JPS63110760A - Electronic component and manufacture thereof - Google Patents
Electronic component and manufacture thereofInfo
- Publication number
- JPS63110760A JPS63110760A JP25768686A JP25768686A JPS63110760A JP S63110760 A JPS63110760 A JP S63110760A JP 25768686 A JP25768686 A JP 25768686A JP 25768686 A JP25768686 A JP 25768686A JP S63110760 A JPS63110760 A JP S63110760A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- coating layer
- solder
- cavity
- masking agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 35
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011247 coating layer Substances 0.000 claims abstract description 26
- 239000010410 layer Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000002904 solvent Substances 0.000 claims abstract description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 27
- 230000000873 masking effect Effects 0.000 claims description 26
- 229910000679 solder Inorganic materials 0.000 claims description 25
- 238000009835 boiling Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 238000007639 printing Methods 0.000 abstract description 4
- 230000006866 deterioration Effects 0.000 abstract description 3
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 5
- 238000010924 continuous production Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 235000014676 Phragmites communis Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Ceramic Capacitors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（ａｌ産業上の利用分野
この発明は、たとえばエネルギー閉じ込め型の圧電共振
子のように基板を挟む電極の周囲に振動許容空間などの
空洞部を形成する必要のある電子部品およびその製造方
法に関する。DETAILED DESCRIPTION OF THE INVENTION (Al Industrial Field of Application) This invention is applicable to an electronic device that requires a cavity such as a vibration permissible space to be formed around electrodes that sandwich a substrate, such as an energy trapping type piezoelectric resonator. Concerning parts and their manufacturing methods.
山）従来の技術
たとえばフィルタや発振子などに使用される圧電共振子
には種々のタイプがあるが、そのうちエネルギー閉じ込
め型のものは、第３図に示すように基板２の表裏に一対
の振動電極３．３を設けた圧電素子１を、第４図（Ｃ）
に示すように樹脂でし
モールドセ外装６を形成するとともに、振動電極３．３
の周囲に空洞部７．７を形成している。このような圧電
共振子は、従来、第４図（Ａ）〜（Ｃ）の手順で製造さ
れていた。3) Conventional technology There are various types of piezoelectric resonators used in filters, oscillators, etc. Among them, the energy trapping type has a pair of vibrating resonators on the front and back sides of a substrate 2, as shown in Figure 3. The piezoelectric element 1 provided with the electrode 3.3 is shown in FIG. 4(C).
As shown in FIG.
A cavity 7.7 is formed around the . Such a piezoelectric resonator has conventionally been manufactured by the procedure shown in FIGS. 4(A) to 4(C).
すなわち、第４図（Ａ）に示すように、たとえばセラミ
ック基板２の両面に形成された振動電極３．３の周囲の
空洞部を形成すべき部位にフックス５，５を盛り上げ、
これを外装用樹脂に浸漬することにより同図（Ｂ）に示
すように上記フックス５，５をモールドする。外装６を
形成し、その後、外装６を形成している樹脂を加熱・硬
化する。このように外装６の樹脂を加熱・硬化するのに
ともなって、それまで外装６内に閉じ込められていたワ
ックス５．５が多孔質の外装６の樹脂内に移行して、ワ
ックス５．５の当初の盛り上げ箇所に同図（Ｃ）に示す
ように空洞部７が形成される。いわゆるワックス方式に
よる製造方法である。That is, as shown in FIG. 4(A), for example, hooks 5, 5 are raised in the area where a cavity is to be formed around the vibrating electrode 3.3 formed on both sides of the ceramic substrate 2, and
By immersing this in an exterior resin, the hooks 5, 5 are molded as shown in FIG. 5(B). The exterior 6 is formed, and then the resin forming the exterior 6 is heated and hardened. As the resin of the exterior casing 6 is heated and hardened in this way, the wax 5.5 that had been confined within the exterior casing 6 moves into the porous resin of the exterior 6, and the wax 5.5 is heated and hardened. A hollow portion 7 is formed at the initial heap as shown in FIG. 2(C). This is a manufacturing method using a so-called wax method.
このようにして製造された圧電共振子は一対の振動電極
３．３に通電することによってこれら振動電極３．３に
挟まれた圧電基板がエネルギー閉じ込め型の振動を行い
、フィルタなどの所定の作用を果たす。In the piezoelectric resonator manufactured in this way, when a pair of vibrating electrodes 3.3 are energized, the piezoelectric substrate sandwiched between these vibrating electrodes 3.3 performs an energy-trap type vibration, and performs a predetermined function such as a filter. fulfill.
（Ｃ）発明が解決しようとする問題点
しかしながら、上記したワックス方式では、条件設定が
適切でないと、ワックス５が外装樹脂に吸収されないで
一部が空洞部７にそのまま残留し、圧電共振子の特性を
低下させるおそれがあり、そのような事態を生じさせな
いためには条件設定に相当の経験を要するといった間ツ
点があった。(C) Problems to be Solved by the Invention However, in the wax method described above, if the conditions are not set appropriately, the wax 5 will not be absorbed into the exterior resin and a portion will remain in the cavity 7, causing the piezoelectric resonator to deteriorate. There was a drawback that there was a risk that the characteristics would deteriorate, and that a considerable amount of experience was required to set conditions in order to prevent such a situation from occurring.
また、外装６の樹脂を加熱・硬化してワックス５を吸収
させるにはかなり長時間（通常１２時間程度）を要する
ためある程度まとまった個数の圧電素子を炉内でバッチ
処理する必要があり、そのため連続生産ラインの組み立
てが難しく、連続生産性、量産性などの点でも問題点が
あった。In addition, it takes a considerable amount of time (usually about 12 hours) to heat and harden the resin of the exterior 6 to absorb the wax 5, so it is necessary to batch-process a certain number of piezoelectric elements in a furnace. It was difficult to assemble a continuous production line, and there were also problems with continuous productivity and mass production.
以上は圧電共振子を例にとって説明したものであるが、
同様の事情は電極の周囲に空洞部が形成されているよう
な電子部品、たとえば表面弾性波フィルタやリードスイ
ッチなどおよびその製造方法についても存在している。The above was explained using a piezoelectric resonator as an example.
A similar situation also exists with respect to electronic components in which a cavity is formed around an electrode, such as a surface acoustic wave filter or a reed switch, and methods of manufacturing the same.
この発明は、上記従来の問題点を解消して、空洞部にワ
ックスが残留することによる特性低下などのおそれがな
く、しかも効率よく製造することができる電子部品を提
供すること、ならびに、ワックスを用いることなく、厳
しい条件設定の必要性を無くし、しかも連続生産ライン
の組み立てが容易で量産性、連続生産性に冨む製造方法
を提供することを目的としている。The present invention solves the above-mentioned conventional problems and provides an electronic component that is free from the risk of deterioration of characteristics due to wax remaining in the cavity and can be manufactured efficiently. The purpose of the present invention is to provide a manufacturing method that eliminates the need for setting strict conditions, facilitates the assembly of a continuous production line, and is highly efficient in mass production and continuous productivity.
（ｄ）問題点を解決するための手段
上記問題点を解決するため、この発明の電子部品は、基
板上の少なくとも電極が中・高沸点溶媒を含むハンダマ
スキング剤層によって覆われているとともに、この電極
とこの電極を被覆する紫外線硬化性樹脂からなる被覆層
との間に空洞部が形成されていることを特徴としている
。(d) Means for Solving the Problems In order to solve the above problems, the electronic component of the present invention includes at least the electrodes on the substrate covered with a solder masking agent layer containing a medium to high boiling point solvent, and A feature is that a cavity is formed between this electrode and a coating layer made of an ultraviolet curable resin that covers this electrode.
また、この発明の電子部品の製造方法は、基板上に形成
された少なくとも電極を中・高沸点溶媒を含むハンダマ
スキング剤で覆った上を紫外線硬化性樹脂で被覆し、し
かるのち上記紫外線硬化性樹脂からなる被覆層を硬化さ
せて前記電極と前記紫外線硬化性樹脂からなる硬化被覆
層との間に空洞部を形成することを特徴としている。Further, in the method for manufacturing an electronic component of the present invention, at least an electrode formed on a substrate is covered with a solder masking agent containing a medium-to-high boiling point solvent, and then the above-mentioned electrode is coated with an ultraviolet curable resin. The method is characterized in that a coating layer made of resin is cured to form a cavity between the electrode and the cured coating layer made of ultraviolet curable resin.
（ｅ）作用
上記構成の電子部品によると、電極と紫外線硬化性樹脂
からなる被覆層との間の空洞部には残留ワックスなどの
異物は存在せず、電極表面に薄いハンダマスキング剤層
が存在するだけであるため、残留ワックスによる電子部
品の特性低下は起こり得ない。(e) Effect According to the electronic component with the above configuration, there is no foreign matter such as residual wax in the cavity between the electrode and the coating layer made of ultraviolet curable resin, and there is a thin solder masking agent layer on the electrode surface. Therefore, the properties of electronic components cannot be deteriorated due to residual wax.
また、上記製造方法によると、紫外線硬化性樹脂の被覆
層が硬化する際、その被覆層がハンダマスキング剤層と
の境界部分で大幅に収縮する。すなわち、素子を覆う紫
外線硬化性樹脂の被覆層を紫外線照射などによって硬化
させると、その樹脂の硬化にともなって被覆層が収縮す
るが、その場合、ハンダマスキング剤は離型性を有して
いるため、被覆層の紫外線硬化性樹脂がハンダマスキン
グ剤層から容易に剥がれるのに対し、ハンダマスキング
剤層以外の部分からは剥がれない。したがって容易に剥
がれるハンダマスキング剤層との境界部分が他の部分に
比べて集中的に収縮し、電極の周囲に十分な大きさの空
洞部が形成される。また、ハンダマスキング剤は中・高
沸点の溶媒を含んでいるため、従来のようにワックスを
ディスペンサなどによって点滴することなく、通常の印
刷方法によって容易にパターン印刷することができ、空
洞部の形成に要する時間を大幅に短縮することができる
ため、連続生産ラインを組み立てることも可能′となる
。Further, according to the above manufacturing method, when the coating layer of the ultraviolet curable resin is cured, the coating layer shrinks significantly at the boundary portion with the solder masking agent layer. In other words, when a coating layer of an ultraviolet curable resin that covers an element is cured by UV irradiation, the coating layer shrinks as the resin hardens, but in this case, the solder masking agent has mold releasability. Therefore, while the ultraviolet curable resin of the coating layer is easily peeled off from the solder masking agent layer, it is not peeled off from parts other than the solder masking agent layer. Therefore, the boundary portion with the solder masking agent layer, which is easily peeled off, contracts more intensively than other portions, and a sufficiently large cavity is formed around the electrode. In addition, since the solder masking agent contains a solvent with a medium to high boiling point, patterns can be easily printed using normal printing methods without the need to drip wax with a dispenser as in the past, forming cavities. Since the time required for production can be significantly reduced, it is also possible to assemble a continuous production line.
（ｆ）実施例
第１図はこの発明の電子部品の一実施例であるエネルギ
ー閉じ込め型の圧電共振子の断面を表すものである。同
図の圧電共振子において、圧電セラミック基板２に形成
された振動電極３，３はハンダマスキング剤層８．８に
よって覆われている。圧電セラミック基板２を被覆する
被覆層９は硬化した紫外線硬化性樹脂からなり、この被
覆層９と上記振動電極３．３との間には空洞部７，７が
形成されている。また、上記空洞部の周囲のセラミ・７
り基板２上には弾性物質からなるダンパー１０．１０が
必要に応じて設けられている。これらのダンパー１０．
１０はスプリアス振動の防止や被覆層９の基板２への過
度なダンピング作用を緩和する作用を果たす。さらに被
覆Ｎ９の表面には外装用樹脂１）がコーティングされて
いる。(f) Embodiment FIG. 1 shows a cross section of an energy trapping type piezoelectric resonator which is an embodiment of the electronic component of the present invention. In the piezoelectric resonator shown in the figure, the vibrating electrodes 3, 3 formed on the piezoelectric ceramic substrate 2 are covered with a solder masking agent layer 8.8. A coating layer 9 covering the piezoelectric ceramic substrate 2 is made of a cured ultraviolet curable resin, and cavities 7 are formed between the coating layer 9 and the vibrating electrode 3.3. In addition, the ceramic around the cavity 7
A damper 10.10 made of an elastic material is provided on the substrate 2 as required. These dampers10.
10 functions to prevent spurious vibrations and to alleviate excessive damping effect of the coating layer 9 on the substrate 2. Further, the surface of the coating N9 is coated with exterior resin 1).
このような圧電共振子によると、空洞部７，７によって
良好な振動特性が確保される。According to such a piezoelectric resonator, good vibration characteristics are ensured by the cavities 7, 7.
なお、エネルギー閉じ込め型でない圧電振動子、例えば
圧電基板の拡がりモードを利用した圧電共振子の場合は
、この基板全体をハンダマスキング剤で覆い、その周囲
に空洞部が形成されるように紫外線硬化性樹脂よりなる
被覆層を形成すればよい。Note that in the case of a piezoelectric resonator that is not an energy trap type, such as a piezoelectric resonator that utilizes the expansion mode of a piezoelectric substrate, the entire substrate is covered with a solder masking agent, and a UV-curable material is applied so that a cavity is formed around it. A coating layer made of resin may be formed.
次に、上記圧電共振子の製造方法について説明する。第
２図（Ａ）〜（Ｄ）は製造工程における各段階の様子を
表す図である。Next, a method for manufacturing the piezoelectric resonator will be described. FIGS. 2(A) to 2(D) are diagrams showing each stage of the manufacturing process.
まず、第２図（Ａ）に示すようにマザー基板２ａ上に振
動電極３，３を含む所定の電極パターンを形成した状態
で、各振動電極３，３上にハンダマスキング剤を印刷し
てハンダマスキング剤層８．８を形成する。次に、マザ
ー基板２ａを図中の破線部分に沿って分断（チップブレ
ーク）して、各チップに同図（Ｂ）に示すように電極リ
ード１２．１２を接続する。このようにして形成された
圧電素子１にダンパー１０を塗布形成した後、圧電素子
１を紫外線硬化性樹脂中に一回もしくは複数回繰り返し
浸漬して同図（Ｃ）に示すように未硬化の紫外線硬化性
樹脂の被覆層９でモールドする。その後、紫外線ランプ
などを用いて、この被覆層９に紫外線を調整照射し被覆
層９を硬化させる。硬化に要する時間は数秒から数十秒
程度である。First, with a predetermined electrode pattern including the vibrating electrodes 3, 3 formed on the motherboard 2a as shown in FIG. A masking agent layer 8.8 is formed. Next, the motherboard 2a is cut (chip broken) along the broken lines in the figure, and electrode leads 12 and 12 are connected to each chip as shown in FIG. After coating the damper 10 on the piezoelectric element 1 thus formed, the piezoelectric element 1 is immersed in an ultraviolet curable resin once or several times to form an uncured layer as shown in FIG. It is molded with a coating layer 9 of ultraviolet curable resin. Thereafter, the coating layer 9 is irradiated with adjusted ultraviolet rays using an ultraviolet lamp or the like to harden the coating layer 9. The time required for curing is about several seconds to several tens of seconds.
紫外線照射によって被覆層９を硬化させると、硬化に伴
う収縮力によって、この被覆層９のハンダマスキング剤
Ｎ８，８との界面部分は容易にハンダマスキング剤層８
．８から剥がれるが、他の部分、たとえばセラミック基
板２やダンパー１０．１０との界面部分は剥がれにくい
。そのため、ハンダマスキング剤層８，８との境界部分
において被覆層９に大幅な収縮が起こり、この部分がハ
ンダマスキング剤層８．８から後退して空洞部７．７を
形成する。その後外装樹脂をコーティングして第１図で
説明した圧電共振子が製造される。When the coating layer 9 is cured by ultraviolet irradiation, the interface portion of the coating layer 9 with the solder masking agent N8, 8 easily becomes the solder masking agent layer 8 due to the shrinkage force accompanying the curing.
．． 8, but other parts, such as the interface with the ceramic substrate 2 and the damper 10.10, are difficult to peel off. As a result, the covering layer 9 undergoes significant shrinkage at the boundary with the solder masking agent layers 8, 8, and this portion recedes from the solder masking agent layer 8.8 to form a cavity 7.7. Thereafter, the piezoelectric resonator illustrated in FIG. 1 is manufactured by coating with an exterior resin.
なお、空洞部が形成された後も各振動電極上にハンダマ
スキング剤層がそのまま存在しているが、ハンダマスキ
ング剤層の厚みは印刷の段階で容易に管理することがで
きるため、その質量は問題とはならない。また、逆に、
ハンダマスキング剤層の厚みを調節することにより共振
周波数の調整を行うことも可能である。さらに外装を形
成させるだめの樹脂は従来のようにワックスに対する吸
収性をもつ必要はなく、樹脂の物性を考慮して種々の外
装樹脂を選択することができる。Note that even after the cavity is formed, the solder masking agent layer remains on each vibrating electrode, but since the thickness of the solder masking agent layer can be easily controlled at the printing stage, its mass is Not a problem. Also, conversely,
It is also possible to adjust the resonance frequency by adjusting the thickness of the solder masking agent layer. Furthermore, the resin used to form the exterior does not need to have wax absorbency as in the past, and various exterior resins can be selected in consideration of the physical properties of the resin.
上記実施例ではエネルギー閉じ込め型の圧電共振子につ
いて説明したが、このタイプ以外の圧電共振子であって
も、また圧電共振子以外の圧電部品、例えば表面弾性波
フィルタやリードスイッチのように電極の周囲に空洞部
を備える必要のある電子部品についても上記実施例と同
様にこの発明を適用することができる。In the above embodiment, an energy trap type piezoelectric resonator was explained, but piezoelectric resonators other than this type can also be used, and piezoelectric parts other than piezoelectric resonators, such as surface acoustic wave filters and reed switches, have electrodes. The present invention can also be applied to electronic components that need to have a cavity around them, in the same manner as in the above embodiments.
（ｇ）発明の詳細
な説明したように、この発明の電子部品は、空洞部が紫
外線硬化性樹脂液ｌＩ！層の硬化時に収縮することによ
って形成されたものであるため、従来のワックス方式で
形成する空洞部のように残留ワックスによって生じる振
動特性の低下などの問題を一掃することができる。(g) Detailed Description of the Invention As described above, the electronic component of the present invention has a cavity with an ultraviolet curable resin liquid lI! Since the layer is formed by shrinking when the layer hardens, it is possible to eliminate problems such as deterioration of vibration characteristics caused by residual wax in cavities formed by conventional wax methods.
また、この発明の製造方法によると、振動電極上に一般
にハンダマスキング剤として用いられているインクを印
刷することによって、紫外線硬化性樹脂からなる被覆層
の硬化時にそのハンダマスキング剤層が離型剤層として
作用し、被覆層との境界部分で収縮が起こり、十分な大
きさの空洞部を前記電極の周囲に形成させることが可能
となる。したがって従来のような厳しい条件設定が不要
となる。しかもハンダマスキング剤の印刷は従来より回
路基板に印刷されているのと同様の方法で容易に印刷す
ることができ、しかもインクの管理方法や取り扱いも容
易となる。さらに、電極を覆うハンダマスキング剤の上
に被覆された紫外線硬化性樹脂はた短時間に硬化するた
め、この硬化工程を含んだ連続生産ラインの組み立ても
可能となり、連続生産性、量産性が向上する。Further, according to the manufacturing method of the present invention, by printing an ink generally used as a solder masking agent on the vibrating electrode, when the coating layer made of an ultraviolet curable resin is cured, the solder masking agent layer becomes a release agent. It acts as a layer and shrinks at the boundary with the covering layer, making it possible to form a cavity of sufficient size around the electrode. Therefore, there is no need to set strict conditions as in the past. Moreover, the solder masking agent can be easily printed in the same manner as conventionally printed on circuit boards, and the ink management method and handling are also easy. Furthermore, since the ultraviolet curable resin coated on the solder masking agent covering the electrodes cures in a short time, it is possible to assemble a continuous production line that includes this curing process, improving continuous productivity and mass production. do.
第１図はこの発明の実施例による電子部品を示す断面図
、第２図（Ａ）〜（Ｄ）は同電子部品の製造方法を説明
するための図、第３図は電子部品の一例である圧電共振
子を製造するための圧電素子の平面図、第４図（Ａ）〜
（Ｃ）は従来の電子部品の型造方法を説明するための図
である。
１−圧電素子、 ２一基板、
３−振動電極、 ７−空洞部、
８−ハンダマスキング剤層、
９−紫外線硬化性樹脂よりなる被覆層。FIG. 1 is a sectional view showing an electronic component according to an embodiment of the present invention, FIGS. 2(A) to (D) are diagrams for explaining a method of manufacturing the electronic component, and FIG. 3 is an example of the electronic component. Plan view of a piezoelectric element for manufacturing a certain piezoelectric resonator, FIG. 4(A) ~
(C) is a diagram for explaining a conventional electronic component molding method. 1- piezoelectric element, 2- substrate, 3- vibrating electrode, 7- cavity, 8- solder masking agent layer, 9- coating layer made of ultraviolet curable resin.
Claims (2)
ハンダマスキング剤層によって覆われているとともに、
この電極とこの電極を被覆する紫外線硬化性樹脂からな
る被覆層との間に空洞部が形成されていることを特性と
する電子部品。(1) At least the electrode on the substrate is covered with a solder masking agent layer containing a medium-to-high boiling point solvent, and
An electronic component characterized in that a cavity is formed between the electrode and a coating layer made of an ultraviolet curable resin that covers the electrode.
溶媒を含むハンダマスキング剤で覆った上を紫外線硬化
性樹脂で被覆し、しかるのち上記紫外線硬化性樹脂から
なる被覆層を硬化させて、前記電極と前記紫外線硬化性
樹脂からなる硬化被覆層との間に空洞部を形成すること
を特徴とする電子部品の製造方法。(2) At least the electrodes formed on the substrate are covered with a solder masking agent containing a medium-to-high boiling point solvent, the top is coated with an ultraviolet curable resin, and then the coating layer made of the ultraviolet curable resin is cured. . A method of manufacturing an electronic component, characterized in that a cavity is formed between the electrode and the cured coating layer made of the ultraviolet curable resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25768686A JPS63110760A (en) | 1986-10-29 | 1986-10-29 | Electronic component and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25768686A JPS63110760A (en) | 1986-10-29 | 1986-10-29 | Electronic component and manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63110760A true JPS63110760A (en) | 1988-05-16 |
| JPH0482187B2 JPH0482187B2 (en) | 1992-12-25 |
Family
ID=17309698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25768686A Granted JPS63110760A (en) | 1986-10-29 | 1986-10-29 | Electronic component and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63110760A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04217107A (en) * | 1990-12-17 | 1992-08-07 | Murata Mfg Co Ltd | Manufacture of piezoelectric resonator |
| KR100394453B1 (en) * | 2000-06-27 | 2003-08-14 | 가부시키가이샤 무라타 세이사쿠쇼 | Method for manufacturing electronic component |
-
1986
- 1986-10-29 JP JP25768686A patent/JPS63110760A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04217107A (en) * | 1990-12-17 | 1992-08-07 | Murata Mfg Co Ltd | Manufacture of piezoelectric resonator |
| KR100394453B1 (en) * | 2000-06-27 | 2003-08-14 | 가부시키가이샤 무라타 세이사쿠쇼 | Method for manufacturing electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0482187B2 (en) | 1992-12-25 |
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| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |