JPH1127080A - Ceramic device wafer and its production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ceramic device wafer and its production method which can improve the quality and yield of a chip intermediate by contriving the print pattern of a cover resin layer when a chip ceramic electronic parts is produced. SOLUTION: When plural electrical characteristic function parts Q are formed in print patterns on the surface of a ceramic substrate 1 to serve as the individual elements, the print patterns of cover resin layers 6A covering the parts Q are separated from each other for each part Q and also not extended to a cutting part where the parts Q are cut into the individual elements. Then the formed layers 6A are separated from each other for each part Q.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic device wafer used for manufacturing chip ceramic electronic components such as a high-frequency resonator, and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, a ceramic device wafer applied to a chip ceramic electronic component such as a high-frequency resonator is manufactured by a pair of through holes 2 as shown in an example of FIG.
In the electrode forming step, a copper film electrode 3 is formed on the ceramic substrate 1 (large plate) of FIG. 1A by sputtering as shown in FIG. 2B and through holes are formed as shown in FIG. 2, a resist film 4 is formed by printing as shown in FIG. 4D in a predetermined area excluding the through hole 2, and the resist film 4 is further formed on the upper surface thereof as shown in FIG. A thermosetting cover resin layer 6 provided with a hole 5 to be taken out is formed by printing, and after removing the resist film 4 from the hole 5, a sealing resin layer 7 for covering and protecting the whole is overprinted. This is performed by filling and curing, thereby obtaining a ceramic device wafer in which a cavity 8 is formed in a portion where the electrodes 3 are opposed to each other across the substrate 1 as shown in FIG. In FIG. 11, the same parts as those in FIG. It was.).

In the cutting step shown in FIG. 10F, after the sealing resin layer 7 and the like are hardened, the ceramic device wafer is cut into approximately 4.3 mm × by a dicing saw (cutting device).
It is cut into chip elements (chip ceramic electronic parts) 10 having a size of 3.0 mm.

FIG. 12 shows a pattern of a thermosetting cover resin layer 6 formed on a large ceramic substrate 1 by printing. The thermosetting cover resin layer 6 is continuous with a large number of chip element portions. Is formed.

[0005]

However, FIG.
(A) and the thermosetting cover resin layer 6 as in the example of FIG.
In the case of a pattern in which a coating layer composed of the resin layer 7 and the sealing resin layer 7 is continuously applied to the entire surface of the ceramic substrate 1, the cut portions (AA, BB, and CC along the cuts by the dicing saw in FIG. 11) is a cross-sectional view of a part of the ceramic device wafer because all of the portions have the same print pattern as the electrical characteristic function portion Q (the portion where the copper film and the cavity are formed).
(A) Thermosetting cover resin layer 6 and sealing resin layer 7
Is also continuously coated on the adjacent cut portion (P in FIG. 11), and when cutting with a dicing saw into chips, the cut portion P is cut from the resin laminated state on the cutting blade (blade). ) 9 is cut. For this reason, the cutting strength reduces the adhesive strength between the ceramic substrate 1 and the resin bonding surface due to the cutting stress, and the resin layer of the characteristic function portion Q, particularly the cover resin layer 6 which determines the characteristic function, is formed as shown in FIG. After the cutting, the copper film 3, the cavity 8, or the ceramic substrate 1 of the characteristic function portion Q is exposed. For this reason, it has the disadvantage that the characteristics are poor and the yield is poor.

In particular, a cover resin layer 6 for securing a cavity 8 formed after removing the resist film 4 from the hole 5.
Is peeled off by cutting, there arises a problem that the electrical characteristic function portion Q is definitely degraded.

[0007] In view of the above, the present invention provides a high frequency SMD.
When manufacturing chip ceramic electronic components such as a T resonator and a 10.75 MHz chip ceramic filter for PHS, a ceramic device wafer capable of improving the quality and yield of a chip intermediate by devising a printing pattern of a cover resin layer, and the like. It is intended to provide a manufacturing method.

[0008] Other objects and novel features of the present invention will be clarified in embodiments described later.

[0009]

In order to achieve the above object, a ceramic device wafer according to the present invention has a structure in which a plurality of electric characteristic function portions to be individual elements are provided on a ceramic substrate surface. It is characterized in that the cover resin layer covering the characteristic function part is formed separately for each individual electric characteristic function part and does not exist in the cut part.

Further, in the method of manufacturing a ceramic device wafer according to the present invention, in the case where a plurality of electric characteristic function portions to be individual elements are formed on a ceramic substrate surface by a printing pattern, a cover covering each electric characteristic function portion is provided. It is characterized in that the printed pattern of the resin layer is a printed pattern that is separated for each individual electrical characteristic function portion and does not extend to a cut portion for chipping into individual elements.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a ceramic device wafer and a method for manufacturing the same according to the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing a ceramic device wafer according to an embodiment of the present invention, and FIG. 2 is a diagram showing the arrangement of a cavity and a cover resin in a portion to be an individual chip element (chip ceramic electronic component). Reference numeral 7 denotes a process for manufacturing a ceramic device wafer. FIG. 8 is an enlarged view of one block pattern of the print pattern for the cover resin layer that covers (covers) the electrical characteristic function portion of the chip element, and FIG. 9 shows a pair of block patterns of FIG. Is an example of an overall print pattern diagram in which a plurality of portions are formed, and lines AA, BB, and CC are cut portions and some of them are shown.

The manufacturing process will be described with reference to FIGS. FIG.
As shown in FIG. 1, first, a ceramic substrate 1 provided with a through hole 2 is provided.
(Large plate) Electrode 3 of copper film of predetermined pattern in electrode forming process
Is formed by sputtering, and the through-hole 2 is filled to form a predetermined region (the cavity 8 in FIG. 2) excluding the through-hole 2.
The resist film 4 is formed by printing on the ceramic substrate 1, the electrodes 3 and the thermosetting cover resin layer in a region corresponding to (2) as shown in FIG. 4. The print coating of the resist film 4 uses a print pattern such that the resist is printed on the predetermined area.

After the resist film 4 is dried and cured, a printing pattern is used so that the thermosetting cover resin layer 6A is printed at a predetermined position as shown in FIG. Is formed so as not to be applied by printing and to form a hole 5 from which the resist film 4 can be removed. That is, from the enlarged plan view of one element of the print pattern of the thermosetting cover resin layer 6A shown in FIG. 8 and the entire print pattern of the thermosetting cover resin layer 6A for the large ceramic substrate 1 of FIG. As can be seen, the printed pattern of the thermosetting cover resin layer 6A covering the electrical characteristic function part Q of the chip element is cut for separating the individual electric characteristic function part of each element and forming the chip into individual elements. The printed pattern does not extend to the portion. In other words, the block where the print pattern of the thermosetting cover resin layer 6A does not exist in the cut portion (all along AA, BB, CC) by the dicing saw shown in FIG. It is a pattern (a pattern separated from each other as a block).

Therefore, after the thermosetting cover resin layer 6A is cured by heating, the resist film 4 is removed from the hole 5 with a volatile solvent to form a cavity 8, and then the entire surface as shown in FIG. 1A and 7B by coating and sealing the exposed portion of the ceramic substrate 1 in the cut portion P and filling and closing the cutout hole 5 to cure the resin. As described above, a ceramic device wafer having no thermosetting cover resin layer 6A in the cut portion P is obtained.

Since the sealing resin layer 7A is made of an ultraviolet curable resin, it cures at about room temperature, and has a lower strength than the cover resin layer 6A. Therefore, as shown in FIG. When the chip element is to be cut and separated, the cutting operation is facilitated and no cutting stress is applied to the cover resin layer 6A, so that the peeling occurs without reducing the adhesive strength between the ceramic substrate 1 and the cover resin layer 6A. Never.

According to this embodiment, the following effects can be obtained.

(1) As shown in FIG. 1, after the thermosetting cover resin layer 6A is formed so as to cover only the electrical characteristic function portion Q, the sealing resin layer 7A is applied. The resin layer 6A is formed independently for each individual electric characteristic function portion Q, and the cover resin layer 6A is not formed at the cut portion P, and only the sealing resin layer 7A is formed at the cut portion P. The structure is applied on the ceramic substrate 1. Therefore, when cutting the ceramic device wafer of FIG. 1 with the cutting blade 9, the processing is performed without cutting the thermosetting cover resin layer 6A. For this reason, it is possible to mass-produce an electronic component intermediate which is a chip element with good characteristics and uniform quality without adversely affecting the electrical characteristic function part Q.

(2) Since the present invention can be applied to a relatively inexpensive printing machine as a manufacturing facility, the total cost can be reduced.

The present invention is applicable not only to the manufacture of a chip device having one cavity as shown in FIG. 1, but also to a chip device having a plurality of cavities and a plurality of through holes. Obviously, it is also applicable to manufacturing.

Although the case where the number of thermosetting cover resin layers is one has been described, the present invention can be applied to the case where the number of thermosetting cover resin layers is plural.

Although the embodiments of the present invention have been described above, it is obvious to those skilled in the art that the present invention is not limited to the embodiments and that various modifications and changes can be made within the scope of the claims. There will be.

[0023]

As described above, according to the ceramic device wafer and the method of manufacturing the same according to the present invention, since the conventional printed pattern is one in which the cover resin layer is entirely continuous up to the cut portion, the ceramic substrate is cut at the time of cutting. The cover resin layer peeled off, and moisture and the like penetrated into the cavity and the like, and had the disadvantage of deteriorating the characteristics.However, by devising the print pattern of the cover resin layer, the cut resin layer Is not printed and coated, it is possible to realize a chip electronic component having extremely uniform and excellent characteristic quality. Further, since the present invention can be applied to a relatively inexpensive printing machine, the total cost can be reduced.

[Brief description of the drawings]

FIG. 1 is an embodiment of a ceramic device wafer and a method for manufacturing the same according to the present invention, and is a cross-sectional view showing a step of cutting a ceramic device wafer with a cutting blade.

FIG. 2 is a plan view of a portion to be an individual chip element of the ceramic device wafer, in which a sealing resin layer is omitted.

FIG. 3 is a cross-sectional view showing an electrode forming step in the embodiment.

FIG. 4 is a sectional view showing a resist printing step.

FIG. 5 is a cross-sectional view showing a printing step of a thermosetting cover resin layer.

FIG. 6 is a sectional view showing a printing step of the sealing resin.

FIG. 7 is a sectional view showing a step of cutting the ceramic device wafer obtained according to the embodiment.

FIG. 8 is an enlarged plan view of one block pattern, which is an example of a print pattern for a cover resin layer covering an electrical characteristic function portion of a ceramic device wafer according to an embodiment.

FIG. 9 is an overall plan view of a print pattern for a cover resin layer.

FIG. 10 is a schematic diagram illustrating a conventional manufacturing process of a ceramic device wafer.

FIG. 11 is an explanatory sectional view of a conventional ceramic device wafer when it is cut into chip elements.

FIG. 12 is an overall plan view showing a conventional print pattern for a cover resin layer.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ceramic substrate 2 Through hole 3 Electrode 4 Resist film 5 Drilled hole 6, 6A Thermosetting cover resin layer 7, 7A Sealing resin layer 8 Cavity 9 Cutting blade 10 Chip element

Claims (2)

[Claims] In a ceramic device wafer provided with a plurality of electric characteristic function portions to be individual elements on a ceramic substrate surface, a cover resin layer covering each electric characteristic function portion is provided for each electric characteristic function portion. A ceramic device wafer, wherein the ceramic device wafer is formed so as to be separated from the substrate and does not exist in the cut portion. 2. A method for manufacturing a ceramic device wafer in which a plurality of electrical characteristic function portions to be individual elements are formed on a ceramic substrate surface by a print pattern, wherein a print pattern of a cover resin layer covering each electrical characteristic function portion is formed. A method for manufacturing a ceramic device wafer, wherein a printed pattern is formed so as to be separated into individual electric characteristic function portions and not to extend to a cut portion for forming a chip into individual elements.