected and used. Further, the electrical connection between the semiconductor chip 15 and the inner leads 12 may be performed not through the thin metal wires 16 but through bumps or the like.

Next, in the step shown in FIG. 5, a sealing tape 21 is attached to the back surface of the inner lead 12 with the semiconductor chip 15 bonded to the die pad 13 of the lead frame.

The sealing tape 21 serves as a mask for preventing the sealing resin from flowing around the resin, especially when sealing the resin on the rear surface side of the inner lead 12. Can prevent resin burrs from being formed on the back surface of the inner lead 12. The sealing tape 21 to be attached to the inner leads 12 and the like is a tape based on a resin containing polyethylene terephthalate, polyimide, polycarbonate, or the like as a main component, and can be easily peeled off after resin sealing. Any material that can withstand the high-temperature environment at the time of stoppage may be used. Here, a tape containing polyethylene terephthalate as a main component was used, and the thickness was 50 [μm].

Here, the sealing tape 21 is
It is adhered to the entire back surface of the lead frame in a state of being in close contact with only the surface of the inner lead 12 of the lead frame, and is not in close contact with the back surface of the die pad 13 upset by the depressed portion of the suspension lead. However, the rear surface of the die pad 13 may be exposed by bringing the sealing tape 21 into close contact with the rear surface of the die pad 13 and peeling off the sealing tape 21 after the resin sealing step, thereby improving the heat radiation characteristics.

Next, in the step shown in FIG.
5, the lead frame to which the sealing tape 21 is attached is housed in a mold, and the sealing resin 17 is poured into the mold to perform resin sealing. At this time, the inner lead 12
The distal end portion 22 of the inner lead 12 of the lead frame is pressed downward with a metal mold so as to prevent the sealing resin 17 from wrapping around the rear surface of the lead frame. In addition, the surface of the sealing tape 21 on the back surface side of the inner lead 12 is pressed toward the mold surface side to perform resin sealing.

Finally, in the step shown in FIG. 7, the sealing tape 21 adhered to the back surface of the inner lead 12 is removed by peeling off to form the external electrode 18 projecting from the back surface of the sealing resin 17. Then, by separating the distal end portion 22 of the inner lead 12 such that the distal end surface of the inner lead 12 and the side surface of the sealing resin 17 are substantially flush with each other,
A resin-sealed semiconductor device as shown in FIG. 7 is completed.

FIG. 8 is a partial rear view of the resin-encapsulated semiconductor device, showing the external electrode 18 in an enlarged manner. As shown in the figure, since the resin sealing step in which the sealing tape 21 is adhered to the back surface of the lead frame is performed here, the back surface and the side surface of the inner lead 12, that is, the external electrode 18
Of resin burrs on the surface of the substrate can be prevented. Further, it is possible to prevent the sealing resin 17 from going around the surface of the external electrode 18 and burying a part of the external electrode 18 in the sealing resin 17 as in the conventional manufacturing method.

In the above manufacturing method, the sealing tape 21 is applied to the back surface of the inner lead 12 before the resin sealing step.
Is adhered, so that the sealing resin 17 does not wrap around, and no resin burrs are generated on the back surface of the inner lead 12 serving as an external electrode. Therefore, unlike the conventional method of manufacturing a resin-encapsulated semiconductor device that exposes the lower surface of the inner lead, it is not necessary to remove the resin burr formed on the inner lead by a water jet or the like. That is, by eliminating the troublesome process for removing the resin burr, the process in the mass production process of the resin-encapsulated semiconductor device can be simplified. In addition, the peeling of the metal plating layer of nickel (Ni), palladium (Pd), gold (Au) or the like on the lead frame, which may have conventionally occurred in the resin burr removal step using a water jet or the like, can be eliminated. Therefore, pre-plating of each metal layer before the resin sealing step can be performed.

In addition, since the external electrode 18 formed by the above-described manufacturing method protrudes from the sealing resin 17, the external electrode 18 is used as an external terminal without attaching a solder ball as in the related art. be able to.

As shown in FIG. 6, in the resin sealing step, the sealing tape 21 is softened and thermally contracted by the heat of the molten sealing resin. And a step is formed between the back surface of the inner lead 12 and the back surface of the sealing resin 17. Therefore, the back surface of the inner lead 12 has a structure protruding from the back surface of the sealing resin 17, and the stand-off height of the external electrode 18 below the inner lead 12 can be secured. Therefore, this protruding external electrode 1
8 can be used as it is as an external terminal.

The size of the step between the back surface of the inner lead 12 and the back surface of the sealing resin 17 can be controlled by the thickness of the sealing tape 21 applied before the sealing step. In the present invention, the sealing tape 2 of 50 [μm] is used.
1, the size of the step, that is, the external electrode 18
Is generally about half of that, with a maximum of 50
[Μm]. That is, since the amount of the sealing tape 21 entering above the back surface of the inner lead 12 is determined by the thickness of the sealing tape 21, the protrusion amount of the external electrode 18 can be self-controlled by the thickness of the sealing tape 21, Manufacturing can be facilitated. This external electrode 1
In order to control the amount of protrusion of 8, it is only necessary to control the thickness of the sealing tape 21 in the mass production process, and there is no need to provide a separate process. Therefore, the manufacturing method of the present invention is extremely advantageous in cost of process control. It is a way. In addition, about the sealing tape 21 to stick, according to the magnitude | size of a desired step,
The hardness, thickness, and softening property of the material due to heat can be determined.

As shown in FIG. 1B, in the above resin-encapsulated semiconductor device, although the encapsulating resin 17 exists on the back surface side of the die pad 13, the thickness of the encapsulating resin 17 is Very thin. Therefore, the resin-sealed semiconductor device is substantially a single-sided sealed semiconductor device.

Here, an example is shown in which the sealing tape 21 is attached to the lower surface of the inner lead 12 of the lead frame before the resin sealing step. However, the sealing tape 21 is not used. May be set in a sealing mold, and the lead frame 12 may be adhered thereon. In this case, as described later, the supply of the sealing tape to the sealing die can be performed, thereby further streamlining the process.

Here, an example of a manufacturing method in which a sealing tape is adhered to the back surface of a lead frame to perform resin sealing has been described. However, the method of the present invention is limited to a semiconductor device having a lead frame. It is not something to be done. The method of using a sealing tape in the resin sealing step, which is a basic concept of the present invention, is widely applicable to the resin sealing step of a semiconductor device having a semiconductor chip mounted thereon and having a member to be resin-sealed. It can be applied to a resin sealing process for semiconductor devices of a TAB type, a substrate type, and the like.

Hereinafter, embodiments of the present invention will be described. In the following embodiments, a resin sealing method and a resin sealing device for preventing generation of wrinkles in a resin-sealed semiconductor device will be described with reference to the drawings.

(First Embodiment) Next, specific examples according to the first embodiment in which tension is applied to the sealing tape by vacuum evacuation to eliminate wrinkles will be described.

-First Specific Example- FIG. 9A shows a sealing die (lower die) used in a method of manufacturing a resin-sealed semiconductor device according to a first specific example of the present embodiment. 9B is a cross-sectional view showing a state of resin sealing along a center line in FIG. 9A.

As shown in FIGS. 9A and 9B, in the method of manufacturing a resin-encapsulated semiconductor device of the present embodiment, first, a lead frame having an inner lead 101 and a die pad 103 is prepared. The semiconductor chip 102 is bonded to the die pad 103 with a die bond material, and the electrode pads (not shown) on the semiconductor chip 102 and the inner leads 101 are electrically connected via the thin metal wires 105. In addition, the upper mold 112a and four evacuation holes 11 are provided.
3 and a lower mold 112b having an evacuation groove 114 for communicating between the evacuation holes 113 are prepared. Then, the lower mold 1 of the sealing mold 112
The sealing tape 106 is placed on the top 12b, and the lead frame on which the semiconductor chip 102 is mounted is placed thereon. In this state, the inner lead 1 of the lead frame
01 is in contact with the sealing tape 106.

Next, the upper mold 112a and the lower mold 112b of the sealing mold 112 are matched. At this time, the upper mold 112a
Is in contact with the upper surface of the sealing tape 106. Then, the upper mold 112a is pressed, and the lower mold 112b is pressed by a vacuuming device (not shown).
The sealing tape 106 is evacuated in four directions in the mold through the four evacuation holes 113 formed in the mold, and the uniformly extended state is maintained. By performing the resin sealing step in this state, the sealing tape 10 due to heat shrinkage during resin sealing is formed.
6 can be prevented from occurring. As a result, the back surface of the resin of the resin-molded resin-molded semiconductor device is formed flat.

Hereinafter, the mechanism for eliminating the wrinkles of the sealing tape will be described in more detail. At the time of resin sealing, the sealing tape 106 undergoes thermal contraction and shrinks, so that the sealing tape 106 is pulled in the direction of each of the vacuum holes 113 by performing vacuum evacuation through the vacuum holes 113. Can be By giving the sealing tape 106 an extended state as described above, the contraction of the sealing tape 106 is suppressed, and the occurrence of wrinkles is prevented. Therefore,
On the back surface of the formed resin-encapsulated semiconductor device, the surface of the encapsulation resin 107 that has been in contact with the encapsulation tape 106 is flat.

The depth and width of the evacuation groove 114 connected to the evacuation hole 113 on the lower mold 112b of the sealing mold 112 are formed in consideration of the elongation of the sealing tape 106. It is desirable.

However, it is also possible to pull the sealing tape from each of the vacuum holes individually without providing the vacuum grooves.
The effect of preventing the generation of wrinkles in the sealing tape can be exhibited.

In the present embodiment, the method of bonding a semiconductor chip to a lead frame and performing wire bonding is the same as the conventional method, so that the description using the drawings is omitted.

As described above, according to the method of manufacturing the resin-encapsulated semiconductor device of the present embodiment, when the encapsulation tape is brought into close contact with the lead frame or the like and is encapsulated with the resin, the encapsulation die is placed at substantially uniform intervals. When the sealing tape is sucked through a plurality of provided vacuum evacuation holes and sealed with a resin while the sealing tape is pulled uniformly, wrinkles due to heat shrinkage when the sealing tape is thin The resin portion on the back surface of the resin-sealed semiconductor device after resin sealing can be formed flat.
In particular, by providing the evacuation groove, a more uniform pulling force can be applied to the sealing tape.

A method of forming a vacuum evacuation hole in the sealing mold of the present embodiment and performing a resin encapsulation step while pulling a sealing tape through the evacuation hole or a method of each embodiment described later. Can be applied not only to semiconductor devices having the structures shown in FIGS. 1A and 1B, but also to semiconductor devices having various structures. However, when the sealing tape needs to be brought into close contact with the upper mold, a vacuum hole is formed in the upper mold, and the sealing tape is pulled through the vacuum hole.

Next, as modifications of the first embodiment, various embodiments in which a plurality of rows of evacuation grooves or evacuation holes are provided will be described.

FIG. 10 shows three rows of annular evacuation grooves 114a and 114.
b, 114c and each of the evacuation grooves 114a, 114b, 1
Vacuum evacuation holes 113a, 113b,
The lower mold 11 according to the second specific example provided with 113c.
It is a top view of 2b. In such a case, each evacuation hole 1
Vacuum evacuation may be performed simultaneously from 13a, 113b, and 113c, but first, evacuation is performed from the outermost evacuation hole 113a to extend the sealing tape, and then evacuation is performed from the intermediate evacuation hole 113b. Finally, three stages of evacuation may be performed such that the evacuation is performed from the innermost evacuation hole 113c to gradually elongate the sealing tape gradually. By performing this stepwise evacuation, there is an advantage that a more uniform and large tensile force can be applied to the sealing tape.

-Third Specific Example- FIG. 11 shows three rows of annular evacuation grooves 114a and 114.
b, 114c, a connecting groove 116a connecting between the evacuation grooves 114a-114b, and an evacuation groove 114b-114.
It is a top view of the lower metal mold | die 112b which concerns on the 3rd specific example in which the connection groove 116b which connects between c and the evacuation hole 113 formed in the outermost evacuation groove 114a were provided. In this case, when the evacuation is performed through the evacuation hole 113, the degree of vacuum is sequentially increased from the outermost groove 114a. Therefore, the same effect as stepwise evacuation can be exerted without performing control for shifting the evacuation timing.

Fourth Specific Example FIG. 12 shows three rows of linearly evacuated grooves 117a, 117b, 117c extending in the short side direction, and each of the evacuated grooves 117.
a, 117b, 117c
It is a top view of the lower metal mold | die 112b which concerns on the 4th example provided with 3a, 113b, 113c. The structure shown in FIG. 12 can also apply a tensile force to the sealing tape. In this case, as described above, three stages of evacuation may be sequentially performed from the outermost evacuation hole 113a. Alternatively, a connection groove as shown in FIG. 11 may be provided, a vacuum hole may be formed in the outermost vacuum groove 117a, and vacuum may be evacuated from this vacuum hole. In any case, the same effect as described for the structure provided with the annular evacuation groove can be exerted.

Fifth Specific Example FIG. 13 shows three rows of evacuation grooves 118a, 118b and 118c extending in the long side direction, and the evacuation grooves 118.
a, 118b, 118c
It is a top view of the lower metal mold | type 112b which concerns on the 5th example provided with 3a, 113b, and 113c. With the structure shown in FIG. 13, a pulling force can be applied to the sealing tape. In that case, as described above, the outer evacuation hole 1
The evacuation in two stages may be performed sequentially from 13a. Alternatively, a connection groove as shown in FIG. 11 may be provided, a vacuum hole may be formed in the outer vacuum groove 117a, and vacuum may be evacuated from this vacuum hole. In any case, the same effect as described for the structure provided with the annular evacuation groove can be exerted.

In the above embodiment, the lower mold 112b
Although the example in which the vacuum groove and the vacuum hole are provided is described above, it goes without saying that the upper mold 112a may be provided with the vacuum groove and the vacuum hole. Further, the upper mold 112a
In addition, both the lower mold 112b and the lower mold 112b may be provided with a vacuum groove or a vacuum hole.

(Second Embodiment) Next, a method for manufacturing a resin-sealed semiconductor device according to a second embodiment of the present invention will be described. In the present embodiment, a device for releasing the pressing force applied to the sealing tape particularly below the inner lead will be described. FIG. 14 is a cross-sectional view illustrating a resin-sealed state in the method for manufacturing a resin-sealed semiconductor device according to the present embodiment. FIG. 15 is a top view of the lower mold 112b used in the present embodiment.

In FIGS. 14 and 15, the same members as those in the first embodiment are denoted by the same reference numerals as in FIG. 9B, and description thereof is omitted. In the present embodiment, in addition to the structure shown in FIG. 9B in the first embodiment,
In a region located below the inner lead 101 on the upper surface of the lower mold 112b, a carved portion 115 is formed with a desired depth. By using the lower mold 112b having a carved portion 115 below the inner lead 101, a part of the sealing tape 106 escapes into the carved portion 115 during resin sealing.
It is possible to suppress a deep groove which is easily formed between the layers 01 to shallow. Further, the adhesion area between the side surface of the inner lead 101 and the sealing resin 107 can be increased, and the adhesion strength between the inner lead 101 and the sealing resin 107 can be increased.

Here, the depth of the engraved portion 115 is appropriately determined according to the thickness of the sealing tape 106. When the thickness is equal to or greater than the thickness of the sealing tape 106, almost no pressure is applied to the inner leads 101, and thus the amount of protrusion of the inner leads 101 after the resin sealing step is almost eliminated. On the other hand, when the depth of the engraved portion 115 is close to 0, the protrusion amount of the inner lead 101 becomes too large as described above, and the effect of the present embodiment cannot be achieved.
Deep grooves are likely to appear between the inner leads 101. Therefore, when the sealing tape 106 is about 25 μm, the engraved portion 115 is almost unnecessary, but when the thickness of the sealing tape is about 30 μm to 80 μm, the thickness of the sealing tape 106 and the depth of the engraved portion 115 Is 2
It is preferably about 5 μm.

The structure in which the engraved portion is provided can be applied not only to the present embodiment but also to the embodiments already described and the embodiments described later.

(Third Embodiment) Next, in order to apply a pulling force to the sealing tape, a third embodiment in which a resin sealing step is performed while pulling the sealing tape from both sides will be described. This will be described with reference to FIGS.

-First Specific Example- FIGS. 16 (a) and 16 (b) are plan views showing a first specific example in which a clamper is provided on an upper mold and a pulling force is applied to the sealing tape by the clamper. It is a figure and a sectional view. FIG.
As shown in FIGS. 6 (a) and 6 (b), the sealing device and the sealing mold of the resin-encapsulated semiconductor device are an upper mold 121a, a clamper 122a installed on the upper mold 121a, and a lower mold. Type 1
21b, a semiconductor product molding part 124 (die cavity) provided in the lower mold 121b, a sealing tape 125,
A structure in which a drive device 126 for applying pressure between the upper mold 121a and the lower mold 121b is provided, and the sealing tape 125 is sandwiched and fixed between the lower surface of the upper mold 121a and the clamper 122a. It has become. The lower mold 121
The b has a relief portion for avoiding a buffer with the clamper 122a.

-Second Specific Example- In FIGS. 17 to 21 in the following specific examples, FIG.
The same members as those shown in (a) and (b) are denoted by the same reference numerals and description thereof will be omitted.

FIGS. 17A and 17B show a mold 121a,
It is the top view and sectional drawing which show the 2nd specific example which comprised the clamper 122b provided outside 121b, and this clamper 122b was able to move independently of metallic molds 121a and 121b.

-Third Specific Example- FIGS. 18A and 18B show a case where a clamper 122c is provided outside the mold and extends in the long side direction, and the clamper 122c is independent of the molds 121a and 121b. FIGS. 9A and 9B are a plan view and a cross-sectional view illustrating a third specific example configured to be able to be moved.

-Fourth Specific Example- FIGS. 19A and 19B show an annular clamper 122d surrounding the dies 121a and 121b provided outside the dies 121a and 121b. Mold 1
It is the top view and sectional drawing which show the 4th specific example comprised so that it could move independently of 21a, 121b.

FIG. 20 shows a clamper 122b having the same structure as that of the second embodiment outside the dies 121a and 121b. The clamper 122b is independent of the dies 121a and 121b. And the clamper 122b
123 for urging the outside in a direction parallel to the short side direction
It is a top view which shows the 5th specific example in which was provided. In addition, two springs are provided for each clamper 122b,
May be biased in all directions.

Sixth Specific Example FIG. 21 shows a clamper 122 having the same structure as the third specific example extending outwardly of the dies 121a and 121b in the long side direction.
c, and the clamper 122c is
1b and can be moved independently.
FIG. 18 is a plan view showing a sixth specific example in which a spring 123 for urging the clamper 122c outward in a direction parallel to the short side direction is provided.

-Effects of Specific Examples- With any of the structures shown in FIGS. 17 to 21, a pulling force can be applied to the sealing tape 125, and wrinkling of the sealing tape 125 in the resin sealing step occurs. Consequently, it is possible to prevent the occurrence of an uneven pattern in the sealing resin. In particular, when a spring for urging the clamper outward is provided, the pulling force can be more effectively applied to the sealing tape. The means for urging the clamper outward is not limited to a spring, and it goes without saying that another elastic body such as rubber may be used.

In the second to sixth specific examples,
A function that allows the mechanism holding the clamper to move from a position away from the sealing mold to the vicinity of the sealing mold is added, and the sealing tape is affected by the thermal influence of the upper mold and the lower mold. After being clamped and fixed by the clamper at a place where it is not so separated, it may be supplied to the upper die 121a or the lower die 121b.

(Fourth Embodiment) Next, a concave portion and a convex portion which are engaged with each other are provided in the upper mold and the lower mold of the sealing mold, and the sealing is performed when the resin is sealed. Each specific example of the fourth embodiment in which the tape is sandwiched between the concave portion and the convex portion to apply a pulling force to the sealing tape will be described with reference to FIGS. 22 to 27. I do.

-First Specific Example- FIGS. 22A and 22B are a perspective view and a sectional view, respectively, showing a first specific example of the present embodiment. However, FIG.
FIG. 22 (b) shows the convex portion 139a and the concave portion 1 shown in FIG.
It is sectional drawing in the center part of the direction orthogonal to 41a.
As shown in FIGS. 22 (a) and 22 (b), the upper mold 131a has a convex portion 139a projecting vertically from the mold mating surface, while the lower mold 131b has the upper mold 131.
A concave portion 141a that can be engaged with the convex portion 139a of FIG. The lower mold 131b includes a semiconductor product molding unit 134.
Is provided.

With this structure, when the upper mold 131a is lowered and approaches the lower mold 131b, the sealing tape 1
35 are sandwiched between the convex portion 139a and the concave portion 141a which engage with each other. When the upper mold 131a is further lowered, the sealing tape 135 is moved to the convex portion 139a and the concave portion 141a.
, The sealing tape 135 is stretched in at least two directions.

-Second Specific Example- FIG. 23 is a bottom view of an upper mold showing a second specific example of the present embodiment. In this specific example, the upper mold 121a is provided with a convex portion 139b that is not linear but curved. Although the figure showing the structure of the lower mold is omitted, the lower mold is provided with a curved concave portion engageable with the convex portion 139b. Even with such a structure, the sealing tape can be elongated by the same operation as in the first specific example.

-Third Specific Example- FIGS. 24A and 24B are a sectional view and a top view of a lower mold, respectively, showing a third specific example of the present embodiment. However, FIG. 24A shows the concave portion 141c shown in FIG.
FIG. 4 is a cross-sectional view of a central portion in a direction orthogonal to FIG. In this specific example, the upper mold 131a is formed with three rows of convex portions 139c projecting vertically from the mold mating surface.
However, the heights of the three rows of projections 139c are gradually reduced from the outermost side. On the other hand, the lower mold 131b has a depth that allows the protrusion 139c of the upper mold 131a to engage.
A row of recesses 141a is formed. In other words, the outer convex portion 139c and concave portion 141c have a larger engagement length. Further, the lower mold 131b includes the semiconductor product molding unit 1
34 are provided. In addition, a roll 142 as an urging means for pulling the sealing tape 135 is also provided, but this roll 142 is not always necessary.

As described above, the convex portions 139c and the concave portions 141c which are engaged with each other in a plurality of rows are provided. By putting, the outermost convex part-
The sealing tape stretched by the engagement of the concave portion is sequentially stretched by the engagement of the convex portion and the concave portion inside. That is, since the sealing tape 135 can be pulled while gradually increasing the strength, the sealing tape 135 can be more effectively extended.

-Fourth Specific Example- FIG. 25 is a top view of a lower mold showing a fourth specific example of the present embodiment. In this specific example, a plurality of rows of short linear concave portions 141d are arranged in a staggered manner in the lower die 131b. However, the depth of each recess 141d is deeper toward the outermost. Although the figure showing the structure of the upper mold is omitted, the upper mold is provided with a plurality of rows of convex portions which can be engaged with the concave portion 141d. Even with such a structure, the sealing tape can be effectively elongated by the same operation as in the third specific example.

Fifth Specific Example FIG. 26 is a top view of a lower mold showing a fifth specific example of the present embodiment. In this specific example, a plurality of small circular concave portions 141e are arranged in a staggered manner in the lower die 131b. However, the depth of each recess 141e becomes deeper toward the outermost side. Although illustration of the structure of the upper mold is omitted, the upper mold is provided with a plurality of convex portions that can be engaged with the concave portion 141e. Even with such a structure, the sealing tape can be effectively elongated by the same operation as in the third specific example.

Sixth Specific Example FIG. 27 is a top view of a lower mold showing a sixth specific example of the present embodiment. In this specific example, when a plurality of semiconductor product molding portions 134 are provided in the lower mold 131b, a long linear concave portion 141g extending in the long side direction is provided at an end of the lower mold 131b in the long side direction. Provided, each semiconductor product molding unit 13
A small recess 141f is provided in the area between the four. Although the figure showing the structure of the upper mold is omitted, the concave 1
Protrusions engageable with 41f and 141g are provided.
Reference numeral 144 denotes a sealing resin flow path for supplying a sealing resin to each semiconductor product molding unit 134. In this case,
Sealing tape 135 from all sides of each semiconductor product molding portion 134
Is particularly effective when a large number of semiconductor devices are resin-sealed by one resin sealing step. Since the mold used in the actual resin sealing process of the semiconductor device has a very large number of die cavities in the sealing mold, the structure of this specific example is extremely effective. Can be.

-Seventh Specific Example- FIG. 28 is a sectional view showing a seventh specific example of the present embodiment. In this specific example, the upper mold 131a has a recess 141h.
Is provided on the lower mold 131b, and a convex portion 139h that engages with the concave portion 141h of the upper mold 131a is formed. Then, the sealing tape 13 is provided on the lower surface of the upper mold 131a.
5 is formed so as to surround the concave portion 141h. The lower mold 131b
Is provided with a semiconductor product molding part 134.

As described above, by providing the evacuation groove 146 for the purpose of evacuation in the inside, the inner periphery, the outer periphery, or the outside of the formation region of the protrusion-recess which engages with each other, the sealing can be more effectively performed. The tape 135 can be stretched.

In addition, a hole for evacuation is formed in the concave portion which engages with the convex portion, and tension is effectively applied to the sealing tape by both the engaging effect between the convex portion and the concave portion and the evacuation function. You can also.

In all of the above embodiments, the projections 139 and the depressions 141 are matted on the surface to prevent the sealing tape 135 from slipping, or are formed of a non-slip material, for example, silicone rubber. It is desirable.

(Fifth Embodiment) In this embodiment, FIG. 29 shows a fifth embodiment in which wrinkles of a sealing tape are prevented by using a sealing tape which has been pulled in advance. It will be described with reference to FIG. FIG. 29 is a cross-sectional view illustrating a resin sealing method according to the fifth embodiment.

As shown in FIG. 29, a flat jig 147 is prepared, a sealing tape 135 is attached to the flat jig 147, and then transferred to the upper mold 131a. This also
Wrinkling of the sealing tape 135 can be prevented as much as possible.

It should be noted that even greater effects can be obtained by using a sealing device and a sealing mold having a combination of the clamper function, the concave-convex shape, and the vacuuming function in the third to fifth embodiments. Needless to say.

(Sixth Embodiment) Hereinafter, a sixth embodiment of the present invention will be described. In the present embodiment, a method for continuously supplying a sealing tape for preventing wrinkling of a resin-sealed semiconductor device and a resin sealing device provided with a sealing tape supply device will be described with reference to the drawings. I will explain it.

FIGS. 30A to 30C are perspective views showing a resin sealing device provided with a sealing tape supply device and a resin sealing step in this embodiment. FIG.
It is sectional drawing which shows one process in a resin sealing process.

As shown in FIG. 30A, the sealing mold comprises an upper mold 151a and a lower mold 151b.
1b is provided with a large number of semiconductor product molding sections 160 (die cavities) and a sealing resin flow path 161 for supplying a sealing resin to each semiconductor product molding section 155.
Further, the unwinding roll 156a and the winding roll 156
It is configured to be able to continuously unwind and wind the sealing tape 152 while applying a constant tension to the sealing tape 152.

Then, as shown in FIG. 30B, a lead frame 153 on which a large number of semiconductor chips are mounted is supplied to the semiconductor product molding section 160 of the lower mold 151b, and the resin tablet 154a is sealed with the lower mold 151b. It is fed into the resin supply section.

Next, as shown in FIG. 52, the upper die 151a and the lower die 151b of the sealing die are clamped, and the sealing resin melted from below by the piston 158 is applied to each semiconductor product molding section 160. Supplied to the semiconductor device 1
55 is injection molded. When the injection molding is completed, the lower mold 151b opens.

At this time, as soon as the lower mold 151b is opened,
The sealing tape 152 is separated from the resin cull 154b and the resin-encapsulated semiconductor device 155 shown in FIG. In addition, a portion of the sealing tape 152 used in this resin sealing step is wound around a winding roll 156b,
The part used in the next resin sealing step is the unwinding roll 15
6a. Meanwhile, the resin cull 154b and the resin-encapsulated semiconductor device 155 are taken out of the lower mold 151b.

According to the present embodiment, the unwinding roll 15
By supplying the sealing tape 152 continuously between the winding tape 6a and the take-up roll 156b, the resin sealing step using the sealing tape can be performed quickly, and the production efficiency can be improved. it can. Also, the unwinding roll 156
By applying a rotational force to a and the take-up roll 156b, an appropriate tension can be applied to the sealing tape 152, and the occurrence of wrinkling of the sealing tape 152 in the resin sealing step can be suppressed.

(Effects of Suppressing Wrinkles in Each Embodiment) The effects of suppressing the occurrence of wrinkles in the above embodiments will be described in further detail.

FIGS. 32 (a) and 32 (b) are cross-sectional views showing the state in the sealing mold when the resin sealing step is performed without applying tension to the sealing tape, and the resin to be formed. It is sectional drawing of a sealing body. FIGS. 33 (a) and 33 (b)
FIG. 4 is a cross-sectional view showing a state in a sealing mold when a resin sealing step is performed in a state where tension is applied to a sealing tape 152, and a cross-sectional view of a formed resin sealing body. However, FIG.
In FIG. 2 (a) and FIG. 33 (a), in order to display in the same vertical relation as the resin sealing body, the display is shown upside down from the state shown in each of the above embodiments. FIG. 32 (a),
In FIG. 1B, members denoted by the same reference numerals as those in FIGS. 1A and 1B have already been described.

When resin sealing is performed without applying tension to the sealing tape, the sealing tape may be wrinkled, sagged, or broken as shown in FIG. Then, when this wrinkle or the like is generated, it is transferred to the sealing resin 17 as it is, so that the back surface of the sealing resin 17 of the removed resin sealing body after the resin sealing step is finished is as shown in FIG.
As shown in (b), dents and the like may occur. When such dents occur, not only the appearance is impaired, but also a part of the sealed member is exposed,
There is a possibility that cracks in the sealing resin 17 may occur.

On the other hand, as shown in FIG. 33 (a), by attaching the sealing tape to the sealing die in the resin sealing step while applying tension to the sealing tape, as shown in each of the above embodiments, The generation of wrinkles and sagging can be suppressed. Since no dents or the like occur on the back surface of the sealing resin 17 of the resin sealing body taken out after the resin sealing step, a resin-encapsulated semiconductor device having good appearance and characteristics can be obtained. . That is, the yield can be improved by reducing the defective rate.

A plurality of sealing tapes can be used. For example, it can be mounted on the upper surface side and the lower surface side, or a plurality of sheets can be mounted on one side.

[0136]

According to the method or the apparatus for manufacturing a resin-encapsulated semiconductor device of the present invention, when encapsulating a semiconductor chip and a lead frame in an encapsulation resin with an encapsulation tape attached, A tension is applied to the stop tape, so that wrinkles are prevented from being generated in the sealing tape, and a portion in which the sealing tape is in close contact is exposed from the sealing resin, and wrinkles are transferred. It is possible to manufacture a resin-encapsulated semiconductor device having no dents in the encapsulation resin due to the above.

[Brief description of the drawings]

1A and 1B are a plan view and a cross-sectional view showing a sealing resin of a resin-sealed semiconductor device applied to each embodiment.

FIG. 2 is a cross-sectional view illustrating a process of preparing a lead frame in a process of manufacturing a resin-sealed semiconductor device applied to each embodiment.

FIG. 3 is a cross-sectional view showing a step of bonding a semiconductor chip onto a die pad in a manufacturing step of a resin-sealed semiconductor device applied to each embodiment.

FIG. 4 is a cross-sectional view showing a step of forming a thin metal wire in a process of manufacturing a resin-sealed semiconductor device applied to each embodiment.

FIG. 5 is a cross-sectional view showing a step of laying a sealing tape under a lead frame in a process of manufacturing a resin-sealed semiconductor device applied to each embodiment.

FIG. 6 is a cross-sectional view showing a resin sealing step in a manufacturing step of the resin-sealed semiconductor device applied to each embodiment.

FIG. 7 is a cross-sectional view of the resin-encapsulated semiconductor device after the end cutting step of the inner lead in the manufacturing process of the resin-encapsulated semiconductor device applied to each embodiment;

FIG. 8 is a partial back view of the resin-sealed semiconductor device formed in the manufacturing process of the resin-sealed semiconductor device applied to each embodiment.

FIG. 9 is a plan view of a lower mold of an encapsulation mold used in a method of manufacturing a resin-encapsulated semiconductor device according to a first specific example of the first embodiment, and FIG. (A) is a sectional view showing the state of resin sealing at the center line.

FIG. 10 is a top view of a lower mold of a sealing mold according to a second specific example of the first embodiment having three rows of annular evacuation grooves and evacuation holes.

FIG. 11 is a top view of a lower mold of a sealing mold according to a third specific example of the first embodiment having three rows of annular evacuation grooves, connection grooves, and evacuation holes.

FIG. 12 is a top view of a lower mold of a sealing mold according to a fourth specific example of the first embodiment, having three rows of evacuation grooves and evacuation holes extending in the short side direction.

FIG. 13 is a top view of a lower mold of a sealing mold according to a fifth specific example of the first embodiment having three rows of evacuation grooves and evacuation holes extending in the long side direction.

FIG. 14 is a cross-sectional view showing a resin-sealed state in the method for manufacturing a resin-sealed semiconductor device according to the second embodiment.

FIG. 15 is a top view of a lower mold having a vacuum groove and a carved portion used in the second embodiment.

FIG. 16 is a plan view and a sectional view showing a first specific example of the third embodiment in which a clamper is provided in an upper mold.

FIGS. 17A and 17B are a plan view and a cross-sectional view illustrating a second specific example of the third embodiment in which a clamper that moves independently of a mold is provided.

FIGS. 18A and 18B are a plan view and a cross-sectional view illustrating a third specific example of the third embodiment in which a clamper extending in a long side direction is provided outside a mold.

FIG. 19 is a plan view and a sectional view showing a fourth specific example of the third embodiment in which an annular clamper surrounding the periphery of a mold is provided.

FIG. 20 is a plan view showing a fifth specific example of the third embodiment in which a clamper and a spring for urging the clamper in the short side direction are provided outside the mold.

FIG. 21 is a plan view showing a sixth specific example of the third embodiment in which a clamper and a spring for urging the clamper in the short side and long side directions are provided outside the mold.

FIG. 22 is a perspective view and a cross-sectional view showing a first specific example of the fourth embodiment in which a convex portion and a concave portion that engage with each other are provided on an upper mold and a lower mold, respectively.

FIG. 23 is a bottom view of an upper mold having a curved convex portion in a second specific example of the fourth embodiment.

FIG. 24 shows three rows of projections and recesses that engage with each other,
It is sectional drawing and the top view of a lower metal mold which show the 3rd example of 4th Embodiment provided in the lower metal mold, respectively.

FIG. 25 is a top view of a lower mold in which a plurality of rows of short linear concave portions are arranged in a staggered manner in a fourth specific example of the fourth embodiment.

FIG. 26 is a top view of a lower mold in which a plurality of small circular concave portions are arranged in a staggered manner in a fifth specific example of the fourth embodiment.

FIG. 27 is a top view of a lower mold having a linear concave portion and a small concave portion in a sixth specific example of the fourth embodiment.

FIG. 28 is a cross-sectional view showing a seventh specific example of the fourth embodiment in which convex portions and concave portions that engage with each other are provided in an upper mold and a lower mold, respectively, and a vacuum drawing groove is provided in the upper mold. It is.

FIG. 29 is a cross-sectional view illustrating a resin sealing method according to a fifth embodiment.

FIG. 30 is a perspective view showing a resin sealing device provided with a device for continuously supplying a sealing tape in a sixth embodiment and a resin sealing step.

FIG. 31 shows a state during a resin sealing step in the sixth embodiment.
It is sectional drawing which shows one process.

FIG. 32 is a cross-sectional view showing a state in a sealing die when a resin sealing step is performed in a state where tension is not applied to the sealing tape, and a cross-sectional view of a formed resin sealing body.

FIG. 33 is a cross-sectional view showing a state in a sealing mold when a resin sealing step is performed with tension applied to the sealing tape;
FIG. 3 is a cross-sectional view of a formed resin sealing body.

FIG. 34 is a plan view and a cross-sectional view of a conventional resin-encapsulated semiconductor device of a type having an external electrode on the back surface side.

FIG. 35 is a cross-sectional view of a conventional resin-encapsulated semiconductor device in which ball electrodes are provided on external electrodes to secure a stand-off height.

FIG. 36 is a cross-sectional view showing a step of preparing a lead frame in a manufacturing step of a conventional resin-encapsulated semiconductor device.

FIG. 37 is a cross-sectional view showing a step of bonding a semiconductor chip onto a die pad in a manufacturing process of a conventional resin-encapsulated semiconductor device.

FIG. 38 is a cross-sectional view showing a step of forming a thin metal wire in a manufacturing process of a conventional resin-encapsulated semiconductor device.

FIG. 39 is a cross-sectional view showing a resin sealing step in a manufacturing process of a conventional resin-sealed semiconductor device.

DESCRIPTION OF SYMBOLS 12 Inner lead 13 Die pad 14 Suspended lead 15 Semiconductor chip 16 Thin metal wire 17 Sealing resin 18 External electrode 19 Depressed part 20 Lead frame 21 Sealing tape 101 Inner lead 102 Semiconductor chip 103 Die pad 105 Thin metal wire 106 Sealed Stop tape 107 Sealing resin 112a Upper mold 112b Lower mold 113 Vacuum hole 114 Vacuum groove 115 Engraved portion 116 Connection groove 117 Vacuum groove 118 Vacuum groove 121a Upper mold 121b Lower mold 122 Clamper 123 Spring 124 Semiconductor Product molding part (die cavity) 125 sealing tape 126 drive device 131a upper die 131b lower die 134 semiconductor product molding part (die cavity) 135 sealing tape 139 convex part 141 concave part 142 roll 144 Sealing resin flow path 146 Vacuum evacuation groove 147 Jig 151a Upper die 151b Lower die 152 Sealing tape 153 Lead frame 154a Resin tablet 154b Resin cul 155 Resin sealed type semiconductor device 156a Unwind roll 156b Take-up roll 158 Piston 159 Rotating roll 160 Semiconductor product forming section 161 Sealing resin flow path

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI // B29L 31:34 (72) Inventor Osamu 1-1, Sachimachi, Takatsuki-shi, Osaka Matsushita Electronics Co., Ltd. (72) Inventor Yasuhiro Yamada 1-1, Sachimachi, Takatsuki City, Osaka Prefecture Matsushita Electronics Corporation

Claims (26)

[Claims] A first step of preparing a sealing mold, a semiconductor chip, and a peripheral member, and a step of attaching the sealing tape to a part of the surface of the peripheral member while attaching the sealing tape to the sealing mold. A third step of sealing at least a part of the semiconductor chip and the peripheral member except for at least a part of the surface in a sealing resin while attaching the sealing tape while applying tension to the sealing tape; A method for manufacturing a resin-encapsulated semiconductor device, comprising the steps of: 2. The method for manufacturing a resin-encapsulated semiconductor device according to claim 1, wherein in the first step, a first mold and a second mold are used. A sealing mold having a die cavity in at least one of the first and second molds and having a concave portion for evacuation sandwiching the die cavity in at least one of the first and second molds is prepared. In a third step, a method of manufacturing a resin-encapsulated semiconductor device, characterized in that a tension is applied to the sealing tape by adsorbing the sealing tape to the evacuation recess. 3. The method of manufacturing a resin-encapsulated semiconductor device according to claim 2, wherein a plurality of the evacuation recesses are provided from an inner position close to the die cavity to an outer position. And a method for manufacturing a resin-sealed semiconductor device, wherein vacuuming is performed in order from the outermost vacuuming recess. 4. The method for manufacturing a resin-encapsulated semiconductor device according to claim 1, wherein in the first step, a clamper for clamping the sealing tape is provided in at least two regions sandwiching the die cavity. The method of manufacturing a resin-encapsulated semiconductor device, wherein a tension is applied to the sealing tape by fixing the sealing tape with the clamper in the third step. 5. The method for manufacturing a resin-encapsulated semiconductor device according to claim 4, further comprising: urging means for urging the clamper in a direction in which the sealing tape is stretched. Of manufacturing a resin-sealed semiconductor device. 6. The method for manufacturing a resin-encapsulated semiconductor device according to claim 4, wherein, prior to the second step, the sealing is performed by the clamper at a location separated from the sealing mold. A method for manufacturing a resin-encapsulated semiconductor device, comprising: holding a stop tape; and, in the second step, moving the sealing tape together with the clamper to a position of the sealing mold. 7. The method for manufacturing a resin-encapsulated semiconductor device according to claim 1, wherein in the first step, a first mold and a second mold are used. At least one has a die cavity, and at least one engages with each other.
A sealing mold having a pair of convex portions and concave portions in at least two regions sandwiching the die cavity of the first and second molds is prepared, and in the third step, the first and second molds are provided. A method for manufacturing a resin-encapsulated semiconductor device, characterized in that when the second mold approaches, the convex portion and the concave portion engage with each other to apply tension to the sealing tape. 8. The method of manufacturing a resin-encapsulated semiconductor device according to claim 7, wherein, in the first step, the projections and the recesses have different engagement lengths from each other, and the engagement length is the smallest. In the third step, the sealing tape stretched by the engagement of the outermost convex portion and the concave portion is replaced with the inner convex portion. A method of manufacturing a resin-encapsulated semiconductor device, wherein tension is applied to a sealing tape so that the sealing tape is further elongated by engagement of a part and a recess. 9. The method of manufacturing a resin-encapsulated semiconductor device according to claim 1, wherein a plurality of the sealing tapes are used. Manufacturing method. 10. A first mold and a second mold used in a resin encapsulation step in a resin encapsulation type semiconductor device manufacturing process, wherein at least one of the first and second dies is provided. A resin mold comprising: a sealing mold having a die cavity; and tension applying means for applying tension to a sealing tape for exposing a part of the surface of the resin-sealed semiconductor device from the sealing resin. Production equipment for semiconductor devices. 11. The apparatus for manufacturing a resin-encapsulated semiconductor device according to claim 10, wherein said tension applying means is provided in a region sandwiching said die cavity in at least one of said first and second molds. A resin-sealed semiconductor device manufacturing apparatus, characterized in that it is a vacuuming concave portion which is connected to a vacuuming device and sucks the sealing tape. 12. The apparatus for manufacturing a resin-encapsulated semiconductor device according to claim 11, wherein the vacuuming recess is a groove sandwiching the die cavity and a vacuum hole formed in each groove. An apparatus for manufacturing a resin-encapsulated semiconductor device, comprising: 13. The manufacturing apparatus for a resin-encapsulated semiconductor device according to claim 11, wherein the evacuation recess is an annular groove surrounding the die cavity and a vacuum hole formed in the groove. An apparatus for manufacturing a resin-encapsulated semiconductor device, comprising: 14. The resin-encapsulated semiconductor device manufacturing apparatus according to claim 11, wherein a plurality of said evacuation recesses are provided. Equipment for manufacturing semiconductor devices. 15. The apparatus for manufacturing a resin-encapsulated semiconductor device according to claim 11, wherein the evacuation recess is a plurality of grooves provided around the die cavity and an outermost groove among the plurality of grooves. And a vacuum hole formed only in the groove and communicating with the vacuum evacuation device. 16. The manufacturing apparatus for a resin-encapsulated semiconductor device according to claim 10, wherein said tension applying means is provided in at least two regions sandwiching said die cavity, and is used for clamping said sealing tape. An apparatus for manufacturing a resin-encapsulated semiconductor device, which is a clamper. 17. The resin-molded semiconductor device manufacturing apparatus according to claim 16, wherein the clamper has a function of moving the sealing tape so as to extend the sealing tape in at least two directions. Equipment for manufacturing sealed semiconductor devices. 18. The apparatus for manufacturing a resin-encapsulated semiconductor device according to claim 16, further comprising an urging means for urging said clamper in a direction in which said sealing tape is extended. For manufacturing resin-sealed semiconductor devices. 19. The manufacturing apparatus for a resin-encapsulated semiconductor device according to claim 16, wherein the clamper holds the sealing tape while maintaining the sealing tape. An apparatus for manufacturing a resin-encapsulated semiconductor device, having a function of being able to move from a remote location to the position of the encapsulation mold. 20. The manufacturing apparatus for a resin-sealed semiconductor device according to claim 10, wherein said tension applying means is provided in at least two regions sandwiching said die cavity in said first and second molds. A resin-encapsulated semiconductor device manufacturing apparatus comprising at least one pair of projections and depressions that engage with each other. 21. The manufacturing apparatus for a resin-encapsulated semiconductor device according to claim 20, wherein the convex portion and the concave portion are provided in a plurality of pairs having engagement lengths different from each other, and the engagement length is An apparatus for manufacturing a resin-encapsulated semiconductor device, wherein the larger the outer convex portions and concave portions, the larger. 22. The manufacturing apparatus of a resin-encapsulated semiconductor device according to claim 20, wherein a plurality of die cavities of the first or second mold are provided, and An apparatus for manufacturing a resin-encapsulated semiconductor device, comprising: an outer region sandwiching all die cavities; and an inner region between the die cavities. 23. The manufacturing apparatus for a resin-encapsulated semiconductor device according to claim 20, wherein a wall surface of the convex portion or the concave portion is subjected to a roughening treatment for preventing slippage. An apparatus for manufacturing a resin-encapsulated semiconductor device, comprising: 24. The apparatus for manufacturing a resin-encapsulated semiconductor device according to claim 20, wherein a wall surface of the convex portion or the concave portion is made of a non-slip material. For manufacturing resin-sealed semiconductor devices. 25. The apparatus for manufacturing a resin-encapsulated semiconductor device according to claim 20, wherein a vacuum hole connected to a vacuum device is formed in the concave portion. An apparatus for manufacturing a resin-encapsulated semiconductor device, comprising: 26. The apparatus for manufacturing a resin-encapsulated semiconductor device according to claim 10, wherein the resin-encapsulated semiconductor device is mounted on one of the first and second molds. An apparatus for manufacturing a resin-encapsulated semiconductor device, wherein a carved portion is provided in a region facing the part.