JPH11260892A - Apparatus for picking up semiconductor chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the maintenance and check work of a semiconductor chip pickup apparatus, as well as labor and cost for replacing components thereof. SOLUTION: In a pickup apparatus which peels off a semiconductor chip from an expanding tape, using a thrusting part which is composed of a tape guide 7 having a guide face fitted to the size of the semiconductor chip, a first tubular needle holder 4a having a taper 4d, which is inserted in the tape guide 7 and gradually taperes at one end inner diameter and thread 4e cut from the other end, a second needle holder 4b which is inserted in the first needle holder 4a and holds a part of the needle 9 for thrusting off the semiconductor chip, and a screw cap 4c screwed in the thread of the first needle holder 4a to limit the motion of the second needle holder 4b, and the second needle holder 4b is pushed to the taper so as to increase the holding force of the needle.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a pickup device for a semiconductor chip, and more particularly, to a structure of a push-up portion thereof.

[0002]

2. Description of the Related Art Semiconductor devices such as diodes, transistors, and ICs are manufactured by dividing and separating a large number of semiconductor elements formed on a wafer substrate such as silicon by photoetching technology into individual semiconductor chips. The semiconductor device is assembled through various processes such as die bonding, wire bonding, packaging, exterior processing, trim forming, marking, and inspection, and becomes a completed semiconductor device.

[0003] In these steps, the step of dividing and separating a semiconductor element into individual semiconductor chips is usually performed as follows. That is, resinous and extensible expandable tape (also referred to as "adhesive tape") on the back surface of the wafer substrate
Is adhered, and in this state, the semiconductor chip is divided into semiconductor chips by using a dicing apparatus, and the expanded tape is stretched to separate the semiconductor chips so as to secure a distance between the individual semiconductor chips. Then, the semiconductor chip is separated from the expanding tape using a semiconductor chip pickup device,
The individual semiconductor chips are transferred to a lead frame or the like for packaging.

FIG. 2 is a cross-sectional explanatory view showing a semiconductor chip pickup device and its operation based on FIG. 1 of Japanese Patent Application Laid-Open No. Hei 9-181150, in which an expanding tape 2 is provided above a tape guide 7 having a guide surface 6 and a concave portion 6a. The semiconductor chip 1 which is adhered to and divided / separated is arranged, and further above the collet (also referred to as “adsorption collet”) 12 is arranged. On the other hand, just below the semiconductor chip 1, a needle 9 fixed to the needle holder 4 is provided.
(Also referred to as a “push-up pin”) is provided, and a plurality of holes for penetrating the needle 9 and a plurality of vacuum holes 8 for sucking the expand tape 2 under a negative pressure are formed in the concave portion 6a.

FIG. 2A shows a state in which the semiconductor chip 1 stuck to the expanding tape 2 is set at a predetermined position above the push-up portion 5, and FIG. FIG. 2 shows a state in which the expand tape 2 is adsorbed by the concave portion 6a by suctioning the air (A1) to a negative pressure, and the semiconductor chip 1 is relatively pushed up by the needle 9 and separated from the expand tape 2;
(C) is a state in which the semiconductor chip 1 is attracted to the collet 12 with a negative pressure (A2) and the expanded tape 2 returns to the original position by releasing or pressurizing (A3) the negative pressure in the tape guide 7. Is shown. FIG.
By sequentially repeating the steps of FIG. 2C, the desired semiconductor chips 1 are separated from the expand tape 2 and individually transferred to the next step such as die bonding. (For details of the operation and structure of the pickup device, see Japanese Patent Application Laid-Open No. 9-181150)

[0006]

However, the conventional pickup device has the following problems. That is,
When the needle 9 is fixed to the needle holder 4 using the adhesive 9a, the entire needle holder 4 must be replaced when the tip of the needle 9 is bent or shortened due to abrasion or breakage. In some cases, the adhesion was loosened and the position of the needle shifted. On the other hand, when fixing without using an adhesive, the needle 9 is securely fixed to the needle holder 4 because the steel material used for the needle holder 4, which is a rust-resistant SUS material, has a relatively small friction coefficient and is slippery. Therefore, it was necessary to repeatedly adjust the position of the needle 9 frequently.

SUMMARY OF THE INVENTION It is an object of the present invention to reduce the maintenance and inspection work of a semiconductor chip pickup device and to reduce the labor and cost for replacing components.

[0008]

According to a first aspect of the present invention, there is provided a pickup device for a semiconductor device, comprising: an expanded tape (2) having a plurality of semiconductor chips (1) adhered to a surface thereof. A push-up portion (5) provided on the back side of the expand tape for pushing the semiconductor chip away from the expand tape; and a push-up portion (5) provided above the semiconductor chip on the front surface side of the expand tape. In a pickup device for a semiconductor chip provided with a collet (12) for sucking and transferring, the push-up portion has a tape guide (7) having a guide surface having a size corresponding to the size of the semiconductor chip; A tapered portion (4) which is inserted inside the guide and is provided so that the inner diameter of one end is gradually reduced.
d) and a tubular first needle holder (4a) having a threaded portion (4e) made from the other end;
A second needle holder (4b) inserted into the inside of the needle holder and holding a part of the needle (9) for pushing the semiconductor chip away therefrom; and a second needle holder screwed into the threaded portion of the first needle holder. A screw cap (4c) for restricting the movement of the needle holder,
The present invention is characterized in that the pressing force of the needle is increased by pressing the second needle holder against the tapered portion.

Therefore, the pickup device of the present invention is:
The needle 9 of the push-up portion can be more firmly held, so that the needle 9 is less likely to be displaced, and only the needle 9 can be easily replaced when replacing parts.

[0010]

Embodiments of the present invention will be described below in detail with reference to FIG. FIG. 1A is a cross-sectional explanatory view showing a push-up portion 5 (the right side in the drawing is the semiconductor chip side) of a pickup device for a small semiconductor chip such as a transistor chip, and shows a case where only one needle 9 is provided.
FIGS. 1B and 1C show the shapes of the tape guide 7 and the needle holder 4b as viewed from the semiconductor chip. In this specification, the same or similar parts are denoted by the same reference numerals throughout the drawings to simplify the description. The configuration of the pickup device other than the push-up section 5 and the push-up operation of the semiconductor chip by the push-up section 5 are the same as those in the related art, and therefore detailed description is omitted.

The tape guide 7 has a metal surface formed at one end with a guide surface 6 for sliding contact with the expandable tape 2 and with a plug 7b (referred to as a blind plug) fitted at the other end. By suctioning the internal air from the suction hole 7a to make the inside of the tube negative pressure, the inner portion of the expanded tape 2 which is in sliding contact with the guide surface 6 can be sucked through the through hole 8 described later. ing. A needle holder 4 (4a, 4b, 4c) for fixing a needle 9, which will be described later, is formed in the pipe so that the needle holder 4 (4a, 4b, 4c) can be inserted thereinto, and a needle height adjusting screw 7c attached to a thick portion is provided. The position of the needle 9 can be adjusted by tightening and fixing the needle holder 4b. Further, as shown in FIG. 1 (b), the outer shape of the tape guide is formed by cutting a part of the cylinder to form a flat surface 7d, thereby preventing the tape guide 7 from rotating carelessly and making it easy to position. .

The guide surface 6 has a thickness (about 0.4 m) larger than the chip size of the semiconductor chip 1 on the inner side.
m) A deeper concave portion (depth about 0.5 mm) is provided, and a needle hole (having a diameter of about 0.5 mm) provided in the concave portion so as to have a diameter smaller than the length of one side of the semiconductor chip 1 and to penetrate the tip of the needle 9 1 mm) and eight vacuum holes (both holes are collectively referred to as “through holes 8”) having a diameter smaller than the length of one side of the semiconductor chip 1 and provided so that the expanding tape 2 can be sucked in the concave portion by negative pressure. ) Is formed. The periphery of the concave portion is formed so as to have an inclination of about 45 °, and is formed in such a structure that the expanding tape 2 can easily adhere along the concave portion.

The needle 9 is pierced into the needle holder 4a by a needle made of an ultra-hard metal or diamond having a spire shape and having a diameter of about 0.7 mm and having a diameter of about 0.7 mm. This is used to push the semiconductor chip 1 away from the back side.
The needle holder 4 is a metallic cylindrical tube inserted into the inside of the tape guide 7 from the stopper 7b side, and has an end portion having a tapered portion 4d whose inner diameter gradually decreases and a threaded portion 4e formed on the inner wall of the cylinder. Needle holder 4a (first needle holder) having the other end formed near 4d
And a needle holder 4b (second needle holder) for inserting and holding the needle 9 in the center of a metallic cylindrical tube inserted into the needle holder 4a from the stopper 7b side.
One of the needle holders 4b is made of a metal cylinder screwed into the threaded portion 4e from the stopper 7b side.
and a screw cap (also referred to as a "set screw") 4c for pressing against the tapered portion 4d of FIG.

The length of the needle holder 4b is 6.5.
2.5mm in thickness, about half of the cylinder is about 6
It has a truncated conical shape formed so that the outer diameter gradually becomes smaller at an angle of °. Further, as shown in FIG. 1 (c), the distance from the side to the center hole is about 0.4 m.
An m slot 4b 'is formed. With such a configuration, the needle 9 can be easily inserted into the needle holder 4b and the needle holder 4b can be easily inserted into the needle holder 4a. When the screw-in cap 4c is screwed into the needle holder 4a, the tapered portion of the needle holder 4b is pressed against the tapered portion 4d of the needle holder 4a, and the interval between the slits 4b 'is subjected to the wedge action by the tapered portion 4d. And shrink,
The needle 9 can be held more firmly.
When the tip of the needle 9 is short due to wear or chipping, or is bent for some reason, the screwing cap 4c is rotated in the reverse direction to open the needle holder 4b to eliminate the pinching force due to the wedge action. Thus, the needle 9 can be withdrawn relatively easily from the needle holder 4b and replaced with a new needle 9.

In this embodiment, only one needle 9 is shown, but a plurality of needles 9 may be used. In this case, it is necessary to adjust the needle 9 so that the tip height thereof is parallel to the semiconductor chip 1 before use. Further, each component of the push-up portion 5 may be formed of a material other than metal.

[0016]

As described above, according to the pickup device of the present invention, the needle 9 of the push-up portion can be more firmly held, and the needle 9 is less likely to be displaced. Since the number of times can be reduced, the time and cost loss due to the maintenance and inspection work can be greatly reduced, and only the needle 9 can be easily replaced when replacing parts. This has the effect of reducing the number and cost of maintenance parts.

Furthermore, since the needle 9 is more securely fixed, the deflection of the tip of the needle is reduced, and the defect such as cracking or chipping of the semiconductor chip due to the deflection of the needle and the displacement are eliminated. This has the effect that the yield can be improved.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a push-up portion of a pickup device according to the present invention;

FIG. 2 is an explanatory sectional view showing a conventional pickup device and its operation.

[Explanation of symbols]

 1: semiconductor chip 2: expanding tape (adhesive tape) 4: needle holder 4a: first needle holder 4b: second needle holder 4c: screw-in cap (set screw) 5: push-up portion 6: guide surface 7: tape guide (Suction table) 8: Through hole 9: Needle (thrust pin) 12: Collet (Suction collet)

Claims (1)

[Claims] An expandable tape having a plurality of semiconductor chips adhered to a front surface thereof; a push-up portion provided on a back side of the expandable tape to push the semiconductor chip away from the expandable tape; And a collet for adsorbing and transferring the protruded semiconductor chip placed above the semiconductor chip on the front surface side, wherein the push-up portion has a size of the semiconductor chip. A tape guide having a guide surface of a size corresponding to
A first tubular needle holder having a tapered portion inserted inside the tape guide and having a tapered portion provided so that the inside diameter of one end is gradually reduced, and a threaded portion provided from the other end; A second needle holder inserted into the first needle holder and holding a part of a needle that pushes away the semiconductor chip; and a second needle screwed into a threaded portion of the first needle holder. A screw-in cap for restricting the movement of the needle holder, wherein the pinching force of the needle is increased by pressing the second needle holder against the tapered portion. .