JPH11260952A - Hermetic terminal for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the hermetic terminal for a semiconductor device, which can form the longitudinal width in the front and back direction of an eyelet by leaving the eyelet part, which can add compressive stress to lead sealing glass around a lead sealing hole and leaving a sealing area, which connects the surrounding part of the lower end of a cap around the upper surface of the eyelet. SOLUTION: An eyelet part 10a wherein lead sealing holes 12 and 14 are formed, and an eyelet part 10b wherein a heat sink 40 is formed, are provided separately at the right and left sides of an eyelet 10. Then, the eyelet 10 part having the specified width, which can apply compressive stress to lead-sealing glass 30, is made to remain around the lead sealing holes 12 and 14. At the same time, a sealing area 18, which connects the surrounding part of the lower end of cap, is made to remain around the upper surface of the eyelet 10. The longitudinal width H in the front and back direction of the eyelet 10 is formed narrowly.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a hermetic terminal (hermetic terminal) for a semiconductor device for mounting a semiconductor element such as an LD (laser diode).

[0002]

2. Description of the Related Art The above-mentioned hermetic terminal generally has a structure as shown in FIGS. In this hermetic terminal, the diameter L made of mild steel is 5.6 mm.
The two lead sealing holes 1
2, 14 are formed side by side. The lead 20 is inserted into the lead sealing holes 12 and 14. The lead 20 is hermetically sealed in the lead sealing holes 12 and 14 via the glass 30. Two lead sealing holes 12, 14
Between the two lead sealing holes 1
A rectangular block-shaped heat sink 40 for mounting a semiconductor element is formed in a protruding manner on the eyelet 10 portion between the two. An earth lead 16 is joined to the lower surface of the eyelet 10. A seal area 18 having a predetermined width is secured around the upper surface of the eyelet 10 for joining a lower edge of a flange of a cap described later. In addition, the hermetic terminal shown has two lead sealing holes 1
An indent (recess) 50 for mounting the monitor element is provided on the upper surface of the eyelet 10 between the heat sink 4 and the heat sink 4.
0.

When using this hermetic terminal,
As shown in FIG.
And the like. A monitor element 70 is mounted on the indent 50. Semiconductor element 60
Of the eyelet 10 and the electrode of the monitor element 70
Is electrically connected to the upper end of the lead 20 projecting upward through a wire (not shown). A hat-shaped cap 80 made of metal is placed over the upper periphery of the eyelet 10 including the heat sink 40 on which the semiconductor element 60 is mounted. The flange-shaped lower peripheral edge 82 of the cap 80 is hermetically joined to the seal area 18 around the upper surface of the eyelet 10 by electric resistance welding or the like. The semiconductor element 60 and the monitor element 70 are hermetically sealed in a space 84 surrounded by the cap 80 and the eyelet 10.

[0004]

When the above-mentioned hermetic terminal is housed in a recently thinned electronic device, the hermetic terminal is mounted on the inside of the electronic device in a state where it is laid sideways. ing. Various electronic components including the above-mentioned hermetic terminals are housed side by side at high density with little space inside the thinned electronic device.

Therefore, the above-mentioned hermetic terminal needs to be formed to have a narrow vertical width in the front-rear direction, for example, 3 mm or less, in accordance with the vertical width of the inner space of recently thinned electronic equipment.

However, when the above-mentioned hermetic terminal is downsized while maintaining its current shape,
The width of the seal area 18 around the upper surface of the eyelet 10 has been reduced. Further, the lower peripheral edge 82 of the cap 80 could not be accurately and airtightly joined to the seal area 18 by electric resistance welding or the like. Further, the airtightness of the space 84 inside the cap 80 for enclosing the semiconductor element 60 could not be sufficiently maintained. Further, the heat sink 40 is downsized, and the high-power semiconductor element 6 mounted on the heat sink 40 is reduced.
The heat generated from the heat sink 0 cannot be efficiently and accurately dissipated to the heat sink 40. At the same time, the semiconductor element 6
As shown in FIG. 8, the inner surface of the heat sink 40 on which the heat sink 40 is mounted becomes narrower, and as shown in FIG.
However, it has cut into the inner surface of the heat sink 40 on which the semiconductor element 60 is mounted. Therefore, the lateral width of the inner surface of the heat sink 40 on which the semiconductor element 60 is mounted cannot be sufficiently secured.

The present invention can solve such a problem.
While sufficiently securing the width of the seal area joining the lower edge of the cap, the longitudinal width of the eyelet in the front-rear direction can be formed to be small, and the lateral width of the inner surface of the heat sink on which the semiconductor element is mounted can be sufficiently secured, An object of the present invention is to provide a hermetic terminal (hermetic terminal) for a semiconductor device which can be mounted in a state of being laid horizontally on the inside of a thin electronic device, which can increase the heat dissipation of the heat sink by increasing the size of the heat sink. The purpose is.

[0008]

In order to achieve the above-mentioned object, a hermetic terminal of the present invention is provided in which a lead is hermetically sealed via a glass in a lead sealing hole formed in an eyelet, and a lead is provided on an upper surface of the eyelet. In a hermetic terminal for a semiconductor device in which a heat sink for mounting a semiconductor element is formed so as to protrude, an eyelet portion in which the lead sealing hole is formed and an eyelet portion in which the heat sink is formed do not overlap in the front-back direction of the eyelet. An eyelet portion having a lead sealing hole and an eyelet portion having a heat sink formed separately on the left and right of the eyelet, and an eyelet portion having a predetermined width capable of applying a compressive stress to the glass for sealing the lead. Around the lead sealing hole and the eyelet with the lead sealing hole formed. Sink compared to the eyelet provided so as to overlap in the longitudinal direction of the eyelet part and are eyelets are formed, it is characterized in that the narrower the vertical width of the front and rear direction of the eyelet.

In this hermetic terminal, an eyelet portion having a lead sealing hole and an eyelet portion having a heat sink are separately provided on the left and right sides of the eyelet. And, the eyelet portion where the lead sealing hole is formed and the eyelet portion where the heat sink is formed are prevented from overlapping in the front-back direction of the eyelet.
Therefore, compared to an eyelet provided in such a manner that the eyelet portion where the lead sealing hole is formed and the eyelet portion where the heat sink is formed overlap in the front-back direction, the eyelet portion where the lead sealing hole is formed in the front-back direction The vertical width can be made smaller because the eyelet portion on which the heat sink is formed does not overlap the front or rear of the eyelet portion on which the lead sealing hole is formed.

An eyelet portion having a lead sealing hole formed in front of or behind the eyelet portion having the heat sink formed thereon, the eyelet having a predetermined width capable of applying a compressive stress to the glass for sealing the lead. It is not necessary to secure an eyelet portion having the portion around the lead sealing hole. For this reason, the vertical width of the eyelet portion where the heat sink is formed can be narrowed in accordance with the vertical width in the front-rear direction of the eyelet portion where the lead sealing hole is formed. Then, a large heat sink having a wide horizontal width close to the longitudinal width of the eyelet portion in the front-rear direction can be formed on the eyelet portion.

In this hermetic terminal,
An eyelet portion having a predetermined width capable of applying a compressive stress to the glass for sealing the lead is left around the lead sealing hole. Therefore, when the lead is sealed in the lead sealing hole via glass, compressive stress can be accurately applied to the glass for lead sealing from an eyelet portion having a predetermined width left around the lead sealing hole. . Then, the lead can be securely and hermetically sealed in the lead sealing hole via the glass.

In the hermetic terminal of the present invention, it is preferable that the eyelet has a structure in which the longitudinal width of the eyelet in the front-rear direction is reduced, leaving a seal area for joining the lower peripheral edge of the cap around the upper surface of the eyelet.

In the hermetic terminal, the lower edge of the cap-shaped flange or the like can be accurately and hermetically joined to the seal area left around the upper surface of the eyelet.

In the hermetic terminal of the present invention, it is preferable that the indent for mounting the monitor element is formed on the upper surface of the eyelet between the lead sealing hole and the heat sink.

In this hermetic terminal, a monitor element can be mounted on the indent formed on the upper surface of the eyelet between the lead sealing hole and the heat sink. Then, the monitor element can monitor the light amount of a laser or the like emitted from a semiconductor element such as an LD mounted on the inner surface of the heat sink.

Further, in the hermetic terminal of the present invention, the eyelet portion in which the lead sealing hole is formed is formed of mild steel, and the heat sink and the eyelet portion in which the heat sink is formed are formed of copper or a copper alloy. This is preferred.

In this hermetic terminal, when the lead is sealed in the lead sealing hole via glass, the lead is sealed from the eyelet portion around the lead sealing hole formed of mild steel having a large thermal expansion coefficient. A sufficient compressive stress can be applied to the glass. Then, the lead can be securely and hermetically sealed in the lead sealing hole via the glass. With it
The heat sink and the eyelet portion on which the heat sink is formed can be formed using copper or a copper alloy having high thermal conductivity. Then, heat generated by the semiconductor element mounted on the heat sink can be efficiently dissipated to the high heat conductive heat sink and the high heat conductive eyelet portion on which the heat sink is formed.

Further, in the hermetic terminal of the present invention, the material for forming the eyelet portion having the lead sealing hole, the heat sink, and the material for forming the eyelet portion having the heat sink are integrally joined. It is preferable that an eyelet is formed using a clad material.

In this hermetic terminal, a clad material formed by integrally joining a material for forming an eyelet portion having a lead sealing hole, a heat sink, and a material for forming an eyelet portion having the heat sink formed thereon. The eyelet portion where the lead sealing hole is formed from the clad material is made of a material such as mild steel, and the heat sink and the eyelet portion where the heat sink is formed are made of copper or copper. An eyelet made of a material such as an alloy, in which an eyelet portion provided with a lead sealing hole and an eyelet portion provided with a heat sink are separately provided on the left and right, can be integrally formed. Alternatively, in addition to the above, an eyelet provided with an indent at an upper surface portion of the eyelet between the lead sealing hole and the heat sink can be integrally formed.

[0020]

Next, embodiments of the present invention will be described with reference to the drawings. 1 and 2 show a preferred embodiment of a hermetic terminal according to the present invention. FIG.
FIG. 2 is a front sectional view showing the state of use. Hereinafter, the hermetic terminal will be described.

In the illustrated hermetic terminal, the heat sink 40 is removed from between the two lead sealing holes 12 and 14 formed in front of and behind the eyelet 10.
Then, the two lead sealing holes 12 and 14 are formed side by side with the left eyelet portion 10a close to the front and rear. Then, the longitudinal width of the left eyelet portion 10a in which the two lead sealing holes 12 and 14 are formed is reduced in the front-rear direction. Around the lead sealing holes 12 and 14,
The eyelet 10 having a predetermined width is left. When the lead 20 is sealed to the lead sealing holes 12 and 14 via the glass 30, the compressive stress is applied to the glass 30 for lead sealing from the eyelet 10 portion left around the lead sealing holes 12 and 14. Can be added.

The right eyelet portion 1 of the eyelet 10
0b is formed by projecting a rectangular block-shaped heat sink 40. And two lead sealing holes 12,
The eyelet portion 10a formed with the two lead sealing holes 12 and 14 and the heat sink are formed so that the eyelet portion 10a formed with the heat sink 40 and the eyelet portion 10b formed with the heat sink 40 do not overlap in the front-rear direction of the eyelet 10. The eyelet portion 10b on which the 40 is formed is provided separately on the left side and the right side of the eyelet 10.

The longitudinal width in the front-rear direction of the right eyelet portion 10b on which the heat sink 40 is formed is equal to the lead sealing hole 1
The left eyelet portion 10a on which the second and the second eyelets 14 are formed is formed to be as narrow as the vertical width in the front-rear direction. The vertical width H in the front-rear direction of the entire eyelet 10 formed by horizontally connecting the left eyelet portion 10a and the right eyelet portion 10b to the eyelet portion 10a in which the lead sealing holes 12, 14 are formed. Compared to the eyelet 10 provided so that the eyelet portion 10b on which the heat sink 40 is formed overlaps in the front-rear direction, for example, 3 mm
It is narrowed below. Then, the outer shape of the eyelet 10 is
It is formed in an almost elliptical plate shape with flat sides parallel to the front and back.

Around an upper surface of an eyelet 10 formed by connecting a left eyelet portion 10a in which two lead sealing holes 12 and 14 are formed and a right eyelet portion 10b in which a heat sink 40 is formed, to be described later. A seal area 18 having a predetermined width for joining the flange-shaped lower edge of the cap is left.

The left eyelet portion 10a in which the two lead sealing holes 12, 14 are formed is made of mild steel or the like having a large thermal expansion coefficient, which can sufficiently apply a compressive stress to the glass 30 for sealing the lead. ing. And lead 2
0 is sealed into the lead sealing holes 12 and 14 via the glass 30, and compressed from the left eyelet portion 10 a formed of mild steel or the like around the lead sealing holes 12 and 14 into the glass 30 for lead sealing. A sufficient stress can be applied. Then, the lead 20 is inserted into the lead sealing hole 12,
It is ensured that the glass can be hermetically sealed via the glass 30.

Heat sink 40 and heat sink 40
The eyelet portion 10b on the right side where is formed is made of copper or a copper alloy having high thermal conductivity. The heat generated by the semiconductor element 60 mounted on the heat sink 40 can be efficiently and quickly dissipated to the heat sink 40 and the right eyelet portion 10b on which the heat sink 40 is formed.

In addition, in the hermetic terminal shown, two lead sealing holes 12 and 14 and a heat sink 40 are provided.
An indent 50 for mounting a monitor element is provided on an upper surface portion of the eyelet 10 between the two. The bottom surface of the indent 50 is inclined downward toward the lead sealing holes 12 and 14. The monitor element 70 can be mounted on the bottom surface of the indent 50 at an angle. The monitor element 70 can monitor the amount of laser light emitted from the semiconductor element 60 such as an LD mounted on the inner surface of the heat sink 40.

In other respects, the structure is the same as that of the above-described hermetic terminal shown in FIGS. 6 and 7, and the usage example also includes a heat sink 40 on which a semiconductor element 60 is mounted, as shown in FIG. Above the narrow eyelet 10,
In accordance with the shape of the eyelet 10, the cap 80 is covered with a cap 80 having a narrow vertical width, and a flange-shaped lower peripheral edge 82
Is hermetically connected to the seal area 18 around the upper surface of the eyelet 10 by electric resistance welding or the like, except that the hermetic terminal described above with reference to FIGS.

In the above hermetic terminal,
If the semiconductor element 60 mounted on the heat sink 40 does not need to monitor the amount of laser light or the like emitted by the element, the upper surface portion of the eyelet 10 between the lead sealing holes 12 and 14 and the heat sink 40 Indent 5
It is not necessary to provide 0, and the width of the eyelet 10 may be reduced accordingly.

In the manufacture of the above-mentioned hermetic terminals, as shown in FIG. 3 or FIG. 4, a material 102 such as mild steel capable of sufficiently applying a compressive stress to the glass 30 for sealing leads and a heat sink 40 are formed. The eyelet portion 10a in which the lead sealing holes 12 and 14 are formed and the heat sink 40 are formed using the clad material 100 formed by integrally joining a high thermal conductive material 104 such as copper or a copper alloy. It is preferable to integrally form an eyelet 10 in which an eyelet portion 10b is provided separately on a left side and a right side.
Or, in addition, the indent 50 is formed in the lead sealing hole 1.
The eyelet 10 provided on the upper surface of the eyelet 10 between the heat sinks 2 and 14 may be formed integrally.

When the eyelet 10 is integrally formed using the clad material 100, the clad material 100 is subjected to machining such as cutting and pressing to form a lead sealing hole as shown in FIG. The eyelet portion 10a formed with 12, 14 is made of a material 102 such as mild steel capable of applying a compressive stress to the glass 30 for sealing leads, and the heat sink 40 and the eyelet portion 10b formed with the heat sink 40 have high thermal conductivity. The eyelet 10 having a narrow vertical width and made of a material 104 such as copper or copper alloy can be integrally formed easily and quickly without any trouble and time. Alternatively, the lead sealing holes 12, 14 and the heat sink 40
The eyelet 10 in which the indent 50 is provided on the upper surface portion of the eyelet 10 between them can be easily and quickly integrated without the need for trouble and time.

The clad material 100 for forming the eyelet
As shown in FIG. 3, its cross-sectional shape is substantially elliptical with a narrow vertical width similar to the planar shape of the eyelet 10, and the left portion thereof is formed of a material 102 such as mild steel.
It is preferable to use a material whose right side is formed of a material 104 such as copper or a copper alloy. And the clad material 10
It is preferable to form a substantially elliptical plate-shaped eyelet 10 by cutting a 0 into a predetermined thickness. Then, the formed body of the eyelet 10 is subjected to press working, and from the formed body, a left eyelet portion 10a in which the lead sealing holes 12, 14 are formed as shown in FIG. A heat sink 40 and an eyelet portion 10b on the right side on which the heat sink 40 is formed is an eyelet 10 made of a material 104 such as copper or a copper alloy, and an eyelet portion 10a on which lead sealing holes 12, 14 are formed. It is preferable that the eyelet portion 10b on which the heat sink 40 is formed and the eyelet 10 having a narrow vertical width provided separately on the left side and the right side are integrally formed. Alternatively, in addition, the eyelet 10 provided with the indent 50 may be integrally formed on the upper surface of the eyelet 10 between the lead sealing holes 12 and 14 and the heat sink 40.

Alternatively, a clad material 10 for forming an eyelet
As shown in FIG. 4, when a strip-shaped material whose left portion is formed of a material 102 such as mild steel and whose right portion is formed of a material 104 such as copper or a copper alloy as shown in FIG. good. Then, the clad material 100 is preferably subjected to a punching process or the like to form a substantially elliptic plate-shaped eyelet 10 having a small vertical width. Then, the formed body of the eyelet 10 is subjected to press working, and from the formed body, a left eyelet portion 10a in which the lead sealing holes 12, 14 are formed as shown in FIG. The heat sink 40 and the right eyelet portion 10b on which the heat sink 40 is formed are made of a material 10 such as copper or a copper alloy.
4. An eyelet 10 comprising a lead sealing hole 1
It is preferable that the eyelet portion 10a on which the heat sinks 2 and 14 are formed and the eyelet portion 10b on which the heat sink 40 is formed be integrally formed with a narrow vertical eyelet 10 provided on the left side and the right side. Or in addition to the eyelet 10 between the lead sealing holes 12, 14 and the heat sink 40.
Eyelet 1 provided with an indent 50 on the upper surface of the eyelet 1
0 may be formed integrally.

In the above-mentioned hermetic terminal, as shown in FIG.
4 may be formed on the left eyelet portion 10a in an oblique front-rear direction. Then, the vertical width of the left eyelet portion 10a in which the two lead sealing holes 12 and 14 are formed, that is, the vertical width H of the eyelet 10, is set to the two lead sealing holes 12 and 14 in the left eyelet portion 10a. It may be narrower than that formed vertically in the front-rear direction. At the same time, an eyelet 1 made of mild steel or the like having a predetermined width or more capable of sufficiently applying a compressive stress to the glass 30 for sealing leads around the two lead sealing holes 12 and 14.
You may enable it to leave 0 part.

In the case of a hermetic terminal having a structure in which the lower end inner peripheral surface of the cap 80 is joined to the peripheral side surface of the eyelet 10, a seal area 18 for joining the lower end peripheral edge 82 of the cap is provided around the upper surface of the eyelet 10. It is not necessary, and the vertical width of the eyelet 10 in the front-rear direction may be reduced accordingly.

The present invention is also applicable to a hermetic terminal in which three or more lead sealing holes are formed in an eyelet, or a hermetic terminal in which one lead sealing hole is formed in an eyelet. Even when used for a hermetic terminal, it is possible to increase the width of a heat sink on which the semiconductor element is mounted or to increase the size of the heat sink while reducing the longitudinal width of the eyelet in the front-rear direction.

[0037]

As described above, according to the hermetic terminal of the present invention, an eyelet made of mild steel or the like having a predetermined width capable of sufficiently applying a compressive stress to the glass for sealing the lead around the lead sealing hole. The longitudinal width of the eyelet in the front-rear direction can be reduced to 3 mm or less while leaving a portion or a seal area around the upper surface of the eyelet for joining the lower peripheral edge of the cap. Further, the lateral width of the heat sink can be greatly expanded without being limited to the eyelet portion where the lead sealing hole is formed. And
The semiconductor element can be accurately mounted on the inner surface of the heat sink with a margin. At the same time, the size of the heat sink is increased without being limited to the eyelet portion where the lead sealing hole is formed, and the heat generated by the semiconductor element mounted on the heat sink can be efficiently and quickly dissipated to the heat sink.

[Brief description of the drawings]

FIG. 1 is a plan view of a hermetic terminal of the present invention.

FIG. 2 is a front sectional view showing a use state of the hermetic terminal of the present invention.

FIG. 3 is a perspective view of a clad material for forming an eyelet of a hermetic terminal according to the present invention.

FIG. 4 is a perspective view of a clad material for forming an eyelet of a hermetic terminal according to the present invention.

FIG. 5 is a plan view of the hermetic terminal of the present invention.

FIG. 6 is a plan view of a conventional hermetic terminal.

FIG. 7 is a front sectional view showing a use state of a conventional hermetic terminal.

FIG. 8 is an enlarged front view of a conventional heat sink on which a semiconductor element having a hermetic terminal is mounted.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Eyelet 10a Left eyelet part 10b Right eyelet part 12, 14 Lead sealing hole 16 Ground lead 18 Seal area 20 Lead 30 Glass 40 Heat sink 50 Indent 60 Semiconductor element 70 Monitor element 80 Cap 82 Lower edge of cap 100 Cladding material 102 Material such as mild steel 104 Material such as copper or copper alloy

Claims (6)

[Claims] 1. A hermetic terminal for a semiconductor device, wherein a lead is hermetically sealed via a glass in a lead sealing hole formed in an eyelet, and a heat sink for mounting a semiconductor element is formed on an upper surface of the eyelet. An eyelet having a lead sealing hole and an eyelet having a heat sink so that the eyelet portion having the lead sealing hole and the eyelet portion having the heat sink do not overlap in the front-rear direction of the eyelet. The part is provided separately on the left and right of the eyelet,
An eyelet part having a predetermined width capable of applying a compressive stress to the glass for lead sealing is left around the lead sealing hole, and an eyelet part having a lead sealing hole and an eyelet part having a heat sink are formed. A hermetic terminal for a semiconductor device, wherein a vertical width of the eyelet in the front-rear direction is narrower than an eyelet provided to overlap in the front-rear direction of the eyelet. 2. The hermetic terminal for a semiconductor device according to claim 1, wherein an outer shape of the eyelet is formed in a substantially elliptical plate shape having flat front and rear sides parallel to each other. 3. The hermetic terminal for a semiconductor device according to claim 1, wherein the vertical width of the eyelet in the front-rear direction is reduced while leaving a seal area around the upper surface of the eyelet for joining a lower peripheral edge of the cap. 4. The hermetic terminal for a semiconductor device according to claim 1, wherein the indent for mounting the monitor element is formed on an upper surface of an eyelet between the lead sealing hole and the heat sink. 5. The method according to claim 1, wherein the eyelet portion in which the lead sealing hole is formed is formed of mild steel, and the heat sink and the eyelet portion in which the heat sink is formed are formed of copper or a copper alloy. Hermetic terminals for semiconductor devices. 6. An eyelet is formed by using a clad material formed by integrally joining a material for forming an eyelet portion having a lead sealing hole, a heat sink, and a material for forming an eyelet portion having the heat sink formed thereon. The hermetic terminal for a semiconductor device according to claim 1, wherein the hermetic terminal is formed.