JPH11265884A5 - - Google Patents

Info

Publication number
JPH11265884A5
JPH11265884A5 JP1998068199A JP6819998A JPH11265884A5 JP H11265884 A5 JPH11265884 A5 JP H11265884A5 JP 1998068199 A JP1998068199 A JP 1998068199A JP 6819998 A JP6819998 A JP 6819998A JP H11265884 A5 JPH11265884 A5 JP H11265884A5
Authority
JP
Japan
Prior art keywords
gas
flow paths
resistance plate
flow
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998068199A
Other languages
English (en)
Japanese (ja)
Other versions
JP3725325B2 (ja
JPH11265884A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP06819998A priority Critical patent/JP3725325B2/ja
Priority claimed from JP06819998A external-priority patent/JP3725325B2/ja
Publication of JPH11265884A publication Critical patent/JPH11265884A/ja
Publication of JPH11265884A5 publication Critical patent/JPH11265884A5/ja
Application granted granted Critical
Publication of JP3725325B2 publication Critical patent/JP3725325B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP06819998A 1998-03-18 1998-03-18 半導体製造方法ならびに半導体製造装置 Expired - Fee Related JP3725325B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP06819998A JP3725325B2 (ja) 1998-03-18 1998-03-18 半導体製造方法ならびに半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06819998A JP3725325B2 (ja) 1998-03-18 1998-03-18 半導体製造方法ならびに半導体製造装置

Publications (3)

Publication Number Publication Date
JPH11265884A JPH11265884A (ja) 1999-09-28
JPH11265884A5 true JPH11265884A5 (enExample) 2005-07-07
JP3725325B2 JP3725325B2 (ja) 2005-12-07

Family

ID=13366899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP06819998A Expired - Fee Related JP3725325B2 (ja) 1998-03-18 1998-03-18 半導体製造方法ならびに半導体製造装置

Country Status (1)

Country Link
JP (1) JP3725325B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4698251B2 (ja) * 2004-02-24 2011-06-08 アプライド マテリアルズ インコーポレイテッド 可動又は柔軟なシャワーヘッド取り付け
JP4633425B2 (ja) * 2004-09-17 2011-02-16 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法
JP4187175B2 (ja) * 2006-03-13 2008-11-26 国立大学法人東北大学 窒化ガリウム系材料の製造方法
KR102102787B1 (ko) 2013-12-17 2020-04-22 삼성전자주식회사 기판 처리 장치 및 블록커 플레이트 어셈블리
WO2016157317A1 (ja) * 2015-03-27 2016-10-06 株式会社日立国際電気 基板処理装置、半導体装置の製造方法および記録媒体

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