JPH11273454A - Manufacture of flake-form copper alloy powder for electroconductive paste - Google Patents
Manufacture of flake-form copper alloy powder for electroconductive pasteInfo
- Publication number
- JPH11273454A JPH11273454A JP10071539A JP7153998A JPH11273454A JP H11273454 A JPH11273454 A JP H11273454A JP 10071539 A JP10071539 A JP 10071539A JP 7153998 A JP7153998 A JP 7153998A JP H11273454 A JPH11273454 A JP H11273454A
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- alloy powder
- weight
- powder
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000843 powder Substances 0.000 title claims abstract description 181
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 135
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 229910052709 silver Inorganic materials 0.000 claims abstract description 37
- 239000004332 silver Substances 0.000 claims abstract description 37
- 239000002245 particle Substances 0.000 claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 44
- 229910052802 copper Inorganic materials 0.000 claims description 34
- 239000010949 copper Substances 0.000 claims description 34
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 10
- 229930195729 fatty acid Natural products 0.000 claims description 10
- 239000000194 fatty acid Substances 0.000 claims description 10
- 150000004665 fatty acids Chemical class 0.000 claims description 10
- 238000004438 BET method Methods 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 46
- 230000002829 reductive effect Effects 0.000 abstract description 7
- 239000002253 acid Substances 0.000 abstract 1
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 62
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 39
- 239000011248 coating agent Substances 0.000 description 27
- 238000000576 coating method Methods 0.000 description 27
- 239000007858 starting material Substances 0.000 description 23
- 239000000203 mixture Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000002184 metal Substances 0.000 description 20
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 18
- 235000021355 Stearic acid Nutrition 0.000 description 16
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 16
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 16
- 239000008117 stearic acid Substances 0.000 description 16
- 229910052739 hydrogen Inorganic materials 0.000 description 14
- 239000001257 hydrogen Substances 0.000 description 14
- 239000004925 Acrylic resin Substances 0.000 description 13
- 229920000178 Acrylic resin Polymers 0.000 description 13
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 13
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 13
- 238000007650 screen-printing Methods 0.000 description 13
- 239000007789 gas Substances 0.000 description 11
- 238000002156 mixing Methods 0.000 description 10
- 229910021529 ammonia Inorganic materials 0.000 description 9
- 238000000354 decomposition reaction Methods 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 6
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 238000009692 water atomization Methods 0.000 description 5
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 3
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 3
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 3
- 239000005639 Lauric acid Substances 0.000 description 3
- 239000005642 Oleic acid Substances 0.000 description 3
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 3
- 235000021314 Palmitic acid Nutrition 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009689 gas atomisation Methods 0.000 description 3
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 3
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- DCXXMTOCNZCJGO-UHFFFAOYSA-N Glycerol trioctadecanoate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCCCC DCXXMTOCNZCJGO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002431 hydrogen Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Paints Or Removers (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、導電ペースト用片
状銅合金粉の製造方法に関するものである。The present invention relates to a method for producing flaky copper alloy powder for conductive paste.
【０００２】[0002]
【従来の技術】一般にポリマー型導電ペーストと言え
ば、導電性金属粉である銅粉あるいは銀粉を合成樹脂バ
インダーに分散させたタイプが主流である。これら導電
ペーストはプリント基板のスルーホールや導電回路、電
極の接着剤、電磁波シールド用等に多量に使用されてい
る。2. Description of the Related Art In general, a polymer type conductive paste is mainly of a type in which copper powder or silver powder, which is conductive metal powder, is dispersed in a synthetic resin binder. These conductive pastes are used in large quantities for through holes in printed circuit boards, conductive circuits, adhesives for electrodes, electromagnetic wave shielding, and the like.
【０００３】しかし、銅粉を分散したものは安価である
が銀のような優れた導電性を得ることが難しく、また酸
化により導電性が低下し易い。これらの問題を解決する
ために「導電性銅ペースト」(特許公報第２６５４０６
７号)が提案されているが、銅粉を還元しながらペース
ト化するもので還元性樹脂を使用する必要が有る等多く
の制約があり、あらゆる用途に対応出来ないものであ
る。銀粉を使用したものは優れた導電性が得られるもの
の、高価格でありマイグレーションの問題が発生し易い
ことから銅粉に銀メッキした銅粉「銀めっき銅粉」(特
開平９−２８２９３５号公報)、銀メッキ銅粉を分散し
たペースト「導電性接着剤」(特開平７−１３８５４９
号公報)等が提案されているが、銀メッキ銅粉はメッキ
液の廃液処理、粒子径の細かい比表面積の大きな粉末へ
のメッキ処理は難しい等の問題を有している。銅合金粉
の粒子表面への銀濃度を高くした銅銀合金粉を使用した
ペースト「はんだ付け可能な銅系導電性ペースト」（特
公平７−１０９７２４号公報）が提案されているが、不
活性ガスアトマイズ法で製造した金属粉を使用している
ためやはり高価であり、粒子径の小さい粉末では表面近
傍と内部の銀濃度に差がなくなる傾向がある。最近では
電子機器の小型化傾向により、吹き付け塗装あるいはロ
ールコータ法、スクリーン印刷法による電磁波シールド
用では、より塗装し易く、かつ薄い塗膜が要求されてき
ている。スクリーン印刷方法による導電回路やジャンパ
ー線では、より細線パターンに対応出来る導電ペースト
が要求されてきている。ディスペンサーによる導電接着
剤用も部品の小型化により接着面積が微細化し、より細
かい粒子を分散したペーストが必要になってきている。[0003] However, a dispersion of copper powder is inexpensive, but it is difficult to obtain excellent conductivity such as silver, and the conductivity is easily reduced by oxidation. To solve these problems, “conductive copper paste” (Patent Publication No. 265406)
No. 7) has been proposed, but it is one that forms a paste while reducing copper powder, and has many restrictions such as the need to use a reducing resin, and cannot be used in all applications. Although silver powder is used, excellent conductivity can be obtained, but copper powder "silver-plated copper powder" obtained by plating silver on copper powder is expensive (Patent Document 9) ), A paste in which silver-plated copper powder is dispersed, “conductive adhesive” (JP-A-7-138549)
However, silver-plated copper powder has a problem that it is difficult to treat a waste solution of a plating solution and to apply a plating process to powder having a small particle diameter and a large specific surface area. A paste using a copper-silver alloy powder having a high silver concentration on the particle surface of the copper alloy powder, “Solderable copper-based conductive paste” (Japanese Patent Publication No. 7-109724) has been proposed, but is inactive. Since the metal powder produced by the gas atomization method is used, the powder is still expensive, and the powder having a small particle diameter tends to have no difference between the silver concentration in the vicinity of the surface and the silver concentration in the inside. In recent years, due to the trend of miniaturization of electronic devices, there has been a demand for a thinner coating film which can be easily painted in the case of electromagnetic wave shielding by spray coating, roll coating, or screen printing. In a conductive circuit or a jumper wire by a screen printing method, a conductive paste that can correspond to a finer line pattern has been required. For conductive adhesives using a dispenser, the bonding area has been reduced due to the miniaturization of parts, and a paste in which finer particles are dispersed has become necessary.
【０００４】[0004]
【発明が解決しようとする課題】従来まで導電ペースト
用に使用されてきた金属粉は、銀粉が主である。それ
は、優れた導電性が容易に得られるとともに信頼性にお
いて安定した性能が得られるためである。しかし銀粉は
高価であるとともに、回路の線間が狭くなればなるほど
マイグレーションの問題が発生し易く、新しい導電性金
属粉が待たれていた。銅粉に銀をメッキしたものや、表
面の銀濃度を高くしたものなどが新規な導電性金属粉と
して提案されてきたが、いずれも製造法上粒子径の小さ
いものが出来ず、最近の電子機器の小型化に対応できな
いものであった。すなわち、銀粉は粒子径を細かくして
も、機械的に片状加工しても酸化の問題がそれほどない
ため導電ペースト用として多くの用途に問題なく使用さ
れている。The metal powder which has hitherto been used for the conductive paste is mainly silver powder. This is because excellent conductivity is easily obtained and stable performance in reliability is obtained. However, silver powder is expensive and migration problems are more likely to occur as the lines between circuits become narrower, and new conductive metal powders have been awaited. Copper powder plated with silver and silver with a high silver concentration on the surface have been proposed as new conductive metal powders. It could not cope with downsizing of equipment. In other words, silver powder has no problem of oxidation even if it has a fine particle diameter or is mechanically flaked, so that it is used without problems in many applications as a conductive paste.
【０００５】しかし、銀メッキ銅粉は、メッキする粒子
径を細かくする事が出来ず、さらに形状が片状であると
比表面積が大きくなるため均一にメッキする事が出来な
い。したがって、銀メッキは荒い粒子のみ行われてい
る。形状を片状にすれば、薄膜化、細線化などペースト
に要求される性能をかなりの部分で満足させることが解
っている。しかし、これまで銀の効果を十分に生かした
片状銅合金粉はまだ実用化されていない。そこで、本発
明者等はポリマー型導電ペースト用として使用できる片
状銅合金粉の製造方法について研究を重ねた結果、特定
の銅銀合金粉に脂肪酸を加え機械的に片状加工し、しか
る後に還元性雰囲気中で還元処理すれば、最近のペース
ト要求性能に対応出来る導電ペースト用片状銅合金粉が
出来ることを見いだした。However, silver-plated copper powder cannot be reduced in particle size to be plated, and if the shape is flaky, the specific surface area becomes large, so that uniform plating cannot be performed. Therefore, silver plating is performed only for coarse particles. It has been found that if the shape is flaked, the performance required for the paste, such as thinning and thinning, can be satisfied to a large extent. However, flaky copper alloy powders that fully utilize the effect of silver have not yet been put to practical use. Therefore, the present inventors have repeated research on a method of producing a flaky copper alloy powder that can be used for a polymer type conductive paste, and as a result, a fatty acid is added to a specific copper-silver alloy powder and mechanically flake-processed. It has been found that a flake copper alloy powder for a conductive paste can be produced by performing a reduction treatment in a reducing atmosphere, which can respond to recent paste performance requirements.
【０００６】[0006]
【課題を解決するための手段】本発明に関する導電ペー
スト用片状銅合金粉の製造方法とは、銀を３から７５重
量％含有した銅合金粉に対して、０.０５から２重量％
の脂肪酸を加えて機械的に片状加工し、しかる後に還元
性雰囲気中で、１５０℃から５００℃の温度で還元処理
し、粒子径が１００μｍ以下で，ＢＥＴ法比表面積値が
２０００ｃｍ2／ｇ以上の粉末を得ることを特徴とする
ものである。The method for producing a flaky copper alloy powder for a conductive paste according to the present invention is as follows: 0.05 to 2% by weight of copper alloy powder containing 3 to 75% by weight of silver.
And then mechanically flaked, and then reduced in a reducing atmosphere at a temperature of 150 ° C. to 500 ° C. to a particle diameter of 100 μm or less and a BET specific surface area of 2000 cm 2 / g. It is characterized by obtaining the above powder.
【０００７】[0007]
【発明の実施の形態】本発明の構成を詳しく説明すれば
次の通りである。本発明の出発原料である銅合金粉は、
銀を３から７５重量％含有する必要がある。特性を損な
わなければアルミニウム、亜鉛、錫、鉛などの第三金属
成分を添加しても良いが、銀の含有量はこの範囲が必要
である。３重量％より少ないと銀粉に近い導電性やペー
ストとしての信頼性が得られない。７５重量％よりも多
いと銀粉と価格的に差がなくなり、またマイグレーショ
ンも少なくならない。工業的に好ましい銀含有量は５か
ら７０重量％である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The construction of the present invention will be described in detail as follows. Copper alloy powder as a starting material of the present invention,
It must contain from 3 to 75% by weight of silver. If the characteristics are not impaired, a third metal component such as aluminum, zinc, tin, or lead may be added, but the silver content must be within this range. If the amount is less than 3% by weight, the conductivity close to silver powder and the reliability as a paste cannot be obtained. If the content is more than 75% by weight, there is no difference in price from silver powder, and migration does not decrease. An industrially preferred silver content is from 5 to 70% by weight.
【０００８】銅合金粉の製造方法はアトマイズ法を用い
れば容易に製造できる。合金箔や切削粉も出発原料にす
ることが出来るが、工業的にアトマイズ法が良い。アト
マイズ法には不活性ガスアトマイズ法、空気アトマイズ
法、水アトマイズ法、オイルアトマイズ法等があるが、
本発明の場合高価なガスを使用する不活性ガスアトマイ
ズ法でなくてよく、水や、空気を使用したアトマイズ法
で良い。機械的に片状加工するときに加える脂肪酸の量
は、銅合金粉に対して０.０５重量％から２重量％必要
である。０.０５重量％より少ないと片状加工中に凝集
するとともに、還元処理中に強く凝集し再分散出来ず導
電ペースト用片状銅合金粉とならない。２重量％より多
く加えると片状化が難しく、還元処理時間が長くかかり
良くない。脂肪酸量を粉砕加工中に多くすることが出来
ない場合は、片状加工した後にミキサーなどの混合機で
脂肪酸と片状銅合金粉を混合すれば良い。工業的に好ま
しい量は０.１から１重量％である。脂肪酸を加え機械
的に片状加工する方法は、ボールミル、振動ミル、アジ
テータミル、デイスクミル、などの粉砕機で粉砕しなが
ら片状加工すれば良い。粉砕機の種類や粉砕時間を調整
する事により、目的とする粒子径、ＢＥＴ法比表面積値
の片状銅合金粉を得ることが出来る。脂肪酸はラウリン
酸、パルミチン酸、ステアリン酸、オレイン酸など高級
脂肪酸が良い。低級脂肪酸は還元処理中に悪臭が出るた
め好ましくない。還元性雰囲気は、水素、一酸化炭素、
天然ガス、アンモニア分解ガスなど還元性気体を流す方
法が良い。The copper alloy powder can be easily produced by using an atomizing method. Although alloy foil and cutting powder can be used as starting materials, the atomizing method is industrially preferable. The atomizing method includes an inert gas atomizing method, an air atomizing method, a water atomizing method, an oil atomizing method, and the like.
In the case of the present invention, an inert gas atomization method using an expensive gas may be used, and an atomization method using water or air may be used. The amount of the fatty acid to be added when mechanically flake processing is required to be 0.05% by weight to 2% by weight based on the copper alloy powder. If the content is less than 0.05% by weight, the particles coagulate during the flake processing, and strongly coagulate during the reduction treatment, cannot be redispersed, and do not become flake copper alloy powder for conductive paste. If it is added in an amount of more than 2% by weight, flake formation is difficult, and the reduction treatment time is long, which is not good. When the fatty acid amount cannot be increased during the pulverization, the fatty acid and the flaky copper alloy powder may be mixed by a mixer such as a mixer after the flake processing. An industrially preferred amount is from 0.1 to 1% by weight. As a method of mechanically flake processing by adding a fatty acid, flake processing may be performed while grinding with a crusher such as a ball mill, a vibration mill, an agitator mill, and a disk mill. By adjusting the type of the pulverizer and the pulverization time, a flaky copper alloy powder having a target particle diameter and a BET specific surface area can be obtained. Fatty acids are preferably higher fatty acids such as lauric acid, palmitic acid, stearic acid, and oleic acid. Lower fatty acids are not preferred because they give off odor during the reduction treatment. The reducing atmosphere is hydrogen, carbon monoxide,
A method of flowing a reducing gas such as natural gas or ammonia decomposition gas is preferable.
【０００９】還元処理する温度は１５０℃から５００℃
が良い。１５０℃より低い温度であると非常に長時間か
かるとともに、優れた導電性を有する片状銅合金粉が得
られない。５００℃より高い温度であると還元処理中に
片状銅合金粉が脂肪酸で被覆していても凝集するため塗
装性、スクリーン印刷性や導電性も悪くなり、導電ペー
スト用片状銅合金粉として使用できないものとなる。工
業的には２００℃から４５０℃が好ましい。還元処理し
た片状銅合金粉は粗大粉や凝集粉を多く含んでいる場合
があるので、１００μｍで篩い分けする必要がある。１
００μｍよりも荒い粉が有るとペーストとして使用した
場合、スクリーンの目詰まりを生じる。ＢＥＴ法比表面
積値は粉砕加工時間等を調整して２０００ｃｍ2／ｇ以
上にする必要がある。２０００ｃｍ2／ｇよりも小さい
値だと性能的に粒状のアトマイズ粉と同レベルで、片状
粉にした効果が少なく、最近の加工技術に対応出来るペ
ースト用粉末とならない。最近のスクリーン印刷法での
ペースト要求性能に対応できる好ましい値は、粒子径が
４５μｍ以下であって、ＢＥＴ法比表面積値は３０００
ｃｍ2／ｇ以上である。The temperature for the reduction treatment is from 150 ° C. to 500 ° C.
Is good. When the temperature is lower than 150 ° C., it takes a very long time, and a flaky copper alloy powder having excellent conductivity cannot be obtained. If the temperature is higher than 500 ° C., even if the flaky copper alloy powder is coated with a fatty acid during the reduction treatment, the paintability, screen printability and conductivity will be deteriorated because the flake copper alloy powder will be agglomerated. It cannot be used. Industrially, the temperature is preferably from 200 ° C to 450 ° C. Since the flaky copper alloy powder subjected to the reduction treatment may contain a large amount of coarse powder or agglomerated powder, it needs to be sieved at 100 μm. 1
When the powder having a coarseness of more than 00 μm is used as a paste, the screen is clogged. The BET specific surface area value needs to be 2000 cm 2 / g or more by adjusting the pulverization processing time and the like. If the value is less than 2000 cm 2 / g, the performance is at the same level as the granular atomized powder, the effect of forming the flake powder is small, and the powder for paste that can cope with recent processing techniques is not obtained. A preferable value that can meet the paste performance required by the recent screen printing method is that the particle diameter is 45 μm or less and the BET specific surface area value is 3000.
cm 2 / g or more.
【００１０】[0010]
【実施例】以下、実施例により本発明を具体的に説明す
るが、これにより本発明の範囲及び使用範囲が限定され
るものではない。 （実施例１）銅９７重量％、銀３重量％になるように調
整した金属を坩堝で溶解し、空気アトマイズ法で本発明
の出発原料の銅合金粉を作成した。このようにして作成
した銅合金粉１０００ｇに対して、５ｇのステアリン酸
を加え、振動ミルで２時間粉砕し片状加工した。しかる
後に水素雰囲気の還元炉で３００℃２０分間還元処理し
た。このようにして得た片状粉末を１５０メッシュの篩
を用いて１００μｍ以下の粒子径にし、ＢＥＴ法比表面
積値３０００ｃｍ2／ｇの導電ペースト用片状銅合金粉
を製造した。このようにして製造した本発明の導電ペー
スト用片状銅合金粉の性能を確認するために銅合金粉７
５重量部、アクリル樹脂２５重量部になるように混合
し、トルオールで希釈して導電ペーストを作成した。作
成したペーストをＡＢＳ樹脂板にロールコータ法で印刷
し膜厚２５μｍの塗膜を作成し、比抵抗値を測定した。
その結果３.０×１０ー4Ω・ｃｍの良好な導電性を示し
た。EXAMPLES The present invention will be described below in detail with reference to examples, but the scope and use of the present invention are not limited thereby. (Example 1) A metal adjusted to be 97% by weight of copper and 3% by weight of silver was melted in a crucible, and a copper alloy powder as a starting material of the present invention was prepared by an air atomizing method. 5 g of stearic acid was added to 1000 g of the copper alloy powder thus prepared, and the mixture was pulverized by a vibration mill for 2 hours and processed into flakes. Thereafter, a reduction treatment was performed at 300 ° C. for 20 minutes in a reducing furnace in a hydrogen atmosphere. The flake powder thus obtained was sized to 100 μm or less using a 150-mesh sieve to produce a flake copper alloy powder for conductive paste having a BET specific surface area of 3000 cm 2 / g. In order to confirm the performance of the flaky copper alloy powder for conductive paste of the present invention thus produced, the copper alloy powder 7 was used.
5 parts by weight and 25 parts by weight of an acrylic resin were mixed and diluted with toluene to prepare a conductive paste. The prepared paste was printed on an ABS resin plate by a roll coater method to form a coating film having a thickness of 25 μm, and the specific resistance value was measured.
As a result, good conductivity of 3.0 × 10 −4 Ω · cm was exhibited.
【００１１】（実施例２）銅９５重量％、銀５重量％に
なるように調整した金属を坩堝で溶解し、空気アトマイ
ズ法で本発明の出発原料の銅合金粉を作成した。このよ
うにして作成した銅合金粉１０００ｇに対して、５ｇの
ステアリン酸を加え、振動ミルで２時間粉砕し片状加工
した。しかる後に水素雰囲気の還元炉で３００℃２０分
間還元処理した。このようにして得た片状粉末を１５０
メッシュの篩を用いて１００μｍ以下の粒子径にし、Ｂ
ＥＴ法比表面積値３０５０ｃｍ2／ｇの導電ペースト用
片状銅合金粉を製造した。このようにして製造した本発
明の導電ペースト用片状銅合金粉の性能を確認するため
に銅合金粉７５重量部、アクリル樹脂２５重量部になる
ように混合し、トルオールで希釈して導電ペーストを作
成した。作成したペーストをＡＢＳ樹脂板にロールコー
タ法で印刷し膜厚２５μｍの塗膜を作成し、比抵抗値を
測定した。その結果２.５×１０ー4Ω・ｃｍの良好な導電
性を示した。Example 2 A metal adjusted to 95% by weight of copper and 5% by weight of silver was melted in a crucible, and a copper alloy powder as a starting material of the present invention was prepared by an air atomizing method. 5 g of stearic acid was added to 1000 g of the copper alloy powder thus prepared, and the mixture was pulverized by a vibration mill for 2 hours and processed into flakes. Thereafter, a reduction treatment was performed at 300 ° C. for 20 minutes in a reducing furnace in a hydrogen atmosphere. The flaky powder obtained in this way is
Using a mesh sieve, reduce the particle size to 100 μm or less.
A flaky copper alloy powder for conductive paste having an ET method specific surface area value of 3050 cm 2 / g was produced. In order to confirm the performance of the flaky copper alloy powder for conductive paste of the present invention thus manufactured, the conductive paste was mixed by mixing 75 parts by weight of copper alloy powder and 25 parts by weight of acrylic resin and diluted with toluene. It was created. The prepared paste was printed on an ABS resin plate by a roll coater method to form a coating film having a thickness of 25 μm, and the specific resistance value was measured. As a result, good conductivity of 2.5 × 10 −4 Ω · cm was exhibited.
【００１２】（実施例３）銅９０重量％、銀１０重量％
になるように調整した金属を坩堝で溶解し、空気アトマ
イズ法で本発明の出発原料の銅合金粉を作成した。この
ようにして作成した銅合金粉１０００ｇに対して、５ｇ
のステアリン酸を加え、振動ミルで２時間粉砕し片状加
工した。しかる後に水素雰囲気の還元炉で３００℃２０
分間還元処理した。このようにして得た片状粉末を１５
０メッシュの篩を用いて１００μｍ以下の粒子径にし、
ＢＥＴ法比表面積値３０５０ｃｍ2／ｇの導電ペースト
用片状銅合金粉を製造した。このようにして製造した本
発明の導電ペースト用片状銅合金粉の性能を確認するた
めに銅合金粉７５重量部、アクリル樹脂２５重量部にな
るように混合し、トルオールで希釈して導電ペーストを
作成した。作成したペーストをＡＢＳ樹脂板にロールコ
ータ法で印刷し膜厚２５μｍの塗膜を作成し、比抵抗値
を測定した。その結果２.０×１０ー4Ω・ｃｍの良好な導
電性を示した。Example 3 90% by weight of copper and 10% by weight of silver
Was melted in a crucible to prepare a copper alloy powder as a starting material of the present invention by an air atomizing method. 5 g for 1000 g of the copper alloy powder thus prepared
Of stearic acid was added, and the mixture was pulverized with a vibration mill for 2 hours and processed into flakes. Then, in a reducing furnace in a hydrogen atmosphere at 300 ° C. 20
Reduction treatment was performed for minutes. The flaky powder obtained in this way is 15
Using a 0 mesh sieve to a particle size of 100 μm or less,
A flake copper alloy powder for a conductive paste having a BET specific surface area of 3050 cm 2 / g was produced. In order to confirm the performance of the flaky copper alloy powder for conductive paste of the present invention thus manufactured, the conductive paste was mixed by mixing 75 parts by weight of copper alloy powder and 25 parts by weight of acrylic resin and diluted with toluene. It was created. The prepared paste was printed on an ABS resin plate by a roll coater method to form a coating film having a thickness of 25 μm, and the specific resistance value was measured. As a result, good conductivity of 2.0 × 10 −4 Ω · cm was exhibited.
【００１３】（実施例４）銅８０重量％、銀２０重量％
になるように調整した金属を坩堝で溶解し、空気アトマ
イズ法で本発明の出発原料の銅合金粉を作成した。この
ようにして作成した銅合金粉１０００ｇに対して、５ｇ
のステアリン酸を加え、振動ミルで２時間粉砕し片状加
工した。しかる後に水素雰囲気の還元炉で３００℃２０
分間還元処理した。このようにして得た片状粉末を１５
０メッシュの篩を用いて１００μｍ以下の粒子径にし、
ＢＥＴ法比表面積値３２００ｃｍ2／ｇの導電ペースト
用片状銅合金粉を製造した。このようにして製造した本
発明の導電ペースト用片状銅合金粉の性能を確認するた
めに銅合金粉７５重量部、アクリル樹脂２５重量部にな
るように混合し、トルオールで希釈して導電ペーストを
作成した。作成したペーストをＡＢＳ樹脂板にロールコ
ータ法で印刷し膜厚２５μｍの塗膜を作成し、比抵抗値
を測定した。その結果２.０×１０ー4Ω・ｃｍの良好な導
電性を示した。(Example 4) 80% by weight of copper and 20% by weight of silver
Was melted in a crucible to prepare a copper alloy powder as a starting material of the present invention by an air atomizing method. 5 g for 1000 g of the copper alloy powder thus prepared
Of stearic acid was added, and the mixture was pulverized with a vibration mill for 2 hours and processed into flakes. Then, in a reducing furnace in a hydrogen atmosphere at 300 ° C. 20
Reduction treatment was performed for minutes. The flaky powder obtained in this way is 15
Using a 0 mesh sieve to a particle size of 100 μm or less,
A flaky copper alloy powder for a conductive paste having a BET specific surface area of 3,200 cm 2 / g was produced. In order to confirm the performance of the flaky copper alloy powder for conductive paste of the present invention thus manufactured, the conductive paste was mixed by mixing 75 parts by weight of copper alloy powder and 25 parts by weight of acrylic resin and diluted with toluene. It was created. The prepared paste was printed on an ABS resin plate by a roll coater method to form a coating film having a thickness of 25 μm, and the specific resistance value was measured. As a result, good conductivity of 2.0 × 10 −4 Ω · cm was exhibited.
【００１４】（実施例５）銅５０重量％、銀５０重量％
になるように調整した金属を坩堝で溶解し、空気アトマ
イズ法で本発明の出発原料の銅合金粉を作成した。この
ようにして作成した銅合金粉１０００ｇに対して、５ｇ
のステアリン酸を加え、振動ミルで２時間粉砕し片状加
工した。しかる後に水素雰囲気の還元炉で３００℃２０
分間還元処理した。このようにして得た片状粉末を１５
０メッシュの篩を用いて１００μｍ以下の粒子径にし、
ＢＥＴ法比表面積値３５００ｃｍ2／ｇの導電ペースト
用片状銅合金粉を製造した。このようにして製造した本
発明の導電ペースト用片状銅合金粉の性能を確認するた
めに銅合金粉７５重量部、アクリル樹脂２５重量部にな
るように混合し、トルオールで希釈して導電ペーストを
作成した。作成したペーストをＡＢＳ樹脂板にロールコ
ータ法で印刷し膜厚２５μｍの塗膜を作成し、比抵抗値
を測定した。その結果１.８×１０ー4Ω・ｃｍの良好な導
電性を示した。(Example 5) 50% by weight of copper and 50% by weight of silver
Was melted in a crucible to prepare a copper alloy powder as a starting material of the present invention by an air atomizing method. 5 g for 1000 g of the copper alloy powder thus prepared
Of stearic acid was added, and the mixture was pulverized with a vibration mill for 2 hours and processed into flakes. Then, in a reducing furnace in a hydrogen atmosphere at 300 ° C. 20
Reduction treatment was performed for minutes. The flaky powder obtained in this way is 15
Using a 0 mesh sieve to a particle size of 100 μm or less,
A flake copper alloy powder for a conductive paste having a BET specific surface area of 3500 cm 2 / g was produced. In order to confirm the performance of the flaky copper alloy powder for conductive paste of the present invention thus manufactured, the conductive paste was mixed by mixing 75 parts by weight of copper alloy powder and 25 parts by weight of acrylic resin and diluted with toluene. It was created. The prepared paste was printed on an ABS resin plate by a roll coater method to form a coating film having a thickness of 25 μm, and the specific resistance value was measured. As a result, good conductivity of 1.8 × 10 −4 Ω · cm was exhibited.
【００１５】（実施例６）銅３０重量％、銀７０重量％
になるように調整した金属を坩堝で溶解し、空気アトマ
イズ法で本発明の出発原料の銅合金粉を作成した。この
ようにして作成した銅合金粉１０００ｇに対して、５ｇ
のステアリン酸を加え、振動ミルで２時間粉砕し片状加
工した。しかる後に水素雰囲気の還元炉で３００℃２０
分間還元処理した。このようにして得た片状粉末を１５
０メッシュの篩を用いて１００μｍ以下の粒子径にし、
ＢＥＴ法比表面積値４０００ｃｍ2／ｇの導電ペースト
用片状銅合金粉を製造した。このようにして製造した本
発明の導電ペースト用片状銅合金粉の性能を確認するた
めに銅合金粉７５重量部、アクリル樹脂２５重量部にな
るように混合し、トルオールで希釈して導電ペーストを
作成した。作成したペーストをＡＢＳ樹脂板にロールコ
ータ法で印刷し膜厚２５μｍの塗膜を作成し、比抵抗値
を測定した。その結果１.５×１０ー4Ω・ｃｍの良好な導
電性を示した。Example 6 30% by weight of copper, 70% by weight of silver
Was melted in a crucible to prepare a copper alloy powder as a starting material of the present invention by an air atomizing method. 5 g for 1000 g of the copper alloy powder thus prepared
Of stearic acid was added, and the mixture was pulverized with a vibration mill for 2 hours and processed into flakes. Then, in a reducing furnace in a hydrogen atmosphere at 300 ° C. 20
Reduction treatment was performed for minutes. The flaky powder obtained in this way is 15
Using a 0 mesh sieve to a particle size of 100 μm or less,
A flake copper alloy powder for a conductive paste having a BET specific surface area value of 4000 cm 2 / g was produced. In order to confirm the performance of the flaky copper alloy powder for conductive paste of the present invention thus manufactured, the conductive paste was mixed by mixing 75 parts by weight of copper alloy powder and 25 parts by weight of acrylic resin and diluted with toluene. It was created. The prepared paste was printed on an ABS resin plate by a roll coater method to form a coating film having a thickness of 25 μm, and the specific resistance value was measured. As a result, good conductivity of 1.5 × 10 −4 Ω · cm was exhibited.
【００１６】（実施例７）銅２５重量％、銀７５重量％
になるように調整した金属を坩堝で溶解し、空気アトマ
イズ法で本発明の出発原料の銅合金粉を作成した。この
ようにして作成した銅合金粉１０００ｇに対して、５ｇ
のステアリン酸を加え、振動ミルで２時間粉砕し片状加
工した。しかる後に水素雰囲気の還元炉で３００℃２０
分間還元処理した。このようにして得た片状粉末を１５
０メッシュの篩を用いて１００μｍ以下の粒子径にし、
ＢＥＴ法比表面積値４１００ｃｍ2／ｇの導電ペースト
用片状銅合金粉を製造した。このようにして製造した本
発明の導電ペースト用片状銅合金粉の性能を確認するた
めに銅合金粉７５重量部、アクリル樹脂２５重量部にな
るように混合し、トルオールで希釈して導電ペーストを
作成した。作成したペーストをＡＢＳ樹脂板にロールコ
ータ法で印刷し膜厚２５μｍの塗膜を作成し、比抵抗値
を測定した。その結果１.５×１０ー4Ω・ｃｍの良好な導
電性を示した。(Example 7) Copper 25% by weight, silver 75% by weight
Was melted in a crucible to prepare a copper alloy powder as a starting material of the present invention by an air atomizing method. 5 g for 1000 g of the copper alloy powder thus prepared
Of stearic acid was added, and the mixture was pulverized with a vibration mill for 2 hours and processed into flakes. Then, in a reducing furnace in a hydrogen atmosphere at 300 ° C. 20
Reduction treatment was performed for minutes. The flaky powder obtained in this way is 15
Using a 0 mesh sieve to a particle size of 100 μm or less,
A flaky copper alloy powder for a conductive paste having a BET specific surface area of 4,100 cm 2 / g was produced. In order to confirm the performance of the flaky copper alloy powder for conductive paste of the present invention thus manufactured, the conductive paste was mixed by mixing 75 parts by weight of copper alloy powder and 25 parts by weight of acrylic resin and diluted with toluene. It was created. The prepared paste was printed on an ABS resin plate by a roll coater method to form a coating film having a thickness of 25 μm, and the specific resistance value was measured. As a result, good conductivity of 1.5 × 10 −4 Ω · cm was exhibited.
【００１７】（実施例８）銅９０重量％、銀１０重量％
になるように調整した金属を坩堝で溶解し、空気アトマ
イズ法で本発明の出発原料の銅合金粉を作成した。この
ようにして作成した銅合金粉１０００ｇに対して、２０
ｇのステアリン酸を加え、ボールミルで８時間粉砕し片
状加工した。しかる後に水素雰囲気の還元炉で５００℃
１０分間還元処理した。このようにして得た片状粉末を
１５０メッシュの篩を用いて１００μｍ以下の粒子径に
し、ＢＥＴ法比表面積値５０００ｃｍ2／ｇの導電ペー
スト用片状銅合金粉を製造した。このようにして製造し
た本発明の導電ペースト用片状銅合金粉の性能を確認す
るために銅合金粉７５重量部、アクリル樹脂２５重量部
になるように混合し、トルオールで希釈して導電ペース
トを作成した。作成したペーストをＡＢＳ樹脂板にロー
ルコータ法で印刷し膜厚２５μｍの塗膜を作成し、比抵
抗値を測定した。その結果２.０×１０ー4Ω・ｃｍの良好
な導電性を示した。Example 8 90% by weight of copper, 10% by weight of silver
Was melted in a crucible to prepare a copper alloy powder as a starting material of the present invention by an air atomizing method. For 1000 g of the copper alloy powder thus produced, 20 g
g of stearic acid was added, and the mixture was pulverized with a ball mill for 8 hours and processed into flakes. Then, in a hydrogen atmosphere reducing furnace at 500 ° C
Reduction treatment was performed for 10 minutes. The flaky powder thus obtained was sized using a 150-mesh sieve to a particle size of 100 μm or less to produce a flaky copper alloy powder for a conductive paste having a BET specific surface area of 5000 cm 2 / g. In order to confirm the performance of the flaky copper alloy powder for conductive paste of the present invention thus manufactured, the conductive paste was mixed by mixing 75 parts by weight of copper alloy powder and 25 parts by weight of acrylic resin and diluted with toluene. It was created. The prepared paste was printed on an ABS resin plate by a roll coater method to form a coating film having a thickness of 25 μm, and the specific resistance value was measured. As a result, good conductivity of 2.0 × 10 −4 Ω · cm was exhibited.
【００１８】（実施例９）銅５０重量％、銀５０重量％
になるように調整した金属を坩堝で溶解し、空気アトマ
イズ法で本発明の出発原料の銅合金粉を作成した。この
ようにして作成した銅合金粉１０００ｇに対して、２０
ｇのステアリン酸を加え、ボールミルで８時間粉砕し片
状加工した。しかる後に水素雰囲気の還元炉で５００℃
１０分間還元処理した。このようにして得た片状粉末を
１５０メッシュの篩を用いて１００μｍ以下の粒子径に
し、ＢＥＴ法比表面積値６０００ｃｍ2／ｇの導電ペー
スト用片状銅合金粉を製造した。このようにして製造し
た本発明の導電ペースト用片状銅合金粉の性能を確認す
るために銅合金粉７５重量部、アクリル樹脂２５重量部
になるように混合し、トルオールで希釈して導電ペース
トを作成した。作成したペーストをＡＢＳ樹脂板にロー
ルコータ法で印刷し膜厚２５μｍの塗膜を作成し、比抵
抗値を測定した。その結果１.６×１０ー4Ω・ｃｍの良好
な導電性を示した。Example 9 50% by weight of copper and 50% by weight of silver
Was melted in a crucible to prepare a copper alloy powder as a starting material of the present invention by an air atomizing method. For 1000 g of the copper alloy powder thus produced, 20 g
g of stearic acid was added, and the mixture was pulverized with a ball mill for 8 hours and processed into flakes. Then, in a hydrogen atmosphere reducing furnace at 500 ° C
Reduction treatment was performed for 10 minutes. The flaky powder thus obtained was sieved to a particle size of 100 μm or less using a 150-mesh sieve to produce a flaky copper alloy powder for a conductive paste having a BET specific surface area of 6000 cm 2 / g. In order to confirm the performance of the flaky copper alloy powder for conductive paste of the present invention thus manufactured, the conductive paste was mixed by mixing 75 parts by weight of copper alloy powder and 25 parts by weight of acrylic resin and diluted with toluene. It was created. The prepared paste was printed on an ABS resin plate by a roll coater method to form a coating film having a thickness of 25 μm, and the specific resistance value was measured. As a result, good conductivity of 1.6 × 10 −4 Ω · cm was exhibited.
【００１９】（実施例１０）銅９０重量％、銀１０重量
％になるように調整した金属を坩堝で溶解し、空気アト
マイズ法で本発明の出発原料の銅合金粉を作成した。こ
のようにして作成した銅合金粉１０００ｇに対して、
０.５ｇのステアリン酸を加え、ボールミルで１時間粉
砕し片状加工した。しかる後に水素雰囲気の還元炉で１
５０℃６０分間還元処理した。このようにして得た片状
粉末を１５０メッシュの篩いを用いて１００μｍ以下の
粒子径にし、ＢＥＴ法比表面積値２０００ｃｍ2／ｇの
導電ペースト用片状銅合金粉を製造した。このようにし
て製造した本発明の導電ペースト用片状銅合金粉の性能
を確認するために銅合金粉７５重量部、アクリル樹脂２
５重量部になるように混合し、トルオールで希釈して導
電ペーストを作成した。作成したペーストをＡＢＳ樹脂
板にロールコータ法で印刷し膜厚２５μｍの塗膜を作成
し、比抵抗値を測定した。その結果４.０×１０ー4Ω・ｃ
ｍの良好な導電性を示した。Example 10 A metal adjusted to 90% by weight of copper and 10% by weight of silver was melted in a crucible, and a copper alloy powder as a starting material of the present invention was prepared by an air atomizing method. For 1000 g of the copper alloy powder thus prepared,
0.5 g of stearic acid was added, and the mixture was pulverized for 1 hour with a ball mill and processed into flakes. Then, in a reducing furnace in a hydrogen atmosphere,
Reduction treatment was performed at 50 ° C. for 60 minutes. The flaky powder thus obtained was sieved to a particle size of 100 μm or less using a 150-mesh sieve to produce a flaky copper alloy powder for a conductive paste having a BET specific surface area of 2000 cm 2 / g. In order to confirm the performance of the flaky copper alloy powder for a conductive paste of the present invention thus manufactured, 75 parts by weight of copper alloy powder, acrylic resin 2
It mixed so that it might become 5 weight part, and diluted with toluene, and produced the conductive paste. The prepared paste was printed on an ABS resin plate by a roll coater method to form a coating film having a thickness of 25 μm, and the specific resistance value was measured. As a result, 4.0 × 10-4 Ω · c
m showed good conductivity.
【００２０】（実施例１１）銅５０重量％、銀５０重量
％になるように調整した金属を坩堝で溶解し、空気アト
マイズ法で本発明の出発原料の銅合金粉を作成した。こ
のようにして作成した銅合金粉１０００ｇに対して、
０.５ｇのステアリン酸を加え、ボールミルで１時間粉
砕し片状加工した。しかる後に水素雰囲気の還元炉で１
５０℃６０分間還元処理した。このようにして得た片状
粉末を１５０メッシュの篩を用いて１００μｍ以下の粒
子径にし、ＢＥＴ法比表面積値２５００ｃｍ2／ｇの導
電ペースト用片状銅合金粉を製造した。このようにして
製造した本発明の導電ペースト用片状銅合金粉の性能を
確認するために銅合金粉７５重量部、アクリル樹脂２５
重量部になるように混合し、トルオールで希釈して導電
ペーストを作成した。作成したペーストをＡＢＳ樹脂板
にロールコータ法で印刷し膜厚２５μｍの塗膜を作成
し、比抵抗値を測定した。その結果３.０×１０ー4Ω・ｃ
ｍの良好な導電性を示した。(Example 11) A metal adjusted to 50% by weight of copper and 50% by weight of silver was melted in a crucible, and a copper alloy powder as a starting material of the present invention was prepared by an air atomizing method. For 1000 g of the copper alloy powder thus prepared,
0.5 g of stearic acid was added, and the mixture was pulverized for 1 hour with a ball mill and processed into flakes. Then, in a reducing furnace in a hydrogen atmosphere,
Reduction treatment was performed at 50 ° C. for 60 minutes. The flaky powder thus obtained was sized to a particle size of 100 μm or less using a 150-mesh sieve to produce a flaky copper alloy powder for a conductive paste having a BET specific surface area of 2500 cm 2 / g. In order to confirm the performance of the flaky copper alloy powder for conductive paste of the present invention thus produced, 75 parts by weight of copper alloy powder and 25 parts of acrylic resin were used.
It mixed so that it might become a weight part, and diluted with toluene, and produced the conductive paste. The prepared paste was printed on an ABS resin plate by a roll coater method to form a coating film having a thickness of 25 μm, and the specific resistance value was measured. As a result, 3.0 × 10-4 Ω · c
m showed good conductivity.
【００２１】（実施例１２）銅９０重量％、銀１０重量
％になるように調整した金属を坩堝で溶解し、空気アト
マイズ法で本発明の出発原料の銅合金粉を作成した。こ
のようにして作成した銅合金粉１０００ｇに対して、５
ｇのラウリン酸を加え、振動ミルで４時間粉砕し片状加
工した。しかる後にアンモニア分解ガス雰囲気の還元炉
で２００℃８０分間還元処理した。このようにして得た
片状粉末を３２５メッシュの篩を用いて４５μｍ以下の
粒子径にし、ＢＥＴ法比表面積値７０００ｃｍ2/ｇの導
電ペースト用片状銅合金粉を製造した。このようにして
製造した本発明の導電ペースト用片状銅合金粉の性能を
確認するために銅合金粉７５重量部、エポキシ樹脂１０
重量部、エチルカルビトール１５重量部及び硬化剤、反
応促進剤を適量添加し銅ペーストを作成した。作成した
ペーストを２００メッシュのスクリーンを使用してスク
リーン印刷方法で塗膜を作成し、比抵抗値を測定した。
その結果０.９×１０ー4Ω・ｃｍの良好な導電性を示し
た。Example 12 A metal adjusted to 90% by weight of copper and 10% by weight of silver was melted in a crucible, and a copper alloy powder as a starting material of the present invention was prepared by an air atomizing method. For 1000 g of the copper alloy powder thus prepared, 5 g
g of lauric acid was added, and the mixture was pulverized with a vibration mill for 4 hours and flake-shaped. Thereafter, reduction treatment was performed at 200 ° C. for 80 minutes in a reducing furnace in an ammonia decomposition gas atmosphere. The flaky powder thus obtained was sized using a 325 mesh sieve to a particle size of 45 μm or less to produce a flaky copper alloy powder for a conductive paste having a BET specific surface area of 7000 cm 2 / g. In order to confirm the performance of the flaky copper alloy powder for a conductive paste of the present invention thus manufactured, 75 parts by weight of the copper alloy powder, epoxy resin 10
Parts by weight, 15 parts by weight of ethyl carbitol, a curing agent and a reaction accelerator were added in appropriate amounts to prepare a copper paste. Using the prepared paste, a coating film was formed by a screen printing method using a 200-mesh screen, and the specific resistance value was measured.
As a result, good conductivity of 0.9 × 10 −4 Ω · cm was exhibited.
【００２２】（実施例１３）銅９０重量％、銀１０重量
％になるように調整した金属を坩堝で溶解し、空気アト
マイズ法で本発明の出発原料の銅合金粉を作成した。こ
のようにして作成した銅合金粉１０００ｇに対して、５
ｇのパルミチン酸を加え、振動ミルで４時間粉砕し片状
加工した。しかる後にアンモニア分解ガス雰囲気の還元
炉で２００℃８０分間還元処理した。このようにして得
た片状粉末を３２５メッシュの篩を用いて４５μｍ以下
の粒子径にし、ＢＥＴ法比表面積値６８００ｃｍ2／ｇ
の導電ペースト用片状銅合金粉を製造した。このように
して製造した本発明の導電ペースト用片状銅合金粉の性
能を確認するために銅合金粉７５重量部、エポキシ樹脂
１０重量部、エチルカルビトール１５重量部及び硬化
剤、反応促進剤を適量添加し銅ペーストを作成した。作
成したペーストを２００メッシュのスクリーンを使用し
てスクリーン印刷方法で塗膜を作成し、比抵抗値を測定
した。その結果０.９×１０ー4Ω・ｃｍの良好な導電性を
示した。Example 13 A metal adjusted to 90% by weight of copper and 10% by weight of silver was melted in a crucible, and a copper alloy powder as a starting material of the present invention was prepared by an air atomizing method. For 1000 g of the copper alloy powder thus prepared, 5 g
g of palmitic acid was added, and the mixture was pulverized with a vibrating mill for 4 hours and processed into flakes. Thereafter, reduction treatment was performed at 200 ° C. for 80 minutes in a reducing furnace in an ammonia decomposition gas atmosphere. The flaky powder thus obtained was reduced to a particle diameter of 45 μm or less using a 325 mesh sieve, and the BET specific surface area value was 6800 cm 2 / g.
Flake copper alloy powder for conductive paste was manufactured. In order to confirm the performance of the flaky copper alloy powder for a conductive paste of the present invention thus produced, 75 parts by weight of copper alloy powder, 10 parts by weight of epoxy resin, 15 parts by weight of ethyl carbitol, a curing agent, and a reaction accelerator Was added in an appropriate amount to prepare a copper paste. Using the prepared paste, a coating film was formed by a screen printing method using a 200-mesh screen, and the specific resistance value was measured. As a result, good conductivity of 0.9 × 10 −4 Ω · cm was exhibited.
【００２３】（実施例１４）銅９０重量％、銀１０重量
％になるように調整した金属を坩堝で溶解し、空気アト
マイズ法で本発明の出発原料の銅合金粉を作成した。こ
のようにして作成した銅合金粉１０００ｇに対して、５
ｇのステアリン酸を加え、振動ミルで４時間粉砕し片状
加工した。しかる後にアンモニア分解ガス雰囲気の還元
炉で２００℃８０分間還元処理した。このようにして得
た片状粉末を３２５メッシュの篩を用いて４５μｍ以下
の粒子径にし、ＢＥＴ法比表面積値７２００ｃｍ2／ｇ
の導電ペースト用片状銅合金粉を製造した。このように
して製造した本発明の導電ペースト用片状銅合金粉の性
能を確認するために銅合金粉７５重量部、エポキシ樹脂
１０重量部、エチルカルビトール１５重量部及び硬化
剤、反応促進剤を適量添加し銅ペーストを作成した。作
成したペーストを２００メッシュのスクリーンを使用し
てスクリーン印刷方法で塗膜を作成し、比抵抗値を測定
した。その結果０.９×１０ー4Ω・ｃｍの良好な導電性を
示した。Example 14 A metal adjusted to 90% by weight of copper and 10% by weight of silver was melted in a crucible, and a copper alloy powder as a starting material of the present invention was prepared by an air atomizing method. For 1000 g of the copper alloy powder thus prepared, 5 g
g of stearic acid was added, and the mixture was pulverized with a vibration mill for 4 hours and processed into flakes. Thereafter, reduction treatment was performed at 200 ° C. for 80 minutes in a reducing furnace in an ammonia decomposition gas atmosphere. The flaky powder thus obtained was sized using a 325 mesh sieve to a particle size of 45 μm or less, and the BET specific surface area value was 7200 cm 2 / g.
Flake copper alloy powder for conductive paste was manufactured. In order to confirm the performance of the flaky copper alloy powder for a conductive paste of the present invention thus produced, 75 parts by weight of copper alloy powder, 10 parts by weight of epoxy resin, 15 parts by weight of ethyl carbitol, a curing agent, and a reaction accelerator Was added in an appropriate amount to prepare a copper paste. Using the prepared paste, a coating film was formed by a screen printing method using a 200-mesh screen, and the specific resistance value was measured. As a result, good conductivity of 0.9 × 10 −4 Ω · cm was exhibited.
【００２４】（実施例１５）銅９０重量％、銀１０重量
％になるように調整した金属を坩堝で溶解し、空気アト
マイズ法で本発明の出発原料の銅合金粉を作成した。こ
のようにして作成した銅合金粉１０００ｇに対して、５
ｇのオレイン酸を加え、振動ミルで４時間粉砕し片状加
工した。しかる後にアンモニア分解ガス雰囲気の還元炉
で２００℃８０分間還元処理した。このようにして得た
片状粉末を３２５メッシュの篩を用いて４５μｍ以下の
粒子径にし、ＢＥＴ法比表面積値７４００ｃｍ2/ｇの導
電ペースト用片状銅合金粉を製造した。このようにして
製造した本発明の導電ペースト用片状銅合金粉の性能を
確認するために銅合金粉７５重量部、エポキシ樹脂１０
重量部、エチルカルビトール１５重量部及び硬化剤、反
応促進剤を適量添加し銅ペーストを作成した。作成した
ペーストを２００メッシュのスクリーンを使用してスク
リーン印刷方法で塗膜を作成し、比抵抗値を測定した。
その結果０.９×１０ー4Ω・ｃｍの良好な導電性を示し
た。Example 15 A metal adjusted to 90% by weight of copper and 10% by weight of silver was melted in a crucible, and a copper alloy powder as a starting material of the present invention was prepared by an air atomizing method. For 1000 g of the copper alloy powder thus prepared, 5 g
g of oleic acid was added, and the mixture was pulverized with a vibration mill for 4 hours and processed into flakes. Thereafter, reduction treatment was performed at 200 ° C. for 80 minutes in a reducing furnace in an ammonia decomposition gas atmosphere. The flaky powder thus obtained was sized using a 325 mesh sieve to a particle size of 45 μm or less to produce a flaky copper alloy powder for a conductive paste having a BET specific surface area of 7400 cm 2 / g. In order to confirm the performance of the flaky copper alloy powder for a conductive paste of the present invention thus manufactured, 75 parts by weight of the copper alloy powder, epoxy resin 10
Parts by weight, 15 parts by weight of ethyl carbitol, a curing agent and a reaction accelerator were added in appropriate amounts to prepare a copper paste. Using the prepared paste, a coating film was formed by a screen printing method using a 200-mesh screen, and the specific resistance value was measured.
As a result, good conductivity of 0.9 × 10 −4 Ω · cm was exhibited.
【００２５】（実施例１６）銅８０重量％、銀２０重量
％になるように調整した金属を坩堝で溶解し、水アトマ
イズ法で本発明の出発原料の銅合金粉を作成した。この
ようにして作成した銅合金粉１０００ｇに対して、５ｇ
のラウリン酸を加え、振動ミルで４時間粉砕し片状加工
した。しかる後にアンモニア分解ガス雰囲気の還元炉で
２００℃８０分間還元処理した。このようにして得た片
状粉末を３２５メッシュの篩を用いて４５μｍ以下の粒
子径にし、ＢＥＴ法比表面積値７５００ｃｍ2／ｇの導
電ペースト用片状銅合金粉を製造した。このようにして
製造した本発明の導電ペースト用片状銅合金粉の性能を
確認するために銅合金粉７５重量部、エポキシ樹脂１０
重量部、エチルカルビトール１５重量部及び硬化剤、反
応促進剤を適量添加し銅ペーストを作成した。作成した
ペーストを２００メッシュのスクリーンを使用してスク
リーン印刷方法で塗膜を作成し、比抵抗値を測定した。
その結果０.９×１０ー4Ω・ｃｍの良好な導電性を示し
た。(Example 16) A metal adjusted to 80% by weight of copper and 20% by weight of silver was melted in a crucible, and a copper alloy powder as a starting material of the present invention was prepared by a water atomizing method. 5 g for 1000 g of the copper alloy powder thus prepared
Of lauric acid was added, and the mixture was pulverized with a vibration mill for 4 hours to form flakes. Thereafter, reduction treatment was performed at 200 ° C. for 80 minutes in a reducing furnace in an ammonia decomposition gas atmosphere. The flaky powder thus obtained was sized using a 325 mesh sieve to a particle size of 45 μm or less to produce a flaky copper alloy powder for a conductive paste having a BET specific surface area of 7,500 cm 2 / g. In order to confirm the performance of the flaky copper alloy powder for a conductive paste of the present invention thus manufactured, 75 parts by weight of the copper alloy powder, epoxy resin 10
Parts by weight, 15 parts by weight of ethyl carbitol, a curing agent and a reaction accelerator were added in appropriate amounts to prepare a copper paste. Using the prepared paste, a coating film was formed by a screen printing method using a 200-mesh screen, and the specific resistance value was measured.
As a result, good conductivity of 0.9 × 10 −4 Ω · cm was exhibited.
【００２６】（実施例１７）銅８０重量％、銀２０重量
％になるように調整した金属を坩堝で溶解し、水アトマ
イズ法で本発明の出発原料の銅合金粉を作成した。この
ようにして作成した銅合金粉１０００ｇに対して、５ｇ
のパルミチン酸を加え、振動ミルで４時間粉砕し片状加
工した。しかる後にアンモニア分解ガス雰囲気の還元炉
で２００℃８０分間還元処理した。このようにして得た
片状粉末を３２５メッシュの篩を用いて４５μｍ以下の
粒子径にし、ＢＥＴ法比表面積値７４００ｃｍ2／ｇの
導電ペースト用片状銅合金粉を製造した。このようにし
て製造した本発明の導電ペースト用片状銅合金粉の性能
を確認するために銅合金粉７５重量部、エポキシ樹脂１
０重量部、エチルカルビトール１５重量部及び硬化剤、
反応促進剤を適量添加し銅ペーストを作成した。作成し
たペーストを２００メッシュのスクリーンを使用してス
クリーン印刷方法で塗膜を作成し、比抵抗値を測定し
た。その結果０.９×１０ー4Ω・ｃｍの良好な導電性を示
した。Example 17 A metal adjusted to be 80% by weight of copper and 20% by weight of silver was melted in a crucible, and a copper alloy powder as a starting material of the present invention was prepared by a water atomizing method. 5 g for 1000 g of the copper alloy powder thus prepared
Of palmitic acid was added, and the mixture was pulverized with a vibration mill for 4 hours and processed into flakes. Thereafter, reduction treatment was performed at 200 ° C. for 80 minutes in a reducing furnace in an ammonia decomposition gas atmosphere. The flaky powder thus obtained was sized using a 325 mesh sieve to a particle diameter of 45 μm or less to produce a flaky copper alloy powder for conductive paste having a BET specific surface area of 7,400 cm 2 / g. In order to confirm the performance of the flaky copper alloy powder for a conductive paste of the present invention thus manufactured, 75 parts by weight of copper alloy powder, epoxy resin 1
0 parts by weight, 15 parts by weight of ethyl carbitol and a curing agent,
An appropriate amount of a reaction accelerator was added to prepare a copper paste. Using the prepared paste, a coating film was formed by a screen printing method using a 200-mesh screen, and the specific resistance value was measured. As a result, good conductivity of 0.9 × 10 −4 Ω · cm was exhibited.
【００２７】（実施例１８）銅８０重量％、銀２０重量
％になるように調整した金属を坩堝で溶解し、水アトマ
イズ法で本発明の出発原料の銅合金粉を作成した。この
ようにして作成した銅合金粉１０００ｇに対して、５ｇ
のステアリン酸を加え、振動ミルで４時間粉砕し片状加
工した。しかる後にアンモニア分解ガス雰囲気の還元炉
で２００℃８０分間還元処理した。このようにして得た
片状粉末を３２５メッシュの篩を用いて４５μｍ以下の
粒子径にし、ＢＥＴ法比表面積値７６００ｃｍ2／ｇの
導電ペースト用片状銅合金粉を製造した。このようにし
て製造した本発明の導電ペースト用片状銅合金粉の性能
を確認するために銅合金粉７５重量部、エポキシ樹脂１
０重量部、エチルカルビトール１５重量部及び硬化剤、
反応促進剤を適量添加し銅ペーストを作成した。作成し
たペーストを２００メッシュのスクリーンを使用してス
クリーン印刷方法で塗膜を作成し、比抵抗値を測定し
た。その結果０.８×１０ー4Ω・ｃｍの良好な導電性を示
した。Example 18 A metal adjusted to 80% by weight of copper and 20% by weight of silver was melted in a crucible, and a copper alloy powder as a starting material of the present invention was prepared by a water atomizing method. 5 g for 1000 g of the copper alloy powder thus prepared
Of stearic acid was added, and the mixture was pulverized with a vibration mill for 4 hours and processed into flakes. Thereafter, reduction treatment was performed at 200 ° C. for 80 minutes in a reducing furnace in an ammonia decomposition gas atmosphere. The flaky powder thus obtained was sized using a 325 mesh sieve to a particle size of 45 μm or less to produce a flaky copper alloy powder for conductive paste having a BET specific surface area of 7,600 cm 2 / g. In order to confirm the performance of the flaky copper alloy powder for a conductive paste of the present invention thus manufactured, 75 parts by weight of copper alloy powder, epoxy resin 1
0 parts by weight, 15 parts by weight of ethyl carbitol and a curing agent,
An appropriate amount of a reaction accelerator was added to prepare a copper paste. Using the prepared paste, a coating film was formed by a screen printing method using a 200-mesh screen, and the specific resistance value was measured. As a result, good conductivity of 0.8 × 10 −4 Ω · cm was exhibited.
【００２８】（実施例１９）銅８０重量％、銀２０重量
％になるように調整した金属を坩堝で溶解し、水アトマ
イズ法で本発明の出発原料の銅合金粉を作成した。この
ようにして作成した銅合金粉１０００ｇに対して、５ｇ
のオレイン酸を加え、振動ミルで４時間粉砕し片状加工
した。しかる後にアンモニア分解ガス雰囲気の還元炉で
２００℃８０分間還元処理した。このようにして得た片
状粉末を３２５メッシュの篩を用いて４５μｍ以下の粒
子径にし、ＢＥＴ法比表面積値７９００ｃｍ2/ｇの導電
ペースト用片状銅合金粉を製造した。このようにして製
造した本発明の導電ペースト用片状銅合金粉の性能を確
認するために銅合金粉７５重量部、エポキシ樹脂１０重
量部、エチルカルビトール１５重量部及び硬化剤、反応
促進剤を適量添加し銅ペーストを作成した。作成したペ
ーストを２００メッシュのスクリーンを使用してスクリ
ーン印刷方法で塗膜を作成し、比抵抗値を測定した。そ
の結果０.９×１０ー4Ω・ｃｍの良好な導電性を示した。Example 19 A metal adjusted to 80% by weight of copper and 20% by weight of silver was melted in a crucible, and a copper alloy powder as a starting material of the present invention was prepared by a water atomizing method. 5 g for 1000 g of the copper alloy powder thus prepared
Oleic acid was added, and the mixture was pulverized with a vibration mill for 4 hours to form a flake. Thereafter, reduction treatment was performed at 200 ° C. for 80 minutes in a reducing furnace in an ammonia decomposition gas atmosphere. The flake powder thus obtained was sized using a 325 mesh sieve to a particle diameter of 45 μm or less to produce flake copper alloy powder for conductive paste having a BET specific surface area of 7,900 cm 2 / g. In order to confirm the performance of the flaky copper alloy powder for a conductive paste of the present invention thus produced, 75 parts by weight of copper alloy powder, 10 parts by weight of epoxy resin, 15 parts by weight of ethyl carbitol, a curing agent, and a reaction accelerator Was added in an appropriate amount to prepare a copper paste. Using the prepared paste, a coating film was formed by a screen printing method using a 200-mesh screen, and the specific resistance value was measured. As a result, good conductivity of 0.9 × 10 −4 Ω · cm was exhibited.
【００２９】（実施例２０）銅５０重量％、銀５０重量
％になるように調整した金属を坩堝で溶解し、空気アト
マイズ法で本発明の出発原料の銅合金粉を作成した。こ
のようにして作成した銅合金粉１０００ｇに対して、２
０ｇのステアリン酸を加え、アジテータミルで２時間粉
砕し片状加工した。しかる後に水素雰囲気の還元炉で４
５０℃３０分間還元処理した。このようにして得た片状
粉末を風力分級機を用いて７５μｍ以下の粒子径にし、
ＢＥＴ法比表面積値５５００ｃｍ2/ｇの導電ペースト用
片状銅合金粉を製造した。このようにして製造した本発
明の導電ペースト用片状銅合金粉の性能を確認するため
に銅合金粉７５重量部、アクリル樹脂２５重量部になる
ように混合し、トルオールで希釈して導電ペーストを作
成した。作成したペーストをＡＢＳ樹脂板にロールコー
タ法で印刷し膜厚２５μｍの塗膜を作成し、比抵抗値を
測定した。その結果２.０×１０ー4Ω・ｃｍの良好な導電
性を示した。Example 20 A metal adjusted to 50% by weight of copper and 50% by weight of silver was melted in a crucible, and a copper alloy powder as a starting material of the present invention was prepared by an air atomizing method. For 1000 g of the copper alloy powder thus produced, 2 g
0 g of stearic acid was added, and the mixture was pulverized with an agitator mill for 2 hours and processed into flakes. Then use a reducing furnace with hydrogen atmosphere
Reduction treatment was performed at 50 ° C. for 30 minutes. The flaky powder obtained in this manner was made to have a particle size of 75 μm or less using an air classifier,
A flake copper alloy powder for conductive paste having a BET specific surface area of 5,500 cm 2 / g was produced. In order to confirm the performance of the flaky copper alloy powder for conductive paste of the present invention thus manufactured, the conductive paste was mixed by mixing 75 parts by weight of copper alloy powder and 25 parts by weight of acrylic resin and diluted with toluene. It was created. The prepared paste was printed on an ABS resin plate by a roll coater method to form a coating film having a thickness of 25 μm, and the specific resistance value was measured. As a result, good conductivity of 2.0 × 10 −4 Ω · cm was exhibited.
【００３０】（実施例２１）銅５０重量％、銀５０重量
％になるように調整した金属を坩堝で溶解し、空気アト
マイズ法で本発明の出発原料の銅合金粉を作成した。こ
のようにして作成した銅合金粉１０００ｇに対して、５
ｇのステアリン酸を加え、アジテータミルで１.５時間
粉砕し片状加工した。片状加工した粉末１０００ｇに１
５ｇのステアリンをさらに加えミキサーで５分間撹拌混
合した。しかる後に水素雰囲気の還元炉で４５０℃３０
分間還元処理した。このようにして得た片状粉末を風力
分級機を用いて７５μｍ以下の粒子径にし、ＢＥＴ法比
表面積値６５００ｃｍ2／ｇの導電ペースト用片状銅合
金粉を製造した。このようにして製造した本発明の導電
ペースト用片状銅合金粉の性能を確認するために銅合金
粉７５重量部、アクリル樹脂２５重量部になるように混
合し、トルオールで希釈して導電ペーストを作成した。
作成したペーストをＡＢＳ樹脂板にロールコータ法で印
刷し膜厚２５μｍの塗膜を作成し、比抵抗値を測定し
た。その結果２.０×１０ー4Ω・ｃｍの良好な導電性を示
した。(Example 21) A metal adjusted to 50% by weight of copper and 50% by weight of silver was melted in a crucible, and a copper alloy powder as a starting material of the present invention was prepared by an air atomizing method. For 1000 g of the copper alloy powder thus prepared, 5 g
g of stearic acid was added, and the mixture was pulverized with an agitator mill for 1.5 hours and processed into flakes. 1 in 1000 g of flaked powder
5 g of stearin was further added and mixed by stirring with a mixer for 5 minutes. Then, at 450 ° C 30 in a reducing furnace in a hydrogen atmosphere.
Reduction treatment was performed for minutes. The flaky powder thus obtained was made to have a particle size of 75 μm or less by using an air classifier to produce a flaky copper alloy powder for a conductive paste having a BET specific surface area of 6,500 cm 2 / g. In order to confirm the performance of the flaky copper alloy powder for conductive paste of the present invention thus manufactured, the conductive paste was mixed by mixing 75 parts by weight of copper alloy powder and 25 parts by weight of acrylic resin and diluted with toluene. It was created.
The prepared paste was printed on an ABS resin plate by a roll coater method to form a coating film having a thickness of 25 μm, and the specific resistance value was measured. As a result, good conductivity of 2.0 × 10 −4 Ω · cm was exhibited.
【００３１】[0031]
【発明の効果】本発明の方法によって得られる導電ペー
スト用片状銅合金粉は、従来の粒状粉と異なり片状であ
りながら銀粉と同じような性能が得られ、かつ細かい粒
子径まで工業的に、安価に製造することが出来るように
なった。具体的な効果として、吹き付け塗装あるいはロ
ールコータ法、スクリーン印刷法による電磁波シールド
用では、片状粉であるため沈降速度が遅く、表面積が大
きいため非常に塗装し易く、しかも塗膜表面が平滑で、
かつ塗膜厚も薄くできるようになった。スクリーン印刷
方法による導電回路やジャンパー線では、粒子径が小さ
く表面積が大きい事は、ペーストの単位体積あたりの銅
粉個数が増えるため、樹脂の中に銅粉が均一に分散し易
くなり、導電性の安定した塗膜形成が可能となった。こ
のようにスクリーン印刷性の向上、塗膜表面の平滑性、
細線が必要なファインパターン用に使用できるばかり
か、ディスペンサー用にも対応できるものとなった。も
ちろん銅合金粉であるため銀粉と比較するとマイグレー
ションも少ない。このような導電ペースト用片状銅合金
粉が提供出来るようになることで、安価な導電ペースト
の使用範囲が広がり、本発明の産業上への利用性は非常
に大きいといえる。The flake copper alloy powder for a conductive paste obtained by the method of the present invention has the same performance as silver powder while having a flake shape unlike conventional granular powder, and is industrially applicable to a fine particle diameter. In addition, it has become possible to manufacture at low cost. As a specific effect, in the case of electromagnetic wave shielding by spray coating or roll coater method, screen printing method, sedimentation speed is slow because it is flake powder, it is very easy to paint because it has a large surface area, and the coating film surface is smooth. ,
In addition, the thickness of the coating film can be reduced. In a conductive circuit or jumper wire by screen printing, a small particle size and a large surface area means that the number of copper powders per unit volume of the paste increases, so that the copper powders can be easily dispersed uniformly in the resin, and the conductive properties can be improved. , And a stable coating film was formed. As described above, the screen printability is improved, the smoothness of the coating film surface is improved,
Not only can it be used for fine patterns that require fine lines, but it can also be used for dispensers. Of course, since it is a copper alloy powder, migration is less than silver powder. By providing such a flaky copper alloy powder for conductive paste, the range of use of inexpensive conductive paste is expanded, and it can be said that the industrial applicability of the present invention is extremely large.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０５Ｋ 1/09 Ｈ０５Ｋ 1/09 Ａ ──────────────────────────────────────────────────続 き Continued on front page (51) Int.Cl. 6 Identification code FI H05K 1/09 H05K 1/09 A
Claims (3)
％の脂肪酸を加えて機械的に片状加工し、しかる後に還
元性雰囲気中で、１５０℃から５００℃の温度で還元処
理することを特徴とする導電ペースト用片状銅合金粉の
製造方法。1. A copper flake is mechanically flaked by adding 0.05 to 2% by weight of a fatty acid to a copper alloy powder, and then subjected to a reduction treatment at a temperature of 150 to 500 ° C. in a reducing atmosphere. A method for producing a flaky copper alloy powder for a conductive paste, comprising the steps of:
７５重量％含有することを特徴とする導電ペースト用片
状銅合金粉の製造方法。2. A method for producing a flaky copper alloy powder for a conductive paste, wherein the copper alloy powder according to claim 1 contains 3 to 75% by weight of silver.
の粒子径が１００μｍ以下で，ＢＥＴ法比表面積値が２
０００ｃｍ2／ｇ以上であることを特徴とする導電ペー
スト用片状銅合金粉の製造方法。3. The copper alloy powder for a conductive paste according to claim 1, which has a particle size of 100 μm or less and a specific surface area of 2% by the BET method.
A method for producing a flaky copper alloy powder for a conductive paste, which is not less than 000 cm 2 / g.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07153998A JP4074369B2 (en) | 1998-03-20 | 1998-03-20 | Method for producing flake copper alloy powder for conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07153998A JP4074369B2 (en) | 1998-03-20 | 1998-03-20 | Method for producing flake copper alloy powder for conductive paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11273454A true JPH11273454A (en) | 1999-10-08 |
| JP4074369B2 JP4074369B2 (en) | 2008-04-09 |
Family
ID=13463659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP07153998A Expired - Fee Related JP4074369B2 (en) | 1998-03-20 | 1998-03-20 | Method for producing flake copper alloy powder for conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4074369B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010018781A1 (en) * | 2008-08-11 | 2010-02-18 | 地方独立行政法人大阪市立工業研究所 | Composite nanoparticle and process for producing same |
| JP2017172043A (en) * | 2016-03-16 | 2017-09-28 | Ｄｏｗａエレクトロニクス株式会社 | Ag-Cu ALLOY POWDER AND MANUFACTURING METHOD THEREFOR |
| JP2019515136A (en) * | 2016-05-13 | 2019-06-06 | ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー | Method of producing granular ruthenium |
-
1998
- 1998-03-20 JP JP07153998A patent/JP4074369B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010018781A1 (en) * | 2008-08-11 | 2010-02-18 | 地方独立行政法人大阪市立工業研究所 | Composite nanoparticle and process for producing same |
| CN102119064A (en) * | 2008-08-11 | 2011-07-06 | 地方独立行政法人大阪市立工业研究所 | Composite nanoparticle and process for producing same |
| TWI461470B (en) * | 2008-08-11 | 2014-11-21 | Osaka Municipal Tech Res Inst | Composite nanoparticles and method for the production thereof |
| US8999206B2 (en) | 2008-08-11 | 2015-04-07 | Osaka Municipal Technical Research Institute | Composite nanoparticles and manufacturing method thereof |
| JP5707133B2 (en) * | 2008-08-11 | 2015-04-22 | 地方独立行政法人 大阪市立工業研究所 | Method for producing composite nanoparticles |
| JP2017172043A (en) * | 2016-03-16 | 2017-09-28 | Ｄｏｗａエレクトロニクス株式会社 | Ag-Cu ALLOY POWDER AND MANUFACTURING METHOD THEREFOR |
| JP2019515136A (en) * | 2016-05-13 | 2019-06-06 | ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー | Method of producing granular ruthenium |
| US10913120B2 (en) | 2016-05-13 | 2021-02-09 | Heraeus Deutschland GmbH & Co. KG | Process for production of particulate ruthenium |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4074369B2 (en) | 2008-04-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4954885B2 (en) | Conductive powder and method for producing the same, conductive powder paste, and method for producing conductive powder paste | |
| KR100480863B1 (en) | Copper fine powder and method for preparing the same | |
| JP5080731B2 (en) | Fine silver particle-attached silver-copper composite powder and method for producing the fine silver particle-attached silver-copper composite powder | |
| JP4660701B2 (en) | Silver-coated copper powder, method for producing the same, and conductive paste | |
| JP5181434B2 (en) | Fine copper powder and method for producing the same | |
| JP5074837B2 (en) | Method for producing flat silver powder, flat silver powder, and conductive paste | |
| US20020050186A1 (en) | Fine copper powder and process for producing the same | |
| WO2006118182A1 (en) | Tin powder, process for producing tin powder, and tin powder-containing elctrically conductive paste | |
| JP2008223058A (en) | Mixed conductive powder and its manufacturing method, and conductive paste and its manufacturing method | |
| JPH11264001A (en) | Flake copper powder and its production | |
| JP4074369B2 (en) | Method for producing flake copper alloy powder for conductive paste | |
| JP2002245849A (en) | Conductive filter for conductive paste and manufacturing method of the same | |
| JPH11310806A (en) | Production of copper-silver composite powder for electrically conductive paste | |
| JP4136106B2 (en) | Flat micro copper powder and method for producing the same | |
| JP2002015622A (en) | Copper powder for electro-conductive paste and its manufacturing method | |
| JP4163278B2 (en) | Method for producing flake copper powder for conductive paint | |
| JP4230017B2 (en) | Method for producing fine copper powder | |
| JP2020196928A (en) | Silver-coated alloy powder, alloy powder, metal-powder producing method, silver-coated metal powder producing method, conductive paste, and conductive-paste producing method | |
| JP2009084634A (en) | Metal-coated nickel powder, and method for producing the same | |
| JPH02182809A (en) | Production of fine granular copper powder | |
| JP2000328232A (en) | Electrically conductive powder, its production and coating material using it | |
| JPH09282935A (en) | Silver-plated copper powder | |
| JP3396640B2 (en) | Copper fine powder for solventless thermosetting conductive paste for via holes and solventless thermosetting conductive paste for via holes | |
| JPH10188670A (en) | Flat conductive metal powder, its manufacture, and conductive paste with flat conductive metal powder | |
| JP2000021235A (en) | Copper-base conductive paste |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050117 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070828 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070911 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071031 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080122 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080125 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110201 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110201 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120201 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120201 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130201 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130201 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140201 Year of fee payment: 6 |
|
| LAPS | Cancellation because of no payment of annual fees |