JPH11261300A - Mark reading equipment and electronic component mounting equipment using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately detect the position of a mark formed on a member to be inspected. SOLUTION: A mounting head 16 is equipped with a lamp 33 casting a light on a mounting substrate 15a and a camera 31 receiving a light reflected from the mounting substrate 15a. An incidence side polarizing member 35 is arranged in an incidence optical path reaching the mounting substrate 15a from the lamp 33. A reflection side polarizing member 36 is arranged in a reflection optical path to the camera 31 from the mounting substrate 15a. As a result, a reflected light from the mark M can be clearly discriminated from the other part of the mounting substrate 15a and received, when the surface of the mounting substrate 15a has a high reflectivity.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is applied to detecting a position of a mark provided on a mounting board when mounting an electronic component such as a semiconductor chip such as an IC or LSI, a diode, or a resistor on the mounting board. And a useful mark reading device.

[0002]

2. Description of the Related Art In order to mount electronic components such as semiconductor chips such as ICs and LSIs, capacitors, and diodes on mounting members such as mounting boards and inspection boards, electronic component mounting apparatuses called mounters and chip mounters are used. used. This mounting device has a mounting head that moves in a horizontal direction in order to transport electronic components housed in the component supply unit to a mounting board arranged adjacent to the component supply unit. Has a work holder attached so as to be vertically movable.

[0003]

In order to accurately position electronic components held by a work holder at predetermined positions on a mounted member such as a mounting board, a camera is provided on a mounting head. By irradiating light toward the substrate and receiving the reflected light, the position of the mark attached to the mounting substrate is detected, and the position where the electronic component is mounted is determined based on the position. .

However, in recent years, the surface of a mounting board may be finished to a degree close to a mirror surface. In this case, the reflectance on the surface of the mounting board becomes extremely high. Most of the light is reflected on the surface of the mounting board and enters the camera, making it impossible to distinguish between the mark and the ground part of the mounting board, and the camera can identify the position of the mark on the mounting board. There is a problem that it becomes impossible.

An object of the present invention is to enable the position of a mark provided on a member to be inspected to be accurately detected.

[0006]

A mark reading apparatus according to the present invention is a mark reading apparatus for detecting a mark provided on a surface of a detected member, wherein the moving member moves along the detected member. A light source provided to irradiate the detected member with light; a camera provided to the moving member to receive reflected light from the detected member irradiated from the light source; and a camera from the light source to the detected member. An incident-side polarizing member disposed in an incident optical path, and a reflecting-side polarizing member disposed in a reflecting optical path from the detected member to the camera, at least one of the incident-side polarizing member and the reflecting-side polarizing member A mark provided on the detected member is detected by the camera, with one of the members being rotatable.

An electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus for mounting an electronic component housed in a component supply unit on a member to be mounted, and is provided with a work holder for holding the electronic component. A mounting head that is movable in a horizontal direction between above the component supply unit and above the mounted member, a light source provided on the mounting head, and configured to irradiate light to the mounted member; A camera that is provided and receives reflected light from the mounted member when irradiated from the light source; an incident-side polarizing member disposed in an incident optical path from the light source to the mounted member; and a camera from the mounted member. And a reflection-side polarization member disposed in a reflection optical path leading to the mark, wherein at least one of the incident-side polarization member and the reflection-side polarization member is rotatable so that a mark attached to the mounted member is moved forward. Characterized by being adapted to detect the camera.

In the present invention, even if the surface of the member to be inspected or the member to be mounted has a high reflectance close to the mirror surface, the light reflected from the surface incident on the camera is reflected from the ground portion of the surface. Since the image is attenuated, the camera can receive the reflected light from the mark with clear contrast to the ground on the surface. This makes it possible to reliably detect the position of the mark.

[0009]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a perspective view showing an entire electronic component mounting apparatus 10 also called a chip mounter, and FIG.
3 is an enlarged sectional view taken along line 2-2 in FIG. 1, FIG. 3 is an enlarged sectional view taken along line 3-3 in FIG. 1, and FIG.
FIG. 4 is a view taken along the line 4-4 in FIG.

The electronic component mounting apparatus 10 has an apparatus main body 11 having two vertically extending columns 11a and 11b and a horizontal beam 11c connected to the upper ends thereof. Column portions 11a, 11b and horizontal beam portion 11c
Are formed by attaching a cover to the outside of a skeleton formed of a mold steel material.
A through-hole 12 is formed at the center of 1.

A component support 13 is provided on one side of the apparatus body 11.
The component support 13 is provided with a component supply unit 14 as shown in FIG. FIG. 1 shows a component supply unit 14 provided on one side of the component support 13, but the component supply units 14 are provided on both sides of the component support 13 as shown in FIG. ing.

A large number of parts cassettes are loaded in the parts supply section 14. Each part cassette contains electronic parts such as semiconductor chips of ICs and LSIs, capacitors, diodes and resistors. A tape wound in a reel shape while being held is accommodated. The electronic components to be mounted include, besides the components stored in the parts cassette, the components stored in the stick or the components stored in the tray, and these are mounted on the component support 13. Will be.
The stick is also called a magazine and is a pipe-shaped case with a rectangular cross section, in which electronic components are arranged and accommodated in a straight line, and the tray is used to arrange electronic components in a plane. It is intended to be accommodated.

As shown in FIG. 2, two conveyors 15 are provided above the component support table 13 so as to extend in the X-axis direction. The conveyor 15 mounts a mounting board 15a on which electronic components are mounted. It is designed to be carried in from outside the apparatus main body 11. The two conveyors 15 are mounted on the mounting board 1
According to the size of 5a, the distance between them can be adjusted by moving toward and away from each other in the Y-axis direction. However, in FIG. 1, the conveyor 15 is omitted.

In order to mount the electronic components housed in the parts cassette at a predetermined position on the mounting board 15a, two mounting heads 16 are movably provided in two horizontal directions, ie, an X-axis direction and a Y-axis direction. 11 is attached.

In order to move the mounting head 16 in the horizontal direction, two guide rails 17 extending in the Y-axis direction are attached to the horizontal beam 11c.
The movable beam 18 is slidably mounted on the guide rail 17 at a portion of a sliding block 17a provided on the base end side thereof so as to be slidable in the Y-axis direction along the line 7. Have been. Two guide rails 19 are attached to each of the movable beams 18 so as to extend in the X-axis direction, and the mounting head 1 is movable along the guide rails 19 in the X-axis direction.
6 is mounted.

As shown in FIG. 2, two moving beams 18 each having a mounting head 16 are mounted on the main body 11 of the apparatus. In FIG. Only the rail 19 is shown. However, a component mounting apparatus having one mounting head 16 with one moving beam 18 may be used. As shown, the guide rail 19 is attached to the lower part of the cantilever type movable beam 18, extends from the tip of the movable beam 18 to below the horizontal fixed beam 11 c, and is suspended by the guide rail 19. The mounting head 16 that moves horizontally in the state
Is designed to secure a wide moving stroke in the X-axis direction by utilizing the space below the horizontal fixed beam 11c.

As shown in FIG. 4, the mounting head 16 has a holder 21 to which a slide block 19a that slides along each guide rail 19 is fixed. Make up.

The holder 21 has two bearing blocks 2
2 are attached, and each bearing block 2
Two hollow shafts 23 are slidably mounted in the axial direction and rotatable in the axial direction. Therefore, one mounting head 16 has a total of 8
A book hollow shaft 23 is attached. A work holder 24 is attached to the tip of each hollow shaft 23, and the electronic component E is held by the work holder 24. As the workpiece holder 24, a vacuum suction type suction nozzle or a grip hand having fingers for gripping electronic components is used.

A screw shaft 28 is rotatably attached to the support member 27 fixed to the holder 21, and a vertically moving plate 29 is screwed to the screw shaft 28. Thus, by vertically driving the screw shaft 28, the vertically movable plate 29 is vertically driven. The screw shaft 28 is driven to rotate by a motor (not shown).

Eight pneumatic cylinders 26 are attached to the vertically moving plate 29 in correspondence with the eight work holders 24. The piston rods driven by the respective pneumatic cylinders 26 have hollow shafts via driving levers. 23. Therefore, the work holder 24 attached to the lower end of the hollow shaft 23 reciprocates in the up-down direction, that is, the Z-axis direction, by combining the up-down movement of the up-down movement plate 29 and the pneumatic cylinder 26.

When mounting the electronic component E held by the component supply unit 14 on the mounting board 15a, the electronic component E must be mounted at a predetermined position on the mounting board 15a. Therefore, a mark reading device 30 for detecting the position of a mark provided on the mounting board 15a is provided on the mounting head 16, and based on the position of the mark detected by the mark reading device 30, the electronic component of the mounting board 15a is provided. The position at which E is mounted is calculated.

FIG. 5 is a sectional view showing the mark reading device 30 provided on the mounting head 16.
The light receiving surface faces downward on the holder 21 of the camera 31.
Is mounted, and a lamp 33 as a light source for irradiating light to a beam splitter 32 disposed therebelow is mounted on the holder 21. Therefore, the light from the lamp 33 is irradiated toward the mounting substrate 15a below the camera 31 via the beam splitter 32, and the reflected light from the mounting substrate 15a is reflected on the light receiving surface 31a of the camera 31 via the beam splitter 32. Will be reflected.

The holder 21 has a rotatable cylindrical body 34 rotatably.
An incident side polarizing member 35, which is formed of a polarizing plate and is also called a polarizer, is attached to the rotating cylinder 34. Thereby, the incident side polarizing member 35 is arranged on the incident optical path from the lamp 33 to the mounting board 15a. Further, a reflection-side polarizing member 36 made of a polarizing plate and also called an analyzer is disposed in a reflected light path from the mounting board 15a to the camera 31 in the holder 21. Each of the polarizing members 35 and 36 is formed by an element that converts natural light into linearly polarized light, and may use a polarizing prism, a polaroid using dichroism, or a glass plate using reflection at a polarization angle. it can.

From the lamp 33 as a light source to the mounting board 15a
The light radiated on the surface of the light-receiving surface is rotatable on the incident side polarizing member 3.
5, the position of the polarization plane can be changed by rotating the incident-side polarization member 35.

Therefore, even if the surface of the mounting board 15a is finished to a mirror surface or a surface close to the mirror surface,
Since the irradiation light from the lamp 33 toward the surface of the mounting substrate 15a is polarized, the reflected light from the mounting substrate 15a including the mark M is attenuated in the portions other than the mark M and reflected to the camera 31, The reflected light from the mark M is reflected to the camera 31 without being attenuated. This allows
Even if the surface of the mounting substrate 15a is a surface close to a mirror surface, the contrast of the mark M can be clarified and the position of the mark M can be reliably detected.

Next, a procedure for mounting the electronic component E on the mounting board 15a using the above-described electronic component mounting apparatus 10 will be described.

First, prior to mounting the electronic component E on the mounting board 15a, one mounting head 16 is provided on the moving beam 18 while moving the moving beam 18 along the guide rail 17 in the Y-axis direction. Guide rail 1
By moving the mounting head 16 in the X-axis direction along 9, the mounting head 16 is moved in the horizontal direction. Thereby, one mounting head 16 is moved near the mark M attached to the mounting board 15a. In this state, the lamp 33 is turned on, the image of the mark M is captured on the light receiving surface of the camera 31, and the position of the mark M is accurately detected.

By attaching a plurality of marks M to the mounting substrate 15a in advance, the position of the mounting substrate 15a can be accurately detected from the position of each mark M. If the position of the mounting board 15a is obtained, the position of each electronic component E to be arranged on the mounting board 15a can be calculated based on data stored in a memory in advance.

After the position of the mounting board 15a is detected in this way, as shown in the figure, the two mounting heads 1 are mounted.
In the case where 6 is provided, the electronic component E is mounted on the mounting board 15a using the respective mounting heads 16. At this time, the movement of each mounting head 16 in the horizontal direction is controlled so that the mounting heads 16 do not interfere with each other.

Each of the mounting heads 16 is first moved to a predetermined position of the component supply unit 14, and one of the eight work holders 24 provided on the mounting head 16 is positioned at the upper end of the predetermined electronic component E. I do. When the hollow shaft 23 is moved down in this state, the work holder 24 is moved down to the position of the electronic component E, and the electronic component E can be held.

Next, after the hollow shaft 23 is moved up to raise the electronic component E, the mounting head 16 is moved in the horizontal direction, and the mounting head 16 is stopped at a predetermined position on the mounting board 15a.

In this state, the electronic component E can be placed on the mounting board 15a by moving the hollow shaft 23 holding the electronic component E downward in the same manner as described above.

A mark M is provided at each position where the electronic component E is to be mounted, and when the mounting head 16 is transported to the corresponding mounting position, the mounting head 16 is moved in the horizontal direction based on the mark M. May be corrected.

The present invention is not limited to the above-described embodiment, and it goes without saying that various changes can be made without departing from the scope of the invention.

For example, in the embodiment shown in the drawings, the mark reading apparatus of the present invention is used for an electronic component mounting apparatus, and detects a mark attached to the surface of a member to be detected having a high reflectance. If so, the present invention is not limited to the electronic component mounting device, but can be applied to various devices.
In that case, a camera and a light source are provided on a moving member that moves along the surface of the detected member. In the illustrated case, the present invention is applied to mount a plurality of types of electronic components E on the mounting board 15a. However, the present invention is also applied to a case where a specific electronic component is mounted on a test board as a mounting member. You may do it. Further, in the case shown in the figure, the incident side polarizing member 35 arranged in the incident optical path is rotated to fix the reflecting side polarizing member 36 arranged in the reflected optical path. Alternatively, the reflection side polarizing member 36 may be rotated.

[0037]

According to the present invention, the polarizing members are arranged in the incident light path from the light source to the detected member and in the reflected light path from the detected member to the camera. Even in the case of having a high reflectance like a mirror surface, it is possible to detect the mark attached to the detected member.

When this mark reading device is incorporated in an electronic component mounting device, the mounting efficiency of the electronic component on a mounting board or an inspection board can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an entire electronic component mounting device in which a mark reading device is incorporated.

FIG. 2 is a sectional view taken along line 2-2 in FIG.

FIG. 3 is a sectional view taken along line 3-3 in FIG.

FIG. 4 is a sectional view taken along line 4-4 in FIG. 3;

FIG. 5 is a sectional view showing a mark reading device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Electronic component mounting apparatus 11 Device main body 12 Through-hole 13 Component support stand 14 Component supply part 15 Conveyor 15a Mounting board (inspection member, mounting member) 16 Mounting head (moving member) 17 Guide rail 17a Sliding block 18 Moving Beam 19 Guide rail 19a Sliding block 21 Holder 22 Bearing block 23 Hollow shaft 24 Work holder 30 Mark reader 31 Camera 32 Beam splitter 33 Lamp (light source) 34 Rotating cylinder 35 Incident side polarizing member 36 Reflecting side polarizing member

Claims (2)

[Claims] 1. A mark reading device for detecting a mark provided on a surface of a detected member, provided on a moving member moving along the detected member,
A light source that irradiates the detected member with light; a camera that is provided on the moving member and receives reflected light from the detected member when irradiated from the light source; and an incident light path from the light source to the detected member. An incident-side polarizing member disposed, a reflecting-side polarizing member disposed in a reflected light path from the detected member to the camera, at least one of the incident-side polarizing member and the reflecting-side polarizing member Wherein the mark is rotatable and the mark attached to the detected member is detected by the camera. 2. An electronic component mounting apparatus for mounting an electronic component accommodated in a component supply unit on a member to be mounted, comprising: a work holder for holding the electronic component; A mounting head movably in a horizontal direction between above the mounted member, a light source provided on the mounting head, and irradiating the mounted member with light, and a light source provided on the mounting head and radiated from the light source. A camera that receives reflected light from the mounted member; an incident-side polarizing member disposed on an incident optical path from the light source to the mounted member; and a reflection disposed on a reflected optical path from the mounted member to the camera. A side polarizing member, wherein at least one of the incident side polarizing member and the reflecting side polarizing member is rotatable so that a mark attached to the mounted member is detected by the camera. An electronic component mounting device, characterized in that: