JP3725325B2 - 半導体製造方法ならびに半導体製造装置 - Google Patents

半導体製造方法ならびに半導体製造装置 Download PDF

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Publication number
JP3725325B2
JP3725325B2 JP06819998A JP6819998A JP3725325B2 JP 3725325 B2 JP3725325 B2 JP 3725325B2 JP 06819998 A JP06819998 A JP 06819998A JP 6819998 A JP6819998 A JP 6819998A JP 3725325 B2 JP3725325 B2 JP 3725325B2
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Japan
Prior art keywords
gas
flow path
plate
flow
resistance plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP06819998A
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English (en)
Japanese (ja)
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JPH11265884A5 (enExample
JPH11265884A (ja
Inventor
智司 渡辺
敦彦 須田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Kokusai Denki Electric Inc
Original Assignee
Hitachi Ltd
Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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Application filed by Hitachi Ltd, Hitachi Kokusai Electric Inc, Kokusai Denki Electric Inc filed Critical Hitachi Ltd
Priority to JP06819998A priority Critical patent/JP3725325B2/ja
Publication of JPH11265884A publication Critical patent/JPH11265884A/ja
Publication of JPH11265884A5 publication Critical patent/JPH11265884A5/ja
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Publication of JP3725325B2 publication Critical patent/JP3725325B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
JP06819998A 1998-03-18 1998-03-18 半導体製造方法ならびに半導体製造装置 Expired - Fee Related JP3725325B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP06819998A JP3725325B2 (ja) 1998-03-18 1998-03-18 半導体製造方法ならびに半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06819998A JP3725325B2 (ja) 1998-03-18 1998-03-18 半導体製造方法ならびに半導体製造装置

Publications (3)

Publication Number Publication Date
JPH11265884A JPH11265884A (ja) 1999-09-28
JPH11265884A5 JPH11265884A5 (enExample) 2005-07-07
JP3725325B2 true JP3725325B2 (ja) 2005-12-07

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ID=13366899

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JP06819998A Expired - Fee Related JP3725325B2 (ja) 1998-03-18 1998-03-18 半導体製造方法ならびに半導体製造装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9362091B2 (en) 2013-12-17 2016-06-07 Samsung Electronics Co., Ltd. Substrate treating apparatus and blocker plate assembly

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4698251B2 (ja) * 2004-02-24 2011-06-08 アプライド マテリアルズ インコーポレイテッド 可動又は柔軟なシャワーヘッド取り付け
JP4633425B2 (ja) * 2004-09-17 2011-02-16 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法
JP4187175B2 (ja) * 2006-03-13 2008-11-26 国立大学法人東北大学 窒化ガリウム系材料の製造方法
WO2016157317A1 (ja) * 2015-03-27 2016-10-06 株式会社日立国際電気 基板処理装置、半導体装置の製造方法および記録媒体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9362091B2 (en) 2013-12-17 2016-06-07 Samsung Electronics Co., Ltd. Substrate treating apparatus and blocker plate assembly

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Publication number Publication date
JPH11265884A (ja) 1999-09-28

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