JPH11261240A - Bond for multi-wire wiring board, multi-wire wiring board using the same, and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bond for multi-layer wiring board, a multi-layer wiring board using it, and a method for manufacturing it which is excellent in suppressing degradation of insulation resistance, excellent in position precision of an insulation-coated wire, similar in solidification substance characteristics of glass transfer temperature, etc., to an adjoining insulating layer, excellent in flexibility, excellent in coat formation, and excellent in durability of non- adhesiveness except when wire placing is maintained while solvent is removed at low temperature in short time. SOLUTION: Softening temperature of the bond in B stage is 20-100 deg.C, wherein glass transition temperature of a setting substance is 170 deg.C or above, linear expansion factor at glass transition tempetrature-350 deg.C is 1000 ppm/ deg.C or less, stored elastic modulus at 300 deg.C is 30 Mpa or above, comprising siloxane denaturation polyamide imide resin and thermo-setting component.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an adhesive used for a multi-wire wiring board, a multi-wire wiring board using the adhesive, and a method of manufacturing the same.

[0002]

2. Description of the Related Art A multi-wire wiring board in which an adhesive layer is provided on a substrate, an insulated wire for forming a conductor circuit is wired and fixed, and the layers are connected by through holes is disclosed in U.S. Pat. No. 4,097,684. Gazette, 3,646,572 gazette, 3,674,914 gazette, and 3,674,60
No. 2 discloses a printed wiring board which can provide high-density wiring and is advantageous for matching characteristic impedance and reducing crosstalk.

[0003] The above-mentioned US Patent Publication discloses a process for manufacturing a multi-wire wiring board using an adhesive layer composed of a thermosetting resin, a curing agent, and a rubber component.
Laminating the adhesive on the inner layer circuit board, (3) fixing the insulated wire by a numerically controlled automatic wiring machine, (4) laminating the prepreg, (5) drilling through holes,
(6) It describes that copper plating is performed on the inner wall of the through hole. The reason for using a prepreg in this step (4) is to prevent the insulation coating wire from peeling off when drilling a hole in a drill or the like,
This is to prevent the reliability of the insulation-coated wire from being reduced due to damage.

[0004] Printed wiring boards including multi-wire wiring boards have been increased in density to cope with high-density mounting.
When miniaturization is advanced and this high density is to be applied to a multi-wire wiring board, the insulation resistance of the insulation-coated wire to the insulation-coated wire, the insulation resistance of the insulation-coated wire to the inner-layer circuit layer, and the positional accuracy of the insulation-coated wire Is very important, it is necessary to keep the insulation resistance between adjacent conductors large, and to prevent the insulated wire from moving in the wiring or a process after the wiring. In the prior art, the positional accuracy of the wire is practically used because the wiring density is small and the hole diameter is large, although there is a movement of about 0.2 mm from the design value (hereinafter referred to as wire swimming). Met. However, as the wiring density increases, the adhesive resistance using a rubber component extremely decreases the insulation resistance.In addition, as the density increases, the hole diameter also decreases. There has been a problem in that the insulated wire at the desired position moves and is not connected, resulting in poor connection. This is because the insulation resistance of the rubber component itself is low, and wire wiping occurs because the prepreg and the like are laminated and bonded while the flow of the rubber component in the adhesive remains after wiring.

Therefore, as disclosed in Japanese Patent Publication No. 5-164525, a phenol resin is used as an adhesive.
A UV-curable adhesive sheet containing an epoxy resin, an epoxy resin-modified polybutadiene or the like as a component has been developed. This adhesive, after wiring, after slightly curing the adhesive with ultraviolet light, to perform lamination, can suppress wire swimming,
By introducing a polymer component having a high insulation resistance instead of the rubber component of the adhesive, a decrease in the insulation resistance is suppressed.

[0006]

However, in recent years, multi-wire wiring boards have been required to cope with higher-density mounting, and the number of multilayers has been increasing. In addition, the adhesive must consider that no rubber component is added to suppress the decrease in insulation resistance, the position accuracy of the insulation-coated wire must be increased, and the glass transition between adjacent insulation layers. It is necessary to approximate the properties of the cured product such as temperature, to have flexibility to use the conventional manufacturing equipment as much as possible, to be able to form a film, to be able to maintain non-stickiness except at the time of wiring, and to remove the solvent. It can be performed at a low temperature in a short time.

For example, the adhesive disclosed in Japanese Examined Patent Publication No. 5-164525 employs a polymer component instead of the rubber component in order to suppress a decrease in insulation resistance among the above-mentioned requirements. A plasticizer, a solvent, a reactive diluent, or the like is used to enable film formation. When this adhesive is used, a preliminary curing step using ultraviolet light is added between the wiring step and the laminating step. Because
Conventionally, the prepreg was laminated immediately after the insulation-covered wire was laid. However, if the prepreg was laminated after the laying when this adhesive was used, wire swimming would be large. However, as described above, even though the decrease in insulation resistance can be suppressed without adding a rubber component, the difference in cured material properties such as the glass transition temperature between the adjacent insulating layers is large, and the processing step as a wiring board is difficult. In addition, there is a problem that not only generation of voids and separation due to a difference in shrinkage in a cooling process after a heating process but also generation of voids and separation due to heating and cooling in a process of mounting an electronic component occurs.

The present invention is excellent in suppressing a decrease in insulation resistance,
Excellent in positioning accuracy of insulation coated wire, close to the cured material properties such as glass transition temperature with the adjacent insulation layer, excellent in flexibility, excellent in film formation, can maintain non-adhesiveness except when wiring, It is another object of the present invention to provide an adhesive for a multi-wire wiring board capable of removing a solvent at a low temperature in a short time, a multi-wire wiring board using the adhesive, and a method for manufacturing the same.

[0009]

The adhesive for a multi-wire wiring board of the present invention has a softening temperature of 20 to 20 in the B-stage state.
100 ° C adhesive with glass transition temperature of 1
It has a linear expansion coefficient of 1000 ppm / ° C. or less at a temperature of 70 ° C. or more and a glass transition temperature of 350 ° C. or less, and a storage elastic modulus at 300 ° C. of 30 MPa or more, and is composed of a siloxane-modified polyamideimide resin and a thermosetting component. It is characterized by the following.

[0010] If the softening temperature in the B stage state exceeds 100 ° C, peeling occurs due to insufficient adhesive strength when the insulated wire is laid. If the softening temperature is lower than 20 ° C, the adhesive has tackiness because it has tackiness. Gets worse. Furthermore, the glass transition temperature of the cured product of the adhesive is less than 170 ° C.,
Coefficient of linear expansion from glass transition temperature to 350 ° C is 1000p
If it exceeds pm / ° C., or if the storage elastic modulus at 300 ° C. is less than 30 MPa, the solder heat resistance of the multi-wire wiring board manufactured using this adhesive decreases.

Further, by using a polyamide-imide resin modified with siloxane as compared with a general aromatic polyamide-imide resin, the solvent in the adhesive can be removed at a low temperature and in a short time, and the production process can be shortened. is there.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The siloxane-modified polyamideimide resin of the present invention preferably has a molecular weight of 40,000 or more. If the molecular weight is less than 40,000, the flexibility of the adhesive is reduced and handling becomes poor. If a hot press is performed immediately after wiring, wire swimming will occur.

The thermosetting component is preferably 10 to 150 parts by weight based on 100 parts by weight of the siloxane-modified polyamide-imide resin, and if the thermosetting component is less than 10 parts by weight, the siloxane-modified polyamide-imide resin may be used. Characteristic appears as it is, the coefficient of linear expansion is not improved, and
If the amount exceeds 150 parts by weight, gelation occurs during mixing and stirring, and the flexibility of the adhesive is reduced, resulting in poor handling.

The thermosetting component is an epoxy resin and a curing agent or a curing accelerator for the epoxy resin. The epoxy resin may be any one having at least two glycidyl groups. Can be used with 3 glycidyl groups
More than one is more preferable. This epoxy resin
It may be liquid or solid at room temperature. Examples of the liquid epoxy resin include bisphenol A type YD8125 (trade name, manufactured by Toto Kasei Co., Ltd.), YD128 (trade name, manufactured by Toto Kasei Co., Ltd.), Ep815 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.), Ep828 (Trade name, manufactured by Yuka Shell Epoxy Co., Ltd.), DER337 (trade name, manufactured by Dow Chemical Japan Co., Ltd.), bisphenol F type YDF17
0 (trade name, manufactured by Toto Kasei Co., Ltd.), YDF2004
(Trade name, manufactured by Toto Kasei Co., Ltd.). Examples of the solid epoxy resin include YD907 (trade name, manufactured by Toto Kasei Co., Ltd.), YDCN704S (trade name, manufactured by Toto Kasei Co., Ltd.), YDPN172 (trade name, manufactured by Toto Kasei Co., Ltd.), and YP50 (trade name, manufactured by Toto Kasei Co., Ltd.) Ep1001 (made by Yuka Shell Epoxy Co., Ltd.)
Trade name), Ep1010 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.), Ep180S70 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.), ESA019 (trade name, manufactured by Sumitomo Chemical Co., Ltd.), ESCN195 (Sumitomo Chemical Industries, Ltd.) DER667 (manufactured by Dow Chemical Japan KK, trade name), DEN438 (manufactured by Dow Chemical Japan KK, trade name), EOCN1020 (manufactured by Nippon Kayaku Co., Ltd., trade name) and the like. . Further, in order to improve the flame retardancy, a brominated epoxy resin may be used. For example, YDB400 (trade name, manufactured by Toto Kasei Co., Ltd.), Ep5050 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.)
Trade name) and ESB400 (trade name, manufactured by Sumitomo Chemical Co., Ltd.). These may be used alone, but a plurality of epoxy resins may be selected as necessary.

As the curing agent or curing accelerator for the epoxy resin, amines, imidazoles, polyfunctional phenols, acid anhydrides and the like can be used. Examples of amines include dicyandiamide, diaminodiphenylmethane, and guanylurea.Examples of imidazoles include alkyl-substituted imidazole and benzimidazole.Examples of polyfunctional phenols include hydroquinone, resorcinol,
Bisphenol A and its halogen compounds, as well as novolak and resole resins, which are addition condensation products of these polyfunctional phenols and aldehydes, are phthalic anhydride, hexahydrophthalic anhydride, benzophenonetetracarboxylic acid. Etc.

In the case of amines, the necessary amount of these curing agents is preferably such that the equivalent of the active hydrogen of the amine is substantially equal to the epoxy equivalent of the epoxy resin. For example, in the case of a primary amine, there are two hydrogens, and 0.5 equivalent of the primary amine is required for 1 equivalent of the epoxy resin,
In the case of a secondary amine, one equivalent is required. Next, in the case of imidazoles, the equivalence ratio with active hydrogen is not simply obtained,
Empirically, 1 to 10 parts by weight of epoxy resin
Parts by weight are required. In the case of polyfunctional phenols and acid anhydrides, 0.8 to 1.2 equivalents are required for 1 equivalent of the epoxy resin.

In addition, a catalyst for electroless plating can be added to increase the plating adhesion of the inner wall of the through hole and the like as required, and to manufacture a wiring board by an additive method.

In the present invention, these compositions are mixed in an organic solvent to form an adhesive varnish. As the organic solvent, any solvent can be used as long as solubility can be obtained.Examples thereof include dimethylacetamide, dimethylformamide, dimethylsulfoxide, N-methyl-2-pyrrolidone, γ-butyrolactone, toluene, cyclohexanone, and sulfolane. Can be illustrated.

An example of a method for manufacturing a multi-wire wiring board using this adhesive is as follows. First, as shown in FIG. 1A, an inner-layer circuit board having a conductor circuit 2 such as a power supply and a ground provided in advance on the surface of an insulating plate 1 is prepared. The conductive circuit 2 is formed by etching and removing unnecessary copper foil such as a glass cloth epoxy resin copper-clad laminate or a glass cloth polyimide resin copper-clad laminate. If necessary, a multilayer circuit board may be used for the inner layer circuit board, or an insulating substrate may be used.

Next, as shown in FIG. 1B, an insulating layer is formed as an underlay layer 3 on the inner layer circuit board. This is provided to improve the corrosion resistance and adjust the characteristic impedance, but may not be always necessary, for example, when the above-mentioned inner circuit board is used as an insulating substrate. As the underlay layer 3, a B-stage prepreg made of ordinary glass cloth epoxy resin or glass cloth polyimide resin, or a B-stage resin sheet containing no glass cloth can be used. After laminating these resin layers on the substrate, heat treatment or curing by lamination is performed as necessary.

Next, as shown in FIG. 1C, both sides of the insulated inner circuit board or both sides of the insulating substrate are
The adhesive of the present invention is applied directly to the substrate by spray coating, screen printing or the like, or dried, or a carrier film such as polypropylene or polyethylene terephthalate, once roll-coated and coated and dried to form a dry film. The adhesive layer 4 is provided on the insulating substrate by hot roll lamination or press lamination.
Above all, the use of dry film adhesives
This is preferable because a uniform film thickness is obtained and the characteristic impedance is uniform.

Next, as shown in FIG. 1 (d), the insulating coated wire 5 is pressed by a wiring machine while applying ultrasonic vibration or the like. Due to this ultrasonic vibration, the adhesive layer 4 is softened, the adhesive force is activated, and the insulating coating wire 5 is embedded in the adhesive layer 4 by pressure and fixed.

Copper or a copper alloy is used as a core material of the insulated wire 5 used for the wiring, and is coated with a polyimide resin or the like so as not to be short-circuited even if the wires are crossed on the same plane. Is used. Further, in order to increase the adhesion at the intersection between the insulated wire 5 and the insulated wire 5, it is preferable to further provide a wire adhesive layer outside the insulative coating layer. Although heat-curable and light-curable materials can be used, it is preferable that the adhesive has the same composition as the adhesive.

After completing the wiring, the wiring on the other side is similarly performed, and then the heating press is performed. This reduces unevenness on the surface of the substrate and leaves the substrate in the adhesive layer 4. The voids in the adhesive layer 4 are generated when the insulation-coated wire 5 is wired while being ultrasonically heated during the wiring, or the voids in the insulation-coated wire 5 and the insulation-coated wire 5 are removed. Since it is caused by a space generated near the intersection, smoothing of the wired substrate surface by a heat press and removal of voids in the adhesive layer 4 are indispensable. After this heat pressing, it is preferable that the adhesive layer 4 is completely cured by a heat treatment, but it can be omitted if necessary.

Next, as shown in FIG. 1 (e), an overlay layer 6 is provided for protecting the wired insulated wire 5 and the overlay layer 6 is formed of a normal glass cloth epoxy resin or glass. A B-stage prepreg of a cloth polyimide resin or a B-stage resin sheet not containing a glass cloth is applied and finally cured.

Next, as shown in FIG. 1 (f), holes 7 are made in necessary places, and then plating is performed as shown in FIG. 1 (g). Here, at the time of forming the overlay layer 6 before drilling, a copper foil is bonded to the surface via a prepreg, unnecessary copper foil is removed by etching, and the surface circuit 8 can be formed. A multi-layer wiring board with layers is completed.

Further, next, the completed two multi-wire wiring boards are placed on the interlayer insulating layer 9 as shown in FIG.
As a B-stage prepreg of glass cloth epoxy resin or glass cloth polyimide resin, or a B-stage resin sheet that does not contain glass cloth, it is laminated and adhered, a through hole 10 is opened at a necessary place, and plating is performed. Thus, a multi-wire wiring board having four wiring layers is completed.
Also, by laminating and bonding three or more multi-wire wiring boards of two-layer wiring via an insulating layer, a multi-wire wiring board having six or more wiring layers can be obtained. If necessary, a circuit-forming layer may be included between two or more two-layer wiring multi-wire wiring boards via an insulating layer.

(Function) By using a resin containing a siloxane-modified polyamideimide resin as the main component for the adhesive for a multi-wire wiring board of the present invention, the volatility of the solvent is improved and the production process can be shortened. By setting the softening temperature of the adhesive in the B-stage state to 20 to 100 ° C., it is possible to maintain the adhesive force between the adhesive layer of the insulating coating wire and the adhesive provided on the substrate when wiring at high density. Thereby, the wiring property is improved, and the handling property can be further improved. Further, by setting the glass transition temperature of the cured product of the adhesive to 170 ° C. or more, the linear expansion coefficient at the glass transition temperature to 350 ° C. to 1000 ppm / ° C. or less, and the storage elastic modulus at 300 ° C. to 30 MPa or more, The solder heat resistance of the multi-wire wiring board using the agent can be improved.

In the present invention, since a siloxane-modified polyimide resin having a molecular weight of 40,000 or more is used,
Since the flow of the resin is small and the wire swimming is hardly observed even if the heating press is performed after the wiring, the insulating coating wire can be fixed by the heating press and the adhesive can be cured.

Further, in the present invention, air bubbles generated in the adhesive and spaces generated near the intersections of the wires generated up to the wiring step can be removed by the heating press after the wiring, and the unevenness on the substrate surface can be reduced. Further, since the solvent in the adhesive can be removed at a low temperature and in a short time, even after providing the overlay layer as shown in FIG. It becomes possible to manufacture a wire wiring board.

[0031]

EXAMPLES (Varnish for Adhesive) An aromatic polyamide-imide resin (hereinafter, referred to as PAI) and a siloxane-modified polyamide-imide resin (hereinafter, referred to as SPAI) produced by the following production method are shown in Table 1. Various varnishes were prepared according to the formulas shown, to give a varnish for an adhesive.

(Production of PAI) A three-liter aromatic ring was placed in a 1-liter separable flask equipped with a faucet connected to a reflux condenser, a 25-ml water content receiver, a thermometer and a stirrer.
BAPP (2,2-bis-
[4-aminophenoxy) phenyl] propane) 12
3.2 g (0.3 mol), trimellitic anhydride 11
5.3 g (0.6 mol) of NMP (N-
716 g of methyl-2-pyrrolidone) was added and stirred at 80 ° C. for 30 minutes. Then, 143 g of toluene was charged as an aromatic hydrocarbon azeotropic with water, and then the temperature was increased and the mixture was refluxed at about 160 ° C. for 2 hours. After confirming that water has accumulated in the water quantification receiver of about 10.8 ml or more, and that distilling of water has not been observed, about 190 The temperature was raised to ° C. to remove the toluene. Thereafter, the solution was returned to room temperature, and 75.1 g (0.3 mol) of 4,4′-diphenylmethane diisocyanate was used as an aromatic diisocyanate.
And reacted at 190 ° C. for 2 hours. After the reaction,
An NMP solution resin of PAI was obtained.

(Production of SPAI) In a 1-liter separable flask equipped with a faucet connected to a reflux condenser and having a 25 mol water content receiver, a thermometer, and a stirrer, a diamine having three or more aromatic rings was prepared. , 2-bis- [4
-(4-aminophenoxy) phenyl] propane
7 g (0.16 mol), 1 as siloxane diamine
61AS (manufactured by Shin-Etsu Chemical Co., Ltd., product name) 33.3
g (0.04 mol) trimellitic anhydride 80.7 g
(0.42 mol) as a solvent was charged with 560 g of NMP, and the mixture was stirred at 80 ° C. for 30 minutes. Then, 100 g of toluene was added as an aromatic hydrocarbon capable of azeotropic distillation with water, and then the temperature was increased and the mixture was refluxed at about 160 g for 2 hours. After confirming that about 7.2 ml or more of water has accumulated in the moisture quantification receiver and that distilling of water has not been observed, about 190 ml of water was removed while removing the distillate accumulated in the moisture quantification receiver. The temperature was raised to ° C. to remove the toluene. Thereafter, the solution was returned to room temperature, and 4,4'-
60.1 g of diphenylmethane diisocyanate (0.2
4 mol) and reacted at 190 ° C. for 2 hours. After completion of the reaction, an NMP solution resin of SPAI was obtained.

The insulating varnish produced as described above is
Tetron film S-31 (trade name, manufactured by Teijin Limited), which is a transfer substrate, so that the film thickness after drying is 80 μm.
And dried so that the softening point on the B stage was 50 ° C. to prepare an adhesive sheet, and various properties were measured as follows. Table 1 shows the results. (1) Glass transition temperature (Tg) Using TMA manufactured by MAC SCIENCE, jig: pull, distance between chucks: 15 mm, measurement temperature: room temperature to 35
0 ° C., heating rate: 10 ° C./min, tensile load: 5
g, sample size: Measured at 5 mm width × 25 mm length. (2) Coefficient of linear expansion Measured under the same apparatus and measurement conditions as in (1). (3) Storage elastic modulus Using DVE (DVE-V4 type) manufactured by Rheology, jig: pulling, distance between chucks: 20 mm, measurement temperature:
Room temperature to 350 ° C., heating rate: 5 ° C./min, sample size: 5 mm width × 30 mm length.

[0035]

[Table 1]

Using the above adhesive, a multi-wire wiring board was produced by the following method. (Coating of Adhesive) A varnish for adhesive having the above composition was applied to Tetron film S-31 (trade name, manufactured by Teijin Limited) as a transfer substrate so that the film thickness after drying was 80 μm. , Dried so that the softening point in the B stage becomes 50 ° C.,
An adhesive sheet was used.

(Substrate with Adhesive Coating) Unnecessary copper foil of glass cloth polyimide resin double-sided copper-clad laminate MCL-I-671 (trade name, manufactured by Hitachi Chemical Co., Ltd.) is selectively removed by etching. A glass cloth polyimide resin prepreg GIA-671 (manufactured by Hitachi Chemical Co., Ltd., trade name) is hardened on both sides of the substrate by hot pressing to form an underlay layer. Both surfaces were bonded by a hot press.

(Wiring) Subsequently, an insulating coated wire HAW-216C obtained by applying a phenoxy resin-based adhesive to the substrate.
(Trade name, manufactured by Hitachi Cable, Ltd.) was wired by a wiring machine while performing ultrasonic heating.

(Heating Press) Next, using a polyethylene sheet as a cushion material, 175 ° C., 30 minutes, 25 kgf
/ Cm ² under hot press.

(Removal of Solvent) Next, heat treatment was performed at 150 ° C. for 30 minutes to remove the residual solvent and cure the adhesive layer.

(Formation of Surface Circuit Layer) Next, glass cloth polyimide resin prepreg GIA-671 (trade name, manufactured by Hitachi Chemical Co., Ltd.) was applied on both sides of the substrate, and 1
The 8 μm copper foil was cured by a hot press to form a surface circuit layer.

(Drilling / Through Hole Formation) Subsequently, holes were drilled at necessary places on the substrate. Then, after performing a pretreatment such as hole cleaning to remove smears and the like, immerse in an electroless copper plating solution, perform plating to a thickness of 30 μm, and selectively remove unnecessary portions on one copper plating surface. To form a surface circuit to obtain a two-layer multi-wire wiring board.

(Preparation of a Four-Layer Wiring Structure Multiwire Wiring Board) A glass cloth polyimide resin prepreg GI is provided between the surfaces of two two-layer multiwire wiring boards on which surface circuits are formed.
A-671 (trade name, manufactured by Hitachi Chemical Co., Ltd.) is sandwiched, laminated under heat and pressure, integrated, drilled, plated with through-holes on the inner wall of the hole, and formed copper without a surface circuit by etching. Unnecessary portions of the plating surface were selectively removed by etching to form a circuit, and a four-layer wiring structure multi-wire wiring board was manufactured.

(Solder Heat Resistance Test) The above-described four-layer wiring structure multi-wire wiring board was dried at 130 ° C. for 6 hours to completely remove moisture from the substrate, and to prevent the substrate from absorbing moisture in the desiccator. , Cooled to room temperature and immediately thereafter 288
Floating in a solder bath at 10 ° C for 10 seconds and letting it cool to room temperature.
Repeatedly, the state of the substrate was observed.

As a result, in each of the formulations used in Examples 1 to 4, there was almost no residual solvent in the substrate, and the mechanical properties were good. The multi-wire wiring board using these was good without voids and peeling even after the solder heat resistance test.

On the other hand, Comparative Examples 1 and 2 show a general P
When AI was used and the solvent was removed at a low temperature of 150 ° C., about 10% of the solvent remained in the substrate. Multi-wire wiring boards using these, after the solder heat resistance test,
A void was generated by the solvent. In Comparative Example 3, the film could not be formed because the thermosetting component was 150 parts by weight or more.

[0047]

As described above, according to the present invention, the reduction of insulation resistance is excellent, the positional accuracy of the insulation-coated wire is excellent, and the properties of the cured product such as the glass transition temperature with the adjacent insulation layer are excellent. Excellent in flexibility, excellent in film formation,
Provided are an adhesive for a multi-wire wiring board, which can maintain non-tacky properties other than at the time of wiring and can remove a solvent at a low temperature and in a short time, a multi-wire wiring board using the adhesive, and a method for manufacturing the same. Can be.

[Brief description of the drawings]

1 (a) to 1 (h) are cross-sectional views of respective manufacturing steps showing one embodiment of the present invention.

[Explanation of symbols]

1. Insulating plate 2. 2. Conductor circuit Underlay layer 4. Adhesive layer 5. Insulated wire 6. 6. overlay layer Hole 8. Surface circuit 9. Interlayer insulating layer 10. Through hole

Continued on the front page (72) Inventor ▲ Tsuru ▼ Yoshiyuki 1500 Ogawa, Shimodate-shi, Ibaraki Pref.Hitachi Chemical Industry Co., Ltd.

Claims (8)

[Claims] A softening temperature in a B-stage state is 20 to 10.
It is an adhesive of 0 ° C. and has a glass transition temperature of 170
The composition has a linear expansion coefficient of 1000 ppm / ° C. or less at a glass transition temperature of 350 ° C. or more and a storage elastic modulus of 300 MPa or more at 300 ° C., and is composed of a siloxane-modified polyamideimide resin and a thermosetting component. An adhesive for a multi-wire wiring board, characterized in that: 2. The adhesive for a multi-wire wiring board according to claim 1, wherein the siloxane-modified polyamideimide resin has a molecular weight of 40000 or more. 3. A siloxane-modified polyamide-imide resin 10.
The adhesive for a multi-wire wiring board according to claim 1 or 2, wherein the thermosetting component is in a range of 10 to 150 parts by weight with respect to 0 parts by weight. 4. The adhesive for a multi-wire wiring board according to claim 1, wherein the thermosetting component is an epoxy resin and a curing agent for the epoxy resin. 5. The adhesive for a multi-wire wiring board according to claim 1, wherein the thermosetting component is an epoxy resin and a curing accelerator for the epoxy resin. 6. The adhesive for a multi-wire wiring board according to claim 1, wherein the thermosetting component is an epoxy resin, a curing agent for the epoxy resin, and a curing accelerator for the epoxy resin. . 7. An adhesive layer comprising the adhesive according to claim 1 on a substrate or an insulating substrate on which a conductor circuit has been formed in advance, and an insulating coated wire fixed to the adhesive layer. A multi-wire wiring board comprising a through hole provided at a location required for connection. 8. An adhesive layer according to any one of claims 1 to 6, which is applied onto a substrate or an insulating substrate on which a conductor circuit has been formed in advance, or the adhesive applied to a carrier film is transferred to form an adhesive layer. After forming and arranging the insulation-coated wire on the adhesive layer and fixing the same, the substrate is heated and pressed to harden the adhesive layer. Further, a hole is formed in a necessary portion, and plating is performed on an inner wall of the hole. And forming a conductor circuit by performing the method.