JP2010147627A - Piezoelectric vibrator and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated body obtained by laminating a three-layer substrate, and a piezoelectric vibrator having a resin member that hardly separates from the laminated body. <P>SOLUTION: The piezoelectric vibrator 100 has a bottom substrate 10, a middle substrate 20 provided on the bottom substrate 10, a top substrate 30 provided on the middle substrate 20, and a resin member 40 covering at least a top surface 30a and a side surface 30b of the top substrate 30, and a side surface 20b of the middle substrate 20, wherein a portion of the resin member 40 exists in an area which is under the bottom surface 30c of the top substrate 30, on the top surface 10a of the bottom surface 10 and on inner side of a contour 30r of the top substrate 30 in a planar view. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a piezoelectric vibrator and a manufacturing method thereof.

  In recent years, with the miniaturization of electronic devices, piezoelectric vibrators such as quartz vibrators are required to be further miniaturized. As a technique for realizing miniaturization of the element, for example, a technique of sealing a quartz substrate having a quartz crystal resonator by sandwiching a quartz substrate having a similar shape from above and below and bonding the three layers of substrates together is proposed. (See Patent Document 1).

  In addition, by applying such a technique, when a quartz substrate having a plurality of quartz resonators is used, a plurality of small piezoelectric devices can be obtained by cutting the substrate after bonding the substrates from above and below. Thus, the number of steps can be reduced.

On the other hand, such a piezoelectric vibrator is sometimes subjected to resin molding for the purpose of protecting the piezoelectric vibrator, for example.
JP 2006-094372 A

  However, when a resin mold is applied to the piezoelectric vibrator, the adhesiveness between the two may be insufficient. The piezoelectric vibrator and the resin mold are made of different materials and have different thermal expansion coefficients. Therefore, when there is a temperature change or the like, the interface is more easily peeled off. When such adhesive shortage or interface peeling (delamination) occurs, the piezoelectric vibrator and the resin mold may be separated.

  An object of some embodiments according to the present invention is to provide a piezoelectric vibrator having a laminate in which three layers of substrates are laminated and a resin member that is difficult to separate from the laminate.

  One of the objects of some embodiments according to the present invention is to provide a method of manufacturing a piezoelectric vibrator in which a resin member that is difficult to separate is formed in a laminate in which three layers of substrates are laminated.

The piezoelectric vibrator according to the present invention is
A lower substrate,
An intermediate substrate provided on the lower substrate and having a vibrating portion;
An upper substrate provided on the intermediate substrate;
A resin member that covers at least the upper surface and the side surface of the upper substrate and the side surface of the intermediate substrate;
Have
A part of the resin member exists in a region below the lower surface of the upper substrate, above the lower surface of the lower substrate, and inside the outline in plan view of the upper substrate.

  Such a piezoelectric vibrator includes a laminate in which three layers of substrates are laminated, and a resin member that is difficult to separate from the laminate.

In the piezoelectric vibrator according to the present invention,
In plan view, the contour of the lower substrate may be outside the contour of the upper substrate.

In the piezoelectric vibrator according to the present invention,
In plan view, the contours of the intermediate substrate and the lower substrate can be matched.

In the piezoelectric vibrator according to the present invention,
In plan view, the contour of the lower substrate may be inside the contour of the intermediate substrate.

The piezoelectric vibrator according to the present invention is
A lower substrate,
An intermediate substrate provided on the lower substrate and having a vibrating portion;
An upper substrate provided on the intermediate substrate;
A resin member that covers at least the upper surface and side surfaces of the upper substrate, the side surfaces of the intermediate substrate, and the side surfaces of the lower substrate;
Have
A part of the resin member exists in a region below the lower surface of the intermediate substrate, above the lower surface of the lower substrate, and inside the contour in plan view of the intermediate substrate.

  Such a piezoelectric vibrator includes a laminate in which three layers of substrates are laminated, and a resin member that is difficult to separate from the laminate.

A method for manufacturing a piezoelectric vibrator according to the present invention includes:
Preparing a lower substrate, an intermediate substrate having a vibrating portion, and an upper substrate;
Laminating the lower substrate, the intermediate substrate, and the upper substrate to form a laminated substrate;
A half dicing step of cutting at least the upper substrate of the laminated substrate and forming a hole communicating from the upper substrate side to the upper surface of the lower substrate;
Providing a resin raw material from the upper substrate side, and forming a resin layer so as to cover the upper surface, the side surface and the lower surface of the upper substrate, the side surface of the intermediate substrate, and the upper surface of the lower substrate;
A dicing step of cutting the lower substrate and the resin layer to form individual pieces;
Have
The thickness of the blade used in the dicing process is thinner than the thickness of the blade used in the half dicing process.

  In this way, it is possible to easily manufacture a piezoelectric vibrator in which a resin member that is difficult to separate into a laminated body in which three layers of substrates are laminated is formed.

In the method for manufacturing a piezoelectric vibrator according to the present invention,
The intermediate substrate has a plate-like frame portion,
In the half dicing step, the upper substrate and the frame portion can be cut to form a hole that communicates from the upper substrate side to the upper surface of the lower substrate.

A method for manufacturing a piezoelectric vibrator according to the present invention includes:
Preparing a lower substrate, an intermediate substrate having a vibrating portion, and an upper substrate;
Laminating the lower substrate, the intermediate substrate, and the upper substrate to form a laminated substrate;
Cutting the laminated substrate from the upper substrate side to form a first groove, and a first half dicing step;
Applying a resin raw material from the upper substrate side and forming a first resin layer on the upper surface of the upper substrate and in the first groove;
A second half dicing step of cutting the laminated substrate from the lower substrate side and forming a second groove exposing the first resin layer on the lower substrate side;
Applying the resin raw material from the lower substrate side and forming a second resin layer continuous with the first resin layer inside the second groove;
A dicing step of cutting the first resin layer and the second resin layer to form individual pieces;
Have
The thickness of the blade used in the first half dicing step is thinner than the thickness of the blade used in the second half dicing step,
The thickness of the blade used in the dicing process is thinner than the thickness of the blade used in the first half dicing process.

  In this way, it is possible to easily manufacture a piezoelectric vibrator in which a resin member that is difficult to separate into a laminated body in which three layers of substrates are laminated is formed.

In the method for manufacturing a piezoelectric vibrator according to the present invention,
The intermediate substrate has a plate-like frame portion,
In the first half dicing step, the upper substrate and the frame portion may be cut to form a hole that communicates from the upper substrate side to the upper surface of the lower substrate.

  Preferred embodiments of the present invention will be described below with reference to the drawings. The following embodiment will be described as an example of the present invention.

1. Piezoelectric Vibrator FIG. 1 is a cross-sectional view schematically showing an example of a piezoelectric vibrator 100 according to the present embodiment. FIG. 2 is a plan view schematically showing the piezoelectric vibrator 100. 1 and 2, the details of the intermediate substrate 20 are omitted.

  The piezoelectric vibrator 100 includes a lower substrate 10, an intermediate substrate 20, an upper substrate 30, and a resin member 40.

1.1. Lower substrate and upper substrate The lower substrate 10 is a substrate provided below the piezoelectric vibrator 100 of the present embodiment. An intermediate substrate 20 is provided on the lower substrate 10. The planar shape of the lower substrate 10 can be a rectangle as shown in FIG. 2, for example. The shape of the lower substrate 10 can have a flat plate shape as shown in FIG. 1 when the intermediate substrate 20 has a step structure described later. Further, when the intermediate substrate 20 does not have a step structure, even if a concave portion is appropriately formed on the upper surface 10a of the lower substrate 10 so as not to hinder the operation of the piezoelectric vibrating portion 21 formed on the intermediate substrate 20. Good. The lower substrate 10 and the intermediate substrate 20 can be laminated so as to have an annular contact surface when seen in a plan view. The upper surface 10a of the lower substrate 10 can serve as a lower wall of a cavity formed inside when the intermediate substrate 20 and the upper substrate 30 are stacked.

  The upper substrate 30 is provided on the intermediate substrate 20. The planar shape of the upper substrate 30 can be, for example, a rectangular shape as shown in FIG. The shape of the upper substrate 30 can have a flat plate shape as shown in FIG. 1 when the intermediate substrate 20 has a step structure described later. In addition, when the intermediate substrate 20 does not have a step structure, a concave portion may be appropriately formed on the lower surface 30c of the upper substrate 30 so as not to hinder the operation of the piezoelectric vibrating portion 21 formed on the intermediate substrate 20. The upper substrate 30 and the intermediate substrate 20 can be laminated so as to have an annular contact surface when seen in a plan view. The lower surface 30c of the upper substrate 30 can be an upper wall of a cavity formed inside when the intermediate substrate 20 and the lower substrate 10 are stacked.

  Thus, the lower substrate 10 and the upper substrate 30 are provided so as to sandwich the intermediate substrate 20 therebetween. A cavity is formed inside the three stacked substrates. This cavity is a space for operating the piezoelectric vibrating portion 21 formed in the intermediate substrate 20. Moreover, since this cavity can be sealed, the piezoelectric vibration part 21 can be installed in a decompression space or an inert gas atmosphere.

  The material of the lower substrate 10 and the upper substrate 30 is not particularly limited as long as it is an insulating material, and quartz, glass, or the like can be used. The material of the lower substrate 10 and the upper substrate 30 is preferably a material having the same thermal expansion coefficient as that of the intermediate substrate 20, and preferably the same material as that of the intermediate substrate 10. Therefore, for example, when the intermediate substrate 20 is made of quartz, the lower substrate 10 and the upper substrate 30 are preferably made of quartz.

1.2. Intermediate Substrate FIGS. 3 and 4 are a top view and a bottom view schematically showing an example of the intermediate substrate 20 used in the piezoelectric vibrator 100 according to the present embodiment. 5 to 7 are cross-sectional views schematically showing the intermediate substrate 20 according to the present embodiment, and FIG. 5 is a schematic view corresponding to the IIA-IIA cut surface in FIGS. 3 and 4. FIG. 7 is a schematic diagram corresponding to the IIB-IIB cut surface in FIGS. 3 and 4, and FIG. 7 is a schematic diagram corresponding to the IIC-IIC cut surface in FIGS. 3 and 4.

  The intermediate substrate 20 is provided on the lower substrate 30. The intermediate substrate 20 is provided under the upper substrate 30. That is, the intermediate substrate 20 is provided so as to be sandwiched between the lower substrate 10 and the upper substrate 30. The intermediate substrate 20 has a piezoelectric vibration part 21. As long as the piezoelectric vibrator 100 has a configuration in which the intermediate substrate 20 is sandwiched between the lower substrate 10 and the upper substrate 30, the piezoelectric vibrating portion 21 may be any vibrating piece. Examples of the mode of the vibrating piece of the piezoelectric vibrating unit 21 include an AT vibrating piece, a tuning fork type vibrating piece, and a walk type vibrating piece. In the present embodiment, an example in which an AT vibrating piece is formed as the piezoelectric vibrating portion 21 on the intermediate substrate 20 is illustrated.

  As shown in the figure, the intermediate substrate 20 includes, for example, a piezoelectric vibration part 21, a frame part 22 that surrounds the piezoelectric vibration part 21, and connection parts 25 a and 25 b that connect the piezoelectric vibration part 21 and the frame part 22, The first excitation electrode 50 provided on the upper surface of the piezoelectric vibration part 21, the second excitation electrode 52 provided on the lower surface of the piezoelectric vibration part 21, and the first wiring electrically connected to the first excitation electrode 50 54 and a second wiring 56 electrically connected to the second excitation electrode.

  The intermediate substrate 20 may have a step structure or an inclined structure. For example, as shown in FIGS. 5 to 7, the region of the frame portion 22 of the intermediate substrate 20 is thicker in the vertical direction (thickness direction), and gradually becomes thinner from the frame portion 22 toward the inside. Can be formed thinner than other portions. On the other hand, the connecting portions 25a and 25b may have the same thickness as the piezoelectric vibrating portion 21, or may gradually increase in thickness on the upper and lower surfaces of the intermediate substrate 20 from the piezoelectric vibrating portion 21 to the frame portion 22. Further, the piezoelectric vibrating portion 21 can be positioned at the center in the vertical direction of the frame portion 22 when adopting a step structure. If the intermediate substrate 20 has such a step structure or an inclined structure, even if the lower substrate 10 and the upper substrate 30 have a flat plate shape, a cavity is formed between the lower substrate 10 and the upper substrate 30. It can be formed, and the piezoelectric vibration part 21 can vibrate without interfering with other members.

  Further, the intermediate substrate 20 may not have a step structure or the like. In the case where the intermediate substrate 20 does not have a step structure or the like, a cavity can be formed when stacked by providing concave portions on the surfaces of the lower substrate 10 and the upper substrate 30 that are in contact with the intermediate substrate 20. Thereby, the vibration of the piezoelectric vibration part 21 can be enabled. In the following description, the case where the intermediate substrate 20 has a step structure will be described with reference to FIGS.

  The intermediate substrate 20 has a C-shaped slit 26a as illustrated in the drawing so that the region other than the connection portions 25a and 25b does not contact the piezoelectric vibration portion 21. In the intermediate substrate 20, a region inside the slit 26 a functions as the piezoelectric vibrating portion 21, and a region outside the slit 26 a functions as the frame portion 22 for joining to the lower substrate 10 and the upper substrate 30. A slit 26b is formed between the connection portions 25a and 25b provided at two places. As described above, the piezoelectric vibration portion 21 has a cantilever shape in which one of the two end portions in the −X-axis direction is supported by the connection portions 25a and 25b. As a result, the piezoelectric vibrating portion 21 is held in the cavity formed between the lower substrate 10 and the upper substrate 30, and the piezoelectric vibrating portion 21 can vibrate.

  The frame portion 22 is formed in an annular shape on the outer periphery of the intermediate substrate 20. The frame portion 22 can have a first recess 28 a and a second recess 28 b that communicate from the inside to the outside of the frame portion 22. When these recesses are provided, wirings and the like can be arranged in the recesses, and can be used for electrical connection with the outside of the piezoelectric vibrator 100. In the illustrated example, the first recess 28 a and the second recess 28 b are provided on the lower surface of the frame portion 22 and at positions facing each other with the piezoelectric vibrating portion 21 interposed therebetween. Specifically, the second recess 28 b is provided on the connection portion 25 a side in the frame portion 22, and the first recess 28 a is provided at a position facing the second recess 28 b with the piezoelectric vibrating portion 21 interposed therebetween. When these concave portions are formed, the surface of the frame portion 22 can be made flat (level) by filling each concave portion with a wiring or a resin as necessary.

  The material of the intermediate substrate 20 can be made of a piezoelectric material such as quartz, lithium tantalate, or lithium niobate. Since the piezoelectric vibrating portion 21 is formed integrally with the intermediate substrate 20 as described above, it can be made of the same material as the intermediate substrate 20. The piezoelectric vibrating portion 21, the connecting portions 25a and 25b, and the frame portion 22 are preferably made of a quartz substrate. For example, an AT-cut made by rotating and cutting a substrate surface parallel to the X axis and around the X axis. A quartz substrate is more preferable.

  The first excitation electrode 50 is provided on the upper surface of the piezoelectric vibrating portion 21. The second excitation electrode 52 is provided on the lower surface of the piezoelectric vibration unit 21. The first excitation electrode 50 is drawn out by the first wiring 54 provided on the connection portion 25 a and extends to the inner side surface of the frame portion 22. The first wiring 54 is further provided so as to go around the piezoelectric vibrating portion 21, and passes through the inner surface of the lower surface of the frame portion 22 on the side facing the side where the connecting portions 25 a and 25 b are provided. Extending into the first recess 28a. The second excitation electrode 52 is drawn out by the second wiring 56 provided on the lower surface of the connection portion 25b and extends to the inner side surface of the frame portion 22. The second excitation electrode 52 is the lower surface of the frame portion 22, and the connection portions 25a and 25b are connected to each other. It extends into the second recess 28b through the inner surface on the provided side.

  Examples of the material of the first excitation electrode 50, the second excitation electrode 52, the first wiring 54, and the second wiring 56 include a multilayer structure in which a Cr film is used as a base and an Au film is formed thereon. .

1.3. Laminate The lower substrate 10, the intermediate substrate 20, and the upper substrate 30 are laminated and bonded together to form a laminate. The lower substrate 10 and the intermediate substrate 20 and the upper substrate 30 and the intermediate substrate 20 can be bonded using, for example, plasma welding, seam welding, ultrasonic bonding, an adhesive, or the like. The adhesion between the substrates exemplified here is relatively stronger than the adhesion between each substrate and the resin member 40. Therefore, the adhesive strength between the substrates is larger than the adhesive strength between the resin member 40 and each substrate described below. Therefore, when an external force that peels each member is applied to the piezoelectric vibrator 100, it can be considered that the peeling between the resin member 40 and each substrate occurs in preference to the peeling between the substrates.

1.4. Resin Member The resin member 40 is provided so as to cover at least the upper surface 30 a and the side surface 30 b of the upper substrate 30 and the side surface 20 b of the intermediate substrate 20. In the example shown in FIG. 1, the resin member 40 covers the upper surface 30 a, the side surface 30 b and the lower surface 30 c of the upper substrate 30, the side surface 10 b of the intermediate substrate 20, and the upper surface 10 a of the lower substrate 10. One function of the resin member 40 is to protect each substrate from an impact applied from the outside by covering each substrate. Further, the resin member 40 can have a function of sealing (molding) the piezoelectric vibrator 100.

  As shown in FIG. 1, the resin member 40 is below the lower surface 30 c of the upper substrate 30, above the lower surface 10 c of the lower substrate 10, and inside the contour 30 r in plan view of the upper substrate 10. It is provided so that a part of the resin member 40 exists in the region. Hereinafter, a part of the resin member 40 may be referred to as a “claw 42”. Such a claw 42 of the resin member 40 has a role of a claw (claw) that resists removal against an external force that removes the resin member 40 from the piezoelectric vibrator 100. Therefore, the presence of the claws 42 on the resin member 40 makes it difficult for the resin member 40 covering each substrate to come off the piezoelectric vibrator 100. That is, the resin member 40 is difficult to separate from the laminate in which the three layers of the lower substrate 10, the intermediate substrate 20, and the upper substrate 30 are laminated. Even if the interface between the resin member 40 and each substrate is peeled off due to a temperature change or the like, the resin member 40 can be prevented from coming off the piezoelectric vibrator 100.

  The shape and planar arrangement of the claw 42 will be described with reference to FIGS. 1, 2, 8, and 9. FIG. 8 is a cross-sectional view schematically illustrating an example of the piezoelectric vibrator 100 according to the present embodiment, and illustrates the claw 42. FIG. 9 is a plan view schematically showing an example of the piezoelectric vibrator 100 according to the present embodiment, and illustrates the claw 42.

  In the example of FIG. 1, the shape of the claw 42 is a shape having the same thickness as the thickness of the intermediate substrate 20 (the thickness of the frame portion 22), but is not limited to this, and the two types of examples shown in FIG. As described above, the notch 62 may be provided in a part of the side surface of the intermediate substrate 20, and the claw 42 may be formed by filling a part of the resin member 40 in the notch 62. Such a shape of the claw 42 can be applied to any aspect in the present specification.

  Further, as a planar arrangement of the claws 42, the above effect can be obtained as long as at least one place is formed in a region inside the outline 30 r in a plan view of the upper substrate 30. It is more preferable that the claws 42 are formed at two or more locations in a region inside the contour 30r in plan view of the upper substrate 30. Specifically, as illustrated in FIG. 9, the claws 42 can be formed in two places. Further, when the claw 42 is formed at two places, it is more preferable that the claw 42 is formed at a position facing one claw 42 when the resin member 40 is viewed in a plan view, as shown in FIG. Moreover, as a planar arrangement | positioning of the nail | claw 42, you may form so that the circumference | surroundings of the intermediate substrate 20 may be surrounded so that it may illustrate in FIG. According to the claw 42 having the shape and arrangement exemplified above, it is possible to achieve an effect that the resin member 40 is hardly detached from each substrate. Such a planar arrangement of the claws 42 can be applied to any aspect in the present specification.

  On the other hand, the resin member 40 can also be provided so as to cover at least the upper surface 30 a and the side surface 30 b of the upper substrate 30, the side surface 20 b of the intermediate substrate 20, and the side surface 10 b of the lower substrate 10. 10 to 13 are cross-sectional views schematically showing examples of the piezoelectric vibrator 100 according to the present embodiment. 10 to 13 cover at least the upper surface 30a and the side surface 30b of the upper substrate 30, the side surface 20b of the intermediate substrate 20, and the side surface 10b of the lower substrate 10. In these examples, in the example shown in FIG. 10, the resin member 40 includes the upper surface 30 a and the side surface 30 b of the upper substrate 30, the side surface 20 b and the lower surface 20 c of the intermediate substrate 20, and the side surface 10 b of the lower substrate 10. Covered. In the example shown in FIG. 10, the resin member 40 is below the lower surface 20 c of the intermediate substrate 20, above the lower surface 10 c of the lower substrate 10, and inside the contour 20 r in plan view of the intermediate substrate 20. It is provided so that a part of the resin member 40 exists in the region. Also in this example, a part of the resin member 40 (claw 42) may have a role of a claw (claw) that resists removal against an external force that removes the resin member 40 from the piezoelectric vibrator 100. it can. The shape and planar arrangement of the claw 42 in this example can be the same as described above. In the piezoelectric vibrator 100 illustrated in FIGS. 11 to 13, the resin member 40 is below the lower surface 20 c of the intermediate substrate 20, above the lower surface 10 c of the lower substrate 10, and at the intermediate substrate 20. Is provided so that a part (claw 42) of the resin member 40 exists in a region inside the outline 20r in a plan view.

  The material of the resin member 40 is not particularly limited as long as it is a material that can protect the laminated body made of each substrate from impact or the like, that is, a material that is less rigid than each substrate. Examples of such a material include an epoxy resin and a polyimide resin.

  When the resin member 40 functions as a sealing material (mold), the resin member 40 is provided in close contact with at least the upper surface and the side surface of the upper substrate 30 and the side surface of the intermediate substrate 20. Therefore, the shape of the claw 42 of the resin member 40 depends on the outer shapes of the lower substrate 10, the intermediate substrate 20, and the upper substrate 30. The examples of FIGS. 11 to 13 will be described together with the shapes of the lower substrate 10, the intermediate substrate 20, and the upper substrate 30 in the next section.

1.5. The shape of the lower substrate, the intermediate substrate, and the upper substrate The lower substrate 10, the intermediate substrate 20, and the upper substrate 30 of the piezoelectric vibrator 100 have the following shapes in order to form the claws 42 on the resin member 40. be able to. Hereinafter, the relationship between the shape of the resin member 40 and the shapes of the upper substrate 30, the intermediate substrate 20, and the lower substrate 10 will be described. In addition, about the shape and planar arrangement | positioning of the nail | claw 42 in the resin member 40, it is as above-mentioned and abbreviate | omits description.

  First, the claw 42 is provided in a region where the resin member 40 is above the lower surface 10 c of the lower substrate 10, below the lower surface 30 c of the upper substrate 30, and inside the contour 30 r in plan view of the upper substrate 10. The case of having Examples of this include the piezoelectric vibrator 100 shown in FIGS. 1, 8, 11, and 12. In these piezoelectric vibrators 100, the claws 42 of the resin member 40 are formed on the side of the intermediate substrate 20. That is, the outline 20 r of the intermediate substrate 20 is formed inside the outline 30 r of the upper substrate 30.

  In the piezoelectric vibrator 100 illustrated in FIG. 1, FIG. 8, FIG. 11, and FIG. 12, the claw 42 is formed on the side of the intermediate substrate 20. It becomes difficult to come off from the laminate. Therefore, in this case, the shape of the lower substrate 10 is arbitrary. For example, in plan view, the contour 10r of the lower substrate 10 can be outside the contour 30r of the upper substrate 30 (see FIGS. 1, 2, and 8). Further, the contour 10r of the lower substrate 10 can be matched with the contour 20r of the intermediate substrate 20 (see FIG. 11). Further, the contour 10r of the lower substrate 10 can be inside the contour 20r of the intermediate substrate 20 (see FIG. 12). The size of the lower substrate 10 can be appropriately set according to the purpose of reducing the number of dicing steps in the manufacturing process of the piezoelectric vibrator 100, for example.

  Next, the resin member 40 is located in a region above the lower surface 10 c of the lower substrate 10, below the lower surface 20 c of the intermediate substrate 20, and inside the contour 20 r in the plan view of the intermediate substrate 20. The case of having 42 (FIGS. 10, 12, 13, etc.) will be described. In the piezoelectric vibrator 100 illustrated in FIGS. 10, 12, and 13, the claw 42 of the resin member 40 is formed on the side of the lower substrate 10.

  In the piezoelectric vibrator 100 illustrated in FIGS. 10, 12, and 13, the claw 42 is formed on the side of the lower substrate 10, so that the claw 42 covers the intermediate substrate 20, and the resin member 40 is laminated. It is hard to come off from. Therefore, in this case, the shape of the upper substrate 30 is arbitrary. For example, in plan view, the contour 30r of the upper substrate 30 can be outside the contour 20r of the intermediate substrate 20 (see FIG. 12). Further, the contour 30r of the upper substrate 30 can be coincident with the contour 20r of the intermediate substrate 20 (see FIG. 10). Further, the contour 30r of the upper substrate 30 can be coincident with the contour 10r of the lower substrate 10 (see FIG. 13). The size of the upper substrate 30 can be appropriately set according to the purpose of reducing the number of dicing steps in the manufacturing process of the piezoelectric vibrator 100, for example.

  As described above, the piezoelectric vibrator 100 according to the present embodiment includes the resin member 40 having the claw 42 on at least one of the intermediate substrate 20 and the upper substrate 30. That is, it is a structure in which the laminated body in which the three substrates of the lower substrate 10, the intermediate substrate 20, and the upper substrate 30 are laminated and the resin member 40 are difficult to separate. As a result, the piezoelectric vibrator 100 is difficult to separate the resin member 40 even if peeling occurs at the interface between the substrate and the resin member 40 due to, for example, a temperature change. Therefore, the piezoelectric vibrator 100 according to the present embodiment has high reliability.

2. Method for Manufacturing Piezoelectric Vibrator A method for manufacturing the piezoelectric vibrator 100 according to the present embodiment will be described. 14 to 24 are schematic views showing the manufacturing process of the piezoelectric vibrator 100 according to the present embodiment. In this embodiment, the case where each board | substrate of the piezoelectric vibrator 100 consists of quartz is illustrated.

2.1. First Mode First, a process of manufacturing the piezoelectric vibrator 100 (FIGS. 1, 8, etc.) in which the resin member 40 exists only above the upper surface of the lower substrate 10 will be described. The manufacturing method of the piezoelectric vibrator 100 according to this aspect includes a step of preparing a lower substrate, an intermediate substrate having a vibration unit, and an upper substrate, a step of forming a laminated substrate, a half dicing step, and a resin layer. A process and a dicing process.

2.1.1. Step of preparing the lower substrate, the intermediate substrate having the vibration part, and the upper substrate Hereinafter, the lower substrate 10, the intermediate substrate 20 having the vibration part 21, and the quartz substrate from which each of the upper substrate 30 is cut out, respectively, These are referred to as side crystal plate 110, intermediate crystal plate 120, and upper crystal plate 130.

  FIG. 14 is a schematic view of each crystal plate, and is a schematic view showing how these crystal plates are stacked. In this step, a lower crystal plate 110 (lower substrate), an intermediate crystal plate 120 (intermediate substrate), and an upper crystal plate 130 (upper substrate) are prepared. The lower crystal plate 110, the intermediate crystal plate 120, and the upper crystal plate 130 have a structure in which a plurality of lower substrates 10, intermediate substrates 20, and upper substrates 30 are arranged in a plurality of rows and columns, respectively. The number of substrates arranged on each quartz plate is arbitrary. The number of substrates arranged on one quartz plate is preferably the same as the number of substrates arranged on another quartz plate.

  The lower crystal plate 110 and the upper crystal plate 130 can be cut to form the lower substrate 10 and the upper substrate 30 described in the section “1.1. Lower substrate and upper substrate”. The lower crystal plate 110 and the upper crystal plate 130 are formed with a hole for decompressing a cavity formed inside each crystal plate and a hole for connecting an electrode to the outside. May be.

  FIG. 15 is a schematic view showing the lower surface of the intermediate crystal plate 120. FIG. 16 is a cross-sectional view schematically showing the intermediate crystal plate 120. 16 corresponds to a cross section taken along line VV in FIG. The intermediate crystal plate 120 can be cut to form the intermediate substrate 20 described in “1.2. Intermediate substrate”. As shown in FIG. 15, the intermediate crystal plate 120 includes a piezoelectric vibrating portion 21, connecting portions 25 a and 25 b, a first excitation electrode 50, a second excitation electrode 52, a first wiring 54, and a second wiring 56. And a frame portion 22 formed around the piezoelectric vibration portion 21 and a plurality of regions (regions that become the intermediate substrate 20 when cut). The region to be the intermediate substrate 20 can be arranged in a plurality of rows and a plurality of columns on the intermediate crystal plate 120, for example.

  In this aspect, the outer periphery of the frame portion 22 of the intermediate substrate 20 is formed apart from the outer periphery of the upper substrate 30, that is, the ends of the cutting lines L 31 and L 32 of the upper crystal plate 130. The frame part 22 has the connection part 122 which connects both between the frame parts 22 arranged adjacently. The connecting portion 122 has a function of allowing the intermediate crystal plate 120 to be handled as a single member. The connection part 122 may be formed in the whole area | region between the frame part 22 and the frame part 22 adjacent, for example like the connection part 122a shown in FIG. In this case, the thickness of the connecting part 122 can be formed thinner than the thickness of the frame part 22. Moreover, like the connection part 122b shown in FIG. 15, the connection part 122 is formed in a part of area | region between the frame part 22 and the adjacent frame part 22, and other than the connection part 122b in this area | region. The intermediate crystal plate 120 may be removed. In this case, the connection part 122b may be formed in the same thickness as the frame part 22.

  An example of a method for manufacturing the intermediate crystal plate 120 of this aspect will be described. First, a quartz plate is prepared, and a region where the piezoelectric vibrating portion 21 is formed and, if necessary, a region between the frame portion 22 and the adjacent frame portion 22 are thinned to form a step structure. This step can be performed by wet etching, for example, by photolithography.

  Next, in the thinned region, the crystal in the region other than the region that becomes the slits 26a and 26b and the region that becomes the connecting portion 122b between the frame portion 22 and the adjacent frame portion 22 is removed if necessary. The piezoelectric vibrating part 21 and the frame part 22 are formed. This step can be performed, for example, by wet etching using a photolithography technique.

  Next, the first excitation electrode 50, the second excitation electrode 52, the first wiring 54, and the second wiring 56 are formed by, for example, etching using a photolithography technique, vapor deposition, or sputtering. At this time, the frequency of the piezoelectric vibration part 21 can be adjusted as needed. The frequency can be adjusted, for example, by changing the thickness of the first excitation electrode 50 or the second excitation electrode 52 while detecting the frequency by vibrating the piezoelectric vibrating portion 21.

  The intermediate crystal plate 120 can be manufactured through the above steps, and an intermediate crystal plate 120 (intermediate substrate) having a vibrating part is prepared.

2.1.2. Cutting Line As illustrated in FIG. 14, the cutting lines in each quartz plate are provided in an orthogonal lattice shape. In this example, the center line of the cutting line of each crystal plate coincides when the crystal plates are stacked in a plan view. The width of the cutting line corresponds to the thickness of the blade during dicing.

  In this embodiment, the cutting lines L11 and L12 in the lower crystal plate 110 are narrower than the cutting lines L31 and L32 in the upper crystal plate 130 and the cutting lines L21 and L22 in the intermediate crystal plate 120.

  In this aspect, the cutting lines L31 and L32 in the upper crystal plate 130 have the same width as the cutting lines L21 and L22 of the intermediate crystal plate 120. However, the cutting lines L31 and L32 are provided apart from the outer periphery of the frame portion 22 of the intermediate crystal substrate 120 in plan view.

  The cutting lines L21 and L22 in the intermediate crystal plate 120 are provided in a region between the frame portion 22 and the adjacent frame portion 22. Therefore, the resin member 40 having the claw 42 can be formed through a subsequent process. In other words, in the intermediate crystal plate 120, there is a gap between the frame portion 22 and the ends of the cutting lines L21 and L22. Therefore, the resin can enter the gap in a later step, and the claw 42 can be formed on the side of the intermediate substrate 20.

2.1.3. Step of Forming Laminated Substrate In this step, the laminated crystal substrate 110 is formed by laminating the lower crystal plate 110 (lower substrate), the intermediate crystal plate 120 (intermediate substrate), and the upper crystal plate 130 (upper substrate). FIG. 17 is a perspective view schematically showing the multilayer substrate 200 of this aspect. In this step, the cutting lines of the quartz plates are laminated so as to overlap each other. It is preferable to apply plasma welding for the bonding between the quartz plates. Specifically, at least one of the two crystal plates to be bonded is irradiated with plasma to activate the bonded portion. Thereafter, by bonding the two substrates together at room temperature and joining them, it is possible to reduce the generation of stress due to heating and form a laminate with a stable frequency. By this step, it is possible to form a laminated substrate 200 having a plurality of piezoelectric vibrating portions 21 inside and three crystal plates laminated.

2.1.4. Half Dicing Step Next, at least the upper crystal plate 130 (upper substrate) of the multilayer substrate 200 is cut to form a hole that communicates from the upper substrate side to the upper surface of the lower crystal plate 110 (lower substrate). FIG. 18 is a cross-sectional view schematically showing this step. As shown in FIG. 18, the upper crystal plate 130 is cut by half dicing to form the upper substrate 30. Here, half dicing refers to dicing (cutting) halfway in the thickness direction of the cutting target without cutting the cutting target (here, the laminated substrate 200) and forming individual pieces. In this step, as long as the lower crystal plate 110 is not cut, half dicing can be performed to an arbitrary position in the thickness direction of the multilayer substrate 200. This step can be performed by a general dicing apparatus. The thickness of the blade at the time of dicing coincides with the width of the cutting line.

  After this step, at least the crystals in the cutting lines L31 and L32 of the upper crystal plate 130 are removed. Thereby, a hole communicating from the upper substrate side to the upper surface of the lower crystal plate 110 (lower substrate) is formed. As long as a hole communicating from the upper substrate side to the upper surface of the lower crystal plate 110 (lower substrate) is formed, the intermediate crystal plate 120 may not be cut. In this process, at least the lower crystal plate 110 is not cut, so that the multilayer substrate 200 can be easily handled in the subsequent processes.

  FIG. 19 is a cross-sectional view showing a state in which the connecting portion of the intermediate crystal plate 120 is formed in the entire region between adjacent frame portions 22 like the connecting portion 122a shown in FIG. In the case of the intermediate crystal plate 120 having such a connecting portion 122a, the intermediate crystal plate 120 (connecting portion 122a) is cut in addition to the upper crystal plate 130 in this half dicing step. FIG. 19 shows a state where a part of the connecting part 122a is removed, and the connecting part 122c in the region surrounded by the imaginary line is removed. In this way, it is possible to form a hole that communicates from the upper substrate side to the upper surface of the lower crystal plate 110 (lower substrate).

2.1.5. Step of Forming Resin Layer Next, a resin raw material is applied from the upper substrate 30 side, and the upper surface 30a, the side surface 30b and the lower surface 30c of the upper substrate 30, the side surface 20b of the intermediate substrate 20, and the upper surface 10a of the lower substrate 10 Then, a resin layer 40a is formed so as to cover. FIG. 20 is a cross-sectional view schematically showing a state where the resin layer 40a is formed. The resin raw material is not limited as long as it has fluidity, and examples thereof include an epoxy resin precursor. This step can be performed, for example, by applying a resin material to the upper substrate 30 side. The application method is not particularly limited. This step can be performed by placing the laminated substrate 200 in a reduced pressure state. In this way, it is possible to more reliably allow the resin raw material to enter the hole communicating from the upper substrate side to the upper surface of the lower crystal plate 110 (lower substrate). In this step, after the resin raw material is applied, the resin layer 40a is formed by performing a curing reaction, for example, by heating.

2.1.6. Dicing Step Next, the lower crystal plate 110 (lower substrate) and the resin layer 40a are cut to form individual pieces of the piezoelectric vibrator 100. This step is performed by removing the members (lower crystal plate 110 and resin layer 40a) inside the cutting lines L11 and L12 of the lower crystal plate 110 (see FIG. 20). In this step, the multilayer substrate 200 is cut, and the piezoelectric vibrator 100 (see FIGS. 1 and 8, etc.) in which the resin member 40 exists only above the upper surface of the lower substrate 10 is formed. This step can be performed by a general dicing apparatus.

  The thickness of the blade at the time of dicing coincides with the width of the cutting line. The thickness of the blade of the dicing apparatus used in this step is thinner than the thickness of the blade of the dicing apparatus used in “2.1.3. Half dicing step”. In this step, by using such a blade, the piezoelectric vibrator 100 in which the resin member 40 is formed on the side of the intermediate substrate 20 and the upper substrate 30 can be formed. In addition, the strength of the resin member 40 increases as the thickness of the blade used in this process decreases.

  As described above, the piezoelectric vibrator 100 (FIG. 1, FIG. 8, etc.) in which the resin member 40 exists only above the upper surface of the lower substrate 10 according to the first aspect can be manufactured. According to the method for manufacturing a piezoelectric vibrator of this aspect, it is possible to easily manufacture a piezoelectric vibrator in which a resin member that is difficult to separate into a laminate in which three layers of substrates are stacked is formed.

2.2. Second Aspect Next, a process of manufacturing the piezoelectric vibrator 100 (FIGS. 10 to 13 and the like) in which the resin member 40 exists on the side of the lower substrate 10 will be described. The method for manufacturing the piezoelectric vibrator 100 according to this aspect includes a step of preparing a lower substrate, an intermediate substrate having a vibrating portion, and an upper substrate, a step of forming a laminated substrate, a first half dicing step, and a first resin. A layer forming step, a second half dicing step, a second resin layer forming step, and a dicing step.

2.2.1. Step of Preparing Lower Substrate, Intermediate Substrate Having Vibrating Unit, and Upper Substrate This step prepares “2.1.1. Lower Substrate, Intermediate Substrate Having Vibrating Unit, and Upper Substrate of First Mode” Since this is the same as the “step to perform”, the description thereof is omitted.

2.2.2. Cutting Line As illustrated in FIG. 21, also in this embodiment, cutting lines in each quartz plate are provided in an orthogonal lattice shape. Also in this example, the center line of the cutting line of each crystal plate coincides when the crystal plates are laminated in a plan view. The width of the cutting line corresponds to the thickness of the blade during dicing.

  The cutting lines L11 and L12 in the lower crystal plate 110 are thicker than at least one of the cutting lines L21 and L22 in the intermediate crystal plate 120 and the cutting lines L31 and L32 in the upper crystal plate 130. Therefore, the resin member 40 having the claw 42 can be formed through a subsequent process.

  The thickness of the cutting lines L31 and L32 in the upper crystal plate 130 is not particularly limited when the cutting lines L11 and L12 of the lower crystal plate 110 are thicker than the cutting lines L21 and L22 of the intermediate crystal plate 120. In this case, the cutting lines L31 and L32 of the upper crystal plate 130 can coincide with the cutting lines L21 and L22 of the intermediate crystal plate 120.

  The cutting lines L31 and L32 in the upper crystal plate 130 are the cutting lines L21 and L12 in the lower crystal plate 110 when the cutting lines L11 and L12 in the lower crystal plate 110 are narrower than the cutting lines L21 and L22 in the intermediate crystal plate 120. , L22 is provided narrower than L22. In this case, the cutting lines L31 and L32 of the upper crystal plate 130 can coincide with the cutting lines L11 and L12 of the lower crystal plate 110, for example.

  The thicknesses of the cutting lines L21 and L22 in the intermediate crystal plate 120 are appropriately set depending on the thicknesses of the cutting lines of the lower crystal plate 110 and the upper crystal plate 130.

2.2.3. Step of Forming Multilayer Substrate Since this step is the same as “2.1.3. Step of Forming Multilayer Substrate” in the first aspect, description thereof is omitted.

2.2.4. First Half Dicing Step In this step, the upper crystal plate 130 (upper substrate) side of the laminated substrate 200 is cut to form the first groove 70. Since this step is the same as the “2.1.4. Half dicing step” of the first aspect, detailed description thereof is omitted. In this step, as long as the lower crystal plate 110 is not cut, half dicing can be performed to an arbitrary position in the thickness direction of the multilayer substrate 200. By this step, for example, the structure shown in FIG. 22 is formed. The thickness of the blade of the dicing apparatus used in this step is thinner than the thickness of the blade used in the second half dicing step described later. Thereby, the claw 42 can be formed in the resin member 40. Further, in this step, since the multilayer substrate 200 is not cut, the multilayer substrate 200 can be easily handled in the subsequent steps.

2.2.5. Step of Forming First Resin Layer Next, as shown in FIG. 23, the first resin layer 40 b is formed on the upper surface of the upper substrate 30 and inside the first groove 70. Since this step is substantially the same as “2.1.5. Step of forming resin layer” in the first aspect, detailed description thereof is omitted. This step can be performed by placing the laminated substrate 200 in a reduced pressure state. In this way, the resin raw material can be more reliably penetrated into the first groove 70 formed by the first half dicing.

2.2.6. Second Half Dicing Step Next, at least the lower crystal plate 110 is cut to form a second groove 72 that exposes the first resin layer 40b on the lower substrate side. FIG. 24 is a cross-sectional view schematically showing this step. As shown in FIG. 24, half dicing is performed from the lower crystal plate 110 side to expose the first resin layer 40b. In this step, as long as the laminated substrate 200 is not cut, half dicing can be performed to an arbitrary position in the thickness direction of the laminated substrate 200. This step can be performed by a general dicing apparatus. After this step, at least the crystals in the cutting lines L11 and L12 of the lower crystal plate 110 are removed. Thereby, the first resin layer 40b is exposed on the lower substrate side. The thickness of the blade of the dicing apparatus used in this step is thicker than the thickness of the blade used in the first half dicing step described above. Thereby, the claw 42 can be formed in the resin member 40. Further, in this step, since the multilayer substrate 200 is not cut, the multilayer substrate 200 can be easily handled in the subsequent steps.

2.2.7. Step of Forming Second Resin Layer Next, a resin raw material is applied from the lower substrate 10 side to form a second resin layer 40 c continuous with the first resin layer 40 b inside the second groove 72. FIG. 25 is a cross-sectional view schematically showing a state in which the second resin layer 40c is formed. As a resin raw material, it is preferable to use what was used in order to form the 1st resin layer 40b at the point which improves the adhesiveness of the 1st resin layer 40b and the 2nd resin layer 40c. This step can be performed, for example, by applying a resin raw material to the lower substrate 10 side. The application method is not particularly limited. This step can be performed by placing the laminated substrate 200 in a reduced pressure state. In this way, the resin raw material can be more reliably penetrated into the second groove 72 formed by the second half dicing. In this step, after the resin raw material is applied, a curing reaction is performed, for example, by heating or the like, so that the second resin layer 40c continuous with the first resin layer 40b is formed.

2.2.8. Dicing Step This step is a step of cutting the first resin layer 40b and the second resin layer 40c. Accordingly, since the second resin layer 40c is cut in place of the lower crystal plate 110, it is the same as “2.1.6. Dicing process” in the first aspect, and thus detailed description thereof is omitted. As shown by the imaginary line in FIG. 25, the laminated substrate 200 is cut by this process, and the piezoelectric vibrator 100 (FIGS. 11 to 14 and the like) in which the resin member 40 exists on the side of the lower substrate 10 is manufactured. . This step can be performed by a general dicing apparatus.

  The thickness of the blade of the dicing apparatus used in this step is thinner than the thickness of the blade used in the first half dicing step (see FIG. 25). In this step, by using such a blade, the piezoelectric vibrator 100 in which the resin member 40 is formed on the upper surface and the side surface can be formed.

  As described above, the piezoelectric vibrator 100 (FIGS. 11 to 14, etc.) in which the resin member 40 exists on the side of the lower substrate 10 according to the second aspect can be manufactured. According to the method for manufacturing a piezoelectric vibrator of this aspect, it is possible to easily manufacture a piezoelectric vibrator in which a resin member that is difficult to separate into a laminate in which three layers of substrates are stacked is formed.

  The aspect illustrated in the method for manufacturing the piezoelectric vibrator 100 may include a step of appropriately forming an external terminal or the like that is electrically connected to a wiring or the like formed on the intermediate substrate 20 as appropriate.

  The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same purposes and effects). In addition, the present invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that achieves the same effect as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

FIG. 3 is a cross-sectional view schematically showing an example of the piezoelectric vibrator 100 according to the embodiment. FIG. 2 is a plan view schematically showing an example of the piezoelectric vibrator 100 according to the embodiment. FIG. 3 is a top view schematically showing the intermediate substrate 20 according to the embodiment. FIG. 3 is a bottom view schematically showing the intermediate substrate 20 according to the embodiment. Sectional drawing which shows the intermediate | middle board | substrate 20 concerning embodiment typically. Sectional drawing which shows the intermediate | middle board | substrate 20 concerning embodiment typically. Sectional drawing which shows the intermediate | middle board | substrate 20 concerning embodiment typically. FIG. 3 is a cross-sectional view schematically showing an example of the piezoelectric vibrator 100 according to the embodiment. The top view which shows typically the example of the nail | claw 42 of the resin member 40 concerning embodiment. FIG. 3 is a cross-sectional view schematically showing an example of the piezoelectric vibrator 100 according to the embodiment. FIG. 3 is a cross-sectional view schematically showing an example of the piezoelectric vibrator 100 according to the embodiment. FIG. 3 is a cross-sectional view schematically showing an example of the piezoelectric vibrator 100 according to the embodiment. FIG. 3 is a cross-sectional view schematically showing an example of the piezoelectric vibrator 100 according to the embodiment. The perspective view which shows typically each quartz crystal substrate concerning embodiment. FIG. 3 is a plan view schematically showing an intermediate crystal substrate 120 according to the embodiment. Sectional drawing which shows typically the intermediate | middle crystal substrate 120 concerning embodiment. The perspective view which shows the example of the laminated substrate 200 concerning embodiment typically. Sectional drawing which shows typically the manufacturing process of the piezoelectric vibrator 100 concerning embodiment. Sectional drawing which shows typically the manufacturing process of the piezoelectric vibrator 100 concerning embodiment. Sectional drawing which shows typically the manufacturing process of the piezoelectric vibrator 100 concerning embodiment. The perspective view which shows the example of the laminated substrate 200 concerning embodiment typically. Sectional drawing which shows typically the manufacturing process of the piezoelectric vibrator 100 concerning embodiment. Sectional drawing which shows typically the manufacturing process of the piezoelectric vibrator 100 concerning embodiment. Sectional drawing which shows typically the manufacturing process of the piezoelectric vibrator 100 concerning embodiment. Sectional drawing which shows typically the manufacturing process of the piezoelectric vibrator 100 concerning embodiment.

Explanation of symbols

10 ... lower substrate, 20 ... intermediate substrate, 30 ... upper substrate, 10a, 20a, 30a ... upper surface,
10b, 20b, 30b ... side face, 10c, 20c, 30c ... bottom face,
10r, 20r, 30r ... contour, 21 ... piezoelectric vibration part, 22 ... frame part,
25a, 25b ... connection portion, 26a, 26b ... slit, 28a ... first groove portion,
28b ... 2nd groove part, 40 ... Resin member, 40a ... Resin layer, 40b ... 1st resin layer,
40c ... second resin layer, 42 ... claw, 50 ... first excitation electrode, 52 ... second excitation electrode,
54 ... 1st wiring, 56 ... 2nd wiring, 62 ... Notch, 70, 72 ... Groove, 100 ... Piezoelectric vibrator,
110 ... Lower crystal substrate, 120 ... Intermediate crystal substrate, 130 ... Upper crystal substrate,
200 ... laminated substrate, L11, L12, L21, L22, L31, L32 ... cutting line

Claims (9)

A lower substrate,
An intermediate substrate provided on the lower substrate and having a vibrating portion;
An upper substrate provided on the intermediate substrate;
A resin member that covers at least the upper surface and the side surface of the upper substrate and the side surface of the intermediate substrate;
Have
Piezoelectric vibration in which a part of the resin member exists in a region below the lower surface of the upper substrate, above the lower surface of the lower substrate, and inside the contour in plan view of the upper substrate. Child. In claim 1,
The piezoelectric vibrator in which a contour of the lower substrate is outside a contour of the upper substrate in a plan view. In claim 1,
A piezoelectric vibrator in which outlines of the intermediate substrate and the lower substrate coincide in a plan view. In claim 1,
The piezoelectric vibrator in which a contour of the lower substrate is inside a contour of the intermediate substrate in a plan view. A lower substrate,
An intermediate substrate provided on the lower substrate and having a vibrating portion;
An upper substrate provided on the intermediate substrate;
A resin member that covers at least the upper surface and side surfaces of the upper substrate, the side surfaces of the intermediate substrate, and the side surfaces of the lower substrate;
Have
Piezoelectric vibration in which a part of the resin member exists in a region below the lower surface of the intermediate substrate, above the lower surface of the lower substrate, and inside the contour in plan view of the intermediate substrate. Child. Preparing a lower substrate, an intermediate substrate having a vibrating portion, and an upper substrate;
Laminating the lower substrate, the intermediate substrate, and the upper substrate to form a laminated substrate;
A half dicing step of cutting at least the upper substrate of the laminated substrate and forming a hole communicating from the upper substrate side to the upper surface of the lower substrate;
Providing a resin raw material from the upper substrate side, and forming a resin layer so as to cover the upper surface, the side surface and the lower surface of the upper substrate, the side surface of the intermediate substrate, and the upper surface of the lower substrate;
A dicing step of cutting the lower substrate and the resin layer to form individual pieces;
Have
The method of manufacturing a piezoelectric vibrator, wherein a thickness of the blade used in the dicing step is thinner than a thickness of the blade used in the half dicing step. In claim 6,
The intermediate substrate has a plate-like frame portion,
In the half dicing step, the upper substrate and the frame are cut to form a hole that communicates from the upper substrate side to the upper surface of the lower substrate. Preparing a lower substrate, an intermediate substrate having a vibrating portion, and an upper substrate;
Laminating the lower substrate, the intermediate substrate, and the upper substrate to form a laminated substrate;
Cutting the laminated substrate from the upper substrate side to form a first groove, and a first half dicing step;
Applying a resin raw material from the upper substrate side and forming a first resin layer on the upper surface of the upper substrate and in the first groove;
A second half dicing step of cutting the laminated substrate from the lower substrate side and forming a second groove exposing the first resin layer on the lower substrate side;
Providing the resin raw material from the lower substrate side, and forming a second resin layer continuous with the first resin layer inside the second groove;
A dicing step of cutting the first resin layer and the second resin layer to form individual pieces;
Have
The thickness of the blade used in the first half dicing step is thinner than the thickness of the blade used in the second half dicing step,
The method of manufacturing a piezoelectric vibrator, wherein a thickness of the blade used in the dicing step is thinner than a thickness of the blade used in the first half dicing step. In claim 8,
The intermediate substrate has a plate-like frame portion,
In the first half dicing step, the upper substrate and the frame portion are cut to form a hole communicating from the upper substrate side to the upper surface of the lower substrate.

Images