JPH10242654A - Multilayer printed wiring board and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which is excellent in the high density and the minuteness of an interconnection, which can be made thin and whose heat resistance and connecting reliability are high, and to provide a method in which the multilayer printed wiring board is manufactured with good efficiency. SOLUTION: In a multilayered printed wiring board, a plurality of insulating boards on which conductors circuits are formed in advance are laminated and bonded via a heat-resistant resin composition which is composed of a polyimide resin and of a thermosetting component, and they are connected electrically via respective through holes. In this case, the multilayered printed wiring board in which the glass transition point of the hardened substance of the heat-resistant resin composition is 180 deg.C or higher, in which its coefficient of linear expansion up to 350 deg.C from the glass transition point is 500ppm/ deg.C or lower, and in which its modulus of elasticity at 300 deg.C is 30MPa or higher and the plurality of insulating boards on which the conductor circuits are formed in advance are laminated and bonded via a heat-resistant resin composition whose glass transition point is 180 deg.C or higher, whose coefficient of linear expansion up to 350 deg.C from the glass transition point is 500ppm/ deg.C or lower, and whose modulus of elasticity at 300 deg.C is 30MPa or higher, comprising a polyimide resin and a thermosetting composition, and both are connected electrically via respective through holes.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board and a method for manufacturing the same.

[0002]

2. Description of the Related Art With the miniaturization, high performance, and multifunctionality of electronic equipment, multilayer printed wiring boards have been further densified. In order to achieve high density, thinning between layers, miniaturization of wirings, and reduction in diameter of interlayer connection holes have progressed, and further, interstitial via holes (hereinafter, referred to as IVH) that connect only adjacent wiring layers. ) Has been used. In order to further increase the density, it is necessary to reduce the diameter of the IVH and increase the number of layers. As an example of a multilayer printed wiring board, a so-called build-up multilayer wiring board having a configuration in which insulating layers and conductive circuits are alternately stacked on the outer surface of an inner layer board has been proposed.

Here, a general procedure for manufacturing a build-up multilayer wiring board will be described. The outer surface of an inner layer board on which an inner layer circuit is formed is coated with an additive adhesive and cured by a first adhesive. A second insulating layer is formed. The additive adhesive means an adhesive for forming a conductive circuit by performing electroless plating on the surface thereof. Next, a hole for forming an IVH is formed in a predetermined portion of the insulating layer by a laser, wet etching, or photo method. Here, each of the above methods is a method of irradiating the insulating layer with a laser beam to evaporate, a method of etching and removing the insulating layer with a chemical etching solution, and a method of selectively photocuring the insulating layer, Is a method of developing and removing. Perform surface roughening treatment on the interlayer insulating layer, apply a catalyst to deposit electroless copper plating on the roughened surface, deposit electroless copper plating thinly, and form a current path for electroplating Then, plating is performed thereon to a required thickness by electroplating, an etching resist is formed, and a portion where the etching resist is not formed is selectively removed by etching to form an outer layer wiring. Further, the second interlayer insulating layer and the conductor layer can also be formed basically by repeating the process of the build-up method.

In order to reduce the thickness of a multilayer printed wiring board, it has been proposed to reduce the thickness of an interlayer insulating layer. For example, a prepreg containing a reinforcing material such as a glass cloth, which is used for an ordinary multilayer printed wiring board, has been proposed. When used as an interlayer insulating layer, there is a limit to the reduction in thickness, and a resin sheet not containing a glass cloth or the like has been developed as an interlayer insulating layer.

[0005]

However, the above IVH
When plating is performed on such a concave portion, a dent is formed in the center of the IVH, and when the second build-up layer is formed with the dent remaining, irregularities are formed on the substrate surface, resulting in poor smoothness. As a substrate, it causes a decrease in bonding accuracy at the time of component mounting, a short circuit and a disconnection failure at the time of wiring formation.

In addition, the number of layers not containing a reinforcing material such as glass cloth in the multilayer wiring board increases, so that a difference in glass transition point, coefficient of linear expansion, or storage elastic modulus between the multilayer wiring board and the inner insulating board causes an increase in interlayer resistance. There is a problem that voids and peeling easily occur in the insulating layer.

SUMMARY OF THE INVENTION The present invention provides a multilayer printed wiring board having high heat resistance and connection reliability, which is excellent in high density and fine wiring, regardless of the presence or absence of via holes, and enables thinning of wiring boards. It is another object of the present invention to provide a method for efficiently manufacturing such a multilayer printed wiring board.

[0008]

According to the present invention, there is provided a multilayer printed wiring board comprising a plurality of insulating plates on which conductive circuits are formed in advance, via a heat-resistant resin composition comprising a polyamideimide resin and a thermosetting component. In the multilayer printed wiring board bonded and electrically connected through the through holes, the cured product of the heat-resistant resin composition has a glass transition point of 180 ° C. or higher and a linear expansion coefficient from the glass transition point to 350 ° C. of 500 ppm.
/ ° C or lower and storage elastic modulus at 300 ° C is 30 MPa or more.

Further, at least one or more conductor circuits formed on the surface of an insulated substrate by a heat-resistant resin composition comprising a polyamide-imide resin and a thermosetting component are formed through at least one or more via holes. In the multi-layer printed wiring board electrically connected to each other, the cured product of the heat-resistant resin composition has a glass transition point of 180 ° C. or more, a linear expansion coefficient from the glass transition point to 350 ° C. of 500 ppm / ° C. or less, and 300 ° C. Is characterized by having a storage modulus of 30 MPa or more.

[0010] Such a multilayer printed wiring board can be manufactured by the following steps. a. A thermosetting polyamide-imide adhesive film composed of a polyamide-imide resin and a thermosetting component, interposed between a plurality of insulating plates and an outer layer copper foil in which a conductor circuit is formed in advance,
Step of heat-curing by heating and pressurizing and laminating and bonding b. Drilling a through hole at a desired position to expose a conductor circuit for conducting each layer c. Plating step for electrically connecting each conductor circuit layer d. Forming an etching resist on the outer layer copper foil and forming a wiring circuit on the copper foil surface by selective etching; e. Step of removing etching resist

Further, it can also be manufactured by the following steps. a. A thermosetting polyamide-imide adhesive film composed of a polyamide-imide resin and a thermosetting component is interposed between the inner layer plate and the outer layer copper foil on which a conductor circuit has been formed in advance, and heated and heated.
Step of heat-curing under pressure and laminating and bonding b. Step of forming an etching resist on the outer layer conductor and forming fine holes in the copper foil surface by selective etching c. Removing the etching resist d. Removing the cured resin layer under the micro holes by laser drilling, drilling via holes, and exposing the conductor circuit of the inner layer plate e. Plating step for electrically connecting the conductor circuit of the inner layer plate and the outer layer copper foil f. Forming an etching resist on the outer layer copper foil and forming a wiring circuit on the copper foil surface by selective etching; g. Step of removing etching resist

Further, h. Repeat steps a to g, 2
Multiple layers can be stacked by adding a step of forming via holes continuously over more than one layer. Further, instead of the adhesive film and the copper foil used in the step a, an adhesive film with a copper foil in which an adhesive material is directly applied to the copper foil in advance can be used.

In the present invention, the cured product of the heat-resistant resin composition has a glass transition point of less than 180 ° C. or a coefficient of linear expansion from the glass transition point to 350 ° C. of 500 pp.
If the temperature exceeds m / ° C., voids and peeling occur due to the difference in shrinkage from the insulating plate in the cooling process after heating during solder mounting, and the storage elastic modulus at 300 ° C. is 30 MPa.
If it is less than 3, the resin flows at the time of heating, the resin flows to a portion which is easily expanded, and voids are easily generated due to uneven film thickness or the flow of the resin.

The heat-resistant resin composition of the present invention is characterized in that it is a thermosetting polyamide-imide-based adhesive film comprising a polyamide-imide resin and a thermosetting component. When the polyamideimide resin is used alone, the glass transition point is high (230 to 250 ° C.), but the linear expansion coefficient from the glass transition point to 350 ° C. is 500 ppm / ° C. or more, and the storage elastic modulus at 300 ° C. is 30 MPa or less. When this is used, voids or peeling occur in the board after solder mounting.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION
An aromatic diimide carboxylic acid obtained by reacting a diamine having three or more aromatic rings with trimetic anhydride,
As an aromatic polyamide-imide resin obtained by reacting with an aromatic diisocyanate or an aromatic diimide carboxylic acid, 2,2-bis [4- {4- (5-hydroxycarbonyl-1,3-dione-isoindolino)] It is preferable to use an aromatic polyamideimide resin obtained by reacting [phenoxydiphenyl] propane with 4,4′-diphenylmethane diisocyanate as the aromatic diisocyanate.

Diamines having three or more aromatic rings include:
2,2-bis [4- (4-aminophenoxy) phenyl] propane, bis [4- (3-aminophenoxy) phenyl] sulfone, bis [4- (4-aminophenoxy) phenyl] sulfone, 2,2- Bis [4- (4-aminophenoxy) phenyl] hexafluoropropane,
Bis [4- (4-aminophenoxy) phenyl] methane, 4,4-bis (4-aminophenoxy) biphenyl, bis [4- (4-aminophenoxy) phenyl] ether, bis [4- (4-aminophenoxy) )] Phenyl] ketone, 1,3-bis (4-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene and the like can be used alone or in combination.

The aromatic diisocyanate includes 4,4
4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-diisocyanate, 2,
4-Tolylene dimer or the like can be used alone or in combination.

Further, the thermosetting component of the present invention is characterized in that it is an epoxy resin and its curing agent or curing accelerator. The epoxy resin may be any resin as long as it has two or more glycidyl groups, and more preferably three or more glycidyl groups. The epoxy resin may be liquid or solid at room temperature. Commercially available products include bisphenol A type liquid epoxy resins such as YD128 and YD8125 (trade name, manufactured by Toto Kasei Kogyo Co., Ltd.), Ep815, Ep828 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.), and the like. And DER337 (trade name, manufactured by Dow Chemical Industry Co., Ltd.), and bisphenol F type YDF170, YDF2004, etc. (trade name, manufactured by Toto Kasei Kogyo Co., Ltd.). As solid epoxy resins, YD907, YDCN704
S, YDPN172 (all manufactured by Toto Kasei Kogyo Co., Ltd.), Ep1001, Ep1010, Ep1
80S70 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.)
ESA019, ESCN195 (manufactured by Sumitomo Chemical Co., Ltd., trade name), DER667, DEN438 (manufactured by Dow Chemical Industry Co., Ltd., trade name), EOCN102
0 (manufactured by Nippon Kayaku Co., Ltd., trade name) and the like. Further, in order to improve the flame retardancy, a brominated epoxy resin may be used.
00 (manufactured by Toto Kasei Kogyo Co., Ltd.), Ep50
E (manufactured by Yuka Shell Epoxy Co., Ltd.)
SB400 (manufactured by Sumitomo Chemical Co., Ltd., trade name) and the like. These may be used alone, but a plurality of epoxy resins may be selected as necessary.

As the curing agent or curing accelerator for the epoxy resin, amines, imidazoles, polyfunctional phenols, acid anhydrides, isocyanates and the like can be used. Examples of amines include dicyandiamide, diaminodiphenylmethane, and guanylurea.Examples of imidazoles include alkyl-substituted imidazole and benzimidazole.Examples of polyfunctional phenols include hydroquinone, resorcinol, bisphenol A and halogen compounds thereof. These include novolaks and resole resins which are condensates with aldehydes, and the acid anhydrides include phthalic anhydride, hexahydrophthalic anhydride, benzophenonetetracarboxylic acid and the like. Examples of the isocyanates include tolylene diisocyanate, isophorone diisocyanate, and the like, and those obtained by masking this isocyanate with a phenol or the like may be used.

In the case of amines, the necessary amount of these curing agents is preferably such that the equivalent of the active hydrogen of the amine is substantially equal to the epoxy equivalent of the epoxy resin. For example, in the case of a primary amine, there are two hydrogens, and 0.5 equivalent of the primary amine is required for 1 equivalent of the epoxy resin.
In the case of a secondary amine, one equivalent is required. Next, in the case of imidazoles, the equivalence ratio with active hydrogen is not simply obtained,
Empirically, 1 to 10 parts by weight of epoxy resin
Parts by weight are required. In the case of polyfunctional phenols and acid anhydrides, 0.8 to 1.2 equivalents are required for 1 equivalent of the epoxy resin. In the case of isocyanates, it reacts with both the polyamideimide resin and the epoxy resin, so that 0.8 to 1.2 equivalents are required for 1 equivalent of each. These curing agents or curing accelerators may be used alone, but if necessary, a plurality of curing agents or curing accelerators may be selected.

The weight ratio of the polyamide-imide resin to the thermosetting component is preferably 10 to 150 parts by weight, more preferably 10 to 150 parts by weight, based on 100 parts by weight of the polyamide-imide resin. Is less than 300 parts, the coefficient of linear expansion from the glass transition point to 350 ° C. is large,
The characteristic of the polyamide-imide resin that the storage elastic modulus at a temperature is low is manifest as it is, and when it exceeds 150 parts by weight, the compatibility is reduced and gelation occurs during stirring.

In addition, if necessary, a catalyst for electroless plating can be added in order to increase the plating adhesion of the inner walls of the via holes or through holes and to manufacture the wiring board by the additive method.

The resin flow of the thermosetting polyamideimide adhesive film at the B stage is 500 μm.
m is preferable, and when it is less than 500 μm, there is a problem that the embedding property of the inner layer circuit and the unevenness are generated on the surface. In the present invention, the resin flow amount is determined by making a hole having a diameter of 1 cm in a semi-cured adhesive film having a thickness of 50 μm, laminating the adhesive film and a copper-clad laminate, and applying a pressure of 40 ° C.
It is defined as the distance flowing inward from the sample hole when kgf / cm ² is added for 60 minutes. The B stage means an intermediate stage in the curing reaction of the thermosetting resin. The thermosetting polyamide-imide adhesive film at the B stage may have a multilayer structure such as low flow / high flow, high flow / low flow / high flow, etc., so that both moldability and resin thickness can be ensured. Further, instead of the outer layer copper foil and the thermosetting polyamideimide adhesive film in the B stage, an adhesive film with a copper foil, in which an adhesive material is directly applied to the copper foil, may be used.

When a high-flow (resin flow amount of 500 μm or more) type polyamideimide-based adhesive film is used and the resin can be embedded in the IVH hole when laminated, the surface of the interlayer insulating layer becomes relatively smooth. The outer conductor circuit formed thereon has no irregularities.
Further, the glass transition point is 180 ° C. or more, and the linear expansion coefficient from the glass transition point to 350 ° C. is 500 ppm / ° C. or less.
Since the storage elastic modulus at 00 ° C. is 30 MPa or more, even in a portion having a high through-hole density, it is possible to suppress voids and peeling occurring during solder mounting, and to provide high heat resistance.
A multilayer printed wiring board having connection reliability is obtained.

[0025]

EXAMPLES Next, the present invention will be described specifically with reference to examples, but the present invention is not limited to these examples. The measurement values shown in the following Examples and Comparative Examples were measured by the following measurement methods.

(1) Glass transition point (Tg) Using TMA manufactured by MAC SCIENCE, jig: tension, distance between chucks: 15 mm, measurement temperature: room temperature to 350 ° C., heating rate: 10 ° C./min, tensile load: 5 g, sample size: The measurement was 5 mm width × 30 mm length.

(2) Coefficient of linear expansion Using TMA manufactured by MAC SCIENCE, jig: tension, distance between chucks: 15 mm Measurement temperature: room temperature to 350 ° C., heating rate: 10 ° C./min, tensile load: 5 g, sample size: 5 mm width × It was measured at a length of 30 mm.

(3) Storage elastic modulus Using DVE (DVE-V4 type) manufactured by Rheology Co., Ltd., jig: tension Distance between chucks: 20 mm Measurement frequency: 5 Hz Measurement temperature: room temperature to 350 ° C. Temperature rising rate: 5 ° C./min Sample size: 5 mm width x 30 mm length.

A method for evaluating the surface circuit forming property and the solder heat resistance will be described below. (4) Formability of surface circuit A line / space can be formed up to 100 μm / 100 μm.

(5) Solder Heat Resistance The process of floating in a solder bath at 288 ° C. for 10 seconds and cooling to room temperature is repeated three times, and the resin layer in the printed wiring board is observed to check for voids or peeling.

(Synthesis of Polyamideimide Resin) A diamine having three or more aromatic rings is placed in a 1-liter separable flask equipped with a faucet connected to a reflux condenser and having a 25 ml water content receiver, a thermometer and a stirrer. As 2, 2
-Bis- [4- (4-aminophenoxy) phenyl] propane (123.2 g, 0.3 mol) and trimellitic anhydride (115.3 g, 0.6 mol) were used as solvents in NM.
716 g of P (N-methyl-2-pyrrolidone) was charged,
Stirred at 80 ° C. for 30 minutes. Then, 143 g of toluene was charged as an aromatic hydrocarbon azeotropic with water, and then the temperature was increased and the mixture was refluxed at about 160 ° C. for 2 hours. Confirm that water has accumulated in the water content determination receiver at least about 10.8 ml and that distilling of water has not been observed, and remove the distillate remaining in the water content determination device at about 190 ° C. The temperature was increased to remove the toluene. Thereafter, the solution was returned to room temperature, and 75.1 g (0.3 mol) of 4,4′-diphenylmethane diisocyanate was used as an aromatic diisocyanate.
And reacted at 190 ° C. for 2 hours. After the reaction,
An NMP solution resin of an aromatic polyamideimide resin was obtained.

(Blending of resin composition) An epoxy resin and a phenol resin were added as thermosetting components to the aromatic polyamideimide resin, and the mixture was stirred at room temperature for about 1 hour to obtain a resin composition.

(Formation of B-stage film) The resin composition was applied on a release film and dried at 110 ° C for 15 minutes. As a result, the film thickness after drying was about 50 μm.

Example 1 As shown in FIG. 1A, a glass epoxy copper clad laminate MCL-E-6 having a base material thickness of 0.2 mm and a copper foil thickness of 18 μm.
An inner layer circuit board 1 was produced by forming an etching resist on the surface of No. 79 (trade name, manufactured by Hitachi Chemical Co., Ltd.) and etching away copper exposed from the etching resist. Next, as shown in FIG. 1 (b), 21.3 parts by weight of a cresol novolac type epoxy resin ESCN195 (manufactured by Sumitomo Chemical Co., Ltd., trade name) and bisphenol A were added to 100 parts by weight of the aromatic polyamideimide resin. Type phenolic resin, VH4170 (manufactured by Dainippon Ink and Chemicals, Inc., trade name) 12.5 parts by weight, and each cured product has a glass transition point of 241.
° C, linear expansion coefficient from glass transition point to 350 ° C = 17
0 ppm / ° C., storage elastic modulus at 300 ° C. = 103 Mpa, and 18 μm with the inner circuit board 1 via the B-stage polyamideimide adhesive film 2 having a thickness of 50 μm.
Thick outer layer copper foil 3 is applied at 180 ° C. for 60 minutes at 30 kgf / c.
It was laminated and bonded under the condition of m ² . The resin flow of this film was 800 μm. Next, as shown in FIG. 1C, a through hole 4 was formed at a desired position by using a drill having a diameter of 0.3 mm. Next, as shown in FIG. 1 (d), electroless plating is performed to about 15 μm, plating 5 is deposited on the inner wall of the through hole 4, and copper in unnecessary portions on the surface is removed by etching to obtain a line / space = 100 μm. / 10
The wiring 6 having a thickness of 0 μm was formed, and an eight-layer multilayer printed wiring board was manufactured. As a result, the solder heat resistance was good.

Example 2 As shown in FIG. 2 (a), using MCL-E-679 (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a base material thickness of 0.4 mm and a copper foil thickness of 18 μm, 0.3mm diameter at the position
And then electroless plating about 12μm
After that, an etching resist was formed, and copper exposed from the etching resist was removed by etching, whereby the inner layer circuit board 1 was manufactured. Next, as shown in FIG. 2B, a 50 μm thick B-stage polyamideimide adhesive film 2 used in Example 1 and an 18 μm thick outer layer copper were used on both surfaces of the inner circuit board 1. Foil 3
Laminate bonding was performed at 80 ° C. for 60 minutes at 30 kgf / cm ² . Next, as shown in FIG. 2C, a portion to be the via hole 9 of the outer layer copper foil 3 is removed by etching,
m opening 7 was provided. Next, as shown in FIG. 2 (d), the resin in the exposed via hole 9 was removed by using a laser drilling machine GS-500H (trade name, manufactured by Sumitomo Heavy Industries, Ltd.) at a frequency of 150 Hz. , Voltage = 2
0 kV, pulse energy = 85 mJ, number of shots = 7
Under the conditions of the shot, it was removed until the inner layer copper foil was exposed. Next, as shown in FIG. 2 (e), electroless plating is performed by about 15 μm to electrically connect the outer layer copper foil and the inner layer circuit at the via hole 9. Is removed by etching to obtain a line / space = 100 μm
/ 100 μm wiring was formed to form a four-layer build-up printed wiring board. Next, as shown in FIG.
The B-stage polyamide-imide adhesive film 2 having a thickness of 50 μm and the outer copper foil 3 having a thickness of 18 μm used in Example 1 were applied to both sides of the build-up printed wiring board having a thickness of 180 μm.
Laminate bonding was performed at 30 ° C. for 60 minutes at 30 kgf / cm ² . Next, as shown in FIG. 2 (g), a portion to become the via hole 9 of the outer layer copper foil 3 was removed by etching to obtain a 100 μm
Opening 7 was provided. Next, as shown in FIG.
The exposed portion of the resin to be the via hole 9 was removed by a laser drilling machine GS-500H until the inner layer copper foil was exposed, and further, a through hole was formed by drilling with a 0.3 mm diameter drill. . Next, as shown in FIG. 2 (i), electroless plating is performed at 15 μm to electrically connect the respective layers at the locations of the through holes 4 and the via holes 9, and then copper at unnecessary locations on the surface is removed. The wiring was removed by etching to form a line / space = 100 μm / 100 μm, and a six-layer build-up printed wiring board was manufactured. As a result, the solder heat resistance was good.

Example 3 As shown in FIG. 3A, an etching resist was applied to the surface of MCL-E-679 (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a base material thickness of 0.2 mm and a copper foil thickness of 18 μm. To form
The inner layer circuit board 1 was produced by etching away the copper exposed from the etching resist. next,
As shown in FIG. 3 (b), on both sides of the inner circuit board 1, a 50 μm thick B-stage polyamide-imide adhesive film 2 used in Example 1 and an 18 μm outer copper foil 3
Were laminated and bonded at 180 ° C. for 60 minutes at 30 kgf / cm ² . Next, as shown in FIG. 3C, a hole is drilled at a desired position using a drill having a diameter of 0.3 mm.
A through hole 4 was provided. Next, as shown in FIG. 3 (d), electroless plating is performed to about 15 μm, plating 5 is deposited on the inner wall of the through hole 4, and copper at unnecessary portions on the surface is removed by etching to obtain a line / space = 100 μm. The wiring 6 of / 100 μm was formed, and a four-layer multilayer printed wiring board was manufactured. Next, as shown in FIG. 3E, the 50 μm thick B used in Example 1 was applied to both surfaces of the four-layer multilayer printed wiring board.
Stage polyamide-imide adhesive film 2 and 18
μm outer layer copper foil 3 at 180 ° C. for 60 minutes, 30 kgf /
The laminate was adhered under the condition of cm ² . Next, as shown in FIG. 3 (f), a portion to be the via hole 9 of the outer layer copper foil 3 was removed by etching to provide an opening 7 of 100 μm. next,
As shown in FIG. 3 (g), the resin in the portion to be the exposed via hole 9 was removed by a laser drilling machine GS-500H until the inner layer copper foil was exposed. Next, FIG.
As shown in (h), electroless plating is performed by about 15 μm to electrically connect the outer layer copper foil and the inner layer circuit at the location of the via hole 9, and then the unnecessary portion of the surface is etched away by copper. , Line / space = 100 μm / 100 μm
Were formed to form a six-layer build-up printed wiring board. Next, as shown in FIG. 3 (i), the B-stage polyamideimide adhesive film 2 used in Example 1 and the 18 μm outer copper foil 3 were applied to both surfaces of a six-layer build-up printed wiring board at 180 ° C. , 60 minutes, 30kgf / cm ²
Under the conditions described below. Next, as shown in FIG. 3 (j), a portion to be the via hole 9 of the outer layer copper foil 3 was removed by etching to provide an opening 7 of 100 μm. Next, FIG.
As shown in (k), the resin in the exposed via hole 9 is removed by a laser drilling machine GS-500H.
Remove until the inner layer copper foil is exposed.
A through hole 4 was provided by drilling with a mm drill. Next, as shown in FIG.
After conducting 5 μm and electrically connecting the respective layers at the locations of the through holes 4 and the via holes 9, copper in unnecessary portions on the surface was removed by etching, and line / space = 100 μm / 1.
A wiring of 00 μm was formed, and an eight-layer build-up printed wiring board was manufactured. As a result, the solder heat resistance was good.

Example 4 A cresol novolak epoxy resin EOCN1020 was added to 100 parts by weight of an aromatic polyamideimide resin.
(Manufactured by Nippon Kayaku Co., Ltd., trade name) 21.7 parts by weight and cresol novolak type phenol resin KA1160
(Trade name, manufactured by Dainippon Ink and Chemicals, Inc.) 13.2
The cured product has a glass transition point of 241 ° C., a coefficient of linear expansion from the glass transition point to 350 ° C. = 170 ppm / ° C., and a storage modulus at 300 ° C. = 10, respectively.
An 8-layer multilayer printed wiring board was produced in the same manner as in Example 1, except that a B-stage polyamideimide-based adhesive film having a thickness of 3 Mpa and a thickness of 50 μm was used. The resin flow of this film was 700 μm. As a result, the solder heat resistance was good.

Example 5 EO was added to 100 parts by weight of an aromatic polyamideimide resin.
CN1020 (manufactured by Nippon Kayaku Co., Ltd., trade name) 21.7
Parts by weight and 13.2 parts by weight of KA1160 (trade name, manufactured by Dainippon Ink and Chemicals, Inc.), and the properties of the cured product are glass transition point = 241 ° C. and linear expansion from the glass transition point to 350 ° C., respectively. Coefficient = 170 ppm / ° C, 30
Storage modulus at 0 ° C. = 103 Mpa and thickness of 50
A six-layer build-up printed wiring board was produced in the same manner as in Example 2 except that a B-staged polyamideimide-based adhesive film of μm was used. As a result, the solder heat resistance was good.

Example 6 EO was added to 100 parts by weight of an aromatic polyamide-imide resin.
CN1020 (manufactured by Nippon Kayaku Co., Ltd., trade name) 21.7
Parts by weight and 13.2 parts by weight of KA1160 (trade name, manufactured by Dainippon Ink and Chemicals, Inc.), and the properties of the cured product are glass transition point = 241 ° C. and linear expansion from the glass transition point to 350 ° C., respectively. Coefficient = 170 ppm / ° C, 30
Storage modulus at 0 ° C. = 103 Mpa and thickness of 50
An eight-layer build-up printed wiring board was produced in the same manner as in Example 3, except that a B-staged polyamideimide-based adhesive film of μm was used. As a result, the solder heat resistance was good.

Comparative Example 1 An aromatic polyamide-imide resin was used alone, and the cured product had a glass transition point of 229 ° C. and a linear expansion coefficient from the glass transition point to 350 ° C. of 6400 ppm / ° C., respectively.
Storage modulus at 00 ° C. = 5.2 Mpa and thickness 5
An eight-layer multilayer printed wiring board was produced in the same manner as in Example 1 except that a B-stage polyamideimide adhesive film of 0 μm was used. As a result, after the solder heat resistance test, voids were generated in the adhesive film layer in the multilayer wiring board, and the solder heat resistance was reduced.

[0041]

As described above, according to the multilayer printed wiring board of the present invention and the method of manufacturing the same, the IVH can be superimposed directly on multiple stages, the density can be increased, the substrate surface is smooth, and the heat resistance is improved. Therefore, an excellent effect of improving the wiring formability, mounting reliability and heat resistance of the multilayer printed wiring board can be obtained.

[Brief description of the drawings]

FIGS. 1A to 1D are cross-sectional views in respective steps for describing one embodiment of the present invention.

2 (a) to 2 (i) are cross-sectional views in respective steps for explaining another embodiment of the present invention.

3 (a) to 3 (l) are cross-sectional views in respective steps for explaining still another embodiment of the present invention.

[Explanation of symbols]

1. 1. inner layer circuit board 2. Polyamide-imide adhesive film Outer layer copper foil 4. Through hole 5. Plating 6. Wiring 7. Opening 8. 8. Hole to be a via hole Via hole

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Yuichi Shimayama 1500 Ogawa Ogawa, Shimodate City, Ibaraki Prefecture Inside the Shimodate Research Laboratory, Hitachi Chemical Co., Ltd. Inside the Shimodate Research Laboratory

Claims (8)

[Claims] 1. A plurality of insulating plates on which conductor circuits are formed in advance are laminated and bonded via a heat-resistant resin composition comprising a polyamideimide resin and a thermosetting component, and are electrically connected via through holes. In the multilayer printed wiring board, the cured product of the heat-resistant resin composition has a glass transition point of 180 ° C. or higher and a linear expansion coefficient from the glass transition point to 350 ° C. of 50.
0 ppm / ° C or less, storage elastic modulus at 300 ° C is 30MP
a. The multilayer printed wiring board characterized by being not less than a. 2. A heat-resistant resin composition comprising a polyamide-imide resin and a thermosetting component allows at least one or more conductive circuits formed on the surface of an insulated substrate to pass through at least one or more via holes. The glass transition point of the cured product of the heat-resistant resin composition is 180 ° C. or higher and 3
Coefficient of linear expansion up to 50 ° C is 500 ppm / ° C or less, 30
A multilayer printed wiring board having a storage elastic modulus at 0 ° C. of 30 MPa or more. 3. The multilayer printed wiring board according to claim 1, wherein the thermosetting component in the heat-resistant resin composition comprises an epoxy resin and a curing agent or a curing accelerator thereof. 4. The weight ratio of the polyamide-imide resin and the thermosetting component is 100 parts by weight of the polyamide-imide resin.
The multilayer printed wiring board according to claim 3, wherein the thermosetting resin component is in a range of 10 to 150 parts by weight. 5. A method according to claim 1, A thermosetting polyamide-imide adhesive film composed of a polyamide-imide resin and a thermosetting component,
A step of interposing between a plurality of insulating plates in which a conductor circuit has been formed in advance and an outer layer copper foil, heating and curing by heating and pressing, and laminating and bonding b. Drilling a through hole at a desired position to expose a conductor circuit for conducting each layer c. Plating step for electrically connecting each conductor circuit layer d. Forming an etching resist on the outer layer copper foil, selectively removing the copper foil by etching, and forming a wiring circuit e. A method for producing a multilayer printed wiring board, comprising a step of removing an etching resist. 6. A method according to claim 6, A thermosetting polyamide-imide adhesive film composed of a polyamide-imide resin and a thermosetting component,
A step of interposing between an inner layer plate in which a conductor circuit has been previously formed and an outer layer copper foil, heating and curing by heating and pressing, and laminating and bonding b. A step of forming an etching resist on the outer layer conductor and selectively etching away the copper foil to form fine holes c. Removing the etching resist d. A step of removing the cured resin layer exposed from the fine holes by laser drilling, making a via hole, and exposing the conductive circuit of the inner layer plate e. Plating step for electrically connecting the conductor circuit of the inner layer plate and the outer layer copper foil f. Forming an etching resist on the outer layer copper foil and forming a wiring circuit on the copper foil surface by selective etching; g. A method for producing a multilayer printed wiring board, comprising a step of removing an etching resist. 7. h. The method for producing a multilayer printed wiring board according to claim 6, further comprising a step of repeating steps a to g to form via holes continuously over two or more layers. 8. The production of a multilayer printed board according to claim 5, wherein the resin flow of the thermosetting polyamideimide-based adhesive film in the B stage is 500 μm or more. Law.